US20110265975A1 - Mounting base - Google Patents

Mounting base Download PDF

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Publication number
US20110265975A1
US20110265975A1 US13/094,188 US201113094188A US2011265975A1 US 20110265975 A1 US20110265975 A1 US 20110265975A1 US 201113094188 A US201113094188 A US 201113094188A US 2011265975 A1 US2011265975 A1 US 2011265975A1
Authority
US
United States
Prior art keywords
mounting base
channels
fluid
condenser
evaporator
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
US13/094,188
Other languages
English (en)
Inventor
Timo Koivuluoma
Risto Laurila
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
ABB Oy
Original Assignee
ABB Oy
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by ABB Oy filed Critical ABB Oy
Assigned to ABB OY reassignment ABB OY ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: KOIVULUOMA, TIMO, LAURILA, RISTO
Publication of US20110265975A1 publication Critical patent/US20110265975A1/en
Abandoned legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
    • H01L23/427—Cooling by change of state, e.g. use of heat pipes
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F28D15/0233—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes the conduits having a particular shape, e.g. non-circular cross-section, annular
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F28D15/0266—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with separate evaporating and condensing chambers connected by at least one conduit; Loop-type heat pipes; with multiple or common evaporating or condensing chambers
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F28D15/0275—Arrangements for coupling heat-pipes together or with other structures, e.g. with base blocks; Heat pipe cores
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F9/00—Casings; Header boxes; Auxiliary supports for elements; Auxiliary members within casings
    • F28F9/26—Arrangements for connecting different sections of heat-exchange elements, e.g. of radiators
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Definitions

  • This disclosure relates to a mounting base for an electric component, for example, a mounting base which can conduct heat away from an electric component.
  • an electric component is attached to a first surface of a mounting base.
  • a second surface of the mounting base is cooled. In this way heat generated by the electric component can be dissipated via the mounting base.
  • the heat load may not be evenly distributed over the mounting base. Therefore different parts of the base can have different temperatures.
  • the entire dissipation capacity of the second surface may not be efficiently utilized because of an uneven heat distribution.
  • U.S. Patent Application Publication No. 2003/0155102 A1 discloses a mounting base with a thermosyphon or a planar heat pipe which is used for distributing heat in various directions.
  • a chamber is provided where a fluid can boil and condense.
  • the pressure inside the chamber can increase to an extent than the mounting base bulges. In that case an electric component attached to the mounting base may be bent to an extent where damage occurs to the component.
  • a mounting base for an electric component including a first surface for receiving the electric component and for receiving a heat load generated by the electric component, a second surface for dissipating heat from the mounting base and evaporator channels arranged in the vicinity of the first surface for transferring the received heat load to a fluid in the evaporator channels, condenser channels in the vicinity of the second surface for transferring heat from the fluid in the condenser channels to the second surface, a first connecting part for passing the fluid from the condenser channels to the evaporator channels and a second connecting part for passing the fluid from the evaporator channels to the condenser channels.
  • FIGS. 1 to 3 illustrate a first exemplary embodiment of a mounting base
  • FIG. 4 illustrates a second exemplary embodiment of a mounting base
  • FIG. 5 illustrates an exemplary fluid distribution in a mounting base.
  • evaporator channels and condenser channels can be arranged in the mounting base to make it possible to utilize a fluid in the mounting base for receiving and passing on a heat load generated by an electric component. In this way heat can be efficiently distributed due to the fluid. Therefore, the dissipation capacity of the second surface of the mounting base can be utilized efficiently.
  • FIGS. 1 to 3 illustrate a first exemplary embodiment of a mounting base 1 .
  • FIG. 1 is a side view of the mounting base 1
  • FIGS. 2 and 3 are partial cross sections of the mounting base.
  • the illustrated mounting base can be utilized with significant fluid pressures without any bulging that can damage components attached to the mounting base.
  • the mounting base 1 includes a first surface 2 for receiving one or more electric components 3 that generate a heat load during use.
  • the mounting base 1 can be utilized for efficiently cooling a plurality of electric components that can be freely distributed over the first surface 2 .
  • the electric component or electric components may be a power semiconductor.
  • the generated heat load can be received by the mounting base 1 via the first surface 2 .
  • the heat load received by the mounting base 1 can be dissipated from the mounting base via a second surface 4 of the mounting base 1 .
  • this second surface 4 can be provided by an apparatus or shaped in a way which enhances the dissipation.
  • the second surface includes a heat sink 5 for dissipating heat into the ambient surroundings.
  • a fin structure capable of dissipating heat into the ambient surroundings, may be utilized.
  • the heat sink 5 can additionally include a plurality of fins which pass on heat into the surrounding air.
  • a fan may be utilized in order to generate an airflow 6 between the fins, as illustrated by way of example.
  • the direction of the airflow can be as illustrated, or in any suitable direction.
  • the mounting base can, for example, include evaporator channels 7 , condenser channels 8 , a first connecting part 9 and a second connecting part 10 in order to circulate fluid in the mounting base 1 .
  • the evaporator channels 7 can be arranged in the vicinity of the first surface 2 to receive the heat load from the electric component 3 via the first surface 2 , and to pass the heat load into the fluid in the evaporator channels 7 .
  • the second connecting part 10 shown in the upper end of the mounting base 1 in the example of FIGS. 1 and 2 , can receive the fluid from the evaporator channels 7 and pass the fluid on into the condenser channels 8 .
  • the condenser channels 8 can be arranged in the vicinity of the second surface 4 in order to transfer heat from the fluid in the condenser channels to the second surface 4 .
  • the first connecting part 9 shown in the lower end of the mounting base 1 in the example of FIGS. 1 and 2 , can receive the fluid from the condenser channels 8 and pass the fluid on into the evaporator channels 9 .
  • the mounting base is utilized in a position where the second connecting part 10 is located higher than the first connecting part 9 , and the circulation of the fluid will take place due to gravity and condensation/evaporation of the fluid. See EP 2 031 332 A1 and EP 2 119 993 A1, for example. No pump is therefore needed in order to circulate the fluid.
  • the evaporation in the evaporator channels 7 can cause an upward movement of the fluid in the evaporator channels 7 , and gravity can cause a downward movement of the fluid in the condenser channels 8 .
  • Such a circulation can be achieved at least as long as the first connecting part 9 is not located above the level of the second connecting part 10 .
  • first and second connecting parts 9 and 10 can be designed to pass on fluid from any evaporator channel to any condenser channel and vice versa. Fluid from different evaporator channels and different condenser channels may also be permitted to be mixed up with each other in the first and the second connecting parts before they are passed on.
  • the evaporator channels 7 and the condenser channels 8 can be grouped together into at least a first group 11 and a second group 12 , though the number of groups is sixteen in the illustrated example.
  • Each group can include at least one evaporator channel and at least one condenser channel.
  • Such a structure can be accomplished by extruding the mounting base 4 of an aluminum alloy, for example, in which case the mounting base can include a single block having the evaporator channels and the condenser channels formed in it already after the extrusion phase.
  • the mounting base 1 includes two plates 13 and 14 .
  • the first plate can be manufactured with grooves, into which pipes can be fitted.
  • the pipes can include longitudinal internal walls that separate the evaporator channels and the condenser channels from each other.
  • the second plate 14 can be attached to the first plate 13 to form the mounting base 1 .
  • the first and second plate 13 and 14 , the fins of the heat sink 5 and the pipes may be attached to each other by providing for example, a solder on the surfaces of these parts that come into contact with each other. In this way, after the parts have been arranged to contact each other in the illustrated positions, the solder can be melted in an oven, in which case the solder melts and subsequently, when cooled, attaches the parts to each other.
  • some of the evaporator channels of FIG. 3 can be omitted.
  • the material thickness of the mounting base is bigger at these locations, which makes it possible to use these locations for attaching said screws, for example.
  • the solid base material at these attachment locations can conduct heat for short distances, and therefore such attachment locations can be arranged in different parts of the mounting base in advance (before knowing exactly the components and the sizes of the components that will be attached to this particularly mounting base), while only those attachment locations that are actually needed are subsequently used by providing attachment holes into them, for example. Consequently the attachment of components to the mounting base can be very simple and flexible.
  • FIG. 4 illustrates a second exemplary embodiment of a mounting base 1 ′.
  • the embodiment of FIG. 4 is similar to the one explained in connection with FIGS. 1 to 3 . Therefore, the embodiment of FIG. 4 will be explained also by pointing out the differences between these embodiments.
  • FIG. 4 several subsequent pipe structures 15 ′ can be utilized.
  • the first and second connecting parts 9 ′ and 10 ′ can be designed to pass on fluid between these different pipe structures.
  • a heat sink can be provided on the second surface 4 ′ of the mounting base 1 ′ for dissipating heat.
  • FIG. 5 illustrates fluid distribution in a mounting base, such as the one illustrated in FIGS. 1 to 3 .
  • a mounting base such as the one illustrated in FIGS. 1 to 3 .
  • the electric component 3 the first connecting part 9 and the second connecting part 10 are shown.
  • the evaporator channels and the condenser channels are located on top of each other.
  • FIG. 5 illustrates a situation where the first and second connecting parts 9 and 10 have a structure that allows fluid from different evaporator channels, and correspondingly, different condenser channels, to mix up with each other and to be passed on via any one of the condenser channels, and correspondingly, evaporator channels. It can be seen that as the fluid also circulates sideways, the cooling capacity of the entire second surface can be utilized efficiently. In this way the dimensions of the mounting base can be increased both longitudinally and transversally. The spaces between the channels may be dimensioned in such a way that electric or other components can be attached by screws, for instance, in the spaces between the channels.
  • fluid has been used generally to indicate any medium suitable for use in the described mounting base.
  • the fluid may be a liquid or a gas, and in many implementations, the fluid can be in liquid state in certain parts of the mounting base while it can be in a gas state in other parts of the mounting base.

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Engineering & Computer Science (AREA)
  • Thermal Sciences (AREA)
  • Mechanical Engineering (AREA)
  • Sustainable Development (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
US13/094,188 2010-04-29 2011-04-26 Mounting base Abandoned US20110265975A1 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
EP10161436.0 2010-04-29
EP10161436A EP2383779B1 (en) 2010-04-29 2010-04-29 Mounting base

Publications (1)

Publication Number Publication Date
US20110265975A1 true US20110265975A1 (en) 2011-11-03

Family

ID=42651162

Family Applications (1)

Application Number Title Priority Date Filing Date
US13/094,188 Abandoned US20110265975A1 (en) 2010-04-29 2011-04-26 Mounting base

Country Status (3)

Country Link
US (1) US20110265975A1 (zh)
EP (1) EP2383779B1 (zh)
CN (1) CN102237322A (zh)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9097467B2 (en) 2012-03-28 2015-08-04 Abb Research Ltd Heat exchanger for traction converters
US20160201993A1 (en) * 2015-01-09 2016-07-14 Abb Technology Oy Cooling apparatus
US20180038653A1 (en) * 2015-04-21 2018-02-08 Aavid Thermalloy, Llc Thermosiphon with multiport tube and flow arrangement
US20180231326A1 (en) * 2017-02-16 2018-08-16 J R Thermal LLC Serial thermosyphon

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB2489401B (en) * 2011-03-21 2014-04-23 Naked Energy Ltd Solar energy converter
EP2811251A1 (en) * 2013-06-04 2014-12-10 ABB Research Ltd. Cooling apparatus
JP6665604B2 (ja) * 2016-03-15 2020-03-13 富士電機株式会社 半導体モジュールおよび半導体モジュールの製造方法

Citations (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4917173A (en) * 1988-11-15 1990-04-17 The United States Of America As Represented By The National Aeronautics And Space Administration Monogroove liquid heat exchanger
US20030127215A1 (en) * 1999-06-08 2003-07-10 Thermotek, Inc. Cooling apparatus having low profile extrusion and method of manufacture therefor
US20060243427A1 (en) * 2005-04-28 2006-11-02 Hitachi Cable, Ltd. Heat pipe heat sink and method for fabricating the same
US20080092587A1 (en) * 2005-02-02 2008-04-24 Carrier Corporation Heat Exchanger with Fluid Expansion in Header
US20090056916A1 (en) * 2007-08-27 2009-03-05 Abb Research Ltd Heat exchanger
US7520316B2 (en) * 2005-10-05 2009-04-21 Fu Zhun Precision Industry (Shen Zhen) Co., Ltd. Heat sink with heat pipes
US7621316B2 (en) * 2003-09-12 2009-11-24 The Furukawa Electric Co., Ltd. Heat sink with heat pipes and method for manufacturing the same
US7650928B2 (en) * 2007-03-30 2010-01-26 Coolit Systems Inc. High performance compact thermosiphon with integrated boiler plate
US8002021B1 (en) * 2008-02-04 2011-08-23 Advanced Cooling Technologies, Inc. Heat exchanger with internal heat pipe

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US3143592A (en) * 1961-11-14 1964-08-04 Inland Electronics Products Co Heat dissipating mounting structure for semiconductor devices
US6483705B2 (en) * 2001-03-19 2002-11-19 Harris Corporation Electronic module including a cooling substrate and related methods
US20030155102A1 (en) 2002-02-15 2003-08-21 Garner Scott D. Vapor chamber having integral captive fasteners
JP4032954B2 (ja) * 2002-07-05 2008-01-16 ソニー株式会社 冷却装置、電子機器装置、音響装置及び冷却装置の製造方法
JP2004190976A (ja) * 2002-12-12 2004-07-08 Sony Corp 熱輸送装置及び電子デバイス
CN2681342Y (zh) * 2003-12-19 2005-02-23 鸿富锦精密工业（深圳）有限公司 热管散热装置
DE102004023037B4 (de) * 2004-05-06 2008-08-21 Liu I-Ming Kühlkörper mit integrierter Heatpipe
CN2736925Y (zh) * 2004-09-15 2005-10-26 鸿富锦精密工业（深圳）有限公司 散热装置
US7650932B2 (en) * 2006-01-30 2010-01-26 Jaffe Limited Loop heat pipe
JP2007266153A (ja) * 2006-03-28 2007-10-11 Sony Corp プレート型熱輸送装置及び電子機器
CN101312633A (zh) * 2007-05-25 2008-11-26 富准精密工业(深圳)有限公司 散热装置
EP2119993A1 (en) 2008-05-14 2009-11-18 ABB Research Ltd. Two-phase cooling circuit

Patent Citations (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4917173A (en) * 1988-11-15 1990-04-17 The United States Of America As Represented By The National Aeronautics And Space Administration Monogroove liquid heat exchanger
US20030127215A1 (en) * 1999-06-08 2003-07-10 Thermotek, Inc. Cooling apparatus having low profile extrusion and method of manufacture therefor
US7621316B2 (en) * 2003-09-12 2009-11-24 The Furukawa Electric Co., Ltd. Heat sink with heat pipes and method for manufacturing the same
US20080092587A1 (en) * 2005-02-02 2008-04-24 Carrier Corporation Heat Exchanger with Fluid Expansion in Header
US20060243427A1 (en) * 2005-04-28 2006-11-02 Hitachi Cable, Ltd. Heat pipe heat sink and method for fabricating the same
US7520316B2 (en) * 2005-10-05 2009-04-21 Fu Zhun Precision Industry (Shen Zhen) Co., Ltd. Heat sink with heat pipes
US7650928B2 (en) * 2007-03-30 2010-01-26 Coolit Systems Inc. High performance compact thermosiphon with integrated boiler plate
US20090056916A1 (en) * 2007-08-27 2009-03-05 Abb Research Ltd Heat exchanger
US8002021B1 (en) * 2008-02-04 2011-08-23 Advanced Cooling Technologies, Inc. Heat exchanger with internal heat pipe

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9097467B2 (en) 2012-03-28 2015-08-04 Abb Research Ltd Heat exchanger for traction converters
US20160201993A1 (en) * 2015-01-09 2016-07-14 Abb Technology Oy Cooling apparatus
US20180038653A1 (en) * 2015-04-21 2018-02-08 Aavid Thermalloy, Llc Thermosiphon with multiport tube and flow arrangement
US10989483B2 (en) * 2015-04-21 2021-04-27 Aavid Thermalloy, Llc Thermosiphon with multiport tube and flow arrangement
US20180231326A1 (en) * 2017-02-16 2018-08-16 J R Thermal LLC Serial thermosyphon
US10859318B2 (en) * 2017-02-16 2020-12-08 J R Thermal, LLC Serial thermosyphon

Also Published As

Publication number Publication date
EP2383779B1 (en) 2012-09-12
CN102237322A (zh) 2011-11-09
EP2383779A1 (en) 2011-11-02

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Legal Events

Date Code Title Description
AS Assignment

Owner name: ABB OY, FINLAND

Free format text: ASSIGNMENT OF ASSIGNORS INTEREST;ASSIGNORS:KOIVULUOMA, TIMO;LAURILA, RISTO;REEL/FRAME:026280/0838

Effective date: 20110428

STCB Information on status: application discontinuation

Free format text: ABANDONED -- FAILURE TO RESPOND TO AN OFFICE ACTION