CN107592739A - A kind of flexible PCB and preparation method thereof, electronic equipment - Google Patents
A kind of flexible PCB and preparation method thereof, electronic equipment Download PDFInfo
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- CN107592739A CN107592739A CN201710816816.5A CN201710816816A CN107592739A CN 107592739 A CN107592739 A CN 107592739A CN 201710816816 A CN201710816816 A CN 201710816816A CN 107592739 A CN107592739 A CN 107592739A
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Abstract
The invention discloses a kind of flexible PCB and preparation method thereof, electronic equipment, the preparation method of the flexible PCB includes：Pair of lamina compliant conductive base material is provided；Wherein, Double-layer flexible conductive base includes the first conductive layer, substrate and the second conductive layer being stacked；First conductive layer is etched, to remove at least part region of the first conductive layer；The first protection film layer is made in side of the substrate away from the second conductive layer, and the second protection film layer is made in side of second conductive layer away from substrate.By the above-mentioned means, on the one hand flexible PCB provided by the invention has more preferable pliability, bending, distortion are advantageously implemented, on the other hand with more preferable intensity, is not easy to be torn.
Description
Technical field
The present invention relates to flexible PCB technical field, more particularly to a kind of flexible PCB and preparation method thereof, electricity
Sub- equipment.
Background technology
Flexible PCB (Flexible Printed Circuit, abbreviation FPC) be using polyimides or polyester film as
It is a kind of made of base material that there is height reliability, excellent flexible printed circuit.It is high, in light weight, thick with Distribution density
Spend the characteristics of thin, bending property is good.
But just because of above-mentioned in light weight, thickness of thin, bending property is good the features such as, cause flexible PCB assembling and tieing up
It is easily torn when repairing so that yield reduces electronic product in process of production, cost increase.
The content of the invention
In order to solve the above technical problems, one aspect of the present invention is：Pair of lamina compliant conductive base material is provided；
Wherein, Double-layer flexible conductive base includes the first conductive layer, substrate and the second conductive layer being stacked；To the first conductive layer
It is etched, to remove at least part region of the first conductive layer；The is made in side of the substrate away from the second conductive layer
One protection film layer, and make the second protection film layer in side of second conductive layer away from substrate.
In order to solve the above technical problems, one aspect of the present invention is：A kind of flexible PCB is provided, this is soft
Property circuit board include the first protection film layer, single-layer flexible conductive base and the second protection film layer that are stacked；Wherein, individual layer
Compliant conductive base material is using Double-layer flexible conductive base and etches away one layer of conductive layer in Double-layer flexible conductive base extremely
Obtained by small part region, Double-layer flexible conductive base includes the first conductive layer, substrate and the second conduction being stacked
Layer.
In order to solve the above technical problems, one aspect of the present invention is：A kind of electronic equipment, the electronics are provided
Equipment includes the flexible PCB that preparation method described above makes, or the electronic equipment includes flexible PCB described above.
Brief description of the drawings
Fig. 1 is the structural representation of the embodiment of flexible PCB one provided by the invention；
Fig. 2 is the structural representation of another embodiment of flexible PCB provided by the invention；
Fig. 3 is the structural representation of flexible PCB another embodiment provided by the invention；
Fig. 4 is the structural representation of the another embodiment of flexible PCB provided by the invention；
Fig. 5 is flexible PCB provided by the invention and the structural representation of another embodiment；
Fig. 6 is the schematic flow sheet of the embodiment of preparation method one of flexible PCB provided by the invention；
Fig. 7 be flexible PCB provided by the invention another embodiment of preparation method in step 32 schematic flow sheet；
Fig. 8 is the schematic flow sheet of the preparation method another embodiment of flexible PCB provided by the invention；
Fig. 9 be flexible PCB provided by the invention preparation method another embodiment in step 52 schematic flow sheet；
Figure 10 is the structural representation of the embodiment of electronic equipment one provided by the invention；
Figure 11 is the structural representation of flexible PCB in another embodiment of electronic equipment provided by the invention.
Embodiment
Below in conjunction with the accompanying drawing in the embodiment of the present invention, the technical scheme in the embodiment of the present invention is carried out clear, complete
Site preparation describes.It is understood that specific embodiment described herein is only used for explaining the present invention, rather than the limit to the present invention
It is fixed.It also should be noted that for the ease of description, part related to the present invention illustrate only in accompanying drawing and not all knot
Structure.Based on the embodiment in the present invention, what those of ordinary skill in the art were obtained under the premise of creative work is not made
Every other embodiment, belongs to the scope of protection of the invention.
Term " first ", " second " in the present invention etc. are to be used to distinguish different objects, rather than specific suitable for describing
Sequence.In addition, term " comprising " and " having " and their any deformations, it is intended that cover non-exclusive include.Such as comprising
The step of process of series of steps or unit, method, system, product or equipment are not limited to list or unit, and
It is alternatively also to include the step of not listing or unit, or alternatively also includes for these processes, method, product or equipment
Intrinsic other steps or unit.
Referenced herein " embodiment " is it is meant that the special characteristic, structure or the characteristic that describe can wrap in conjunction with the embodiments
In at least one embodiment of the present invention.Each position in the description occur the phrase might not each mean it is identical
Embodiment, nor the independent or alternative embodiment with other embodiments mutual exclusion.Those skilled in the art explicitly and
Implicitly understand, embodiment described herein can be combined with other embodiments.
Electronic equipment provided in an embodiment of the present invention can be mobile phone, tablet personal computer, Intelligent worn device etc., these electronics
Typically all include flexible PCB in equipment.
Flexible PCB (Flexible Printed Circuit, abbreviation FPC) be using polyimides or polyester film as
It is a kind of made of base material that there is height reliability, excellent flexible printed circuit.It is high, in light weight, thick with Distribution density
Spend the characteristics of thin, bending property is good.
It should be understood that in the production and supply chain of flexible PCB, the assembly enterprise purchase of electronic equipment is only
Compliant conductive base material, that is, include the substrate and conductive layer being stacked, for example, flexible copper clad base material (Flexible Copper
Clad Laminate, abbreviation FCCL), FCCL mainly includes individual layer FCCL and double-deck FCCL, and individual layer FCCL includes what is be stacked
Substrate and conductive layer, double-deck FCCL include the first conductive layer, substrate and the second conductive layer being stacked.
, it is necessary to carry out patterned process shape to the conductive layer on FCCL in the manufacture craft for carrying out FPC is processed to FCCL
The processing that comes to the surface is carried out into circuit, and to FCCL.For example, by taking individual layer FCCL as an example, figure is carried out in the conductive layer to individual layer FCCL
After caseization processing, layer protecting film can be covered on the electrically conductive, for another example by taking double-deck FCCL as an example, to the of double-deck FCCL
After one conductive layer and/or the second conductive layer carry out patterned process, it can distinguish on the surface of the first conductive layer and the second conductive layer
Covering protection film.
In actual applications, flexible PCB can bend, distort in use, be made using above-mentioned individual layer FCCL
Flexible PCB, intensity is not high, is easily torn during bending, distortion, and uses what above-mentioned double-deck FCCL made
Flexible PCB, due to not high with two conductive layers, pliability, it is difficult to used in bending, distortion.
Refering to Fig. 1, Fig. 1 is the structural representation of the embodiment of flexible PCB one provided by the invention, the flexible PCB
Including the first protection film layer 11, the protection film layer 13 of single-layer flexible conductive base 12 and second being stacked.
Wherein, single-layer flexible conductive base 12 is using Double-layer flexible conductive base and etches away Double-layer flexible conductive base
In one layer of conductive layer obtained by, Double-layer flexible conductive base includes the first conductive layer, the substrate and second that are stacked
Conductive layer.Single-layer flexible conductive base 12 in the present embodiment includes the substrate 121 and conductive layer 122 being stacked.
It should be understood that Double-layer flexible conductive base therein can be the former material made that supplier provides
Material, i.e., the conductive layer of substrate and substrate both sides made together with, alternatively, it is also possible to purchase baseplate material and conduction material
Material, and make to obtain above-mentioned single-layer flexible conductive base using coating process.
Wherein, substrate 121 can use polyimides (PI) or PET (PET) to make, its thickness
It can be 5 μm -150 μm.
Wherein, conductive layer 122 can use electrolytic copper foil or rolled copper foil to make, and its thickness can be 5 μm -70 μm.
Wherein, the first protection film layer 11 and the second protection film layer 13 are also cover layer, are typically made using polyimides (PI)
Make.
It should be understood that between the first protection film layer 11 and single-layer flexible conductive base 12 and single-layer flexible is conductive
Between the protection film layer 13 of base material 12 and second, in addition to the adhesive for pasting, specifically, it is with the first protection film layer 11
Example, a layer of adhesive can be first coated in the lower surface of single-layer flexible conductive base 12, then be protected by way of pressing by first
Cuticular layer 11 is pressed together on the lower surface of single-layer flexible conductive base 12, can be first soft in individual layer by taking the second protection film layer 13 as an example
Property conductive base 12 upper surface coating a layer of adhesive, then the second protection film layer 13 is pressed together on individual layer by way of pressing
The upper surface of compliant conductive base material 12.
Therefore, as shown in Fig. 2 in another embodiment of flexible PCB provided by the invention, the flexible PCB can
With including the first protection film layer 21, first adhesive phase 22, substrate 23, conductive layer 24, the second adhesive phase 25 that are stacked
And second protection film layer 26.
Below with six kinds of specific examples, book is illustrated to the thickness of each layer of flexible PCB in the present embodiment：
In first example, the thickness of the first protection film layer 21 is 12.5 μm, and the thickness of first adhesive phase 22 is 25 μ
M, the thickness of substrate 23 is 25 μm, and the thickness of conductive layer 24 is 12 μm, and the thickness of second adhesive phase 25 is 25 μm, and second protects
The thickness of cuticular layer 26 is 12.5 μm.The gross thickness of the flexible PCB is 112 μm.
In second example, the thickness of the first protection film layer 21 is 12.5 μm, and the thickness of first adhesive phase 22 is 25 μ
M, the thickness of substrate 23 is 20 μm, and the thickness of conductive layer 24 is 12 μm, and the thickness of second adhesive phase 25 is 25 μm, and second protects
The thickness of cuticular layer 26 is 12.5 μm.The gross thickness of the flexible PCB is 107 μm.
In third example, the thickness of the first protection film layer 21 is 12.5 μm, and the thickness of first adhesive phase 22 is 20 μ
M, the thickness of substrate 23 is 25 μm, and the thickness of conductive layer 24 is 12 μm, and the thickness of second adhesive phase 25 is 20 μm, and second protects
The thickness of cuticular layer 26 is 12.5 μm.The gross thickness of the flexible PCB is 102 μm.
In fourth example, the thickness of the first protection film layer 21 is 12.5 μm, and the thickness of first adhesive phase 22 is 20 μ
M, the thickness of substrate 23 is 20 μm, and the thickness of conductive layer 24 is 12 μm, and the thickness of second adhesive phase 25 is 20 μm, and second protects
The thickness of cuticular layer 26 is 12.5 μm.The gross thickness of the flexible PCB is 97 μm.
In fifth example, the thickness of the first protection film layer 21 is 12.5 μm, and the thickness of first adhesive phase 22 is 15 μ
M, the thickness of substrate 23 is 25 μm, and the thickness of conductive layer 24 is 12 μm, and the thickness of second adhesive phase 25 is 15 μm, and second protects
The thickness of cuticular layer 26 is 12.5 μm.The gross thickness of the flexible PCB is 92 μm.
In the 6th example, the thickness of the first protection film layer 21 is 12.5 μm, and the thickness of first adhesive phase 22 is 15 μ
M, the thickness of substrate 23 is 20 μm, and the thickness of conductive layer 24 is 12 μm, and the thickness of second adhesive phase 25 is 15 μm, and second protects
The thickness of cuticular layer 26 is 12.5 μm.The gross thickness of the flexible PCB is 87 μm.
It is different from the situation of prior art, the first protection film layer that the flexible PCB of the present embodiment includes being stacked,
Single-layer flexible conductive base and the second protection film layer；Wherein, single-layer flexible conductive base is to use Double-layer flexible conductive base
And obtained by etching away one layer of conductive layer in Double-layer flexible conductive base, Double-layer flexible conductive base includes what is be stacked
First conductive layer, substrate and the second conductive layer.By the above-mentioned means, the flexible PCB of the present embodiment is compared to individual layer
FCCL adds the flexible PCB of single layer protection film to have higher intensity, is advantageous to anti-tear, while adds compared to double-deck FCCL
The flexible PCB of double shielding film has more preferable pliability, is advantageously implemented bending, distortion.
Refering to Fig. 3, Fig. 3 is the structural representation of flexible PCB another embodiment provided by the invention, the flexible electrical
Road plate can include be stacked the first protection film layer 31, first adhesive phase 32, the first conductive layer 33, substrate 34, second
Conductive layer 35, the protection film layer 37 of second adhesive phase 36 and second.
Wherein, after the first conductive layer 33 is etched, subregion is eliminated, first adhesive phase 32 is in the part
It can be applied directly on substrate 34 on region.
Optionally, in the present embodiment, the subregion is the bending region of flexible PCB.
It should be understood that because two conductive layers can influence the bending performance of flexible PCB, in the above embodiments
Except the second all conductive layers, but the above embodiments can be only applied to the circuit trace of individual layer.In the present embodiment, only
The subregion of second conductive layer 33 is removed, other parts still retain, and still can realize circuit trace.
Specifically, walking line can be entered in normal fashion in the region for retaining the second conductive layer, in the part of etching
Circuit on second conductive layer 33 can be guided to the first conductive layer 35 by region by the form of the making through hole on substrate 34
On, then backed on the second conductive layer 35 by another through hole on substrate 34.
Refering to Fig. 4, Fig. 4 is the structural representation of the first conductive layer in the another embodiment of flexible PCB provided by the invention
Figure, the stepped construction of the flexible PCB of this implementation is similar to the above embodiments, and difference is, and first in the present embodiment
Conductive layer 40 is designed using hollow out.
In other words, when being etched in this implementation to the first conductive layer 40, the more of the first conductive layer 40 are etched away
Individual region, form multiple void regions 41.In the present embodiment, to the size, quantity and distribution shape of void region 41 not
It is construed as limiting.
It should be understood that the first conductive layer 40 includes multiple void regions 41, flexible PCB on the one hand can be improved
Hardness, it on the other hand can also improve the bending performance of flexible PCB.In addition, circuit trace on the first conductive layer 40 can be with
It is distributed in non-void region.
Refering to Fig. 5, Fig. 5 is the structural representation of the first conductive layer in flexible PCB provided by the invention and another embodiment
Figure, the stepped construction of the flexible PCB of this implementation is similar to the above embodiments, and difference is, and first in the present embodiment
Conductive layer 50 is designed using hollow out.
In other words, when being etched in this implementation to the first conductive layer 50, etch away needs on the first conductive layer 50
The central area for the part to be bent, form void region 51.
In the present embodiment, different from all etching away the bending region part of the first conductive layer in above-described embodiment,
But the marginal portion in bending region is remained, core is etched away, so, strengthens flexible PCB bending region
The intensity of marginal portion, the circuit board of flexibility is set to be not easy to be torn during bending.
Refering to Fig. 6, Fig. 6 is the schematic flow sheet of the embodiment of preparation method one of flexible PCB provided by the invention, should
Method includes：
Step 61：Pair of lamina compliant conductive base material is provided；Wherein, Double-layer flexible conductive base includes first be stacked
Conductive layer, substrate and the second conductive layer.
It should be understood that Double-layer flexible conductive base therein is the raw material made that supplier provides, i.e.,
Together with substrate has been made with two conductive layers.The method of the present embodiment is that Double-layer flexible conductive base is carried out further
Working process.
Optionally, substrate can use polyimides (PI) or PET (PET) to make, its thickness
It can be 5 μm -150 μm.Conductive layer can use electrolytic copper foil or rolled copper foil to make, and its thickness can be 5 μm -70 μm.
Optionally, in one embodiment, the Double-layer flexible conductive base is flexible copper clad base material, and it includes what is be stacked
First copper foil layer, substrate and the second copper foil layer.
Step 62：First conductive layer is etched, to remove at least part region of the first conductive layer.
Certainly, in another embodiment, the second conductive layer can also be etched, retains the first conductive layer.
It should be understood that the compliant conductive base material that the present embodiment uses includes two conductive layers, if retaining two conductive layers,
It can make it that the flexible PCB hardness of making is higher, bending performance reduces, therefore, in the present embodiment, by the way of etching
Remove one layer of conductive layer.
Optionally, in other embodiments, it can be only that the first conductive layer is partially etched, it is conductive to remove first
The subregion of layer.For example, the region that bend can be needed to be etched the first conductive layer, and remaining part still can be with
Carry out circuit trace.
Step 63：The first protection film layer is made in side of the substrate away from the second conductive layer, and it is remote in the second conductive layer
Side from substrate makes the second protection film layer.
Optionally, wherein, the first protection film layer and the second protection film layer are also cover layer, typically using polyimides (PI)
Make.
Optionally, as shown in fig. 7, in another embodiment, step 63 can specifically include：
Step 631：First adhesive phase is coated in side of the substrate away from the second conductive layer, and it is remote in the second conductive layer
Side from substrate coats second adhesive phase.
It should be understood that being not construed as limiting in substrate side and in the order of conductive layer side application of adhesive, certainly, also may be used
To be coated in both sides simultaneously.
Step 632：The first protection film layer is pasted in first adhesive phase, and second is pasted in second adhesive phase
Protection film layer.
It should be understood that the order for pasting the second protection film layer of the first protection film layer and stickup is not construed as limiting, certainly, also may be used
To be pasted in both sides simultaneously.
Optionally, the first protection film layer is pasted in step 632 and the second protection film layer of stickup specifically can be by pressing
Mode.
Refering to Fig. 8, Fig. 8 is the schematic flow sheet of the preparation method another embodiment of flexible PCB provided by the invention,
This method includes：
Step 81：Pair of lamina compliant conductive base material is provided；Wherein, Double-layer flexible conductive base includes first be stacked
Conductive layer, substrate and the second conductive layer.
It should be understood that Double-layer flexible conductive base therein is the raw material made that supplier provides, i.e.,
Together with substrate has been made with two conductive layers.The method of the present embodiment is that Double-layer flexible conductive base is carried out further
Working process.
Optionally, substrate can use polyimides (PI) or PET (PET) to make, its thickness
It can be 5 μm -150 μm.Conductive layer can use electrolytic copper foil or rolled copper foil to make, and its thickness can be 5 μm -70 μm.
Optionally, in another embodiment, Double-layer flexible conduction can also be made using baseplate material and conductive material
Base material.Specifically, there is provided a substrate；Conductive layer is made using coating process respectively in the two sides of substrate.Wherein it is possible to using
The mode of plating, alternatively, it is also possible to be made by the way of calendering.
Step 82：First conductive layer and the second conductive layer are etched, to remove at least portion of the first conductive layer
Subregion, and patterned process is carried out to the remaining area of the first conductive layer and the second conductive layer and forms conducting wire.
It should be understood that because the first Conductive Layer Etch eliminates subregion, cause the remaining area on the first conductive layer
Domain is incoherent, therefore, through hole can be opened up on substrate, the circuit on the first conductive layer is guided on the second conductive layer.
Optionally, as shown in figure 9, step 82 can specifically include：
Step 821：Photoresist is coated on the first conductive layer and the second conductive layer.
Step 822：The conductive layer of light shield irradiation light first and the second conductive layer of UV light permeability setting pattern is respectively adopted
On photoresist.
Step 823：Photoresist after illumination is partially stripped.
Wherein, photoresist is also known as photoresist, and by photosensitive resin, sensitizer, (and solvent three kinds of main components form
Photosensitive mixing liquid.After illumination, in exposure region photocuring reaction can soon occur for photosensitive resin so that this material
Significant change occurs for the physical property of material, particularly dissolubility, affinity etc..Handled through appropriate solvent, dissolve soluble portion
Point, obtain required image.
Step 824：First conductive layer and the second conductive layer are etched.
It should be understood that the light shield of the setting pattern in above-mentioned steps 822 has drawn out circuitous pattern, therefore in step
Remaining photoresist is circuitous pattern after photoresist lift off in 823, and conductive layer is etched in step 824,
The part for not having photoresist to cover on conductive layer can all be etched away, retain the part of photoresist covering, that is, ultimately form
Conducting wire.
Wherein, the method for etching typically uses wet etching, in other examples, can also use the side of dry ecthing
Formula, for example, being etched using special gas to exposed conductive layer.
It should be understood that because photoresist is only coated in the second conductive layer side, therefore, in the etching process of step 524
In, the first conductive layer is all etched away, and the second conductive layer then remains circuit pattern.
Step 825：Remove remaining photoresist.
Step 83：First adhesive phase is coated in side of the substrate away from the second conductive layer, and it is remote in the second conductive layer
Side from substrate coats second adhesive phase.
Step 84：The first protection film layer is pasted in first adhesive phase, and second is pasted in second adhesive phase
Protection film layer.
Optionally, wherein, the first protection film layer and the second protection film layer are also cover layer, typically using polyimides (PI)
Make.
Optionally, the present embodiment can be entered by the way of pressing after pressing by 150-200 DEG C of high temperature
The row solidification of one hour.
Step 85：Through hole is made in the second protection film layer, to expose partially electronically conductive circuit.
It should be understood that separated time road needs to carry out grafting or welding with external component in the middle part of conducting wire, with welding
Exemplified by, it is necessary to make pad in conducting wire, therefore, through hole can be opened up in the second protection film layer, be led what is exposed
Electric line part can carry out the making of pad, can be nickel gold processing specifically.
In addition, step 84 and step 85 can also carry out following replace：The first relevant position system in the second protection film layer
Make through hole, retell the second protection film layer and be pasted onto in second adhesive phase.It should be understood that the second protection film layer is pre-production
Alright, therefore, the second protection film layer has all pre-seted through hole, so, in the Making programme of flexible PCB, it is only necessary to according to
The flow of step 84 carries out the stickup of the second protection film layer.
Flexible PCB in the present embodiment, existing Double-layer flexible conductive base is etched away into one layer of conductive layer, then
The top and bottom of Double-layer flexible conductive base make two layers of protection film layer, compared to the flexible circuit that individual layer FCCL adds single layer protection film
Plate has higher intensity, is advantageous to anti-tear, while adds the flexible PCB of double shielding film to have compared to double-deck FCCL
More preferable pliability, it is advantageously implemented bending, distortion.
Refering to Figure 10, Figure 10 is the structural representation of the embodiment of electronic equipment one provided by the invention, the electronic equipment 100
Including flexible PCB 101.
Optionally, with continued reference to Figure 10, by taking mobile phone as an example, the flexible PCB 101 can apply to the He of cell phone mainboard 102
The circuit connected between mobile phone side key 103.
It should be understood that because mobile phone side key 103 is installed on mobile phone side, therefore, cell phone mainboard 102 and mobile phone side are connected
Flexible PCB 101 between key 103 can bend in installation process, distort, so, connect the soft of mobile phone side key 103
Property circuit board 101 to intensity, it is flexible require it is higher.
Flexible PCB 101 in the present embodiment can include the first protection film layer, the single-layer flexible conduction being stacked
Base material and the second protection film layer；Wherein, single-layer flexible conductive base is using Double-layer flexible conductive base and etches away bilayer
Obtained by least part region of one layer of conductive layer in compliant conductive base material, Double-layer flexible conductive base includes being stacked
The first conductive layer, substrate and the second conductive layer.
It should be understood that as shown in figure 11, the flexible PCB 101 in the present embodiment is curved due to needing in use
Folding, therefore, reinforcer 1011 can be set at the edge for the part that flexible PCB 101 needs to bend.
Optionally, reinforcement can be respectively provided with the edge for the part that the needs of two sides of flexible PCB 101 are bent
Part 1011.
Specifically, in one embodiment, can be by the first protection film layer and the second protection film layer in the portion that needs are bent
The edge divided sets more to thicken；In another embodiment, the first protection film layer and the second protection film layer can also made
Afterwards, reinforcer 1011 is set in addition at the edge for the part that the first protection film layer and the second protection film layer need to bend.
Wherein, the material of reinforcer 1011 can be identical with the first protection film layer and the second protection film layer, for example, it may be
Polyimides (PI).
It should be understood that flexible PCB and the flexible PCB of above-mentioned offer in the electronic equipment that the present embodiment provides
It is no longer superfluous here and the structure of the flexible PCB in the embodiment of the preparation method of flexible PCB is similar with preparation method
State.
Embodiments of the present invention are the foregoing is only, are not intended to limit the scope of the invention, it is every to utilize this
The equivalent structure or equivalent flow conversion that description of the invention and accompanying drawing content are made, or directly or indirectly it is used in other correlations
Technical field, it is included within the scope of the present invention.
Claims (10)
- A kind of 1. preparation method of flexible PCB, it is characterised in that including：Pair of lamina compliant conductive base material is provided；Wherein, the Double-layer flexible conductive base include be stacked the first conductive layer, Substrate and the second conductive layer；First conductive layer is etched, to remove at least part region of first conductive layer；The first protection film layer is made in side of the substrate away from second conductive layer, and it is remote in second conductive layer Side from the substrate makes the second protection film layer.
- 2. preparation method according to claim 1, it is characterised in thatIt is described that the first protection film layer is made in side of the substrate away from second conductive layer and conductive described second The step of side of the layer away from the substrate makes the second protection film layer, including：First adhesive phase is coated in side of the substrate away from second conductive layer, and it is remote in second conductive layer Side from the substrate coats second adhesive phase；The first protection film layer is pasted in the first adhesive phase, and the second protection is pasted in the second adhesive phase Film layer.
- 3. preparation method according to claim 2, it is characterised in thatIt is described that first conductive layer is etched, to remove the step at least part region of first conductive layer Suddenly, including：First conductive layer and second conductive layer are etched, to remove first conductive layer extremely Small part region, and patterned process is carried out to the remaining area of first conductive layer and second conductive layer and formed Conducting wire.
- 4. preparation method according to claim 3, it is characterised in thatIt is described that the first protection film layer is pasted in the first adhesive phase, and paste second in the second adhesive phase After the step of protection film layer, in addition to：Through hole is made in second protection film layer, to expose the part conducting wire.
- 5. preparation method according to claim 3, it is characterised in thatIt is described that first conductive layer and second conductive layer are etched, to remove first conductive layer At least part region, and to second conductive layer carry out patterned process formed conducting wire the step of, including：Photoresist is coated on first conductive layer and second conductive layer；The light that the light shield of UV light permeability setting pattern is irradiated on first conductive layer and second conductive layer is respectively adopted Photoresist；Photoresist after illumination is partially stripped；First conductive layer and second conductive layer are etched；Remove remaining photoresist.
- 6. preparation method according to claim 1, it is characterised in thatThe step of offer pair of lamina compliant conductive base material, including：One substrate is provided；First conductive layer and the second conductive layer are made using coating process respectively in two sides of the substrate.
- 7. flexible PCB according to claim 1, it is characterised in thatThe conductive layer is copper foil；OrFirst protection film layer and second protection film layer are made using polyimide material.
- 8. flexible PCB according to claim 1, it is characterised in thatAt least part region is the bending region of the flexible PCB.
- A kind of 9. flexible PCB, it is characterised in that including be stacked the first protection film layer, single-layer flexible conductive base with And second protection film layer；Wherein, the single-layer flexible conductive base is using Double-layer flexible conductive base and etches away the Double-layer flexible conductive base Obtained by the subregion of one layer of conductive layer in material, the Double-layer flexible conductive base includes the first conduction being stacked Layer, substrate and the second conductive layer.
- 10. a kind of electronic equipment, it is characterised in that the electronic equipment includes the making as described in claim any one of 1-8 The flexible PCB that method makes, or the electronic equipment include flexible PCB as claimed in claim 9.
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Application publication date: 20180116 |