JP2015222754A - Substrate support device and substrate processing device comprising the same - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a substrate support device capable of horizontally supporting a substrate, such as a wafer.SOLUTION: A substrate support device comprises: a plurality of rotation posts 2 arranged along a peripheral edge part of a substrate W, and in each of which a conical guide surface 12 is formed at a top part; at least one pedestal 15 that has a substrate support surface 15 arranged below the guide surface 12; a motor 9 for rotating the plurality of rotation posts 2 around their shaft center; and a plurality of liquid passages 20 that extend in the plurality of rotation posts 2, respectively. The plurality of liquid passages 20 have a plurality of liquid outlets 20b formed at upper ends of the plurality of rotation posts 2.

Description

  The present invention relates to a substrate support apparatus that supports a substrate such as a wafer. The present invention also relates to a substrate processing apparatus provided with such a substrate support apparatus.

  Semiconductor devices are manufactured through various processes such as wafer polishing, cleaning, and drying. The wafer is transferred between a plurality of processing units and a wafer storage container (referred to as a wafer cassette) by a plurality of transfer robots. Since wafers cannot be directly transferred between the transfer robots, the wafers are transferred via a substrate support device called a temporary placement table. Specifically, the wafer is placed on the substrate support apparatus by one of the two adjacent transfer robots, and the wafer is taken out of the substrate support apparatus and transferred to a predetermined place by the other transfer robot.

  FIG. 18 is a plan view showing a conventional substrate support device (temporary placement table) on which a wafer is temporarily placed, and FIG. 19 is a side view of the substrate support device shown in FIG. As shown in FIGS. 18 and 19, the substrate support apparatus includes a plurality of support columns 100 that support the peripheral edge of the wafer W. Each column 100 has a conical surface 101 at the top thereof, and the peripheral portion of the wafer W is supported on the conical surface 101 of each column 100.

Japanese Patent Laid-Open No. 9-246362 Japanese Patent Laid-Open No. 11-40655

  The wafer W is placed on the conical surface 101 of the support column 100 by a transfer robot (not shown). However, as shown in FIG. 20, a part of the wafer W may be caught by the upper end of the support column 100, and the wafer W may be inclined. As a result, another transfer robot cannot take out the wafer W from the substrate support apparatus, and the wafer W cannot be processed.

  Accordingly, an object of the present invention is to provide a substrate support device that can horizontally support a substrate such as a wafer. Moreover, an object of this invention is to provide the substrate processing apparatus provided with such a substrate support apparatus.

  A first aspect of the present invention includes a plurality of rotating posts arranged along a peripheral edge of a substrate and having a conical guide surface formed on the top, and a substrate support surface disposed below the guide surface. At least one pedestal, at least one motor for rotating the plurality of rotating posts around their axial centers, and a plurality of liquid passages respectively extending inside the plurality of rotating posts, the plurality of liquid passages Is a substrate support apparatus having a plurality of liquid outlets formed at upper ends of the plurality of rotating posts.

  The second aspect of the present invention includes a plurality of rotating posts arranged along the peripheral edge of the substrate and having a conical guide surface formed on the top, and a substrate support surface disposed below the guide surface. At least one pedestal and at least one motor for rotating the plurality of rotating posts around their axial centers, the conical guide surface is formed with a spiral groove, When the plurality of rotating posts are rotated by a motor, the substrate supporting device extends in a direction in which the peripheral edge of the substrate is sent downward.

  A third aspect of the present invention includes a plurality of rotating posts arranged along the peripheral edge of the substrate and having a conical guide surface formed on the top, and a substrate support surface disposed below the guide surface. A substrate comprising: at least one pedestal; at least one motor that rotates the plurality of rotating posts around their axes; and at least one lifting device that moves the plurality of rotating posts up and down. It is a support device.

  According to a fourth aspect of the present invention, there are provided a plurality of support columns having a substrate support surface arranged along a peripheral edge portion of the substrate, a support ring having an inverted conical surface for supporting the peripheral edge portion of the substrate, and the support. An elevating device that moves the ring up and down, and the elevating device raises the support ring until the inverted conical surface is higher than the substrate supporting surface, and the inverted conical surface is lower than the substrate supporting surface. The substrate support device is configured to lower the support ring until it reaches the end.

  According to a fifth aspect of the present invention, there is provided a substrate comprising the substrate support apparatus, a processing unit for processing the substrate, and two transfer robots that transfer the substrate via the substrate support apparatus. It is a processing device.

  According to the first to third aspects described above, the substrate can be returned to the horizontal posture even when the substrate such as a wafer is inclined and placed on the support column. Moreover, according to the 4th aspect mentioned above, substrates, such as a wafer, can be horizontally placed on a support | pillar. Therefore, the transfer robot can take out the substrate in a horizontal posture from the substrate support apparatus and transfer the substrate to a predetermined place such as a processing unit.

It is a top view which shows the board | substrate support apparatus which concerns on one Embodiment of this invention. It is a side view of the board | substrate support apparatus shown in FIG. It is a figure which shows the inclined wafer. It is a figure which shows a mode that the inclined wafer is returned to a horizontal attitude | position. It is a figure which shows the wafer returned to the horizontal attitude | position. It is a figure which shows the board | substrate support apparatus which concerns on other embodiment. It is a figure which shows a mode that the inclined wafer is returned to a horizontal attitude | position. It is a figure which shows the wafer returned to the horizontal attitude | position. It is a figure which shows the board | substrate support apparatus which concerns on other embodiment. It is a figure which shows a mode that the inclined wafer is returned to a horizontal attitude | position. It is a figure which shows the wafer returned to the horizontal attitude | position. It is a top view which shows the board | substrate support apparatus which concerns on other embodiment. It is a side view of the board | substrate support apparatus shown in FIG. It is a figure which shows the support ring raised. It is a figure which shows the lowering support ring and the wafer supported by the support | pillar. It is a figure which shows the support ring further lowered | hung and the wafer supported by the support | pillar. It is a top view which shows typically the substrate processing apparatus provided with the substrate support apparatus which concerns on either embodiment mentioned above. It is a top view which shows the conventional board | substrate support apparatus. It is a side view of the board | substrate support apparatus shown in FIG. It is a figure which shows the wafer hold | maintained at the board | substrate support apparatus in the attitude | position inclined.

Embodiments of the present invention will be described below with reference to the drawings.
FIG. 1 is a plan view showing a substrate support apparatus 1 according to an embodiment of the present invention, and FIG. 2 is a side view of the substrate support apparatus 1 shown in FIG. The substrate support device 1 includes a plurality of support columns 2 that support a peripheral portion of a wafer W that is an example of a substrate. These support columns 2 are arranged along the peripheral edge of the wafer W. Each column 2 includes a rotation post 3 that can rotate around an axis extending in the vertical direction, and a pedestal 7 that is disposed around the rotation post 3. The pedestal 7 has a cylindrical shape, and the rotary post 3 is disposed inside the pedestal 7. The rotating post 3 and the pedestal 7 are arranged coaxially. In this embodiment, four support columns 2 are provided, but five or more support columns 2 may be provided. Instead of the plurality of bases 7, a single base having an annular substrate support surface extending along the peripheral edge of the wafer W may be provided.

  The plurality of rotating posts 3 are respectively connected to a plurality of motors 9, and the plurality of rotating posts 3 are rotated around their axes in the same direction by these motors 9. In the present embodiment, four rotating posts 3 and four motors 9 are provided. As another embodiment, one motor may be connected to a plurality of rotating posts 3 with a belt and a pulley, and all the rotating posts 3 may be rotated by one motor. A minute gap is formed between the rotary post 3 and the pedestal 7, and the pedestal 7 remains stationary while the rotary post 3 rotates about its axis.

  A conical guide surface 12 is formed at the top of each rotary post 3. Further, a frustoconical substrate support surface 15 is formed on the top of each pedestal 7. The substrate support surface 15 is located below the guide surface 12 and outside the guide surface 12. Both the guide surface 12 and the substrate support surface 15 are tapered surfaces, and the inclination angle of the guide surface 12 with respect to the horizontal direction is larger than the inclination angle of the substrate support surface 15.

  The wafer W is carried to the substrate support apparatus 1 by a transfer robot (not shown) and placed on the four support columns 2. The peripheral edge of the wafer W is guided by the guide surface 12 and moves downward. The peripheral edge of the wafer W is supported by the substrate support surface 15.

  A liquid passage 20 is formed inside each rotary post 3. The liquid passage 20 extends in the vertical direction along the axis of the rotary post 3. The liquid inlet 20 a of the liquid passage 20 is connected to the liquid supply line 21, and the liquid outlet 20 b of the liquid passage 20 is located at the upper end of the rotary post 3 (that is, the upper end of the column 2). The liquid is supplied to the liquid passage 20 through the liquid supply line 21, and flows out from the liquid outlet 20b. An example of the liquid used is pure water.

  When the wafer W is placed on the support column 2 by the transfer robot, the wafer W may be tilted as shown in FIG. Therefore, in order to change the wafer W from the tilted state to the horizontal posture, as shown in FIG. 4, a liquid (for example, pure water) is supplied to the liquid passage 20 while rotating the four rotary posts 3. The liquid flows downward while covering the guide surface 12 of the rotating post 3 that rotates. The rotation of the rotary post 3 and the supply of the liquid are performed until a preset time elapses after the wafer W is placed on the support column 2 by the transfer robot.

  As shown in FIG. 4, a part of the peripheral edge of the wafer W slides down on the guide surface 12 of the rotating post 3 rotating in a wet state and moves onto the substrate support surface 15. As a result, as shown in FIG. 5, the entire wafer W is in a horizontal posture. Then, when the preset time has elapsed, the rotation of the rotary post 3 and the liquid supply are stopped. As described above, the tilted wafer W can be returned to the horizontal posture by the rotation of the rotary post 3 and the supply of the liquid to the guide surface 12. The wafer W in a horizontal posture is transferred to a predetermined place (for example, a processing unit for processing a substrate) by another transfer robot.

  FIG. 6 is a diagram illustrating a substrate support apparatus 1 according to another embodiment. The configuration of the present embodiment that is not particularly described is the same as the configuration of the embodiment shown in FIGS. 1 and 2, and thus redundant description thereof is omitted. In the present embodiment, the liquid passage 20 and the liquid supply line 21 are not provided, but the spiral groove 31 is formed in the guide surface 12 of the rotary post 3, and therefore the embodiment shown in FIGS. 1 and 2. Is different.

  The spiral groove 31 extends in a direction in which the peripheral edge of the wafer W is sent downward when the rotary post 3 is rotated by the motor 9. Accordingly, as shown in FIG. 7, as the rotary post 3 rotates, a part of the peripheral edge of the inclined wafer W is forcibly moved downward by the rotating spiral groove 31. As a result, as shown in FIG. 8, the entire wafer W is in a horizontal posture.

  The rotation post 3 is rotated until a preset time elapses after the wafer W is placed on the support column 2 by the transfer robot. The tilted wafer W can be returned to the horizontal posture by the rotation of the rotary post 3 in which the spiral groove 31 is formed. Then, when the preset time has elapsed, the rotation of the rotary post 3 is stopped. The wafer W in a horizontal posture is transferred to a predetermined place (for example, a processing unit for processing a substrate) by another transfer robot.

  FIG. 9 is a diagram illustrating a substrate support apparatus 1 according to another embodiment. The configuration of the present embodiment that is not particularly described is the same as the configuration of the embodiment shown in FIGS. 1 and 2, and thus redundant description thereof is omitted. The present embodiment is different from the embodiment shown in FIGS. 1 and 2 in that an elevating device 34 that moves the rotary post 3 up and down is provided instead of the liquid passage 20 and the liquid supply line 21. ing.

  The elevating device 34 is connected to each of the motors 9 and moves the rotary post 3 up and down together with the motors 9. The lifting device 34 may be connected to the rotating post 3 so that only the rotating post 3 is moved up and down. As another embodiment, one lifting device 34 may be connected to all the rotating posts 3 or all the motors 9, and all the rotating posts 3 may be moved up and down by one lifting device 34. An air cylinder or the like is used as the lifting device 34.

  The rotating post 3 is moved by the elevating device 34 while the rotating post 3 is rotated by the motor 9 until the preset time elapses after the wafer W is placed on the support column 2 by the transfer robot (not shown). Move up and down. As shown in FIG. 10, a part of the peripheral edge of the inclined wafer W is moved downward by the vertical movement and rotation of the rotary post 3. As a result, as shown in FIG. 11, the entire wafer W is in a horizontal posture.

  12 and 13 are diagrams showing a substrate support apparatus 1 according to another embodiment. The configuration of the present embodiment that is not particularly described is the same as the configuration of the embodiment shown in FIGS. 1 and 2, and thus redundant description thereof is omitted. In the present embodiment, the support column 2 does not rotate, and the liquid passage 20 and the liquid supply line 21 are not provided. A conical guide surface 12 and a frustoconical substrate support surface 15 are formed on the top of the column 2. The guide surface 12 and the substrate support surface 15 are integrally connected.

  A support ring 38 extending along the direction in which the columns 2 are arranged is provided. The support ring 38 has an inverted conical surface 38 b for supporting the peripheral edge of the wafer W. An elevating device 40 is connected to the support ring 38, and the elevating device 40 raises and lowers the support ring 38. An air cylinder or the like is used as the lifting device 40. A plurality of through holes 38a extending in the vertical direction are formed in the support ring 38, and the support column 2 is inserted into these through holes 38a.

  When the transfer robot transfers the wafer W to the substrate support device 1, the lifting device 40 raises the support ring 38 until the inverted conical surface 38 b is higher than the substrate support surface 15, as shown in FIG. 14. In this state, the wafer W is placed on the inverted conical surface 38 b of the support ring 38. Next, as shown in FIG. 15, the lifting device 40 lowers the support ring 38 until the inverted conical surface 38 b is lower than the substrate support surface 15. As a result, the wafer W is placed on the substrate support surface 15 of the support 2. As shown in FIG. 16, the support ring 38 is further lowered, and the wafer W on the column 2 is transferred to a predetermined place by another transfer robot.

  FIG. 17 is a plan view schematically showing a substrate processing apparatus including the substrate support apparatus 1 according to any one of the above-described embodiments. The substrate processing apparatus includes the substrate support apparatus 1, a plurality of processing units 41 that process the wafer (substrate) W, two transfer robots 43 and 44 that transfer the wafer W via the substrate support apparatus 1, and a plurality of processing units 41. And a substrate cassette 45 for housing the wafer W. The processing unit 41 is, for example, a polishing unit that polishes the wafer W, a cleaning unit that cleans the wafer W, and a drying unit that dries the wafer W.

  The first transfer robot 43 takes out the wafer W from the substrate cassette 45 and places the wafer W on the substrate support device 1 that functions as a temporary placement table. The second transfer robot 44 takes out the wafer W from the substrate support apparatus 1 and sequentially transfers it to the plurality of processing units 41. The wafer W processed by these processing units 41 is placed on the substrate support apparatus 1 by the second transfer robot 44, further taken out from the substrate support apparatus 1 by the first transfer robot 43, and returned to the substrate cassette 45.

  Although the embodiment of the present invention has been described so far, the present invention is not limited to the above-described embodiment, and it is needless to say that the present invention may be implemented in various different forms within the scope of the technical idea.

DESCRIPTION OF SYMBOLS 1 Board | substrate support apparatus 2 Support | pillar 3 Rotating post 7 Base 9 Motor 12 Guide surface 15 Board | substrate support surface 20 Liquid passage 20a Liquid inlet 20b Liquid outlet 21 Liquid supply line 31 Spiral groove 34 Lifting device 38 Support ring 38a Through-hole 38b Reverse conical surface 40 Lifting device 41 Processing units 43 and 44 Transfer robot 45 Substrate cassette

Claims (6)

A plurality of rotating posts arranged along the peripheral edge of the substrate and having a conical guide surface formed on the top;
At least one pedestal having a substrate support surface disposed below the guide surface;
At least one motor for rotating the plurality of rotating posts about their axes;
A plurality of liquid passages respectively extending inside the plurality of rotating posts,
The plurality of liquid passages include a plurality of liquid outlets formed at upper ends of the plurality of rotating posts. A plurality of rotating posts arranged along the peripheral edge of the substrate and having a conical guide surface formed on the top;
At least one pedestal having a substrate support surface disposed below the guide surface;
And at least one motor for rotating the plurality of rotating posts about their axes,
A spiral groove is formed in the conical guide surface, and the spiral groove extends in a direction in which the peripheral edge portion of the substrate is sent downward when the plurality of rotation posts are rotated by the motor. A substrate support apparatus. A plurality of rotating posts arranged along the peripheral edge of the substrate and having a conical guide surface formed on the top;
At least one pedestal having a substrate support surface disposed below the guide surface;
At least one motor for rotating the plurality of rotating posts about their axes;
A substrate support device comprising: at least one lifting device that moves the plurality of rotating posts up and down.   The substrate lifting apparatus according to claim 3, wherein the lifting device moves the plurality of rotating posts rotated by the motor up and down. A plurality of pillars arranged along the peripheral edge of the substrate and having a substrate support surface;
A support ring having an inverted conical surface for supporting the peripheral edge of the substrate;
A lifting device for moving the support ring up and down,
The lifting device is configured to raise the support ring until the inverted conical surface is higher than the substrate support surface, and to lower the support ring until the reverse conical surface is lower than the substrate support surface. A substrate supporting apparatus characterized in that the substrate supporting apparatus is provided. A substrate support apparatus according to any one of claims 1 to 5,
A processing unit for processing a substrate;
A substrate processing apparatus comprising: two transfer robots that transfer the substrate via the substrate support device.

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