US20140224528A1

US20140224528A1 - Precursor substrate, flexible circuit board and process for producing the same

Info

Publication number: US20140224528A1
Application number: US13/852,002
Authority: US
Inventors: Chien-Hwa Chiu; Chih-Min Chao; Peir-Rong Kuo; Chia-Hua Chiang; Chih-Cheng Hsiao; Feng-Ping Kuan; Ying-Wei Lee; Yung-Chang Juang
Original assignee: Ichia Technologies Inc
Current assignee: Ichia Technologies Inc
Priority date: 2013-02-08
Filing date: 2013-03-28
Publication date: 2014-08-14
Also published as: CN103987189A; KR101475423B1; KR101522023B1; US9326374B2; TWI462672B; JP2014154876A; KR20140101263A; CN103987201A; JP5778232B2; TW201433230A; JP2014152397A; JP5903080B2; CN103987189B; US20140224527A1; KR20140101271A; CN103987201B

Abstract

The present invention provides a flexible circuit board, comprising at least a multilayer unit disposed on a substrate, wherein the multilayer unit includes: an adhesion enhancing layer formed within the surface of the substrate, a first electrical conducting unit disposed on the adhesion enhancing layer, and a second electrical conducting layer formed on the first electrical conducting layer, wherein the adhesion enhancing layer is Palladium, the first electrical conducting layer is Nickel, and the substrate is composed of polyimide(PI).

Description

BACKGROUND OF THE INVENTION

1. Field of the Invention
The present disclosure relates to a precursor substrate, a flexible circuit board and a process for producing the same; in particular, to a precursor substrate, a flexible circuit board and a process of producing the same which conducts electroless plating on a substrate as a precursor material.
2. Description of Related Art
Conventional flexible circuit boards are made by processing precursor substrates. The precursor substrates must be coated with a metal conducting layer to enable subsequent processing. Metals generally do not easily adhere to conventional precursor substrates. Conventional methods of coating metal include metal spraying, sputtering deposition, CVD, vapor deposition, and dry coating. However these methods result in problems of thick precursor substrates, or difficult and overly long coating processes. The excess thickness compromises the miniaturization of products. Difficult and overly long coating processes result in limited production capacity and raised production cost.
The above conventional methods not only cannot overcome problem of necking, but given that the technical and material resources of the precursor substrates are controlled by upstream manufacturers, products that use these precursor substrates are subject to charges by external parties and, due to inability to improve the properties of these products, a fundamental solution for reducing cost is unattainable. Moreover, the conventional production process requires large amount of etching to form electric circuits, resulting in most of the material being wasted by etching, which is very non-environmentally friendly. Additionally, the configuration of electric circuits formed by this method has poor options.
Hence, the present inventor believes the above mentioned disadvantages can be overcome, and through devoted research combined with application of theory, finally proposes the present disclosure which has a reasonable design and effectively improves upon the above mentioned disadvantages.

SUMMARY OF THE INVENTION

The object of the present disclosure is to provide a precursor substrate, a flexible circuit board and a process for producing the same, so as to reduce the thickness of the product, save production time and cost, and avoid wasteful etching, thereby taking advantage of the properties and value of the product and reducing waste of material so as to be environmental-friendly.
In order to achieve the aforementioned objects, the present disclosure provides a process for producing a flexible circuit board including the following steps: providing a substrate; using an adhesion enhancer to adhesively enhance the surface of the substrate, thereby forming an adhesion enhancing layer on the surface of the substrate; forming a first electrical conducting layer chemically bonded to the adhesion enhancing layer, thereby fixing the first electrical conducting layer on the surface of the substrate and forming a precursor substrate; disposing a photoresist layer on the first electrical conducting layer; exposing and developing the photoresist according to a circuit configuration diagram to partially remove the photoresist and partially reveal the first electrically conducting layer while leaving behind the remaining photoresist; coating a metal layer at the revealed portion of the first electrical conducting layer by electroplating; removing the remaining photoresist to reveal the first electrical conducting layer underneath; and etching the revealed first electrical conducting layer and the adhesion enhancing layer under the first electrical conducting layer.
In order to achieve the aforementioned objects, the present disclosure provides a flexible circuit board, including: at least one multilayer unit disposed on the substrate and including an adhesion enhancing layer positioned on the surface of the substrate, a first electrically conducting layer disposed on the adhesion enhancing layer, and a second electrically conducting layer formed on the first electrically conducting layer.
In order to achieve the aforementioned objects, the present disclosure provides a precursor substrate, including: a substrate which has an adhesion-enhanced surface containing an adhesion enhancing layer; and a first electrically conducting layer formed on the adhesion enhancing layer, thus the first electrical conducting layer is coated on the surface of the precursor substrate.
In summary, the present disclosure uses the adhesion enhancing layer formed on the substrate as an adhesive medium between the first electrically conducting layer and the substrate, is equivalent to a relatively unique electroless plating, thusly providing a preferable adhesive effect between the first electrically conducting layer and the substrate. Compared to conventional techniques, the present method reduces the thickness of the first electrically conducting layer and the time required for coating, thereby achieving an aim of reduced thickness and reduced cost, and the advantage of controlling source of materials. The second electrically conducting layer is directly electroplated when forming circuits, which not only provides more options but also saves the amount of etching required, reducing waste of material so as to be environmentally friendly.
In order to further the understanding regarding the present invention, the following embodiments are provided along with illustrations to facilitate the disclosure of the present invention.

BRIEF DESCRIPTION OF THE DRAWINGS

FIG. 1A shows a flowchart of steps according to a first embodiment of the present disclosure;

FIG. 1B shows a schematic diagram of a chemical mechanism employed during conductivity treatment of a substrate according to a first embodiment of the present disclosure;

FIG. 1C shows a flowchart of steps of conductivity treatment according to a first embodiment of the present disclosure;

FIG. 2A to FIG. 2H are cross-sectional views corresponding to the steps of the first embodiment of the present disclosure;

FIG. 3 shows a flow chart of steps of the second embodiment of the present disclosure; and

FIG. 4A to FIG. 4K are cross-sectional views corresponding to the steps of the second embodiment of the present disclosure.

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

The aforementioned illustrations and following detailed descriptions are exemplary for the purpose of further explaining the scope of the present disclosure. Other objectives and advantages related to the present disclosure will be illustrated in the subsequent descriptions and appended drawings. First Embodiment
FIG. 1A shows a flowchart of steps according to a first embodiment of the present disclosure. The present disclosure provides a method of manufacturing a flexible circuit board, including the following steps:
As shown in the cross-sectional view of FIG. 2A, provide a substrate 10 having a surface 11. The surface 11 includes an upper surface 11 a and a lower surface 11 b. The substrate 10 is made of raw material such as Polyimide (PI), Polyethylene Terephthalate Polyester (PET), Polyethylene Naphthalate (PEN), Polytetrafluorethylene (PTFE), Thermotropic Liquid Crystal Polymer (LCP), Epoxy, Aramid, and other macro polymers. As shown in FIG. 2B, laser processing can be applied depending on need to bore a via hole 12 on the substrate 10 connecting the upper surface 11 a and the lower surface 11 b. The via hole 12 has a tunnel wall 121 (step S101). The substrate which has been worked on by laser can also be cleaned with plasma, to remove residues left behind by laser processing.
As shown in FIG. 2B and FIG. 2C, use an adhesion enhancer to adhesively enhance the surface 11 of the substrate 10, forming an adhesion enhancing layer 20. Particularly, the adhesion enhancing layer 20 is disposed on the upper surface 11 a, the lower surface 11 b and the tunnel wall 121 of the substrate (step S103). In other words, the adhesion enhancing layer 20 can partially fuse with or permeate into the surface of the upper surface 11 a, the lower surface 11 b and the inner wall 121. Preferably, the adhesion enhancer is a palladium adhesion enhancer. Then, form a first electrical conducting layer 30 which is chemically bonded to the adhesion enhancing layer 20. With the assistance of the adhesion enhancing layer 20, the first electrical conducting layer 30 is fixed onto the upper surface 11 a, the lower surface 11 b and the tunnel wall 121 of the substrate 10, completing the production (step S105) of a precursor substrate (label omitted).
Preferably, the first electrical conducting layer 30 has a thickness between 50 nanometers and 200 nanometers, and is made of one material selected from the group consisting of copper, nickel, chromium, cobalt, nickel alloy, or cobalt alloy. Since the first electrical conducting layer 30 is fixed onto the substrate 10 by electroless plating, it is a type of electroless plating layer.
As show in in FIG. 2D, FIG. 2E and FIG. 2F, dispose a photoresist 40 on the first electrical conducting layer 30 which is on the upper surface 11 a and the lower surface 11 b of the substrate (step S107). Preferably the type of photoresist is not limited, and can be a positive photoresist or a negative photoresist. The photoresist 40 can be disposed by laminating or coating. Expose and develop the photoresist 40 according to a circuit configuration diagram to partially remove the photoresist 40 and partially reveal the first electrically conducting layer 30 while leaving behind the remaining photoresist 40 a (step S109). Coat a metal layer at the revealed portion of the first electrical conducting layer 30 by electroplating (step S111). The metal layer is a second electrical conducting layer 50 or a second electrical conducting layer 50′. Hereby only the second electrical conducting layer 50 is further explained. The first electrical conducting layer and the adhesion enhancing layer under the second electrical conducting layer 50 are respectively labeled 30 b and 20 b. Under the remaining photoresist are the first electrical conducting layer 30 a and the adhesion enhancing layer 20 a. Preferably the second electrical conducting layer 50 is copper, but is not limited hereto.
As shown in FIG. 2G and FIG. 2H, remove the remaining photoresist 40 a to reveal the first electrical conducting layer 30 a under the remaining photoresist 40 a (step S113). Etch the revealed first electrical conducting layer 30 a and the adhesion enhancing layer 20 a underneath (step S115). The adhesion enhancing layer 20 b and the first electrical conducting layer 30 b under the second electric conducting layer 50 of FIG. 2G are renamed as adhesion enhancing layer 20 and first electrical conducting layer 30 in FIG. 2H. Given that the adhesion enhancing layer 20 and the first electrical conducting layer 30 formed on the substrate 10 are thinner compared to those in conventional techniques, the etching process of the present disclosure wastes less material which is more environmentally friendly.
In the present embodiment, referring to FIG. 2C, the substrate 10, the adhesion enhancing layer 20 and the first electrical conducting layer 30 are respectively made of polyimide, palladium and nickel, but are not limited hereto. Referring to FIG. 1B and FIG. 1C, the aforementioned step “use an adhesion enhancer to adhesively enhance the surface 11 of the substrate 10, forming an adhesion enhancing layer 20” further includes a conductivity treatment. The object is to enhance the adhesion between the surface 11 of the substrate 10 and the palladium adhesion enhancer. The first electrical conducting layer 30 is formed by disposing the nickel on the palladium adhesion enhancer, which serves an important role as a foundation for the nickel to adhere to the substrate 10. In other words, the nickel of the first electrical conducting layer 30 and the palladium of the adhesion enhancing layer can form a palladium-nickel alloy.
As shown in FIG. 1B, FIG. 1C and FIG. 2C, in order to enhance the adhesion between the surface of the substrate 10 and the palladium adhesion enhancer, the conductivity treatment includes the following steps on the substrate 10 surface: lipid removing process (step S201), denaturation (step S203), roughening process (step S205), adhesion enhancing process (step S207), and reduction process of the adhesion enhancer (step S209). In particular, the roughening process (step S205) includes chemical roughening or physical roughening. The chemical roughening includes using chemical agent on the surface of the substrate 10 to roughen by corrosion or ring-opening reactions. The physical roughening includes roughening the surface of the substrate 10 by mechanical means. Both methods improve adhesion of the surface of the substrate 10 to the palladium adhesion enhancer. The method of ring-opening reaction opens the molecular rings of the material of the substrate 10 to create unevenness in the molecular structure, to enhance adhesion between the palladium adhesion enhancer and the substrate 10. In other words, if ring opening occurs on the structure of polyimide for example, microscopically the substrate 10 is roughened, thereby creating an adhesion effect between the surface of the substrate 10 and the ions of the palladium adhesion enhancer, such that the ions of the palladium adhesion enhancer is easily fixed onto the substrate 10, forming the adhesion enhancing layer 20.
Furthermore as shown in FIG. 1B, roughening by chemical ring opening involves using a basic agent to cleave one of the carbon-nitrogen bond of imides (O═C—N—C═O) such that ring opening occurs in the polyimide on the substrate 10, and then using the palladium adhesion enhancer as a medium to increase adhesion between the polyimide and nickel, completing the process of electroless plating.
Referring to FIG. 1C in conjunction with FIG. 2A, FIG. 2B and FIG. 2C, when using ring opening as the roughening method, the following applies in the conductivity process:
The lipid removing process uses amino alcohol (H₂NCH₂CH₂CH₂OH, agent number ES-100) agent having pH between 10 and 11 and temperature between 45 and 55 degree Celsius to clean the surface of the substrate 10 for 1 to 3 minutes, in order to remove lipid.
The surface denaturation process uses a weak base having pH between 7.5 and 8.5 and temperature between 35 and 45 degree Celsius, such as sodium carbonate (agent number ES-FE) to clean the surface of the substrate 10 for 1 to 3 minutes, in order to restore the usual pH value on the surface of the substrate 10 and remove residual ES-100. However depending on the conditions after the previous steps, the present step can be skipped accordingly to achieve better effect.
The surface roughening process is chemical and uses inorganic base having pH between 11 and 12 and temperature between 45 and 55 degree Celsius, such as potassium hydroxide (KOH, agent number ES-200) but is not limited hereto, in order to perform basic denaturation on the substrate 10 for 1 to 3 minutes, such that one of the carbon-nitrogen bonds in the polyimide O═C—N—C═O is cleaved so ring opening occurs to the polyimide.
The adhesion enhancing process includes: using an adhesion enhancer to fix onto the surface of the substrate 10 to form an adhesion enhancing layer 20. More specifically, the present step involves palladium ions forming chemical bonds with the carbonyl group (O═C—O—) of ring-opened polyimide (using agent ES-300, including complex compound having palladium sulfate H₂SO₄.Pd₄, of a pH between 5.5 and 6.5 and between 45 and 55 degree Celsius, for 1 to 4 minutes).
The reduction process of the adhesion enhancer includes adhering a metal onto the adhesion enhancing layer 20, thereby merging the first electrical conducting layer 30 with the surface of the substrate 10. More specifically, the present process uses agent ES-400 whose main ingredient is boron (pH is between 6 and 8, the temperature is between 30 and 40 degree Celsius, the process time is between 1 to 3 minutes), to reduce palladium ions such that the palladium can adhere to metal (nickel). Next use agent ES-500 whose main ingredients are NiSO₄.6H₂O and NaH₂PO₂(pH is between 8 and 9, temperature is between 5 and 45, processing time is between 3 and 5 minutes). The nickel easily adheres to the surface of the substrate with the palladium adhesion enhancer acting as an intermediary bonding medium. The nickel layer (first electrical conducting layer) has a thickness of 50 to 200 nanometers. After processing of the ES-500, the precipitated electroless plating of nickel has low amount of phosphorus (2-3%), therefore the first electrical conducting layer 30 is more ductile. The precipitation speed is 100 nm/5 minutes, which is faster than the conventional method, thereby saving production time and cost.
As an aside, in the figures of the present disclosure, the adhesion enhancing layer 20, the first electrical conducting layer 30, the top surface 11 a, the lower surface 11 b, and the tunnel wall 121 have clear boundaries delineated in the diagrams merely for schematic purposes. In practice, the adhesion between the first electrical conducting layer 30 or the adhesion enhancing layer 20 to the top surface 11 a, the lower surface 11 b or the inner wall 121 can include an integrated merging layer (omitted in the figures). This implies that the precursor substrate produced by the production method of the present disclosure has strong adhesion between each of its different layers.
Therefore, referring to FIG. 2H, according to the aforementioned production method, the present disclosure provides a flexible circuit board, including: at least one multilayer unit (label omitted) disposed on a substrate 10, including an adhesion enhancing layer 20, a first electrical conducting layer 30 and a second electrical conducting layer 50. The adhesion enhancing layer 20 is positioned on the surface 11 of the substrate 10. The surface 11 includes the top surface 11 a or the lower surface 11 b. The first electrical conducting layer 30 adheres to the adhesion enhancing layer 20. The second electrical conducting layer 50 is positioned on top of the first electrical conducting layer 30.
Preferably, the production method of the material of the substrate 10 is similar to the above. The material of the substrate 10 is at least one material selected from the group consisting of polyimide, polyester, polyethylene terephthalate, polytetrafluoroethylene, liquid crystal polymer, epoxy resin and aramid. The first electrical conducting layer 30 has a thickness of 50 to 200 nanometers and is an electroless plating layer made of a material selected from the group consisting of copper, nickel, chromium, cobalt, nickel alloy and cobalt alloy. The adhesion enhancing layer includes a palladium adhesion enhancer.
Additionally, referring to FIG. 2B, FIG. 2C and FIG. 2H, the substrate 10 has a via hole 12 running in the vertical direction connecting the top surface 11 a and the lower surface 11 b. The multilayer unit is respectively disposed on the top surface 11 a and the lower surface 11 b and is positioned on the via hole 12. The adhesion enhancing layer 20 and the first electrical conducting layer 30 of the multilayer unit further extends along the tunnel wall 121 of the via hole 12. The second electrical conducting layer 50 also extends along the via hole 12, thereby electrically interconnecting the multilayer unit on the upper surface 11 a and the multilayer unit on the lower surface 11 b. The adhesion enhancing layer 20′, the first electrical conducting layer 30′ and the second electrical conducting layer 50′ in FIG. 2H do not extend into the via hole 12.
More specifically, when the second electrical conducting layer 50 extends into the via hole 12, the multilayer units of the upper surface 11 a and the lower surface 11 b are electrically connected by the first electrically conducting layer 30 or the second electrically conducting layer 50 itself which fills up the via hole 12. The adhesion enhancing layer 20 is preferably a palladium adhesion enhancer. The multilayer units can overall form a first electrical circuit E1. The multilayer units can be electrically connected or not electrically connected.

Second Embodiment

In another embodiment, as shown in the flowchart of FIG. 3 in conjunction with cross-sectional views of FIG. 4A, FIG. 4B, and FIG. 4C, the present disclosure provides a method of manufacturing a multi-layered flexible circuit board, including the following steps. Provide a flexible circuit board P whose surface 11 includes an upper surface 11 a and a lower surface 11 b. The surface 11 has a first electric circuit E1 protruding from the surface 11 and an empty portion 11 c having no first electrical circuit E1 (step S301). Coat an electric insulation layer on the surface 11 of the flexible circuit board P, such that the electric insulation layer fills up the empty portion 11 c to form a neighboring interval layer 10 a. The electric insulation layer coats the top portion of the first electric circuit E1, forming a vertical interval layer 11 d (step S303) such that the electric insulation layer coats at least two sides of the first electric circuit E1 (step S305).
Preferably, the electric insulation layer is made of a material selected from the group consisting of polyimide film, polyamic acid (PAA), polyethylene terephthalate, polyethylene, liquid crystal polymer, epoxy resin, polyphenylene sulfide and photosensitive cover film.
If the electric insulation layer is preferably embodied by polyamic acid, after coating the polyamic acid to form a neighboring interval layer 10 a and a vertical interval layer 11 d, the neighboring interval layer 10 a and the vertical interval layer 11 d can be cured such that the polyamic acid becomes (develops rings) polyimide. The curing occurs at 300 degree Celsius, in an environment full of nitrogen with infrared light beaming on the polyamic acid. After the polyamic acid becomes polyimide, a via hole 12 a having a tunnel wall 121 a can be bore through the vertical interval layer 11 d such that the via hole 12 a is connected to the first electric circuit E1.
Referring to cross-sectional views of FIG. 4D, FIG. 4E and FIG. 4F, the present production method includes the following steps.
Use an adhesion enhancer to adhesively enhance the surface of the vertical interval layer 11 d, thereby forming an adhesion enhancing layer 20 c on the surface of the vertical interval layer 11 d. Form a first electrical conducting layer 30 c for chemically bonding with the adhesion enhancing layer 20 c, thereby assisting the first electrical conducting layer 30 c to be fixed onto the surface of the vertical interval layer 11 d.
Dispose a photoresist 40 c on the surface of the first electrical conducting layer 30 c.
Expose and develop the photoresist 40 c according to a circuit configuration diagram to partially remove the photoresist 40 c and partially reveal the first electrically conducting layer 30 e while leaving behind a remaining photoresist 40 d.
Referring to FIG. 4G, FIG. 4H, FIG. 4I and FIG. 4J, coat a metal layer on the revealed portion of the first electrical conducing layer (namely the first electrical conducting layer 30 e) to form a second electric circuit E2 by electroplating. The second electric circuit can extend into the via hole (label omitted) to electrically connect to the first electric circuit (positioned in the neighboring interval layer 10 a, label omitted). Remove the remaining photoresist 40 d to reveal the first electrical conducting layer 30 d under the remaining photoresist 40 d. Underneath the first electrical conducting layer 30 d is the adhesion enhancing layer 20 d. Etch the revealed first electrical conducting layer 30 d and the adhesion enhancing layer 20 d underneath. In this manner a multilayer unit (label omitted) having the adhesion enhancing layer 20 e, the first electrical conducting layer 30 e and the second electrical conducting layer 50 e can be formed on the vertical interval layer 11 d. Additionally, the same applies to the other multilayer unit formed having the adhesion enhancing layer 20 e′, the first electrical conducting layer 30 e′ and the second electrical conducting layer 50 e′. Given that the two multilayer units are positioned on the same vertical interval layer 11 d, they are considered as part of the second electric circuit E2, even though the two multilayer units can be mutually independent circuits. Even though the second electrical conducting layer 50 e in the multilayer unit is an independent circuit, the second electrical conducting layer 50 e′, the first electrical conducting layer 30 e′ and the adhesion enhancing unit 20 e′ in the other multilayer unit can be similar to the previous embodiments, passing through the vertical interval layer 11 d via the via hole (label omitted) to further electrically connect to the second electrical conducting layer 50 b′ of the first electric circuit E1, improving versatility of the electric circuit configuration.
Additionally, referring to FIG. 4J, the second electric circuit E2 can be enclosed by a neighboring interval layer 10 a′ and a vertical interval layer 11 d′. The neighboring interval layer 10 a′ and the vertical interval layer 11 d′ are likewise formed by curing polyamic acid into polyimide. Therefore comparing FIG. 4A and FIG. 4J, it can be seen that through curing of the polyamic acid, electric circuits can be added on the upper surface 11 a or the lower surface 11 b of the flexible circuit board P.
Of course, when forming the multilayer unit which make up electric circuit on the flexible circuit board P as shown in FIG. 4A, a conductivity treatment can be included just like the first embodiment, whose detailed process is described in the first embodiment, especially the processes of surface roughening and adhesion enhancing on the surface of the vertical interval layer 11 d, such that the multilayer unit of the first electric circuit E1, the second electric circuit E2 or any other electric circuit can have an adhesion enhancing layer (label omitted), hereby not further detailed.
The second embodiment can be interpreted as an extended application of the first embodiment, and adds the multilayer structure of stacked polyamic acid converted to polyimide. Referring to FIG. 4J and FIG. 4K, the present disclosure provides a multi-layered flexible circuit board, whose multi-layered electric-circuit configuration includes at least one electric circuit (label omitted), which can be disposed on the vertical interval layer 11 d of FIG. 4J. The electric circuit, for example as shown in FIG. 4J, can include: a vertical interval layer 11 d, an adhesion enhancing layer 20 e (or adhesion enhancing layer 20 e′), a first electrical conducting layer 30 e (or a first electrical conducting layer 30 e′) and a second electrical conducting layer 50 e (or a second electrical conducting layer 50 e′). The adhesion enhancing layer 20 e is formed on the surface of the vertical interval layer 11 d. The first electrical conducting layer 30 e is formed on the adhesion enhancing layer 20 e. The second electrical conducting layer 50 e is formed on the first electrical conducting layer 30 e. The first electrical conducting layer 30 e and the second electrical conducting layer 50 e both make up the second electric circuit E2 on the vertical interval layer 11 d.
In FIG. 4J, the second electrical conducting layer 50 e′, the first electrical conducting layer 30 e′ and the adhesion enhancing layer 20 e′ all belong to the second electric circuit E2. However they do not have to be mutually electrically connected. In order to keep the circuit design versatile, for example the second electrical conducting layer 50 e′ can cross the vertical interval layer 11 d to electrically connect to part of the first electric circuit E1. Any of the aforementioned electric circuit, for example the first electric circuit E1 and the second electric circuit E2 in the figures, is enclosed by neighboring interval layer (10 a, 10 a′) and vertical interval layer (11 d, 11 d′) formed by polyamic acid converted to polyimide. At least the left and right sides of the electric circuit of the flexible circuit board are enclosed and directly in contact with polyimide. Similarly, a third electric circuit E3 and more can be constructed.
It can be seen from FIG. 4K, that the exemplified multi-layered flexible circuit board P with ten layers already includes two layers of circuits having the first electric circuit E1. According to the above method, additional layers can be progressively stacked above and below. The present embodiment respectively adds 4 layers on each side of the flexible circuit board P to form 10 layers (2+4+4) of circuits. In view of the concept of vertical interval layers introduced in the present embodiment, as shown in FIG. 2H of the first embodiment, the substrate 10 can be broadly viewed as a vertical interval layer. Likewise the substrate of FIG. 4A and FIG. 4B can also be viewed as a vertical interval layer.
However, even though the above example includes an adhesion enhancing layer (20 e, 20 e′), they are merely preferred embodiments and not strictly required. Likewise the electric insulation layer does not have to be formed by polyamic acid converting into polyimide. However if the electric insulation layer uses polyamic acid, but the electric circuit (or the multilayer unit) is conventional and does not have an adhesion enhancing layer, then the present embodiment can still form the polyamic acid on a conventional flexible circuit board to coat a conventional electric circuit, and cure the polyamic acid into polyimide to simplify the production of the multi-layered flexible circuit board, facilitating production. Additionally, through the enclosing provided by the polyimide and other electric insulation material, cross-talk is reduced between the many electric circuits on the flexible circuit board, resulting in better transmission quality.

Third Embodiment

Returning to FIG. 2A, FIG. 2B and FIG. 2C, the present disclosure further provides a precursor substrate (label omitted) as a partially finished product of a circuit board, to be used in subsequent circuit board processing. The precursor substrate includes at least: a substrate 10 and a first electrical conducting layer 30. The substrate 10 has a surface 11 which is adhesively enhanced. The adhesively enhanced surface 11 includes an adhesion enhancing layer 20. The first electrical conducting layer 30 adheres to the adhesion enhancing layer 20 such that the first electrical conducting layer 30 encloses the surface 11 of the substrate 10.
Preferably, the material of the substrate is polyimide; the adhesion enhancing layer 20 includes a palladium adhesion enhancer; the thickness of the first electrical conducting layer 30 is between 50 and 200 nanometers; and the first electrical conducting layer 30 is an electroless plating layer made of a material selected from the group consisting of copper, nickel, chromium, cobalt, nickel alloy and cobalt alloy.
Preferably, the surface includes an upper surface 11 a and a lower surface 11 b, the substrate has a via hole 12 connecting the upper surface 11 a and the lower surface 11 b, the via hole has a tunnel wall 121. Broadly speaking, the surface 11 of the substrate 10 includes the upper surface 11 a, the lower surface 11 b and the tunnel wall 121, all of which can be adhesively enhanced and include the adhesive enhancing layer 20. Thusly, the first electrical conducting layer 30 can be distributed by the adhesion enhancing layer 20 and coat the surface 11 of the substrate 10 including the upper surface 11 a, the lower surface 11 b and the tunnel wall 121.
The descriptions illustrated supra set forth simply the preferred embodiments of the present invention; however, the characteristics of the present invention are by no means restricted thereto. All changes, alternations, or modifications conveniently considered by those skilled in the art are deemed to be encompassed within the scope of the present invention delineated by the following claims.

Claims

What is claimed is:

1. A method of manufacturing a flexible circuit board, comprising at least:

providing a substrate;

adhesively enhancing the surface of the substrate by using an adhesion enhancer, forming an adhesion enhancing layer on the surface of the substrate;

fixing a first electrical conducting layer on the surface of the substrate, forming a precursor substrate;

disposing a photoresist layer on the first electrical conducting layer;

exposing and developing the photoresist according to a circuit configuration diagram to partially remove the photoresist and partially reveal the first electrically conducting layer while leaving behind a remaining photoresist;

coating a metal layer on the revealed portion of the first electrical conducting layer;

removing the remaining photoresist to reveal the first electrical conducting layer under the remaining photoresist; and

etching to remove the revealed first electrical conducting layer and the adhesion enhancing layer under the revealed first electrical conducting layer.

2. The method of manufacturing a flexible circuit board according to claim 1, wherein by adhesively enhancing the surface of the substrate by using an adhesive enhancer, a conductivity treatment is included in the process of forming an adhesion enhancing layer on the surface of the substrate, and the conductivity treatment includes at least processes of roughening and adhesion enhancing on the surface of the substrate.

3. The method of manufacturing a flexible circuit board according to claim 2, wherein the roughening process on the surface of the substrate is chemical roughening, and the chemical roughening includes using chemical agent on the surface of the substrate to roughen by corrosion or ring-opening reactions.

4. The method of manufacturing a flexible circuit board according to claim 2, wherein the roughening process on the surface of the substrate is physical roughening, and the physical roughening includes roughening the surface of the substrate by mechanical means.

5. The method of manufacturing a flexible circuit board according to claim 1, wherein the substrate is made of a material selected from the group consisting of polyimide, polyester, polyethylene terephthalate, polytetrafluoroethylene, liquid crystal polymer, epoxy resin and aramid.

6. The method of manufacturing a flexible circuit board according to claim 2, wherein the substrate is made of a material selected from the group consisting of polyimide, polyester, polyethylene terephthalate, polytetrafluoroethylene, liquid crystal polymer, epoxy resin and aramid.

7. The method of manufacturing a flexible circuit board according to claim 1, wherein the adhesion enhancer is a palladium adhesion enhancer.

8. The method of manufacturing a flexible circuit board according to claim 2, wherein the adhesion enhancer is a palladium adhesion enhancer.

9. The method of manufacturing a flexible circuit board according to claim 3, wherein the adhesion enhancer is a palladium adhesion enhancer.

10. The method of manufacturing a flexible circuit board according to claim 5, wherein the adhesion enhancer is a palladium adhesion enhancer.

11. A flexible circuit board, comprising:

at least one multilayer unit disposed on the substrate, including:

an adhesion enhancing layer disposed on the surface of the substrate;

a first electrical conducting layer adhered onto the adhesion enhancing layer; and

a second electrical conducting layer positioned on the first electrical conducting layer.

12. The flexible circuit board according to claim 11, wherein the substrate is made of a material selected from the group consisting of polyimide, polyester, polyethylene terephthalate, polytetrafluoroethylene, liquid crystal polymer, epoxy resin and aramid.

13. The flexible circuit board according to claim 11, wherein the first electrical conducting layer has a thickness of 50 to 200 nanomenters, and the first electrical conducting layer is an electroless plating layer made of a material selected from the group consisting of copper, nickel, chromium, cobalt, nickel alloy and cobalt alloy.

14. The flexible circuit board according to claim 11, wherein the surface of the substrate includes an upper surface and a lower surface, the substrate has a via hole connecting the upper surface and the lower surface, the multilayer unit is disposed on the upper surface and the lower surface and positioned on the opening of the via hole, the adhesion enhancing layer and the first electrical conducting layer of the multilayer unit extend along the wall of the via hole, and the second electrical conducting layer extend into the via hole thusly electrically connecting the multilayer unit on the upper surface and the multiplayer unit on the lower surface.

15. The flexible circuit board according to claim 11, wherein the adhesion enhancing layer includes a palladium adhesion enhancer.

16. The flexible circuit board according to claim 12, wherein the adhesion enhancing layer includes a palladium adhesion enhancer.

17. A precursor substrate, comprising:

a substrate having a surface which is adhesively enhanced and has an adhesion enhancing layer; and

a first electrical conducting layer adhered onto the adhesion enhancing layer, thusly enclosing the surface of the substrate.

18. The precursor substrate according to claim 17, wherein the material of the substrate is polyimide.

19. The precursor substrate according to claim 17, wherein the adhesion enhancing layer includes a palladium adhesion enhancer.

20. The precursor substrate according to claim 17, wherein the first electrical conducting layer has a thickness of 50 to 200 nanomenters, and the first electrical conducting layer is an electroless plating layer made of a material selected from the group consisting of copper, nickel, chromium, cobalt, nickel alloy and cobalt alloy.