US20130043017A1 - Heat sinking plate - Google Patents

Heat sinking plate Download PDF

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Publication number
US20130043017A1
US20130043017A1 US13/569,087 US201213569087A US2013043017A1 US 20130043017 A1 US20130043017 A1 US 20130043017A1 US 201213569087 A US201213569087 A US 201213569087A US 2013043017 A1 US2013043017 A1 US 2013043017A1
Authority
US
United States
Prior art keywords
heat sinking
metal plate
plate
opening
sinking plate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
US13/569,087
Other languages
English (en)
Inventor
Min Jee KIM
Jung Wook SIM
Won Joon Choe
Gyeong Ho Lee
Seung Hyun Bang
Hae Yong PARK
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
LS Electric Co Ltd
Original Assignee
LSIS Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by LSIS Co Ltd filed Critical LSIS Co Ltd
Assigned to LSIS CO., LTD. reassignment LSIS CO., LTD. ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: BANG, SEUNG HYUN, CHOE, WON JOON, KIM, MIN JEE, LEE, GYEONG HO, PARK, HAE YONG, SIM, JUNG WOOK
Publication of US20130043017A1 publication Critical patent/US20130043017A1/en
Abandoned legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/367—Cooling facilitated by shape of device
    • H01L23/3672—Foil-like cooling fins or heat sinks
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/367—Cooling facilitated by shape of device
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01C—RESISTORS
    • H01C7/00—Non-adjustable resistors formed as one or more layers or coatings; Non-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material
    • H01C7/13—Non-adjustable resistors formed as one or more layers or coatings; Non-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material current responsive
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Definitions

  • the present disclosure relates to a heat sinking plate, and more particularly to a heat sinking plate to be used for radiation of heat in electronic elements such as fault current limiter.
  • air cooling type includes two types: a natural convection and a forced convection.
  • the former uses a fan to control wind speed and wind direction and needs no choosy installation condition for heat sinking plates.
  • heat sink plates are largely stacked horizontally in the natural convection in consideration of characteristics of air circulated by difference of air density.
  • punctured metal plates are vertically stacked to obtain same heat transfer area and vertical air circulation paths as those of metal plates prior to punctuation.
  • heat sinking plates are employed for cooling of many electrical power devices.
  • the heat sinking plates used in the electrical power devices carry several drawbacks such as spatial restriction in installation in view of importance of obtaining an insulation distance.
  • an object of certain embodiments of the present invention is to provide a heat sinking plate configured to improve each shape of metal plate to allow vertical stacking of the metal plate, and to optimize a size of a system for maximization of radiation efficiency.
  • a heat sinking plate comprising a metal plate with a crown-shaped structure by erecting four triangles obtained by diagonally and crossly cutting a square of a predetermined length to one direction of the metal plate at a predetermined first angle relative to the metal plate, and with a square-shaped opening of the predetermined length when viewed from the other direction of the metal plate.
  • the opening is formed at a second angle relative to the rectangular metal plate.
  • the second angle is substantially 45°.
  • a plurality of openings is formed, each spaced apart from the other at a same space.
  • a length of the opening is substantially same as the space.
  • a heat sinking plate comprising a metal plate with a crown-shaped structure by erecting four triangles obtained by diagonally and crossly cutting a square of a predetermined length to one direction of the metal plate at a predetermined first angle relative to the metal plate, and with a square-shaped opening of the predetermined length when viewed from the other direction of the metal plate, wherein a plurality of openings is formed, each opening spaced apart at a same space to every direction, and the plurality of metal plates is stacked.
  • a length of the opening is substantially same as the space, and stacked to allow the openings to be alternatively positioned.
  • the opening is formed at a second angle relative to the rectangular metal plate.
  • the second angle is substantially 45°.
  • the heat sinking plate according to the present disclosure has an advantageous effect in that a system can be greatly reduced while a heat transfer area of a metal plate is same as that prior to punctuation.
  • FIG. 1 is a plan view illustrating a heat sinking plate according to an exemplary embodiment of the present disclosure
  • FIG. 2 a is a schematic perspective view illustrating a rear surface of a circular area formed by dotted lines of FIG. 1 ;
  • FIG. 2 b is a schematic lateral view of FIG. 2 a according to an exemplary embodiment of the present disclosure.
  • FIG. 3 is a schematic view illustrating a stacked structure with heat sinking plates according to the present disclosure.
  • FIGS. 1-3 of the drawings like numerals being used for like and corresponding parts of the various drawings.
  • Other features and advantages of the disclosed embodiments will be or will become apparent to one of ordinary skill in the art upon examination of the following figures and detailed description. It is intended that all such additional features and advantages be included within the scope of the disclosed embodiments, and protected by the accompanying drawings.
  • the illustrated figures are only exemplary and not intended to assert or imply any limitation with regard to the environment, architecture, or process in which different embodiments may be implemented. Accordingly, the described aspect is intended to embrace all such alterations, modifications, and variations that fall within the scope and novel idea of the present invention.
  • first a second constituent element
  • first constituent element a first constituent element without departing from the scope and spirit of the present disclosure
  • first constituent element may be denoted as a second constituent element.
  • FIG. 1 is a plan view illustrating a heat sinking plate according to an exemplary embodiment of the present disclosure.
  • the heat sinking plate according to the present disclosure is formed by a plurality of square-shaped openings ( 11 ), each opening having a predetermined length (a), by punctuating a metal plate ( 10 ), wherein each of the plurality of openings is discrete from the other opening on a straight line, each opening spaced apart at a predetermined gap (b).
  • Each of the plurality of openings ( 11 ) is punched with a predetermined angle ( ⁇ ) relative to the rectangular metal plate ( 10 ), and preferably, each opening is punched at an angle of 45° relative to the rectangular metal plate ( 10 ).
  • FIG. 2 a is a schematic perspective view illustrating a rear surface of a circular area formed by dotted lines of FIG. 1
  • FIG. 2 b is a schematic lateral view of FIG. 2 a according to an exemplary embodiment of the present disclosure.
  • a same heat transfer area as that of the metal plate before the punctuation can be obtained by preserving and not disposing a crown-shaped structure generated in the course of punching the opening ( 11 ). That is, a square on a rectangular metal plate ( 10 ) is diagonally and crossly cut off to obtain four triangles, where the four triangles are erected to one direction of the metal plate ( 10 ) at a predetermined angle ( ⁇ ) to form a crown-shaped structure, wherein an opening ( 11 ) is formed in the other direction.
  • the sizes of four triangles obtained by punching the metal plate are as under:
  • the heat sinking plate thus configured according to the present disclosure can structurally maintain the same heat transfer area as that prior to punctuation to the metal plate, and can smoothly and rapidly dissipate the heat by vertical circulation of air through the openings ( 11 ) formed by the punctuation.
  • FIG. 3 is a schematic view illustrating a stacked structure with heat sinking plates according to the present disclosure.
  • a crown-shaped structure formed by cutting the metal plate corresponding to each opening ( 11 ) functions to maintain a gap between the metal plate ( 10 ).
  • the heat sinking plate according to the present disclosure may be used for cooling an IGBT (Insulated Gate Bipolar Transistor), where an expected heating value of IGBT used for a 24 Kv/4,000 A/40 kA standard fault current limiter may be approximately 48 kW.
  • IGBT Insulated Gate Bipolar Transistor
  • the heat sinking plate according to the present disclosure may greatly reduce a size of a system through obtainment of a heat transfer area same as that of a metal plate prior to the punctuation.
  • the heat sinking plate according to the present disclosure may be used for increasing radiation efficiency and optimizing a size of a system and a distributing board, in a case where a power conversion device such as an IGBT is to be cooled using air cooling type or a heat pipe.
  • the fault current limiter using the IGBT may adopt an air cooling type, a heat pipe cooling type and/or water cooling type depending on heating value.
  • An air cooling type using a heat sinking plate or heat pipe may be used for a relatively small heating value.
  • Arrangement and structure of the heat sinking plate may vary depending on use of cooling fan (i.e., forced cooling or natural convection cooling), and in a case of using the punched heat sinking plate, restriction of structural system may be lessened by vertically stacking the heat sinking plates even in the natural convection type.
  • use of the heat sinking plate according to the present disclosure can remarkably reduce the size of a system by obtaining same heat transfer area as that of a metal plate before the punctuation.

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Chemical & Material Sciences (AREA)
  • Materials Engineering (AREA)
  • Power Engineering (AREA)
  • Electromagnetism (AREA)
  • Thermal Sciences (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Central Heating Systems (AREA)
US13/569,087 2011-08-16 2012-08-07 Heat sinking plate Abandoned US20130043017A1 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
KR10-2011-0081017 2011-08-16
KR1020110081017A KR20130019076A (ko) 2011-08-16 2011-08-16 방열판

Publications (1)

Publication Number Publication Date
US20130043017A1 true US20130043017A1 (en) 2013-02-21

Family

ID=46598388

Family Applications (1)

Application Number Title Priority Date Filing Date
US13/569,087 Abandoned US20130043017A1 (en) 2011-08-16 2012-08-07 Heat sinking plate

Country Status (5)

Country Link
US (1) US20130043017A1 (ko)
EP (1) EP2560202A2 (ko)
JP (1) JP2013042138A (ko)
KR (1) KR20130019076A (ko)
CN (1) CN102958330A (ko)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US11805573B2 (en) 2017-06-13 2023-10-31 I.R.C.A. S.P.A. Industria Resistenze Corazatte E Affini Flexible resistor

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN105636407A (zh) * 2014-11-27 2016-06-01 英业达科技有限公司 散热鳍片组

Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US1982931A (en) * 1933-06-17 1934-12-04 Mccord Radiator & Mfg Co Radiator core
US2400157A (en) * 1943-09-11 1946-05-14 United Aircraft Corp Brazed cylinder muff
US3457988A (en) * 1967-05-15 1969-07-29 Westinghouse Electric Corp Integral heat sink for semiconductor devices
US3631922A (en) * 1970-05-04 1972-01-04 Chrysler Corp Heat exchanger fin
JPS63231198A (ja) * 1987-03-20 1988-09-27 Hitachi Ltd クロスフインチユ−ブ形熱交換器
US5567986A (en) * 1993-06-04 1996-10-22 Diamond Electric Mfg. Co., Ltd. Heat sink
US5653285A (en) * 1993-03-31 1997-08-05 Lee; Yong N. Heat sink apparatus

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS61129349U (ko) * 1985-02-01 1986-08-13
JPH08136180A (ja) * 1994-11-11 1996-05-31 Nissin Electric Co Ltd 放熱装置
KR19980046658A (ko) * 1995-12-14 1998-09-15 윌리엄 이. 힐러 프레스된 열 배출부
JP2002134976A (ja) * 2000-10-27 2002-05-10 Mitsubishi Alum Co Ltd 電磁波遮蔽材
JP2005308311A (ja) * 2004-04-22 2005-11-04 Toshiba Corp フィンチューブ
CN201188739Y (zh) * 2008-05-06 2009-01-28 中山复盛机电有限公司 散热片结构及组合式散热器
EP2299488B1 (en) * 2009-08-06 2014-07-23 Cpumate Inc. Heat-dissipating fin assembly with heat-conducting structure
CN201589566U (zh) * 2009-10-13 2010-09-22 南实企业有限公司 散热鳍片组及具有该散热鳍片组的散热装置

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US1982931A (en) * 1933-06-17 1934-12-04 Mccord Radiator & Mfg Co Radiator core
US2400157A (en) * 1943-09-11 1946-05-14 United Aircraft Corp Brazed cylinder muff
US3457988A (en) * 1967-05-15 1969-07-29 Westinghouse Electric Corp Integral heat sink for semiconductor devices
US3631922A (en) * 1970-05-04 1972-01-04 Chrysler Corp Heat exchanger fin
JPS63231198A (ja) * 1987-03-20 1988-09-27 Hitachi Ltd クロスフインチユ−ブ形熱交換器
US5653285A (en) * 1993-03-31 1997-08-05 Lee; Yong N. Heat sink apparatus
US5567986A (en) * 1993-06-04 1996-10-22 Diamond Electric Mfg. Co., Ltd. Heat sink

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US11805573B2 (en) 2017-06-13 2023-10-31 I.R.C.A. S.P.A. Industria Resistenze Corazatte E Affini Flexible resistor

Also Published As

Publication number Publication date
JP2013042138A (ja) 2013-02-28
KR20130019076A (ko) 2013-02-26
EP2560202A2 (en) 2013-02-20
CN102958330A (zh) 2013-03-06

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Legal Events

Date Code Title Description
AS Assignment

Owner name: LSIS CO., LTD., KOREA, REPUBLIC OF

Free format text: ASSIGNMENT OF ASSIGNORS INTEREST;ASSIGNORS:KIM, MIN JEE;SIM, JUNG WOOK;CHOE, WON JOON;AND OTHERS;REEL/FRAME:028743/0859

Effective date: 20120720

STCB Information on status: application discontinuation

Free format text: ABANDONED -- FAILURE TO RESPOND TO AN OFFICE ACTION