KR20140088732A

KR20140088732A - Method of manufacturing circuit board and chip package

Info

Publication number: KR20140088732A
Application number: KR1020130000632A
Authority: KR
Inventors: 조성준; 설정훈; 이재욱; 김상근
Original assignee: 주식회사 엠디에스
Priority date: 2013-01-03
Filing date: 2013-01-03
Publication date: 2014-07-11

Abstract

The present invention provides a method of manufacturing a thin circuit board, comprising: preparing a core substrate having at least one inner circuit pattern formed on at least one surface thereof to form a thin circuit board; forming a thermoplastic resin on at least one surface of the core substrate; Semi-curing the thermoplastic resin; Joining the core substrate and an insulating film having a conductive layer formed on an outer surface thereof by a lamination method using a roller through the thermoplastic resin; Forming an outer circuit pattern on the conductive layer; .

Description

BACKGROUND OF THE INVENTION 1. Field of the Invention [0001] The present invention relates to a circuit board,

One embodiment of the present invention relates to a circuit board and a method of manufacturing a chip package.

In recent years, the number of components has been increasing due to the smaller size of electronic components and consumers preferring one product to have various functions. Therefore, a technique for mounting a large number of electronic components on a circuit board at a high density is required.

A multi-layer circuit board is a component of an electronic device in which a plurality of substrates are stacked in a multilayer manner to mount electronic components. The multilayer circuit board is capable of performing a number of complicated functions electrically in comparison with a single-sided or double-sided board, and is widely used in various electronic apparatuses because it enables high-density mounting of electronic components.

The multilayer circuit board is formed by sequentially laminating and pressing a semi-cured prepreg prepared by impregnating glass fiber with epoxy on a core substrate and a conductive layer.

However, the manufacturing method of such a multilayer circuit board has a limitation in manufacturing a thinned circuit board because of the thickness of the prepreg. Further, when the prepregs are laminated and pressed, epoxy of the prepreg flows out to contaminate the equipment or to remain on the surface of the conductive layer, thereby deteriorating the quality.

KR 2012-0042416 10

In order to solve the above-described problems, an embodiment of the present invention provides a method of manufacturing a circuit board and a chip package using a thermoplastic resin.

According to an aspect of the present invention, there is provided a method of manufacturing a semiconductor device, comprising: preparing a core substrate having an inner circuit pattern formed on at least one surface thereof; Forming a thermoplastic resin on at least one side of the core substrate; Semi-curing the thermoplastic resin; Joining the core substrate and an insulating film having a conductive layer formed on an outer surface thereof by a lamination method using a roller through the thermoplastic resin; Forming an outer circuit pattern on the conductive layer; The method comprising the steps of:

The thermoplastic resin includes a thermoplastic polyimide.

The step of forming the thermoplastic resin may use at least one of a dipping method, a spray method, and a brushing coating method.

Adjusting the thickness of the thermoplastic resin after forming the thermoplastic resin on at least one side of the core substrate; .

Each step of the method of manufacturing the circuit board is performed by a roll-to-roll method, and the step of adjusting the thickness is performed by using a roller.

According to another aspect of the present invention, there is provided a method of manufacturing a semiconductor device, comprising: preparing a core substrate having an inner circuit pattern formed on at least one surface thereof; Forming a thermoplastic polyimide on at least one side of the core substrate; Semi-curing the thermoplastic polyimide; Bonding the core substrate and an insulating film having a conductive layer formed on an outer surface thereof to the thermoplastic polyimide by a lamination method using a roller; Forming an outer circuit pattern on the conductive layer; Forming a protective layer to cover a part of the outer circuit pattern; And mounting a chip on the protection layer to be connected to the outer circuit pattern. The method of manufacturing a chip package according to claim 1,

According to one embodiment of the present invention, a circuit board is manufactured by bonding an insulating film on which a conductive layer is formed by using a thermoplastic polyimide, thereby making it possible to produce a thin, compact, lightweight circuit board.

1 is a schematic view illustrating a method of manufacturing a circuit board according to an embodiment of the present invention.
2 is an enlarged view of II in Fig.
Fig. 3 is an enlarged view of Fig.
Fig. 4 is an enlarged view of Fig.
FIG. 5 is an enlarged view of FIG. 1; FIG.
FIG. 6 is an enlarged view of FIG. 1 VI. FIG.
7 is an enlarged view of VII in Fig.
8 is an enlarged view of VIII of FIG.
9 schematically shows a chip package manufactured according to an embodiment of the present invention.

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Hereinafter, the present invention will be described in detail with reference to the accompanying drawings.

In this specification, parts that are not related to the present invention are omitted or simplified or shown in order to clearly illustrate the present invention. Further, in the drawings, the thickness and the width are enlarged or exaggerated to clearly illustrate the various layers and regions.

Throughout the specification, the same or similar components are denoted by the same reference numerals. In this specification, terms such as " first ", " second ", and the like are used for the purpose of distinguishing one element from another element. In addition, when a part of a film, an area, a component or the like is referred to as being "on" or "on" another part, not only the part directly above another part but also another film, area, And the like.

1 is a schematic view illustrating a method of manufacturing a circuit board according to an embodiment of the present invention. Figs. 2 to 8 are enlarged views of II to VIII of Fig. 1, respectively. Figs. 2 to 3 show cross-sectional views of the laminated bodies cut in the thickness direction in the step of manufacturing the circuit board. Here, the laminate may be a core substrate or a state in which another material is coated or laminated on the core substrate. In the method of manufacturing a circuit board described below, various materials such as a core substrate may be provided in a wound form on a reel. As the reel rotates, an etching process or other materials The application process can be executed.

Referring to FIG. 1, first, a core substrate 10 is prepared.

The core substrate 10 may be provided in the form of being wound on the first reel 1. The core substrate 10 may have an inner circuit pattern formed on at least one surface thereof or an inner circuit pattern formed on both surfaces thereof as shown in FIG.

The core substrate 10 includes first and second conductive layers 101 and 102 having inner circuit patterns P1 and P2 formed on both surfaces of a first insulating film 110, respectively. Here, the first insulating film 110 may be a polyimide film. The polyimide film is a thin film, and has heat resistance and flexibility, so that a flexible circuit board can be manufactured.

The first and second conductive layers 101 and 102 may be made of a low resistance metal material including at least one selected from silver (Ag), nickel (Ni), copper (Cu), and combinations thereof. The inner circuit patterns P1 and P2 may be formed on the first and second conductive layers 101 and 102, respectively. The inner circuit patterns P1 and P2 are formed by a subtractive method including a tenting method and a panel / pattern method, a semi-additive method (SAP) Including the Modified Semi-Additive Method (MSAP), the Advanced Modified Semi-Additive Method (AMSAP), and the Full-Additive Method (FAP) Additive) method or the like. In the subtractive method, an unnecessary portion of the conductive layer is selectively removed by etching or the like to form a circuit pattern. In the edited method, a conductive material is selectively deposited on the conductive layer by plating or the like to form a circuit pattern The method is well known in the art and will not be described in detail. In the figure, the inner circuit pattern is formed by the tenting method.

Next, a thermoplastic resin is formed on at least one surface of the core substrate 10.

Specifically, the core substrate 10 is transferred to the thermoplastic resin forming space 1000 to form a thermoplastic resin on both sides or one side. A thermoplastic resin is a resin capable of deforming its shape when it is heated again after heat is applied. According to one embodiment of the present invention, the thermoplastic resin may be a thermoplastic polyimide (20). The thermoplastic polyimide 20 has an excellent adhesive strength and can be used as an adhesive when laminating other members to the core substrate 10, and can be coated and formed with a thin film, so that a circuit board can be manufactured in a thin shape.

There are various methods for forming the thermoplastic polyimide 20 on the core substrate 1. For example, a dipping method as shown in FIG. In detail, when the thermoplastic polyimide 20 is provided in a bath of varnish type, the core substrate 10 is immersed in the thermoplastic polyimide 20 and slowly lifted up at a constant speed, (10) is coated with the thermoplastic polyimide (20). According to the dipping method, the thickness of the thermoplastic polyimide 20 coated on the core substrate 10 can be determined by the viscosity of the thermoplastic polyimide 20 and the speed at which the core substrate 10 is lifted. For example, the thermoplastic polyimide 20 may be coated to a thickness of about 2 to 4 micrometers. This dipping method has the advantage of simple equipment and simple process. In FIG. 3, the laminate 200 is shown in which both surfaces of the core substrate 10 are coated with the thermoplastic polyimide 20.

However, the present invention is not limited thereto. The thermoplastic polyimide 20 may be coated on one surface of the core substrate 10 with a releasing film attached thereto, It is also possible to coat only. This method can be used in a method of manufacturing a circuit board including three layers.

As another example, the thermoplastic polyimide 20 may be formed by a spray method. The spraying method is a method of supplying and coating the thermoplastic polyimide 20 through a nozzle. A nozzle of a type that radiates in all directions may be used, or a drop type nozzle may be used. The spraying method is advantageous in that it is easy to coat only the end face of the core substrate 10. As another example, the thermoplastic polyimide 20 may be painted on the core substrate 10 by using a brush, such as a brushing coating method. In addition, the thermoplastic polyimide 20 may be uniformly applied to the core substrate 10 by using a spin coating method. However, there is a problem that the spin coating method is difficult to apply to a circuit board manufacturing method using roll to roll.

Next, the thickness of the thermoplastic resin 20 formed on the core substrate 10 is adjusted.

In detail, the laminate 300 of FIG. 3 is transferred to the thickness adjusting space 2000. The thickness of the thermoplastic polyimide (20) formed on the core substrate (10) is adjusted by using the thickness adjusting rollers (2).

This step may be performed by moving the thermoplastic polyimide 20 thickly formed on a portion of the core substrate 10 through the thickness adjusting rollers 2 to a thermoplastic Making the polyimide (20) resin thinner. In the case where the thermoplastic polyimide 20 is formed by the dipping method, the surface of the thermoplastic polyimide 20 is made uniform through this step, or the void between the inner circuit patterns P1 and P2 is removed, The bonding force of the mid 20 can be further improved. Referring to the laminate 400 of FIG. 4, it can be seen that the thickness of the thermoplastic polyimide 20 formed on the core substrate 10 is reduced and the surface is uniformed compared to the laminate 300 of FIG.

Next, the thermoplastic resin 20 formed on the core substrate 10 is semi-cured.

Specifically, the laminate 400 of FIG. 4 is transferred to the curing space 3000. Heat is applied in the curing space 3000 for a predetermined period of time to semi-cure the thermoplastic polyimide 20. For example, semi-curing can be performed by heat treating at a temperature of about 150 degrees Celsius for about 10 minutes. 5 is a laminated body 500 in which the thermoplastic resin 20 is semi-cured.

This step is a step for reducing the fluidity of the thermoplastic resin 20 and facilitating further handling. In the step of forming the thermoplastic resin 20 on the core substrate 10, the thermoplastic resin 20 is in the same liquid state as the varnish type. Therefore, the liquid phase material is coated on the core substrate, and the liquid phase material is easily buried in the equipment, thereby contaminating the equipment and causing a problem of being left on the surface of other materials. To prevent such a problem, the thermoplastic resin 20 is semi-cured to reduce fluidity. Since the thermoplastic resin (20) is a material that can be re-formed when heat is applied, molding can be performed by applying heat again after semi-curing.

Next, the first film and the second film (23, 24) are bonded to the outer surface of the core substrate (10).

Specifically, the laminate 500 of FIG. 5 is transferred to the lamination space 4000 and bonded to the first and second films 23 and 24. The first film 23 is formed by laminating the third conductive layer 203 and the third insulating film 230 and the second film 24 is formed by laminating the fourth conductive layer 204 and the fourth insulating film 240 ). The first and second films 23 and 24 may be provided in the form of an insulating film on which the conductive layer is formed and wound on the second reel 3. When the second reel 3 rotates, 3 and may be provided to the laminate 500 of FIG.

The first and second films 23 and 24 and the core substrate 10 are joined together through the thermoplastic polyimide 20 so that the third and fourth conductive layers 203 and 204 are externally directed. At this time, the laminate 500 and the first and second films 23 and 24 of FIG. 5 are bonded by a lamination method in which the laminate 500 and the second films 23 and 24 are pressed at a high temperature by using the lamination roller 4. 6 shows a laminated body 600 in which the core substrate 10 and the first and second films 23 and 24 are bonded. For example, the lamination can be performed at a temperature of about 200 degrees Celsius. The temperature of the lamination step should be higher than the temperature of the semi-curing step. This is because the fluidity of the thermoplastic polyimide 20 is increased again so that the first and second films 23 and 24 and the core substrate 10 can be bonded together. Since the thermoplastic polyimide 20 serves as an adhesive as described above, the first and second films 23 and 24 and the core substrate 10 can be bonded together.

The third and fourth insulating films 230 and 240 are thin films and may be made of polyimide. This is because the polyimide can maintain its reliability without being deformed in a high-temperature bonding process because of its good heat resistance. Third and fourth conductive layers 203 and 204 are formed on one surface of each of the third and fourth insulating films 230 and 240. The third and fourth conductive layers 203 and 204 may be made of a low resistance metal material including at least one selected from silver (Ag), nickel (Ni), copper (Cu), and combinations thereof.

According to one embodiment of the present invention, there is a feature that a thin circuit board can be manufactured by bonding a polyimide film having a conductive layer formed thereon without using a prepreg through a thermoplastic polyimide to manufacture a multilayer circuit board. Further, by including the step of semi-curing the thermoplastic polyimide, there is no problem that the thermoplastic polyimide flows out to contaminate the equipment or to remain on the conductive layer to contaminate the quality of the product. Conventionally, the step of laminating a prepreg and a copper foil has been manually performed, and thus defects are likely to occur, workability is poor, and a large number of personnel are required. However, according to the present invention, There is an advantage that the process efficiency is maximized.

On the other hand, if the first film and the second film are flexible films, the circuit board of the present invention is also flexible.

Next, the outer circuit patterns P3 and P4 are formed on the third and fourth conductive layers 203 and 204, respectively.

6 is transferred to the circuit pattern forming space 5000 and the outer circuit patterns P3 and P4 are formed on the third and fourth conductive layers 203 and 204 as shown in FIG. The outer circuit patterns P3 and P4 are formed by a subtractive method including a tenting method and a panel / pattern method, a semi-additive method (SAP) Including the Modified Semi-Additive Method (MSAP), the Advanced Modified Semi-Additive Method (AMSAP), and the Full-Additive Method (FAP) Additive) method or the like. Therefore, redundant explanation is omitted.

On the other hand, when the outer circuit patterns P3 and P4 are formed, the vias V for energizing the inner circuit patterns P1 and P2 are formed together. The via hole passing through the insulating film can be formed by a mechanical method using a laser drill or by a chemical method using an etching solution. The inner wall of the via hole thus formed may be plated or the via hole may be filled with a low-resistance metal to form a via.

Next, the protective layer 30 is formed on the third and fourth conductive layers 230 and 240 where the outer circuit patterns P3 and P4 are formed.

Specifically, the laminate 700 of FIG. 7 is transferred to the protective layer formation space 6000 to apply photo solder resist (PSR) ink to the outer surface. The circuit board 800 thus manufactured is shown in Fig.

Up to now, a method of manufacturing a circuit board including a total of four layers has been described. However, in the method of manufacturing a circuit board according to an embodiment of the present invention, a circuit board including a 3-layer can also be manufactured. In this case, a thermoplastic resin is formed on only one side of the core substrate, and an insulating film on which a conductive layer is formed is laminated only on the portion where the thermoplastic resin is formed. Meanwhile, in the method of manufacturing a circuit board according to an embodiment of the present invention, a circuit board having four or more layers can also be manufactured. For example, in the case of a circuit board comprising a six-layer, the previous steps are repeated one more time. In the case of a circuit board comprising an 8-layer, the previous steps are repeated two more times. As described above, according to an embodiment of the present invention, a multilayer circuit board including various layers can be manufactured.

9 schematically shows a chip package 900 manufactured according to an embodiment of the present invention. In Fig. 9, a chip package 900 is manufactured using the circuit board (800 in Fig. 8) manufactured in Fig.

The semiconductor chip 50 is mounted on the upper surface of the circuit board (800 of FIG. 8) manufactured by FIG. The protective layer 30 is partially removed to expose the outer circuit patterns P3 and P4 and the outer circuit patterns P3 and P4 are electrically connected to the semiconductor chip 50 through the bonding of the wires 51. [ However, the present invention is not limited to this, and the external circuit pattern and the chip may be electrically connected through the energizing structure such as the bump by removing the protective layer of the portion where the semiconductor chip is mounted.

On the other hand, a plurality of solder balls 52 are formed on the circuit board opposite to the semiconductor chip 50. A part or all of the semiconductor chip 50, the bonding wires 51, and the circuit board are sealed with a mold resin 40, such as an epoxy mold compound, to complete the chip package.

In addition, although a via hole, a plated through hole (PTH), a circuit pattern of a predetermined type, and the like are shown in the drawings for explaining an embodiment according to the present invention, However, it should be understood that the present invention is not limited thereto, and that other forms, different numbers, and other patterns may be included without departing from the manufacturing method of the present invention.

Although the present invention has been described with reference to the limited embodiments, various embodiments are possible within the scope of the present invention. It will also be understood that, although not described, equivalent means are also incorporated into the present invention. Therefore, the true scope of protection of the present invention should be defined by the following claims.

10: core substrate
20: Thermoplastic polyimide
30: Protective layer

Claims

Preparing a core substrate having an inner circuit pattern formed on at least one surface thereof;
Forming a thermoplastic resin on at least one side of the core substrate;
Semi-curing the thermoplastic resin;
Joining the core substrate and an insulating film having a conductive layer formed on an outer surface thereof by a lamination method using a roller through the thermoplastic resin; And
Forming an outer circuit pattern on the conductive layer;
Wherein the method further comprises the steps of:

The method according to claim 1,
Wherein the thermoplastic resin comprises a thermoplastic polyimide.

The method according to claim 1,
The step of forming the thermoplastic resin includes:
Wherein at least one of a dipping method, a spraying method, and a brushing coating method is used.

The method according to claim 1,
After the step of forming the thermoplastic resin on at least one side of the core substrate
Adjusting the thickness of the thermoplastic resin;
Further comprising the steps of:

5. The method of claim 4,
Each step of the method of manufacturing the circuit board is performed by a roll to roll method,
Wherein the step of adjusting the thickness uses a roller.

Preparing a core substrate having an inner circuit pattern formed on at least one surface thereof;
Forming a thermoplastic polyimide on at least one side of the core substrate;
Semi-curing the thermoplastic polyimide;
Bonding the core substrate and an insulating film having a conductive layer formed on an outer surface thereof to the thermoplastic polyimide by a lamination method using a roller;
Forming an outer circuit pattern on the conductive layer;
Forming a protective layer to cover a part of the outer circuit pattern; And
Mounting a chip on the protection layer so as to be connected to the outer circuit pattern;
Wherein the chip package comprises: