US20200046210A1 - Endoscope, image pickup module and manufacturing method for image pickup module - Google Patents

Endoscope, image pickup module and manufacturing method for image pickup module Download PDF

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Publication number
US20200046210A1
US20200046210A1 US16/656,648 US201916656648A US2020046210A1 US 20200046210 A1 US20200046210 A1 US 20200046210A1 US 201916656648 A US201916656648 A US 201916656648A US 2020046210 A1 US2020046210 A1 US 2020046210A1
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United States
Prior art keywords
electrode
rear surface
image pickup
joints
pickup module
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
US16/656,648
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English (en)
Inventor
Takatoshi IGARASHI
Takahiro Shimohata
Takuro Suyama
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Olympus Corp
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Olympus Corp
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Assigned to OLYMPUS CORPORATION reassignment OLYMPUS CORPORATION ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: IGARASHI, TAKATOSHI, Shimohata, Takahiro, SUYAMA, TAKURO
Publication of US20200046210A1 publication Critical patent/US20200046210A1/en
Abandoned legal-status Critical Current

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
    • H01L27/144—Devices controlled by radiation
    • H01L27/146—Imager structures
    • H01L27/14601—Structural or functional details thereof
    • H01L27/14618—Containers
    • A—HUMAN NECESSITIES
    • A61—MEDICAL OR VETERINARY SCIENCE; HYGIENE
    • A61B—DIAGNOSIS; SURGERY; IDENTIFICATION
    • A61B1/00—Instruments for performing medical examinations of the interior of cavities or tubes of the body by visual or photographical inspection, e.g. endoscopes; Illuminating arrangements therefor
    • A61B1/00002—Operational features of endoscopes
    • A61B1/00004—Operational features of endoscopes characterised by electronic signal processing
    • A61B1/00006—Operational features of endoscopes characterised by electronic signal processing of control signals
    • A—HUMAN NECESSITIES
    • A61—MEDICAL OR VETERINARY SCIENCE; HYGIENE
    • A61B—DIAGNOSIS; SURGERY; IDENTIFICATION
    • A61B1/00—Instruments for performing medical examinations of the interior of cavities or tubes of the body by visual or photographical inspection, e.g. endoscopes; Illuminating arrangements therefor
    • A61B1/00002—Operational features of endoscopes
    • A61B1/00004—Operational features of endoscopes characterised by electronic signal processing
    • A61B1/00009—Operational features of endoscopes characterised by electronic signal processing of image signals during a use of endoscope
    • A—HUMAN NECESSITIES
    • A61—MEDICAL OR VETERINARY SCIENCE; HYGIENE
    • A61B—DIAGNOSIS; SURGERY; IDENTIFICATION
    • A61B1/00—Instruments for performing medical examinations of the interior of cavities or tubes of the body by visual or photographical inspection, e.g. endoscopes; Illuminating arrangements therefor
    • A61B1/00002—Operational features of endoscopes
    • A61B1/00011—Operational features of endoscopes characterised by signal transmission
    • A61B1/00018—Operational features of endoscopes characterised by signal transmission using electrical cables
    • A—HUMAN NECESSITIES
    • A61—MEDICAL OR VETERINARY SCIENCE; HYGIENE
    • A61B—DIAGNOSIS; SURGERY; IDENTIFICATION
    • A61B1/00—Instruments for performing medical examinations of the interior of cavities or tubes of the body by visual or photographical inspection, e.g. endoscopes; Illuminating arrangements therefor
    • A61B1/00064—Constructional details of the endoscope body
    • A61B1/00071—Insertion part of the endoscope body
    • A61B1/0008—Insertion part of the endoscope body characterised by distal tip features
    • A61B1/00096—Optical elements
    • A—HUMAN NECESSITIES
    • A61—MEDICAL OR VETERINARY SCIENCE; HYGIENE
    • A61B—DIAGNOSIS; SURGERY; IDENTIFICATION
    • A61B1/00—Instruments for performing medical examinations of the interior of cavities or tubes of the body by visual or photographical inspection, e.g. endoscopes; Illuminating arrangements therefor
    • A61B1/00064—Constructional details of the endoscope body
    • A61B1/0011—Manufacturing of endoscope parts
    • A—HUMAN NECESSITIES
    • A61—MEDICAL OR VETERINARY SCIENCE; HYGIENE
    • A61B—DIAGNOSIS; SURGERY; IDENTIFICATION
    • A61B1/00—Instruments for performing medical examinations of the interior of cavities or tubes of the body by visual or photographical inspection, e.g. endoscopes; Illuminating arrangements therefor
    • A61B1/04—Instruments for performing medical examinations of the interior of cavities or tubes of the body by visual or photographical inspection, e.g. endoscopes; Illuminating arrangements therefor combined with photographic or television appliances
    • A61B1/05—Instruments for performing medical examinations of the interior of cavities or tubes of the body by visual or photographical inspection, e.g. endoscopes; Illuminating arrangements therefor combined with photographic or television appliances characterised by the image sensor, e.g. camera, being in the distal end portion
    • A61B1/051—Details of CCD assembly
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B23/00—Telescopes, e.g. binoculars; Periscopes; Instruments for viewing the inside of hollow bodies; Viewfinders; Optical aiming or sighting devices
    • G02B23/24—Instruments or systems for viewing the inside of hollow bodies, e.g. fibrescopes
    • G02B23/2407—Optical details
    • G02B23/2423—Optical details of the distal end
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B23/00—Telescopes, e.g. binoculars; Periscopes; Instruments for viewing the inside of hollow bodies; Viewfinders; Optical aiming or sighting devices
    • G02B23/24—Instruments or systems for viewing the inside of hollow bodies, e.g. fibrescopes
    • G02B23/2476—Non-optical details, e.g. housings, mountings, supports
    • G02B23/2484—Arrangements in relation to a camera or imaging device
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
    • G06T7/00—Image analysis
    • G06T7/0002—Inspection of images, e.g. flaw detection
    • G06T7/0012—Biomedical image inspection
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
    • H01L27/144—Devices controlled by radiation
    • H01L27/146—Imager structures
    • H01L27/14601—Structural or functional details thereof
    • H01L27/14634—Assemblies, i.e. Hybrid structures
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
    • H01L27/144—Devices controlled by radiation
    • H01L27/146—Imager structures
    • H01L27/14601—Structural or functional details thereof
    • H01L27/14636—Interconnect structures
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
    • H04N23/50—Constructional details
    • H04N23/54—Mounting of pick-up tubes, electronic image sensors, deviation or focusing coils
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
    • H04N23/50—Constructional details
    • H04N23/555—Constructional details for picking-up images in sites, inaccessible due to their dimensions or hazardous conditions, e.g. endoscopes or borescopes
    • A—HUMAN NECESSITIES
    • A61—MEDICAL OR VETERINARY SCIENCE; HYGIENE
    • A61B—DIAGNOSIS; SURGERY; IDENTIFICATION
    • A61B1/00—Instruments for performing medical examinations of the interior of cavities or tubes of the body by visual or photographical inspection, e.g. endoscopes; Illuminating arrangements therefor
    • A61B1/06—Instruments for performing medical examinations of the interior of cavities or tubes of the body by visual or photographical inspection, e.g. endoscopes; Illuminating arrangements therefor with illuminating arrangements
    • A61B1/0661—Endoscope light sources
    • A61B1/0684—Endoscope light sources using light emitting diodes [LED]

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  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Health & Medical Sciences (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Surgery (AREA)
  • Optics & Photonics (AREA)
  • General Physics & Mathematics (AREA)
  • Power Engineering (AREA)
  • General Health & Medical Sciences (AREA)
  • Medical Informatics (AREA)
  • Radiology & Medical Imaging (AREA)
  • Nuclear Medicine, Radiotherapy & Molecular Imaging (AREA)
  • Public Health (AREA)
  • Pathology (AREA)
  • Molecular Biology (AREA)
  • Animal Behavior & Ethology (AREA)
  • Biomedical Technology (AREA)
  • Biophysics (AREA)
  • Veterinary Medicine (AREA)
  • Heart & Thoracic Surgery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Electromagnetism (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Computer Hardware Design (AREA)
  • Astronomy & Astrophysics (AREA)
  • Signal Processing (AREA)
  • Multimedia (AREA)
  • Quality & Reliability (AREA)
  • Computer Vision & Pattern Recognition (AREA)
  • Theoretical Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Endoscopes (AREA)
US16/656,648 2017-04-19 2019-10-18 Endoscope, image pickup module and manufacturing method for image pickup module Abandoned US20200046210A1 (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/JP2017/015662 WO2018193531A1 (ja) 2017-04-19 2017-04-19 内視鏡、撮像モジュール、および撮像モジュールの製造方法

Related Parent Applications (1)

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PCT/JP2017/015662 Continuation WO2018193531A1 (ja) 2017-04-19 2017-04-19 内視鏡、撮像モジュール、および撮像モジュールの製造方法

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US20200046210A1 true US20200046210A1 (en) 2020-02-13

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US16/656,648 Abandoned US20200046210A1 (en) 2017-04-19 2019-10-18 Endoscope, image pickup module and manufacturing method for image pickup module
US16/656,788 Active 2038-07-16 US11000184B2 (en) 2017-04-19 2019-10-18 Image pickup module, fabrication method for image pickup module, and endoscope

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US16/656,788 Active 2038-07-16 US11000184B2 (en) 2017-04-19 2019-10-18 Image pickup module, fabrication method for image pickup module, and endoscope

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WO (2) WO2018193531A1 (ja)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2019138442A1 (ja) * 2018-01-09 2019-07-18 オリンパス株式会社 撮像装置、内視鏡、および、撮像装置の製造方法
WO2019193911A1 (ja) * 2018-04-03 2019-10-10 オリンパス株式会社 撮像ユニット、および内視鏡
CN110164896B (zh) * 2019-06-05 2021-06-25 芯盟科技有限公司 内窥镜探头以及制造方法
WO2021152658A1 (ja) * 2020-01-27 2021-08-05 オリンパス株式会社 撮像装置、および、内視鏡

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20140275786A1 (en) * 2012-10-12 2014-09-18 Olympus Medical Systems Corp. Endoscope
US20150359420A1 (en) * 2014-06-11 2015-12-17 Panasonic Intellectual Property Management Co., Ltd. Endoscope and method of manufacturing endoscope

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* Cited by examiner, † Cited by third party
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JP5030360B2 (ja) 2002-12-25 2012-09-19 オリンパス株式会社 固体撮像装置の製造方法
US7828736B2 (en) * 2004-01-27 2010-11-09 Fujinon Corporation Electronic scan type ultrasound diagnostic instrument
JP4589659B2 (ja) 2004-05-31 2010-12-01 Ｈｏｙａ株式会社 電子内視鏡の先端部の組立方法
JP2009082503A (ja) * 2007-09-28 2009-04-23 Fujifilm Corp 撮像装置及びその撮像装置を備えた内視鏡
JP5701550B2 (ja) * 2010-09-17 2015-04-15 オリンパス株式会社 撮像装置および撮像装置の製造方法
US8698887B2 (en) 2010-04-07 2014-04-15 Olympus Corporation Image pickup apparatus, endoscope and manufacturing method for image pickup apparatus
US10426320B2 (en) * 2010-04-28 2019-10-01 Xiaolong OuYang Single use medical devices
US9649014B2 (en) * 2010-04-28 2017-05-16 Xiaolong OuYang Single use medical devices
JP5500007B2 (ja) * 2010-09-03 2014-05-21 ソニー株式会社 固体撮像素子およびカメラシステム
JP2013030593A (ja) 2011-07-28 2013-02-07 J Devices:Kk 半導体装置、該半導体装置を垂直に積層した半導体モジュール構造及びその製造方法
CH705951B1 (de) 2011-12-23 2017-12-15 Awaiba Consultadoria Desenvolvimento E Comércio De Componentes Microelectrónicos Unipessoal Lda Optische Sensoranordnung und Verfahren zur Herstellung sowie Verwendung derselben.
JP6021618B2 (ja) * 2012-12-05 2016-11-09 オリンパス株式会社 撮像装置、内視鏡及び撮像装置の製造方法
JP6000859B2 (ja) * 2013-01-11 2016-10-05 オリンパス株式会社 半導体装置の製造方法、半導体装置、及び内視鏡
JP6071613B2 (ja) * 2013-02-14 2017-02-01 オリンパス株式会社 半導体基板、半導体装置、撮像素子、および撮像装置
JP6351228B2 (ja) 2013-09-30 2018-07-04 オリンパス株式会社 撮像モジュールおよび内視鏡装置
JP6348759B2 (ja) * 2014-04-16 2018-06-27 オリンパス株式会社 半導体モジュール、接合用治具、および半導体モジュールの製造方法
JP6295983B2 (ja) * 2015-03-05 2018-03-20 ソニー株式会社 半導体装置およびその製造方法、並びに電子機器
CN107431767A (zh) 2015-04-17 2017-12-01 奥林巴斯株式会社 摄像装置
JP2017023234A (ja) * 2015-07-17 2017-02-02 オリンパス株式会社 撮像ユニットおよび内視鏡
JPWO2017077620A1 (ja) * 2015-11-05 2018-09-20 オリンパス株式会社 固体撮像装置

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20140275786A1 (en) * 2012-10-12 2014-09-18 Olympus Medical Systems Corp. Endoscope
US20150359420A1 (en) * 2014-06-11 2015-12-17 Panasonic Intellectual Property Management Co., Ltd. Endoscope and method of manufacturing endoscope

Also Published As

Publication number Publication date
US11000184B2 (en) 2021-05-11
US20200049972A1 (en) 2020-02-13
US20210141210A9 (en) 2021-05-13
WO2018194039A1 (ja) 2018-10-25
WO2018193531A1 (ja) 2018-10-25

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