US20110277491A1 - Heat dissipation system with a spray cooling device - Google Patents

Heat dissipation system with a spray cooling device Download PDF

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Publication number
US20110277491A1
US20110277491A1 US12/931,605 US93160511A US2011277491A1 US 20110277491 A1 US20110277491 A1 US 20110277491A1 US 93160511 A US93160511 A US 93160511A US 2011277491 A1 US2011277491 A1 US 2011277491A1
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US
United States
Prior art keywords
heat dissipation
dissipation system
chamber
housing
fluid
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
US12/931,605
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English (en)
Inventor
Ching-Ping Wu
Kai-An Cheng
Chun-Hsien Wu
Ju-Hong Lin
Chia-Chen Liao
Hsien Meng
Hsien-Chun Meng
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Microbase Technology Corp
MicroBase Tech Group
Original Assignee
MicroBase Tech Group
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by MicroBase Tech Group filed Critical MicroBase Tech Group
Assigned to MICROBASE TECHNOLOGY CORP. reassignment MICROBASE TECHNOLOGY CORP. ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: Cheng, Kai-An, LIAO, CHIA-CHEN, Lin, Ju-Hong, Meng, Hsien, Meng, Hsien-Chun, WU, CHING-PING, WU, CHUN-HSIEN
Publication of US20110277491A1 publication Critical patent/US20110277491A1/en
Abandoned legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
    • H01L23/433—Auxiliary members in containers characterised by their shape, e.g. pistons
    • H01L23/4336—Auxiliary members in containers characterised by their shape, e.g. pistons in combination with jet impingement
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F28D15/0266—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with separate evaporating and condensing chambers connected by at least one conduit; Loop-type heat pipes; with multiple or common evaporating or condensing chambers
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F28D15/04—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with tubes having a capillary structure
    • F28D15/046—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with tubes having a capillary structure characterised by the material or the construction of the capillary structure
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F9/00—Casings; Header boxes; Auxiliary supports for elements; Auxiliary members within casings
    • F28F9/02—Header boxes; End plates
    • F28F9/026—Header boxes; End plates with static flow control means, e.g. with means for uniformly distributing heat exchange media into conduits
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
    • H01L23/473—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing liquids
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Definitions

  • the invention relates to a heat dissipation system, and more particularly to a closed-loop heat dissipation system that employs a principle of a liquid-vapor phase change.
  • An ordinary active-type heat-dissipating system for electronic components such as a fan incorporated with fins, a fan incorporated with fins and heat-transmitting ducts, etc., usually faces a problem of insufficient unit area heat flux and hence cannot meet the requirement for dissipating heat generated by high-powered electronic components.
  • An object of the present invention is to provide a heat dissipation system with a simple construction and high heat dissipating efficiency.
  • Another object of this invention is to provide a cooling device that can efficiently spray a working fluid to assist vaporization.
  • a heat dissipation system for dissipating heat from a heat source includes a cooling device, a condenser, a vapor conveying duct and a cooling liquid conveying duct.
  • the cooling device includes a housing, and an orifice plate mounted in the housing.
  • the orifice plate divides an inner space of the housing into a liquid supply chamber and an evaporation chamber proximate to the heat source, and has a plurality of micro orifices each having a diameter ranging from 5 to 1000 micrometers.
  • the housing has a cooling liquid inlet communicated with the liquid supply chamber and adapted to permit a working fluid to flow into the liquid supply chamber, and a vapor outlet communicated with the evaporation chamber.
  • the condenser includes a fluid inlet, a condensing chamber and a fluid outlet.
  • the vapor conveying duct is connected to the vapor outlet of the housing and the fluid inlet of the condenser.
  • the cooling liquid conveying duct is connected to the cooling liquid inlet of the housing and the fluid outlet of the condenser.
  • the cooling device, the condenser, the vapor conveying duct and the cooling liquid conveying duct cooperate to form a closed circuit.
  • FIG. 1 is a block diagram illustrating the first preferred embodiment of a cooling system according to the present invention
  • FIG. 2 is an exploded perspective view of a cooling device of the first preferred embodiment
  • FIG. 3 is a schematic diagram illustrating a working fluid operating inside the cooling device of the first preferred embodiment
  • FIG. 4 is perspective view of an orifice plate of the first preferred embodiment
  • FIGS. 5 and 6 are schematic diagrams illustrating manufacturing processes of the orifice plate
  • FIG. 7 is a schematic diagram illustrating a condenser of the first preferred embodiment
  • FIGS. 8 and 9 are top views of the orifice plate used in the second preferred embodiment.
  • FIG. 10 is a schematic diagram illustrating the orifice plate that indents downward at its central part during operation
  • FIG. 11 is a schematic diagram illustrating the cooling system applied to an LED lamp device.
  • FIG. 12 is a schematic diagram illustrating the cooling system applied to a computer housing.
  • the cooling system includes a cooling device 1 , a condenser 2 , a vapor conveying duct 3 , a cooling liquid conveying duct 4 , a fluid driving module 5 and a power and control module 6 .
  • the cooling device 1 , the condenser 2 , the vapor conveying duct 3 and the cooling liquid conveying duct 4 cooperate to form a closed circuit.
  • the fluid driving module 5 has a pump 51 connected to the closed circuit for driving a working fluid, and a control valve 52 connected to the closed circuit for controlling the working fluid.
  • the working fluid is one of the Flourinert and Novec series products manufactured by 3M.
  • the working fluid may also include water, other liquids.
  • the pump 51 may be a piezoelectric thin film type, a gear type, or an electromagnetic type, and is compatible with the working fluid. If the pump 51 can be operated to control the liquid flow, then the control valve 52 can be dispensed with.
  • the cooling device 1 includes a housing 11 having a bottom side contacting the heat source 70 , an orifice plate 12 mounted in the housing 11 and a temperature sensing member 13 .
  • the orifice plate 12 divides an inner space of the housing 11 into an upper liquid supply chamber 102 and a lower evaporation chamber 103 .
  • the housing 11 has a cooling liquid inlet 101 communicated with the liquid supply chamber 102 and adapted to permit a working fluid to flow into the liquid supply chamber 102 , and a vapor outlet 104 communicated with the evaporation chamber 103 .
  • the housing 11 has an upper housing part 111 defining the liquid supply chamber 102 and a lower housing part 112 defining the evaporation chamber 103 and assembled to the upper housing part 111 .
  • the orifice plate 12 has a thickness ranging from 20 to 300 micrometers and is formed with a plurality of micro orifices 120 arranged in a matrix layout or in intersecting rows.
  • Each of the micro orifices 120 has a diameter ranging from 5 to 1000 micrometers.
  • the micro orifices 120 are spaced apart from each other by a distance that ranges from 5 to 2000 micrometers.
  • the micro orifices 120 have a diameter ranging from 10 to 200 micrometers, preferably, from 5 to 500 micrometers, to provide an improved spraying effect that assists heat dissipation.
  • a manufacturing method of making the orifice plate 12 includes the following steps:
  • a surface of a substrate body 80 is formed with a metal layer deposited (not shown in the Figure) by a technique, such as physical vapor deposition (abbreviated as PVD), or chemical vapor deposition (abbreviated as CVD).
  • a photoresist layer is formed by spin coating, or dip coating. The photoresist layer is exposed through a photomask by a photolithography technique, and is developed to remove the unexposed area of the photoresist layer and to thereby expose parts of the deposited metal layer to be removed. Thereafter, the exposed part of deposited metal layer uncovered by the photoresist layer is etched, and the remaining photoresist layer is removed.
  • the deposited metal layer 81 formed on the substrate body 80 is provided with a plurality of holes 810 , as shown in FIG. 5 , which are prefabricated holes for the micro orifices 120 of the orifice plate 12 .
  • the holes 810 are larger than the micro orifices 120 .
  • another metal layer 83 is formed on the surface of the deposit metal layer 81 by electro-forming in a mold (not shown). After the mold is removed, the metal layer 83 is separated from the substrate body 80 and the metal layer 81 , and the orifice plate 12 as shown in FIG. 4 is obtained.
  • the orifice plate 12 may also be made by other methods, such as electro-forming, laser processing, thermal pressure forming, injection molding, etc.
  • the orifice diameter of the micro orifices 120 of the orifice plate 12 can be adjusted by the using the aforementioned process.
  • Each of the micro orifices 120 includes a liquid intaking end 121 proximate to the liquid supply chamber 102 and a liquid ejecting end 122 proximate to the evaporation chamber 103 .
  • the orifice diameter of each of the micro orifices 120 tapers from the liquid intaking end 121 to the liquid ejecting end 122 .
  • the working fluid flows into the liquid supply chamber 102 through the cooling liquid inlet 101 , the working fluid is sprayed into the evaporation chamber 103 through the multiple micro orifices 120 .
  • the working fluid sprayed into the evaporation chamber 103 forms a thin sprayed layer on a bottom of the evaporation chamber 103 where the heat source 70 is disposed.
  • the sprayed layer absorbs heat generated by the heat source 70 and is vaporized. Bubbles 9 are easily formed on the heat source 70 due to vaporization of the working fluid.
  • the vapor from the heat source 70 exits from the housing 1 through the vapor outlet 104 .
  • the lower housing part 112 has an inner surface formed with microstructure, the surface area thereof is increased, improving the effects of evaporating the working fluid and absorbing heat from the heat source 70 .
  • the vapor inside the evaporation chamber 103 flows into the vapor conveying duct 3 through the vapor outlet 104 .
  • the vapor conveying duct 3 is made of a material compatible with the working fluid, such as a polymeric material, or stainless steel, and has an inner surface formed with microstructures in order to increase an overall heat transfer surface area and to facilitate condensation of the vapor inside the vapor conveying duct 3 .
  • the pump 51 the vapor pressure and the capillary action of the vapor conveying duct 3 , the vapor or the condensed liquid can be drawn into the condenser 2 .
  • the condenser 2 includes a chamber casing 21 and a plurality of fins 22 in spatial communication with the chamber casing 21 .
  • the fins 22 are hollow, and have interior spaces communicated with an interior of the chamber casing 21 to form a condensing chamber 202 .
  • the chamber casing 21 has a fluid inlet 201 in fluid communication with the condensing chamber 202 and a fluid outlet 203 .
  • the hollow fins 22 are used for the purpose of increasing heat exchange area and enhancing the effect of condensing the vapor.
  • the inner surfaces of the chamber casing 21 and the hollow fins 22 are formed with microstructures to increase the surface area and to enhance condensation effects.
  • the chamber casing 21 has an inclined bottom side, the fluid outlet 203 is formed at a lower position of the bottom side, and the fluid inlet 201 is arranged to be higher than the fluid outlet 203 .
  • the cooling liquid is permitted to easily flow into the cooling liquid conveying duct 4 .
  • the cooling liquid conveying duct 4 is connected to the cooling liquid inlet 101 of the cooling device 1 and the fluid outlet 203 of the condenser 2 .
  • this embodiment utilizes the power and control module 6 for supplying power and controlling the fluid driving module 5 .
  • the condenser 2 further includes a temperature sensing member 23 for sensing the temperature of the condensing chamber 202 and a pressure sensing member 24 for sensing the pressure of the condensing chamber 202 .
  • the power source and control module 6 is connected to the temperature sensing member 23 and the pressure sensing member 24 of the condenser 2 , and the temperature sensing member 13 of the cooling device 1 .
  • the sensed temperature and pressure are used as parameters for controlling the speed of the pump 51 , the size of the opening of the control valve 52 , and the switching frequency of the control valve 52 .
  • the pump 51 operates according to the control signals from the fluid driving module 5 .
  • the control valve 52 opens or closes according to the control signals.
  • the second preferred embodiment of this invention differs from the first preferred embodiment in that, the cooling device 1 further includes a plurality of liquid guiding plates 14 mounted on the inner surface of the upper housing part 111 .
  • the liquid guiding plates 14 have a center beneath the cooling liquid inlet 101 and extend radially.
  • the liquid guiding plates 14 extend concentrically.
  • the working fluid When the working fluid enters the housing 1 through the cooling liquid inlet 101 , the working fluid is guided by the liquid guiding plates 14 to flow in the guided directions. As shown in FIG. 10 , the orifice plate 12 indents downward slightly at its central part beneath the cooling liquid inlet 101 because the pressure of the working fluid is relatively high proximate to the cooling liquid inlet 101 . The working fluid flowing through the orifice plate 12 can be sprayed homogeneously into the evaporation chamber 103 .
  • the cooling system 100 of this invention can be mounted to an LED lamp device 71 as shown in FIG. 11 .
  • the cooling device 1 contacts the LED chip (functioning as the heat source 70 ) and absorbs heat therefrom through phase change.
  • the cooling system 100 of this invention can also be mounted inside a computer housing 72 as shown in FIG. 12 .
  • the cooling device 1 contacts the central processing unit (functioning as the heat source 70 ).
  • the condenser 2 is provided with a fan 25 adjacent to the fins 22 .

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Mechanical Engineering (AREA)
  • General Engineering & Computer Science (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Sustainable Development (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
US12/931,605 2010-02-12 2011-02-03 Heat dissipation system with a spray cooling device Abandoned US20110277491A1 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
TW099104710 2010-02-12
TW99104710A TW201128154A (en) 2010-02-12 2010-02-12 Cooling and heat-dissipation system, and cooling device thereof

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US20110277491A1 true US20110277491A1 (en) 2011-11-17

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EP (1) EP2360725A2 (zh)
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US20150334876A1 (en) * 2014-05-19 2015-11-19 Fujitsu Limited Evaporator, cooling device, and electronic device
US20160120019A1 (en) * 2014-10-27 2016-04-28 Ebullient, Llc Circuit board assembly adapted for fluid cooling
US20160128238A1 (en) * 2014-10-27 2016-05-05 Ebullient, Llc Hot-swappable server with cooling line assembly
WO2016069259A1 (en) * 2014-10-27 2016-05-06 Ebullient, Llc Heat sink module
US20160141062A1 (en) * 2014-11-19 2016-05-19 General Electric Company Target body for an isotope production system and method of using the same
US20170105313A1 (en) * 2015-10-10 2017-04-13 Ebullient, Llc Multi-chamber heat sink module
US9832913B2 (en) 2011-06-27 2017-11-28 Ebullient, Inc. Method of operating a cooling apparatus to provide stable two-phase flow
US9848509B2 (en) 2011-06-27 2017-12-19 Ebullient, Inc. Heat sink module
US9854714B2 (en) 2011-06-27 2017-12-26 Ebullient, Inc. Method of absorbing sensible and latent heat with series-connected heat sinks
US9852963B2 (en) 2014-10-27 2017-12-26 Ebullient, Inc. Microprocessor assembly adapted for fluid cooling
US9854715B2 (en) 2011-06-27 2017-12-26 Ebullient, Inc. Flexible two-phase cooling system
US9891002B2 (en) 2014-10-27 2018-02-13 Ebullient, Llc Heat exchanger with interconnected fluid transfer members
US9901013B2 (en) 2011-06-27 2018-02-20 Ebullient, Inc. Method of cooling series-connected heat sink modules
US9901008B2 (en) 2014-10-27 2018-02-20 Ebullient, Inc. Redundant heat sink module
US10184699B2 (en) 2014-10-27 2019-01-22 Ebullient, Inc. Fluid distribution unit for two-phase cooling system
US10239085B2 (en) 2015-10-30 2019-03-26 Johnson & Johnson Consumer Inc. Aseptic aerosol misting device
US10264706B2 (en) * 2017-08-31 2019-04-16 Man Zai Industrial Co., Ltd. Phase change evaporator with heat-dissipating fins and phase change cooling device using the same
US10271458B2 (en) * 2015-03-25 2019-04-23 Mitsubishi Electric Corporation Cooling device, power conversion device, and cooling system
WO2020041749A1 (en) * 2018-08-24 2020-02-27 Washington University Methods and systems for evaporation of liquid from droplet confined on hollow pillar
CN111954445A (zh) * 2020-08-14 2020-11-17 上海交通大学 一种肋柱式高效相变冷却装置及其冷却方法
US10943850B2 (en) 2018-08-10 2021-03-09 Frore Systems Inc. Piezoelectric MEMS-based active cooling for heat dissipation in compute devices
US11191184B2 (en) * 2019-04-14 2021-11-30 Jetcool Technologies Inc. Direct contact fluid based cooling module
US11253885B2 (en) 2015-10-30 2022-02-22 Johnson & Johnson Consumer Inc. Aseptic aerosol misting device
US11432433B2 (en) 2019-12-06 2022-08-30 Frore Systems Inc. Centrally anchored MEMS-based active cooling systems
US11503742B2 (en) 2019-12-06 2022-11-15 Frore Systems Inc. Engineered actuators usable in MEMS active cooling devices
US11571704B2 (en) 2015-10-30 2023-02-07 Johnson & Johnson Consumer Inc. Aseptic aerosol misting device
US20230045752A1 (en) * 2021-08-05 2023-02-09 Nan Chen System for Modular Liquid Spray Cooling of Electronic Devices
US11583885B2 (en) 2015-10-30 2023-02-21 Johnson & Johnson Consumer Inc. Unit dose aseptic aerosol misting device
CN116017950A (zh) * 2023-01-09 2023-04-25 深圳市深汕特别合作区虹菱电器有限公司 一种led面板会议机
US11765863B2 (en) 2020-10-02 2023-09-19 Frore Systems Inc. Active heat sink
US11796262B2 (en) 2019-12-06 2023-10-24 Frore Systems Inc. Top chamber cavities for center-pinned actuators
US11802554B2 (en) 2019-10-30 2023-10-31 Frore Systems Inc. MEMS-based airflow system having a vibrating fan element arrangement
US11906218B2 (en) 2014-10-27 2024-02-20 Ebullient, Inc. Redundant heat sink module
US11963341B2 (en) 2020-09-15 2024-04-16 Jetcool Technologies Inc. High temperature electronic device thermal management system
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