US20180188861A1 - Display device - Google Patents

Display device Download PDF

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Publication number
US20180188861A1
US20180188861A1 US15/480,383 US201715480383A US2018188861A1 US 20180188861 A1 US20180188861 A1 US 20180188861A1 US 201715480383 A US201715480383 A US 201715480383A US 2018188861 A1 US2018188861 A1 US 2018188861A1
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United States
Prior art keywords
layer
recesses
display device
disposed
substrate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
US15/480,383
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English (en)
Inventor
Yuan-Lin WU
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Innolux Corp
Original Assignee
Innolux Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Innolux Corp filed Critical Innolux Corp
Priority to US15/480,383 priority Critical patent/US20180188861A1/en
Assigned to Innolux Corporation reassignment Innolux Corporation ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: WU, YUAN-LIN
Priority to CN202210323582.1A priority patent/CN114695496A/zh
Priority to CN201711454199.5A priority patent/CN108269832A/zh
Publication of US20180188861A1 publication Critical patent/US20180188861A1/en
Priority to US16/697,086 priority patent/US11281318B2/en
Priority to US17/670,507 priority patent/US11747930B2/en
Priority to US18/353,892 priority patent/US20230359296A1/en
Abandoned legal-status Critical Current

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    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
    • G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
    • G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
    • G06F3/041—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
    • G06F3/0412—Digitisers structurally integrated in a display
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/40—OLEDs integrated with touch screens
    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/1333—Constructional arrangements; Manufacturing methods
    • G02F1/133345—Insulating layers
    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/1333—Constructional arrangements; Manufacturing methods
    • G02F1/13338—Input devices, e.g. touch panels
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
    • G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
    • G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
    • G06F3/041—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
    • G06F3/044—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means by capacitive means
    • G06F3/0443—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means by capacitive means using a single layer of sensing electrodes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/562—Protection against mechanical damage
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/16—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof the devices being of types provided for in two or more different main groups of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. forming hybrid circuits
    • H01L25/167—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof the devices being of types provided for in two or more different main groups of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. forming hybrid circuits comprising optoelectronic devices, e.g. LED, photodiodes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/02—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers
    • H01L27/12—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being other than a semiconductor body, e.g. an insulating body
    • H01L27/1214—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being other than a semiconductor body, e.g. an insulating body comprising a plurality of TFTs formed on a non-semiconducting substrate, e.g. driving circuits for AMLCDs
    • H01L27/1218—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being other than a semiconductor body, e.g. an insulating body comprising a plurality of TFTs formed on a non-semiconducting substrate, e.g. driving circuits for AMLCDs with a particular composition or structure of the substrate
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/02—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers
    • H01L27/12—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being other than a semiconductor body, e.g. an insulating body
    • H01L27/1214—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being other than a semiconductor body, e.g. an insulating body comprising a plurality of TFTs formed on a non-semiconducting substrate, e.g. driving circuits for AMLCDs
    • H01L27/1248—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being other than a semiconductor body, e.g. an insulating body comprising a plurality of TFTs formed on a non-semiconducting substrate, e.g. driving circuits for AMLCDs with a particular composition or shape of the interlayer dielectric specially adapted to the circuit arrangement
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/15—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components having potential barriers, specially adapted for light emission
    • H01L27/153—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components having potential barriers, specially adapted for light emission in a repetitive configuration, e.g. LED bars
    • H01L27/156—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components having potential barriers, specially adapted for light emission in a repetitive configuration, e.g. LED bars two-dimensional arrays
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/10—OLED displays
    • H10K59/12—Active-matrix OLED [AMOLED] displays
    • H10K59/121—Active-matrix OLED [AMOLED] displays characterised by the geometry or disposition of pixel elements
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F2203/00—Indexing scheme relating to G06F3/00 - G06F3/048
    • G06F2203/041—Indexing scheme relating to G06F3/041 - G06F3/045
    • G06F2203/04102—Flexible digitiser, i.e. constructional details for allowing the whole digitising part of a device to be flexed or rolled like a sheet of paper
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F2203/00—Indexing scheme relating to G06F3/00 - G06F3/048
    • G06F2203/041—Indexing scheme relating to G06F3/041 - G06F3/045
    • G06F2203/04103—Manufacturing, i.e. details related to manufacturing processes specially suited for touch sensitive devices
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
    • G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
    • G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
    • G06F3/041—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
    • G06F3/044—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means by capacitive means
    • G06F3/0446—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means by capacitive means using a grid-like structure of electrodes in at least two directions, e.g. using row and column electrodes
    • G—PHYSICS
    • G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
    • G09G—ARRANGEMENTS OR CIRCUITS FOR CONTROL OF INDICATING DEVICES USING STATIC MEANS TO PRESENT VARIABLE INFORMATION
    • G09G3/00—Control arrangements or circuits, of interest only in connection with visual indicators other than cathode-ray tubes
    • G09G3/20—Control arrangements or circuits, of interest only in connection with visual indicators other than cathode-ray tubes for presentation of an assembly of a number of characters, e.g. a page, by composing the assembly by combination of individual elements arranged in a matrix no fixed position being assigned to or needed to be assigned to the individual characters or partial characters
    • G09G3/22—Control arrangements or circuits, of interest only in connection with visual indicators other than cathode-ray tubes for presentation of an assembly of a number of characters, e.g. a page, by composing the assembly by combination of individual elements arranged in a matrix no fixed position being assigned to or needed to be assigned to the individual characters or partial characters using controlled light sources
    • G09G3/30—Control arrangements or circuits, of interest only in connection with visual indicators other than cathode-ray tubes for presentation of an assembly of a number of characters, e.g. a page, by composing the assembly by combination of individual elements arranged in a matrix no fixed position being assigned to or needed to be assigned to the individual characters or partial characters using controlled light sources using electroluminescent panels
    • G09G3/32—Control arrangements or circuits, of interest only in connection with visual indicators other than cathode-ray tubes for presentation of an assembly of a number of characters, e.g. a page, by composing the assembly by combination of individual elements arranged in a matrix no fixed position being assigned to or needed to be assigned to the individual characters or partial characters using controlled light sources using electroluminescent panels semiconductive, e.g. using light-emitting diodes [LED]
    • G09G3/3208—Control arrangements or circuits, of interest only in connection with visual indicators other than cathode-ray tubes for presentation of an assembly of a number of characters, e.g. a page, by composing the assembly by combination of individual elements arranged in a matrix no fixed position being assigned to or needed to be assigned to the individual characters or partial characters using controlled light sources using electroluminescent panels semiconductive, e.g. using light-emitting diodes [LED] organic, e.g. using organic light-emitting diodes [OLED]
    • G09G3/3225—Control arrangements or circuits, of interest only in connection with visual indicators other than cathode-ray tubes for presentation of an assembly of a number of characters, e.g. a page, by composing the assembly by combination of individual elements arranged in a matrix no fixed position being assigned to or needed to be assigned to the individual characters or partial characters using controlled light sources using electroluminescent panels semiconductive, e.g. using light-emitting diodes [LED] organic, e.g. using organic light-emitting diodes [OLED] using an active matrix
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
    • Y02E10/00—Energy generation through renewable energy sources
    • Y02E10/50—Photovoltaic [PV] energy
    • Y02E10/549—Organic PV cells

Definitions

  • the disclosure relates to a display device.
  • the disclosure provides a display device with the plurality of recesses to stop the spread of the micro-cracks of the display device.
  • a display device includes a substrate, a driving structure layer, a display structure layer and a touch layer.
  • the substrate includes a bending area and a main area adjacent to the bending area.
  • the driving structure layer is disposed on the substrate.
  • the driving structure layer comprises an insulating structure, and the insulating structure comprises a plurality of recesses.
  • the display structure layer is disposed on the driving structure layer.
  • the touch layer is disposed on the driving structure layer. A portion of the touch layer is disposed on the bending area of the substrate. At least a part of the plurality of recesses is disposed on the bending area of the substrate.
  • a display device includes a substrate, a driving structure layer, a display structure layer and a touch layer.
  • the substrate includes a bending area and a main area adjacent to the bending area.
  • the driving structure layer is disposed on the substrate.
  • the driving structure layer comprises a crack stopper.
  • the display structure layer is disposed on the driving structure layer.
  • the touch layer is disposed on the driving structure layer. A portion of the touch layer is disposed on the bending area of the substrate. At least a part of the crack stopper is disposed on the bending area of the substrate.
  • the driving structure layer includes a plurality of recesses. In this way, the spread of the micro-cracks may be mitigated, or the endurability of the display device may be improved.
  • FIG. 1 is a schematic cross-sectional view of a display device according to an embodiment of the disclosure.
  • FIGS. 2-4 are schematic top views of display devices according to three embodiments of the disclosure.
  • FIG. 5 is a schematic top views of display devices according to another embodiment of the disclosure.
  • FIG. 6 is a schematic partially enlarged cross-sectional view of a display device according to an embodiment of the disclosure.
  • FIG. 7 is a schematic partially enlarged cross-sectional view of a display device according to an embodiment of the disclosure.
  • FIG. 8 is a schematic partially enlarged cross-sectional view of a display device according to an embodiment of the disclosure.
  • FIG. 9 is a schematic partially enlarged cross-sectional view of a display device according to an embodiment of the disclosure.
  • FIG. 10 is a schematic partially enlarged cross-sectional view of a plurality of recesses of a display device according to an embodiment of the disclosure.
  • FIG. 11 is a schematic partially enlarged cross-sectional view of a plurality of recesses of a display device according to another embodiment of the disclosure.
  • FIG. 12 is a schematic partially enlarged cross-sectional view of a plurality of recesses of a display device according to an embodiment of the disclosure.
  • FIGS. 13A to 13E are schematic partially enlarged top views of the corners of the display device according to five embodiments of the disclosure.
  • FIG. 14 is a schematic cross-sectional view of FIG. 13A along I-I line.
  • FIGS. 15A to 15H are schematic partially enlarged top views of the straight edge of the display device according to eight embodiments of the disclosure.
  • FIG. 1 is a schematic cross-sectional view of a display device according to an embodiment of the disclosure.
  • the display device 100 includes a substrate 110 , a driving structure layer 120 , a display structure layer 130 and a touch layer 140 .
  • the substrate 110 may be a flexible substrate or a rigid substrate.
  • the flexible substrate can be made of plastic, and the rigid substrate can be made of glass, which is not limited.
  • the substrate 110 has a bending area 112 and a main area 114 adjacent to the bending area 112 .
  • the bending area 112 can be considered as a bent portion of the substrate 110
  • the main area 114 can be considered as an unbent portion of the substrate 110 .
  • the main area 114 can be flat.
  • the main area 114 can be not flat and include uneven or curved surface.
  • the bending area 112 can have greater bending extent than the main area 114 . In other words, a greatest curvature of the bending area 112 is greater than a greatest curvature of the main area 114 .
  • the bending process can be conducted before the display device is presented to the consumers (or users).
  • FIG. 1 shows the state of the display device, in which the substrate 110 has been bent.
  • the bending process can be conducted by the consumer. That is, originally, the substrate of the display device can be flat, and then the consumer can bend the substrate to have the bending area according to requirement, thus obtaining the display device as shown in FIG. 1 .
  • the bending area can mean a portion that has been bent, or a portion that will be bent by the consumers.
  • the driving structure layer 120 is disposed on the substrate 110 .
  • the driving structure layer 120 comprises an insulating structure.
  • the insulating structure includes a plurality of recesses 122 .
  • the plurality of recesses 122 could act as a crack stopper.
  • the recess can be in the form of opening or slit.
  • the display structure layer 130 is disposed on the driving structure layer 120 .
  • the touch layer 140 is disposed on the driving structure layer 120 . A portion of the touch layer 140 is disposed on the bending area 112 of the substrate 110 . At least a part of the plurality of recesses 122 is disposed on the bending area 112 of the substrate 110 .
  • the driving structure layer 120 includes the plurality of recesses 122 disposed on the bending area 112 of the substrate 110 , even though the micro-cracks might exist at the edge of the substrate 110 and/or the edge of the driving structure layer 120 , the spread of the micro-cracks can be stopped by the plurality of recesses 122 . In this way, the spread of the micro-cracks may be mitigated, or yield of the substrate 110 , the driving structure layer 120 , the display structure layer 130 and the touch layer 140 can in increased, or the endurability of the display device may be improved. Meanwhile, it may be unnecessary to worry about the repeatedly bending will cause the spread of the micro-cracks on the display device 100 .
  • the driving structure layer 120 may comprise driving circuits and driving elements constituted from a plurality of insulating layers and conductive layers, which is not limited thereto.
  • the display structure layer 130 may comprises a plurality of organic light emitting diode (OLED) components, a plurality of micro-LED or other suitable display structure, which is not limited thereto.
  • the touch layer 140 may comprises a plurality of insulating layers and conductive layers, which is not limited thereto.
  • the driving structure layer 120 , a display structure layer 130 and a touch layer 140 may not be separated clearly. For example, in some embodiment, portion of the touch layer 140 may be between the driving structure layer 120 and the display structure layer 130 , and another portion of the touch layer 140 is located on the display structure layer 130 .
  • the bending area 112 of the substrate 110 is a portion of the substrate 110 with curve surface.
  • the bending area 112 could be at side of the substrate 110 as shown in FIG. 1 .
  • the bending area could be in the middle region of the substrate, which is not limited thereto.
  • FIG. 1 is a schematic drawing for facilitating understanding of the present embodiment only.
  • FIGS. 2-4 are schematic top views of display devices according to three embodiments of the disclosure.
  • the area filled with dots is the location of the plurality of recesses where the plurality of recesses is distributed.
  • the distribution location of the plurality of recesses 222 A, 222 B and 222 C surrounds the touch layer 240 .
  • the distribution location of the plurality of recesses 222 A, 222 B and 222 C are located at edges of the substrates 210 A, 210 B and 210 C.
  • the distribution locations of the plurality of recesses 222 A and 222 B are continuous strip areas, and the distribution location of the plurality of recesses 222 C is a discontinuous strip area, which is not limited thereto.
  • FIG. 5 is a schematic top view of a display device according to another embodiment of the disclosure.
  • the distribution location of the plurality of recesses 222 D surrounds the display structure layer 230 as shown in FIG. 5 .
  • the substrates 210 D and the substrates 210 A have the same shapes.
  • the display structure layer and the touch layer exist at the four embodiments of FIGS. 2-5 , but only one of the display structure layer and the touch layer is shown in each embodiment.
  • the substrate 210 A, 210 B, 210 C or 210 D
  • the substrate 210 A can be bent along at least one of the dash lines to form the bending area 112 .
  • the substrate can be bent along at least one of the dash lines to form the bending area, which is not limited thereto.
  • the substrate 110 further comprises a first edge 116
  • the touch layer 140 comprises a second edge 142 adjacent to the first edge 116
  • a part of the plurality of recesses 122 is disposed between the first edge 116 and the second edge 142 .
  • a minimum distance between the portion of the plurality of recesses 122 and the first edge 116 is a first distance D 10
  • the first distance D 10 is between 0.1 um and 1000 um, which is not limited thereto.
  • the display structure layer 130 is completely covered by the touch layer 140 . Since the plurality of recesses 122 is disposed between the first edge 116 and the second edge 142 , the plurality of recesses 122 locates outside the display structure layer 130 . Therefore, the spread of the micro-cracks can be stopped by the plurality of recesses outside the display structure layer 130 , and the display structure layer 130 can be kept away from the micro-cracks.
  • FIG. 6 is a schematic partially enlarged cross-sectional view of a display device according to an embodiment of the disclosure.
  • the display device 300 is similar to the display device 100 of FIG. 1 , and the similar detail thereof is not repeated.
  • a main difference therebetween is that the display device 300 further comprises a capping layer 150 .
  • the capping layer 150 is disposed between the display structure layer 130 and the touch layer 140 .
  • the capping layer 150 protects the display structure layer 130 and the driving structure layer 120 from the deterioration due to moisture penetration, the post-processes and the like.
  • the capping layer 150 of the present embodiment also provides flat surface for disposing the touch layer 140 .
  • the capping layer 150 may comprise a plurality of stacked layer, and the plurality of stacked layer may comprise inorganic layers and organic layer(s) between the inorganic layers.
  • the display structure layer 130 of the present embodiment includes a pixel electrode layer 132 , a light-emitting layer 134 and a common electrode layer 136 .
  • a pixel defining layer 138 is disposed on the pixel electrode layer 132 and has an opening.
  • the light-emitting layer 134 is disposed in the opening of the pixel defining layer 138 and between the pixel electrode layer 132 and the common electrode layer 136 to form light-emitting OLEDs for emitting light to constitute images for a user.
  • the pixel electrode layer 132 can be an anode, and the common electrode layer 136 can be a cathode. Or, alternatively, the pixel electrode layer 132 can be a cathode, and the common electrode layer 136 can be an anode.
  • the driving structure layer 120 can further include an insulating structure 180 .
  • the insulating structure 180 can includes a plurality of recesses 122 as shown in FIG. 1 .
  • the insulating structure 180 can include at least one insulating layer.
  • the insulating structure 180 can include multiple insulating layers.
  • the insulating layer can be a planarization layer, a gate insulating layer, a buffer layer, a passivation layer and so on, which is not limited thereto.
  • the driving structure layer 120 includes a plurality of thin film transistor (TFT) 124 , only one TFT 124 is shown in FIG. 6 .
  • TFT thin film transistor
  • the TFT 124 could electrically connect to the pixel electrode layer 132 and controls the light-emitting OLEDs.
  • the TFT 124 can includes a buffer layer 126 A, an active layer 1241 , a gate layer 1242 , a gate insulating layer 126 B, a passivation layer 126 C, a source/drain layer 1243 , and a planarization layer 126 D.
  • the buffer layer 126 A is disposed on the substrate 110 and between the substrate 110 and the active layer 1241 .
  • the gate insulating layer 126 B is disposed between the active layer 1241 and the gate layer 1242 .
  • the passivation layer 126 C covers the gate layer 1242
  • the planarization layer 126 D covers the source/drain layer 1243 .
  • the insulating structure 180 can include at least one of the buffer layer 126 A, the gate insulating layer 126 B, the passivation layer 126 C, and the planarization layer 126 D, which is not limited thereto.
  • the insulating layer 180 includes only the buffer layer 126 A, the gate insulating layer 126 B, and the passivation layer 126 C in another embodiment, which is not limited thereto.
  • FIG. 7 is a schematic partially enlarged cross-sectional view of a display device according to an embodiment of the disclosure.
  • the display device 400 is similar to the display device 300 of FIG. 6 , and the similar detail thereof is not repeated.
  • a main difference therebetween is that the touch layer 440 of the display device 400 includes an upper touch electrode layer 442 and a lower touch electrode layer 444 .
  • the upper touch electrode layer 442 is disposed on the capping layer 150
  • the lower touch electrode layer 444 is disposed between the display structure layer 130 and the capping layer 150 .
  • the lower touch electrode layer 444 and the common electrode layer 136 can be the same layer, and can be made of the same material. Specifically, first, an electrode layer can be formed, and then patterned by photolithography to form the lower touch electrode layer 444 and the common electrode layer 136 .
  • FIG. 8 is a schematic partially enlarged cross-sectional view of a display device according to an embodiment of the disclosure.
  • the display device 500 is similar to the display device 300 of FIG. 6 , and the similar detail thereof is not repeated.
  • a main difference therebetween is that the touch layer 540 of the display device 500 is disposed between the display structure layer 130 and the driving structure layer 120 .
  • the touch electrode layer 540 and the pixel electrode layer 132 can be the same layer, and can be made of the same material. Specifically, first, an electrode layer can be formed, and then patterned by photolithography to form the touch electrode layer 540 and the pixel electrode layer 132 . Or, alternatively, the touch electrode layer 540 can be the same layer and be made of the same material as the source/drain layer 1243 .
  • FIG. 9 is a schematic partially enlarged cross-sectional view of a display device according to an embodiment of the disclosure.
  • the display device 600 is similar to the display device 300 of FIG. 6 , and the similar detail thereof is not repeated.
  • a main difference therebetween is that the display structure layer 630 of the display device 600 includes a plurality of micro-LEDs 632 .
  • two micro-LEDs 632 can be disposed in one pixel.
  • only one micro-LED 632 can be disposed in one pixel, which is not limited thereto.
  • Each of the micro-LEDs 632 includes a first electrode 632 A, a first type doped semiconductor layer 632 B, a quantum well layer 632 C, a second type doped semiconductor layer 632 D and a second electrode 632 E.
  • the first type doped semiconductor layer and the second type doped semiconductor layer can be of different doping types.
  • the first type can be N-doped, and the second type can be P-doped, and vice versa.
  • the micro-LEDs 632 of the present embodiment are vertical LEDs for exemplary purposes. However, in other embodiments, flip-chip LEDs or other light emitting devices may also be adopted in the display structure layer 630 .
  • the substrate 110 While bonding the micro-LEDs 632 onto the display device 600 , the substrate 110 will be squeezed, and the possibility of the spread of the micro-cracks may increase. Therefore, the insulating structure 180 with the plurality of recesses 122 (shown in FIG. 1 ) is very important.
  • FIG. 10 is a schematic partially enlarged cross-sectional view of an insulating structure with a plurality of recesses structure in the bending area of a display device according to an embodiment of the disclosure.
  • the insulating structure 180 can include at least one insulating layer, or can include multiple insulating layer.
  • the plurality of recesses can have different depths.
  • the insulating structure 180 can include the buffer layer 126 A, the gate insulating layer 126 B, and the passivation layer 126 C.
  • the insulating structure 180 can include a plurality of recesses on the main area and on the bending area.
  • FIG. 10 the insulating structure 180 can include the buffer layer 126 A, the gate insulating layer 126 B, and the passivation layer 126 C.
  • the insulating structure 180 can include a plurality of recesses on the main area and on the bending area.
  • Recesses 122 A 1 , 122 A 2 , and 122 A 3 are formed in the insulating structure 180 .
  • the recess 122 A 1 is formed in the passivation layer 126 C
  • the recess 122 A 2 is formed in the passivation layer 126 C and the gate insulating layer 126 B.
  • the recess 122 A 3 is formed in the passivation layer 126 C, the gate insulating layer 126 B, and the buffer layer 126 A.
  • the surface 118 of the substrate 110 is only exposed in some of the recesses, but the surface 118 is not exposed in other recesses. For example, as shown in FIG. 10 , the surface 118 of the substrate 110 is exposed by the recess 122 A 3 , but not exposed by the recess 122 A 1 and recess 122 A 2 , which is not limited thereto.
  • the insulating structure 180 includes recesses 122 A 1 , 122 A 2 , and 122 A 3 with different depths, which is not limited thereto.
  • the recesses with different depths can stop the spread of the micro-cracks occur in different depths.
  • the recess 122 A 3 includes a sidewall 122 S and a bottom 122 B.
  • the insulating structure 180 includes an angle ⁇ formed by the sidewall 122 S and the bottom 122 B, and the angle ⁇ can be between 10° and 80°.
  • the probability of the spread of the micro-cracks is 23% when the taper angle ⁇ is 90°, and the probabilities of the spread of the micro-cracks are 10%, 8%, 7%, 9% and 7% when the taper angle ⁇ is 80°, 60°, 50°, 20° and 10°, respectively.
  • the taper angle ⁇ can be between 10° to 80°. In some embodiments, the taper angle ⁇ can be between 20° to 60°.
  • the sidewalls of the recesses included in the insulating structure 180 can be smooth or can have a step profile.
  • the sidewalls of the recesses 122 A 1 , 122 A 2 , and 122 A 3 are smooth.
  • the sidewalls 122 B 1 of the recess 122 B as shown in FIG. 11 has a step 122 B 2 , which is not limited thereto.
  • the insulating structure 180 can include stacked insulating layers including the first silicon oxide layer I 12 , the first silicon nitride layer I 14 , the second silicon oxide layer 116 and the second silicon nitride layer I 18 , which is not limited thereto.
  • the total thickness of the silicon oxide layer (such as a sum of a thickness T 12 of the first silicon oxide layer I 12 and a thickness T 16 of the second silicon oxide layer I 16 ) may be larger than the total thickness of the silicon nitride layer (such as a sum of a thickness T 14 of the first silicon nitride layer I 14 and a thickness T 18 of the second silicon nitride layer 118 ).
  • the total thickness of the silicon oxide layer may be 1.5 times larger than the total thickness of the silicon nitride layer, and the total thickness of the silicon oxide layer may be smaller than 15 times of the total thickness of the silicon nitride layer.
  • FIG. 12 is a schematic partially enlarged cross-sectional view of an insulating structure with a plurality of recesses structure in the bending area of a display device according to an embodiment of the disclosure.
  • the insulating structure 180 can include a plurality of recesses on the main area and on the bending area.
  • FIG. 12 shows the part of the plurality of recesses on the bending area.
  • the insulating structure 180 comprises a first recess 122 C and a second recess 122 D.
  • a minimum width of the first recess 122 C is a first width W 12
  • a minimum width of the second recess 122 D is a second width W 14
  • the first width W 12 is different from the second width W 14 , which is not limited thereto.
  • the first recess 122 C has a first depth D 12
  • the second recess 122 D has a second depth D 14
  • the first depth D 12 is different from the second depth D 14 . Therefore, the spread of the micro-cracks occur in different depths can be stopped.
  • the first recess 122 C includes a first sidewall 122 CS and a first bottom 122 CB
  • the second recess 122 D includes a second sidewall 122 DS and a second bottom 122 DB.
  • the insulating structure 180 includes a first angle ⁇ 1 formed by the first sidewall 122 CS and the first bottom 122 CB, and a second angle ⁇ 2 formed by the second sidewall 122 DS and the second bottom 122 DB.
  • the first angle ⁇ 1 and the second angle ⁇ 2 can be in the range of 10° to 80°, for example, in the range of 20° to 60°.
  • the first angle ⁇ 1 and the second angle ⁇ 2 can be the same or different.
  • the quotient obtained by dividing the first angle ⁇ 1 by the second angle ⁇ 2 may be smaller than 1.5 and larger than 0.8.
  • the corner at the top of the first recess 122 C may have a smooth profile as shown in FIG. 12 . Therefore, the mitigation effect of the spread of the micro-cracks can be further enhanced.
  • the display device of the present embodiment may further comprise an organic layer 160 that covers the first recess 122 C and the second recess 122 D of the plurality of recesses.
  • the organic layer 160 can be formed by the same fabricating process of the organic layer of the capping layer 150 or other layers as shown in FIG. 6 , but the organic layer 160 can be a layer different from the layers shown in FIG. 6 , which is not limited thereto.
  • the organic layer 160 can be the same layer of the pixel defining layer 138 of the display structure layer 130 .
  • the organic layer 160 can mitigate the stress concentration occurred at the plurality of recesses, and the spread of the micro-cracks may be mitigated.
  • the thickness T 20 of the organic layer 160 is larger than both the first depth D 12 of the first recess 122 C and the second depth D 14 of the second recess 122 D.
  • the thickness T 20 of the organic layer 160 may be 1.5 times larger than both the first depth D 12 of the first recess 122 C and the second depth D 14 of second recess 122 D.
  • FIGS. 13A to 13E are schematic partially enlarged top views of the corners of the display device according to five embodiments of the disclosure.
  • the corners shown in FIGS. 13A to 13E can show the area C in FIG. 2 .
  • FIGS. 13A to 13E are shown in microscopic viewpoint, and FIGS. 2-5 are shown in macroscopic viewpoint.
  • a plurality of recesses similar as that of FIGS. 13A to 13E may be distributed in the areas filled with dots shown in FIGS. 2-5 .
  • the plurality of recesses 722 comprises at least one first recess 722 A and at least one second recess 722 B.
  • a plurality of first recesses 722 A and a plurality of second recesses 722 B can be disposed in the insulating structure 180 in the present embodiment, which is not limited thereto.
  • the first recesses 722 A are extending along a first direction D 1
  • the second recesses 722 B are extending along a second direction D 2
  • the first direction D 1 is different from the second direction D 2 .
  • the first direction D 1 may be perpendicular to the second direction D 2 , which is not limited thereto.
  • the first recesses 722 A and the second recesses 722 B can be disposed on the bending area.
  • the first recesses 722 A and the second recesses 722 B extending along different directions can stop the spread of the micro-cracks occur in different direction. Meanwhile, the first recesses 722 A and the second recesses 722 B may have arc-shaped edged 722 A 1 and 722 B 1 for reducing the cusp angles to mitigate the occurrence of the micro-cracks at the cusp angles, which is not limited thereto.
  • the recesses in the insulating structure can be of various depths, and can be of various widths.
  • a minimum width of the first recess 722 A is a first width W 1
  • a minimum width of the second recess 722 B is a second width W 2
  • the first width W 1 can be different from the second width W 2
  • the first recess 722 A has a first depth D 21
  • the second recess 722 B 1 has a second depth D 22
  • the first depth D 21 can be different from the second depth D 22 .
  • the plurality of recesses comprises recesses 722 C extend along four different directions.
  • the plurality of recesses comprises recesses 722 D having continuous crisscross-shapes.
  • the plurality of recesses comprises recesses 722 E having continuous crisscross-shapes and straight shapes.
  • the plurality of recesses comprises recesses 722 F having curve shapes and straight shapes.
  • FIGS. 15A to 15H are schematic partially enlarged top views of the straight edge of the display device according to eight embodiments of the disclosure.
  • the plurality of recesses comprises a chain of recesses 822 A having S-shapes.
  • the plurality of recesses comprises a plurality of recesses 822 B having wider straight shapes.
  • the plurality of recesses comprises a plurality of recesses 822 C having thinner straight shapes.
  • the plurality of recesses comprises a plurality of recesses 822 D having circle shapes. Referring to FIG.
  • the plurality of recesses comprises a plurality of recesses 822 E having continuous crisscross-shapes.
  • the plurality of recesses comprises a plurality of recesses 822 F having spiral-shapes.
  • the plurality of recesses comprises a plurality of recesses 822 G having continuous S-shapes with wider pitch.
  • the plurality of recesses comprises a plurality of recesses 822 H having continuous S-shapes with narrow pitch.
  • the micro-cracks would not spread to the display area of the display device owing to the plurality of recesses of the driving structure layer.
  • the mitigating effect for the spread of the micro-cracks is more significant for the foldable display device.
  • the display device of the disclosure has batter reliability or the display quality can be kept well.

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US15/480,383 US20180188861A1 (en) 2017-01-03 2017-04-06 Display device
CN202210323582.1A CN114695496A (zh) 2017-01-03 2017-12-28 显示装置
CN201711454199.5A CN108269832A (zh) 2017-01-03 2017-12-28 显示装置
US16/697,086 US11281318B2 (en) 2017-01-03 2019-11-26 Display device with recesses
US17/670,507 US11747930B2 (en) 2017-01-03 2022-02-14 Display device with recesses
US18/353,892 US20230359296A1 (en) 2017-01-03 2023-07-18 Electronic device with recesses

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US16/390,425 Active US10691244B2 (en) 2017-01-03 2019-04-22 Display device
US16/697,086 Active US11281318B2 (en) 2017-01-03 2019-11-26 Display device with recesses
US16/876,298 Abandoned US20200278767A1 (en) 2017-01-03 2020-05-18 Display device and touch display device
US17/670,507 Active US11747930B2 (en) 2017-01-03 2022-02-14 Display device with recesses
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US16/697,086 Active US11281318B2 (en) 2017-01-03 2019-11-26 Display device with recesses
US16/876,298 Abandoned US20200278767A1 (en) 2017-01-03 2020-05-18 Display device and touch display device
US17/670,507 Active US11747930B2 (en) 2017-01-03 2022-02-14 Display device with recesses
US18/353,892 Pending US20230359296A1 (en) 2017-01-03 2023-07-18 Electronic device with recesses

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CN114695496A (zh) 2022-07-01
US20200097114A1 (en) 2020-03-26
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US10691244B2 (en) 2020-06-23
US20230359296A1 (en) 2023-11-09
US20190250747A1 (en) 2019-08-15
CN108268164B (zh) 2021-06-11
US11281318B2 (en) 2022-03-22
US20200278767A1 (en) 2020-09-03
US20220171485A1 (en) 2022-06-02
US10310652B2 (en) 2019-06-04
US20180188862A1 (en) 2018-07-05
US11747930B2 (en) 2023-09-05

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