US20140075960A1 - Cooling Device For Electronic Components - Google Patents

Cooling Device For Electronic Components Download PDF

Info

Publication number
US20140075960A1
US20140075960A1 US13/708,990 US201213708990A US2014075960A1 US 20140075960 A1 US20140075960 A1 US 20140075960A1 US 201213708990 A US201213708990 A US 201213708990A US 2014075960 A1 US2014075960 A1 US 2014075960A1
Authority
US
United States
Prior art keywords
substrate
cooling device
electrodes
recited
electronic components
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
US13/708,990
Other languages
English (en)
Inventor
Yang-Kuo Kuo
Chia-Yi Hsiang
Hung-Tai Ku
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
National Chung Shan Institute of Science and Technology NCSIST
Original Assignee
National Chung Shan Institute of Science and Technology NCSIST
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by National Chung Shan Institute of Science and Technology NCSIST filed Critical National Chung Shan Institute of Science and Technology NCSIST
Assigned to CHUNG SHAN INSTITUTE OF SCIENCE AND TECHNOLOGY, ARMAMENTS BUREAU, M. N. D reassignment CHUNG SHAN INSTITUTE OF SCIENCE AND TECHNOLOGY, ARMAMENTS BUREAU, M. N. D ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: KUO, YANG-KUO, HSIANG, CHIA-YI, KU, HUNG-TAI
Publication of US20140075960A1 publication Critical patent/US20140075960A1/en
Assigned to NATIONAL CHUNG SHAN INSTITUTE OF SCIENCE AND TECHNOLOGY reassignment NATIONAL CHUNG SHAN INSTITUTE OF SCIENCE AND TECHNOLOGY CHANGE OF NAME (SEE DOCUMENT FOR DETAILS). Assignors: CHUNG-SHAN INSTITUTE OF SCIENCE AND TECHNOLOGY, ARMAMENTS BUREAU, M.N.D.
Priority to US15/011,515 priority Critical patent/US20160148917A1/en
Abandoned legal-status Critical Current

Links

Images

Classifications

    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
    • F25B—REFRIGERATION MACHINES, PLANTS OR SYSTEMS; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS
    • F25B21/00—Machines, plants or systems, using electric or magnetic effects
    • F25B21/02—Machines, plants or systems, using electric or magnetic effects using Peltier effect; using Nernst-Ettinghausen effect

Definitions

  • the present invention relates to a cooling structure for thermoelectric components, and more particularly to a cooling device integrated a thermoelectric cooling element with thermoelectric components.
  • LED light emitting diode
  • LCD backlight mobile phone backlight
  • signal lights headlights, street lamps, art lighting, architectural lighting, and stage lighting control, home lighting, etc.
  • the LED gradually reaches high-power, high-brightness and high-performance.
  • a lot of heat generated by high-power LED can not be effectively excluded, which results in high the LED Junction Temperature, so that the LED brightness is reduced or even extinguished.
  • the primary objective of the present invention is to provide a cooling device for electronic components, which effectively resolves the heat dissipation problem encountered in the operation of the conventional electronic components, and achieves the goal of extending usage lifespan, weight and size reducing, and the appearance aesthetic design.
  • a further objective of the present invention is to transform the heat generated by the electronic components in operation into a renewable energy by using the temperature difference of thermoelectric effect, and the energy is to be stored in battery as a spare power.
  • the present invention provides a cooling device for electronic components, including: a first substrate configured as a metallized circuit, having a first surface and a second surface; at least one electronic element configured on the first surface of the first substrate and coupled to the metallized circuit, a thermoelectric element configured on the second surface of the first substrate so as to conduct the heat generated by the at least one electronic element, and a second substrate having a third surface and a fourth surface, the third surface of the second substrate coupled to the thermoelectric element, so as to conduct the heat to the fourth surface, and a battery coupled between the first substrate and the second substrate for storing energy generated by the cooling device, wherein a thermoelectric effect is generated by thermal temperature differences therebetween, wherein the first substrate and the second substrate are made of an insulating ceramic material selected from one of the following group consisting of: alumina and aluminum nitride.
  • the at least one electronic element is one selected from the following group consisting of: an LED, a CPU and a solar focusing device.
  • the thermoelectric element includes: a first conductive layer including a plurality of first electrodes, configured on the second surface of the first substrate, a second conductive layer comprising a plurality of second electrodes, configured on the third surface of the second substrate; and a plurality of N-type semiconductors and a plurality of P-type semiconductors, wherein the plurality of N-type semiconductors and the plurality of
  • P-type semiconductors are alternatively configured between the plurality of first electrodes and the plurality of second electrodes, and are coupled to the plurality of first electrodes and the plurality of second electrodes so as to form a current loop.
  • the first surface of the first substrate is a cooling surface.
  • the first surface of the first substrate is a heating surface.
  • FIG. 1 is a structure diagram showing a preferred embodiment of the present invention
  • FIG. 2 is a perspective cross sectional view of a preferred embodiment of the present invention.
  • FIG. 3 is a schematic view showing a finished product of the present invention.
  • FIG. 1 is a structure diagram shows a preferred embodiment of the present invention.
  • the present invention utilizes the heat temperature difference of the cooling chip to be applied to the cooling device of the electronic components.
  • This embodiment uses an LED element as a light component.
  • the heat generated by the LED chip is sent to the cooling chip to reduce the temperature of the LED.
  • This design can also be proven to greatly reduce the LED overall size and weight.
  • the cooling device of this embodiment includes: a first substrate 11 configured as a metallized circuit, having a first surface 111 and a second surface 112 , at least one electronic element 14 , 15 being LED chip 14 and LED lens 15 respectively, configured on the first surface 111 of the first substrate 11 and coupled to the metallized circuit; a thermoelectric element 13 configured on the second surface 112 of the first substrate 11 so as to conduct the heat generated by the at least one electronic element 14 , 15 , and a second substrate 12 having a third surface 121 and a fourth surface 122 , the third surface 121 of the second substrate 12 coupled to the thermoelectric element 13 , so as to conduct the heat to the fourth surface; and a battery coupled between the first substrate and the second substrate for storing energy generated by the cooling device, wherein a thermoelectric effect is generated by thermal temperature differences therebetween, wherein the first substrate 11 and the second substrate 12 are made of an insulating ceramic material and selected from one of the following group consisting of: alumina and aluminum nitride.
  • thermoelectric element 13 includes: a first conductive layer including a plurality of first electrodes 131 , configured on the second surface 112 of the first substrate 11 , a second conductive layer including a plurality of second electrodes 132 , configured on the third surface 121 of the second substrate 12 , a plurality of N-type semiconductors 134 and a plurality of P-type semiconductors 133 , wherein the plurality of N-type semiconductors 134 and the plurality of P-type semiconductors 133 are alternatively configured between the plurality of first electrodes 131 and the plurality of second electrodes 132 , and are coupled to the plurality of first electrodes 131 and the plurality of second electrodes 132 so as to form a current loop.
  • thermoelectric cooling chip (Bi2-Te3) with the semiconductor elements 133 , 134 , conductors 131 , 132 and the ceramic material as a cooling device by using the principle of thermoelectric effect.
  • heat can be transferred by the cooling device from one end (N ⁇ P endothermic, cold end, as the third surface 121 on the first substrate 11 ) to the other end (P ⁇ N exothermic, hot end, as the fourth surface 122 on the second substrate 12 , to form a temperature difference phenomenon between a hot side and a cold side of the cooling device.
  • the maximum temperature difference of the best finished product has been up to 74° C.
  • the cooling device further has a battery 17 used to store the electric energy of thermoelectric effect generated by the temperature difference between the first substrate 11 and the second substrate 12 of the cooling device.
  • this figure is a perspective cross sectional view of a preferred embodiment of the present invention.
  • a dielectric substrate 22 is coated on the upper and lower layers of the cooling device 21 .
  • a plurality of N-type semiconductors 24 and P-type semiconductors 25 are coated by two layers of plural conductors 23 , wherein the plurality of N-type semiconductors 25 and the plurality of P-type semiconductors 24 are alternatively configured between the two layers of plural conductors 23 , and coupled to the upper and lower electrodes formed by the two layers of plural conductors 23 , so as to form a current loop.
  • the direction of current applied to the cooling device 21 can be controlled to cause a cold end on the upper side of the cooling device 21 and to cause a hot end on the lower side of the cooling device 21 , so as to conduct the heat.
  • FIG. 3 is a schematic view showing a finished product of the present invention.
  • the finished size of the cooling device 31 of the present invention is small, which is equivalent to a coin of NT ten dollars 30 .
  • Each cooling device includes a cathode pin 32 and a negative pin 33 to connect the power source 16 as shown in FIG. 1 .
  • the cooling device of the present invention has high cooling efficiency to indirectly extend the lifespan of the configured components, it also has the characteristics of small size, light weight, long life, high reliability, environmentally friendly (without using refrigerant), easy maintenance, and energy reuse. Therefore the cooling device of the present invention is extremely suitable for electronic components and capable of high value in market demand.
US13/708,990 2012-09-19 2012-12-08 Cooling Device For Electronic Components Abandoned US20140075960A1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
US15/011,515 US20160148917A1 (en) 2012-12-08 2016-01-30 Cooling device for electronic components

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
TW101134226 2012-09-19
TW101134226A TWI481086B (zh) 2012-09-19 2012-09-19 一種用於電子元件的散熱裝置

Related Child Applications (1)

Application Number Title Priority Date Filing Date
US15/011,515 Continuation-In-Part US20160148917A1 (en) 2012-12-08 2016-01-30 Cooling device for electronic components

Publications (1)

Publication Number Publication Date
US20140075960A1 true US20140075960A1 (en) 2014-03-20

Family

ID=50273016

Family Applications (1)

Application Number Title Priority Date Filing Date
US13/708,990 Abandoned US20140075960A1 (en) 2012-09-19 2012-12-08 Cooling Device For Electronic Components

Country Status (2)

Country Link
US (1) US20140075960A1 (zh)
TW (1) TWI481086B (zh)

Cited By (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20150075186A1 (en) * 2013-09-18 2015-03-19 Qualcomm Incorporated Method of and an apparatus for maintaining constant phone skin temperature with a thermoelectric cooler and increasing allowable power/performance limit for die in a mobile segment
CN105042722A (zh) * 2015-06-11 2015-11-11 珠海格力电器股份有限公司 散热器及其控制方法、装置和空调器
USD749713S1 (en) * 2014-07-31 2016-02-16 Innovative Medical Equipment, Llc Heat exchanger
CN106765743A (zh) * 2016-11-28 2017-05-31 陈耀武 一种节能型空调装置
WO2018053705A1 (zh) * 2016-09-21 2018-03-29 宁德时代新能源科技股份有限公司 可充电电池
WO2019202277A1 (fr) * 2018-04-20 2019-10-24 ANDREE, Jean-Marie Lampe electrique a consommation reduite et dispositif d'eclairage public associe
CN110501831A (zh) * 2019-08-14 2019-11-26 深圳市华星光电技术有限公司 背光模组及显示装置
WO2021093014A1 (zh) * 2019-11-15 2021-05-20 Tcl华星光电技术有限公司 背光模组及其制备方法
CN117199026A (zh) * 2023-11-07 2023-12-08 之江实验室 一种散热装置、散热控制方法及装置、电子设备

Citations (19)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4082394A (en) * 1977-01-03 1978-04-04 International Business Machines Corporation Metallized ceramic and printed circuit module
JP2002050727A (ja) * 2000-08-01 2002-02-15 Hitachi Maxell Ltd 電子機器
US20050236028A1 (en) * 2003-11-18 2005-10-27 Strnad Richard J Heat to cooling converter
US20050257821A1 (en) * 2004-05-19 2005-11-24 Shriram Ramanathan Thermoelectric nano-wire devices
US20060101829A1 (en) * 2004-11-18 2006-05-18 Stmicroelectronics S.A. Self-cooled vertical electronic component
US20060201161A1 (en) * 2002-12-27 2006-09-14 Shinji Hirai Cooling device for electronic component using thermo-electric conversion material
US20080010998A1 (en) * 2006-07-17 2008-01-17 Sun Microsystems, Inc. Thermal-electric-MHD cooling
US20080163916A1 (en) * 2006-10-25 2008-07-10 Kabushiki Kaisha Toshiba Thermoelectric conversion module and thermoelectric conversion apparatus
US20080178920A1 (en) * 2006-12-28 2008-07-31 Schlumberger Technology Corporation Devices for cooling and power
US20080251111A1 (en) * 2007-04-10 2008-10-16 Woo Sik Yoo Thermoelectric energy conversion
US20090153007A1 (en) * 2007-12-17 2009-06-18 Foxsemicon Integrated Technology, Inc. Light source module and method for manufacturing same
US20100081191A1 (en) * 2008-09-26 2010-04-01 Marlow Industries, Inc. Anisotropic heat spreader for use with a thermoelectric device
US20100207573A1 (en) * 2009-02-11 2010-08-19 Anthony Mo Thermoelectric feedback circuit
US20110220162A1 (en) * 2010-03-15 2011-09-15 Siivola Edward P Thermoelectric (TE) Devices/Structures Including Thermoelectric Elements with Exposed Major Surfaces
US8039726B2 (en) * 2005-05-26 2011-10-18 General Electric Company Thermal transfer and power generation devices and methods of making the same
US20110259018A1 (en) * 2010-04-27 2011-10-27 Samsung Electro-Mechanics Co., Ltd. Thermoelectric module and method for manufacturing the same
US20120042661A1 (en) * 2008-12-11 2012-02-23 Lamos Inc. Split thermo-electric cycles for simultaneous cooling, heating, and temperature control
US8822807B2 (en) * 2008-01-23 2014-09-02 Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. Method for producing a thermoelectric component and thermoelectric component
US8895833B2 (en) * 2009-12-10 2014-11-25 Kabushiki Kaisha Toshiba Thermoelectric device and thermoelectric module

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWM276042U (en) * 2005-02-02 2005-09-21 Bothhand Entpr Inc Structure of soft cryogenic part
KR101822600B1 (ko) * 2010-07-29 2018-01-26 엘지이노텍 주식회사 열전냉각모듈이 내장된 ｌｅｄ 모듈을 포함하는 ｌｅｄ 조명기구

Patent Citations (19)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4082394A (en) * 1977-01-03 1978-04-04 International Business Machines Corporation Metallized ceramic and printed circuit module
JP2002050727A (ja) * 2000-08-01 2002-02-15 Hitachi Maxell Ltd 電子機器
US20060201161A1 (en) * 2002-12-27 2006-09-14 Shinji Hirai Cooling device for electronic component using thermo-electric conversion material
US20050236028A1 (en) * 2003-11-18 2005-10-27 Strnad Richard J Heat to cooling converter
US20050257821A1 (en) * 2004-05-19 2005-11-24 Shriram Ramanathan Thermoelectric nano-wire devices
US20060101829A1 (en) * 2004-11-18 2006-05-18 Stmicroelectronics S.A. Self-cooled vertical electronic component
US8039726B2 (en) * 2005-05-26 2011-10-18 General Electric Company Thermal transfer and power generation devices and methods of making the same
US20080010998A1 (en) * 2006-07-17 2008-01-17 Sun Microsystems, Inc. Thermal-electric-MHD cooling
US20080163916A1 (en) * 2006-10-25 2008-07-10 Kabushiki Kaisha Toshiba Thermoelectric conversion module and thermoelectric conversion apparatus
US20080178920A1 (en) * 2006-12-28 2008-07-31 Schlumberger Technology Corporation Devices for cooling and power
US20080251111A1 (en) * 2007-04-10 2008-10-16 Woo Sik Yoo Thermoelectric energy conversion
US20090153007A1 (en) * 2007-12-17 2009-06-18 Foxsemicon Integrated Technology, Inc. Light source module and method for manufacturing same
US8822807B2 (en) * 2008-01-23 2014-09-02 Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. Method for producing a thermoelectric component and thermoelectric component
US20100081191A1 (en) * 2008-09-26 2010-04-01 Marlow Industries, Inc. Anisotropic heat spreader for use with a thermoelectric device
US20120042661A1 (en) * 2008-12-11 2012-02-23 Lamos Inc. Split thermo-electric cycles for simultaneous cooling, heating, and temperature control
US20100207573A1 (en) * 2009-02-11 2010-08-19 Anthony Mo Thermoelectric feedback circuit
US8895833B2 (en) * 2009-12-10 2014-11-25 Kabushiki Kaisha Toshiba Thermoelectric device and thermoelectric module
US20110220162A1 (en) * 2010-03-15 2011-09-15 Siivola Edward P Thermoelectric (TE) Devices/Structures Including Thermoelectric Elements with Exposed Major Surfaces
US20110259018A1 (en) * 2010-04-27 2011-10-27 Samsung Electro-Mechanics Co., Ltd. Thermoelectric module and method for manufacturing the same

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
Multicomp, Thermoelectric Module, 05/11/2011 pg. 1-3 *

Cited By (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20150075186A1 (en) * 2013-09-18 2015-03-19 Qualcomm Incorporated Method of and an apparatus for maintaining constant phone skin temperature with a thermoelectric cooler and increasing allowable power/performance limit for die in a mobile segment
USD749713S1 (en) * 2014-07-31 2016-02-16 Innovative Medical Equipment, Llc Heat exchanger
CN105042722A (zh) * 2015-06-11 2015-11-11 珠海格力电器股份有限公司 散热器及其控制方法、装置和空调器
WO2018053705A1 (zh) * 2016-09-21 2018-03-29 宁德时代新能源科技股份有限公司 可充电电池
CN109565090A (zh) * 2016-09-21 2019-04-02 宁德时代新能源科技股份有限公司 可充电电池
CN106765743A (zh) * 2016-11-28 2017-05-31 陈耀武 一种节能型空调装置
WO2019202277A1 (fr) * 2018-04-20 2019-10-24 ANDREE, Jean-Marie Lampe electrique a consommation reduite et dispositif d'eclairage public associe
FR3080436A1 (fr) * 2018-04-20 2019-10-25 Jean Marie Andree Lampe electrique a consommation reduite et dispositif d'eclairage public associe
CN110501831A (zh) * 2019-08-14 2019-11-26 深圳市华星光电技术有限公司 背光模组及显示装置
WO2021093014A1 (zh) * 2019-11-15 2021-05-20 Tcl华星光电技术有限公司 背光模组及其制备方法
CN117199026A (zh) * 2023-11-07 2023-12-08 之江实验室 一种散热装置、散热控制方法及装置、电子设备

Also Published As

Publication number Publication date
TW201414025A (zh) 2014-04-01
TWI481086B (zh) 2015-04-11

Similar Documents

Publication Publication Date Title
US20140075960A1 (en) Cooling Device For Electronic Components
US7926979B2 (en) Illumination device
US8371717B2 (en) LED light emitting device having temperature sensor for controlling current supplied to LEDs therof
JP2006179894A (ja) 発光素子
US20090225556A1 (en) Thermoelectric cooler and illumination device using same
CN103104828A (zh) 发光二极管灯芯和采用发光二极管作为光源的照明装置
TW201324736A (zh) 發光裝置
US7838986B2 (en) Illumination device
US20100117113A1 (en) Light emitting diode and light source module having same
US20160148917A1 (en) Cooling device for electronic components
Cheng Thermal management of high-power white LED package
CN102593317A (zh) 一种高功率高亮度led光源封装结构及其封装方法
CN202855803U (zh) 一种高导热led封装基板
CN201936915U (zh) 一种led封装结构及其led模组
CN205678474U (zh) 基于温差发电的环保手电筒
Kıyak A Study on the Working Performance of Dimming Methods for Single-and Multichip Power LEDs
US8419237B2 (en) Heat sink and light emitting diode lamp
CN202259303U (zh) 一种高压发光二极管芯片
US8053797B2 (en) Light-emitting device with reflection layer and structure of the reflection layer
CN202601730U (zh) Led半导体散热支架
TWI298553B (en) Light module
CN102142508A (zh) 一种高功率高亮度led光源封装结构及其封装方法
CN202189831U (zh) 一种高功率高亮度led光源封装结构
Wang et al. Hyper-Generation LEDs VCPCB
CN202025750U (zh) 一种大功率led封装结构

Legal Events

Date Code Title Description
AS Assignment

Owner name: CHUNG SHAN INSTITUTE OF SCIENCE AND TECHNOLOGY, AR

Free format text: ASSIGNMENT OF ASSIGNORS INTEREST;ASSIGNORS:KUO, YANG-KUO;HSIANG, CHIA-YI;KU, HUNG-TAI;SIGNING DATES FROM 20121206 TO 20121207;REEL/FRAME:029505/0480

AS Assignment

Owner name: NATIONAL CHUNG SHAN INSTITUTE OF SCIENCE AND TECHN

Free format text: CHANGE OF NAME;ASSIGNOR:CHUNG-SHAN INSTITUTE OF SCIENCE AND TECHNOLOGY, ARMAMENTS BUREAU, M.N.D.;REEL/FRAME:035453/0341

Effective date: 20140129

STCB Information on status: application discontinuation

Free format text: ABANDONED -- FAILURE TO RESPOND TO AN OFFICE ACTION