US20190129108A1 - Modular Laser Connector Packaging System and Method - Google Patents

Modular Laser Connector Packaging System and Method Download PDF

Info

Publication number
US20190129108A1
US20190129108A1 US15/799,510 US201715799510A US2019129108A1 US 20190129108 A1 US20190129108 A1 US 20190129108A1 US 201715799510 A US201715799510 A US 201715799510A US 2019129108 A1 US2019129108 A1 US 2019129108A1
Authority
US
United States
Prior art keywords
fiber
substrate
laser
top surface
module
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
US15/799,510
Other languages
English (en)
Inventor
Qing Tan
Mario Paniccia
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Corning Inc
Original Assignee
Versalume LLC
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Versalume LLC filed Critical Versalume LLC
Priority to US15/799,510 priority Critical patent/US20190129108A1/en
Assigned to Versalume LLC reassignment Versalume LLC ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: PANICCIA, MARIO, TAN, QING
Priority to CN201880079135.8A priority patent/CN111656238B/zh
Priority to CN202211118540.0A priority patent/CN115576060A/zh
Priority to EP18873694.6A priority patent/EP3704525A4/en
Priority to PCT/US2018/058415 priority patent/WO2019089732A2/en
Publication of US20190129108A1 publication Critical patent/US20190129108A1/en
Priority to US16/442,917 priority patent/US10838158B2/en
Assigned to CORNING INCORPORATED reassignment CORNING INCORPORATED ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: Versalume LLC
Abandoned legal-status Critical Current

Links

Images

Classifications

    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/0001—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings specially adapted for lighting devices or systems
    • G02B6/0005—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings specially adapted for lighting devices or systems the light guides being of the fibre type
    • G02B6/0006—Coupling light into the fibre
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G02B6/4201—Packages, e.g. shape, construction, internal or external details
    • G02B6/4248—Feed-through connections for the hermetical passage of fibres through a package wall
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G02B6/4201—Packages, e.g. shape, construction, internal or external details
    • G02B6/4202—Packages, e.g. shape, construction, internal or external details for coupling an active element with fibres without intermediate optical elements, e.g. fibres with plane ends, fibres with shaped ends, bundles
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G02B6/4201—Packages, e.g. shape, construction, internal or external details
    • G02B6/4204—Packages, e.g. shape, construction, internal or external details the coupling comprising intermediate optical elements, e.g. lenses, holograms
    • G02B6/4212—Packages, e.g. shape, construction, internal or external details the coupling comprising intermediate optical elements, e.g. lenses, holograms the intermediate optical element being a coupling medium interposed therebetween, e.g. epoxy resin, refractive index matching material, index grease, matching liquid or gel
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G02B6/4201—Packages, e.g. shape, construction, internal or external details
    • G02B6/4219—Mechanical fixtures for holding or positioning the elements relative to each other in the couplings; Alignment methods for the elements, e.g. measuring or observing methods especially used therefor
    • G02B6/4236—Fixing or mounting methods of the aligned elements
    • G02B6/424—Mounting of the optical light guide
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G02B6/4201—Packages, e.g. shape, construction, internal or external details
    • G02B6/4256—Details of housings
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G02B6/4201—Packages, e.g. shape, construction, internal or external details
    • G02B6/4274—Electrical aspects
    • G02B6/428—Electrical aspects containing printed circuit boards [PCB]
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/0001—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings specially adapted for lighting devices or systems
    • G02B6/0005—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings specially adapted for lighting devices or systems the light guides being of the fibre type
    • G02B6/001—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings specially adapted for lighting devices or systems the light guides being of the fibre type the light being emitted along at least a portion of the lateral surface of the fibre
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G02B6/4201—Packages, e.g. shape, construction, internal or external details
    • G02B6/4256—Details of housings
    • G02B6/4262—Details of housings characterised by the shape of the housing
    • G02B6/4263—Details of housings characterised by the shape of the housing of the transisitor outline [TO] can type

Definitions

  • the present invention provides an integrated fiber lighting module that efficiently optically couples and structurally connects lasers or LEDs with light diffusion optical fibers and circuit boards.
  • VCSELs Very-Cavity Surface-Emitting Lasers
  • VCSELs Very-Cavity Surface-Emitting Lasers
  • Various modules, assemblies or packages have been and are being used to hold and align the laser, other optical components, and optical fiber in order that the laser is as efficiently as possible optically coupled to the fiber.
  • the process of aligning an optical fiber to a laser diode and fixing it in place can be a time-consuming and, therefore, costly step in the manufacturing process.
  • Standard laser package types include coaxial or TO (transistor outline) can laser packages and butterfly laser packages.
  • the laser e.g., a laser diode
  • the light-receiving end of the optical fiber may be mounted together within a substantially cylindrical housing.
  • the laser is mounted on a laser submount on a TO Can post of a TO can header.
  • the fiber end may be disposed in a rigid cylindrical ferrule mounted to the TO can housing, and the TO can housing may also contain other related components, such as a lens and a monitor photodiode, and is typically hermetically sealed.
  • a butterfly type laser package shown in FIG. 1B
  • the laser and related components are mounted on a platform such as an optical bench within a metal boxlike housing that is hermetically sealed.
  • the laser and laser circuitry are electrically connected to one or more pins extending laterally from the housing (e.g., 7 pins on each side, as shown).
  • the fiber is inserted through the ferrule into the inside of the housing and soldered to the ferrule for a sealed fit.
  • Components such as an isolator and one or more lenses may be disposed on the platform between the laser and the input end of the fiber.
  • Butterfly laser packages are generally more expensive than TO can laser packages and are generally used for higher performance requirement applications.
  • the present invention provides a module for optically and mechanically coupling an optical fiber, such as a multi-mode or light diffusion fiber, to a laser or LED diode, such as for example a VCSEL or a LED.
  • an optical fiber such as a multi-mode or light diffusion fiber
  • a laser or LED diode such as for example a VCSEL or a LED.
  • the present invention also provides a method for fabricating such a module.
  • a method for optically and structurally coupling an optical fiber to a laser or LED on a substrate in a compact module comprises providing an optical fiber with a core tip exposed and extending from the fiber cladding at a light receiving end of the fiber which may be of the light diffusion type, The exposed core tip is extended into a fiber holder through an aperture in a closed end of the fiber holder.
  • a laser or LED diode is disposed on a top surface of a substrate, and an open end of the fiber holder is positioned on the top surface of the substrate surrounding the laser with the exposed fiber core tip in light-receiving butt-coupled relation to the laser or LED.
  • a resilient strain relief housing is disposed about the light receiving end of the fiber, and the fiber holder and at least the top surface of the substrate are inserted into the strain relief housing in water resistant sealing relation.
  • the laser may, for example, be a VCSEL.
  • a module assembly for optically and structurally coupling an optical fiber to a laser or LED.
  • the module assembly comprises an optical fiber (e.g., a light diffusion optical fiber) having a light-receiving end, an optically transmissive core and a cladding surrounding the core, wherein a portion of core extends axially from the cladding at the light-receiving end of the fiber.
  • a fiber holder has an open end and a closed end with an aperture defined through the closed end, and the light-receiving end of the optical fiber is secured to the closed end of the fiber holder with the exposed core tip extending though the aperture into the holder.
  • a substrate having top and bottom surfaces has a laser or LED disposed on the top surface of said substrate.
  • the open end of the fiber holder is secured to the top surface of the substrate surrounding the laser or LED such that the exposed fiber core tip is butt-coupled to the laser or LED in light-receiving relation.
  • a resilient strain relief housing encloses and provides water resistant sealing for the light receiving end of the fiber, the fiber holder and at least the top surface of the substrate.
  • a gap in the range of a few microns to a couple of hundred microns may be provided between the butt-coupled laser or LED and the exposed core tip of the optical fiber.
  • the gap may be filled with epoxy having a refractive index matching the refractive index of the optical fiber.
  • FIG. 1A is a view in perspective of a prior art TO Can type laser package as described above.
  • FIG. 1B is a view in perspective of a prior art butterfly type laser package as described above.
  • FIG. 2 is a view in perspective from below of one embodiment of a laser or LED package according to the present invention.
  • FIG. 3A is an exploded view in perspective from below of the embodiment of FIG. 2 .
  • FIG. 3B is an exploded view in perspective from above of the embodiment of FIG. 2 .
  • FIG. 4 is a view in longitudinal section of the embodiment of FIG. 2 .
  • FIG. 5 is a schematic illustration of light transmitted between a laser or LED and optical fiber in the embodiment of FIG. 2 .
  • FIG. 6 is a view in perspective from below of a second embodiment of a laser or LED package according to the present invention.
  • FIG. 7A is an exploded view in perspective from below of the embodiment of FIG. 6 .
  • FIG. 7B is an exploded view in perspective from above of the embodiment of FIG. 6 .
  • FIG. 8 is a view in longitudinal section of the embodiment of FIG. 6 .
  • an optical fiber 10 has a light-transmissive core 11 surrounded by a cladding 12 which is cut away or otherwise removed at a light-receiving end of the fiber to expose a tip of the core.
  • the fiber 10 is preferably a flexible light diffusing fiber utilized to scatter or diffuse light transversely out of the fiber. More specifically, light is guided away from the core 11 through the outer cladding 12 to provide illumination for applications, such as illuminated signage, displays, certain lighting fixtures, etc. It will be understood, that although the invention has particular application for flexible light diffusing fiber, the principles of the invention can be applied to other types of optical waveguides.
  • Core 11 may be fabricated from glass or other suitable light-transmissive material.
  • Cladding 12 may be made from a material having a low refractive index to provide a high numerical aperture (NA) similar to or lower than the refractive index of core 11 .
  • the cladding material may be a low index polymer such as UV or thermally curable fluoroacrylate or silicone.
  • Light diffusing fibers and their core and cladding materials are well known, some examples of which are disclosed in US20160238784 (Logunov), U.S. Pat. No. 9,093,003 (Logunov et al) and U.S. Pat. No. 9,146,347 (Logunov et al).
  • a fiber holder 20 has a closed proximal end 21 and an open distal end 22 and is preferably fabricated from a suitable polymer material.
  • the fiber holder 20 has a generally cylindrical cup-shaped configuration but it will be appreciated that other configurations and materials consistent with the described functional requirements of the fiber holder may be employed.
  • An aperture 23 is defined through the proximal end 21 of the fiber holder and is configured to circumferentially engage the exposed tip of core 11 inserted axially through the aperture.
  • Aperture 23 is preferably centrally located in proximal holder end 21 such that the inserted tip of core 11 and holder 20 are concentrically aligned.
  • the annular shoulder at the end of cladding 12 from, which the core tip extends, abuts and may be secured by suitable adhesive or other means to the exterior surface of proximal end 21 surrounding aperture 23 .
  • a substrate 30 typically a printed circuit board (PCB), has an interiorly facing top surface 31 , an exteriorly facing bottom surface 32 and a periphery 33 .
  • a laser or LED diode 34 is disposed on the top surface 31 of the substrate 30 .
  • miscellaneous electronic components 35 , 36 may also be disposed on the substrate top surface.
  • Electrical leads or wires 37 extend from bottom surface 32 for connection to external electrical components.
  • the substrate 30 is round (i.e., a flat cylinder) and the laser or LED diode 34 is positioned at the center thereof.
  • the annular open distal end 22 of fiber holder 20 may be secured by a suitable adhesive or other means to the top surface 31 of the substrate 30 in a concentric relation about laser or LED diode 34 such that the exposed tip of core 11 in the fiber holder is aligned with and butt-coupled to the laser or LED diode.
  • the butt-coupling defines a small gap, anywhere from a few microns but no greater than a two or three hundred microns, between the laser or LED diode 34 and the fiber core tip.
  • the gap may be filled with epoxy having a refractive index matching the refractive index of the optical fiber.
  • the laser or LED diode 34 and exposed tip of core 11 are thusly coaxially aligned.
  • a housing 40 in the form of a resilient strain relief member, encloses the fiber holder 20 along with the top surface 31 and periphery 33 of substrate 30 .
  • the resilient strain relief housing 40 may have an elongated generally bell-shaped configuration that is open at its wide end, the interior surface 41 of which engages the periphery 33 of substrate 30 in water-resistant sealing relation.
  • the narrow end of housing 40 is closed except for an axially centered aperture 42 defined therein that communicates with a hollow cylindrical fiber retaining tube 43 extending axially through the housing interior, terminating short of the open housing end.
  • Tube 43 is configured to receive and circumferentially surround and engage fiber 10 such that the tip of the fiber core 11 extends in butt-coupling relation to the laser or LED diode 34 as described above.
  • Housing 40 may be made of rubber or other resilient material suitable for serving the protective strain relief and housing functions described herein.
  • the exposed tip of fiber core 11 extends into fiber holder 20 where it is butt-coupled to the laser or LED diode 34 .
  • the strain relief housing contains and protects the coupling region as well as the top surface of the substrate.
  • the annular end of the fiber cladding 12 may be secured to the closed end of fiber holder 20 as described, the positional engagement of the fiber may rely solely on frictional or other engagement within the fiber retaining tube 43 .
  • Strain relief housing 40 being resilient, protects the fiber and its positioning against pulling or bending while enclosing and protecting the coupling region and top surface of the substrate in a water resistant engagement.
  • the fiber holder 20 protects the butt coupling region within the housing and may also serve as a polishing holder.
  • the invention includes the method of assembling the module.
  • the method includes the following steps performed not necessarily in the order recited.
  • Optical fiber 10 is provided with an exposed tip of core 11 extending from the fiber cladding at the light receiving end of the fiber.
  • the exposed core tip is inserted into fiber holder 20 through aperture 23 at the closed end of the fiber holder.
  • Laser or LED 34 is disposed on the top surface 31 of substrate 30 , and an open end of the fiber holder 20 is placed on the top surface of the substrate surrounding the laser or LED with the exposed fiber core tip in light-receiving butt-coupled relation to the laser or LED. Because of the simple design this placement may be accomplished, without laser- or LED fiber alignment complications, using standard pick and place robotic systems.
  • Resilient strain relief housing 40 is secured about the light receiving end of the fiber, and the fiber holder 20 and at least the top surface 31 of the substrate 30 are inserted into and secured to the strain relief housing 40 in water resistant sealing relation.
  • the schematic diagram of FIG. 5 shows the light transmission between laser or LED 34 and the tip of fiber core 11 in the optical butt coupling arrangement.
  • the laser is preferably a VCSEL, but may be an LED.
  • the gap between the laser and fiber core can be on the order of a few microns to a couple hundred microns, depending on the particular optical and structural design.
  • the small gap between the laser and fiber core may be filled with index matched epoxy.
  • substrate 30 is illustrated as being circular (i.e., having a flat cylindrical configuration), that is not to be considered as a limiting feature of the invention since the substrate can be a regular or irregular polygon, ellipse, or other shape.
  • the strain relief housing configuration would also be modified to accommodate the substrate configuration for providing the required enclosure and sealing functions.
  • FIGS. 6, 7A, 7B and 8 An example of this is illustrated in FIGS. 6, 7A, 7B and 8 .
  • substrate 30 A in this embodiment is shown as having a generally rectangular configuration with a top surface 31 A, a bottom surface 32 A, and a periphery 33 A.
  • Laser or LED diode 34 is positioned on top surface 31 A along with electronic components 35 A, 36 A. Electrical wires or leads 37 extend from the substrate bottom surface.
  • Strain relief housing member 40 A is configured as a trapezoid, truncated at its narrow top end with aperture 42 A defined therein.
  • Fiber retaining tube 43 A extends axially through the housing interior, terminating short of the open housing end.
  • Tube 43 A is configured to receive and circumferentially surround and engage fiber 10 such that the tip of the fiber core 11 extends in butt-coupling relation to the laser or LED diode 34 disposed on surface 31 A as described above.
  • Housing 40 A has its open bottom end configured as a rectangle to match the rectangular periphery 33 A of the substrate so that its bottom interior surface 41 A can be secured to and provide water resistant sealing along that periphery.
  • the package design described and illustrated provides an integrated solution for laser or LED driver electronics packaging, fiber alignment, strain relief, semi-hermetic sealing (or water resistance sealing) in one simple cost effective design.
  • the advantages of the invention are several.
  • the laser or LED and fiber alignment can be accomplished using standard pick and place equipment; no active alignment step is required.
  • fiber holder 20 serves to provide not only a fiber holding function; it also provides protection for the laser or LED diode and associated wiring.
  • the strain relief housing unit 40 serves to protect the optical fiber from pulling and bending forces and also protects and provides a water resistant seal for the overall module.
  • housing 40 is configured to permit the remainder of the laser or LED module to be easily inserted therein and sealed, resulting in a simply assembled overall package that can easily be adapted to be fully waterproof.
  • holder 20 can be replaced with index matched, transparent encapsulation epoxy.
  • the substrate instead of a PCB, may be a ceramic package or a lead frame package.
  • the invention includes structure and a method of fabricating a structure for a module for coupling a laser or LED diode (e.g., a VCSEL) with light diffusion fiber in butt-coupling relation.
  • the package design integrates solutions for laser or LED driver electronics, and a housing that effects fiber alignment, strain relief, and semi-hermetic sealing (or water resistance sealing) in one simple cost effective design.
  • a PCB assembly is nested into the strain relief housing.
  • the laser or LED module described is a simple, low cost laser or LED package designed for light diffusion fiber. Only two leads 37 (Vcc and GND) are required to operate the module, although pulse width modulation (PWM) signals can be provided on a third lead with additional functionality (such as light intensity control, dimming, etc).
  • PWM pulse width modulation

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Optical Couplings Of Light Guides (AREA)
US15/799,510 2017-10-31 2017-10-31 Modular Laser Connector Packaging System and Method Abandoned US20190129108A1 (en)

Priority Applications (6)

Application Number Priority Date Filing Date Title
US15/799,510 US20190129108A1 (en) 2017-10-31 2017-10-31 Modular Laser Connector Packaging System and Method
CN201880079135.8A CN111656238B (zh) 2017-10-31 2018-10-31 模块化激光器连接器封装系统和方法
CN202211118540.0A CN115576060A (zh) 2017-10-31 2018-10-31 模块化激光器连接器封装系统和方法
EP18873694.6A EP3704525A4 (en) 2017-10-31 2018-10-31 MODULAR LASER CONNECTOR PACKAGING SYSTEM AND METHOD
PCT/US2018/058415 WO2019089732A2 (en) 2017-10-31 2018-10-31 Modular laser connector packaging system and method
US16/442,917 US10838158B2 (en) 2017-10-31 2019-06-17 Modular laser connector packaging system and method

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US15/799,510 US20190129108A1 (en) 2017-10-31 2017-10-31 Modular Laser Connector Packaging System and Method

Related Child Applications (1)

Application Number Title Priority Date Filing Date
US16/442,917 Continuation US10838158B2 (en) 2017-10-31 2019-06-17 Modular laser connector packaging system and method

Publications (1)

Publication Number Publication Date
US20190129108A1 true US20190129108A1 (en) 2019-05-02

Family

ID=66245562

Family Applications (2)

Application Number Title Priority Date Filing Date
US15/799,510 Abandoned US20190129108A1 (en) 2017-10-31 2017-10-31 Modular Laser Connector Packaging System and Method
US16/442,917 Active US10838158B2 (en) 2017-10-31 2019-06-17 Modular laser connector packaging system and method

Family Applications After (1)

Application Number Title Priority Date Filing Date
US16/442,917 Active US10838158B2 (en) 2017-10-31 2019-06-17 Modular laser connector packaging system and method

Country Status (4)

Country Link
US (2) US20190129108A1 (zh)
EP (1) EP3704525A4 (zh)
CN (2) CN111656238B (zh)
WO (1) WO2019089732A2 (zh)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US10566763B2 (en) * 2018-03-29 2020-02-18 Shimadzu Corporation Underwater laser light source

Citations (32)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5229749A (en) * 1975-09-02 1977-03-05 Mitsubishi Electric Corp Optical equipment and its manufacturing process
US4186996A (en) * 1978-09-22 1980-02-05 Amp Incorporated Optic adaptor junction
US4192574A (en) * 1977-04-13 1980-03-11 Thomson-Csf Sealed enclosing system for coupling an optoelectronic device and an optical fibre
JPS55166973A (en) * 1979-06-15 1980-12-26 Hitachi Ltd Assembling method of light emitting semiconductor device with optical fiber
US4316204A (en) * 1979-02-09 1982-02-16 Fujitsu Limited Optoelectronic semiconductor device
JPS5784414A (en) * 1980-11-14 1982-05-26 Matsushita Electric Works Ltd Optical coupling method
FR2504693A1 (fr) * 1981-04-27 1982-10-29 Philips Nv Traversee pour fibre de verre dans un boitier metallique
US4385797A (en) * 1979-06-20 1983-05-31 U.S. Philips Corporation Light-emitting device coupled to an optical fibre
US4399453A (en) * 1981-03-23 1983-08-16 Motorola, Inc. Low thermal impedance plastic package
US4461538A (en) * 1981-10-20 1984-07-24 Augat Inc. Active receptacle having resilient sleeve-like bushing
US4639077A (en) * 1983-07-21 1987-01-27 Bbc Brown, Boveri & Company Limited Coupling for a light-conducting fiber
EP0241955A1 (en) * 1986-03-17 1987-10-21 Koninklijke Philips Electronics N.V. Coupler for an optical fibre with an opto-electronic element, in a hermetically sealed housing, and method of manufacturing it
US4709979A (en) * 1983-11-04 1987-12-01 Telettra-Telefonia Elettronica E Radio S.P.A. System for the connection of photodetectors to optical fibers
US4725128A (en) * 1985-11-20 1988-02-16 Medtronic, Inc. Method for delivering light from multiple light emitting diodes over a single optical fiber
US5065011A (en) * 1989-07-20 1991-11-12 Fujitsu Limited Photodetector module for coupling with optical fiber
US5647044A (en) * 1995-12-22 1997-07-08 Lucent Technologies Inc. Fiber waveguide package with improved alignment means
US5812571A (en) * 1996-10-25 1998-09-22 W. L. Gore & Associates, Inc. High-power vertical cavity surface emitting laser cluster
US6231245B1 (en) * 1998-01-28 2001-05-15 Litef Gmbh Connection between a light guide and a light receiver
US6588942B1 (en) * 2000-04-06 2003-07-08 Fitel Usa Corp. Optical system having improved fiber-device coupling
US6659659B1 (en) * 2001-04-11 2003-12-09 Optical Communication Products, Inc. High-speed optical sub-assembly utilizing ceramic substrate, direct coupling and laser welding
US20040037514A1 (en) * 2000-03-29 2004-02-26 Francois Marion Method and device for passive alignment of optical fibres and optoelectronic components
US20040151442A1 (en) * 2002-09-23 2004-08-05 Jerry Scruggs Bench assembly and bi-directional optical transceiver constructed therewith
US6832860B2 (en) * 2001-06-30 2004-12-21 Samsung Electronics Co., Ltd. Optical module
US7111992B2 (en) * 2003-02-10 2006-09-26 Seiko Epson Corporation Connection structure between optical element and optical fiber, connection method thereof, and optical module
US7207729B2 (en) * 2001-03-22 2007-04-24 Telefonaktiebolaget Lm Ericsson (Publ) TO-can having a leadframe
US7229216B2 (en) * 2002-11-13 2007-06-12 Yang Kwan-Suk Optical contact module
US20070189677A1 (en) * 2005-08-12 2007-08-16 Applied Optoelectronics, Inc. Modular laser package system
US7347632B2 (en) * 2003-12-12 2008-03-25 Mina Farr Optical connectors for electronic devices
US20150309272A1 (en) * 2014-04-29 2015-10-29 Corning Incorporated Optical connectors for coupling light sources to optical fibers
US20150346411A1 (en) * 2014-06-03 2015-12-03 Corning Incorporated Light diffusing fiber lighting device
US9385249B2 (en) * 2011-07-21 2016-07-05 Olympus Corporation Optical element module, optical transmission module, and method of manufacturing optical transmission module
US9874706B2 (en) * 2014-03-13 2018-01-23 Olympus Corporation Optical transmission module and method for manufacturing optical transmission module

Family Cites Families (27)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4255015A (en) * 1978-09-01 1981-03-10 Rockwell International Corporation Means for coupling a fiber optic cable with an electro-optic transducer
US5000536A (en) 1986-07-21 1991-03-19 At&T Bell Laboratories Connector for optical fiber cable
JP2570879B2 (ja) * 1990-02-08 1997-01-16 三菱電機株式会社 光半導体モジュールの組立方法
US5137364A (en) 1991-01-31 1992-08-11 Mccarthy Cornelius J Optical spectral analysis apparatus
WO2002103867A1 (de) * 2001-06-15 2002-12-27 Infineon Technologies Ag Opto-elektronisches lasermodul
US20030210873A1 (en) 2002-05-09 2003-11-13 Moretti Anthony L. Passive alignment connection for fiber optics incorporating VCSEL emitters
JP2004020851A (ja) * 2002-06-14 2004-01-22 Hamamatsu Photonics Kk 光モジュール
WO2004042444A1 (ja) 2002-11-08 2004-05-21 Tdk Corporation 光モジュール及びその製造方法
US6874950B2 (en) 2002-12-17 2005-04-05 International Business Machines Corporation Devices and methods for side-coupling optical fibers to optoelectronic components
US6885797B2 (en) * 2003-01-22 2005-04-26 Finisar Corporation Zero clearance receptacle design for single mode optical fiber connectors
US7210857B2 (en) * 2003-07-16 2007-05-01 Finisar Corporation Optical coupling system
US7226218B2 (en) 2004-09-10 2007-06-05 Applied Optoelectronics, Inc. Method and apparatus for coupling a laser to a fiber in a two-lens laser system
US20060056778A1 (en) 2004-09-10 2006-03-16 Applied Optoelectronics, Inc. Laser module with improved lens housing and associated methods
US7118292B2 (en) * 2005-01-24 2006-10-10 Emcore Corporation Coaxial cooled laser modules with integrated thermal electric cooler and optical components
KR100696205B1 (ko) 2005-08-26 2007-03-20 한국전자통신연구원 광 모듈 및 광 모듈 패키지
KR20110007456A (ko) * 2009-07-16 2011-01-24 주식회사 엑스엘 광 모듈 및 그 제조방법
JP2013061478A (ja) * 2011-09-13 2013-04-04 Toshiba Corp 光モジュール及びその製造方法
US9093003B2 (en) 2011-10-11 2015-07-28 Corning Incorporated Manipulation of color illumination using light diffusing fiber
EP2795378B1 (en) 2011-12-19 2020-06-24 Corning Incorporated Uniform uv efficient light diffusing fiber
JP5226856B1 (ja) 2011-12-26 2013-07-03 株式会社フジクラ レーザモジュール及びその製造方法
CA2891250A1 (en) * 2012-11-15 2014-05-22 4233999 Canada Inc. Methods and apparatus for high speed short distance optical communications using micro light emitting diodes
US9103999B2 (en) * 2013-03-13 2015-08-11 Avago Technologies General Ip (Singapore) Pte. Ltd. Optical data communication module having EMI cage
WO2015118131A1 (fr) 2014-02-07 2015-08-13 Cnam - Conservatoire National Des Arts Et Metiers Procédé de fabrication de structures de couplage optique vertical
US20150369991A1 (en) * 2014-06-23 2015-12-24 Corning Incorporated Light diffusing fiber lighting device having a single lens
US10101517B2 (en) 2015-02-18 2018-10-16 Corning Incorporated Optical fiber illumination systems and methods
US20200101326A1 (en) * 2015-04-22 2020-04-02 Angiodynamics, Inc. Monolithinc photodetector for dosimeter
US20170040768A1 (en) 2015-08-04 2017-02-09 AMD Lasers Multi-Wavelength Laser Diode Package Arrangement

Patent Citations (32)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5229749A (en) * 1975-09-02 1977-03-05 Mitsubishi Electric Corp Optical equipment and its manufacturing process
US4192574A (en) * 1977-04-13 1980-03-11 Thomson-Csf Sealed enclosing system for coupling an optoelectronic device and an optical fibre
US4186996A (en) * 1978-09-22 1980-02-05 Amp Incorporated Optic adaptor junction
US4316204A (en) * 1979-02-09 1982-02-16 Fujitsu Limited Optoelectronic semiconductor device
JPS55166973A (en) * 1979-06-15 1980-12-26 Hitachi Ltd Assembling method of light emitting semiconductor device with optical fiber
US4385797A (en) * 1979-06-20 1983-05-31 U.S. Philips Corporation Light-emitting device coupled to an optical fibre
JPS5784414A (en) * 1980-11-14 1982-05-26 Matsushita Electric Works Ltd Optical coupling method
US4399453A (en) * 1981-03-23 1983-08-16 Motorola, Inc. Low thermal impedance plastic package
FR2504693A1 (fr) * 1981-04-27 1982-10-29 Philips Nv Traversee pour fibre de verre dans un boitier metallique
US4461538A (en) * 1981-10-20 1984-07-24 Augat Inc. Active receptacle having resilient sleeve-like bushing
US4639077A (en) * 1983-07-21 1987-01-27 Bbc Brown, Boveri & Company Limited Coupling for a light-conducting fiber
US4709979A (en) * 1983-11-04 1987-12-01 Telettra-Telefonia Elettronica E Radio S.P.A. System for the connection of photodetectors to optical fibers
US4725128A (en) * 1985-11-20 1988-02-16 Medtronic, Inc. Method for delivering light from multiple light emitting diodes over a single optical fiber
EP0241955A1 (en) * 1986-03-17 1987-10-21 Koninklijke Philips Electronics N.V. Coupler for an optical fibre with an opto-electronic element, in a hermetically sealed housing, and method of manufacturing it
US5065011A (en) * 1989-07-20 1991-11-12 Fujitsu Limited Photodetector module for coupling with optical fiber
US5647044A (en) * 1995-12-22 1997-07-08 Lucent Technologies Inc. Fiber waveguide package with improved alignment means
US5812571A (en) * 1996-10-25 1998-09-22 W. L. Gore & Associates, Inc. High-power vertical cavity surface emitting laser cluster
US6231245B1 (en) * 1998-01-28 2001-05-15 Litef Gmbh Connection between a light guide and a light receiver
US20040037514A1 (en) * 2000-03-29 2004-02-26 Francois Marion Method and device for passive alignment of optical fibres and optoelectronic components
US6588942B1 (en) * 2000-04-06 2003-07-08 Fitel Usa Corp. Optical system having improved fiber-device coupling
US7207729B2 (en) * 2001-03-22 2007-04-24 Telefonaktiebolaget Lm Ericsson (Publ) TO-can having a leadframe
US6659659B1 (en) * 2001-04-11 2003-12-09 Optical Communication Products, Inc. High-speed optical sub-assembly utilizing ceramic substrate, direct coupling and laser welding
US6832860B2 (en) * 2001-06-30 2004-12-21 Samsung Electronics Co., Ltd. Optical module
US20040151442A1 (en) * 2002-09-23 2004-08-05 Jerry Scruggs Bench assembly and bi-directional optical transceiver constructed therewith
US7229216B2 (en) * 2002-11-13 2007-06-12 Yang Kwan-Suk Optical contact module
US7111992B2 (en) * 2003-02-10 2006-09-26 Seiko Epson Corporation Connection structure between optical element and optical fiber, connection method thereof, and optical module
US7347632B2 (en) * 2003-12-12 2008-03-25 Mina Farr Optical connectors for electronic devices
US20070189677A1 (en) * 2005-08-12 2007-08-16 Applied Optoelectronics, Inc. Modular laser package system
US9385249B2 (en) * 2011-07-21 2016-07-05 Olympus Corporation Optical element module, optical transmission module, and method of manufacturing optical transmission module
US9874706B2 (en) * 2014-03-13 2018-01-23 Olympus Corporation Optical transmission module and method for manufacturing optical transmission module
US20150309272A1 (en) * 2014-04-29 2015-10-29 Corning Incorporated Optical connectors for coupling light sources to optical fibers
US20150346411A1 (en) * 2014-06-03 2015-12-03 Corning Incorporated Light diffusing fiber lighting device

Non-Patent Citations (5)

* Cited by examiner, † Cited by third party
Title
Bauco US 2015/0346411 A1 *
Farr US 7,347,632 B2 *
Murry US 2007/0189677 A1 *
Scruggs US 2004/0151442 A1 *
Yang US 7,229,216 B2 *

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US10566763B2 (en) * 2018-03-29 2020-02-18 Shimadzu Corporation Underwater laser light source

Also Published As

Publication number Publication date
US10838158B2 (en) 2020-11-17
CN111656238A (zh) 2020-09-11
CN111656238B (zh) 2022-09-30
WO2019089732A2 (en) 2019-05-09
EP3704525A2 (en) 2020-09-09
WO2019089732A3 (en) 2020-04-02
US20190302382A1 (en) 2019-10-03
EP3704525A4 (en) 2021-08-04
CN115576060A (zh) 2023-01-06

Similar Documents

Publication Publication Date Title
US9846288B2 (en) Fiber optic devices and methods of manufacturing fiber optic devices
JP3540834B2 (ja) 光コネクタ及びそれに使用する光結合装置
US9897769B2 (en) Vision-based passive alignment of an optical fiber subassembly to an optoelectronic device
US5812717A (en) Optical package with alignment means and method of assembling an optical package
JP2017090909A (ja) 光電変換アセンブリ
US7625133B2 (en) Method of assembling optoelectronic devices and an optoelectronic device assembled according to this method
US7223023B2 (en) Optoelectronic transmission and/or reception arrangements
JPH03500826A (ja) 光学部品の製造方法
US5029968A (en) Optoelectronic hybrid package assembly including integral, self-aligned fiber optic connector
IE910134A1 (en) Optical devices
CA2365141A1 (en) Light source-optical fiber coupler
US10838158B2 (en) Modular laser connector packaging system and method
KR20080088723A (ko) 가이드 핀을 이용한 병렬형 광 트랜시버 모듈 패키지 및 그제작방법
KR101256814B1 (ko) 완전 수동정렬 패키징된 광모듈 및 그 제조방법
US8581173B2 (en) Fiber optic transceiver module having a molded cover in which an optical beam transformer made of an elastomer is integrally formed
US20090016683A1 (en) Angled fiber ferrule having off-axis fiber through-hole and method of coupling an optical fiber at an off-axis angle
JP2007072199A (ja) 光モジュールおよび光伝送装置
US6999644B1 (en) Discrete optoelectric package
KR100816063B1 (ko) 수동 정렬된 광결합 장치 및 그 제작방법
EP1063548B1 (en) Plastic packaged optoelectronic device
US20040247250A1 (en) Integrated sleeve pluggable package
JP2004317630A (ja) 光送信モジュール
CN107533202A (zh) 具有集成光子器件的光具座子组件
EP4147084A1 (en) Apparatus for coupling light into an optical fiber
JP2004341370A (ja) 光モジュール

Legal Events

Date Code Title Description
AS Assignment

Owner name: VERSALUME LLC, CALIFORNIA

Free format text: ASSIGNMENT OF ASSIGNORS INTEREST;ASSIGNORS:TAN, QING;PANICCIA, MARIO;REEL/FRAME:044768/0445

Effective date: 20171030

STPP Information on status: patent application and granting procedure in general

Free format text: FINAL REJECTION MAILED

STCB Information on status: application discontinuation

Free format text: ABANDONED -- FAILURE TO RESPOND TO AN OFFICE ACTION

AS Assignment

Owner name: CORNING INCORPORATED, NEW YORK

Free format text: ASSIGNMENT OF ASSIGNORS INTEREST;ASSIGNOR:VERSALUME LLC;REEL/FRAME:051198/0209

Effective date: 20191121