US20200287352A1 - Laser heating device for mounting led - Google Patents

Laser heating device for mounting led Download PDF

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Publication number
US20200287352A1
US20200287352A1 US16/559,728 US201916559728A US2020287352A1 US 20200287352 A1 US20200287352 A1 US 20200287352A1 US 201916559728 A US201916559728 A US 201916559728A US 2020287352 A1 US2020287352 A1 US 2020287352A1
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Prior art keywords
predetermined range
laser source
laser
conductor
layer
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Abandoned
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US16/559,728
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English (en)
Inventor
Chien-Shou Liao
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Stroke Precision Advanced Engineering Co Ltd
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Asti Global Inc Taiwan
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Assigned to ASTI GLOBAL INC., TAIWAN reassignment ASTI GLOBAL INC., TAIWAN ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: LIAO, CHIEN-SHOU
Publication of US20200287352A1 publication Critical patent/US20200287352A1/en
Assigned to STROKE PRECISION ADVANCED ENGINEERING CO., LTD. reassignment STROKE PRECISION ADVANCED ENGINEERING CO., LTD. ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: ASTI GLOBAL INC., TAIWAN
Priority to US17/984,263 priority Critical patent/US20230068569A1/en
Abandoned legal-status Critical Current

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    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
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    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/02—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor bodies
    • H01L33/04—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor bodies with a quantum effect structure or superlattice, e.g. tunnel junction
    • H01L33/06—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor bodies with a quantum effect structure or superlattice, e.g. tunnel junction within the light emitting region, e.g. quantum confinement structure or tunnel barrier

Definitions

  • the present disclosure relates to a laser heating device, and more particularly to a laser heating device for mounting LED.
  • LED Light-emitting diodes
  • a conventional display device adopts a combination of red, green, and blue light-emitting diode chips to form a full color light-emitting diode display device.
  • the full-color light-emitting diode display device can respectively emit three colors of red, green and blue light through three kinds of red, green and blue light-emitting diode chips, so that a full-color light is formed to display relevant information after the mixing of light.
  • the substrate carrying the LED chip needs to be removed first.
  • the present disclosure provides a laser heating device for mounting LED.
  • the present disclosure provides a laser heating device for mounting LED, including: a carrier substrate, an optical module, and a laser generation module.
  • the carrier substrate is disposed to carry a circuit substrate, and the circuit substrate includes a plurality of conductive pads, a plurality of conductors, and a plurality of LED chips.
  • the conductors are respectively disposed on the conductive pads, and each of the LED chips is disposed on at least two of the corresponding conductors.
  • the optical module is disposed above the carrier substrate.
  • the laser generation module is adjacent to the optical module to provide a laser source having a first predetermined range.
  • the conductor is irradiated by the laser source to mount the LED chip, the first predetermined range of the laser source forms a second predetermined range by optical adjustment of the optical module, and the first predetermined range is greater than, less than, or equal to the second predetermined range.
  • the present disclosure provides another laser heating device for mounting LED, including: a carrier substrate, an optical module, and a laser generation module.
  • the laser generation module is adjacent to the optical module to provide a laser source having a first predetermined range.
  • the conductor is irradiated by the laser source to mount the LED chip, the first predetermined range of the laser source forms a second predetermined range by optical adjustment of the optical module, and the first predetermined range is greater than, less than, or equal to the second predetermined range.
  • the present disclosure provides still another laser heating device for mounting LED, including: a carrier substrate, an optical module, a laser generation module, a temperature control module and a control module.
  • the carrier substrate is used to carry a plurality of conductors.
  • the optical module is disposed above the carrier substrate.
  • a laser generation module is adjacent to the optical module to provide a laser source having a first predetermined range.
  • the temperature control module is adjacent to the carrier substrate for detecting the temperature of the conductor to obtain a conductor temperature information.
  • the control module is electrically connected between the temperature control module and the laser generation module.
  • the first predetermined range of the laser source is optically adjusted by the optical module to form a second predetermined range.
  • the first predetermined range is greater than, less than, or equal to the second predetermined range, and the first predetermined range has the same or a different shape as the second predetermined range.
  • the control module adjusts the power output by the laser generation module according to the conductor temperature information.
  • the laser heating device for mounting LED has the technical features of “a laser heating device for mounting LED, including: a carrier substrate, an optical module, and a laser generation module,” “the optical module being disposed above the carrier substrate,” “the laser generation module being adjacent to the optical module to provide a laser source having a first predetermined range” and “the conductor being irradiated by the laser source to mount the LED chip, the first predetermined range of the laser source forming a second predetermined range by optical adjustment of the optical module, and the first predetermined range being greater than, less than, or equal to the second predetermined range” so that the LED chip can be mounted on a circuit substrate.
  • FIG. 1 is a first operational schematic diagram of a laser heating device for mounting LED according to a first embodiment of the present disclosure.
  • FIG. 2 is a second operational schematic diagram of the laser heating device for mounting LED according to the first embodiment of the present disclosure.
  • FIG. 3 is a third operational schematic diagram of the laser heating device for mounting LED according to the first embodiment of the present disclosure.
  • FIG. 4 is a fourth operational schematic diagram of the laser heating device for mounting LED according to the first embodiment of the present disclosure.
  • FIG. 5 is a fifth operational schematic diagram of the laser heating device for mounting LED according to the first embodiment of the present disclosure.
  • FIG. 6 is an enlarged schematic view of a portion VI of FIG. 5 .
  • FIG. 7 is a schematic diagram of irradiation of a second predetermined range of a laser source according to the first embodiment of the present disclosure.
  • FIG. 8 is a sixth operational schematic diagram of the laser heating device for mounting LED according to the first embodiment of the present disclosure.
  • FIG. 9 is a seventh operational schematic diagram of the laser heating device for mounting LED according to the first embodiment of the present disclosure.
  • FIG. 10 is a eighth operational schematic diagram of the laser heating device for mounting LED according to the first embodiment of the present disclosure.
  • FIG. 11 is a first operational schematic diagram of a laser heating device for mounting LED according to a second embodiment of the present disclosure.
  • FIG. 12 is a second operational schematic diagram of the laser heating device for mounting LED according to the second embodiment of the present disclosure.
  • FIG. 13 is a schematic structural view of a partial module of a laser heating device for mounting LED according to a third embodiment of the present disclosure.
  • FIG. 14 is a functional block diagram of the laser heating device for mounting LED according to the third embodiment of the present disclosure.
  • FIG. 15 is a first operational schematic diagram of a laser heating device for mounting LED according to a fourth embodiment of the present disclosure.
  • FIG. 16 is a second operational schematic diagram of the laser heating device for mounting LED according to the fourth embodiment of the present disclosure.
  • Numbering terms such as “first”, “second” or “third” can be used to describe various components, signals or the like, which are for distinguishing one component/signal from another one only, and are not intended to, nor should be construed to impose any substantive limitations on the components, signals or the like.
  • a first embodiment of the present disclosure provides a laser heating device Z for mounting LED, including: a carrier substrate M 1 , an optical module M 2 , and a laser generation module M 3 .
  • the carrier substrate M 1 carries a circuit substrate 10
  • the load module M 1 can be a stage device with a displacement function, but is not limited thereto.
  • the circuit substrate 10 includes a plurality of conductive pads 100 , a plurality of conductors 101 , and a plurality of LED chips 102 .
  • the conductors 101 are respectively disposed on the conductive pads 100 .
  • at least one of the conductors 101 can be disposed on each of the conductive pads 100 , and the conductor 101 can be a solder ball or other type of conductive material, but the present disclosure is not limited thereto.
  • the LED chips 102 are disposed on the circuit substrate 10 , and each of the LED chips 102 is disposed on at least two conductors 101 .
  • the laser heating device Z for mounting LED provided by the present disclosure further includes: a pick and place module M 4 adjacent to the carrier substrate M 1 for placing each of the LED chips 102 on the corresponding at least two of the conductors 101 .
  • the present disclosure can also place a plurality of LED chips 102 on the circuit substrate 10 by pick and place module M 4 , and each of the LED chips 102 corresponds to at least two conductors 101 .
  • the pick and place module M 4 can be a vacuum nozzle or any kind of pick and place machine.
  • the present disclosure is not limited thereto.
  • the optical module M 2 is disposed above the carrier substrate M 1 and is located between the laser generation module M 3 and the circuit substrate 10 .
  • the optical module M 2 may be a lens structure or a light guide plate structure, but is not limited thereto.
  • the laser source generating module M 3 can provide a laser source L having a first predetermined range R 1 and direct the light from the light source to the optical module M 2 .
  • the first predetermined range R 1 of the laser source L is formed by the optical adjustment of the optical module M 2 to form a second predetermined range R 2 .
  • the first predetermined range R 1 may be greater than, less than, or equal to the second predetermined range R 2 .
  • the first predetermined range R 1 may be smaller than the second predetermined range R 2 , but the present disclosure is not limited thereto.
  • the first predetermined range R 1 and the second predetermined range R 2 may have the same or different shapes.
  • each of the LED chips 102 may be a micro-semiconductor light-emitting element (Micro LED) including an n-type conductive layer N disposed in a stack, a light-emitting layer M passed through by the laser source L, and a p-type conductive layer P.
  • Micro LED micro-semiconductor light-emitting element
  • the n-type conductive layer N may be an n-type gallium nitride material layer or an n-type gallium arsenide material layer
  • the light-emitting layer M is a multi-quantum well structure layer
  • the p-type conductive layer P may be a p-type gallium nitride material layer or a p-type gallium arsenide material layer, but is not limited thereto.
  • the above-mentioned examples are only one of the possible embodiments and the present disclosure is not limited thereto.
  • the second predetermined range R 2 of the laser source L may cover a plurality of LED chips 102 .
  • the second predetermined range R 2 may cover 4 ⁇ 4 LED chips 102 , but the present disclosure is not limited thereto.
  • the intensity 3 of the laser source L of the module M of the present disclosure may be adjusted by adjusting the laser source, so that the laser source L 3 generated by the laser source generating module M 3 passes only through the LED chip 102 without passing through the circuit substrate 10 .
  • the above-mentioned examples are only one of the possible embodiments and the present disclosure is not limited thereto.
  • the conductor 101 disposed between the LED chip 102 and the circuit substrate 10 is cured by the irradiation of the laser source L, so that the LED chip 102 is mounted onto the circuit substrate 10 .
  • the conductor 101 disposed between the LED chip 102 and the circuit substrate 10 is irradiated by the laser source L, the conductor 101 is softened, and a connection with the LED chip 102 is made.
  • the LED chip 102 is mounted onto the circuit substrate 10 and electrically connected to the circuit substrate 10 through the conductor 101 .
  • the present disclosure is not limited thereto.
  • the laser heating device Z for mounting LED provided by the present disclosure can further project the light from the laser source L generated by the laser source generating module M 3 to the contact interface F of the LED chip 102 and the conductor 101 , thereby reducing the connection strength between the LED chip 102 and the conductor 101 .
  • the LED chip 102 is removed from the circuit substrate 10 so that the LED chip 102 is easily detached from the conductor 101 .
  • the present disclosure can also direct the laser source L generated by the laser source generating module M 3 to the contact interface F between the LED chip 102 and the cured conductor 101 so as to soften part of the conductor 101 close to the contact interface F, and reduce the connection strength and bonding force between the LED chip 102 and the conductor 101 , so that the LED chip 102 can be easily detached from the conductor 101 and removed from the circuit substrate 10 . Then, at least two old conductors 101 separate from the LED chip 102 can be removed from the circuit substrate 10 using a special instrument (such as a scraper or grinder) to facilitate repositioning of the new conductor 101 .
  • a special instrument such as a scraper or grinder
  • the present disclosure provides a laser heating device Z for mounting LED, including: a circuit substrate 10 , an optical module M 2 , and a laser generation module M 3 .
  • the circuit substrate 10 is used to carry a plurality of conductors 101 and a plurality of LED chips 102 .
  • the optical module M 2 is disposed above the circuit substrate 10 .
  • the laser generation module M 3 is adjacent to the optical module M 2 to provide a laser source L having a first predetermined range R 1 .
  • the conductor 101 is irradiated by the laser source L to fix the LED chip 102 , and the first predetermined range R 1 of the laser source L is optically adjusted by the optical module M 2 to form a second predetermined range R 2 , which is greater than, less than or equal to the second predetermined range R 2 .
  • a second embodiment of the present disclosure provides a laser heating device Z for mounting LED that is similar to that described in the first embodiment, and therefore similar steps in the process will not be described again. Further, with reference to FIG. 6 and according to FIG. 11 and FIG. 12 and FIG. 5 and FIG.
  • each of the LED chips 102 of the present embodiment may be a sub-millimeter light-emitting diode (Mini LED) including a base layer 1020 disposed in a stacked manner, an n-type conductive layer N, a light-emitting layer M passed through by the laser source L and a p-type conductive layer P.
  • Min LED sub-millimeter light-emitting diode
  • the base layer 1020 is a sapphire material layer
  • the n-type conductive layer N may be an n-type gallium nitride material layer or an n-type gallium arsenide material layer
  • the light-emitting layer M is a multi-quantum well structure layer
  • the p-type conductive layer P may be a p-type gallium nitride material layer or a p-type gallium arsenide material layer, but the present disclosure is not limited thereto.
  • the base layer 1020 may also be a quartz base layer, a glass base layer, a tantalum base layer, or a base layer of any material.
  • the above-mentioned examples are only one of the possible embodiments and the present disclosure is not limited thereto.
  • the light from the laser source L of the second predetermined range R 2 is directed to each of the LED chips 102 , the light passes through the base layer 1020 , the n-type conductive layer N, the light-emitting layer M, and the p-type conductive layer P, and is projected onto at least two conductors 101 of the circuit substrate 10 .
  • the conductor 101 disposed between the LED chip 102 and the circuit substrate 10 is cured by irradiation of the laser source L so that the LED chip 102 is mounted on the circuit substrate 10 .
  • the above-mentioned examples are only one of the possible embodiments and the present disclosure is not limited thereto.
  • a third embodiment of the present disclosure provides a laser heating device Z for mounting LED that is similar to that described in the first embodiment, and therefore similar steps in the process will not be described again. Further, the difference between the third embodiment and the first embodiment of the present disclosure is that, the laser heating device Z for mounting LED provided by the present disclosure further includes: a temperature control module M 5 and a control module M 6 .
  • the temperature control module M 5 is adjacent to the carrier substrate M 1 for detecting the temperature of the conductor 101 to obtain a conductor temperature information.
  • the control module M 6 is electrically connected between the temperature control module M 5 and the laser generation module M 3 .
  • the control module M 6 adjusts the power output by the laser generation module M 3 according to the conductor temperature information.
  • the temperature control module M 5 can be a temperature sensor or a temperature controller, but the present disclosure is not limited thereto.
  • a sensing end of the temperature control module M 5 may be disposed on the carrier substrate M 1 and adjacent to the circuit substrate 10 , or the sensing end of the temperature control module M 5 may be located outside the carrier substrate M 1 and adjacent to one or a part of the conductor 101 on the circuit substrate 10 .
  • the control module M 6 is electrically connected to the carrier substrate M 1 , the laser generation module M 3 , the pick and place module M 4 , and the temperature control module M 5 . Therefore, at the same time as or after the laser source L is projected onto the conductor 101 on the circuit substrate 10 , the temperature of the conductor 101 can be detected by the temperature control module M 5 to obtain a conductor temperature information.
  • control module M 6 can determine whether the power output by the laser generation module M 3 is sufficient, too low or too high according to the conductor temperature information (for example, comparing the conductor temperature information with a preset temperature information, but the present disclosure is not limited thereto), and then the power output by the laser generation module M 3 is appropriately adjusted.
  • the conductor temperature information for example, comparing the conductor temperature information with a preset temperature information, but the present disclosure is not limited thereto.
  • the present disclosure further provides a laser heating device Z for mounting LED, including: a circuit substrate 10 , an optical module M 2 , a laser generation module M 3 , a temperature control module M 5 , and a control module M 6 .
  • the circuit substrate 10 is used to carry a plurality of conductors 101 .
  • the optical module M 2 is disposed above the circuit substrate 10 .
  • the laser generation module M 3 is adjacent to the optical module M 2 to provide a laser source L having a first predetermined range R 1 .
  • the temperature control module M 5 is adjacent to the circuit substrate 10 for detecting the temperature of the conductor 101 to obtain a conductor temperature information.
  • the control module M 6 is electrically connected between the temperature control module M 5 and the laser generation module M 3 .
  • the first predetermined range R 1 of the laser source L is optically adjusted by the optical module M 2 to form a second predetermined range R 2 .
  • the first predetermined range R 1 is greater than, less than or equal to the second predetermined range R 2 , and the first predetermined range R 1 and the second predetermined range R 2 have the same or different shapes.
  • the control module M 6 adjusts the power output by the laser generation module M 3 according to the conductor temperature information.
  • a fourth embodiment of the present disclosure provides a laser heating device Z for mounting LED that is similar to that described in the first embodiment, and therefore similar steps in the process will not be described again. Further, according to FIG. 15 , FIG. 2 and FIG. 3 , the difference between the fourth embodiment and the first embodiment of the present disclosure is that the laser heating device Z for mounting LED provided by the present disclosure can also have at least two conductors 101 disposed on each of the LED chips 102 .
  • At least two conductors 101 may be disposed on each of the LED chips 102 , and the conductor 101 may be a solder ball, or other conductive materials having different shapes or structures, but the present disclosure is not limited thereto.
  • a plurality of LED chips 102 are placed on the circuit substrate 10 by a pick and place module M 4 , and at least two conductors 101 of each of the LED chips 102 correspond to the conductive pads 100 of the circuit substrate 10 . Then, the light from the laser source L generated by the laser generation module is directed to the LED chip 102 .
  • the conductor 101 disposed between the LED chip 102 and the circuit substrate 10 is irradiated by the laser source L, the conductor 101 is softened, and a connection with the circuit substrate 10 is made. Finally, after the conductor 101 is cured, the LED chip 102 is mounted onto the circuit substrate 10 and electrically connected to the circuit substrate 10 through the conductor 101 .
  • the above-mentioned examples are only one of the possible embodiments and the present disclosure is not limited thereto.
  • the laser heating device for mounting LED Z has the technical features of “a laser heating device Z for mounting LED, including: a carrier substrate M 1 , an optical module M 2 , and a laser generation module M 3 ,” “the optical module M 2 being disposed above the carrier substrate M 1 ,” “the laser generation module M 3 being adjacent to the optical module M 2 to provide a laser source L having a first predetermined range R 1 ” and “the conductor 101 being irradiated by the laser source L to mount the LED chip 102 , the first predetermined range R 1 of the laser source L forming a second predetermined range R 2 by optical adjustment of the optical module M 2 , and the first predetermined range R 1 being greater than, less than, or equal to the second predetermined range R 2 ” so that the LED chip can be mounted on a circuit substrate 10 .
  • the laser heating device Z for mounting LED provided by the present disclosure can convert the first predetermined range R 1 of the laser source L into the second predetermined range R 2 by using the optical adjustment of the optical module M 2 by the above-mentioned technical solution, so as to conduct the solid crystal process of the LED chip 102 .

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TWI747585B (zh) * 2020-10-30 2021-11-21 昱凱科技股份有限公司 顯示裝置的製造方法

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