WO2010124937A3 - Vorrichtung zum austausch von wärme mit einem plattenpaket und verfahren zu deren herstellung - Google Patents
Vorrichtung zum austausch von wärme mit einem plattenpaket und verfahren zu deren herstellung Download PDFInfo
- Publication number
- WO2010124937A3 WO2010124937A3 PCT/EP2010/054947 EP2010054947W WO2010124937A3 WO 2010124937 A3 WO2010124937 A3 WO 2010124937A3 EP 2010054947 W EP2010054947 W EP 2010054947W WO 2010124937 A3 WO2010124937 A3 WO 2010124937A3
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- plates
- plate stack
- producing
- exchanging heat
- plate
- Prior art date
Links
Classifications
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
- F28F3/00—Plate-like or laminated elements; Assemblies of plate-like or laminated elements
- F28F3/08—Elements constructed for building-up into stacks, e.g. capable of being taken apart for cleaning
- F28F3/086—Elements constructed for building-up into stacks, e.g. capable of being taken apart for cleaning having one or more openings therein forming tubular heat-exchange passages
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
- H01L23/473—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing liquids
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/4935—Heat exchanger or boiler making
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Mechanical Engineering (AREA)
- General Engineering & Computer Science (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Thermal Sciences (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Heat-Exchange Devices With Radiators And Conduit Assemblies (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
Priority Applications (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US13/318,247 US20120055659A1 (en) | 2009-04-29 | 2010-04-15 | Device for exchanging heat comprising a plate stack and method for producing said device |
JP2012507667A JP5420755B2 (ja) | 2009-04-29 | 2010-04-15 | 積層板を有する熱交換装置およびその製造方法 |
EP10716315A EP2425196A2 (de) | 2009-04-29 | 2010-04-15 | Vorrichtung zum austausch von wärme mit einem plattenpaket und verfahren zu deren herstellung |
CN201080019004.4A CN102414535B (zh) | 2009-04-29 | 2010-04-15 | 具有叠片组的热交换设备及其制造方法 |
Applications Claiming Priority (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE102009019356.1 | 2009-04-29 | ||
DE102009019356 | 2009-04-29 | ||
DE102009052489.4 | 2009-11-09 | ||
DE102009052489A DE102009052489A1 (de) | 2009-04-29 | 2009-11-09 | Vorrichtung zum Austausch von Wärme mit einem Plattenpaket und Verfahren zu deren Herstellung |
Publications (2)
Publication Number | Publication Date |
---|---|
WO2010124937A2 WO2010124937A2 (de) | 2010-11-04 |
WO2010124937A3 true WO2010124937A3 (de) | 2011-06-03 |
Family
ID=42932582
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/EP2010/054947 WO2010124937A2 (de) | 2009-04-29 | 2010-04-15 | Vorrichtung zum austausch von wärme mit einem plattenpaket und verfahren zu deren herstellung |
Country Status (6)
Country | Link |
---|---|
US (1) | US20120055659A1 (de) |
EP (1) | EP2425196A2 (de) |
JP (1) | JP5420755B2 (de) |
CN (1) | CN102414535B (de) |
DE (1) | DE102009052489A1 (de) |
WO (1) | WO2010124937A2 (de) |
Families Citing this family (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE102011007759A1 (de) | 2011-04-20 | 2012-10-25 | Siemens Aktiengesellschaft | Elektrolysezelle mit einem Blechpaket übereinander gestapelter Bleche mit Ausnehmungen und Verfahren zu deren Herstellung und Betrieb |
DE102011079637A1 (de) * | 2011-07-22 | 2013-01-24 | Siemens Aktiengesellschaft | Verfahren zur Herstellung einer seewasserfesten Kühlplatte und Vorrichtung hergestellt mit diesem Verfahren sowie deren Verwendung |
US20130058042A1 (en) * | 2011-09-03 | 2013-03-07 | Todd Richard Salamon | Laminated heat sinks |
EP2674715A1 (de) * | 2012-06-14 | 2013-12-18 | Alfa Laval Corporate AB | Plattenwärmetauscher mit Fliessbohrung |
Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4516632A (en) * | 1982-08-31 | 1985-05-14 | The United States Of America As Represented By The United States Deparment Of Energy | Microchannel crossflow fluid heat exchanger and method for its fabrication |
DE4238192A1 (de) * | 1992-11-12 | 1994-05-19 | Hoechst Ceram Tec Ag | Durchlässige Strukturen |
DE19528116A1 (de) * | 1995-08-01 | 1997-02-06 | Behr Gmbh & Co | Wärmeübertrager mit Platten-Sandwichstruktur |
DE102005007707A1 (de) * | 2004-09-27 | 2006-03-30 | Powerfluid Gmbh | Rekuperator, Mikrokanal-Rekuperator, Folie, Verwendung einer Folie und Verfahren zum Herstellen sowie zum Betreiben eines Rekuperators |
US20080030194A1 (en) * | 2006-08-07 | 2008-02-07 | Bernd Gromoll | Gradient coil system and mr imaging system embodying same |
Family Cites Families (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US2281754A (en) * | 1937-01-27 | 1942-05-05 | Cherry Burreil Corp | Heat exchanger |
GB8910966D0 (en) * | 1989-05-12 | 1989-06-28 | Du Pont Canada | Panel heat exchangers formed from thermoplastic polymers |
DE19528117B4 (de) * | 1995-08-01 | 2004-04-29 | Behr Gmbh & Co. | Wärmeübertrager mit Plattenstapelaufbau |
DE19536115C2 (de) * | 1995-09-28 | 2001-03-08 | Behr Gmbh & Co | Mehrfluid-Wärmeübertrager mit Plattenstapelaufbau |
US6167952B1 (en) * | 1998-03-03 | 2001-01-02 | Hamilton Sundstrand Corporation | Cooling apparatus and method of assembling same |
US6892805B1 (en) * | 2004-04-05 | 2005-05-17 | Modine Manufacturing Company | Fluid flow distribution device |
JP2006224253A (ja) * | 2005-02-18 | 2006-08-31 | Seiko Epson Corp | マイクロチャンネル構造体及びその製造方法、光源装置、並びにプロジェクタ |
-
2009
- 2009-11-09 DE DE102009052489A patent/DE102009052489A1/de not_active Withdrawn
-
2010
- 2010-04-15 EP EP10716315A patent/EP2425196A2/de not_active Withdrawn
- 2010-04-15 JP JP2012507667A patent/JP5420755B2/ja not_active Expired - Fee Related
- 2010-04-15 US US13/318,247 patent/US20120055659A1/en not_active Abandoned
- 2010-04-15 CN CN201080019004.4A patent/CN102414535B/zh not_active Expired - Fee Related
- 2010-04-15 WO PCT/EP2010/054947 patent/WO2010124937A2/de active Application Filing
Patent Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4516632A (en) * | 1982-08-31 | 1985-05-14 | The United States Of America As Represented By The United States Deparment Of Energy | Microchannel crossflow fluid heat exchanger and method for its fabrication |
DE4238192A1 (de) * | 1992-11-12 | 1994-05-19 | Hoechst Ceram Tec Ag | Durchlässige Strukturen |
DE19528116A1 (de) * | 1995-08-01 | 1997-02-06 | Behr Gmbh & Co | Wärmeübertrager mit Platten-Sandwichstruktur |
DE102005007707A1 (de) * | 2004-09-27 | 2006-03-30 | Powerfluid Gmbh | Rekuperator, Mikrokanal-Rekuperator, Folie, Verwendung einer Folie und Verfahren zum Herstellen sowie zum Betreiben eines Rekuperators |
US20080030194A1 (en) * | 2006-08-07 | 2008-02-07 | Bernd Gromoll | Gradient coil system and mr imaging system embodying same |
Also Published As
Publication number | Publication date |
---|---|
US20120055659A1 (en) | 2012-03-08 |
DE102009052489A1 (de) | 2010-11-11 |
JP5420755B2 (ja) | 2014-02-19 |
EP2425196A2 (de) | 2012-03-07 |
WO2010124937A2 (de) | 2010-11-04 |
CN102414535B (zh) | 2014-07-16 |
JP2012525559A (ja) | 2012-10-22 |
CN102414535A (zh) | 2012-04-11 |
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