US20170275309A1 - Novel organic titanium compound, method for producing same, and room temperature-curable resin composition - Google Patents

Novel organic titanium compound, method for producing same, and room temperature-curable resin composition Download PDF

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US20170275309A1
US20170275309A1 US15/508,739 US201515508739A US2017275309A1 US 20170275309 A1 US20170275309 A1 US 20170275309A1 US 201515508739 A US201515508739 A US 201515508739A US 2017275309 A1 US2017275309 A1 US 2017275309A1
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room temperature
curable resin
parts
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Taiki Katayama
Takafumi Sakamoto
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Shin Etsu Chemical Co Ltd
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    • C—CHEMISTRY; METALLURGY
    • C07—ORGANIC CHEMISTRY
    • C07F—ACYCLIC, CARBOCYCLIC OR HETEROCYCLIC COMPOUNDS CONTAINING ELEMENTS OTHER THAN CARBON, HYDROGEN, HALOGEN, OXYGEN, NITROGEN, SULFUR, SELENIUM OR TELLURIUM
    • C07F7/00—Compounds containing elements of Groups 4 or 14 of the Periodic Table
    • C07F7/28—Titanium compounds
    • C—CHEMISTRY; METALLURGY
    • C07—ORGANIC CHEMISTRY
    • C07F—ACYCLIC, CARBOCYCLIC OR HETEROCYCLIC COMPOUNDS CONTAINING ELEMENTS OTHER THAN CARBON, HYDROGEN, HALOGEN, OXYGEN, NITROGEN, SULFUR, SELENIUM OR TELLURIUM
    • C07F7/00—Compounds containing elements of Groups 4 or 14 of the Periodic Table
    • C07F7/02—Silicon compounds
    • C07F7/08—Compounds having one or more C—Si linkages
    • C—CHEMISTRY; METALLURGY
    • C07—ORGANIC CHEMISTRY
    • C07F—ACYCLIC, CARBOCYCLIC OR HETEROCYCLIC COMPOUNDS CONTAINING ELEMENTS OTHER THAN CARBON, HYDROGEN, HALOGEN, OXYGEN, NITROGEN, SULFUR, SELENIUM OR TELLURIUM
    • C07F7/00—Compounds containing elements of Groups 4 or 14 of the Periodic Table
    • C07F7/02—Silicon compounds
    • C07F7/08—Compounds having one or more C—Si linkages
    • C07F7/0803—Compounds with Si-C or Si-Si linkages
    • C—CHEMISTRY; METALLURGY
    • C07—ORGANIC CHEMISTRY
    • C07F—ACYCLIC, CARBOCYCLIC OR HETEROCYCLIC COMPOUNDS CONTAINING ELEMENTS OTHER THAN CARBON, HYDROGEN, HALOGEN, OXYGEN, NITROGEN, SULFUR, SELENIUM OR TELLURIUM
    • C07F7/00—Compounds containing elements of Groups 4 or 14 of the Periodic Table
    • C07F7/02—Silicon compounds
    • C07F7/08—Compounds having one or more C—Si linkages
    • C07F7/18—Compounds having one or more C—Si linkages as well as one or more C—O—Si linkages
    • C07F7/1804—Compounds having Si-O-C linkages
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/54—Silicon-containing compounds
    • C08K5/541—Silicon-containing compounds containing oxygen
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L83/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers
    • C08L83/04—Polysiloxanes
    • C—CHEMISTRY; METALLURGY
    • C07—ORGANIC CHEMISTRY
    • C07F—ACYCLIC, CARBOCYCLIC OR HETEROCYCLIC COMPOUNDS CONTAINING ELEMENTS OTHER THAN CARBON, HYDROGEN, HALOGEN, OXYGEN, NITROGEN, SULFUR, SELENIUM OR TELLURIUM
    • C07F7/00—Compounds containing elements of Groups 4 or 14 of the Periodic Table
    • C07F7/02—Silicon compounds
    • C07F7/08—Compounds having one or more C—Si linkages
    • C07F7/18—Compounds having one or more C—Si linkages as well as one or more C—O—Si linkages
    • C07F7/1804—Compounds having Si-O-C linkages
    • C07F7/1872—Preparation; Treatments not provided for in C07F7/20
    • C07F7/1876—Preparation; Treatments not provided for in C07F7/20 by reactions involving the formation of Si-C linkages
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/04—Polysiloxanes
    • C08G77/14—Polysiloxanes containing silicon bound to oxygen-containing groups
    • C08G77/18—Polysiloxanes containing silicon bound to oxygen-containing groups to alkoxy or aryloxy groups

Definitions

  • the present invention relates to a novel organic titanium compound useful as a curing catalyst for a room temperature-curable resin composition; a production method of such organic titanium compound; and a room temperature-curable resin composition containing such organic titanium compound both as a curing catalyst and as an adhesion promoter.
  • the present invention relates to a room temperature-curable resin composition containing an organopolysiloxane.
  • a room temperature-curable resin composition such as a room temperature-curable organopolysiloxane composition, as a composition capable of being cross-linked and cured by reaction with the moisture in the atmosphere.
  • a room temperature-curable resin composition is widely used in, for example, the architecture industry, the transportation aircraft industry and the electric and electronic parts industry, due to the fact that it is safe and superior in durability and adhesion as a rubber. Emphasis is often put on adhesion in particular, because adhesion is what significantly impacts the reliability of a member to which the composition was applied.
  • a catalyst for use in a room temperature-curable silicone rubber composition there have been disclosed various kinds of curing catalysts.
  • a curing catalyst for use in a moisture-curable room temperature-curable resin composition having a hydrolyzable silicon group(s) in its molecule there are used dibutyl tin compounds such as dibutyl tin dilaurate and dibutyl tin diacetate; or organic titanium catalysts such as tetra (n-butoxy) titanium and titanium diisopropoxybis (ethylacetoacetate).
  • dibutyl tin compounds such as dibutyl tin dilaurate and dibutyl tin diacetate
  • organic titanium catalysts such as tetra (n-butoxy) titanium and titanium diisopropoxybis (ethylacetoacetate).
  • these organic metal compounds used as catalysts for a room temperature-curable resin composition are basically irrelevant to an adhesion after curing. As a matter of fact, these organic metal compounds are therefore simply used as curing catalysts, and it is essential that an adhesion promoter such as a silane coupling agent be separately added to the room temperature-curable resin composition to improve the adhesion after curing (see Patent documents 1 to 4).
  • Patent Literature 1 JP-A-Hei 10-168320
  • Patent Literature 2 JP-A-2002-097367
  • Patent Literature 3 JP-A-2010-065182
  • Patent Literature 4 JP-A-2012-025876
  • the present invention was made to solve the aforementioned problems. It is an object of the present invention to provide a novel organic titanium compound having an effect as an adhesion promoter by itself, and capable of quickly curing a room temperature-curable resin composition; a production method of such organic titanium compound; and a room temperature-curable resin composition containing such organic titanium compound both as a curing catalyst and as an adhesion promoter. Even when there is used an other adhesion promoter, the amount of such adhesion promoter used can be reduced such that an economically advantageous room temperature-curable resin composition can be provided.
  • the inventors of the present invention diligently conducted studies to achieve the above objectives, and completed the invention as follows. That is, the inventors found that the following organic titanium compound and production method thereof were useful in solving the above problems.
  • the present invention is to provide the following organic titanium compound.
  • R 1 represents a substituted or unsubstituted monovalent hydrocarbon group having 1 to 12 carbon atoms
  • R represents a substituted or unsubstituted monovalent hydrocarbon group having 1 to 12 carbon atoms
  • A represents a divalent hydrocarbon group having 3 to 6 carbon atoms
  • Y represents a hydrolyzable group
  • a represents a number satisfying 0 ⁇ a ⁇ 4
  • organic titanium compound according to ⁇ 1> wherein the organic titanium compound is a reaction product of an organic silicon compound and an organooxy titanium, the organic silicon compound having a ⁇ -ketoester structure and being represented by the following general formula (1):
  • organooxy titanium (wherein R, A and Y are defined as above), and the organooxy titanium being represented by the following general formula (2):
  • organic titanium compound according to ⁇ 2> wherein the organic silicon compound represented by the general formula (1) is a reaction product of an unsaturated aliphatic group-containing ⁇ -ketoester and a hydrolyzable silane compound, the unsaturated aliphatic group-containing ⁇ -ketoester being represented by the following general formula (3):
  • hydrolyzable silane compound (wherein R is defined as above; and A 1 represents a divalent hydrocarbon group having 1 to 4 carbon atoms), and the hydrolyzable silane compound being represented by the following general formula (4):
  • organic titanium compound of the invention that has been defined above, as long as the average structure of an organic titanium compound aggregate belongs to the above scope, the aggregate shall be included in the present invention, even when the structures of the individual organic titanium compounds differ from one another.
  • the present invention is to provide the following production method ⁇ 5> of the organic titanium compound.
  • a production method of the organic titanium compound as set forth in ⁇ 1> comprising a step of reacting an organic silicon compound and an organooxy titanium, the organic silicon compound having a ⁇ -ketoester structure and being represented by the following general formula (1):
  • organooxy titanium (wherein R, A and Y are defined as above), and the organooxy titanium being represented by the following general formula (2):
  • the present invention is to provide, for example, the following room temperature-curable resin compositions ⁇ 6> to ⁇ 10>.
  • a room temperature-curable resin composition comprising:
  • the room temperature-curable resin composition according to ⁇ 6> comprising the organic titanium compound (A) as set forth in any one of ⁇ 1> to ⁇ 4> in an amount of 0.01 to 30 parts by mass per 100 parts by mass of the room temperature-curable resin (B).
  • a coating agent, adhesive agent or sealing agent comprising the room temperature-curable resin composition as set forth in any one of ⁇ 6> to ⁇ 9>.
  • the novel organic titanium compound of the present invention has an effect as an adhesion promoter, and is capable of quickly curing a room temperature-curable resin composition.
  • the organic titanium compound of the invention is useful as a curing catalyst for a room temperature-curable resin composition.
  • the room temperature-curable resin composition of the invention contains the particular organic titanium compound both as a curing catalyst and as an adhesion promoter, it can be cured in a short period of time without using an other adhesion promoter, and can also become a room temperature-curable resin composition having a sufficient adhesion strength, particularly, a room temperature-curable organopolysiloxane resin composition capable of forming a silicone rubber elastic body after curing. Furthermore, there can be obtained, after curing, a cured product with a sufficient hardness, shear elongation at break and tensile strength i.e. a cured product having physical properties of a rubber.
  • room temperature-curable resin composition of the invention is suitable for use in a coating agent, adhesive agent or sealing agent.
  • FIG. 1 is a 1 H NMR chart of an organic titanium compound obtained in a synthetic example 1.
  • FIG. 2 is a 1 H NMR chart of an organic titanium compound obtained in a synthetic example 2.
  • An organic titanium compound of the present invention is represented by an average composition formula (I): Ti(OR 1 ) 4-a (Y 3 Si-A-O—CO—CH ⁇ C(O)R) a .
  • examples of a substituted or unsubstituted monovalent hydrocarbon group represented by R and having 1 to 12 carbon atoms include an alkyl group such as a methyl group, an ethyl group, a propyl group, an isopropyl group, a butyl group, an isobutyl group, a tert-butyl group, a pentyl group, a hexyl group, a heptyl group, an octyl group, a 2-ethylhexyl group, a nonyl group, a decyl group and a dodecyl group; a cycloalkyl group such as a cyclopentyl group and a cyclohexyl group; an alkenyl group such as a vinyl group, an allyl group, a propenyl group, an isopropenyl group, a butenyl group, a
  • a divalent hydrocarbon group represented by A and having 3 to 6 carbon atoms be a saturated aliphatic divalent hydrocarbon group such as a linear or branched alkylene group represented by —C p H 2p —, more preferably a linear alkylene group represented by —(CH 2 ) p — (p is 3 to 6).
  • a linear alkylene group represented by —(CH 2 ) p — (p is 3 to 6).
  • —(CH 2 ) 3 — is particularly preferred.
  • Y represents a hydrolyzable group.
  • hydrolyzable group represented by Y include an alkoxy group such as a methoxy group, an ethoxy group and a propoxy group; an alkoxyalkoxy group such as a methoxyethoxy group, an ethoxyethoxy group, a methoxypropoxy group; an acyloxy group such as an acetoxy group, an octanoyloxy group and a benzoyloxy group; an alkenyloxy group such as a vinyloxy group, an allyloxy group, a propenyloxy group, an isopropenyloxy group and a 1-ethyl-2-methylvinyloxy group; a ketoxime group such as a dimethylketoxime group, a methylethylketoxime group and a diethylketoxime group; an amino group such as a dimethylamino group, a diethylamino
  • examples of a substituted or unsubstituted monovalent hydrocarbon group represented by R 1 and having 1 to 12 carbon atoms include an alkyl group such as a methyl group, an ethyl group, a propyl group, an isopropyl group, a butyl group, an isobutyl group, a tert-butyl group, a pentyl group, a hexyl group, a heptyl group, an octyl group, a 2-ethylhexyl group, a nonyl group, a decyl group and a dodecyl group; a cycloalkyl group such as a cyclopentyl group and a cyclohexyl group; an alkenyl group such as a vinyl group, an allyl group, a propenyl group, an isopropenyl group, a butenyl group, a pen
  • an average coordination number a of a hydrolyzable silyl group-containing ⁇ -ketoester structure to titanium is 0.5 to 2.5, preferably 1.5 to 2.4, more preferably 1.7 to 2.3, and particularly preferably about 2.
  • the organic titanium compound of the present invention can, for example, be produced by the following method.
  • the target organic titanium compound can be produced by reacting an organic silicon compound and an organooxy titanium (e.g. tetraorganooxy titanium such as tetraalkoxy titanium), and then distilling away a hydroxy group-containing compound such as an alcohol represented by R 1 —OH and obtained as a by-product from the reaction solution.
  • an organooxy titanium e.g. tetraorganooxy titanium such as tetraalkoxy titanium
  • the organic silicon compound used here is represented by the following general formula (1), and has a ⁇ -ketoester structure and a hydrolyzable silyl group.
  • the organooxy titanium used here is represented by the following general formula (2)
  • R 1 is defined as above.
  • a ratio of the organic silicon compound represented by the general formula (1) and the organooxy titanium represented by the general formula (2) depends on the coordination number of the ⁇ -ketoester structure to titanium in the target organic titanium compound.
  • the organic silicon compound (1) is normally in an amount of 1 to 4 mol, preferably 1 to 3 mol, particularly 1.5 to 2.5 mol, per 1 mol of the organooxy titanium (2).
  • the reaction may be performed at room temperature, and is preferably performed while performing stirring.
  • the reaction time is normally 15 to 30 hours, particularly about 24 hours.
  • organic silicon compound represented by the general formula (1) can be prepared by reference to, for example, a known method (JP-A-2005-314325) where an unsaturated aliphatic group-containing ⁇ -ketoester and a hydrolyzable silane compound are reacted.
  • the unsaturated aliphatic group-containing ⁇ -ketoester used here is represented by the following general formula (3).
  • R is defined as above;
  • a 1 is a divalent hydrocarbon group having 1 to 4 carbon atoms.
  • hydrolyzable silane compound used here is represented by the following general formula (4).
  • a 1 is a group obtained by eliminating an ethylene group (—(CH 2 ) 2 —) from A in the general formula (1).
  • the divalent hydrocarbon group represented by A 1 and having 1 to 4 carbon atoms be a saturated aliphatic divalent hydrocarbon group such as a linear or branched alkylene group represented by —C p H 2p —, more preferably a linear alkylene group represented by —(CH 2 ) p — (p is 1 to 4).
  • a linear alkylene group represented by —(CH 2 ) p — (p is 1 to 4).
  • —(CH 2 )— is particularly preferred.
  • organic titanium compound examples include a titanium diisopropoxybis (trimethoxysilylpropyl acetoacetate) and a titanium diisopropoxybis (triethoxysilylpropyl acetoacetate) that are represented by the following structural formulae.
  • a room temperature-curable/vulcanizable resin composition of the present invention is a room temperature-curable resin composition containing the above organic titanium compound (A) and a room temperature-curable resin (B). It is preferred that the room temperature-curable resin composition of the invention be a composition containing the organic titanium compound (A) by an amount of 0.01 to 30 parts by mass per 100 parts by mass of the room temperature-curable resin (B), or a composition where the room temperature-curable resin (B) contains a curable organopolysiloxane (so-called room temperature-curable organopolysiloxane composition). It is particularly preferred that, per 100 parts by mass of the curable organopolysiloxane (B), the room temperature-curable resin composition of the invention (room temperature-curable organopolysiloxane composition) contain
  • the room temperature-curable resin composition of the invention be a room temperature-curable silicone rubber composition capable of being cured at room temperature and thus forming a rubber-like elastic body (elastomer).
  • the organic titanium compound as the component (A) is represented by the above average composition formula (I): Ti(OR 1 ) 4-a (Y 3 Si-A-O—CO—CH ⁇ C(O)R) a .
  • the above organic titanium compound contained in the room temperature-curable resin composition of the present invention is capable of quickly curing the room temperature-curable resin composition, thus serving as a curing catalyst for the room temperature-curable resin composition. Further, such organic titanium compound is capable of improving the adhesiveness of the room temperature-curable resin composition, thus also serving as an adhesion promoter for the room temperature-curable resin composition. That is, a room temperature-curable resin composition with a sufficient adhesion strength can be obtained without using a silane coupling agent as an adhesion promoter, provided that the room temperature-curable resin composition is the room temperature-curable resin composition of the present invention that contains the organic titanium compound both as a curing catalyst and as an adhesion promoter.
  • this composition can be cured in a short period of time, and form, after curing, a cured product with a sufficient hardness, shear elongation at break and tensile strength i.e. a cured product having physical properties of a rubber.
  • the adhesion strength can be further improved by using the organic titanium compound of the invention as an adhesion promoter together with a silane coupling agent. Even in such case, the amount of a silane coupling agent used can be reduced in a way such that there can be provided a composition that is economically more advantageous than the conventional ones.
  • the organic titanium compound in the room temperature-curable resin composition of the present invention be added in an amount of 0.01 to 30 parts by mass, more preferably 0.05 to 15 parts by mass, particularly preferably 0.1 to 5 parts by mass, per 100 parts by mass of a room temperature-curable resin such as a later-described curable organopolysiloxane as the component (B).
  • base compound resin base polymer
  • such base compound resin is a room temperature-curable organic resin.
  • the curable organopolysiloxane as a preferable example of the component (B) serves as a base compound (base polymer) of the room temperature-curable resin composition.
  • the curable organopolysiloxane has in its molecule at least two silicon atom-bonded hydroxyl groups (silanol groups) or hydrolyzable groups as curable functional groups. Preferably, these groups are located at both ends of the molecular chain of such curable organopolysiloxane.
  • organopolysiloxane examples include a linear diorganopolysiloxane represented by the following general formula (5) where the ends of its molecular chain are blocked by hydroxyl groups (diorganohydroxysilyl groups); or a linear diorganopolysiloxane represented by the following general formula (6) where the ends of its molecular chain are blocked by hydrolyzable groups (hydrolyzable group-containing triorganosilyl groups).
  • R is defined as above; X represents an oxygen atom or a divalent or trivalent hydrocarbon group having 1 to 8 carbon atoms; Y′ represents a hydrolyzable group; b represents 0 or 1; and m represents a number by which a viscosity of such diorganopolysiloxane will become 100 to 1,000,000 mPa ⁇ s at 25° C.
  • X represents an oxygen atom or a divalent or trivalent hydrocarbon group having 1 to 8 carbon atoms, and it is preferred that X be that represented by —(CH 2 CH 2 ) q — or —(CH ⁇ CH) q — (q represents 1 to 4).
  • X an oxygen atom, —CH 2 CH 2 — or —CH ⁇ CH— is particularly preferred.
  • Y′ represents a hydrolyzable group
  • examples of such hydrolyzable group include an alkoxy group such as a methoxy group, an ethoxy group and a propoxy group; an alkoxyalkoxy group such as a methoxyethoxy group, an ethoxyethoxy group and a methoxypropoxy group; an acyloxy group such as an acetoxy group, an octanoyloxy group and a benzoyloxy group; an alkenyloxy group such as a vinyloxy group, an allyloxy group, a propenyloxy group, an isopropenyloxy group and a 1-ethyl-2-methylvinyloxy group; a ketoxime group such as a dimethylketoxime group, a methylethylketoxime group and a diethylketoxime group; an amino group such as a dimethylamino group, a diethylamino group,
  • the viscosity of the curable organopolysiloxane as the component (B) at 25° C. be 100 to 1,000,000 mPa ⁇ s, more preferably 300 to 500,000 mPa ⁇ s, particularly preferably 500 to 100,000 mPa ⁇ s, and especially preferably 1,000 to 80,000 mPa ⁇ s.
  • the viscosity of the organopolysiloxane is not lower than 100 mPa ⁇ s, there can be obtained a coating film superior in physical and mechanical strengths.
  • the viscosity is a numerical value obtained through a rotary viscometer (Brookfield viscometer).
  • diorganopolysiloxanes are specific examples of the curable organopolysiloxane as the component (B).
  • organopolysiloxane (B) there may be used only one kind of such organopolysiloxane; or two or more kinds of such organopolysiloxanes with different structures and molecular weights, in combination.
  • the composition can be cured in a short period of time, and exhibit a sufficient adhesion strength after curing.
  • the component (C) is a curing catalyst other than the component (A), and is used as an optional component if necessary for further shortening the curing time of the room temperature-curable resin composition.
  • catalyst include an alkyl tin ester compound such as dibutyl tin diacetate, dibutyl tin dilaurate and dibutyl tin dioctoate; a titanic acid ester or titanium chelate compound such as tetraisopropoxytitanium, tetra n-butoxytitanium, tetrakis (2-ethylhexoxy) titanium, dipropoxybis (acetylacetonato) titanium and titanium isopropoxyoctylene glycol; an organic metal compound such as zinc naphthenate, zinc stearate, zinc-2-ethyloctoate, iron-2-ethylhexoate, cobalt-2-ethylhexoate, manganese-2-ethylhe
  • these curing catalysts are preferably added in an amount of 0 to 15 parts by mass, particularly preferably 0.01 to 5 parts by mass, per 100 parts by mass of the organopolysiloxane as the component (B).
  • hydrolyzable group-containing silane and/or the partial hydrolysis condensate thereof as the component (D) serve as a cross-linking agent, and are added as an optional component if necessary.
  • hydrolyzable group include a ketoxime group, an alkoxy group, an acetoxy group and an isopropenoxy group, among which an alkoxy group and an isopropenoxy group are preferred.
  • component (D) examples include alkoxysilanes such as methyltrimethoxysilane, dimethyldimethoxysilane, vinyltrimethoxysilane, phenyl trimethoxysilane, methyltriethoxysilane and ⁇ -(dimethoxymethylsilyl) propionic acid 2-ethylhexyl; isopropenoxy group-containing silanes such as methyltriisopropenoxysilane, ethyltriisopropenoxysilane, vinyltriisopropenoxysilane and phenyltriisopropenoxysilane; acetoxysilanes such as methyltriacetoxysilane, ethyltriacetoxysilane and vinyltriacetoxysilane; and partial hydrolysis condensates of these silanes. Any of these silanes and partial hydrolysis condensates may be used singularly, or two or more of them may be used in combination.
  • the component (D) is normally added in an amount of 0 to 3 parts by mass, preferably 0.1 to 20 parts by mass, more preferably 0.5 to 15 parts by mass, per 100 parts by mass of the component (B). It is preferable when the component (D) is added in an amount of not larger than 30 parts by mass, because the cured product will not become excessively hard, and because this amount is economical.
  • the filler as the component (E) is used as an optional component if necessary, for the purpose of imparting a sufficient mechanical strength to the cured product formed of the composition of the invention.
  • a known filler may be used as such filler, and examples of such known filler include a finely powdered silica; a fumed silica; a silica aerogel; a precipitated silica; a diatom earth; a metal oxide such as an iron oxide, a zinc oxide and a titanium oxide, each of which may be surface treated with silane; a metal carboxylate such as calcium carbonate, magnesium carbonate and zinc carbonate; an inorganic filler such as asbestos, a glass wool, carbon black, finely powdered mica and a molten silica powder; or a synthetic resin powder such as polystyrene, polyvinyl chloride and polypropylene.
  • the component (E) is preferably added in an amount of 0 to 1,000 parts by mass, particularly preferably 5 to 200 parts by mass, per 100 parts by mass of the component (B).
  • the component (E) By adding the component (E), the cured product obtained from the room temperature-curable resin composition will exhibit a sufficient mechanical strength. Further, it is preferable when the component (E) is added in an amount of not larger than 1,000 parts by mass, because the workability will not be impaired due to an increased viscosity of the composition, or a rubber elasticity will also not be impaired due to a decreased rubber strength after curing.
  • the component (F) is the adhesion promoter other than the component (A), and is added as an optional component if necessary. Particularly, it is preferred that there be added amino functional group-containing alkoxysilanes such as ⁇ -aminopropyltriethoxysilane and 3-2-(aminoethylamino) propyltrimethoxysilane; epoxy functional group-containing alkoxysilanes such as ⁇ -glycidoxypropyltrimethoxysilane and ⁇ -(3,4-epoxycyclohexyl) ethyltrimethoxysilane; or a silane coupling agent such as isocyanate functional group-containing alkoxysilane (carbon functional hydrolyzable silanes). It is preferred that these adhesion promoters be added in an amount of 0 to 30 parts by mass, particularly preferably 0.2 to 10 parts by mass, per 100 parts by mass of the organopolysiloxane as the component (B).
  • the room temperature-curable resin composition of the invention contains the organic titanium compound (A) both as a curing catalyst and as an adhesion promoter. For this reason, when using the adhesion promoter as the component (F), such as the silane coupling agent, the amount thereof can be reduced, thus achieving an economically advantageous room temperature-curable resin composition.
  • additives may also be added to the room temperature-curable resin composition of the invention.
  • additives include a pigment, a dye, an anti-degradation agent, an antioxidant, an antistatic agent, and a flame retardant such as antimony oxide and chlorinated paraffin.
  • polyether as a thixotropy improving agent, an antifungal agent, an antibacterial agent or an adhesion aid.
  • the room temperature-curable resin composition of the invention is inherently different from a so-called primer composition in a sense that the composition of the invention essentially contains the room temperature-curable resin component (base polymer) as the component (B), such as the organopolysiloxane having the room temperature-curable functional groups, whereas a primer composition has no curability by itself, but is directly applied to the surface of an adherend to improve an adhesion between various organic rubbers and the adherend.
  • the room temperature-curable resin composition of the present invention contains the organic titanium compound as a curing catalyst, it can be cured in a short period of time, and become a room temperature-curable resin composition having a sufficient adhesion strength. Further, the composition of the invention when cured will become a cured product with a sufficient hardness, shear elongation at break and tensile strength i.e. a cured product having physical properties of a rubber. Furthermore, such room temperature-curable resin composition of the invention is suitable as a fast curing resin, and is thus suitable for use in a coating agent, an adhesive agent or a sealing agent.
  • a viscosity refers to a value measured by a rotary viscometer (Brookfield viscometer) at 25° C.
  • part(s) refer to parts by mass.
  • Titanium tetraisopropoxide of 14.2 g (0.05 mol) was put into a 50 ml eggplant-shaped flask, followed by delivering thereinto by drops trimethoxysilylpropyl acetoacetate of 26.4 g (about 0.10 mol with infinitesimal amount of impurities such as isomers contained, the same applies hereafter) while performing stirring, such trimethoxysilylpropyl acetoacetate being a reaction product of allyl acetoacetate and trimethoxysilane.
  • isopropanol as a by-product was distilled away so as to obtain 34.2 g (yield 99%) of a product that was in the form of a thick yellow liquid, and had the structure of a titanium diisopropoxybis (trimethoxysilylpropyl acetoacetate) as its typical average structure.
  • the typical average structure of the product obtained above was considered as that of a titanium diisopropoxybis (trimethoxysilylpropyl acetoacetate) represented by the following formula (7).
  • Titanium tetraisopropoxide of 14.2 g (0.05 mol) was put into a 50 ml eggplant-shaped flask, followed delivering thereinto by drops triethoxysilylpropyl acetoacetate of 30.6 g (about 0.10 mol) while performing stirring, such triethoxysilylpropyl acetoacetate being a reaction product of allyl acetoacetate and triethoxysilane.
  • isopropanol as a by-product was distilled away so as to obtain 38.4 g (yield 99%) of a product that was in the form of a thick yellow liquid, and had the structure of a titanium diisopropoxybis (triethoxysilylpropyl acetoacetate) as its typical average structure.
  • the typical average structure of the product obtained above was considered as that of a titanium diisopropoxybis (triethoxysilylpropyl acetoacetate) represented by the following formula (8).
  • A-1 Titanium diisopropoxybis (trimethoxysilylpropyl acetoacetate) (product of synthetic example 1)
  • A-2 Titanium diisopropoxybis (triethoxysilylpropyl acetoacetate) (product of synthetic example 2)
  • Titanium diisopropoxybis ethylacetoacetate (product name: TC-750 by Matsumoto Fine Chemical Co., Ltd.)
  • A-4 (for use in comparative examples): Tetraoctyl titanate (product name: TA-30 by Matsumoto Fine Chemical Co., Ltd.)
  • B-1 Dimethylpolysiloxane with both ends of its molecular chain blocked by methyldimethoxysilyl groups, and having a viscosity of 20,000 mPa ⁇ s
  • B-2 Dimethylpolysiloxane with both ends of its molecular chain blocked by hydroxyl groups (silanol groups), and having a viscosity of 20,000 mPa ⁇ s
  • E-1 Surface-treated hydrophobic silica (product name: MU-215 by Shin-Etsu Chemical Co., Ltd.)
  • the surface-treated hydrophobic fumed silica (E-1) of 13 parts (product name MU-215 by Shin-Etsu Chemical Co., Ltd.; product surface-hydrophobized by dimethyldichlorosilane; BET specific surface area 120 m 2 /g; water amount 0.5% by mass), was added to 100 parts of the dimethylpolysiloxane (B-1) with both ends of its molecular chain blocked by methyldimethoxysilyl groups and having the viscosity of 20,000 mPa ⁇ s, followed by mixing these components at room temperature and under ordinary pressure for 30 min, and then mixing the same again at room temperature and under a reduced pressure for another 15 min to obtain a mixed product.
  • E-1 surface-treated hydrophobic fumed silica
  • the surface-treated hydrophobic silica (E-1) of 13 parts was added to 100 parts of the dimethylpolysiloxane (B-1) with both ends of its molecular chain blocked by methyldimethoxysilyl groups and having the viscosity of 20,000 mPa ⁇ s, followed by mixing these components at room temperature and under ordinary pressure for 30 min, and then mixing the same again at room temperature and under a reduced pressure for another 15 min to obtain a mixed product.
  • the surface-treated hydrophobic silica (E-1) of 13 parts was added to 100 parts of the dimethylpolysiloxane (B-1) with both ends of its molecular chain blocked by methyldimethoxysilyl groups and having the viscosity of 20,000 mPa ⁇ s, followed by mixing these components at room temperature and under ordinary pressure for 30 min, and then mixing the same again at room temperature and under a reduced pressure for another 15 min to obtain a mixed product.
  • the surface-treated hydrophobic silica (E-1) of 13 parts was added to 100 parts of the dimethylpolysiloxane (B-1) with both ends of its molecular chain blocked by methyldimethoxysilyl groups and having the viscosity of 20,000 mPa ⁇ s, followed by mixing these components at room temperature and under ordinary pressure for 30 min, and then mixing the same again at room temperature and under a reduced pressure for another 15 min to obtain a mixed product.
  • the surface-treated hydrophobic silica (E-1) of 13 parts by mass was added to 100 parts by mass of the dimethylpolysiloxane (B-2) with both ends of its molecular chain blocked by hydroxyl groups (silanol groups) and having the viscosity of 20,000 mPa ⁇ s, followed by mixing these components at room temperature and under ordinary pressure for 30 min, and then mixing the same again at room temperature and under a reduced pressure for another 15 min to obtain a mixed product.
  • the surface-treated hydrophobic silica (E-1) of 13 parts by mass was added to 100 parts by mass of the dimethylpolysiloxane (B-2) with both ends of its molecular chain blocked by hydroxyl groups and having the viscosity of 20,000 mPa ⁇ s, followed by mixing these components under ordinary pressure for 30 min, and then mixing the same again under a reduced pressure for another 15 min to obtain a mixed product.
  • the surface-treated hydrophobic silica (E-1) of 13 parts by mass was added to 100 parts by mass of the dimethylpolysiloxane (B-2) with both ends of its molecular chain blocked by hydroxyl groups and having the viscosity of 20,000 mPa ⁇ s, followed by mixing these components under ordinary pressure for 30 min, and then mixing the same again under a reduced pressure for another 15 min to obtain a mixed product.
  • the surface-treated hydrophobic silica (E-1) of 13 parts by mass was added to 100 parts by mass of the dimethylpolysiloxane (B-2) with both ends of its molecular chain blocked by hydroxyl groups and having the viscosity of 20,000 mPa ⁇ s, followed by mixing these components under ordinary pressure for 30 min, and then mixing the same again under a reduced pressure for another 15 min to obtain a mixed product.
  • the surface-treated hydrophobic silica (E-1) of 13 parts by mass was added to 100 parts by mass of the dimethylpolysiloxane (B-2) with both ends of its molecular chain blocked by hydroxyl groups and having the viscosity of 20,000 mPa ⁇ s, followed by mixing these components under ordinary pressure for 30 min, and then mixing the same again under a reduced pressure for another 15 min to obtain a mixed product.
  • Each room temperature-curable resin composition immediately after being prepared in working examples 1 to 5 and comparative examples 1 to 4 was pushed out as a sheet-shaped object having a thickness of 2 mm. Such sheet was then exposed to an air of 23° C. and 50% RH, and was left under the same atmosphere for 7 days to obtain a cured product.
  • the physical properties (hardness, shear elongation at break and tensile strength) of the cured product thus obtained were then measured in accordance with JIS K-6249. Particularly, the hardness of the cured product was measured by a durometer A-type hardness meter as set forth in JIS K-6249 (initial physical property). The results thereof are shown in Table 1 and Table 2.
  • each room temperature-curable resin composition immediately after being prepared in working examples 3 to 5; and comparative examples 3 and 4 was put into a sealed container.
  • the composition in the sealed container was then left at 70° C. for 7 days, and a sheet of the thickness of 2 mm was later formed from such composition that had been left at 70° C. for 7 days.
  • a similar measurement was also performed on such sheet (storage test). The results thereof are shown in Table 2.
  • Each room temperature-curable resin composition immediately after being prepared in working examples 1 to 5 and comparative examples 1 to 4; and an adherend (aluminum, copper, SUS, PC, ABS, PBT, glass) having a width of 25 mm and a length of 100 mm were used to prepare a shear adhesion test specimen having an adhesive area of 2.5 mm 2 and an adhesive thickness of 1 mm by performing curing at 23° C. and 50% RH for 7 days.
  • a shear adhesion force was then measured in accordance with JIS K-6249. The results thereof are shown in Table 1 and Table 2.
  • the resin compositions of working examples 3 to 5 that contained the organic titanium compound of the invention as a curing catalyst had exhibited equivalent levels of curabilities and rubber physical properties; and high adhesion strengths and cohesion failure rates, as compared to the resin compositions of comparative examples 3 and 4 that used the existing organic titanium catalysts. Furthermore, the rubber physical properties of the resin compositions of working examples 3 to 5 were also not significantly impaired even after the storage test.
  • the room temperature-curable resin composition of the invention contains the particular organic titanium compound as a curing catalyst, it can be cured in a short period of time; become a room temperature-curable resin composition having a sufficient adhesion strength; and exhibit, after curing, a sufficient hardness, shear elongation at break and tensile strength i.e. rubber physical properties.
  • the present invention is not limited to the above embodiment.
  • the above embodiment is merely an example; and any embodiment shall be included in the technical scope of the present invention, provided that the embodiment has a structure substantially identical to the technical ideas described in the scope of the patent claims of the invention, and that the embodiment also brings about similar functions and effects as such technical ideas.

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