US20150377564A1 - Heat dissipating fin assembly - Google Patents

Heat dissipating fin assembly Download PDF

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Publication number
US20150377564A1
US20150377564A1 US14/675,119 US201514675119A US2015377564A1 US 20150377564 A1 US20150377564 A1 US 20150377564A1 US 201514675119 A US201514675119 A US 201514675119A US 2015377564 A1 US2015377564 A1 US 2015377564A1
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US
United States
Prior art keywords
heat dissipating
dissipating fins
fin assembly
fins
fan
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
US14/675,119
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English (en)
Inventor
Shu-Cheng Yang
Chih-Hsiang Chang
Shih-Chou Chen
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Delta Electronics Inc
Original Assignee
Delta Electronics Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Delta Electronics Inc filed Critical Delta Electronics Inc
Assigned to DELTA ELECTRONICS, INC. reassignment DELTA ELECTRONICS, INC. ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: CHANG, CHIH-HSIANG, CHEN, SHIH-CHOU, YANG, SHU-CHENG
Publication of US20150377564A1 publication Critical patent/US20150377564A1/en
Priority to US16/667,272 priority Critical patent/US11009301B2/en
Abandoned legal-status Critical Current

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Classifications

    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F3/00—Plate-like or laminated elements; Assemblies of plate-like or laminated elements
    • F28F3/02—Elements or assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with recesses, with corrugations
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F04—POSITIVE - DISPLACEMENT MACHINES FOR LIQUIDS; PUMPS FOR LIQUIDS OR ELASTIC FLUIDS
    • F04D—NON-POSITIVE-DISPLACEMENT PUMPS
    • F04D17/00—Radial-flow pumps, e.g. centrifugal pumps; Helico-centrifugal pumps
    • F04D17/08—Centrifugal pumps
    • F04D17/16—Centrifugal pumps for displacing without appreciable compression
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F04—POSITIVE - DISPLACEMENT MACHINES FOR LIQUIDS; PUMPS FOR LIQUIDS OR ELASTIC FLUIDS
    • F04D—NON-POSITIVE-DISPLACEMENT PUMPS
    • F04D29/00—Details, component parts, or accessories
    • F04D29/58—Cooling; Heating; Diminishing heat transfer
    • F04D29/582—Cooling; Heating; Diminishing heat transfer specially adapted for elastic fluid pumps
    • F04D29/5826—Cooling at least part of the working fluid in a heat exchanger
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F19/00—Preventing the formation of deposits or corrosion, e.g. by using filters or scrapers
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F2215/00—Fins
    • F28F2215/04—Assemblies of fins having different features, e.g. with different fin densities
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F2250/00—Arrangements for modifying the flow of the heat exchange media, e.g. flow guiding means; Particular flow patterns
    • F28F2250/08—Fluid driving means, e.g. pumps, fans

Definitions

  • the present invention relates to a heat dissipating fin assembly and, in particular, to a heat dissipating fin assembly with dusting function.
  • the electronic products are developed with higher performance, higher frequency, higher speed, and lighter and thinner structure.
  • these features make the internal temperature of the electronic products become higher and higher, which may cause the product unstable and thus affect the reliability of the products. Therefore, the existing electronic products are usually equipped with a fan to dissipate the generated heat.
  • the outlet of the fan located adjacent to the heat dissipating fin assembly will accumulate with great amount of dusts, which may come from the air.
  • the accumulated dust can sufficiently affect the rotation speed and heat dissipating efficiency of the heat-dissipating fan.
  • an objective of the present invention is to provide a heat dissipating fin assembly which can provide a dusting function easily so as to improve the heat dissipating efficiency.
  • the present invention discloses a heat dissipating fin assembly suitable for a fan, which includes a bottom plate, a plurality of first heat dissipating fins, a plurality of second heat dissipating fins, an inner cover plate and an outer cover plate.
  • the heat dissipating fin assembly has an inner end adjacent to the fan and an outer end away from the fan.
  • the first heat dissipating fins are disposed on the bottom plate side by side and extend from the inner end to the outer end.
  • the second heat dissipating fins are disposed on the bottom plate and located between two of the first heat dissipating fins.
  • the inner cover plate is disposed at the inner end and connected to one side of the first heat dissipating fins away from the bottom plate.
  • the outer cover plate is disposed at the outer end and connected to one side of the second heat dissipating fins away from the bottom plate.
  • the outer cover plate and the inner cover plate are separated so as to form an opening.
  • the second heat dissipating fins extend from around the opening to the outer end, and the length of the first heat dissipating fins is larger than that of the second heat dissipating fins.
  • each of the second heat dissipating fins has a slant edge corresponding to the position of the opening, and the slant edge extends obliquely and upwardly from the inner end to the outer end.
  • the fan is a centrifugal fan.
  • any adjacent two of the first heat dissipating fins are interposed with one of the second heat dissipating fins.
  • any adjacent two of the first heat dissipating fins are interposed with at least two of the second heat dissipating fins.
  • any adjacent two of the first heat dissipating fins are interposed with different amount of the second heat dissipating fins.
  • a hole is configured on a side wall of a fan frame of the fan adjacent to an outlet.
  • any adjacent two of the first heat dissipating fins located close to the hole are interposed with less amount of the second heat dissipating fins, while any adjacent two of the first heat dissipating fins located away from the hole are interposed with greater amount of the second heat dissipating fins.
  • the present invention also discloses a heat dissipating fin assembly suitable for a fan, which includes a plurality of first heat dissipating fins and a plurality of second heat dissipating fins.
  • the heat dissipating fin assembly has an inner end adjacent to the fan and an outer end away from the fan.
  • Each of the first heat dissipating fins includes a first fin body, a first bottom extension portion, a first inner cover extension portion and a first outer cover extension portion.
  • the first bottom extension portion turns and extends from the first fin body.
  • the first inner cover extension portion is disposed at the inner end and connected to one side of the first fin body away from the first bottom extension portion.
  • the first outer cover extension portion is disposed at the outer end and connected to one side of the first fin body away from the first bottom extension portion.
  • Each of the second heat dissipating fins includes a second fin body, a second bottom extension portion and a second outer cover extension portion.
  • the second bottom extension portion turns and extends from the second fin body.
  • the second outer cover extension portion is disposed at the outer end and connected to one side of the second fin body away from the second bottom extension portion.
  • the length of the first heat dissipating fins is larger than that of the second heat dissipating fins.
  • the second heat dissipating fins and the first heat dissipating fins are arranged side by side.
  • the first inner cover extension portions, the first outer cover extension portions and the second outer cover extension portions form an opening.
  • each of the second fin bodies has a slant edge corresponding to the position of the opening, and the slant edge extends obliquely and upwardly from the inner end to the outer end.
  • the fan is a centrifugal fan.
  • any adjacent two of the first heat dissipating fins are interposed with one of the second heat dissipating fins.
  • any adjacent two of the first heat dissipating fins are interposed with at least two of the second heat dissipating fins.
  • any adjacent two of the first heat dissipating fins are interposed with different amount of the second heat dissipating fins.
  • a hole is configured on a side wall of a fan frame of the fan adjacent to an outlet.
  • any adjacent two of the first heat dissipating fins located close to the hole are interposed with less amount of the second heat dissipating fins, while any adjacent two of the first heat dissipating fins located away from the hole are interposed with greater amount of the second heat dissipating fins.
  • the inner end of the heat dissipating fin assembly of the invention has lower density of heat dissipating structure (the first heat dissipating fins), and the outer end of the heat dissipating fin assembly has higher density of heat dissipating structure (including the first and second heat dissipating fins).
  • the lower density heat dissipating structure at the inner end can avoid the accumulation of dusts, and the higher density heat dissipating structure at the outer end can maintain a larger heat dissipating surface area.
  • the heat dissipating fin assembly further includes an inner cover plate and an outer cover plate, and an opening is defined between the inner and outer cover plates. As a result, the dusts can be exhausted through the opening, thereby achieving the effects of dusting and improved heat dissipating efficiency.
  • the inner end of the heat dissipating fin assembly has lower density of heat dissipating structure (the first fin bodies), and the outer end of the heat dissipating fin assembly has higher density of heat dissipating structure (including the first and second fin bodies).
  • the first inner cover extension portion, the first outer cover extension portion and the second outer cover extension portion form an opening. This configuration can also provide a lower density heat dissipating structure at the inner end to avoid the accumulation of dusts, and a higher density heat dissipating structure at the outer end to maintain a larger heat dissipating surface area.
  • the dusts entering the heat dissipating fin assembly through the inner end can be ejected via the opening.
  • FIG. 1 is a schematic diagram showing an assembled heat dissipating device according to an embodiment of the invention
  • FIG. 2 is an exploded view of the heat dissipating device of FIG. 1 ;
  • FIG. 3 is a schematic diagram showing a part of the assembled heat dissipating device of FIG. 1 ;
  • FIG. 4A is a sectional diagram of the heat dissipating device of FIG. 3 along the line A-A;
  • FIG. 4B is a schematic diagram showing the operation of the heat dissipating device of FIG. 4A ;
  • FIG. 5A is a sectional diagram of another aspect of the heat dissipating device of FIG. 4A ;
  • FIG. 5B is a schematic diagram showing the operation of the heat dissipating device of FIG. 5A ;
  • FIG. 6A is a sectional diagram of another aspect of the heat dissipating device of FIG. 4A ;
  • FIG. 6B is a schematic diagram showing the operation of the heat dissipating device of FIG. 6A ;
  • FIG. 7A is a sectional diagram of another aspect of the heat dissipating device of FIG. 4A ;
  • FIG. 7B is a schematic diagram showing the operation of the heat dissipating device of FIG. 7A ;
  • FIG. 8 is a schematic diagram showing the operation of the shielding member of FIG. 3 ;
  • FIG. 9 is a schematic diagram showing a part of an assembled heat dissipating device according to another embodiment of the invention.
  • FIG. 10A is a schematic diagram showing a heat dissipating fin assembly according to an embodiment of the invention.
  • FIG. 10B is a schematic diagram showing an aspect of the heat dissipating fin assembly of FIG. 10A in cooperated with a fan;
  • FIG. 10C is a schematic diagram showing another aspect of the heat dissipating fin assembly of FIG. 10A in cooperated with a fan;
  • FIG. 10D is a schematic diagram showing another aspect of the heat dissipating fin assembly of FIG. 10A ;
  • FIG. 10E is a schematic diagram showing another aspect of the heat dissipating fin assembly of FIG. 10A ;
  • FIG. 11A is a schematic diagram showing another aspect of the heat dissipating fin assembly of FIG. 10A ;
  • FIG. 11B is a schematic diagram showing another aspect of the heat dissipating fin assembly of FIG. 11A ;
  • FIG. 11C is a schematic diagram showing another aspect of the heat dissipating fin assembly of FIG. 11A ;
  • FIG. 12A is a schematic diagram showing a part of an assembled heat dissipating device according to another embodiment of the invention.
  • FIG. 12B is a schematic diagram showing a part of an assembled heat dissipating device according to another embodiment of the invention.
  • FIG. 1 is a schematic diagram showing an assembled heat dissipating device la according to an embodiment of the invention
  • FIG. 2 is an exploded view of the heat dissipating device 1 a of FIG. 1
  • FIG. 3 is a schematic diagram showing a part of the assembled heat dissipating device 1 a of FIG. 1
  • the heat dissipating device 1 a of this embodiment includes a fan F, a heat dissipating fin assembly 14 and a block 15 .
  • the fan F includes a fan frame 11 , an impeller 12 and a motor 13 .
  • the motor 13 is disposed in the fan frame 11 .
  • the impeller is mounted on the motor 13 , so that the motor 13 is connected to the impeller 12 and drives it to rotate.
  • the fan frame 11 has an inlet 111 and an outlet 112 .
  • the heat dissipating fin assembly 14 is disposed at the position of the outlet 112 for dissipating heat.
  • the heat dissipating fin assembly 14 is composed of a plurality of heat dissipating fins 141 , which are arranged side by side, and any two of the heat dissipating fins 141 form a heat dissipating channel C. Accordingly, the heat dissipating fin assembly 14 has a plurality of heat dissipating channel C for dissipating heat from the heat dissipating device 1 a .
  • the dusts may be accumulated at one side of the heat dissipating fin assembly 14 adjacent to the impeller 12 when the air in the heat dissipating device 1 a flows through the heat dissipating fin assembly 14 .
  • the dusts accumulate at the joint position of the outlet 112 and the heat dissipating fin assembly 14 .
  • the block 15 of the embodiment shields the heat dissipating channels C, so that the air cannot be exhausted through the heat dissipating channels C.
  • the block 15 can movably connect with the heat dissipating fin assembly 14 , and the detailed aspects thereof will be discussed later.
  • the block 15 may not connect with the heat dissipating fin assembly 14 . That is, the block 15 is an independent component disposed close to the heat dissipating fin assembly 14 for shielding the heat dissipating channels C.
  • the block 15 can be a part of another device that can also be disposed close to the heat dissipating channels C for shielding them.
  • a hole O 1 is configured on a side wall S of the fan frame 11 adjacent to the outlet 112 . Since the block 15 blocks the air inside the heat dissipating device 1 a , the air will flow within the heat dissipating device 1 a continuously so as to from a higher pressure zone. At the same time, the hole O 1 connecting to the outside of the heat dissipating device 1 a forms a lower pressure zone. Thus, the air naturally flows from the higher pressure zone to the lower pressure zone so as to blow the dusts accumulated at the joint position of the outlet 112 and the heat dissipating fin assembly 14 to the hole O 1 , thereby exhausting the dusts through the hole O 1 and thus achieving the goal of dusting.
  • FIG. 4A is a sectional diagram of the heat dissipating device 1 a of FIG. 3 along the line A-A
  • FIG. 4B is a schematic diagram showing the operation of the heat dissipating device 1 a of FIG. 4A
  • the block 15 is movably connected with the heat dissipating fin assembly 14 , so it can move between a first open position PO 1 and a first close position PC 1 .
  • the block 15 a is located at the first closing position PC 1 (see FIG. 5A )
  • the block 15 shields the heat dissipating channels C of the heat dissipating fin assembly 14 (see FIG. 2 ) so as to stop the air in the heat dissipating device 1 a from flowing through the heat dissipating channels C.
  • FIG. 5A is a sectional diagram of another aspect of the heat dissipating device of FIG. 4A
  • FIG. 5B is a schematic diagram showing the operation of the heat dissipating device of FIG. 5A .
  • the block 15 a is a sliding cap structure, which includes a track and a cap. Accordingly, the cap can be controlled by hand or circuit to slide along the track to shield the heat dissipating fin assembly 14 .
  • FIG. 6A is a sectional diagram of another aspect of the heat dissipating device of FIG. 4A
  • FIG. 6B is a schematic diagram showing the operation of the heat dissipating device of FIG. 6A
  • the block 15 b is a rolling door structure, which can be controlled by hand or circuit to move downwardly for shielding the heat dissipating fin assembly 14 .
  • the other related descriptions can be referred to the above aspects, so the detailed description thereof will be omitted.
  • FIG. 7A is a sectional diagram of another aspect of the heat dissipating device of FIG. 4A
  • FIG. 7B is a schematic diagram showing the operation of the heat dissipating device of FIG. 7A .
  • the block 15 c is a shutter structure, which can be controlled by hand or circuit to rotate downwardly for shielding the heat dissipating fin assembly 14 .
  • the other related descriptions can be referred to the above aspects, so the detailed description thereof will be omitted.
  • the block 15 , 15 a , 15 b or 15 c shields one side of the heat dissipating fin assembly 14 away from the impeller 12 .
  • the block 15 , 15 a , 15 b or 15 c can shield the outlets of the heat dissipating channels C.
  • the block 15 , 15 a , 15 b or 15 c may shield one side of the heat dissipating fin assembly 14 adjacent to the impeller 12 . That is, the block 15 , 15 a , 15 b or 15 c can shield the inlets of the heat dissipating channels C.
  • the block 15 , 15 a , 15 b or 15 c shields the inlets or outlets of the heat dissipating channels C, the air can be blocked inside the heat dissipating device 1 a and cannot be exhausted through the heat dissipating channels C. Furthermore, the configuration of the hole can provide an excellent dusting effect.
  • the hole O 1 is located at a left side of the side wall S and adjacent to the outlet 112 . Accordingly, the dusts accumulated at the joint position of the outlet 112 and the heat dissipating fin assembly 14 can be swept by the clockwise airflow and exhausted through the hole O 1 , thereby achieving the desired dusting effect.
  • the heat dissipating device 1 a further includes a shielding member 16 moveably connected to the edge of the hole O 1 .
  • the shielding member 16 is disposed at a position of the side wall S adjacent to the hole O 1 .
  • the shielding member 16 is movable between the second open position PO 2 and the second close position PC 2 (see FIG. 8 ).
  • FIG. 8 is a schematic diagram showing the operation of the shielding member 16 of FIG. 3 .
  • the shielding member 16 can also be controlled by hand or circuit to move between the second open position PO 2 (see FIG. 3 ) and the second close position PC 2 .
  • the block 15 is controlled to shield the heat dissipating channels C of the heat dissipating fin assembly 14 while the shielding member 16 does not shield the hole O 1 . Accordingly, the dusts accumulated at the joint position of the outlet 112 and the heat dissipating fin assembly 14 are blew to the hole O 1 , thereby exhausting the dusts through the hole O 1 and thus achieving the goal of dusting.
  • FIGS. 1 Regarding to the aspect as shown in FIGS.
  • the block 15 , 15 a , 15 b or 15 c moves to the first close position PC 1 while the shielding member 16 is located at the second open position PO 2 (see FIG. 3 ).
  • the block 15 does not shield the heat dissipating channels C of the heat dissipating fin assembly 14 (see FIG. 2 ) while the shielding member 16 shields the hole O 1 .
  • the block 15 , 15 a , 15 b or 15 c moves to the first open position PO 1 while the shielding member 16 is located at the second close position PC 2 (see FIG. 8 ). Accordingly, the heat dissipating device 1 a can dissipating heated airflow through the heat dissipating channels C of the heat dissipating fin assembly 14 .
  • FIG. 9 is a schematic diagram showing a part of an assembled heat dissipating device 1 b according to another embodiment of the invention.
  • the impeller 12 of the heat dissipating device 1 b rotates counterclockwise, so that the hole O 2 is located at the right side of the side wall S.
  • the hole O 2 is located at the right side of the side wall S and adjacent to the outlet 112 .
  • the fan frame 11 may include both of the hole O 1 disposed at the left side of the side wall S (see FIG. 3 ) and the hole O 2 disposed at the right side of the side wall S (see FIG. 8 ) in cooperating with different rotation directions of the impeller 12 for performing dusting procedure.
  • FIG. 10A is a schematic diagram showing a heat dissipating fin assembly 14 a according to an embodiment of the invention
  • FIG. 10B is a schematic diagram showing an aspect of the heat dissipating fin assembly 14 a of FIG. 10A in cooperated with a fan.
  • the heat dissipating fin assembly 14 a of this embodiment is in cooperating with a fan F so as to form a heat dissipating device 1 c .
  • the fan F is preferably a centrifugal fan.
  • the heat dissipating fin assembly 14 a includes a bottom plate 142 , a plurality of first heat dissipating fins 1411 , a plurality of second heat dissipating fins 1412 , an inner cover plate 143 and an outer cover plate 144 .
  • the heat dissipating fin assembly 14 a has an inner end E 1 close to the fan F and an outer end E 2 away from the fan F.
  • the first heat dissipating fins 1411 are disposed on the bottom plate 142 side by side and extend from an inner end E 1 to an outer end E 2 .
  • the second heat dissipating fins 1412 are disposed on the bottom plate 142 side by side and located between two first heat dissipating fins 1411 , respectively.
  • first heat dissipating fins 1411 are interposed with a second heat dissipating fin 1412 .
  • the inner cover plate 143 is disposed at the inner end E 1 and connected to one side of the first heat dissipating fins 1411 away from the bottom plate 142 .
  • the outer cover plate 144 is disposed at the outer end E 2 and connected to one side of the second heat dissipating fins 1412 away from the bottom plate 142 .
  • the outer cover plate 144 and the inner cover plate 143 are separated so as to form an opening O 3 , and the second heat dissipating fins 1412 extend from around the opening O 3 to the outer end E 2 .
  • the length of the first heat dissipating fins 1411 is larger than that of the second heat dissipating fins 1412 .
  • the “length” represents the length of the first heat dissipating fins 1411 or the second heat dissipating fins 1412 in the direction from the inner end E 1 to the outer end E 2 .
  • the inner end E 1 of the heat dissipating fin assembly 14 a has lower density of heat dissipating structure (the first heat dissipating fins), and the outer end E 2 of the heat dissipating fin assembly 14 a has higher density of heat dissipating structure (including the first and second heat dissipating fins).
  • the lower density heat dissipating structure at the inner end E 1 can avoid the accumulation of dusts at the joint between the heat dissipating fin assembly 14 a and the outlet 112 , and the higher density heat dissipating structure at the outer end E 2 can maintain a larger heat dissipating surface area.
  • the dusts entering the heat dissipating fin assembly 14 a through the inner end E 1 can be exhausted through the opening O 3 , thereby achieving the effects of dusting and improved heat dissipating efficiency.
  • the second heat dissipating fin 1412 has a slant edge L corresponding to the position of the opening O 3 .
  • the slant edge L extends obliquely and upwardly from the inner end E 1 to the outer end E 2 . Accordingly, the dusts can be more easily ejected, along the slant edge L, through the opening O 3 .
  • FIG. 10C is a schematic diagram showing another aspect of the heat dissipating fin assembly 14 a of FIG. 10A in cooperated with a fan.
  • the side wall S of the fan F 1 has a hole O 1 and the block 15 is disposed at the outer end E 2 of the heat dissipating fin assembly 14 a .
  • the block 15 shields the heat dissipating channels of the heat dissipating fin assembly 14 a , so that the dusts accumulated at the joint position of the outlet 112 and the heat dissipating fin assembly 14 a are blew to the hole O 1 .
  • the dusts entering the heat dissipating fin assembly 14 a through the inner end E 1 of the heat dissipating fin assembly 14 a can be exhausted through the opening O 3 , thereby achieving a double dusting effect.
  • the other related descriptions can be referred to the above embodiments, so the detailed description thereof will be omitted.
  • FIG. 10D is a schematic diagram showing another aspect of the heat dissipating fin assembly of FIG. 10A in cooperated with a fan.
  • adjacent two first heat dissipating fins 1411 are interposed with at least two of the second heat dissipating fins 1412 .
  • adjacent two first heat dissipating fins 1411 can be interposed with more second heat dissipating fins 1412 . Accordingly, a larger interval can be formed around the inner end E 1 , so that the dusts entering the heat dissipating fin assembly 14 b can be more easily ejected through the opening O 3 .
  • FIG. 10E is a schematic diagram showing another aspect of the heat dissipating fin assembly of FIG. 10A in cooperated with a fan.
  • adjacent two first heat dissipating fins 1411 are interposed with different amount of the second heat dissipating fins 1412 .
  • some adjacent two first heat dissipating fins 1411 are interposed with two second heat dissipating fins 1412
  • some adjacent two first heat dissipating fins 1411 are interposed with three second heat dissipating fins 1412 .
  • the amount or amounts of the interposed second heat dissipating fins 1412 and the configuration between the first heat dissipating fins 1411 and the second heat dissipating fins 1412 can be modified based on the actual needs.
  • FIG. 11A is a schematic diagram showing another aspect of the heat dissipating fin assembly of FIG. 10A .
  • the heat dissipating fin assembly 14 d of this aspect includes a plurality of first heat dissipating fins 1411 and a plurality of second heat dissipating fins 1412 .
  • Each of the first heat dissipating fins 1411 includes a first fin body 14111 , a first bottom extension portion 14112 , a first inner cover extension portion 14113 and a first outer cover extension portion 14114 .
  • the first bottom extension portion 14112 turns and extends from the first fin body 14111 .
  • the first inner cover extension portion 14113 is disposed at the inner end E 1 and connected to one side of the first fin body 14111 away from the first bottom extension portion 14112 .
  • the first outer cover extension portion 14114 is disposed at the outer end E 2 and connected to one side of the first fin body 14111 away from the first bottom extension portion 14112 .
  • Each of the second heat dissipating fins 1412 includes a second fin body 14121 , a second bottom extension portion 14122 and a second outer cover extension portion 14124 .
  • the second bottom extension portion 14122 turns and extends from the second fin body 14121 .
  • the second outer cover extension portion 14124 is disposed at the outer end E 2 and connected to one side of the second fin body 14121 away from the second bottom extension portion 14122 .
  • the length of the first heat dissipating fins 1411 is larger than that of the second heat dissipating fins 1412 .
  • the “length” represents the length of the first heat dissipating fins 1411 or the second heat dissipating fins 1412 in the direction from the inner end E 1 to the outer end E 2 .
  • the first heat dissipating fins 1411 and the second heat dissipating fins 1412 are arranged side by side, and two adjacent first heat dissipating fins 1411 are interposed with one second heat dissipating fin 1412 , for example.
  • the heat dissipating fins 1411 and the second heat dissipating fins 1412 are arranged side by side through a riveting method. Due to the above side-by-side structure, the first inner cover extension portion 14113 , the first outer cover extension portion 14114 and the second outer cover extension portion 14124 can form an opening O 4 . According to the above structure, the inner end E 1 of the heat dissipating fin assembly 14 d has lower density of heat dissipating structure (the first fin bodies), and the outer end E 2 of the heat dissipating fin assembly 14 d has higher density of heat dissipating structure (including the first and second fin bodies).
  • the lower density heat dissipating structure at the inner end E 1 can avoid the accumulation of dusts, and the higher density heat dissipating structure at the outer end E 2 can maintain a larger heat dissipating surface area.
  • the dusts entering the heat dissipating fin assembly 14 d through the inner end E 1 can be exhausted through the opening O 4 , thereby achieving the effects of dusting and improved heat dissipating efficiency.
  • the second fin body 14121 has a slant edge L corresponding to the position of the opening O 4 .
  • the slant edge L extends obliquely and upwardly from the inner end E 1 to the outer end E 2 . Accordingly, the dusts entering the heat dissipating fin assembly 14 d can be more easily ejected, along the slant edge L, through the opening O 4 .
  • FIG. 11B is a schematic diagram showing another aspect of the heat dissipating fin assembly of FIG. 11A .
  • adjacent two first heat dissipating fins 1411 are interposed with two second heat dissipating fins 1412 .
  • adjacent two first heat dissipating fins 1411 can be interposed with more second heat dissipating fins 1412 . Accordingly, a larger interval can be formed around the inner end E 1 of the fan, so that the dusts entering the heat dissipating fin assembly 14 e can be more easily ejected through the opening O 4 .
  • FIG. 11C is a schematic diagram showing another aspect of the heat dissipating fin assembly of FIG. 11A .
  • adjacent two first heat dissipating fins 1411 are interposed with different amount of the second heat dissipating fins 1412 .
  • some adjacent two first heat dissipating fins 1411 are interposed with two second heat dissipating fins 1412
  • some adjacent two first heat dissipating fins 1411 are interposed with three second heat dissipating fins 1412 .
  • the amount or amounts of the interposed second heat dissipating fins 1412 and the configuration between the first heat dissipating fins 1411 and the second heat dissipating fins 1412 can be modified based on the actual needs.
  • FIG. 12A is a schematic diagram showing a part of an assembled heat dissipating device according to another embodiment of the invention.
  • the heat dissipating fin assembly 14 g is cooperated with the fan F 1 of FIG. 10C so as to form a heat dissipating device 1 e.
  • the description of the fan F 1 can be referred to the above aspects. Different from the heat dissipating fin assembly 14 a of FIG.
  • adjacent two of the first heat dissipating fins 1411 located close to the hole O 1 are interposed with less amount of the second heat dissipating fins 1412
  • adjacent two of the first heat dissipating fins 1411 located away from the hole O 1 are interposed with greater amount of the second heat dissipating fins 1412 . Since the hole O 1 can provide the dusting function, which means the position close to the hole O 1 has better dusting ability, it is possible to arrange the first heat dissipating fins 1411 with the higher density around the hole O 1 .
  • this invention is to configure more second heat dissipating fins 1412 between the adjacent first heat dissipating fins 1411 (higher density) around the joint position, so that the dusts entering the heat dissipating fin assembly 14 g can be ejected via the opening O 3 more easily, thereby improving the dusting ability at the position away from the hole O 1 .
  • FIG. 12B is a schematic diagram showing a part of an assembled heat dissipating device according to another embodiment of the invention.
  • the heat dissipating fin assembly 14 h is cooperated with the fan F 1 of FIG. 10C .
  • the description of the fan F 1 can be referred to the above aspects. Different from the heat dissipating fin assembly 14 d of FIG.
  • adjacent two of the first heat dissipating fins 1411 located close to the hole O 1 are interposed with less amount of the second heat dissipating fins 1412
  • adjacent two of the first heat dissipating fins 1411 located away from the hole O 1 are interposed with greater amount of the second heat dissipating fins 1412 . Since the hole O 1 can provide the dusting function, which means the position close to the hole O 1 has better dusting ability, it is possible to arrange the first heat dissipating fins 1411 with the higher density around the hole O 1 .
  • this invention is to configure more second heat dissipating fins 1412 between the adjacent first heat dissipating fins 1411 (higher density) around the joint position, so that the dusts entering the heat dissipating fin assembly 14 h can be ejected via the opening O 4 more easily, thereby improving the dusting ability at the position away from the hole O 1 .
  • the inner end of the heat dissipating fin assembly of the invention has lower density of heat dissipating structure (the first heat dissipating fins), and the outer end of the heat dissipating fin assembly has higher density of heat dissipating structure (including the first and second heat dissipating fins).
  • the lower density heat dissipating structure at the inner end can avoid the accumulation of dusts, and the higher density heat dissipating structure at the outer end can maintain a larger heat dissipating surface area.
  • the heat dissipating fin assembly further includes an inner cover plate and an outer cover plate, and an opening is defined between the inner and outer cover plates. As a result, the dusts can be exhausted through the opening, thereby achieving the effects of dusting and improved heat dissipating efficiency.
  • the inner end of the heat dissipating fin assembly has lower density of heat dissipating structure (the first fin bodies), and the outer end of the heat dissipating fin assembly has higher density of heat dissipating structure (including the first and second fin bodies).
  • the first inner cover extension portion, the first outer cover extension portion and the second outer cover extension portion form an opening. This configuration can also provide a lower density heat dissipating structure at the inner end to avoid the accumulation of dusts, and a higher density heat dissipating structure at the outer end to maintain a larger heat dissipating surface area.
  • the dusts entering the heat dissipating fin assembly through the inner end can be ejected via the opening.

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  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • General Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Structures Of Non-Positive Displacement Pumps (AREA)
US14/675,119 2014-06-27 2015-03-31 Heat dissipating fin assembly Abandoned US20150377564A1 (en)

Priority Applications (1)

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US16/667,272 US11009301B2 (en) 2014-06-27 2019-10-29 Heat dissipating fin assembly

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TW103122426A TWI568342B (zh) 2014-06-27 2014-06-27 散熱鰭片組
TW103122426 2014-06-27

Related Child Applications (1)

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CN (1) CN105283034B (zh)
TW (1) TWI568342B (zh)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD755134S1 (en) * 2012-06-10 2016-05-03 Apple Inc. Thermal device
USD821564S1 (en) * 2016-04-25 2018-06-26 Ebm-Papst Mulfingen Gmbh & Co. Kg Fan blade
US10285306B1 (en) * 2017-11-29 2019-05-07 Listan Gmbh & Co. Kg Power supply
US10362711B2 (en) 2017-11-29 2019-07-23 Listan Gmbh & Co. Kg Fan mounting arrangement in a power supply

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN111212544A (zh) * 2018-11-21 2020-05-29 英业达科技有限公司 电子装置
TWI676884B (zh) * 2018-12-03 2019-11-11 英業達股份有限公司 電子裝置

Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20030155106A1 (en) * 2002-02-20 2003-08-21 Malone Christopher G. Heat sink apparatus with air duct
US6626233B1 (en) * 2002-01-03 2003-09-30 Thermal Corp. Bi-level heat sink
US20090044927A1 (en) * 2007-08-17 2009-02-19 Fu Zhun Precision Industry (Shen Zhen) Co., Ltd. Thermal module and fin unit thereof
US20110267777A1 (en) * 2010-04-30 2011-11-03 Sony Corporation Cooling unit, electronic device, and heat sink
US20110277969A1 (en) * 2007-09-28 2011-11-17 Neng Tyi Precision Industries Co., Ltd. Heat dissipation device which is pre-built with an air vent structure
US20110286178A1 (en) * 2010-05-20 2011-11-24 International Business Machines Corporation Heat Sink For Distributing A Thermal Load
US20120063088A1 (en) * 2010-09-10 2012-03-15 Hon Hai Precision Industry Co., Ltd. Heat dissipating apparatus
US20120175079A1 (en) * 2011-01-06 2012-07-12 Hon Hai Precision Industry Co., Ltd. Heat dissipation device having centrifugal fan

Family Cites Families (19)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1767182A (zh) * 2004-10-26 2006-05-03 台达电子工业股份有限公司 散热组件及其流向控制结构
TW200636169A (en) * 2005-04-01 2006-10-16 Shwin-Chung Wong A flow distributor for a fan
CN1870878A (zh) * 2005-05-26 2006-11-29 台达电子工业股份有限公司 散热器
JP4493611B2 (ja) * 2005-12-13 2010-06-30 富士通株式会社 電子機器
TWM292736U (en) * 2006-01-05 2006-06-21 Neng Tyi Prec Ind Co Ltd Multi-directional heat-dissipating structure
TW200823636A (en) * 2006-11-23 2008-06-01 Inventec Corp Heat-dissipation device with dust-disposal function
TWM320113U (en) * 2007-01-12 2007-10-01 Neng Tyi Prec Ind Co Ltd Heat dissipation device capable of presetting a vent structure
TWM315850U (en) * 2007-01-15 2007-07-21 Hon Hai Prec Ind Co Ltd Computer enclosure with guiding bracket
TW200903225A (en) * 2007-07-02 2009-01-16 Ama Precision Inc Heat dissipation module
TWI330068B (en) * 2007-08-27 2010-09-01 Inventec Corp Heat dissipation device with dust removal mechanism
TWI349072B (en) * 2008-07-04 2011-09-21 Inventec Corp Wind guiding cover
TWM351385U (en) * 2008-08-25 2009-02-21 Wistron Corp Adjustable ventilation apparatus for computer enclosure and assembly for computer enclosure and adjustable ventilation apparatus
TWI424805B (zh) * 2008-10-15 2014-01-21 Micro Star Int Co Ltd Venting device
TW201029554A (en) * 2009-01-21 2010-08-01 Wistron Corp A dust-proofing method for an electronic device and the electronic device
TWI465009B (zh) * 2010-04-21 2014-12-11 Foxconn Tech Co Ltd 散熱裝置及其採用的離心風扇
CN102958325A (zh) * 2011-08-29 2013-03-06 鸿富锦精密工业（深圳）有限公司 散热装置
TWM435645U (en) * 2012-03-22 2012-08-11 Wistron Corp Heat dissipating module having enhanced heat dissipating efficiency
TWI496531B (zh) * 2012-12-12 2015-08-11 Inventec Corp 散熱模組、電子裝置及其除塵方法
TWI486749B (zh) * 2013-01-30 2015-06-01 Wistron Corp 散熱組件

Patent Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6626233B1 (en) * 2002-01-03 2003-09-30 Thermal Corp. Bi-level heat sink
US20030155106A1 (en) * 2002-02-20 2003-08-21 Malone Christopher G. Heat sink apparatus with air duct
US20090044927A1 (en) * 2007-08-17 2009-02-19 Fu Zhun Precision Industry (Shen Zhen) Co., Ltd. Thermal module and fin unit thereof
US20110277969A1 (en) * 2007-09-28 2011-11-17 Neng Tyi Precision Industries Co., Ltd. Heat dissipation device which is pre-built with an air vent structure
US20110267777A1 (en) * 2010-04-30 2011-11-03 Sony Corporation Cooling unit, electronic device, and heat sink
US20110286178A1 (en) * 2010-05-20 2011-11-24 International Business Machines Corporation Heat Sink For Distributing A Thermal Load
US20120063088A1 (en) * 2010-09-10 2012-03-15 Hon Hai Precision Industry Co., Ltd. Heat dissipating apparatus
US20120175079A1 (en) * 2011-01-06 2012-07-12 Hon Hai Precision Industry Co., Ltd. Heat dissipation device having centrifugal fan

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD755134S1 (en) * 2012-06-10 2016-05-03 Apple Inc. Thermal device
USD821564S1 (en) * 2016-04-25 2018-06-26 Ebm-Papst Mulfingen Gmbh & Co. Kg Fan blade
US10285306B1 (en) * 2017-11-29 2019-05-07 Listan Gmbh & Co. Kg Power supply
US10362711B2 (en) 2017-11-29 2019-07-23 Listan Gmbh & Co. Kg Fan mounting arrangement in a power supply

Also Published As

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TW201601620A (zh) 2016-01-01
CN105283034B (zh) 2018-02-09
CN105283034A (zh) 2016-01-27
TWI568342B (zh) 2017-01-21

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