CN209880558U - Wafer edge washing device - Google Patents
Wafer edge washing device Download PDFInfo
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- CN209880558U CN209880558U CN201921077822.4U CN201921077822U CN209880558U CN 209880558 U CN209880558 U CN 209880558U CN 201921077822 U CN201921077822 U CN 201921077822U CN 209880558 U CN209880558 U CN 209880558U
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- wafer
- edge washing
- clamping
- bracket
- wafer edge
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Abstract
The utility model provides a wafer edge washing device, include: a bracket configured to support the wafer and drive the wafer to rotate; the clamping needle can rotate around a rotating shaft fixed on the bracket and comprises a gravity center end and a clamping end which are positioned at two sides of the rotating shaft; the clamping pins rotate along with the bracket and correspondingly rotate under the centrifugal action, so that the clamping ends form clamping for the wafer on the surface, deviating from the bracket, of the wafer, the wafer is positioned through the clamping pins, and the shaking generated when the wafer rotates at a high speed is restrained.
Description
Technical Field
The utility model relates to a semiconductor technology field, more specifically say, the utility model relates to a wafer edge washing device.
Background
After a wafer is subjected to a metal electroplating process, metal on the edge and the side wall of the wafer needs to be washed away so as to avoid metal pollution in the subsequent process, the wafer is usually placed on a base station by a wafer edge washing device, then the wafer is clamped by clamping pieces arranged on the periphery of the base station to realize the positioning of the wafer, the clamping pieces are usually driven by a cylinder or a motor, and the positioning mode easily causes the position of the wafer to deviate due to the abrasion of the base station after long-term use and the clamping precision deviation of the clamping pieces, so that the phenomenon of edge washing deviation occurs in the edge washing process.
Therefore, there is a need for an improved wafer edge washing apparatus.
SUMMERY OF THE UTILITY MODEL
In order to solve the above problems in the prior art, an edge washing apparatus for a wafer is provided, which can accurately position the wafer and prevent the wafer from shifting after positioning.
The utility model provides a wafer edge washing device, include: a bracket configured to support the wafer and drive the wafer to rotate; the clamping needle can rotate around the rotating shaft fixed on the bracket and comprises a gravity center end and a clamping end, wherein the gravity center end and the clamping end are positioned on two sides of the rotating shaft, the clamping needle rotates correspondingly under the centrifugal action along with the rotation of the bracket, and the clamping end clamps the wafer on the surface of the wafer deviating from the bracket.
In the technical scheme, the wafer is positioned through the card, wherein the card needle is an eccentric part, when the bracket rotates, the card needle rotates under the centrifugal action to form clamping on the wafer, the clamping force can be decomposed into force in the height direction and force in the horizontal direction, namely, the position of the wafer is restrained in the height direction and the horizontal direction, the positioning of the wafer is realized, the shake of the wafer generated in the high-speed rotation process can be restrained, and the precision of edge washing of the wafer is improved.
The utility model discloses an among the preferred technical scheme, the bracket just has the diapire that is used for guiding the lateral wall that the wafer got into and is used for bearing wafer along the circumference interval distribution of wafer, and the conical surface is altogether to the lateral wall, and the diapire forms along radial inside extension from the lower extreme of lateral wall, and the outer peripheral edge of diapire is altogether just the diameter of the circle altogether and the diameter of wafer equals.
In this technical scheme, the accommodation space of bracket has been injectd through the diapire and the lateral wall of bracket, and specifically, it has injectd the position of wafer along the ascending direction of horizontal, and the wafer is placed in the bracket promptly, and the bracket has not only realized the bearing to the wafer, has still accomplished the location to the wafer.
The utility model discloses an among the preferred technical scheme, the card needle is roughly sharp appear, under natural state: the clamping needle is suspended outside the plane where the wafer is located, the gravity center end is located below the clamping end, and the upper end of the clamping end is higher than the upper surface of the wafer.
The utility model discloses an among the preferred technical scheme, the card needle rotates to be connected in the lateral wall along the both sides of circumference.
The utility model discloses an among the preferred technical scheme, still include rotatable casing, the position and the casing relatively fixed of bracket.
The utility model discloses an among the preferred technical scheme, still include the nozzle that is used for spraying edge-washing liquid to the wafer.
The utility model discloses an among the preferred technical scheme, still including the lift unit that is used for going up and down the wafer.
The utility model discloses an among the preferred technical scheme, be equipped with on the casing and be used for washing the outside outage of limit liquid discharge to wafer edge washing device.
In the technical scheme, the liquid discharge hole is arranged to guide the edge washing liquid out of the wafer edge washing device.
The utility model discloses an among the preferred technical scheme, the outage below is equipped with and is used for washing the ring baffle of limit liquid drainage to outage, and ring baffle extends the formation towards the inside tilt up of casing from the inner wall of casing.
In this technical scheme, the setting of ring baffle not only helps the collection of washing limit liquid, can prevent moreover that washing limit liquid from causing the corruption to the inner wall of casing.
The utility model discloses an among the preferred technical scheme, the rotatory rotational speed of wafer is adjustable, responds to the rotatory rotational speed of wafer and surpasss the default, and the centre gripping to the wafer is accomplished to the card needle.
Drawings
Fig. 1 is a schematic structural diagram of a wafer edge washing apparatus according to a preferred embodiment of the present invention;
FIG. 2 is an enlarged view at A in FIG. 1;
FIG. 3 is a schematic top view of the wafer edge bead remover of FIG. 1 after removing the wafer;
FIG. 4 is a schematic view of the wafer edge washing apparatus of FIG. 1 with a wafer placed in the carrier;
FIG. 5 is a schematic view of the wafer edge-cleaning apparatus of FIG. 4 rotating at V2.
Reference numerals: 1-shell, 11-liquid discharge hole, 12-annular baffle; 2-bracket, 21-side wall, 22-bottom wall, 23-rotation axis; 3-a wafer; 4-a first nozzle; 5-first power unit, 51-gear, 52-motor; 6-clamping needle, 61-gravity center end, 62-clamping end; 7-lifting unit, 71-support, 72-second power unit; 8-second nozzle.
Detailed Description
The preferred embodiments of the present invention will be described below with reference to the accompanying drawings. It should be understood by those skilled in the art that these technical solutions are only used for explaining the technical principles of the present invention, and are not intended to limit the scope of the present invention. And can be modified as needed by those skilled in the art to suit particular applications.
It should be noted that in the description of the preferred embodiments of the present invention, the terms "upper", "lower", "left", "right", "front", "rear", "vertical", "horizontal", "inner", "outer", and the like, which indicate directions or positional relationships, are based on the directions or positional relationships shown in the drawings, which are for convenience of description only, and do not indicate or imply that the devices or components must have specific orientations, be constructed and operated in specific orientations, and therefore, should not be construed as limiting the present invention.
Fig. 1 to fig. 2 show the wafer edge washing device provided by the present invention, including: the wafer placing device comprises a shell 1, the shell 1 is annular, three brackets 2 are arranged at intervals along the radial direction of the shell 1, the brackets 2 are arranged inside the shell 1 and are relatively fixed with the shell 1, each bracket 2 comprises a side wall 21 and a bottom wall 22 extending inwards from the lower end of the side wall 21 along the radial direction, the side walls 21 are in a conical surface shape, the opening of the conical surface is wide at the top and narrow at the bottom so as to guide a wafer 3 to enter, the outer peripheries of the bottom walls 22 are in a circular shape, the diameter of the circular shape is equal to that of the wafer 3, the wafer 3 can automatically slide to the bottom of the bracket 2 under the action of gravity, the accommodating space of the bracket 2 is limited by the bottom walls 22 and the side walls 21 of the brackets 2, the wafer 3 can be placed on the brackets 2 conveniently, the wafer 3 can be automatically positioned after being placed (the bracket 2 limits the position of the wafer 3 along the horizontal direction), the number, the preferred embodiments of the present invention adopt the minimum value of three, which is only shown as a feasible embodiment and is not limited to the present embodiments.
The wafer edge washing device further comprises a first nozzle 4 for spraying edge washing liquid to the surface of the wafer 3, and the position of the first nozzle 4 is generally fixed, so that the wafer 3 needs to be rotated to evenly wash the edge of the wafer 3, in the preferred technical scheme of the present invention, the housing 1 is rotated under the driving of the first power unit 5 and drives the wafer 3 to correspondingly rotate, specifically, the first power unit 5 comprises a gear 51 and a motor 52 for driving the gear to rotate, a gear groove (not shown) for meshing and matching with the gear 51 is arranged on the housing 1, the housing 1 is correspondingly rotated under the driving of the gear 51, because the position of the wafer 3 is easy to shake in a high-speed rotation state, in the prior art, the wafer 3 is mostly positioned by using a clamping member (not shown), the clamping member can be driven by a cylinder or a motor, along with the increase of the goods passing amount, the easy deviation that produces of holder shift position, and then lead to the inaccuracy of 3 location of wafer, among the preferred technical scheme of this embodiment, wafer edge washing device still includes card needle 6, and card needle 6 can rotate around being fixed in the pivot 23 of bracket 2, specifically, card needle 6 is the eccentric member, and it is roughly straight line shape, including the focus end 61 and the block end 62 that are located pivot 23 both sides, and the focus of card needle 6 is located focus end 61, under natural state: the clamping pins 6 are suspended outside the plane of the wafer 3, so that when the shell 1 is in a static state, the clamping pins 6 cannot interfere with the taking and placing of the wafer 3; under the action of gravity, the gravity center end 61 is located below the engaging end 62, the upper end of the engaging end 62 is higher than the upper surface of the wafer 3, when the engaging pin 6 rotates along with the housing 1 and rotates correspondingly under the centrifugal action, the gravity center end 61 swings outwards along the radial direction and drives the engaging end 62 to form a holding for the wafer 3 at the side of the wafer 3 departing from the bracket (in the preferred technical scheme of the present invention, the upper surface of the wafer 3), specifically, the engaging end 62 abuts against the upper edge of the wafer 3 to position the wafer 3, the interaction force between the engaging end and the wafer 3 can be decomposed into a force in the height direction and a force in the horizontal direction, in other words, the engaging end simultaneously forms a constraint to the wafer 3 along the height direction and the horizontal direction, thereby not only realizing the positioning of the wafer 3, but also inhibiting the wafer 3 from shaking caused by the rotation, compared with the prior art, firstly, the engaging pin 6 used in the preferred technical scheme of the present invention is an eccentric piece, it need not extra power supply, it can form the card of wafer 3 through centrifugal motion automatically to the rotational speed at the rotatory time of casing 1, when having practiced thrift the cost, avoided because of the braking of power supply, the movement error that parameter setting or other reasons produced, in addition, card needle 6 and bracket 2 cooperation are used, carry out multiple restraint to wafer 3 simultaneously along horizontal direction and direction of height, realized the accurate positioning to wafer 3, and realize the location of wafer 3 through pure physical structure, the action and the response time of industry control have been reduced, the edge washing efficiency has been improved.
In the preferred technical solution of the present invention, the latch 6 is rotatably connected to the side wall 21 along the circumferential direction, and in some alternative embodiments, the rotating shaft 23 may be only disposed on one side of the side wall 21 along the circumferential direction.
In the preferred technical solution of the present invention, the present invention further comprises a lifting unit 7 for lifting the wafer 3, wherein the lifting unit 7 comprises a supporting member 71 for supporting the wafer 3 and driving the wafer 3 to lift and a second power unit 72 for providing power for the supporting member 71 to lift; and a second nozzle 8 for spraying deionized water onto the surface of the wafer 3.
The utility model discloses an among the preferred technical scheme, be equipped with on the casing 1 and be used for washing the outside outage 11 of limit liquid discharge to wafer edge washing device.
Further, an annular baffle 12 for guiding the edge washing liquid to the liquid discharge hole 11 is arranged below the liquid discharge hole 11, and the annular baffle 12 is formed by extending from the inner wall of the shell 1 to the inside of the shell 1 in an upward inclined manner.
In this technical scheme, the setting of ring baffle 12 not only helps the collection of washing limit liquid, can prevent that washing limit liquid from causing the corruption to the inner wall of casing 1 moreover.
The utility model discloses an among the preferred technical scheme, the rotatory rotational speed of wafer 3 is adjustable, responds to the rotatory rotational speed of wafer 3 and surpasss the default, and the centre gripping to wafer 3 is accomplished to card needle 6.
In the preferred embodiment of the present invention, the edge washing process of the wafer comprises the steps of:
s1, the support 71 is driven by the second power unit 72 to rise from the initial position to the upper part of the bottom wall 22, and contact the lower surface of the wafer 3 conveyed by the wafer conveying device (not shown), and then driven by the second power unit 72 to fall until the wafer 3 is placed on the carrier 2, and the support 71 continues to fall until it reaches the initial position;
s2, the first power unit 5 drives the shell 1 to rotate, when the speed reaches a preset rotating speed V1, the second nozzle 8 starts to spray deionized water, the surface of the wafer 3 is cleaned, and a water film is formed on the surface of the wafer 3;
s3, stopping spraying by the second nozzle 8, and spraying edge washing liquid by the first nozzle 4 to wash edges;
s4, stopping spraying by the first nozzle 4, spraying deionized water by the second nozzle 8, and washing off the edge washing liquid on the surface of the wafer 3;
s5, the second nozzle 8 stops spraying, the rotating speed of the shell 1 is raised to reach the preset rotating speed V2 so as to dry the liquid on the surface of the wafer 3, and the clamping needle 6 is abutted against the upper edge of the wafer 3 under the centrifugal action so as to clamp the wafer 3.
S6, when the first power unit 5 stops rotating and the housing 1 returns to the stationary state, the support 71 is driven by the second power unit 72 to rise to separate the wafer 3 from the bracket 2, and the wafer transfer apparatus takes away the wafer 3, thereby ending the process.
In the technical scheme, when the rotating speed of the shell 1 reaches the preset rotating speed V2, the clamping pins 6 clamp the wafer 3, and the shaking which may be generated when the wafer 3 rotates highly is restrained.
So far, the technical solutions of the present invention have been described with reference to the accompanying drawings, but it is obvious to those skilled in the art that the scope of the present invention is not limited to these specific technical solutions. Without departing from the principle of the present invention, a person skilled in the art can make equivalent changes or substitutions to the related technical features, and the technical solutions after these changes or substitutions will fall within the protection scope of the present invention.
Claims (10)
1. A wafer edge washing device, comprising:
a bracket configured to support the wafer and drive the wafer to rotate; and
the clamping needle can rotate around a rotating shaft fixed on the bracket and comprises a gravity center end and a clamping end which are positioned at two sides of the rotating shaft;
the clamping needle rotates correspondingly under the centrifugal action along with the rotation of the bracket, so that the clamping end forms clamping for the wafer on the surface of the wafer departing from the bracket.
2. The wafer edge washing apparatus as claimed in claim 1, wherein the brackets are spaced apart along the circumference of the wafer and have sidewalls for guiding the wafer in and a bottom wall for supporting the wafer, the sidewalls having a conical shape, the bottom wall extending radially inward from a lower end of the sidewalls, the outer peripheries of the bottom walls being co-circular and having a diameter equal to the diameter of the wafer.
3. The wafer edge washing apparatus of claim 2, wherein the chuck pin is substantially linear and, in a natural state: the clamping needle is suspended outside the plane where the wafer is located, the gravity center end is located below the clamping end, and the upper end of the clamping end is higher than the upper surface of the wafer.
4. The wafer edge washing device as claimed in claim 3, wherein the chuck pins are rotatably connected to both sides of the sidewall along the circumferential direction.
5. The wafer edge washing apparatus of any one of claims 1-4, further comprising a rotatable housing, wherein the position of the carrier is fixed relative to the housing.
6. The wafer edge washing apparatus of claim 1, further comprising a nozzle for spraying an edge washing liquid onto the wafer.
7. The wafer edge washing apparatus of claim 1, further comprising a lifting unit for lifting the wafer.
8. The wafer edge washing device as claimed in claim 5, wherein the housing is provided with a drain hole for draining the edge washing liquid to the outside of the wafer edge washing device.
9. The wafer edge washing device as claimed in claim 8, wherein an annular baffle plate for guiding edge washing liquid to the drain hole is arranged below the drain hole, and the annular baffle plate is formed by extending from the inner wall of the shell to the inside of the shell in an upward inclined manner.
10. The wafer edge washing apparatus of claim 1, wherein the rotation speed of the wafer rotation is adjustable, and the chuck pin completes clamping of the wafer in response to the rotation speed of the wafer rotation exceeding a preset value.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201921077822.4U CN209880558U (en) | 2019-07-10 | 2019-07-10 | Wafer edge washing device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201921077822.4U CN209880558U (en) | 2019-07-10 | 2019-07-10 | Wafer edge washing device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN209880558U true CN209880558U (en) | 2019-12-31 |
Family
ID=68948932
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201921077822.4U Active CN209880558U (en) | 2019-07-10 | 2019-07-10 | Wafer edge washing device |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN209880558U (en) |
-
2019
- 2019-07-10 CN CN201921077822.4U patent/CN209880558U/en active Active
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