US20160116132A1 - Heat dissipating plate device for light emitting diode, head lamp for automobile and method for preparing the same - Google Patents

Heat dissipating plate device for light emitting diode, head lamp for automobile and method for preparing the same Download PDF

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Publication number
US20160116132A1
US20160116132A1 US14/520,917 US201414520917A US2016116132A1 US 20160116132 A1 US20160116132 A1 US 20160116132A1 US 201414520917 A US201414520917 A US 201414520917A US 2016116132 A1 US2016116132 A1 US 2016116132A1
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United States
Prior art keywords
heat dissipating
dissipating plate
thin film
carbon nanotube
metal thin
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Abandoned
Application number
US14/520,917
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English (en)
Inventor
Byoung Kyu CHO
Yool Koo Kim
Bong Jun CHANG
Kwang Jin Kim
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NEVADA, University of
Hyundai Motor Co
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NEVADA, University of
Hyundai Motor Co
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Application filed by NEVADA, University of, Hyundai Motor Co filed Critical NEVADA, University of
Priority to US14/520,917 priority Critical patent/US20160116132A1/en
Assigned to THE UNIVERSITY OF NEVADA, HYUNDAI MOTOR COMPANY reassignment THE UNIVERSITY OF NEVADA ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: CHO, BYUNG KYU, KIM, YOOL KOO, CHANG, BONG JUN, KIM, KWANG JIN
Priority to DE102015204934.5A priority patent/DE102015204934A1/de
Priority to CN201510140039.8A priority patent/CN106152002B/zh
Assigned to HYUNDAI MOTOR COMPANY, THE BOARD OF REGENTS OF THE NEVADA SYSTEM OF HIGHER EDUCATION ON BEHALF OF THE UNIVERSITY OF NEVADA, LAS VEGAS reassignment HYUNDAI MOTOR COMPANY CORRECTIVE ASSIGNMENT TO CORRECT THE TO CORRECT THE NAME OF THE SECOND ASSIGNEE PREVIOUSLY RECORDED ON REEL 034698 FRAME 0251. ASSIGNOR(S) HEREBY CONFIRMS THE ASSIGNMENT. Assignors: CHO, BYUNG KYU, KIM, YOOL KOO, Zhang, Bong Jun, KIM, KWANG JIN
Priority to KR1020150109697A priority patent/KR101786658B1/ko
Publication of US20160116132A1 publication Critical patent/US20160116132A1/en
Priority to US15/809,662 priority patent/US20180090653A1/en
Abandoned legal-status Critical Current

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    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21S—NON-PORTABLE LIGHTING DEVICES; SYSTEMS THEREOF; VEHICLE LIGHTING DEVICES SPECIALLY ADAPTED FOR VEHICLE EXTERIORS
    • F21S41/00—Illuminating devices specially adapted for vehicle exteriors, e.g. headlamps
    • F21S41/10—Illuminating devices specially adapted for vehicle exteriors, e.g. headlamps characterised by the light source
    • F21S41/14—Illuminating devices specially adapted for vehicle exteriors, e.g. headlamps characterised by the light source characterised by the type of light source
    • F21S41/141—Light emitting diodes [LED]
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K5/00—Heat-transfer, heat-exchange or heat-storage materials, e.g. refrigerants; Materials for the production of heat or cold by chemical reactions other than by combustion
    • C09K5/08—Materials not undergoing a change of physical state when used
    • C09K5/14—Solid materials, e.g. powdery or granular
    • F21S48/328—
    • C—CHEMISTRY; METALLURGY
    • C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
    • C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
    • C04B35/00—Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products
    • C04B35/515—Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products based on non-oxide ceramics
    • C04B35/52—Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products based on non-oxide ceramics based on carbon, e.g. graphite
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21S—NON-PORTABLE LIGHTING DEVICES; SYSTEMS THEREOF; VEHICLE LIGHTING DEVICES SPECIALLY ADAPTED FOR VEHICLE EXTERIORS
    • F21S45/00—Arrangements within vehicle lighting devices specially adapted for vehicle exteriors, for purposes other than emission or distribution of light
    • F21S45/40—Cooling of lighting devices
    • F21S45/42—Forced cooling
    • F21S45/43—Forced cooling using gas
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21S—NON-PORTABLE LIGHTING DEVICES; SYSTEMS THEREOF; VEHICLE LIGHTING DEVICES SPECIALLY ADAPTED FOR VEHICLE EXTERIORS
    • F21S45/00—Arrangements within vehicle lighting devices specially adapted for vehicle exteriors, for purposes other than emission or distribution of light
    • F21S45/40—Cooling of lighting devices
    • F21S45/47—Passive cooling, e.g. using fins, thermal conductive elements or openings
    • F21S48/325—
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/64—Heat extraction or cooling elements
    • H01L33/641—Heat extraction or cooling elements characterized by the materials
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2933/00—Details relating to devices covered by the group H01L33/00 but not provided for in its subgroups
    • H01L2933/0008—Processes
    • H01L2933/0033—Processes relating to semiconductor body packages
    • H01L2933/0075—Processes relating to semiconductor body packages relating to heat extraction or cooling elements

Definitions

  • the present disclosure relates to a heat dissipating plate for a light emitting diode (LED), a head lamp for an automobile including the same, and a method for preparing the same.
  • LED light emitting diode
  • an electronic member generating a lot of heat includes a high power amplifier (HPA) and a linear power amplifier (LPA) of a mobile communication repeater, a central processor unit (CPU) of a personal computer, a multiple processor unit (MPU) of a server-level work station, a power amplifier unit (PAU) of a relay base station, and so on.
  • HPA high power amplifier
  • LPA linear power amplifier
  • CPU central processor unit
  • MPU multiple processor unit
  • PAU power amplifier unit
  • Representative devices which discharge heat from an electronic equipment in order to prevent malfunction and the breakage, mainly use a fin heat sink for discharging heat generated from the heat source by a heat dissipating fin and a heat pipe for discharging heat generated from the heat source through a capillary structure to move heat outside.
  • the fin heat sink may increases the fin density or increase the length of the heat dissipating fin for maximizing the heat dissipating area, but the cooling efficiency is deteriorated when increasing the fin density, and the heat dissipating plate is enlarged when increasing the length or size of heat dissipating fin, so the manufacturing cost is also increased.
  • An aspect of the present disclosure provides a heat dissipating plate for a light emitting diode (LED) having a light-weight and an improved cooling performance.
  • LED light emitting diode
  • Another aspect of the present disclosure provides a head lamp for an automobile including a heat dissipating plate for an LED.
  • Another aspect of the present disclosure provides a method of preparing a heat dissipating plate in a low cost and a high efficiency.
  • a heat dissipating plate for an LED includes a metal thin film containing a hydroxyl functional group (—OH).
  • a coating layer is disposed on at least one surface of the metal thin film and includes a carbon nanotube containing a hydrophilic functional group.
  • Bonding energy of the hydrogen bond may be about 15 KJ/mol to 40 KJ/mol.
  • the hydrophilic functional group may be a carboxyl functional group (—COOH).
  • a thickness of the coating layer may be about 10 to 100 ⁇ m.
  • An average diameter of the carbon nanotube may be about 10 to 30 nm.
  • An average length of the carbon nanotube may be about 1 to 20 ⁇ m.
  • the metal thin film may be selected from aluminum, iron, copper, nickel silver, tin, zinc, tungsten, and a combination thereof.
  • the metal thin film may further include a plurality of protruded heat dissipating fins.
  • the heat dissipating fins may be selected from aluminum, iron, copper, nickel silver, tin, zinc, tungsten, and a combination thereof.
  • a head lamp for an automobile including the heat dissipating plate is provided.
  • the head lamp may further include a cooling fan.
  • a method of preparing a heat dissipating plate for an LED includes oxidizing a carbon nanotube in an acid aqueous solution.
  • the oxidized carbon nanotube is neutralized, and an ultra-sonication is treated to provide a carbon nanotube dispersion.
  • a metal thin film is immersed in the carbon nanotube dispersion and heated to coat the carbon nanotube on the metal thin film.
  • the dispersion may further include a dispersing agent selected from sodium dodecyl sulfate, lithium dodecyl sulfate, Triton-x, and a combination thereof.
  • a dispersing agent selected from sodium dodecyl sulfate, lithium dodecyl sulfate, Triton-x, and a combination thereof.
  • the heating may be performed at a heat capacity of about 150 to 400 W/cm 2 for about 30 minutes to 2 hours.
  • the coating layer is attached to the metal thin film by bonding the hydroxyl functional group with the hydrophilic functional group in a hydrogen bond.
  • the heat dissipating plate for an LED is light-weight and has excellent cooling characteristics due to a high thermal conductivity.
  • FIG. 1 is a schematic view showing a chemically non-treated carbon nanotube and a functionalized carbon nanotube.
  • FIGS. 2 and 3 are scanning electron microscopic (SEM) photographs of the functionalized carbon nanotube.
  • FIG. 4 is a graph showing the cooling performance results of heat dissipating plates obtained from Example 1, Comparative Example 1, and Comparative Example 2 in terms of a temperature change according to an applied power.
  • FIG. 5 is a graph showing cooling performance results of heat dissipating plates obtained from Example 2, Comparative Example 1, and Comparative Example 2 in terms of a temperature change according to an applied power.
  • FIG. 6 is a graph showing a temperature difference ( ⁇ T) change of between a base temperature (T base ) and a tip temperature (T tip ) of a heat dissipating fin for a heat dissipating plate obtained from Example 1 depending upon time.
  • ⁇ T temperature difference
  • a heat dissipating plate for an LED may include a metal thin film containing a hydroxyl functional group (—OH).
  • a coating layer is disposed on at least one surface of the metal thin film and includes a carbon nanotube containing a hydrophilic functional group. The coating layer may be attached to the metal thin film by bonding the hydroxyl functional group with the hydrophilic functional group in a hydrogen bond.
  • the carbon nanotube As the carbon nanotube is light-weight and has a high length to diameter ratio, it has a very high surface area per unit area and characteristics of a physical strength of almost 100 times of steel and is chemically stable. Particularly, the carbon nanotube has a thermal conductivity of about 1600-6000 W/mK, which is more excellent than copper (thermal conductivity: about 400 W/mK) or aluminum (thermal conductivity: about 205 W/mK) as several ten to several hundred times. Accordingly, when the carbon nanotube having the very high surface area and a thermal conductivity compared to the conventional material is included in at least one surface of the metal thin film, the heat exchange efficiency may be enhanced through the surface where the carbon nanotube is disposed.
  • Bonding energy of the hydrogen bond may be about 15 KJ/mol to 40 KJ/mol.
  • the strong bond between functional groups may be provided by an electrostatic attractive force induced by the hydrogen bond, without any additional adhesive layer.
  • the hydrophilic functional group may be a carboxyl functional group (—COOH).
  • a thickness of the coating layer may be about 10 to 100 ⁇ m.
  • the coating layer has a thickness of less than 100 ⁇ m, a region where the metal thin film is not coated with a carbon nanotube coating layer may be existed, so a uniform heat radiation may be not accomplished.
  • the thickness of the coating layer may be about 10 to 50 ⁇ m, and more specifically about 10 to 30 ⁇ m.
  • the metal thin film may include any metal having a high thermal conductivity, and may include a pure metal or an alloy.
  • the metal thin film may include a pure metal including one kind of metal selected from aluminum (Al), iron (Fe), copper (Cu), nickel (Ni), silver (Ag), tin (Sn), zinc (Zn), and tungsten (W) or the like, or an alloy of at least two kinds of metals selected from the metals list above.
  • the metal thin film may include the pure metal selected from Al, Cu, Sn, or the alloy thereof, considering the cost, the weight, the thermal conductivity, or the like. It may further include a pure aluminum or an aluminum alloy thin film including a main component of aluminum.
  • the thickness of the metal thin film may be freely established depending upon the electronic product, ranging from about 0.01 mm to 5.0 mm. More specifically, the metal thin film for a laptop computer may have a thickness of less than or equal to about 0.1 mm, or ranging from about 0.01 mm to 0.1 mm. The metal thin film for a plasma display may have a thickness of greater than or equal to about 0.1 mm, or ranging from about 0.1 mm to about 5.0 mm.
  • the metal thin film may have a shape comprising a plurality of protruded heat dissipating fins by modifying a flat metal thin film in order to increase a surface area and to maximize a heat transfer efficiency.
  • the heat dissipating fin may be made of material selected from aluminum, iron, copper, nickel silver, tin, zinc, tungsten, or the like, which is the same as the material for metal thin film.
  • a head lamp for an automobile may include a heat dissipating plate for an LED.
  • a method of preparing a heat dissipating plate for an LED includes oxidizing a carbon nanotube in an acid aqueous solution.
  • the oxidized carbon nanotube is neutralized and treated with an ultrasonication to provide a carbon nanotube dispersion.
  • a metal thin film is immersed in the carbon nanotube dispersion and heated to coat the carbon nanotube on the metal thin film.
  • the heat dissipating plate having an improved cooling efficiency may be obtained by acid-treating and heating in an aqueous solution instead of a complicate anodizing treatment.
  • the carbon nanotube may be a single-wall nanotube, a multi-walled nanotube, a rope nanotube, or a mixture thereof.
  • the carbon nanotube having a diameter of about 10 nm to 30 nm, a length of about 1 ⁇ m to 20 ⁇ m was used.
  • a diameter of the carbon nanotube may be specifically about 10 to 20 nm, or about 10 nm to about 15 nm.
  • a length of the carbon nanotube may be specifically about 1 to about 10 ⁇ m, or about 1 ⁇ m to about 5 ⁇ m.
  • the carbon nanotube may be functionalized by oxidizing the carbon nanotube in the acid aqueous solution.
  • the hydrophilic functional group may be generated on a surface of the carbon nanotube to be well absorbed on a surface of the metal thin film.
  • the hydrophilic functional group for providing a hydrogen bond with hydroxyl functional group on an aluminum surface may include a carboxyl functional group.
  • the generation of the hydrophilic functional group on the surface of the carbon nanotube may be optimized by adjusting pH of the acid aqueous solution within about 1 to 2.
  • the functionalized carbon nanotube powder may be obtained by neutralizing the carbon nanotube acid aqueous solution in less than or equal to pH 7, distilling and drying the same.
  • the dispersion may further include a dispersing agent.
  • the dispersing agent may be selected from sodium dodecyl sulfate, lithium dodecyl sulfate, Triton-x, and a combination thereof. In an exemplary embodiment of the present disclosure, more specific examples may be sodium dodecyl sulfate.
  • the functionalized carbon nanotube and the dispersing agent may have a concentration of about 100 wppm, respectively.
  • the functionalized carbon nanotube and the dispersing agent may be each used in 100 mg per 1 L of water.
  • the carbon nanotube may be uniformly and strictly attached onto the metal thin film.
  • the ultrasonification may be generally sufficient in an intensity of about 40 to 60 KHz for about 1 hour as long as conditions do not give any damage on the functionalized carbon nanotube.
  • the solution may be black.
  • the coating the carbon nanotube on the metal thin film may be performed with heating as immersing the metal thin film in the dispersion solution.
  • the heating may be performed at a heat capacity of about 150 to 400 W/cm 2 for about 0.5 to 2 hours.
  • the heating may be performed at a heat capacity of about 200 W/cm 2 for about 1 hour.
  • the coating layer may have a desirable thickness.
  • the method of preparing a heat dissipating plate according to an embodiment of the present disclosure includes functional zing the carbon nanotube and then heating in aqueous solution, which may simplify the process and save the cost. As the method does not require an additional process such as pre-treatment on the metal thin film for the carbon nanotube coating, the heat dissipating plate having an improved cooling efficiency may be provided by the simplified process.
  • the heat dissipating plate structure using the carbon nanotube according to an embodiment of the present disclosure may be equally applicable to a device of discharging heat by compression and condensation, for example, an air conditioner, a mechanical machine as well as to a computer cooler (computer processing unit (CPU) cooler, graphic card cooler, heat dissipating fin, and heat pipe self-cooler) including a laptop.
  • a device of discharging heat by compression and condensation for example, an air conditioner, a mechanical machine as well as to a computer cooler (computer processing unit (CPU) cooler, graphic card cooler, heat dissipating fin, and heat pipe self-cooler) including a laptop.
  • a computer cooler computer processing unit (CPU) cooler, graphic card cooler, heat dissipating fin, and heat pipe self-cooler) including a laptop.
  • CPU computer processing unit
  • the functionalized CNT was ground, and then 100 wppm of functionalized CNT was added into 100 wppm of sodium dodecyl sulphate (SDS) aqueous solution and mixed for 1 hour through an ultrasonication to provide a functionalized CNT-SDS disperse solution.
  • SDS sodium dodecyl sulphate
  • a aluminum heat dissipating plate was immersed in the functionalized CNT-SDS disperse solution obtained from Synthesis Example 1 and heated for 1 hour with applying a heat capacity of about 200 W/cm 2 , and then taken out and washed with distilled water to provide a heat dissipating plate.
  • the obtained heat dissipating plate was evaluated for a cooling performance.
  • the heat dissipating plate was evaluated for the cooling performance in accordance with the same procedure as in Example 1, except that the heat dissipating plate according to Example 1 was used in a device mounted with a cooling plate.
  • the aluminum heat dissipating plate was used without a separate treatment.
  • the heat dissipating plate was obtained from Hyundai Motor Company, which is mass-produced and surface-treated according to aluminum anodizing method.
  • Example 1 The heat dissipating plates according to Example 1, Example 2, Comparative Example 1, and Comparative Example 2 were evaluated for the cooling performance, and the results are shown in FIGS. 4 and 5 .
  • FIG. 4 is a graph showing cooling performance results of the heat dissipating plate obtained from Example 1, Comparative Example 1, and Comparative Example 2 in terms of a temperature change depending upon power applied.
  • FIG. 5 is a graph showing cooling performance results of the heat dissipating plates obtained from Example 2, Comparative Example 1, and Comparative Example 2 in terms of a temperature change depending upon power applied.
  • T base 124° C. was set as a base temperature of the heat dissipating fin in the heat dissipating plate.
  • T 0 25° C. (air temperature) was set for air temperature.
  • a temperature difference ( ⁇ T T base ⁇ T tip ) between the base temperature and the tip temperature of heat dissipating fin depending upon the applied power was measured and shown in the graphs.
  • Example 1 and Example 2 had a higher temperature difference ( ⁇ T) depending upon the applied power than Comparative Example 1 and Comparative Example 2. Particularly, the cooling performance is improved about 18% to 27% according to Example 1 and about 17% to 38% according to Example 2, compared to the heat dissipating plate obtained by surface-treating in the aluminum anodizing method. In other words, it is confirmed that the heat dissipating plates according to Examples 1 and 2 had a further excellent heat discharging efficiency from the results, and the difference between the base temperature (T base ) and the tip temperature (T tip ) was relatively large.
  • Example 1 In order to determine whether the heat dissipating plate obtained from Example 1 may maintain the cooling characteristics in the same level for a long period of time, the heat dissipating plate was evaluated for the cooling performance with power of 0.29 W for 250 hours, and results are shown in FIG. 6 .
  • FIG. 6 is a graph showing the difference ( ⁇ T) change of base temperature (T hose ) and tip temperature (T tip ) of heat dissipating fin of the heat dissipating plate obtained from Example 1 depending upon the time.

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  • Engineering & Computer Science (AREA)
  • General Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Chemical & Material Sciences (AREA)
  • Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Optics & Photonics (AREA)
  • Materials Engineering (AREA)
  • Organic Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Combustion & Propulsion (AREA)
  • Thermal Sciences (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Ceramic Engineering (AREA)
  • Structural Engineering (AREA)
US14/520,917 2014-10-22 2014-10-22 Heat dissipating plate device for light emitting diode, head lamp for automobile and method for preparing the same Abandoned US20160116132A1 (en)

Priority Applications (5)

Application Number Priority Date Filing Date Title
US14/520,917 US20160116132A1 (en) 2014-10-22 2014-10-22 Heat dissipating plate device for light emitting diode, head lamp for automobile and method for preparing the same
DE102015204934.5A DE102015204934A1 (de) 2014-10-22 2015-03-19 Wärmeableitfolieneinrichtung für Leuchtdiode, Scheinwerferlampe für Automobile und Verfahren zur Herstellung derselben
CN201510140039.8A CN106152002B (zh) 2014-10-22 2015-03-27 发光二极管的散热板设备、用于汽车的头灯及制备方法
KR1020150109697A KR101786658B1 (ko) 2014-10-22 2015-08-03 Led용 방열판, 자동차 헤드램프, 및 이의 제조 방법
US15/809,662 US20180090653A1 (en) 2014-10-22 2017-11-10 Heat dissipating plate device for light emitting diode, head lamp for automobile and method for preparing the same

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US14/520,917 US20160116132A1 (en) 2014-10-22 2014-10-22 Heat dissipating plate device for light emitting diode, head lamp for automobile and method for preparing the same

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US15/809,662 Abandoned US20180090653A1 (en) 2014-10-22 2017-11-10 Heat dissipating plate device for light emitting diode, head lamp for automobile and method for preparing the same

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Families Citing this family (3)

* Cited by examiner, † Cited by third party
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USD894141S1 (en) * 2018-08-29 2020-08-25 Samsung Electronics Co., Ltd. Television receiver
KR102041737B1 (ko) 2018-12-27 2019-11-06 문규식 방열성능이 향상된 차량 램프용 히트싱크 및 그 제조방법
KR102158330B1 (ko) 2018-12-27 2020-09-21 이영숙 방열구조체 일체형 ｐｃｂ가 구비된 차량용 램프

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20080131722A1 (en) * 2006-03-21 2008-06-05 Ephraim Suhir Single Layer Carbon Nanotube-Based Structures and Methods for Removing Heat from Solid-State Devices
US20100102280A1 (en) * 2007-02-02 2010-04-29 Sony Deutschland Gmbh Method of producing a film of carbon nanotubes on a substrate
US20110143101A1 (en) * 2009-12-11 2011-06-16 Adarsh Sandhu Graphene structure, method for producing the same, electronic device element and electronic device
US8230690B1 (en) * 2008-05-20 2012-07-31 Nader Salessi Modular LED lamp
US8323439B2 (en) * 2009-03-08 2012-12-04 Hewlett-Packard Development Company, L.P. Depositing carbon nanotubes onto substrate

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
AU2002307283A1 (en) * 2001-04-12 2002-10-28 Honda Giken Kogyo Kabushiki Kaisha Purification of carbon filaments and their use in storing hydrogen
US20130075074A1 (en) * 2004-07-26 2013-03-28 Kuo-Ching Chiang Thermal Dissipation Device
WO2006072085A2 (en) * 2004-12-28 2006-07-06 William Marsh Rice University Purification of carbon nanotubes based on the chemistry of fenton's reagent
KR100674404B1 (ko) * 2005-07-05 2007-01-29 재단법인서울대학교산학협력재단 탄소나노튜브가 코팅된 방열판 및 그 제조방법
TWI434904B (zh) * 2006-10-25 2014-04-21 Kuraray Co 透明導電膜、透明電極基板及使用它之液晶配向膜之製法、以及碳奈米管及其製法
JP5463749B2 (ja) * 2009-06-17 2014-04-09 ソニー株式会社 透明導電性フィルムおよび透明導電性フィルムの製造方法
US8487518B2 (en) * 2010-12-06 2013-07-16 3M Innovative Properties Company Solid state light with optical guide and integrated thermal guide
JP6061638B2 (ja) * 2012-11-20 2017-01-18 株式会社小糸製作所 車両用灯具

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20080131722A1 (en) * 2006-03-21 2008-06-05 Ephraim Suhir Single Layer Carbon Nanotube-Based Structures and Methods for Removing Heat from Solid-State Devices
US20100102280A1 (en) * 2007-02-02 2010-04-29 Sony Deutschland Gmbh Method of producing a film of carbon nanotubes on a substrate
US8230690B1 (en) * 2008-05-20 2012-07-31 Nader Salessi Modular LED lamp
US8323439B2 (en) * 2009-03-08 2012-12-04 Hewlett-Packard Development Company, L.P. Depositing carbon nanotubes onto substrate
US20110143101A1 (en) * 2009-12-11 2011-06-16 Adarsh Sandhu Graphene structure, method for producing the same, electronic device element and electronic device

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KR20160047384A (ko) 2016-05-02
CN106152002B (zh) 2019-08-09
CN106152002A (zh) 2016-11-23
DE102015204934A1 (de) 2016-04-28
US20180090653A1 (en) 2018-03-29
KR101786658B1 (ko) 2017-10-18

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