US20120327402A1 - Inspection device - Google Patents

Inspection device Download PDF

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Publication number
US20120327402A1
US20120327402A1 US12/741,110 US74111008A US2012327402A1 US 20120327402 A1 US20120327402 A1 US 20120327402A1 US 74111008 A US74111008 A US 74111008A US 2012327402 A1 US2012327402 A1 US 2012327402A1
Authority
US
United States
Prior art keywords
support element
inspection device
optical sensor
light
materials
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
US12/741,110
Other languages
English (en)
Inventor
Michael Schilp
Josef Zimmermann
Adolf Zitzmann
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Zimmermann and Schilp Handhabungstechnik GmbH
Original Assignee
Zimmermann and Schilp Handhabungstechnik GmbH
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Zimmermann and Schilp Handhabungstechnik GmbH filed Critical Zimmermann and Schilp Handhabungstechnik GmbH
Assigned to ZIMMERMANN & SCHILP HANDHABUNGSTECHNIK GMBH reassignment ZIMMERMANN & SCHILP HANDHABUNGSTECHNIK GMBH ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: SCHILP, MICHAEL, ZIMMERMANN, JOSEF, ZITZMANN, ADOLF
Publication of US20120327402A1 publication Critical patent/US20120327402A1/en
Abandoned legal-status Critical Current

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Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/01—Arrangements or apparatus for facilitating the optical investigation
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • G01N21/8806—Specially adapted optical and illumination features
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • G01N21/94—Investigating contamination, e.g. dust
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • G01N21/95—Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
    • G01N21/9501—Semiconductor wafers
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/01—Arrangements or apparatus for facilitating the optical investigation
    • G01N21/03—Cuvette constructions
    • G01N2021/0339—Holders for solids, powders

Definitions

  • the invention relates to a device for inspecting contact-sensitive planar materials or work-pieces, e.g. wafers for the semiconductor industry, solar cells, glasses, FPD substrates, or biologically active substrates for biosensors, as well as materials having contact-sensitive curved surfaces.
  • material e.g. wafers for the semiconductor industry, solar cells, glasses, FPD substrates, or biologically active substrates for biosensors, as well as materials having contact-sensitive curved surfaces.
  • material e.g. wafers for the semiconductor industry, solar cells, glasses, FPD substrates, or biologically active substrates for biosensors
  • every kind of material or work-piece will be denoted as material.
  • the surfaces of materials will be treated in different working steps, wherein treatment shall be understood to be working steps like vapor-deposition or structuring, for example. Afterwards, the result of treatment will be inspected. Inspection can be carried out by using a camera provided with an image recognition and evaluation program.
  • top surface of material can be inspected easily, as the material is positioned on an inspection table or a conveyer belt so that there is a free view onto the top surface thereof.
  • the transport path is subdivided into several segments separated from each other by gaps so that the material is delivered up by the single segments.
  • the total width thereof can be scanned.
  • the transfer gap has to be dimensioned very small. Now and then, it is not possible to perform scanning in an unhindered way.
  • the invention according to claim 1 relates to an inspection device which comprises a support element for supporting a material to be inspected.
  • An oscillator is connected to the support element to cause it to vibrate, wherein the oscillation frequency and the amplitude of which are selected so as to keep the material to be inspected hovering on the top side of the support element by ultrasonic levitation.
  • the top surface of the support element is matched to the geometric shape of the bottom surface of the material.
  • the support element is made of a light-permeable material to allow the bottom surface of the material levitating on the support element to be scanned optically, that is, to be inspected by means of an optical sensor such as a camera, an interferometer, a Speckle measuring instrument or a line scan camera.
  • an optical sensor such as a camera, an interferometer, a Speckle measuring instrument or a line scan camera.
  • the support element may be expedient to make the support element of a material such as glass, light-permeable ceramic material, sapphire or oscillatory light-permeable plastic material, as defined in claims 2 to 4 .
  • the optical properties of the support element are dependent on the material which it is made of, on the geometric shape thereof and on the wave length of the light used for the inspection.
  • the support element is formed as a plane-parallel plate having an even surface.
  • an expert skilled in the art will design the optical sensor thereof so that the optical properties of the plane-parallel plate with respect to the refraction of light are considered.
  • the rod-like material having a circular cross section is to be held in a non-contact way and to be inspected, the rod-like material is located in a semi-circular groove of the support element, the radius thereof corresponding to that of the rod-like material.
  • the optical properties of the support element are different from those of a plane-parallel plate and, therefore, the refraction and reflection properties of curved surfaces have to be considered by those skilled in the art, which is true for designing the optical sensor and also for designing the illuminating system required.
  • the support element has to be regarded as a structural optic element which can be made by using technologies known for making and coating structural optic elements.
  • a transport and inspection device is provided, on which materials are transported along a transport path.
  • An inspection device according to any of the claims 1 to 4 is arranged at a certain position of the transport path.
  • the support plate is dependent on the shape and size of the material to be supported and the surface to be inspected may be the total surface of the material or only a section thereof, it is not possible to give concrete geometric information as to the design and shape of the support plate. It is obvious to those skilled in the art and knowing the disclosed technical science that only that surface section of the support plate, in which the propagation of light beams is not shadowed or disturbed, can be used for the inspection.
  • FIG. 1 is a schematic and perspective view of a support plate with a planar material put on it.
  • FIG. 2 is a side view of the support plate shown in FIG. 1 and a camera arranged below it.
  • FIG. 1 is a schematic and perspective view of a support plate 1 that is bent laterally.
  • An oscillator (not shown) is connected to the leg 2 of this plate. Generation of oscillation is indicated by a double arrow.
  • the planar material 3 is a silicon wafer levitating 0.1 mm above the support plate 1 .
  • FIG. 2 is a side view of the structure shown in FIG. 1 .
  • a camera 4 is arranged below the support plate 1 , which is used for inspecting the bottom surface of the silicon wafer levitating on the support plate.
  • the support plate is made of an optical glass and is laterally illuminated from below.
US12/741,110 2007-11-01 2008-10-31 Inspection device Abandoned US20120327402A1 (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
DE102007052530.5 2007-11-01
DE102007052530A DE102007052530A1 (de) 2007-11-01 2007-11-01 Vorrichtungen zur Inspektion und Bestrahlung von flächigen Materialien
PCT/DE2008/001790 WO2009056127A2 (de) 2007-11-01 2008-10-31 Inspektionsvorrichtung

Related Parent Applications (1)

Application Number Title Priority Date Filing Date
PCT/DE2008/001790 A-371-Of-International WO2009056127A2 (de) 2007-11-01 2008-10-31 Inspektionsvorrichtung

Related Child Applications (1)

Application Number Title Priority Date Filing Date
US13/898,122 Continuation US8836933B2 (en) 2007-11-01 2013-05-20 Inspection device

Publications (1)

Publication Number Publication Date
US20120327402A1 true US20120327402A1 (en) 2012-12-27

Family

ID=40530440

Family Applications (2)

Application Number Title Priority Date Filing Date
US12/741,110 Abandoned US20120327402A1 (en) 2007-11-01 2008-10-31 Inspection device
US13/898,122 Active US8836933B2 (en) 2007-11-01 2013-05-20 Inspection device

Family Applications After (1)

Application Number Title Priority Date Filing Date
US13/898,122 Active US8836933B2 (en) 2007-11-01 2013-05-20 Inspection device

Country Status (7)

Country Link
US (2) US20120327402A1 (de)
EP (1) EP2269041B1 (de)
JP (1) JP5502740B2 (de)
KR (1) KR101545761B1 (de)
CN (1) CN102239403A (de)
DE (2) DE102007052530A1 (de)
WO (1) WO2009056127A2 (de)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US10056071B2 (en) 2013-07-22 2018-08-21 Zs-Handling Gmbh Device for inspecting workpiece surfaces and strip materials
US10646972B2 (en) 2013-07-22 2020-05-12 Zs-Handling Gmbh Device for treating or machining a surface

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102008053684B4 (de) * 2008-10-29 2010-10-14 Graphikon Gesellschaft für Bildverarbeitung und Computergraphik mbH Hinterleuchtungsvorrichtung für Halbleitererzeugnisse
DE102023103520B3 (de) 2023-02-14 2024-03-21 Isra Vision Gmbh Vorrichtung und Verfahren zur Inspektion eines plattenförmigen oder bahnförmigen Objekts

Family Cites Families (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0634679Y2 (ja) * 1989-02-14 1994-09-07 日本アルミニウム工業株式会社 粉粒体サンプル検査装置
US5061679A (en) * 1989-03-17 1991-10-29 The University Of Arkansas Drive system employing frictionless bearings including superconducting matter
US5890580A (en) * 1993-07-12 1999-04-06 Kaijo Corporation Object levitating apparatus, object transporting apparatus, and object levitating bearing along with an object levitating process and object transporting process
JP2001027610A (ja) * 1999-07-13 2001-01-30 Mitsui Chemicals Inc 樹脂ペレットの検査方法及び装置
DE10039482B4 (de) * 2000-08-08 2016-03-24 Zs-Handling Gmbh Handler zum Transportieren von flachen, in der Halbleiterindustrie zur Anwendung kommenden Substraten
US6802220B2 (en) * 2000-10-26 2004-10-12 Kabushiki Kaisha Toyota Jidoshokki Apparatus for transporting levitated objects
US6781684B1 (en) * 2000-11-07 2004-08-24 Donald L. Ekhoff Workpiece levitation using alternating positive and negative pressure flows
US6630996B2 (en) * 2000-11-15 2003-10-07 Real Time Metrology, Inc. Optical method and apparatus for inspecting large area planar objects
KR20040039372A (ko) 2001-09-21 2004-05-10 올림푸스 가부시키가이샤 결함 검사 장치
TWI222423B (en) * 2001-12-27 2004-10-21 Orbotech Ltd System and methods for conveying and transporting levitated articles
DE10260672A1 (de) * 2002-12-23 2004-07-15 Mattson Thermal Products Gmbh Verfahren und Vorrichtung zum thermischen Behandeln von scheibenförmigen Substraten
WO2004076320A1 (de) * 2003-02-25 2004-09-10 Technische Universität München Vorrichtung zum berührungslosen transportieren und positionieren von bauteilen
JP2005239392A (ja) * 2004-02-27 2005-09-08 Toyota Industries Corp 物体浮揚搬送装置
JP4554397B2 (ja) * 2005-02-23 2010-09-29 東京エレクトロン株式会社 ステージ装置および塗布処理装置
US7391510B2 (en) * 2006-01-26 2008-06-24 Orbotech Ltd System and method for inspecting patterned devices having microscopic conductors
US7529338B2 (en) * 2006-02-22 2009-05-05 Focalspot, Inc. Method and apparatus for inspecting circuit boards
US8461022B2 (en) * 2009-04-20 2013-06-11 Applied Materials, Inc. Methods and apparatus for aligning a substrate in a process chamber

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US10056071B2 (en) 2013-07-22 2018-08-21 Zs-Handling Gmbh Device for inspecting workpiece surfaces and strip materials
US10646972B2 (en) 2013-07-22 2020-05-12 Zs-Handling Gmbh Device for treating or machining a surface

Also Published As

Publication number Publication date
KR101545761B1 (ko) 2015-08-19
KR20100105566A (ko) 2010-09-29
WO2009056127A3 (de) 2010-07-29
US8836933B2 (en) 2014-09-16
US20130321796A1 (en) 2013-12-05
EP2269041A2 (de) 2011-01-05
EP2269041B1 (de) 2017-08-23
JP5502740B2 (ja) 2014-05-28
DE102007052530A1 (de) 2009-05-14
DE202007019013U1 (de) 2010-04-29
CN102239403A (zh) 2011-11-09
JP2011502257A (ja) 2011-01-20
WO2009056127A2 (de) 2009-05-07

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Legal Events

Date Code Title Description
AS Assignment

Owner name: ZIMMERMANN & SCHILP HANDHABUNGSTECHNIK GMBH, GERMA

Free format text: ASSIGNMENT OF ASSIGNORS INTEREST;ASSIGNORS:SCHILP, MICHAEL;ZIMMERMANN, JOSEF;ZITZMANN, ADOLF;REEL/FRAME:025534/0125

Effective date: 20101220

STCB Information on status: application discontinuation

Free format text: ABANDONED -- FAILURE TO RESPOND TO AN OFFICE ACTION