US20120055659A1 - Device for exchanging heat comprising a plate stack and method for producing said device - Google Patents

Device for exchanging heat comprising a plate stack and method for producing said device Download PDF

Info

Publication number
US20120055659A1
US20120055659A1 US13/318,247 US201013318247A US2012055659A1 US 20120055659 A1 US20120055659 A1 US 20120055659A1 US 201013318247 A US201013318247 A US 201013318247A US 2012055659 A1 US2012055659 A1 US 2012055659A1
Authority
US
United States
Prior art keywords
plates
plate
recesses
adjacent
disposed
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
US13/318,247
Other languages
English (en)
Inventor
Norbert Hubert
Michael Meinert
Armin Rastogi
Karsten Rechenberg
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Siemens AG
Original Assignee
Siemens AG
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Siemens AG filed Critical Siemens AG
Assigned to SIEMENS AKTIENGESELLSCHAFT reassignment SIEMENS AKTIENGESELLSCHAFT ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: RECHENBERG, KARSTEN, MEINERT, MICHAEL, RASTOGI, ARMIN, HUBER, NORBERT
Publication of US20120055659A1 publication Critical patent/US20120055659A1/en
Abandoned legal-status Critical Current

Links

Images

Classifications

    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F3/00—Plate-like or laminated elements; Assemblies of plate-like or laminated elements
    • F28F3/08—Elements constructed for building-up into stacks, e.g. capable of being taken apart for cleaning
    • F28F3/086—Elements constructed for building-up into stacks, e.g. capable of being taken apart for cleaning having one or more openings therein forming tubular heat-exchange passages
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
    • H01L23/473—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing liquids
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/4935—Heat exchanger or boiler making

Definitions

  • the present invention relates to a device for exchanging heat and to a method for producing said device.
  • the device features a plate stack comprising at least a first, a second and a third plate.
  • the at least three plates are stacked above one another and have recesses which are embodied to run right through the entire thickness of the respective plate.
  • the recesses are arranged in one plane of the respective plate in the shape of a regular pattern.
  • cooling plates In many applications, such as obtain in many electrical machines for example, heat occurs during the transport and conversion of electrical current. The heat can have a negative effect on the operation of the electrical device and under some circumstances can result in the destruction of the device. In order to prevent this, facilities for dissipation of the heat are provided in the devices.
  • One possible facility is provided by cooling plates, as are known from DE 10 2006 036 833 A1 for example.
  • the cooling plates consist of a stack of plates, which is constructed from at least two plates with recesses. The plates are arranged such that some of the recesses overlap and form a cooling channel. A fluid, e.g. water which flows through the cooling channel, cools the plate and transports superfluous heat out of the device.
  • the object of the present device is to specify a cooling device in which the aforementioned problems are at least ameliorated.
  • a particular object is to specify a device for exchanging heat which makes it possible to make the temperature more uniform in a device. It is also an object of the invention to specify a method for producing the device.
  • the specified object is achieved in relation to the device for exchanging heat with the characteristics of claim 1 and in relation to the method for producing the device with the characteristics of claim 11 .
  • the inventive device for exchanging heat has a plate stack comprising at least a first, a second and a third plate.
  • the at least three plates are stacked above one another and have recesses which are embodied to run right through the entire thickness of the respective plates.
  • the recesses are arranged in one plane of the respective plate in the shape of a regular pattern.
  • the first and the second plate as well as the second and the third plate adjoin each other and/or are stacked above one another so that the adjacent plates each embody at least one cooling channel accessible for a fluid in one direction in the plate plane.
  • the at least two cooling channels are embodied with the aid of recesses arranged to overlap partly, but not completely in the adjacent plates.
  • the at least one cooling channel of the first and the second plate is completely spatially separated from the at least one cooling channel of the second and the third plate.
  • the embodiment of separate cooling channels enables a fluid to be introduced from different sides of the device and to remove heat in a contraflow principle from the device for example.
  • the inflow of the fluid for cooling from different sides achieves an evening-out of the cooling effect.
  • a temperature gradient between entry and exit of the fluid in the device is reduced.
  • the device is cooled more evenly in its spatial extent.
  • the device can be used as a heat exchanger between two fluids at different temperatures.
  • the recesses of the plate can have an identical shape, especially a Y shape.
  • the Y-shape can be composed of identical parts turned through 120 degrees respectively.
  • the recesses can be arranged so that they only overlap in the area of the ends of the Y-shape. With this shape of recess the device can be produced in an especially simple manner and the recesses can easily be made to overlap.
  • Each end of a Y-shaped recess of a plate can be arranged overlapped respectively with one end of Y-shaped recess of an adjacent plate, especially with precisely one end of a Y-shaped recess of an adjacent plate in each case.
  • the cooling channels formed exhibit favorable flow conditions with this arrangement.
  • a plate can be constructed from a number of identically-shaped subplates stacked above one another and covering the same area.
  • the thickness of the plate can range between 0.5 millimeters-20 mm and the channels can have a thickness in the range of 0.5 mm to 20 mm.
  • Very small coolers or very large cooling plates can have correspondingly modified channel measurements.
  • the plates can consist of a metal, especially magnetizable iron. Furthermore the plates can be coated entirely or partly with an electrically-insulating varnish and/or be electrically insulated in relation to one another.
  • the plate stack can be part of the generator or of a motor and/or part of a rotor or a stator.
  • the plates can consist of a metal, especially aluminum or copper.
  • the plate stack can be used for cooling of electrical power components, such as for cooling of electrical energy accumulators or power electronics components for example.
  • An inventive method for producing a previously described device is produced by at least three plates being stacked one above the other to form a plate stack such that at least a first cooling channel is produced right through a first and through a second plate of the plate stack. At least one second channel, completely separated spatially from at least the first cooling channel, is made right through the second and a third plate of the plate stack.
  • the cooling channels are formed in at least one direction in one plate plane by recesses in the at least three plates. The recesses of adjacent plates are arranged partly but not completely overlapping.
  • the recesses can be punched and/or drilled and/or milled and/or etched out of the plates or embodied with the aid of a laser.
  • the recesses in each of the plates can be arranged in a plane of the respective plate in the shape of a regular pattern.
  • the first and the third plate are embodied with the same pattern rotated in relation to each other by 90 degrees.
  • the second plate arranged between the first and the third plate is embodied with a pattern which produces an overlaying of the pattern of the first plate with the pattern of the third plate, especially with a displacement of the two patterns in relation to each other by a half spacing of the recesses of a plate in relation to each other.
  • All plates of the plate stack can be arranged so that recesses of the adjacent plates are mutually overlapping and do not cover the same area.
  • the plates can be joined to one another by gluing and/or by snap-lock connection and/or by soldering and/or by screwing.
  • the cooling channels formed by the recesses can have a fluid, especially air, water or oils, frost-protection and corrosion protection agents, flowing through them.
  • the at least two cooling channels can also each have a fluid flowing through them, whereby the at least two fluid flows differ in their temperature and an exchange of heat occurs via the plates between the fluids separated from one another.
  • FIG. 1 an oblique view of a plate stack with a cooling channel according to the prior art
  • FIG. 2 a view of a plate stack with two plates according to the prior art, as is depicted in FIG. 1 , and
  • FIG. 3 a view of an inventive plate stack with 3 plates, whereby two cooling channels separated spatially from one another are embodied
  • FIG. 4 a first plate of the plate stack, as depicted in FIG. 3 .
  • FIG. 5 a second plate of the plate stack, as depicted in FIG. 3 .
  • FIG. 6 a third plate of the plate stack, as depicted in FIG. 3 .
  • FIG. 7 a plate without a pattern of recesses which is disposed as a cover plate on top of or underneath the plate stack
  • FIG. 8 a side view of the plate stack with a cover plate on top of the stack and a plate below the stack and connections for supplying and removing fluids to and from cooling channels.
  • FIG. 1 shows an oblique view of a plate stack 1 with recesses 7 in accordance with the prior art, which has a contiguous cooling channel 8 or a channel for a fluid.
  • the plate stack 1 is constructed from two plates 4 and 5 stacked above one another and enclosed by an upper cover plate 2 and a lower cover plate 3 underneath the plate stack 1 , in the form of a sandwich.
  • the two plates 4 and 5 of the plate stack 1 each have Y-shaped recesses 7 , which are disposed at regular distances from each other without touching each other.
  • the recesses 7 each produce a regular pattern in a plate 4 or 5 .
  • Adjacent plates 4 and 5 are arranged with their recesses 7 so that the recesses 7 only overlap in their edge areas.
  • Each end of a Y-shaped recess 7 of the plate 4 or 5 overlaps with an end, especially with precisely one end, of a Y-shaped recess 7 of the adjacent plate 5 or 4 .
  • the overlapping recesses 7 of adjacent plates 4 and 5 form a cooling channel 8 passing completely through plate 4 and 5 along the plate plane.
  • the cooling channel 8 thus formed can have a fluid flowing through it, with the fluid able to take up and transport away waste heat of the plate 2 and 3 .
  • Water provides a frequently-used fluid for cooling.
  • the cooling water flows in the channel 8 in parallel to a plane of plate 2 to 5 .
  • the overlapping recesses 7 of adjacent plates 4 and 5 form a pattern which produces a large common surface between the plates 4 and 5 and the fluid.
  • effective cooling is possible with a compact, simple construction.
  • the embodiment of the cooling channel 8 by overlapping recesses 7 in adjacent plates 4 and 5 makes simple production of the channel 8 possible by stacking plates 2 to 5 on top of one another.
  • FIG. 2 shows a view of a plate stack as presented in FIG. 1 .
  • the cross-hatched recesses 7 a are embodied in the first upper plate 4 in the plate stack in a first plane.
  • the recesses 7 b identified by dots are embodied in the second lower plate 5 in the plate stack in a second plane.
  • the recesses 7 a and 7 b of the first and the second plate 4 and 5 all overlap, but only in the edge area in each case, i.e. at the ends of their Y shape.
  • the pattern of the recesses 7 a in the first plate 4 and the same pattern of recesses 7 b offset thereto in the second plate 5 produces a cooling channel 8 passing right through the length of the plate plane, which takes the form of a network.
  • FIG. 3 shows a view of an inventive plate stack 1 with 3 plates 4 , 5 and 6 .
  • the three plates 4 to 6 are stacked above one another and each have a pattern of recesses 7 .
  • the recesses 7 are arranged in the plates 4 to 6 such that they form two spatially-separated cooling channels 8 a and 8 b partly lying above one another.
  • the first plate 4 is shown individually in FIG. 4 , with a pattern of recesses 7 a. Shown on the right-hand and left-hand side in the plane of the figure are an inflow 9 and an outflow channel 10 .
  • the inflow channel 9 is used to introduce fluid into the first channel 8 a.
  • the outflow channel 10 is used to enable the fluid to leave or to escape from the first channel 8 a.
  • Connections 11 to the inflow channel 9 and the outflow channel 10 are shown as circular dashed areas in each case.
  • FIG. 5 shows the pattern of the recesses 7 b of the second plate 5 .
  • the pattern of the recesses 7 b of the second plate 5 is produced from an overlaying of the pattern of the recesses 7 a of the first plate 4 (see FIG. 4 ) with the same pattern, rotated through 180 degrees and displaced by a half spacing of the recesses 7 a from each other in each case.
  • Shown cross-hatched on the right-hand and left-hand side in the plane of the figure are the inflow channel 9 and the outflow channel 10 of the third plate 6 arranged below the second plate 5 (see FIG. 6 ).
  • Circular holes are made in the second plate 5 in order to introduce fluid into the inflow channel 9 or to transport it away via the outflow channel 10 of the third plate 6 (see dashed lines and FIG. 6 ) via connections 11 through the first and second plate 4 and 5 .
  • the third plate 6 is shown individually in FIG. 6 , with a pattern of recesses 7 c. Shown on the right-hand and left-hand side in the plane of the figure are a respective inflow channel 9 and an outflow channel 10 .
  • the inflow channel 9 is used to introduce fluid into the second channel 8 b.
  • the outflow channel 10 is used to allow the fluid to leave or to escape from the second channel 8 b.
  • Connections 11 to the inflow channel 9 and to the outflow channel 10 are shown as circles in each case in FIG. 6 .
  • FIG. 7 Shown in FIG. 7 is a cover plate 2 (like the cover plate 3 ) which does not have any pattern of recesses 7 .
  • the channels 8 are sealed at the top and bottom with the aid of the cover plate 2 and 3 .
  • a cover plate 2 is arranged on top of the plate stack 1 and a cover plate 3 underneath it.
  • the plates 4 to 6 with recesses lie in the shape of sandwich between the cover plates 2 and 3 .
  • the plate stack 1 is shown from the side in FIG. 8 . Connections shown in the form of circles in FIG. 7 are shown connected in FIG. 8 to inflow and outflow lines 12 .
  • inflow and outflow lines 12 are provided in each case, which are disposed in opposite corners of the plate stack.
  • This allows two fluid circuits to be operated separately from one another with the aid of the first and second channel 8 a and 8 b.
  • the two circuits can be used for more even cooling of the plate stack 1 since cool fluid can flow into the plate stack 1 from two different sides.
  • the plate stack 1 can be used as a heat exchanger between a fluid with the temperature T 1 and a fluid with a higher temperature T 2 .
  • the plates 2 to 6 shown in the figures as a rule have a thickness in the range of the 1 mm.
  • the channels 8 a and 8 b thus typically likewise have thickness of 1 mm (2 mm at points at which the recesses 7 overlap) in a direction at right angles to the plane of the plates.
  • By stacking identical plates thicknesses of 3 to 30 mm or more of the cooling channels in a perpendicular direction to the plane of the plates can also be realized.
  • the plates 2 to 6 and cooling channels 8 a and 8 b can however also have other sizes, in the range of a few centimeters thick for example.
  • the width of the recesses 7 and thus of the channels 8 a and 8 b preferably lies in the range of 5 to 30 mm. Channel widths in the centimeter range are however also possible.
  • the thickness of the plates can lie in the range of 0.5 mm-20 mm and the channels can have a thickness in a range of 0.5 mm to 20 mm.
  • Miniature coolers or very large cooling plates can have accordingly modified channel dimensions.
  • the plates 2 to 6 preferably consist of a metal, especially aluminum or copper. Other pure metals or metal alloys are however also suitable.
  • the plate stack 1 as a heat exchanger or as a plate stack in a stator plate stack of the machine, such as an electric motor or generator for example, is possible.

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Power Engineering (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Thermal Sciences (AREA)
  • Mechanical Engineering (AREA)
  • General Engineering & Computer Science (AREA)
  • Heat-Exchange Devices With Radiators And Conduit Assemblies (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
US13/318,247 2009-04-29 2010-04-15 Device for exchanging heat comprising a plate stack and method for producing said device Abandoned US20120055659A1 (en)

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
DE102009019356 2009-04-29
DE102009019356.1 2009-04-29
DE102009052489.4 2009-11-09
DE102009052489A DE102009052489A1 (de) 2009-04-29 2009-11-09 Vorrichtung zum Austausch von Wärme mit einem Plattenpaket und Verfahren zu deren Herstellung
PCT/EP2010/054947 WO2010124937A2 (de) 2009-04-29 2010-04-15 Vorrichtung zum austausch von wärme mit einem plattenpaket und verfahren zu deren herstellung

Publications (1)

Publication Number Publication Date
US20120055659A1 true US20120055659A1 (en) 2012-03-08

Family

ID=42932582

Family Applications (1)

Application Number Title Priority Date Filing Date
US13/318,247 Abandoned US20120055659A1 (en) 2009-04-29 2010-04-15 Device for exchanging heat comprising a plate stack and method for producing said device

Country Status (6)

Country Link
US (1) US20120055659A1 (ja)
EP (1) EP2425196A2 (ja)
JP (1) JP5420755B2 (ja)
CN (1) CN102414535B (ja)
DE (1) DE102009052489A1 (ja)
WO (1) WO2010124937A2 (ja)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20130058042A1 (en) * 2011-09-03 2013-03-07 Todd Richard Salamon Laminated heat sinks
US9273406B2 (en) 2011-04-20 2016-03-01 Siemens Aktiengesellschaft Electrolytic cell having a laminated core of laminations which are stacked one on top of the other with recesses, and method for manufacturing and operating same

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102011079637A1 (de) * 2011-07-22 2013-01-24 Siemens Aktiengesellschaft Verfahren zur Herstellung einer seewasserfesten Kühlplatte und Vorrichtung hergestellt mit diesem Verfahren sowie deren Verwendung
EP2674715A1 (en) * 2012-06-14 2013-12-18 Alfa Laval Corporate AB A plate heat exchanger with thermally drilled hole

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2281754A (en) * 1937-01-27 1942-05-05 Cherry Burreil Corp Heat exchanger
US5050671A (en) * 1989-05-12 1991-09-24 Du Pont Canada Inc. Panel heat exchangers formed from thermoplastic polymers
US5927396A (en) * 1995-09-28 1999-07-27 Behr Gmbh & Co. Multi-fluid heat transfer device having a plate stack construction
US6167952B1 (en) * 1998-03-03 2001-01-02 Hamilton Sundstrand Corporation Cooling apparatus and method of assembling same
US6892805B1 (en) * 2004-04-05 2005-05-17 Modine Manufacturing Company Fluid flow distribution device

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4516632A (en) * 1982-08-31 1985-05-14 The United States Of America As Represented By The United States Deparment Of Energy Microchannel crossflow fluid heat exchanger and method for its fabrication
DE4238192C2 (de) * 1992-11-12 1994-09-29 Hoechst Ceram Tec Ag Durchlässige Struktur
DE19528117B4 (de) * 1995-08-01 2004-04-29 Behr Gmbh & Co. Wärmeübertrager mit Plattenstapelaufbau
DE19528116B4 (de) * 1995-08-01 2007-02-15 Behr Gmbh & Co. Kg Wärmeübertrager mit Platten-Sandwichstruktur
DE102005007707A1 (de) * 2004-09-27 2006-03-30 Powerfluid Gmbh Rekuperator, Mikrokanal-Rekuperator, Folie, Verwendung einer Folie und Verfahren zum Herstellen sowie zum Betreiben eines Rekuperators
JP2006224253A (ja) * 2005-02-18 2006-08-31 Seiko Epson Corp マイクロチャンネル構造体及びその製造方法、光源装置、並びにプロジェクタ
DE102006036833B4 (de) * 2006-08-07 2012-12-13 Siemens Ag Gradientenspulensystem und Magnetresonanztomograph

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2281754A (en) * 1937-01-27 1942-05-05 Cherry Burreil Corp Heat exchanger
US5050671A (en) * 1989-05-12 1991-09-24 Du Pont Canada Inc. Panel heat exchangers formed from thermoplastic polymers
US5927396A (en) * 1995-09-28 1999-07-27 Behr Gmbh & Co. Multi-fluid heat transfer device having a plate stack construction
US6167952B1 (en) * 1998-03-03 2001-01-02 Hamilton Sundstrand Corporation Cooling apparatus and method of assembling same
US6892805B1 (en) * 2004-04-05 2005-05-17 Modine Manufacturing Company Fluid flow distribution device

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9273406B2 (en) 2011-04-20 2016-03-01 Siemens Aktiengesellschaft Electrolytic cell having a laminated core of laminations which are stacked one on top of the other with recesses, and method for manufacturing and operating same
US20130058042A1 (en) * 2011-09-03 2013-03-07 Todd Richard Salamon Laminated heat sinks

Also Published As

Publication number Publication date
CN102414535B (zh) 2014-07-16
WO2010124937A3 (de) 2011-06-03
CN102414535A (zh) 2012-04-11
WO2010124937A2 (de) 2010-11-04
DE102009052489A1 (de) 2010-11-11
EP2425196A2 (de) 2012-03-07
JP5420755B2 (ja) 2014-02-19
JP2012525559A (ja) 2012-10-22

Similar Documents

Publication Publication Date Title
EP3446058B1 (en) Microchannel evaporators with reduced pressure drop
US8391008B2 (en) Power electronics modules and power electronics module assemblies
US20210219465A1 (en) Automotive power inverter with cooling channels and cooling pins
US9420724B2 (en) Power converter assembly
US20130068434A1 (en) Heat exchanger and method for manufacturing same
US20120055659A1 (en) Device for exchanging heat comprising a plate stack and method for producing said device
NZ580113A (en) Arrangement for cooling a stator of an electrical machine where a metal cooling pipe in the stator is configured such that induced voltage in the cooling pipe is reduced or minimised
US9943016B2 (en) Cooling structure
US9680385B2 (en) Power converter
US20070023168A1 (en) Apparatus for cooling electronic components
US11109511B2 (en) Cooling device and method of manufacturing cooling device
JP5664472B2 (ja) 電力変換装置
JP2008282969A (ja) 冷却器及び電子機器
US20190063848A1 (en) Laminated microchannel heat exchangers
CN109416224B (zh) 层压微通道热交换器
CN107768324B (zh) 具有冷却功能的车辆电力模块组件
US20230307406A1 (en) Electronics assemblies with power electronic devices and three-dimensionally printed circuit boards having reduced joule heating
JP2012064732A (ja) 水冷ヒートシンク
US20160165752A1 (en) Heat exchanger assembly
JP7500792B2 (ja) パワーエレクトロニクスアセンブリ及びその製造方法
EP4167698A1 (en) Liquid-cooled assembly and method
JP6508398B2 (ja) 液冷ジャケット
JP2013229125A (ja) 電池モジュール及び車両
JP5653852B2 (ja) 冷却装置
KR20220167272A (ko) 스테이터 코어, 모터, 파워 트레인, 자동차 및 차량

Legal Events

Date Code Title Description
AS Assignment

Owner name: SIEMENS AKTIENGESELLSCHAFT, GERMANY

Free format text: ASSIGNMENT OF ASSIGNORS INTEREST;ASSIGNORS:HUBER, NORBERT;MEINERT, MICHAEL;RASTOGI, ARMIN;AND OTHERS;SIGNING DATES FROM 20110926 TO 20111004;REEL/FRAME:027176/0311

STCB Information on status: application discontinuation

Free format text: ABANDONED -- AFTER EXAMINER'S ANSWER OR BOARD OF APPEALS DECISION