US20150083038A1 - Spin treatment apparatus - Google Patents

Spin treatment apparatus Download PDF

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Publication number
US20150083038A1
US20150083038A1 US14/491,065 US201414491065A US2015083038A1 US 20150083038 A1 US20150083038 A1 US 20150083038A1 US 201414491065 A US201414491065 A US 201414491065A US 2015083038 A1 US2015083038 A1 US 2015083038A1
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Prior art keywords
substrate
rotation
clamp
clamp pins
pin
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US14/491,065
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US9454080B2 (en
Inventor
Masaaki Furuya
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Shibaura Mechatronics Corp
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Shibaura Mechatronics Corp
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Priority to JP2013-198094 priority Critical
Priority to JP2013198094 priority
Priority to JP2014-162096 priority
Priority to JP2014162096A priority patent/JP6400977B2/en
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Assigned to SHIBAURA MECHATRONICS CORPORATION reassignment SHIBAURA MECHATRONICS CORPORATION ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: FURUYA, MASAAKI
Publication of US20150083038A1 publication Critical patent/US20150083038A1/en
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    • BPERFORMING OPERATIONS; TRANSPORTING
    • B05SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05CAPPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C11/00Component parts, details or accessories not specifically provided for in groups B05C1/00 - B05C9/00
    • B05C11/02Apparatus for spreading or distributing liquids or other fluent materials already applied to a surface ; Controlling means therefor; Control of the thickness of a coating by spreading or distributing liquids or other fluent materials already applied to the coated surface
    • B05C11/08Spreading liquid or other fluent material by manipulating the work, e.g. tilting
    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/16Coating processes; Apparatus therefor
    • G03F7/162Coating on a rotating support, e.g. using a whirler or a spinner
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B05SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05CAPPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C13/00Means for manipulating or holding work, e.g. for separate articles
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B05SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05CAPPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C9/00Apparatus or plant for applying liquid or other fluent material to surfaces by means not covered by any preceding group, or in which the means of applying the liquid or other fluent material is not important
    • B05C9/08Apparatus or plant for applying liquid or other fluent material to surfaces by means not covered by any preceding group, or in which the means of applying the liquid or other fluent material is not important for applying liquid or other fluent material and performing an auxiliary operation
    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/26Processing photosensitive materials; Apparatus therefor
    • G03F7/30Imagewise removal using liquid means
    • G03F7/3021Imagewise removal using liquid means from a wafer supported on a rotating chuck
    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/26Processing photosensitive materials; Apparatus therefor
    • G03F7/42Stripping or agents therefor
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68714Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
    • H01L21/68728Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a plurality of separate clamping members, e.g. clamping fingers

Abstract

A spin treatment apparatus according to an embodiment performs a treatment while rotating a substrate and includes: at least three clamp pins configured to contact an outer peripheral surface of the substrate and clamp the substrate; rotatable pin rotators provided for the respective clamp pins and each configured to retain the corresponding clamp pin at a position offset from a rotation axis of the pin rotator parallel with a rotation axis of the substrate; magnet gears provided for the respective pin rotators around outer peripheral surfaces thereof and each having a magnetic-pole part formed spirally about the rotation axis of the pin rotator; rotation magnets provided for the respective magnet gears and positioned to attract and be attracted by the magnetic-pole part of the corresponding magnet gear; and a movement mechanism configured to move the rotation magnets along the rotation axes of the pin rotators.

Description

    CROSS-REFERENCE TO THE RELATED APPLICATION
  • This application is based on and claims the benefit of priority from Japanese Patent Applications No. 2013-198094, filed on Sep. 25, 2013 and No. 2014-162096, filed on Aug. 8, 2014; the entire contents of which are incorporated herein by reference.
  • FIELD
  • Embodiments discussed herein relate to a spin treatment apparatus.
  • BACKGROUND
  • A manufacturing process for a semiconductor device or a liquid crystal display device typically includes a film-forming process or a photolithography process to form a circuit pattern on a substrate such as a wafer or a glass plate. A wet process which is performed during the above processes and uses mainly liquid employs a spin treatment apparatus to subject the substrate to treatments such as a chemical treatment, a washing treatment, and a drying treatment. A spin treatment apparatus is an apparatus configured to perform a wet process by clamping the outer peripheral surface of a substrate, rotating the substrate about an axis perpendicular to the substrate at the center thereof, and supplying a treatment liquid (e.g., a chemical liquid or pure water) to the rotating substrate. Such a spin treatment apparatus generally includes a chuck mechanism configured to chuck the substrate.
  • As this chuck mechanism, multiple clamp pins are provided along the periphery of a substrate to clamp an outer peripheral portion of the substrate. The clamp pins are each integral with a rotary plate and a rotary shaft body, and provided on the rotary plate at a position offset by a certain distance from the rotation axis of the rotary shaft body. Pinions are fixed to the lower ends of the respective rotary shaft bodies, and mesh with a master gear whose rotation axis is perpendicular to the substrate at the center thereof. Hence, when the master gear rotates, the individual rotation shaft bodies rotate, causing the clamp pins to eccentrically rotate. The substrate can be clamped by these clamp pins.
  • Besides such a gear-type chuck mechanism, a magnet-type chuck mechanism has also been developed. In this magnet-type chuck mechanism, a circular plate is provided at the lower end of each rotary shaft body in place of the pinion described above, and the circular plate has a magnet perpendicular to the rotary shaft body. Bringing another magnet close to this circular plate causes the magnet on the circular plate to rotate with the circular plate due to the attractive force of the other magnet. The rotation of the magnet rotates the rotary shaft body, rotating the clamp pin eccentrically. This magnet-type chuck mechanism is capable of clamping the substrate with the clamp pins like the gear-type chuck mechanism. To unclamp the substrate, a magnet different from the other magnet described above is brought close to an unclamp position which is opposite from a clamp position described above.
  • However, these chuck mechanisms have their drawbacks. Specifically, the gear-type chuck mechanism reliably performs chuck operation with the clamp pins, but might generate dust due to wear of the gears. The magnet-type chuck mechanism generates no dust, but has the following problem. Specifically, due to the configuration in which the attractive force of another magnet causes the magnet on the circular plate to rotate with the circular plate, the distance between the magnetic poles attracting each other varies during the rotation of the magnet. Since the attractive force between the magnetic poles is inversely proportional to the square of the distance between the magnetic poles, decrease in the distance between the magnetic poles drastically increases the attractive force therebetween. For this reason, when the distance between the magnetic poles fluctuates, the clamp pins tend not to rotate uniformly. The positioning of the substrate is performed based on a single one of the clamp pins which has the smallest distance between the magnetic poles, and such non-uniformity in the pin rotation might cause displacement of the substrate from a predetermined position when clamped. It is therefore demanded to suppress both the generation of dust and the displacement of a substrate when clamped.
  • BRIEF DESCRIPTION OF THE DRAWINGS
  • FIG. 1 is a sectional view showing the schematic configuration of a spin treatment apparatus according to a first embodiment.
  • FIG. 2 is a perspective view showing the schematic configuration of a chuck mechanism according to the first embodiment.
  • FIG. 3 is a diagram illustrating the positional relation between a magnet gear and rotation magnets according to the first embodiment.
  • FIG. 4 is a plan view showing the positional relation between the magnet gear and the rotation magnets according to the first embodiment.
  • FIG. 5 is a sectional view showing a state where all clamp pins of the spin treatment apparatus according to the first embodiment are out of substrate-clamping operation.
  • FIG. 6 is a sectional view showing a state where the entire clamp pins of the spin treatment apparatus according to the first embodiment are in substrate-clamping operation.
  • FIG. 7 is a sectional view showing a state where one set of clamp pins of the spin treatment apparatus according to the first embodiment is in substrate-clamping operation.
  • FIG. 8 is a sectional view showing a state where the other set of clamp pins of the spin treatment apparatus according to the first embodiment is in substrate-clamping operation.
  • FIG. 9 is a sectional diagram showing the schematic configuration of a spin treatment apparatus according to a second embodiment.
  • FIG. 10 is a diagram illustrating the positional relation between a magnet gear and a planar magnet according to the second embodiment.
  • FIG. 11 is a sectional diagram showing the schematic configuration of a spin treatment apparatus according to a third embodiment.
  • DETAILED DESCRIPTION
  • According to one embodiment, a spin treatment apparatus that performs a treatment while rotating a substrate, the apparatus includes: at least three clamp pins configured to come into contact with an outer peripheral surface of the substrate and clamp the substrate; a plurality of rotatable pin rotators provided for the respective clamp pins and each configured to retain the corresponding clamp pin at a position offset from a rotation axis of the pin rotator which is parallel with a rotation axis of the substrate; a plurality of magnet gears provided for the respective pin rotators around outer peripheral surfaces thereof and each having a magnetic-pole part formed spirally about the rotation axis of the pin rotator; a plurality of rotation magnets provided for the respective magnet gears and positioned so as to attract and be attracted by the magnetic-pole part of the corresponding magnet gear; and a movement mechanism configured to move the plurality of rotation magnets in the direction of the rotation axes of the pin rotators.
  • Various Embodiments will be described hereinafter with reference to the accompanying drawings.
  • First Embodiment
  • A first embodiment is described with reference to FIGS. 1 to 8.
  • As shown in FIG. 1, a spin treatment apparatus 1 according to the first embodiment includes: a base body 2 serving as the base of the spin treatment apparatus 1; a cup body 3 with an open upper surface; a rotary body 4 configured to rotate inside the cup body 3; a drive motor 5 configured to rotate the rotary body 4; an annular liquid receiver 6 surrounding the rotary body 4; and a controller 7 (e.g., a microcomputer) configured to control each part.
  • The base body 2 has a plate shape, and a through-hole 2 a is formed at a center portion of a bottom surface of the base body 2. In addition, drainage tubes (not shown) configured to drain sump solution are connected to a peripheral edge portion of the base body 2 at predetermined intervals.
  • The cup body 3 has a tubular (annular) shape with an open upper surface and an open lower surface, and accommodates thereinside the rotary body 4, the liquid receiver 6, and the like. An upper end portion of the cup body 3 slants radially inward over the entire circumference. The cup body 3 can be moved up and down by an up-and-down mechanism (not shown) such as a cylinder.
  • The rotary body 4 includes: a cylindrical power transmission body 4 a configured to transmit power from the drive motor 5; multiple (e.g., six) clamp portions 4 b configured to clamp a substrate W; a rotary plate 4 c configured to retain the clamp portions 4 b; a rotation mechanism 4 d for causing the clamp portions 4 b to clamp the substrate W; and a cover 4 e configured to cover these parts.
  • The drive motor 5 includes a tubular stator 5 a and a tubular rotor 5 b rotatably inserted in the stator 5 a. The drive motor 5 is a motor serving as a drive source for rotating the substrate W clamped by the clamp portions 4 b. The drive motor 5 is electrically connected to the controller 7, and is driven as controlled by the controller 7.
  • The power transmission body 4 a is fixed to the rotor 5 b of the drive motor 5 such that the rotation axis (center axis) of the power transmission body 4 a coincides with the rotation axis of the drive motor 5. The power transmission body 4 a rotates along with the rotor 5 b. In other words, the power transmission body 4 a is rotated by the drive motor 5.
  • A stationary shaft 11 which does not rotate is provided in a space inside the power transmission body 4 a and the rotor 5 b. This stationary shaft 11 is provided with a nozzle head 12 at an upper portion thereof. A nozzle 12 a is formed at the nozzle head 12. The nozzle 12 a is configured to eject a treatment liquid (e.g., a chemical liquid or pure water) toward the back surface of the substrate W clamped by the clamp portions 4 b, and is connected to a supply pipe 13 through which the treatment liquid flows. In addition, although not shown, a nozzle for supplying a treatment liquid (e.g., a chemical liquid or pure water) to the front surface of the substrate W is also provided above the rotary body 4.
  • As shown in FIGS. 1 and 2, the clamp portions 4 b are placed at predetermined intervals, e.g. at regular intervals, circumferentially about the rotation axis of the power transmission body 4 a. When put into operation, these clamp portions 4 b implement a chuck mechanism for clamping the substrate W with the center of the substrate W being aligned with the rotation axis of the power transmission body 4 a.
  • Each clamp portion 4 b includes a clamp pin 21 configured to come into contact with the substrate W, a rotary plate 22 configured to retain the clamp pin 21 and rotate, and a pin rotator 23 configured to retain the rotary plate 22 and rotate. The clamp pin 21 is inversely tapered and is integral with the rotary plate 22 by being fixed to an upper surface of the rotary plate 22 with its center being offset from the rotation axis of the pin rotator 23 by a certain distance. The clamp pin 21 eccentrically rotates as the pin rotator 23 rotates. The pin rotator 23 is rotatably retained by a tubular support portion 24 of the rotary plate 4 c.
  • The clamp portion 4 b operates as follows. When the pin rotator 23 rotates in a direction for clamping the substrate W, the clamp pin 21 on the rotary plate 22 eccentrically rotates, coming into contact with the outer peripheral surface (end surface) of the substrate W. Likewise, the clamp pins 21 of the other clamp portions 4 b come into contact with the outer peripheral surface of the substrate W. Thus, the clamp pins 21 clamp the substrate W while aligning the center of the substrate W with the rotation axis of the power transmission body 4 a. On the other hand, when the pin rotator 23 rotates in an unclamping direction which is the opposite from the clamping direction, the clamp pin 21 on the rotary plate 22 rotates in a direction opposite to the aforementioned direction and moves away from the outer peripheral surface of the substrate W. The clamp pins 21 of the other clamp portions 4 b also move away from the outer peripheral surface of the substrate W, unclamping the clamped substrate W.
  • The rotary plate 4 c is integral with the power transmission body 4 a by being fixed to the outer peripheral surface of the power transmission body 4 a. The rotary plate 4 c rotates along with the power transmission body 4 a while retaining the clamp portions 4 b. When the rotary plate 4 c rotates along with the power transmission body 4 a as the power transmission body 4 a rotates, the clamp portions 4 b also rotate about the rotation axis of the power transmission body 4 a. The tubular support portions of the rotary plate 4 c are provided at an outer peripheral portion of the circular rotary plate 4 c at regular intervals along the circumference thereof about the rotation axis of the power transmission body 4 a.
  • The rotation mechanism 4 d includes a first rotation mechanism 31 corresponding to a set of three clamp portions 4 b which are alternate ones of the clamp portions 4 b arranged in the rotation direction of the power transmission body 4 a and a second rotation mechanism 32 corresponding to the other set of three clamp portions 4 b. In a case where there are six clamp portions 4 b, the first rotation mechanism 31 and the second rotation mechanism 32 have the same structure.
  • The first rotation mechanism 31 includes: magnet gears 31 a each provided around an outer peripheral surface of the pin rotator 23 of a corresponding one of the clamp portions 4 b; multiple rotation magnets 31 b corresponding to each of the magnet gears 31 a; a set of up-and-down arms 31 c (three up-and-down arms 31 c in this embodiment) each retaining the rotation magnets 31 b and configured to move up and down; an up-and-down ring 31 d integral with the up-and-down arms 31 c; and an up-and-down mechanism 31 e configured to move the up-and-down ring 31 d in a direction of the rotation axes of the pin rotators 23.
  • As shown in FIGS. 3 and 4, each magnet gears 31 a is a cylindrical magnet gear having north magnetic-pole parts (e.g., bands) and south magnetic-pole parts (e.g., bands) alternately arranged in a spiral manner over the cylindrical surface of the pin rotator 23. The magnet gear 31 a is, as shown in FIGS. 1 and 2, fixed to a lower portion of the outer peripheral surface of the pin rotator 23, and rotates together with the pin rotator 23. The magnet gear 31 a is attached to the pin rotator 23 such that there is no backlash or play in a direction of the rotation axis of the pin rotator 23 (a vertical direction).
  • As shown in FIGS. 3 and 4, the multiple (e.g., four) rotation magnets 31 b are arranged along the outer peripheral surface of the magnet gear 31 a at positions at which they attract the magnetic-pole parts on the surface of the magnet gear 31 a. The rotation magnets 31 b are fixed to the up-and-down arm 31 c. The rotation magnets 31 b are arranged in an edge portion of a through-hole 33 formed in the up-and-down arm 31 c, at regular intervals or at regular intervals with some angle added. In this through-hole 33, the magnet gear 31 a and the pin rotator 23 are inserted. Such rotation magnets 31 b are provided for each up-and-down arm 31 c.
  • When the rotation magnets 31 b move up in a direction of arrow A1 shown in FIG. 3, the magnet gear 31 a rotates in a direction of arrow A2 shown in FIG. 3. Since the rotation magnets 31 b and the magnetic-pole parts of the magnet gear 31 a attract each other, the rotation magnets 31 b move up while attracting the magnetic-pole parts of the magnet gear 31 a. In addition, because of the spiral arrangement of the magnetic-pole parts of the magnet gear 31 a, when the rotation magnets 31 b move up in the direction of arrow A1, the magnet gear 31 a rotate in the direction of arrow A2 to maintain the state in which the rotation magnets 31 b and the magnetic-pole parts of the magnet gear 31 a attract each other. During the rotation of the magnet gear 31 a caused by the elevation of the rotation magnets 31 b, there is no change in the distance between the magnetic poles, i.e., the distance between the magnet gear 31 a and the rotation magnets 31 b. Hence, the attractive force is maintained constant. When the rotation magnets 31 b move down in a direction opposite from arrow A1, the magnet gear 31 a rotates in a direction opposite from arrow A2.
  • Referring back to FIGS. 1 and 2, the set of up-and-down arms 31 c are connected at their base portions to the up-and-down ring 31 d which is a ring-shaped member. These up-and-down arms 31 c are supported by respective up-and-down shafts 34 fixed to the rotary plate 4 c, and are slidable relative to the up-and-down shafts 34. The up-and-down shafts 34 are attached to the rotary plate 4 c in such a manner as to be parallel with the rotation axis of the power transmission body 4 a. The up-and-down shafts 34 allow the up-and-down arms 31 c to move up and down with their postures being maintained to be perpendicular to the rotation axis of the power transmission body 4 a. A clamp spring 35 is provided to each of the up-and-down shafts 34. The clamp spring 35 is located between the rotary plate 4 c and the corresponding up-and-down arm 31 c and presses the up-and-down arm 31 c down with a certain spring force.
  • The up-and-down ring 31 d is a ring-shaped member that unites and supports the set of up-and-down arms 31 c. The up-and-down ring 31 d has the power transmission body 4 a inserted therethrough and is movable in the direction of the rotation axis of the power transmission body 4 a (the vertical direction) along the outer peripheral surface of the power transmission body 4 a. The up-and-down ring 31 d unites the three up-and-down arms 31 c, and at the same time, enables them to move (up and down).
  • The up-and-down mechanism 31 e has a cylinder 36 such as an air cylinder, a cylinder shaft 37 configured to be moved up and down by the cylinder 36, and an up-and-down roller 38 attached to a tip portion of the cylinder shaft 37. The cylinder 36 is fixed to the base body 2. The up-and-down roller 38 is provided at an end portion of the cylinder shaft 37 so that the up-and-down roller 38 comes into contact with the lower surface of the up-and-ring 31 d when moving up. The up-and-down ring 31 d moves up in the direction of the rotation axis of the power transmission body 4 a when the up-and-down roller 38 moves up and contacts the lower surface of the up-and-down ring 31 d to push the up-and-down ring 31 d up in the direction of the rotation axis of the power transmission body 4 a.
  • When the up-and-down mechanism 31 e elevates the up-and-down ring 31 d in the direction of the rotation axis of the power transmission body 4 a, the set of (three) up-and-down arms 31 c moves up in the direction of the rotation axis of the power transmission body 4 a. Thus, the rotation magnets 31 b fixed to each of the up-and-down arms 31 c move up while maintaining the state of attracting the magnetic-pole parts of the magnet gear 31 a, as described earlier. When the rotation magnets 31 b move up, the magnet gear 31 a rotates to maintain the state of attracting the rotation magnets 31 b. In this event, the distance between the magnetic poles, i.e., the distance between the magnet gear 31 a and the rotation magnets 31 b does not change. Hence, the magnet gear 31 a can rotate while maintaining a constant attractive force, allowing the corresponding clamp pin 21 to rotate at a constant velocity.
  • The attractive force between the magnet gear 31 a and the rotation magnets 31 b is adjusted by changing, for example, the number and arrangement of the magnets so that, when the up-and-down arm 31 c is lowered by being pushed down by the force of the compressed clamp spring 35 and thereby lowers the rotation magnets 31 b, the magnet gear 31 a may rotate while constantly maintaining the state (relation) in which the magnet gear 31 a and the rotation magnets 31 b moving down attract and face each other. Thereby, while the magnet gear 31 a rotates when the rotation magnets 31 b move down, the magnet gear 31 a and the rotation magnets 31 b constantly maintain the state of attracting and facing each other. For this reason, the up-and-down arm 31 c moves down due to the spring force of the clamp spring 35, and the rotation magnets 31 b accordingly move down. In this event, the clamp spring 35 gradually extends as the up-and-down arm 31 c moves down, pushing the up-and-down arm 31 c down with less force. The up-and-down arm 31 c is designed to eventually stop moving down once this force of the clamp spring 35 pushing the up-and-down arm 31 c becomes smaller than the attractive force acting between the magnet gear 31 a and the rotation magnets 31 b (the attractive force constantly maintaining the state in which the magnet gear 31 a and the rotation magnets 31 b attract and face each other). In this way, the spring force (pushing force) of the clamp springs 35 pushing the up-and-down arms 31 c down can be used as clamping force with which the clamp pins 21 clamp the substrate W.
  • Moreover, the set of up-and-down arms 31 c on which the force of the clamp springs 35 are acting can move up when the up-and-down ring 31 d is elevated by the up-and-down mechanism 31 e. Then, the rotation magnets 31 b fixed to the set of up-and-down arms 31 c move up to rotate the magnet gears 31 a, which consequently rotates the clamp pins 21 which is clamping the substrate W by use of the force of the clamp springs 35. The rotation of the clamp pins 21 unclamps the substrate W. Note that the force of the clamp springs 35 pushing down the up-and-down arms 31 c acts as the clamping force. Herein, to unclamp the substrate W, the up-and-down mechanism 31 e elevates the up-and-down ring 31 d, compressing the clamp springs 35 and elevating the set of up-and-down arms 31 c to thereby rotate the three clamp pins 21.
  • Conversely, when the up-and-down mechanism 31 e lowers the up-and-down ring 31 d, the set of up-and-down arms 31 c moves down, and consequently the magnet gears 31 a rotate reversely, bringing the clamp pins 21 into contact with the end portion of the substrate W. When the clamp pins 21 clamp the substrate W, the set of up-and-down arms 31 c stops moving down, and the clamp pins 21 stop while applying force to the substrate W with the pressure of the clamp springs 35. At the same time that the up-and-down mechanism 31 e lowers the up-and-down ring 31 d, the clamp springs 35 extend to generate force of pushing the set of up-and-down arms 31 c down. The magnet gears 31 a are rotated by this force, and the three clamp pins 21 eccentrically rotate to come into compact with the substrate W and clamp the substrate W. When the clamp pins 21 come into contact with the substrate W, the clamp springs 35 do not extend all the way, but stop halfway.
  • Since the cylinder 36 is configured to elevate or lower the cylinder shaft 37 by a constant amount irrespective of whether the set of the up-and-down arms 31 c moves down and stops. Hence, the cylinder shaft 37 stops with a gap existing between the up-and-down ring 31 d and the up-and-down roller 38. In other words, when the cylinder shaft 37 is at the lowermost position, the up-and-down roller 38 is not in contact with the up-and-down ring 31 d, but is separated from the lower surface of the up-and-down ring 31 d. Thereby, during the rotation of the rotary body 4, the up-and-down ring 31 d can rotate smoothly without touching the up-and-down roller 38. In addition, it is also possible to elevate the up-and-down ring 31 d during the rotation of the rotary body 4 by bringing the up-and-down roller 38 into contact with the lower surface of the up-and-down ring 31 d. Thus, the clamp pins 21 can be put into or out of operation irrespective of whether the rotary body 4 is rotating or is stopped.
  • The second rotation mechanism 32 includes: magnet gears 32 a each provided on an outer peripheral surface of the pin rotator 23 of a corresponding one of the clamp portions 4 b; multiple rotation magnets 32 b corresponding to each of the magnet gears 32 a; a set of up-and-down arms 32 c (three up-and-down arms 32 c in this embodiment) each retaining the rotation magnets 32 b and configured to move up and down; an up-and-down ring 32 d integral with the up-and-down arms 32 c; and an up-and-down mechanism 32 e configured to move the up-and-down ring 32 d in the direction of the rotation axes of the pin rotators 23. Since the second rotation mechanism 32 has the same configuration as the first rotation mechanism 31, a description of the portions of the second rotation mechanism 32 is omitted.
  • Note that the set of up-and-down arms 31 c and the up-and-down ring 31 d of the first rotation mechanism 31 function as a retainer, and this retainer and the up-and-down mechanism 31 e function as a movement mechanism for moving the rotation magnets 31 b in the direction of the rotation axis of the corresponding pin rotator 23. Similarly, the set of up-and-down arms 32 c and the up-and-down ring 32 d of the second rotation mechanism 32 function as a retainer, and this retainer and the up-and-down mechanism 32 e function as a movement mechanism for moving the rotation magnets 32 b in the direction of the rotation axis of the corresponding pin rotator 23.
  • The number of the spiral magnetic-pole parts (e.g., bands) and the number of the rotation magnets 31 b in the first rotation mechanism 31 or the second rotation mechanism 32 are not limited and each may be one as long as the pin rotators 23 can be rotated by the magnet gears 31 a or 32 a. It is however desirable to have two or more combinations of the spiral magnetic-pole part and the rotation magnet 31 b to improve the stability of the rotation of the pin rotator 23.
  • The cover 4 e is a case with an open lower surface, and covers the aforementioned parts configured to rotate with the rotation of the power transmission body 4 a in order to prevent occurrence of turbulent flow. The cover 4 e has an opening portion 41 configured to allow the treatment liquid ejected from the nozzle 12 a of the nozzle head 12 to pass up therethrough, and multiple through-holes 42 in which the rotary plates 22 of the clamp portions 4 b are inserted.
  • The liquid receiver 6 includes an annular movable liquid receiver (first liquid receiver) 6 a and an annular stationary liquid receiver (second liquid receiver) 6 b. The movable liquid receiver 6 a and the stationary liquid receiver 6 b are provided to surround the rotary body 4 with their centers coinciding with the rotation axis of the rotary body 4, i.e., the rotation axis of the power transmission body 4 a.
  • The movable liquid receiver 6 a has an annular inner wall 51, an annular outer wall 52, and an annular upper-surface wall 53 connecting the upper end portions of the inner wall 51 and the outer wall 52 together. The upper end portion of the inner wall 51 slants radially inward over the entire circumference. The annular inner wall 51 and outer wall 52 have an annular space of a predetermined width in between.
  • An up-and-down mechanism (not shown) such as a cylinder enables the movable liquid receiver 6 a to move up and down, or specifically, between a liquid receiving position (see FIG. 1) at which its surface on the rotary body 4 side (inner surface) receives liquid from the substrate W and a lid-closing position at which the movable liquid receiver 6 a prevents ingress of liquid to the stationary liquid receiver 6 b. The upper end portion of the movable liquid receiver 6 a is higher than the height of the substrate W on the rotary body 4 at the liquid receiving position and is lower than the height of the substrate W on the rotary body 4 at the lid-closing position. Hence, to collect a treatment liquid, the movable liquid receiver 6 a moves up to the liquid-receiving position to receive the liquid from the substrate W on the rotary body 4 and passes the liquid into the stationary liquid receiver 6 b.
  • The stationary liquid receiver 6 b has an annular inner wall 61, an annular outer wall 62, and a bottom-surface wall 63 connecting the lower end portions of the inner wall 61 and the outer wall 62 together. Multiple collection pipes 63 a for collecting a chemical liquid are connected to the bottom-surface wall 63 along the circumference thereof at predetermined intervals. The annular inner wall 61 and outer wall 62 have an annular space of a predetermined width in between.
  • The stationary liquid receiver 6 b is placed such that the inner wall 51 of the movable liquid receiver 6 a and the outer peripheral wall of the cover 4 e are located between the annular inner wall 61 and the annular outer wall 62. The stationary liquid receiver 6 b can collect the liquid received by the inner surface of the movable liquid receiver 6 a. More specifically, the stationary liquid receiver 6 b can collect the liquid which has hit the inner surface of the movable liquid receiver 6 a, in the space between the two annular walls: the inner wall 61 and the outer wall 62.
  • The stationary liquid receiver 6 b has a structure in which the movable liquid receiver 6 a which is down at the lid-closing position serves as a lid closing the opening of the stationary liquid receiver 6 b. When down at the lid-closing position to serve as the lid closing the opening of the stationary liquid receiver 6 b, the movable liquid receiver 6 a prevents liquid from flowing into the stationary liquid receiver 6 b. Since the annular outer wall 62 is covered by the outer wall 52 of the movable liquid receiver 6 a to ensure the prevention of liquid ingress to the stationary liquid receiver 6 b, mixing of liquids can be prevented.
  • Next, spin treatment operation of the spin treatment apparatus 1 configured as above is described.
  • The spin treatment operation has the following steps: placing the substrate W onto the clamp pins 21 as shown in FIG. 5, clamping the substrate W with all the clamp pins 21 before treatment as shown in FIG. 6, putting a set of clamp pins 21 out of clamping operation during the treatment as shown in FIG. 7, putting another set of clamp pins 21 out of clamping operation during the treatment as shown in FIG. 8, and putting all the clamp pins 21 out of clamping operation after the treatment as shown in FIG. 5.
  • As shown in FIG. 5, in the step of placing the substrate W on the clamp pins 21, all the clamp pins 21 of the clamp portions 4 b are out of operation of clamping the substrate W. Then, a conveyance mechanism (not shown) such as a robot with a robot hand places the substrate W onto slanted surfaces of the clamp pins 21. In this state, the up-and-down ring 31 d and the up-and-down ring 32 d are up by elevation of the up-and-down rollers 38 of the up-and-down mechanism 31 e and the up-and-down mechanism 32 e, respectively, so that the two sets of up-and-down arms 31 c and 32 c are up in the direction of the rotation axis. Thus, the rotation magnets 31 b and 32 b fixed to the two sets of up-and-down arms 31 c and 32 c have also been moved up to cause the magnet gears 31 a and 32 a to rotate a certain amount. The clamp pins 21 have rotated along with rotation of the pin rotators 23 and the rotary plates 22, and are stopped at positions for unclamping the substrate W.
  • Next, as shown in FIG. 6, in the step of clamping the substrate W with all the clamp pins 21 before treatment, the up-and-down roller 38 of the up-and-down mechanism 31 e and the up-and-down roller 38 of the up-and-down mechanism 32 e move down to lower the up-and-down ring 31 d and the up-and-down ring 32 d, respectively, from the aforementioned state in FIG. 5. Thereby, the two sets of up-and-down arms 31 c and 32 c move down in the direction of the rotation axis. Thereby, the rotation magnets 31 b fixed to the two sets of up-and-down arms 31 c and 32 c also move down, consequently rotating the magnet gears 31 a and 32 a. Then, all the clamp pins 21 are rotated by the rotation of the pin rotators 23 and the rotary plates 22, and stop after clamping the substrate W with the clamping force of the clamp springs 35. At the same time that the up-and-down mechanisms 31 e and 32 e lower the up-and-down rings 31 d and 32 d, the clamp springs 35 extend, exerting a force pushing down the two sets of up-and-down arms 31 c and 32 c. By using this pushing force to rotate the magnet gears 31 a, the six clamp pins 21 eccentrically rotate to come into contact with the substrate W, and clamp the substrate W. When the clamp pins 21 come into contact with the substrate W, the clamp springs 35 do not extend all the way, but stop halfway.
  • Here, all the clamp pins 21 eccentrically rotate and come into contact with the outer peripheral surface of the substrate W to clamp the substrate W. When the up-and-down rings 31 d and 32 d move down, the set of up-and-down arms 31 c and the set of up-and-down arms 32 c integral with the respective up-and-down rings 31 d and 32 d synchronously move down while keeping their horizontal posture. Thus, the clamp pins 21 (three clamp pins 21 in this embodiment) corresponding to each of the set of up-and-down arms 31 c and the set of up-and-down arms 32 c also synchronously rotate. Thereby, the substrate W is clamped with all the clamp pins 21 with the center of the substrate W being aligned with the rotation axis (the substrate W is centered with all the clamp pins 21). Note that, for the clamping of the substrate W, the up-and-down mechanisms 31 e and 32 e may be operated at the same time in synchronization, or may be actuated at different timings.
  • Next, as shown in FIG. 7, in the step of putting one set of the clamp pins 21 out of clamping operation during the treatment, the up-and-down roller 38 of the up-and-down mechanism 31 e moves up to elevate the up-and-down ring 31 d from the aforementioned state in FIG. 6, thereby elevating the set of up-and-down arms 31 c in the direction of the rotation axis. Thus, the rotation magnets 31 b fixed to the set of up-and-down arms 31 c also move up to cause the magnet gears 31 a to rotate a certain amount. The pin rotators 23 and the rotary plates 22 are thereby rotated to rotate the clamp pins 21, and the clamp pins 21 are stopped at positions for unclamping the substrate W. When the one set of clamp pins 21 is put out of clamping operation in this way, the drive motor 5 rotates the rotary body 4, and a treatment liquid (e.g., a chemical liquid or pure water) is started to be supplied to the upper surface and the lower surface of the rotating substrate W. Note that the one set of clamp pins 21 can be put out of clamping operation at various timings. The one set of clamp pins 21 may be put out of clamping operation before the substrate W is rotated or after the rotation of the substrate W stabilizes.
  • During the supply of the treatment liquid, the treatment liquid supplied to the upper and lower surfaces of the substrate W flows radially outward of the substrate W and flies from the outer peripheral edge of the substrate W due to the centrifugal force and airflows generated by the rotation. In this event, by moving the movable liquid receiver 6 a (up and down), the flow channel of the treatment liquid can be switched between a collection flow channel for collecting the treatment liquid and a drainage flow channel for draining the treatment liquid. When the liquid flow channel is the collection flow channel, i.e., the movable liquid receiver 6 a is up at the liquid receiving position to collect the treatment liquid (see FIG. 1), liquid flying from the end portion of the substrate W hits the inner surface of the movable liquid receiver 6 a, flows along the inner surface, is collected in the stationary liquid receiver 6 b, and is then collected through the collection pipes 63 a. On the other hand, when the liquid flow channel is the drain flow channel, i.e., the movable liquid receiver 6 a is down at the lid-closing position to drain the treatment liquid, liquid flying from the end portion of the substrate W hits the inner peripheral surface of the cup body 3, flows through a flow channel extending from the cup body 3 to the base body 2, and is then drained through the drainage tubes.
  • Thereafter, as shown in FIG. 8, in the step of putting the other set of clamp pins 21 out of clamping operation during the treatment, the up-and-down roller 38 of the up-and-down mechanism 31 e moves down to lower the up-and-down ring 31 d from the aforementioned state in FIG. 7, thereby lowering the set of up-and-down arms 31 c in the direction of the rotation axis. Thus, the rotation magnets 31 b fixed to the set of up-and-down arms 31 c also move down to cause the magnet gears 31 a to rotate. The pin rotators 23 and the rotary plates 22 thereby rotate to rotate the clamp pins 21, and the clamp pins 21 are stopped after clamping the substrate W with the clamping force of the clamp springs 35. At the same time that the up-and-down mechanism 31 e lowers the up-and-down ring 31 d, the clamp springs 35 extend, exerting a force pushing down the one set of up-and-down arms 31 c. By using this pushing force to rotate the magnet gears 31 a, the three clamp pins 21 eccentrically rotate to come into contact with the substrate W, and clamp the substrate W. When the clamp pins 21 come into contact with the substrate W, the clamp springs 35 do not extend all the way, but stop halfway.
  • Next, the up-and-down roller 38 of the up-and-down mechanism 32 e moves up to elevate the up-and-down ring 32 d, thereby elevating the set of up-and-down arms 32 c in the direction of the rotation axis. The rotation magnets 32 b fixed to the set of up-and-down arms 32 c thereby move up, causing the magnet gears 32 a to rotate a certain amount. The pin rotators 23 and the rotary plates 22 thereby rotate to rotate the clamp pins 21, and the clamp pins 21 are stopped at positions for unclamping the substrate W. Although the other set of clamp pins 21 is thus put out of clamping operation, the rotary body 4 is still being rotated by the drive motor 5 with the treatment liquid continuing being supplied to the upper (front) and lower (back) surfaces of the rotating substrate W.
  • When a liquid treatment and a rinsing treatment with pure water are all finished, the supply of the treatment liquid is stopped, and as shown in FIG. 6, the substrate W is once again clamped with all the clamp pins 21. To be more specific, the up-and-down roller 38 of the up-and-down mechanism 32 e moves down to lower the up-and-down ring 32 d from the aforementioned state in FIG. 8, thereby lowering the set of up-and-down arms 32 c in the direction of the rotation axis. The rotation magnets 32 b fixed to the set of up-and-down arms 32 c thereby move down, causing the magnet gears 32 a to rotate. The pin rotators 23 and the rotary plates 22 thereby rotate to rotate the clamp pins 21, and the clamp pins 21 are stopped after clamping the substrate W with the clamping force of the clamp springs 35. At the same time that the up-and-down mechanism 32 e lowers the up-and-down ring 32 d, the clamp springs 35 extend, exerting a force pushing down the set of up-and-down arms 32 c. By using this pushing force to rotate the magnet gears 32 a, the three clamp pins 21 eccentrically rotate to come into contact with the substrate W, and clamp the substrate W. When the clamp pins 21 come into contact with the substrate W, the clamp springs 35 do not extend all the way, but stop halfway.
  • Thereafter, the rotary body 4 rotates at a speed higher than that during the liquid supply stage (spin dry). After a predetermined period of dry treatment, the substrate W is stopped rotating while maintaining the aforementioned state shown in FIG. 6. Finally, after the rotation of the substrate W is stopped, all the clamp pins 21 are put out of operation of clamping the substrate W as shown in FIG. 5. In this unclamping step, the up-and-down roller 38 of the up-and-down mechanism 31 e and the up-and-down roller 38 of the up-and-down mechanism 32 e move up to elevate the up-and-down ring 31 d and the up-and-down ring 32 d, respectively, so that the two sets of up-and-down arms 31 c and 32 c move up in the direction of the rotation axis. Thereby, the rotation magnets 31 b and 32 b fixed to those two sets of up-and-down arms 31 c and 32 c also move up to cause the magnet gears 31 a and 32 a to rotate a certain amount. The pin rotators 23 and the rotary plates 22 thereby rotate to rotate the clamp pins 21, and the clamp pins 21 stop at the positions for unclamping the substrate W. In this way, all the clamp pins 21 are put out of clamping operation. After being unclamped, the substrate W on the slanted surfaces of the clamp pins 21 is conveyed by the aforementioned conveyance mechanism.
  • In such spin treatment steps, when the clamp pins 21 are put in or out of clamping operation, the magnet gears 31 a or 32 a rotate while maintaining a constant attractive force between the magnetic poles because there is no changed in the distance between the magnetic poles, i.e., the distance between each magnet gear 31 a and the rotation magnets 31 b and the distance between each magnet gear 32 a and the rotation magnets 32 b. For this reason, the clamp pins 21 can rotate at a constant velocity. The even rotation of the clamp pins 21 prevents the substrate W from being offset from its predetermined position, enabling precise centering of the substrate W.
  • By lowering the two sets of up-and-down arms 31 c and 32 c separately (on a set-by-set basis), the alternately-located three clamp pins 21 are synchronized to be able to clamp the substrate W with the substrate W being centered. The six clamp pins 21 form two sets of three clamp pins 21, each set functioning as a three-claw clamp. Conversely, by elevating one of the two sets of up-and-down arms 31 c and 32 c, the alternately-located three clamp pins 21 corresponding to that set can be put out of clamping operation. Hence, even when the substrate W is rotating, half of the clamp pins 21 can change from the clamping state to the unclamping state and from the unclamping state to the clamping state alternately. During rotation of the substrate W, the substrate W must be clamped with a constant clamping force. Hence, when the substrate W is clamped with one of the groups of clamp pins 21 and unclamped with the other group of clamp pins 21, the treatment liquid can be spread over to the contact portions between the substrate W and the clamp pins 21 to prevent the substrate W from remaining untreated partially.
  • The mechanism for putting the clamp pins 21 into and out of operation is achieved independent of the mechanism for rotating the substrate W, and moreover, a mechanism for transforming linear motion into rotation can be achieved in a contactless manner. To be more specific, a simple mechanism is achieved, which is capable of putting the clamp pins 21 into and out of operation from the non-rotating side even during rotation of the substrate W, and of implementing the function of moving the clamp pins 21 away from the substrate reliably when unclamping the substrate W and the function of aligning the center of the substrate W with the center of rotation when clamping the substrate W.
  • As described above, according to the first embodiment, the clamp pins 21 are rotated by using the magnet gears 31 a (or 32 a) and the rotation magnets 31 b (or 32 b), i.e., by magnet-type pin rotation. Thus, generation of dust can be suppressed. Further, during the pin rotation, the distance between the magnetic poles, i.e., the distance between each magnet gear 31 a (or 32 a) and the rotation magnets 31 b (or 32 b) is maintained to be constant. Thus, the clamp pins 21 can be rotated evenly, preventing the substrate W from being offset from its predetermined position when clamped.
  • Second Embodiment
  • With reference to FIGS. 9 and 10, a second embodiment is described.
  • The second embodiment is basically the same as the first embodiment. Hence, only the difference between the first embodiment and the second embodiment (the structure of the rotation magnets 31 b and 32 b) is described. Portions in the second embodiment that are the same as those in the first embodiment are denoted by the same reference numerals as those used in the first embodiment, and are not described again here.
  • As shown in FIG. 9, a spin treatment apparatus 1 according to the second embodiment has a rotation magnet 31 b provided to a tip end portion of each of the up-and-down arms 31 c, and a rotation magnet 32 b to a tip end portion of each of the up-and-down arms 32 c. The rotation magnet 31 b and the rotation magnet 32 b have the same structure; therefore, the rotation magnet 32 b is not described. The up-and-down arms 31 c and 32 c do not have the through-holes 33 provided in the first embodiment.
  • As shown in FIG. 10, the rotation magnet 31 b is a planar magnet having north magnetic-pole parts (e.g., bands) and south magnetic-pole parts (e.g., bands) arranged alternately vertically. This planar magnet has a plate-shaped structure in which multiple (e.g., four) magnetic-pole parts are arranged on a plane parallel to the spiral magnetic-pole parts (slanted magnetic-pole parts) of the magnet gear 31 a, in a slanted manner to match the slanted magnetic-pole parts of the magnet gear 31 a.
  • When the planar magnet moves up in a direction of arrow A1 shown in FIG. 10, the magnet gear 31 a rotates in a direction of arrow A2 shown in FIG. 10. Since the planar magnet and the magnetic-pole parts of the magnet gear 31 a attract each other, the planar magnet moves up while maintaining the state of attracting and being attracted by the magnetic-pole parts of the magnet gear 31 a. The spiral arrangement of the magnetic-pole parts of the magnet gear 31 a causes the magnet gear 31 a to rotate in the direction of arrow A2 to maintain the attracting state as the planar magnet moves up in the direction of arrow A1. The rotation of the magnet gear 31 a caused by the elevation of the planar magnet is performed with a constant attractive force being maintained because there is no change in the distance between the magnetic poles, i.e., the distance between the planar magnet and each magnet gear 31 a. When the planar magnet moves down in a direction opposite to the one indicated by arrow A1, the magnet gear 31 a rotates in a direction opposite to the one indicated by arrow A2.
  • As described above, the second embodiment can offer similar advantageous effects to those offered by the first embodiment. Specifically, the clamp pins 21 are rotated by using the magnet gears 31 a (or 32 a) and the rotation magnets 31 b (or 32 b) which are the planar magnets, i.e., by magnet-type pin rotation. Thus, generation of dust can be suppressed. Further, during the pin rotation, the distance between the magnetic poles, i.e., the distance between each magnet gear 31 a (or 32 a) and the rotation magnet 31 b (or 32 b) is maintained to be constant. Thus, the clamp pins 21 can be rotated evenly, preventing the substrate W from being offset from its predetermined position when clamped.
  • In the first and second embodiments, power of clamping the substrate W is determined by the magnetic force or the spring force (power with which the clamp springs 35 push down the up-and-down arms 31 c, 32 c), and the position of clamping the substrate W is determined by the height at which the up-and-down arms 31 c or 32 c stop. For these reasons, it is possible to check whether the substrate W is being clamped properly or not by detecting the position of the height of the up-and-down arms 31 c or 32 c. By permitting half of the clamp pins 21 to be put out of operation only if it has been checked that the substrate W is being clamped properly, troubles can be prevented, such as displacement of the substrate W caused when the substrate W is being clamped with insufficient power when the clamp pins 21 are put out of operation. Accordingly, troubles caused by performing a treatment with the substrate W being clamped with insufficient power can be prevented by having a sensor configured to detect the height of the up-and-down arms 31 c or 32 c or the up-and-down ring 31 d or 32 d and a judgment unit (the controller 7) configured to judge, based on the height detected by the sensor, whether the substrate W is being properly clamped with the clamp pins 21.
  • In addition, although a disc-shaped substrate such as a circular wafer is used as the substrate W to be subjected to treatments in the first or second embodiment, the shape of the substrate W is not limited. For example, the substrate W to be subjected to treatments may be a rectangular glass substrate, such as a liquid crystal panel. This case also requires at least three clamp pins 21. It is however preferable to have four clamp pins 21 to improve the stability of clamping the substrate W. Furthermore, in a case where two sets of four clamp pins 21 are provided, the substrate W can be clamped by those sets alternately during treatment, as in the case described above.
  • Third Embodiment
  • With reference to FIG. 11, a third embodiment is described.
  • The third embodiment is basically the same as the first embodiment. Hence, only the difference between the first embodiment and the third embodiment (an arm movement mechanism) is described. Portions in the third embodiment that are the same as those in the first embodiment are denoted by the same reference numerals as those used in the first embodiment, and are not described again here.
  • As shown in FIG. 11, in a spin treatment apparatus 1 according to the third embodiment, the up-and-down arms 31 c or 32 c for one or two clamp pins (chuck pins) 21 are each configured as a movement up-and-down arm 101 which can move up and down independently of and in parallel with the other up-and-down arms. The movement up-and-down arm 101 is pushed by a spring 103 so as to be able to move independently of and in parallel with the other up-and-down arms along a slide shaft 102 fixed to the up-and-down ring 32 d. A rotary stopper shaft 104 is fixed to the magnet gear 32 a and rotates together with the magnet gear 32 a. A stationary stopper shaft 105 is also provided so that the substrate W clamped by the clamp pins 21 can be positioned near the center position. The rotary stopper shaft 104 and the stationary stopper shaft 105 function as a mechanism for positioning and stopping the movement up-and-down arm 101.
  • By the addition of such a configuration, the magnet gear 32 a can rotate and move the clamp pin 21 until the rotary stopper shaft 104 hits the stationary stopper shaft 105. Once the rotary stopper shaft 104 hits the stationary stopper shaft 105, the magnet gear 32 a stops rotating so that the movement up-and-down arm 101 stops moving down. Meanwhile, the other up-and-down arms keep moving down to rotate the magnet gears 32 a. Thus, the substrate W is pushed by the other clamp pins 21 at the position determined by the stopped clamp pin 21. Addition of this mechanism allows the substrate W to be placed at a predetermined position. Note that such a mechanism can be installed for one clamp pin 21 or two clamp pins 21 not opposed to each other with the substrate W in between.
  • As described above, the third embodiment can offer similar advantageous effects to those offered by the first embodiment. Moreover, the addition of the mechanism according to the third embodiment enables the substrate W to be positioned more precisely, so that the substrate W can be reliably prevented from being displaced when clamped.
  • While certain embodiments have been described, these embodiments have been presented by way of example only, and are not intended to limit the scope of the inventions. Indeed, the novel embodiments described herein may be embodied in a variety of other forms; furthermore, various omissions, substitutions and changes in the form of the embodiments described herein may be made without departing from the spirit of the inventions. The accompanying claims and their equivalents are intended to cover such forms or modifications as would fall within the scope and spirit of the inventions.

Claims (9)

What is claimed is:
1. A spin treatment apparatus that performs a treatment while rotating a substrate, the apparatus comprising:
at least three clamp pins configured to come into contact with an outer peripheral surface of the substrate and clamp the substrate;
a plurality of rotatable pin rotators provided for the respective clamp pins and each configured to retain the corresponding clamp pin at a position offset from a rotation axis of the pin rotator which is parallel with a rotation axis of the substrate;
a plurality of magnet gears provided for the respective pin rotators around outer peripheral surfaces thereof and each having a magnetic-pole part formed spirally about the rotation axis of the pin rotator;
a plurality of rotation magnets provided for the respective magnet gears and positioned so as to attract and be attracted by the magnetic-pole part of the corresponding magnet gear; and
a movement mechanism configured to move the plurality of rotation magnets in the direction of the rotation axes of the pin rotators.
2. The spin treatment apparatus according to claim 1, wherein
the movement mechanism includes
a retainer configured to retain the plurality of rotation magnets and capable of moving in the direction of the rotation axes of the pin rotators, and
an up-and-down mechanism configured to move the retainer in the direction of the rotation axes of the pin rotators.
3. The spin treatment apparatus according to claim 2, wherein
the movement mechanism has a function of positioning and stopping the retainer.
4. The spin treatment apparatus according to claim 1, wherein
six clamp pins are provided as the clamp pins, and alternate three of the six clamp pins in a peripheral direction of the substrate form one set,
the rotation magnets are provided in groups for the respective sets of the clamp pins, and
the movement mechanism moves the rotation magnets for the sets of the clamp pins on a set-by-set basis in the direction of the rotation axes of the pin rotators.
5. The spin treatment apparatus according to claim 2, wherein
six clamp pins are provided as the clamp pins, and alternate three of the six clamp pins in a peripheral direction of the substrate form one set,
the rotation magnets are provided in groups for the respective sets of the clamp pins, and
the movement mechanism moves the rotation magnets for the sets of the clamp pins on a set-by-set basis in the direction of the rotation axes of the pin rotators.
6. The spin treatment apparatus according to claim 3, wherein
six clamp pins are provided as the clamp pins, and alternate three of the six clamp pins in a peripheral direction of the substrate form one set,
the rotation magnets are provided in groups for the respective sets of the clamp pins, and
the movement mechanism moves the rotation magnets for the sets of the clamp pins on a set-by-set basis in the direction of the rotation axes of the pin rotators.
7. The spin treatment apparatus according to claim 4, wherein
during the treatment of the substrate, the movement mechanism moves the rotation magnets for the sets of clamp pins alternately on the set-by-set basis in the direction of the rotation axes of the pin rotators.
8. The spin treatment apparatus according to claim 5, wherein
during the treatment of the substrate, the movement mechanism moves the rotation magnets for the sets of clamp pins alternately on the set-by-set basis in the direction of the rotation axes of the pin rotators.
9. The spin treatment apparatus according to claim 6, wherein
during the treatment of the substrate, the movement mechanism moves the rotation magnets for the sets of clamp pins alternately on the set-by-set basis in the direction of the rotation axes of the pin rotators.
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