US20120021201A1 - Anti-static wrapper for electronic component wrapping, coated with nano film and manufacturing method thereof - Google Patents

Anti-static wrapper for electronic component wrapping, coated with nano film and manufacturing method thereof Download PDF

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Publication number
US20120021201A1
US20120021201A1 US13/166,496 US201113166496A US2012021201A1 US 20120021201 A1 US20120021201 A1 US 20120021201A1 US 201113166496 A US201113166496 A US 201113166496A US 2012021201 A1 US2012021201 A1 US 2012021201A1
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Prior art keywords
film
dlc
electronic component
dlc film
static
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Abandoned
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English (en)
Inventor
Youngha JUN
Jaimoo Yoo
Kiho YEO
Jongchul MOON
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J&L Tech CO Ltd
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J&L Tech CO Ltd
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Assigned to J&L TECH CO., LTD. reassignment J&L TECH CO., LTD. ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: JUN, YOUNGHA, MOON, JONGCHUL, YEO, KIHO, YOO, JAIMOO
Publication of US20120021201A1 publication Critical patent/US20120021201A1/en
Priority to US14/316,516 priority Critical patent/US9267201B2/en
Abandoned legal-status Critical Current

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    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/34—Sputtering
    • C23C14/35—Sputtering by application of a magnetic field, e.g. magnetron sputtering
    • C23C14/354—Introduction of auxiliary energy into the plasma
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J7/00—Chemical treatment or coating of shaped articles made of macromolecular substances
    • C08J7/04—Coating
    • C08J7/06—Coating with compositions not containing macromolecular substances
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B15/08—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
    • C08J5/18—Manufacture of films or sheets
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J7/00—Chemical treatment or coating of shaped articles made of macromolecular substances
    • C08J7/04—Coating
    • C08J7/044—Forming conductive coatings; Forming coatings having anti-static properties
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/06—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the coating material
    • C23C14/0605—Carbon
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/06—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the coating material
    • C23C14/14—Metallic material, boron or silicon
    • C23C14/20—Metallic material, boron or silicon on organic substrates
    • C23C14/205—Metallic material, boron or silicon on organic substrates by cathodic sputtering
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/221—Ion beam deposition
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/56—Apparatus specially adapted for continuous coating; Arrangements for maintaining the vacuum, e.g. vacuum locks
    • C23C14/562—Apparatus specially adapted for continuous coating; Arrangements for maintaining the vacuum, e.g. vacuum locks for coating elongated substrates
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
    • C23C16/22—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the deposition of inorganic material, other than metallic material
    • C23C16/26—Deposition of carbon only
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
    • C23C16/44—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
    • C23C16/50—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating using electric discharges
    • C23C16/513—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating using electric discharges using plasma jets
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/31504—Composite [nonstructural laminate]
    • Y10T428/31678—Of metal
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/31504—Composite [nonstructural laminate]
    • Y10T428/31678—Of metal
    • Y10T428/31681—Next to polyester, polyamide or polyimide [e.g., alkyd, glue, or nylon, etc.]
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/31504—Composite [nonstructural laminate]
    • Y10T428/31678—Of metal
    • Y10T428/31692—Next to addition polymer from unsaturated monomers
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/31504—Composite [nonstructural laminate]
    • Y10T428/31721—Of polyimide
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/31504—Composite [nonstructural laminate]
    • Y10T428/31786—Of polyester [e.g., alkyd, etc.]
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/31504—Composite [nonstructural laminate]
    • Y10T428/31855—Of addition polymer from unsaturated monomers
    • Y10T428/31938—Polymer of monoethylenically unsaturated hydrocarbon

Definitions

  • the invention is upon anti-static wrapper; specifically upon a new technology to manufacture anti-static wrapper using new materials.
  • Anti-static wrapper is used to protect highly electronic components such as semi-conductor from static, and is used as adhesive tape. And, anti-static wrapper is also used to prevent adhesion of pollution material such as dust and to prevent static electricity.
  • the existing anti-static wrapper employed PVD(Physical Vapor Deposition) method using vacuum equipment by depositing aluminium (Al), nickel (Ni), copper (Cu), indum oxide (In2O3), and tin oxide (SnO) upon normal polymer film using sputter source to manufacture conductivity/static dissipating wrapper.
  • PVD Physical Vapor Deposition
  • the above PVD method has problems; it has low adhesive strength of metal film deposited with polymer film during the process and/or after the process of manufacturing the wrapper so that metal film may be detached to reduce anti-static function and to contaminate surroundings.
  • Another method for anti-static wrapper is to adopt a surfactant, which has two methods: one is an external spread type to spread a surfactant upon the surface of polymer resin film; the other is an internal mixing type to mix an anti-static surfactant at a time when making polymer resin film.
  • the former is low cost with fine initial performance, but has relatively low durability for it was spread on the surface of film. And, it also may contaminate other materials contacted during the use.
  • the aim of this invention is to manufacture durable, lubricating and chemically unreactive wrapper with high anti-static performance.
  • the present invention may supply anti-static wrapper for electronic component wrapping in which 1-40 nm DLC (Diamond like carbon) film is coated upon 5 ⁇ 100 ⁇ m thick polymer film made of either Polyimide, Polyethylene, Polyethyleneterephthalate or Polypropylene, whose electric resistance ranges between 106 and 1010 ⁇ /sq.
  • DLC Diamond like carbon
  • the present invention may supply anti-static wrapper for electronic component wrapping in which the above DLC film is coated on both sides of the above polymer film.
  • the present invention may supply anti-static wrapper for electronic component wrapping in which the above DLC film is doped by at least one of Al and W.
  • the present invention may supply anti-static wrapper for electronic component wrapping in which the above DLC film being a buffer layer is added by metal film.
  • the present invention may supply anti-static wrapper for electronic component wrapping in which the above metal film is added by DLC film.
  • the present invention may supply anti-static wrapper for electronic component wrapping in which polymer film is coated by DLC film and metal film repeatedly, and the final coating is made by DLC, whose whole thickness ranges between 3 and 100 nm.
  • a step to insert polymer film into the reaction chamber a step to vacuumize inside the reaction chamber in 10-3 or 10-7 ton; and a step to deposit DLC film on the above polymer film.
  • the thickness of the deposited DLC film ranges between 1 and 40 nm; and the present invention may supply anti-static wrapper for electronic component wrapping in which DLC film is deposited on polymer film, whose resistance ranges between 106 and 1010 ⁇ /sq.
  • the present invention may supply anti-static wrapper for electronic component wrapping in which Roll-to-Roll device is used at a step of depositing the above DLC film, and DLC film is coated on both sides of the above polymer film wired in the roller of Roll-to-Roll device.
  • the present invention may supply anti-static wrapper for electronic component wrapping in which more than air among CH4, C2H2, C6H6, C4H10 is supplied to the magnetic enhanced ion gun at the stage of depositing the above DLC film, and to allow 1000 or 2500 Voltage power is supplied to the above ion gun.
  • the present invention may supply anti-static wrapper for electronic component wrapping in which another step to deposit metal film using sputter method is included after the step of depositing the above DLC film.
  • anti-static wrapper having almost permanent static dissipation of 103 or 1010 ⁇ /sq. conductivity can be manufactured, and this anti-static wrapper has a pollution resist to prevent any attachment of pollution thanks to the character of DLC film.
  • Roll-to-Roll device makes the production of wrapper efficiently in terms of both time and space, which may have competitive price.
  • FIG. 1 is a cross-sectional drawing of anti-static wrapper according to the proper example of the present invention.
  • FIG. 2 is a cross-sectional drawing of anti-static wrapper according to another proper example of the present invention.
  • FIG. 3 is an outline drawing of ion gun used to manufacture anti-static wrapper.
  • FIG. 4 is a Roll-to-Roll device drawing used to manufacture anti-static wrapper.
  • FIG. 5 is a cross-sectional drawing of anti-static wrapper with double side coating manufactured by Roll-to-Roll device.
  • DLC (Diamond like carbon) film has a similar mechanical and optical property with diamond, but has different structure in atomic arrangement. It has high hardness and durability of abrasion with chemical stability. In particular, it can be deposited on large area substrate within 5% uniformity of deposition. It also has low coefficient of friction with high lubrication and elasticity. Accordingly, when DLC film is deposited on polymer film, it becomes to have electric dissipation property as well as the advantageous properties of DLC.
  • anti-static wrapper as in the FIG. 1 can be made employing characteristics of DLC film.
  • DLC film ( 110 ) It enables to manufacture anti-static wrapper with the resistance of 103 or 1010 ⁇ /sq. or desirably with 106 or 1010 ⁇ /sq. by depositing DLC film ( 110 ) on polymer film ( 100 ).
  • the materials of DLC film ( 110 ) may have higher conductivity by doping more than one materials from Si, Cu, Al, Ti, W, Cr besides normal carbon compounds.
  • anti-static wrapper having both conductivity and electric dissipation can be made by depositing metal film ( 120 ) on DLC film ( 110 ) as being a buffer layer, and then depositing DLC film ( 11 ) on top of it (see the FIG. 2 ).
  • metal film ( 12 ) may be the final surface in case, it is recommended to finish with DLC film ( 11 ) for securing long-term adhesion.
  • the resistance of anti-static wrapper in FIG. 2 ranges between 103 and 1010 ⁇ /sq. It enhances static dissipation speed by metal film buffer layer ( 12 ), and adds adhesion of DLC film ( 11 ).
  • DLC film ( 110 ) it also can manufacture multi-layered wrapper by coating alternatively and repeatedly DLC film ( 110 ) and metal film ( 120 ). In such case, it is recommended to coat DLC film ( 110 ) just on polymer film ( 100 ) and to stack metal film ( 120 ) and DLC film ( 110 ) alternatively and repeatedly and finally coat DLC film ( 110 ) so that it may prevent peeling off metal film ( 120 ).
  • the thickness of whole layers ranges between 3 and 100 nm which is suitable in terms of preventing peeling off thin films and process time and cost.
  • both sides of polymer film ( 100 ) are deposited by DLC film ( 110 ), or deposited by DLC film ( 110 ), metal film ( 120 ) and DLC film ( 110 ).
  • the above polymer film ( 100 ) can be selected by one of Polyimide, Polyethylene, Polyethyleneterephthalate or Polypropylene. Although the thickness of DLC film ( 110 ) ranging between 1 and 50 nm is desirable for productivity and functionality, beyond that range is available.
  • FIG. 3 describes the structure of Magnetic enhanced ion gun (MEIG) according to a proper embodiment.
  • MEIG Magnetic enhanced ion gun
  • MEIG depositing device can meet the requirements to relatively low process temperature to prevent from thermal deformation of polymer film, and be suitable for large area uniform deposition and has also high productivity thanks to rapid depositing speed.
  • MEIG depositing device ( 200 ) can equip ion gun including gas feed means, power supply of ion gun and sputter device to control conductivity of wrapper by metal doping.
  • the above ion gun consists of Anode ( 210 ) and Cathode ( 22 ). Cathode creates a magnetic field.
  • the present embodiment used PI and PET film as polymer film ( 11 ).
  • the length of film is 100 m, with 5 to 100 ⁇ m thick, and the thickness of PET film was 125 ⁇ m.
  • PI and PET film was 125 ⁇ m.
  • PI or PET film used in this embodiment is a naturally electrostatic polymer film.
  • polymer film ( 100 ) is cleansed to remove dust using IPA (isopropyl alcohol) before depositing on DLC film ( 11 ). But, this process can be omitted.
  • the cleansed polymer film ( 100 ) is attached to metal panel and put in the reaction chamber and fitted in jig. The reaction chamber is vacuumized in 10-1 or 10-6 ton.
  • the polymer film needs not be attached to a metal panel because it uses Roll-to-Roll device described in details as follows.
  • a cleaning process is performed to remove surface pollutants and activate surface of polymer film ( 100 ) using more than one ion among argon ion (Ar+), oxygen ion or nitrogen ion to facilitate deposition of film.
  • the above cleaning process is subject to change according to insertion amount of polymer film ( 100 ) and a degree of pollution, but it normally performs for less than 1 minute by allowing 1000 and 2500 Volt through power supply.
  • more than one hydrocarbon gas from CH4, C2H2, C6H6, C4H10 is supplied to MEIG depositing device ( 200 ) to deposit DLC film ( 110 ) on polymer film ( 100 ), and carbon plasma is generated by applying 1000 to 2500 Volt to the above ion gun.
  • the applied voltage may be D.C. voltage or omitted, that is, although efficiency of depositing process increases due to the applying of the voltage, it is not always necessary, and therefore can be omitted to simplify the process.
  • DLC film ( 11 ) in forming DLC film ( 110 ), DLC film ( 11 ) can be formed by doped with mixing more than one from Si, Cu, Al, Ti, W, Cr beside hydrocarbon.
  • the doped DLC film has a better electrical conductivity compared with DLC film with hydrocarbon only.
  • Si silane (SiH4) can be introduced in gaseous phase and doped, and other metallic materials can be doped using sputter method.
  • the thickness of the above DLC film ( 110 ) is recommended 1 to 50 nm for its characteristic performance and productivity.
  • the resistance of anti-static wrapper manufactured through the above process ranges between 103 and 1010 ⁇ /sq. having electric dissipation.
  • metal film ( 12 ) shall be deposited using sputter source after depositing DLC film ( 110 ) on polymer film ( 100 ).
  • Either Cr, Ti, Cu, Al, or W can be used as a metal film, Si film can be formed, and the deposition shall be made in 1 nm ⁇ 5 nm thick because each metal has different conductivity.
  • the voltage and current capacity allowed to sputter source can be controlled to control resistance of anti-static wrapper. In this embodiment, the current capacity to sputter source was set in ranges between 0.1 and 5 A/cm2.
  • the process to deposit again DLC film ( 110 ) after depositing metal film ( 120 ) can be performed as in the step 4 ). Accordingly, such anti-static wrapper in FIG. 2 can be manufactured.
  • the existence of a buffer layer can increase electrostatic dissipating speed and prevent peeling off by strengthening adhesion between metal film ( 120 ) and DLC film ( 110 ).
  • the resistance of anti-static wrapper with a buffer layer ranges between 103 and 1010 ⁇ /sq. having electrostatic dissipation.
  • DLC film ( 110 ) and metal film ( 120 ) alternatively on polymer film ( 100 ) according to the depositing methods of DLC film ( 110 ) and metal film ( 120 ) aforesaid.
  • the MEIG depositing device ( 200 ) employs linear ion source. Since such MEIG does not need any thermoelectron unlikely any other ion source, there is no increase of device temperature during the process by ion gun or ion source. Accordingly, it is suitable to deposit DLC film into polymer materials vulnerable to heat.
  • high productive Roll-To-Roll device ( 300 ) can be used to produce anti-static wrapper of the present invention.
  • polymer film ( 100 ) is rolled on the 1st roller ( 310 ) and the 2nd roller ( 320 ) placed with interval each other in the reaction chamber.
  • DLC film ( 110 ), buffer layer of metal film ( 120 ) and/or DLC film ( 110 ) can be deposited while operating the above rollers by equipping a plurality of ion guns ( 330 ) and sputter sources ( 340 ).
  • supporting rollers can be placed in between the two rollers to keep strain polymer film ( 100 ) and to prevent drooping.
  • DLC film ( 110 ), or both sides of DLC film ( 110 ), metal film ( 120 ) and/or DLC film ( 110 ) can be deposited easily on both sides of polymer film ( 100 ).
  • Such Roll-to-Roll device has a price competitiveness as it reduces production cost of anti-static wrapper.
  • FIG. 5 describes a cross-sectional drawing of anti-static wrapper with depositing layers in both sides produced by Roll-to-Roll device.
  • the present invention is not limited to the above described embodiments and is available for a variety of variation and revision within the range of keeping the essentials of the invention by the inventor.

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  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Organic Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
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WO2016174033A1 (de) * 2015-04-30 2016-11-03 Von Ardenne Gmbh Verfahren und beschichtungsanordnung
CN106240105A (zh) * 2016-08-05 2016-12-21 广东正业科技股份有限公司 一种复合材料及其制备方法
WO2019105533A1 (en) * 2017-11-28 2019-06-06 Applied Materials, Inc. Deposition apparatus for coating a flexible substrate, method of coating a flexible substrate and flexible substrate having a coating
WO2019105534A1 (en) * 2017-11-28 2019-06-06 Applied Materials, Inc. Deposition apparatus, method of coating a flexible substrate and flexible substrate having a coating
CN115522162A (zh) * 2022-09-26 2022-12-27 苏州辉钻纳米新材料有限公司 高阶静电消散碳基多元复合薄膜材料及其制备方法
CN115612989A (zh) * 2022-09-27 2023-01-17 苏州辉钻纳米新材料有限公司 含硅含氧的高阶静电消散薄膜复合新材料及其制备方法

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KR101486627B1 (ko) * 2012-04-18 2015-02-23 (주)제이 앤 엘 테크 나노 박막을 코팅한 대전방지 기능을 갖는 시이트 및 그 제조방법
CN106810806A (zh) * 2016-12-23 2017-06-09 苏州缔绿电子科技有限公司 一种用于精密仪器的防静电包装材料及其制备方法
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WO2015074758A1 (en) * 2013-11-21 2015-05-28 Airbus Ds Gmbh Method for manufacturing a charge dissipative surface layer
EP2876649A1 (en) * 2013-11-21 2015-05-27 Astrium GmbH Method for manufacturing a charge dissipative surface layer
RU2655942C2 (ru) * 2013-11-21 2018-05-30 Эйрбас Дс Гмбх Способ изготовления рассеивающего заряд поверхностного слоя
US10763003B2 (en) 2013-11-21 2020-09-01 Airbus Ds Gmbh Method for manufacturing a charge dissipative surface layer
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WO2016174033A1 (de) * 2015-04-30 2016-11-03 Von Ardenne Gmbh Verfahren und beschichtungsanordnung
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CN106240105A (zh) * 2016-08-05 2016-12-21 广东正业科技股份有限公司 一种复合材料及其制备方法
CN110100041A (zh) * 2017-11-28 2019-08-06 应用材料公司 沉积设备、涂布柔性基板的方法、及具有涂层的柔性基板
WO2019105534A1 (en) * 2017-11-28 2019-06-06 Applied Materials, Inc. Deposition apparatus, method of coating a flexible substrate and flexible substrate having a coating
WO2019105533A1 (en) * 2017-11-28 2019-06-06 Applied Materials, Inc. Deposition apparatus for coating a flexible substrate, method of coating a flexible substrate and flexible substrate having a coating
CN115522162A (zh) * 2022-09-26 2022-12-27 苏州辉钻纳米新材料有限公司 高阶静电消散碳基多元复合薄膜材料及其制备方法
CN115612989A (zh) * 2022-09-27 2023-01-17 苏州辉钻纳米新材料有限公司 含硅含氧的高阶静电消散薄膜复合新材料及其制备方法

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CN104723625B (zh) 2017-08-11
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CN102390607A (zh) 2012-03-28
US20140305793A1 (en) 2014-10-16
CN102390607B (zh) 2015-03-25
KR101019065B1 (ko) 2011-03-07

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