CN102239403A - 检查装置 - Google Patents
检查装置 Download PDFInfo
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- CN102239403A CN102239403A CN2008801143147A CN200880114314A CN102239403A CN 102239403 A CN102239403 A CN 102239403A CN 2008801143147 A CN2008801143147 A CN 2008801143147A CN 200880114314 A CN200880114314 A CN 200880114314A CN 102239403 A CN102239403 A CN 102239403A
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
- G01N21/84—Systems specially adapted for particular applications
- G01N21/88—Investigating the presence of flaws or contamination
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
- G01N21/01—Arrangements or apparatus for facilitating the optical investigation
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
- G01N21/84—Systems specially adapted for particular applications
- G01N21/88—Investigating the presence of flaws or contamination
- G01N21/8806—Specially adapted optical and illumination features
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
- G01N21/84—Systems specially adapted for particular applications
- G01N21/88—Investigating the presence of flaws or contamination
- G01N21/94—Investigating contamination, e.g. dust
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
- G01N21/84—Systems specially adapted for particular applications
- G01N21/88—Investigating the presence of flaws or contamination
- G01N21/95—Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
- G01N21/9501—Semiconductor wafers
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
- G01N21/01—Arrangements or apparatus for facilitating the optical investigation
- G01N21/03—Cuvette constructions
- G01N2021/0339—Holders for solids, powders
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- Life Sciences & Earth Sciences (AREA)
- Chemical & Material Sciences (AREA)
- Analytical Chemistry (AREA)
- Biochemistry (AREA)
- General Health & Medical Sciences (AREA)
- General Physics & Mathematics (AREA)
- Immunology (AREA)
- Pathology (AREA)
- Investigating Materials By The Use Of Optical Means Adapted For Particular Applications (AREA)
- Testing Or Measuring Of Semiconductors Or The Like (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Investigating Or Analyzing Materials By The Use Of Ultrasonic Waves (AREA)
- Analysing Materials By The Use Of Radiation (AREA)
- Testing Of Individual Semiconductor Devices (AREA)
Abstract
本发明涉及一种用于检查接触敏感的平面材料或者工件,例如半导体工业的晶片、太阳能电池、玻璃、FPD基片或者生物传感器的生物活性基片以及具有接触敏感的弯曲表面的材料的装置,其中,所述检查装置具有:承载体(1),其用于在承载体(1)的顶面上承载材料(3);至少一个振动发生器,其与所述承载体(1)连接,其中,所述振动发生器的振动频率和幅度选择得要使得所述承载体(1)上的材料(3)保持悬浮;和至少一个光学传感器(4),其中所述承载体(1)由透光的材料构成,并且所述光学传感器(4)设置在所述承载体(1)的下方。
Description
本发明涉及一种用于检查接触敏感的平面材料或者工件,例如半导体工业的晶片、太阳能电池、玻璃、FPD基片或者生物传感器的生物活性基片以及具有接触敏感的弯曲表面的材料的检查装置。下面把各种材料或者工件都称为材料。所述材料的表面由多种多样的工序加工,在此加工例如是蒸发或者构图。在加工之后检查加工结果。为此例如可以采用带有图像识别和分析程序的照相机。
用之既加工材料顶面也加工材料底面的技术也要求双面检查。检测顶面可以方便地进行,因为材料放在检查台上或者传送带上,因而可以随意地看到顶面。同时地检查材料底面却很困难,因为材料底面至少部分地被支撑面遮挡,从而例如照相机无法扫描整个底面。
例如,如果传送其底面对机械接触非常敏感的太阳能电池,则将该太阳能电池放在多个窄的传送带上。而利用照相机从下方却只能检查太阳能电池的没有被传送带遮挡的平面段。然而如果要求检查整个底面,就必须从传送带取下并翻转太阳能电池,但这对于连续运行的过程来说却很繁琐,并且容易受到干扰。
为了解决该问题,由现有技术公知,把传送道划分成各由一个间隙分隔开的多个段,从而进行从一个段到另一个段的材料过渡。在该过渡间隙上,材料不受支撑,从而可以扫描其整个宽度。然而问题是,有时必须使过渡间隙非常狭窄,因为材料的固有强度很小。因而有时无法再进行不受妨碍的扫描。
因此本发明的目的是,提出一种方案,使得能够光学地完全检查在传送路段上传送的接触敏感的材料的底面,也就是说,对材料支撑面的检查不会受到遮挡的妨碍。
该目的通过一种根据权利要求1的检查装置和一种根据权利要求5的传送和检查装置得以实现。
根据权利要求1,本发明涉及一种检查装置,其具有用于承载待受检查的材料的承载体。在该承载体上耦连一种振动发生器,其使所述承载体发生振动,其中振动频率和幅度选择得使所述承载体顶面上的待受检查的材料由于超声波悬浮作用而保持悬浮。所述承载体具有匹配于材料底面几何形状的表面形状。
根据本发明,所述承载体是透光的,从而可以借助于光学传感器例如照相机、干涉仪、斑纹测量器或者逐行扫描照相机检查即光学地扫描所述材料的底面。
从而可以使接触敏感的材料例如晶片或者太阳能电池在检查底面期间保持不接触,并且完全地检查底面。
依据检查采用的光,根据权利要求2至4,所述承载体最好由玻璃、透光的陶瓷例如蓝宝石或者可振动的透光塑料构成。
本领域技术人员知道,所述承载体的光学特性既取决于构成所述承载体的材料,也取决于所述承载体的几何形状和所使用的光波长。
例如,为传送晶片,将所述承载体的表面构造成平坦的,并且将所述承载体构造成为平面平行的板。因此,设计光学系统的本领域技术人员在设计光学传感器时要在光折射方面考虑平面平行板的光学特性。
相反,如果要保持不接触且检查具有圆形横截面的棒材,则将棒材放在承载体的半圆形凹槽中,在此所述凹槽的半径对应于所述棒材的半径。该承载体的光学特性不同于平面平行的板,所以本领域技术人员要考虑曲面的折射特性和反射特性,不论是设计光学传感器还是设计照射装置都是这样。
从而把所述承载体看成光学元件,并且可以采用所有用于制造和涂层光学元件的公知技术来制造。
根据权利要求5,制备沿传送道在其上传送材料的传送和检查装置。在所述传送道的某一位置上设有根据权利要求1至4中任一项的检查装置。
因为承载板取决于要承载的材料的形状和大小,并且要检查的平面可以是整个材料平面,或者也可以只是其一段,所以不可能对承载板的结构和形状进行具体的说明。本领域技术人员通过公开的技术文献可知道,对于检查只能利用承载板的不遮断或者不干扰光线传播的部分面。
本领域技术人员知道如何分析由光学传感器提供的信号。因为信号处理和分析不是本发明的主题,而是由现有技术公知的,所以对于本领域技术人员不需要进行详细说明。
下面借助实施例并参照附图详细地说明本发明。
图1为带有放在其上的平面材料的承载板的立体示意图;
图2用侧视图示出带有照相机的根据图1的承载板。
图1用立体示意图示出承载板1,其在旁侧折起。侧边2与振动发生器(未示出)耦连。双箭头表示振动发生。平面材料3是硅片,其悬浮在承载板1上方0.1mm处。
图2用侧视图示出根据图1的结构。在承载板1下方设有照相机4,利用该照相机检查硅片的没有贴放着的底面。所述承载板由光学玻璃构成,并且在侧下方受到照射。
Claims (5)
1.一种检查装置,具有:
-承载体(1),其用于在承载体(1)的顶面上承载材料(3);
-至少一个振动发生器,其与所述承载体(1)连接,其中,所述振动发生器的振动频率和幅度选择得要使得所述承载体(1)上的材料(3)保持悬浮;和
-至少一个光学传感器;
其中
-所述承载体(1)由透光的材料构成;和
-所述光学传感器设置在所述承载体(1)的下方。
2.如权利要求1所述的检查装置,其特征在于,所述承载体(1)由玻璃构成。
3.如权利要求1所述的检查装置,其特征在于,所述承载体(1)由透光的陶瓷构成。
4.如权利要求1所述的检查装置,其特征在于,所述承载体(1)由可振动的透光塑料构成。
5.一种用于待传送和待检查的材料的传送和检查装置,所述材料借助于传送机构沿着传送道移动,其特征在于,在所述传送道上或内设置有根据权利要求1至4中任一项的检查装置。
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE102007052530.5 | 2007-11-01 | ||
DE102007052530A DE102007052530A1 (de) | 2007-11-01 | 2007-11-01 | Vorrichtungen zur Inspektion und Bestrahlung von flächigen Materialien |
PCT/DE2008/001790 WO2009056127A2 (de) | 2007-11-01 | 2008-10-31 | Inspektionsvorrichtung |
Publications (1)
Publication Number | Publication Date |
---|---|
CN102239403A true CN102239403A (zh) | 2011-11-09 |
Family
ID=40530440
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN2008801143147A Pending CN102239403A (zh) | 2007-11-01 | 2008-10-31 | 检查装置 |
Country Status (7)
Country | Link |
---|---|
US (2) | US20120327402A1 (zh) |
EP (1) | EP2269041B1 (zh) |
JP (1) | JP5502740B2 (zh) |
KR (1) | KR101545761B1 (zh) |
CN (1) | CN102239403A (zh) |
DE (2) | DE102007052530A1 (zh) |
WO (1) | WO2009056127A2 (zh) |
Families Citing this family (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE102008053684B4 (de) * | 2008-10-29 | 2010-10-14 | Graphikon Gesellschaft für Bildverarbeitung und Computergraphik mbH | Hinterleuchtungsvorrichtung für Halbleitererzeugnisse |
JP6012907B2 (ja) * | 2013-07-22 | 2016-10-25 | ツェットエス−ハンドリング ゲゼルシャフト ミット ベシュレンクテル ハフツングZS−Handling GmbH | 表面処理または表面加工のための装置 |
CN105960589B (zh) | 2013-07-22 | 2019-04-26 | Zs-处理有限责任公司 | 用于检查工件表面和带材料的装置 |
DE102023103520B3 (de) | 2023-02-14 | 2024-03-21 | Isra Vision Gmbh | Vorrichtung und Verfahren zur Inspektion eines plattenförmigen oder bahnförmigen Objekts |
Family Cites Families (17)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0634679Y2 (ja) * | 1989-02-14 | 1994-09-07 | 日本アルミニウム工業株式会社 | 粉粒体サンプル検査装置 |
US5061679A (en) * | 1989-03-17 | 1991-10-29 | The University Of Arkansas | Drive system employing frictionless bearings including superconducting matter |
US5890580A (en) * | 1993-07-12 | 1999-04-06 | Kaijo Corporation | Object levitating apparatus, object transporting apparatus, and object levitating bearing along with an object levitating process and object transporting process |
JP2001027610A (ja) * | 1999-07-13 | 2001-01-30 | Mitsui Chemicals Inc | 樹脂ペレットの検査方法及び装置 |
DE10039482B4 (de) * | 2000-08-08 | 2016-03-24 | Zs-Handling Gmbh | Handler zum Transportieren von flachen, in der Halbleiterindustrie zur Anwendung kommenden Substraten |
US6802220B2 (en) * | 2000-10-26 | 2004-10-12 | Kabushiki Kaisha Toyota Jidoshokki | Apparatus for transporting levitated objects |
US6781684B1 (en) * | 2000-11-07 | 2004-08-24 | Donald L. Ekhoff | Workpiece levitation using alternating positive and negative pressure flows |
US6630996B2 (en) * | 2000-11-15 | 2003-10-07 | Real Time Metrology, Inc. | Optical method and apparatus for inspecting large area planar objects |
KR20040039372A (ko) | 2001-09-21 | 2004-05-10 | 올림푸스 가부시키가이샤 | 결함 검사 장치 |
TWI222423B (en) * | 2001-12-27 | 2004-10-21 | Orbotech Ltd | System and methods for conveying and transporting levitated articles |
DE10260672A1 (de) * | 2002-12-23 | 2004-07-15 | Mattson Thermal Products Gmbh | Verfahren und Vorrichtung zum thermischen Behandeln von scheibenförmigen Substraten |
WO2004076320A1 (de) * | 2003-02-25 | 2004-09-10 | Technische Universität München | Vorrichtung zum berührungslosen transportieren und positionieren von bauteilen |
JP2005239392A (ja) * | 2004-02-27 | 2005-09-08 | Toyota Industries Corp | 物体浮揚搬送装置 |
JP4554397B2 (ja) * | 2005-02-23 | 2010-09-29 | 東京エレクトロン株式会社 | ステージ装置および塗布処理装置 |
US7391510B2 (en) * | 2006-01-26 | 2008-06-24 | Orbotech Ltd | System and method for inspecting patterned devices having microscopic conductors |
US7529338B2 (en) * | 2006-02-22 | 2009-05-05 | Focalspot, Inc. | Method and apparatus for inspecting circuit boards |
US8461022B2 (en) * | 2009-04-20 | 2013-06-11 | Applied Materials, Inc. | Methods and apparatus for aligning a substrate in a process chamber |
-
2007
- 2007-11-01 DE DE102007052530A patent/DE102007052530A1/de not_active Ceased
- 2007-11-01 DE DE202007019013U patent/DE202007019013U1/de not_active Expired - Lifetime
-
2008
- 2008-10-31 KR KR1020107012115A patent/KR101545761B1/ko active IP Right Grant
- 2008-10-31 JP JP2010531413A patent/JP5502740B2/ja active Active
- 2008-10-31 WO PCT/DE2008/001790 patent/WO2009056127A2/de active Application Filing
- 2008-10-31 US US12/741,110 patent/US20120327402A1/en not_active Abandoned
- 2008-10-31 CN CN2008801143147A patent/CN102239403A/zh active Pending
- 2008-10-31 EP EP08846098.5A patent/EP2269041B1/de active Active
-
2013
- 2013-05-20 US US13/898,122 patent/US8836933B2/en active Active
Also Published As
Publication number | Publication date |
---|---|
KR101545761B1 (ko) | 2015-08-19 |
KR20100105566A (ko) | 2010-09-29 |
WO2009056127A3 (de) | 2010-07-29 |
US8836933B2 (en) | 2014-09-16 |
US20130321796A1 (en) | 2013-12-05 |
EP2269041A2 (de) | 2011-01-05 |
EP2269041B1 (de) | 2017-08-23 |
JP5502740B2 (ja) | 2014-05-28 |
DE102007052530A1 (de) | 2009-05-14 |
DE202007019013U1 (de) | 2010-04-29 |
US20120327402A1 (en) | 2012-12-27 |
JP2011502257A (ja) | 2011-01-20 |
WO2009056127A2 (de) | 2009-05-07 |
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