US20120327402A1 - Inspection device - Google Patents

Inspection device Download PDF

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Publication number
US20120327402A1
US20120327402A1 US12/741,110 US74111008A US2012327402A1 US 20120327402 A1 US20120327402 A1 US 20120327402A1 US 74111008 A US74111008 A US 74111008A US 2012327402 A1 US2012327402 A1 US 2012327402A1
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US
United States
Prior art keywords
support element
inspection device
optical sensor
light
materials
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
US12/741,110
Inventor
Michael Schilp
Josef Zimmermann
Adolf Zitzmann
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Zimmermann and Schilp Handhabungstechnik GmbH
Original Assignee
Zimmermann and Schilp Handhabungstechnik GmbH
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Zimmermann and Schilp Handhabungstechnik GmbH filed Critical Zimmermann and Schilp Handhabungstechnik GmbH
Assigned to ZIMMERMANN & SCHILP HANDHABUNGSTECHNIK GMBH reassignment ZIMMERMANN & SCHILP HANDHABUNGSTECHNIK GMBH ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: SCHILP, MICHAEL, ZIMMERMANN, JOSEF, ZITZMANN, ADOLF
Publication of US20120327402A1 publication Critical patent/US20120327402A1/en
Abandoned legal-status Critical Current

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Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/01—Arrangements or apparatus for facilitating the optical investigation
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • G01N21/8806—Specially adapted optical and illumination features
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • G01N21/94—Investigating contamination, e.g. dust
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • G01N21/95—Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
    • G01N21/9501—Semiconductor wafers
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/01—Arrangements or apparatus for facilitating the optical investigation
    • G01N21/03—Cuvette constructions
    • G01N2021/0339—Holders for solids, powders

Definitions

  • the invention relates to a device for inspecting contact-sensitive planar materials or work-pieces, e.g. wafers for the semiconductor industry, solar cells, glasses, FPD substrates, or biologically active substrates for biosensors, as well as materials having contact-sensitive curved surfaces.
  • material e.g. wafers for the semiconductor industry, solar cells, glasses, FPD substrates, or biologically active substrates for biosensors, as well as materials having contact-sensitive curved surfaces.
  • material e.g. wafers for the semiconductor industry, solar cells, glasses, FPD substrates, or biologically active substrates for biosensors
  • every kind of material or work-piece will be denoted as material.
  • the surfaces of materials will be treated in different working steps, wherein treatment shall be understood to be working steps like vapor-deposition or structuring, for example. Afterwards, the result of treatment will be inspected. Inspection can be carried out by using a camera provided with an image recognition and evaluation program.
  • top surface of material can be inspected easily, as the material is positioned on an inspection table or a conveyer belt so that there is a free view onto the top surface thereof.
  • the transport path is subdivided into several segments separated from each other by gaps so that the material is delivered up by the single segments.
  • the total width thereof can be scanned.
  • the transfer gap has to be dimensioned very small. Now and then, it is not possible to perform scanning in an unhindered way.
  • the invention according to claim 1 relates to an inspection device which comprises a support element for supporting a material to be inspected.
  • An oscillator is connected to the support element to cause it to vibrate, wherein the oscillation frequency and the amplitude of which are selected so as to keep the material to be inspected hovering on the top side of the support element by ultrasonic levitation.
  • the top surface of the support element is matched to the geometric shape of the bottom surface of the material.
  • the support element is made of a light-permeable material to allow the bottom surface of the material levitating on the support element to be scanned optically, that is, to be inspected by means of an optical sensor such as a camera, an interferometer, a Speckle measuring instrument or a line scan camera.
  • an optical sensor such as a camera, an interferometer, a Speckle measuring instrument or a line scan camera.
  • the support element may be expedient to make the support element of a material such as glass, light-permeable ceramic material, sapphire or oscillatory light-permeable plastic material, as defined in claims 2 to 4 .
  • the optical properties of the support element are dependent on the material which it is made of, on the geometric shape thereof and on the wave length of the light used for the inspection.
  • the support element is formed as a plane-parallel plate having an even surface.
  • an expert skilled in the art will design the optical sensor thereof so that the optical properties of the plane-parallel plate with respect to the refraction of light are considered.
  • the rod-like material having a circular cross section is to be held in a non-contact way and to be inspected, the rod-like material is located in a semi-circular groove of the support element, the radius thereof corresponding to that of the rod-like material.
  • the optical properties of the support element are different from those of a plane-parallel plate and, therefore, the refraction and reflection properties of curved surfaces have to be considered by those skilled in the art, which is true for designing the optical sensor and also for designing the illuminating system required.
  • the support element has to be regarded as a structural optic element which can be made by using technologies known for making and coating structural optic elements.
  • a transport and inspection device is provided, on which materials are transported along a transport path.
  • An inspection device according to any of the claims 1 to 4 is arranged at a certain position of the transport path.
  • the support plate is dependent on the shape and size of the material to be supported and the surface to be inspected may be the total surface of the material or only a section thereof, it is not possible to give concrete geometric information as to the design and shape of the support plate. It is obvious to those skilled in the art and knowing the disclosed technical science that only that surface section of the support plate, in which the propagation of light beams is not shadowed or disturbed, can be used for the inspection.
  • FIG. 1 is a schematic and perspective view of a support plate with a planar material put on it.
  • FIG. 2 is a side view of the support plate shown in FIG. 1 and a camera arranged below it.
  • FIG. 1 is a schematic and perspective view of a support plate 1 that is bent laterally.
  • An oscillator (not shown) is connected to the leg 2 of this plate. Generation of oscillation is indicated by a double arrow.
  • the planar material 3 is a silicon wafer levitating 0.1 mm above the support plate 1 .
  • FIG. 2 is a side view of the structure shown in FIG. 1 .
  • a camera 4 is arranged below the support plate 1 , which is used for inspecting the bottom surface of the silicon wafer levitating on the support plate.
  • the support plate is made of an optical glass and is laterally illuminated from below.

Landscapes

  • Immunology (AREA)
  • General Health & Medical Sciences (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Chemical & Material Sciences (AREA)
  • Physics & Mathematics (AREA)
  • Biochemistry (AREA)
  • Health & Medical Sciences (AREA)
  • General Physics & Mathematics (AREA)
  • Analytical Chemistry (AREA)
  • Pathology (AREA)
  • Investigating Materials By The Use Of Optical Means Adapted For Particular Applications (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Investigating Or Analyzing Materials By The Use Of Ultrasonic Waves (AREA)
  • Analysing Materials By The Use Of Radiation (AREA)
  • Testing Of Individual Semiconductor Devices (AREA)

Abstract

The invention relates to a device for inspecting contact-sensitive planar materials or workpieces, e.g. wafers for the semiconductor industry, solar cells, glasses, FPD substrates, or biologically active substrates for biosensors, as well as materials having contact-sensitive curved surfaces. Said inspection device comprises a support element (1) for supporting a material (3) on the top face of the support element (1), at least one oscillator which is connected to the support element (1) and the oscillation frequency and amplitude of which are selected in such a way as to keep the material (3) hovering on the support element (1), and at least one optical sensor (4). The support element is made of a light-permeable material, and the optical sensor (4) is arranged below the support element (1).

Description

  • The invention relates to a device for inspecting contact-sensitive planar materials or work-pieces, e.g. wafers for the semiconductor industry, solar cells, glasses, FPD substrates, or biologically active substrates for biosensors, as well as materials having contact-sensitive curved surfaces. In the following, every kind of material or work-piece will be denoted as material. The surfaces of materials will be treated in different working steps, wherein treatment shall be understood to be working steps like vapor-deposition or structuring, for example. Afterwards, the result of treatment will be inspected. Inspection can be carried out by using a camera provided with an image recognition and evaluation program.
  • Technologies assigned for the treatment of the top surface and also of the bottom surface of the materials require both these surfaces to be inspected. The top surface of material can be inspected easily, as the material is positioned on an inspection table or a conveyer belt so that there is a free view onto the top surface thereof. However, it is very difficult to inspect the bottom surface of material at the same time, as this surface is at least partly covered by sections of the support structure so that e.g. a camera is not capable of scanning all of this surface.
  • For example, when a solar cell the bottom surface thereof being very sensitive to mechanical contact is transported, this solar cell is borne by several small conveyer belts. Therefore, only those areas of the bottom surface of the solar cell, which are not covered by the conveyer belts, can be inspected by a camera from below. However, when the total bottom surface of the solar cell is to be inspected, the solar cell must be removed from the conveyer belt, turned and again put onto the conveyer belt, but this is time-consuming and susceptible to trouble with continuously running processes.
  • In order to solve these problems, according to the prior art, the transport path is subdivided into several segments separated from each other by gaps so that the material is delivered up by the single segments. As the material is not supported at the transfer gap, the total width thereof can be scanned. However, when the material to be transported is insufficiently stiff, there is the problem that the transfer gap has to be dimensioned very small. Now and then, it is not possible to perform scanning in an unhindered way.
  • Therefore, it is an object of the invention to provide a technology for transporting contact-sensitive materials along a transport path and optically inspecting the bottom surfaces thereof totally without hindering the inspection to be carried out at those positions where the material is supported and thus, is covered.
  • This object is solved by an inspection device according to claim 1 and a transport and inspection device according to claim 5.
  • The invention according to claim 1 relates to an inspection device which comprises a support element for supporting a material to be inspected. An oscillator is connected to the support element to cause it to vibrate, wherein the oscillation frequency and the amplitude of which are selected so as to keep the material to be inspected hovering on the top side of the support element by ultrasonic levitation. The top surface of the support element is matched to the geometric shape of the bottom surface of the material.
  • According to the invention, the support element is made of a light-permeable material to allow the bottom surface of the material levitating on the support element to be scanned optically, that is, to be inspected by means of an optical sensor such as a camera, an interferometer, a Speckle measuring instrument or a line scan camera.
  • In this way, it is possible to keep contact-sensitive materials such as wafers or solar cells levitating during an inspection and to inspect the bottom surfaces thereof completely.
  • Depending on the light used for the inspection, it may be expedient to make the support element of a material such as glass, light-permeable ceramic material, sapphire or oscillatory light-permeable plastic material, as defined in claims 2 to 4.
  • It will be obvious to those skilled in the art that the optical properties of the support element are dependent on the material which it is made of, on the geometric shape thereof and on the wave length of the light used for the inspection.
  • To transport wafers, for example, the support element is formed as a plane-parallel plate having an even surface. When optical systems have to be constructed, an expert skilled in the art will design the optical sensor thereof so that the optical properties of the plane-parallel plate with respect to the refraction of light are considered.
  • On the other hand, when rod-like material having a circular cross section is to be held in a non-contact way and to be inspected, the rod-like material is located in a semi-circular groove of the support element, the radius thereof corresponding to that of the rod-like material. In this case, the optical properties of the support element are different from those of a plane-parallel plate and, therefore, the refraction and reflection properties of curved surfaces have to be considered by those skilled in the art, which is true for designing the optical sensor and also for designing the illuminating system required.
  • Thus, the support element has to be regarded as a structural optic element which can be made by using technologies known for making and coating structural optic elements.
  • According to claim 5, a transport and inspection device is provided, on which materials are transported along a transport path. An inspection device according to any of the claims 1 to 4 is arranged at a certain position of the transport path.
  • As the support plate is dependent on the shape and size of the material to be supported and the surface to be inspected may be the total surface of the material or only a section thereof, it is not possible to give concrete geometric information as to the design and shape of the support plate. It is obvious to those skilled in the art and knowing the disclosed technical science that only that surface section of the support plate, in which the propagation of light beams is not shadowed or disturbed, can be used for the inspection.
  • It is obvious to those skilled in the art, in which way the signals provided by an optical sensor have to be evaluated. As signal processing and evaluating is not subject-matter of the invention but known from the prior art, it is not necessary to explain it in detail for those skilled in the art.
  • Below, the invention will be explained in detail by means of an embodiment and the enclosed schematic drawings.
  • FIG. 1 is a schematic and perspective view of a support plate with a planar material put on it.
  • FIG. 2 is a side view of the support plate shown in FIG. 1 and a camera arranged below it.
    •
  • FIG. 1 is a schematic and perspective view of a support plate 1 that is bent laterally. An oscillator (not shown) is connected to the leg 2 of this plate. Generation of oscillation is indicated by a double arrow. The planar material 3 is a silicon wafer levitating 0.1 mm above the support plate 1.
  • FIG. 2 is a side view of the structure shown in FIG. 1. A camera 4 is arranged below the support plate 1, which is used for inspecting the bottom surface of the silicon wafer levitating on the support plate. The support plate is made of an optical glass and is laterally illuminated from below.

Claims (5)

1. Inspection device which comprises:
a support element (1) for supporting a material (3) on the top side of the support element (1),
at least one oscillator connected to the support element (1), wherein the oscillation frequency and amplitude of the oscillator are selected so as to keep the material (3) levitating on the support element (1), and
at least one optical sensor,
wherein
the support element (1) is made of a light-permeable material and
the optical sensor is arranged below the support element (1).
2. Inspection device according to claim 1, characterized in that the support element (1) is made of glass.
3. Inspection device according to claim 1, characterized in that the support element (1) is made of a light-permeable ceramic material.
4. Inspection device according to claim 1, characterized in that the support element (1) is made of an oscillatory light-permeable plastic material.
5. Transport and inspection device for materials which are to be transported and inspected and are moved along a transport path by using transport means, characterized in that an inspection device according to any of the claims 1 to 4 is arranged within the area of the transport path.
US12/741,110 2007-11-01 2008-10-31 Inspection device Abandoned US20120327402A1 (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
DE102007052530A DE102007052530A1 (en) 2007-11-01 2007-11-01 Devices for inspection and irradiation of sheet materials
DE102007052530.5 2007-11-01
PCT/DE2008/001790 WO2009056127A2 (en) 2007-11-01 2008-10-31 Inspection device

Related Parent Applications (1)

Application Number Title Priority Date Filing Date
PCT/DE2008/001790 A-371-Of-International WO2009056127A2 (en) 2007-11-01 2008-10-31 Inspection device

Related Child Applications (1)

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US13/898,122 Continuation US8836933B2 (en) 2007-11-01 2013-05-20 Inspection device

Publications (1)

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US20120327402A1 true US20120327402A1 (en) 2012-12-27

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US12/741,110 Abandoned US20120327402A1 (en) 2007-11-01 2008-10-31 Inspection device
US13/898,122 Active US8836933B2 (en) 2007-11-01 2013-05-20 Inspection device

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Application Number Title Priority Date Filing Date
US13/898,122 Active US8836933B2 (en) 2007-11-01 2013-05-20 Inspection device

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US (2) US20120327402A1 (en)
EP (1) EP2269041B1 (en)
JP (1) JP5502740B2 (en)
KR (1) KR101545761B1 (en)
CN (1) CN102239403A (en)
DE (2) DE202007019013U1 (en)
WO (1) WO2009056127A2 (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US10056071B2 (en) 2013-07-22 2018-08-21 Zs-Handling Gmbh Device for inspecting workpiece surfaces and strip materials
US10646972B2 (en) 2013-07-22 2020-05-12 Zs-Handling Gmbh Device for treating or machining a surface

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DE102023103520B3 (en) 2023-02-14 2024-03-21 Isra Vision Gmbh Device and method for inspecting a plate-shaped or web-shaped object

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Publication number Priority date Publication date Assignee Title
US10056071B2 (en) 2013-07-22 2018-08-21 Zs-Handling Gmbh Device for inspecting workpiece surfaces and strip materials
US10646972B2 (en) 2013-07-22 2020-05-12 Zs-Handling Gmbh Device for treating or machining a surface

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Publication number Publication date
DE202007019013U1 (en) 2010-04-29
US8836933B2 (en) 2014-09-16
US20130321796A1 (en) 2013-12-05
EP2269041A2 (en) 2011-01-05
EP2269041B1 (en) 2017-08-23
JP2011502257A (en) 2011-01-20
JP5502740B2 (en) 2014-05-28
KR20100105566A (en) 2010-09-29
WO2009056127A3 (en) 2010-07-29
CN102239403A (en) 2011-11-09
DE102007052530A1 (en) 2009-05-14
KR101545761B1 (en) 2015-08-19
WO2009056127A2 (en) 2009-05-07

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AS Assignment

Owner name: ZIMMERMANN & SCHILP HANDHABUNGSTECHNIK GMBH, GERMA

Free format text: ASSIGNMENT OF ASSIGNORS INTEREST;ASSIGNORS:SCHILP, MICHAEL;ZIMMERMANN, JOSEF;ZITZMANN, ADOLF;REEL/FRAME:025534/0125

Effective date: 20101220

STCB Information on status: application discontinuation

Free format text: ABANDONED -- FAILURE TO RESPOND TO AN OFFICE ACTION