US20080190587A1 - Heat-dissipating module - Google Patents

Heat-dissipating module Download PDF

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Publication number
US20080190587A1
US20080190587A1 US11/840,176 US84017607A US2008190587A1 US 20080190587 A1 US20080190587 A1 US 20080190587A1 US 84017607 A US84017607 A US 84017607A US 2008190587 A1 US2008190587 A1 US 2008190587A1
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United States
Prior art keywords
heat
pipe
board
dissipating module
type
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
US11/840,176
Inventor
Chang-Liang Lin
Chi-Lung Lee
Hui-Yuan Liang
Jiu-Yan Yan
Original Assignee
Chang-Liang Lin
Chi-Lung Lee
Hui-Yuan Liang
Jiu-Yan Yan
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority to TW096202713 priority Critical
Priority to TW96202713U priority patent/TWM317745U/en
Application filed by Chang-Liang Lin, Chi-Lung Lee, Hui-Yuan Liang, Jiu-Yan Yan filed Critical Chang-Liang Lin
Publication of US20080190587A1 publication Critical patent/US20080190587A1/en
Abandoned legal-status Critical Current

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    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28HEAT EXCHANGE IN GENERAL
    • F28FDETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F1/00Tubular elements; Assemblies of tubular elements
    • F28F1/10Tubular elements and assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with projections, with recesses
    • F28F1/12Tubular elements and assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with projections, with recesses the means being only outside the tubular element
    • F28F1/24Tubular elements and assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with projections, with recesses the means being only outside the tubular element and extending transversely
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28HEAT EXCHANGE IN GENERAL
    • F28DHEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F28D15/0233Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes the conduits having a particular shape, e.g. non-circular cross-section, annular
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28HEAT EXCHANGE IN GENERAL
    • F28DHEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F28D15/0266Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with separate evaporating and condensing chambers connected by at least one conduit; Loop-type heat pipes; with multiple or common evaporating or condensing chambers
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28HEAT EXCHANGE IN GENERAL
    • F28DHEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F28D15/0275Arrangements for coupling heat-pipes together or with other structures, e.g. with base blocks; Heat pipe cores
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28HEAT EXCHANGE IN GENERAL
    • F28FDETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F1/00Tubular elements; Assemblies of tubular elements
    • F28F1/02Tubular elements of cross-section which is non-circular
    • F28F1/022Tubular elements of cross-section which is non-circular with multiple channels
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28HEAT EXCHANGE IN GENERAL
    • F28FDETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F3/00Plate-like or laminated elements; Assemblies of plate-like or laminated elements
    • F28F3/12Elements constructed in the shape of a hollow panel, e.g. with channels
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L23/00Details of semiconductor or other solid state devices
    • H01L23/34Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/42Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
    • H01L23/427Cooling by change of state, e.g. use of heat pipes
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001Technical content checked by a classifier
    • H01L2924/0002Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Abstract

A heat-dissipating module including a board-type heat-pipe and a heat-conductive construction connected therewith. The heat-conductive construction has a connecting end in contact with the board-type heat-pipe. Via the connecting end, the heat-conductive construction is connected to a predetermined section of the board-type heat-pipe. The other section of the heat-conductive construction forms an open end. The board-type heat-pipe is composed of multiple independent heat-pipe units not communicating with each other. The heat generated by a heat-generating element can be quickly and uniformly transferred through the heat-pipe units to the heat-conductive construction for dissipating the heat at high efficiency.

Description

    BACKGROUND OF THE INVENTION
  • The present invention is related to a heat-dissipating module, and more particularly to a heat-dissipating module including a board-type heat-pipe and a heat-conductive construction connected therewith. The board-type heat-pipe is composed of multiple independent heat-pipe units not communicating with each other for dissipating the heat at high efficiency.
  • There are various electric or electronic products which will generate heat when operating, such as refrigerators, air-conditioners, large-size electronic signs, high-speed electronic elements, etc. In general, a heat-radiating module is arranged for dissipating the heat so as to stabilize the operation of the device. An auxiliary unit with good heat-conductivity is often disposed on the heat-generating element, such as copper plates, aluminum boards, heat-pipes, etc. The heat-radiating module is attached to the surface of the heat-generating element. By means of convection, the heat is transferred to the heat-radiating module and dissipated from the other end of the heat-radiating module distal from the heat-generating element.
  • In the case that the heat-radiating module is a heat-pipe structure, the heat-pipe is positioned at front end of the heat-radiating module. The heat is transferred from the heat-generating element to the heat-conductive material disposed in the heat-pipe. After absorbed by the heat-conductive material, the heat is transferred to a heat-dissipating end of the heat-radiating module. FIG. 1 shows the heat-dissipating end of the heat-radiating module. A heat-conductive construction 20 is arranged at the heat-dissipating end. The heat-conductive construction 20 has a connecting end 21 connected to the surface of the heat-pipe 30. The other sections of the heat-conductive construction 20 serve as a heat-dissipating end 22. In such conventional structure, the heat-conductive construction 20 includes multiple heat-radiating plates continuously arranged along the surface of the heat-pipe 30 in parallel to each other. As shown in FIG. 2, the heat-pipe has a circular cross-section. The heat is radially transferred from the connecting sections 21 of the heat-conductive construction 20 to the open end 22 of the heat-conductive construction 20.
  • FIG. 3 shows another type of heat-radiating structure. The heat-conductive element 20 is a metal block structure with channels 23. The metal block is disposed on a winding heat-pipe 30. Referring to FIG. 4, the heat-conductive element 20 has a connecting section 21 in contact with the heat-pipe 30. Similarly, the heat is radially transferred to the open end 22 of the heat-conductive element 20. The heat-pipe 30 simply linearly contacts the heat-conductive element 20. In order to achieve better heat-dissipating effect, it is necessary to enlarge the area of the heat-conductive element 20. However, under such circumstance, the heat-conductive element 20 can still hardly provide good heat-dissipating effect.
  • It can be seen from FIGS. 2 and 4 that the heat is not uniformly transferred and spread by the heat-conductive construction 20. The heat is more likely radially transferred in accordance with the circular profile of the heat-pipe 30. Accordingly, the sections distal from the connecting end 21, for example, the four corners of the heat-conductive construction 20, can hardly effectively dissipate the heat. This is because during the transfer, most of the heat is concentrated on those sections close to the heat-pipe 30. The sections distal from the heat-pipe can only absorb and dissipate little heat.
  • SUMMARY OF THE INVENTION
  • It is therefore a primary object of the present invention to provide an improved heat-dissipating module which is able to more effectively dissipate the heat generated by a heat-generating unit at high efficiency so as to keep the unit working at efficiency.
  • According to the above objects, the heat-dissipating module of the present invention includes a board-type heat-pipe and a heat-conductive construction connected therewith. The board-type heat-pipe is partially disposed on a heat-generating element for dissipating the heat. The heat-conductive construction has a connecting end in contact with the board-type heat-pipe. Via the connecting end, the heat-conductive construction is connected to a predetermined section of the board-type heat-pipe. The other section of the heat-conductive construction forms an open end. The board-type heat-pipe is composed of multiple independent heat-pipe units not communicating with each other. The heat generated by a heat-generating element can be quickly and uniformly transferred through the heat-pipe units to the heat-conductive construction for dissipating the heat at high efficiency.
  • The present invention can be best understood through the following description and accompanying drawings wherein:
  • BRIEF DESCRIPTION OF THE DRAWINGS
  • FIG. 1 is a perspective view of a conventional heat-dissipating module;
  • FIG. 2 is a sectional view according to FIG. 1;
  • FIG. 3 is a perspective view of another conventional heat-dissipating module;
  • FIG. 4 is a sectional view according to FIG. 3;
  • FIG. 5 is a perspective view of the heat-dissipating module of the present invention;
  • FIG. 6 is a sectional view according to FIG. 5;
  • FIG. 7 is a perspective view of another embodiment of the heat-dissipating module of the present invention;
  • FIG. 8 is a sectional view according to FIG. 7; and
  • FIG. 9 is a perspective view showing the heat-dissipating path of the present invention.
  • DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS
  • Please refer to FIG. 5. The present invention includes a board-type heat-pipe 10 and a heat-conductive construction 20. The board-type heat-pipe 10 is partially disposed on a heat-generating element 40 (as shown in FIG. 9) for dissipating the heat generated by the heat-generating element 40. The heat-conductive construction 20 has a connecting end 21 for contacting or connecting with the board-type heat-pipe 10. Via the connecting end 21, the heat-conductive construction 20 is connected to a predetermined section of the board-type heat-pipe 10. The other section of the heat-conductive construction 20 forms an open end 22. In this embodiment, the heat-conductive construction 20 includes multiple heat-conductive plates arranged around the board-type heat-pipe 10. The board-type heat-pipe 10 is composed of multiple independent heat-pipe units 11 not communicating with each other. Accordingly, the board-type heat-pipe 10 can quickly and uniformly transfer the heat for heat exchange so as to enhance the heat-dissipating efficiency of the heat-radiating module.
  • Referring to FIG. 6, the multiple heat-pipe units 11 of the board-type heat-pipe 10 are arranged side by side without communicating with each other. In practice, phase-changeable material is contained in the different heat-pipe units 11, for example, pure water, coolant, organic solvent or a composition thereof. This can greatly enhance the heat-dissipating efficiency to several times of the heat-dissipating efficiency of the conventional uni-heat pipe structure. In addition, in this embodiment, the heat is uniformly transferred and spread to the open end 22 of the heat-conductive construction 20 as shown in FIG. 6. The heat-dissipating areas of all the open ends 22 of the heat-conductive construction 20 serve to dissipate the heat at high efficiency.
  • FIGS. 7 and 8 show another embodiment of the present invention, in which the board-type heat-pipe 10 is equipped with a heat-conductive construction 20 as a metal block. The metal block is formed with multiple channels 23. The connecting end 21 of the heat-conductive construction 20 connects with the surface of the board-type heat-pipe 10 by large area. In contrast to the conventional structure, such structure has larger heat-transferring area. Besides, the connecting section 21 contacts the board-type heat-pipe 10 by large area so that the heat in the board-type heat-pipe 10 can be quickly and uniformly transferred to the open end 22 of the heat-conductive construction 20 to quickly dissipate the heat as shown in FIG. 8.
  • Please refer to FIG. 9. One end of the board-type heat-pipe 10 is partially attached to a heat-generating element 40 such as an operating CUP. The end of the board-type heat-pipe 10 is directly or indirectly (via a heat-dissipating plate or a thermoelectric couple) attached to the heat-generating element 40. Under such circumstance, the heat can be quickly transferred through the heat-pipe units 11 to the heat-conductive construction 20 in a direction of the arrows. Even if the board-type heat-pipe 10 is damaged by external force, only one single or few heat-pipe units 11 will be affected. The other heat-pipe units 11 can still work to dissipate the heat and keep the device normally operating. Accordingly, a serviceman will have longer time to repair the board-type heat-pipe 10 so as to ensure that the operation of the device will not be affected.
  • In conclusion, the heat-dissipating module of the present invention is able to quickly dissipate the heat generated by a heat-generating element. The board-type heat-pipe 10 composed of multiple independent heat-pipe units 11 tightly contacts the heat-conductive construction 20 by large area to quickly transfer the heat so as to enhance the heat-dissipating efficiency. Moreover, the heat-dissipating module of the present invention is applicable to various fields such as minitype chip module and thinned electronic sign.
  • The above embodiments are only used to illustrate the present invention, not intended to limit the scope thereof. Many modifications of the above embodiments can be made without departing from the spirit of the present invention.

Claims (30)

1. A heat-dissipating module comprising a board-type heat-pipe and a heat-conductive construction connected therewith, the heat-conductive construction having a connecting end in contact with the board-type heat-pipe, via the connecting end, the heat-conductive construction being disposed on a predetermined section of the board-type heat-pipe, the other section of the heat-conductive construction forming an open end, the board-type heat-pipe being composed of multiple independent heat-pipe units not communicating with each other.
2. The heat-dissipating module as claimed in claim 1, wherein the multiple heat-pipe units are arranged side by side.
3. The heat-dissipating module as claimed in claim 1, wherein phase-changeable material is contained in the heat-pipe units.
4. The heat-dissipating module as claimed in claim 2, wherein phase-changeable material is contained in the heat-pipe units.
5. The heat-dissipating module as claimed in claim 3, wherein the phase-changeable material is pure water, coolant, organic solvent or a composition thereof.
6. The heat-dissipating module as claimed in claim 4, wherein the phase-changeable material is pure water, coolant, organic solvent or a composition thereof.
7. The heat-dissipating module as claimed in claim 1, wherein the heat-conductive construction includes multiple heat-conductive plates arranged around the board-type heat-pipe.
8. The heat-dissipating module as claimed in claim 2, wherein the heat-conductive construction includes multiple heat-conductive plates arranged around the board-type heat-pipe.
9. The heat-dissipating module as claimed in claim 3, wherein the heat-conductive construction includes multiple heat-conductive plates arranged around the board-type heat-pipe.
10. The heat-dissipating module as claimed in claim 5, wherein the heat-conductive construction includes multiple heat-conductive plates arranged around the board-type heat-pipe.
11. The heat-dissipating module as claimed in claim 1, wherein the heat-conductive construction is a metal block formed with multiple channels.
12. The heat-dissipating module as claimed in claim 2, wherein the heat-conductive construction is a metal block formed with multiple channels.
13. The heat-dissipating module as claimed in claim 3, wherein the heat-conductive construction is a metal block formed with multiple channels.
14. The heat-dissipating module as claimed in claim 5, wherein the heat-conductive construction is a metal block formed with multiple channels.
15. The heat-dissipating module as claimed in claim 7, wherein the heat-conductive construction is a metal block formed with multiple channels.
16. The heat-dissipating module as claimed in claim 9, wherein the heat-conductive construction is a metal block formed with multiple channels.
17. The heat-dissipating module as claimed in claim 10, wherein the heat-conductive construction is a metal block formed with multiple channels.
18. The heat-dissipating module as claimed in claim 1, wherein the surface of one end of the board-type heat-pipe partially contacts a heat-generating element directly or indirectly.
19. The heat-dissipating module as claimed in claim 2, wherein the surface of one end of the board-type heat-pipe partially contacts a heat-generating element directly or indirectly.
20. The heat-dissipating module as claimed in claim 3, wherein the surface of one end of the board-type heat-pipe partially contacts a heat-generating element directly or indirectly.
21. The heat-dissipating module as claimed in claim 5, wherein the surface of one end of the board-type heat-pipe partially contacts a heat-generating element directly or indirectly.
22. The heat-dissipating module as claimed in claim 7, wherein the surface of one end of the board-type heat-pipe partially contacts a heat-generating element directly or indirectly.
23. The heat-dissipating module as claimed in claim 9, wherein the surface of one end of the board-type heat-pipe partially contacts a heat-generating element directly or indirectly.
24. The heat-dissipating module as claimed in claim 10, wherein the surface of one end of the board-type heat-pipe partially contacts a heat-generating element directly or indirectly.
25. The heat-dissipating module as claimed in claim 11, wherein the surface of one end of the board-type heat-pipe partially contacts a heat-generating element directly or indirectly.
26. The heat-dissipating module as claimed in claim 13, wherein the surface of one end of the board-type heat-pipe partially contacts a heat-generating element directly or indirectly.
27. The heat-dissipating module as claimed in claim 14, wherein the surface of one end of the board-type heat-pipe partially contacts a heat-generating element directly or indirectly.
28. The heat-dissipating module as claimed in claim 15, wherein the surface of one end of the board-type heat-pipe partially contacts a heat-generating element directly or indirectly.
29. The heat-dissipating module as claimed in claim 16, wherein the surface of one end of the board-type heat-pipe partially contacts a heat-generating element directly or indirectly.
30. The heat-dissipating module as claimed in claim 17, wherein the surface of one end of the board-type heat-pipe partially contacts a heat-generating element directly or indirectly.
US11/840,176 2007-02-13 2007-08-16 Heat-dissipating module Abandoned US20080190587A1 (en)

Priority Applications (2)

Application Number Priority Date Filing Date Title
TW096202713 2007-02-13
TW96202713U TWM317745U (en) 2007-02-13 2007-02-13 Improved structure of heat sink

Publications (1)

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US20080190587A1 true US20080190587A1 (en) 2008-08-14

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JP (1) JP3136735U (en)
DE (1) DE202007008908U1 (en)
TW (1) TWM317745U (en)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20090266514A1 (en) * 2008-04-24 2009-10-29 Abb Research Ltd Heat exchange device
US9500416B2 (en) 2008-05-31 2016-11-22 The Boeing Company Thermal management device and method for making the same
US20180007810A1 (en) * 2016-06-30 2018-01-04 Fanuc Corporation Cooling structure for electronic device
EP3194875B1 (en) * 2014-09-15 2021-03-24 Aavid Thermalloy, LLC Arrangement comprising a thermosiphon device with bent tube section

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2009086825A2 (en) * 2008-01-04 2009-07-16 Noise Limit Aps Condenser and cooling device
DE102008000415B4 (en) * 2008-02-26 2011-06-01 Günther, Eberhard, Dipl.-Ing. Arrangement for dissipating heat from electrical components
WO2010072221A2 (en) * 2008-12-23 2010-07-01 Noise Limit Aps Cooling device with bended flat tube and related manufacturing method

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20030000689A1 (en) * 2001-06-29 2003-01-02 Dah-Chyi Kuo Heat dissipater
US20060144561A1 (en) * 2005-01-05 2006-07-06 Cpumate Inc. Heat-dissipating device with isothermal plate assembly of predetermined shape and method for manufacturing the same

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20030000689A1 (en) * 2001-06-29 2003-01-02 Dah-Chyi Kuo Heat dissipater
US20060144561A1 (en) * 2005-01-05 2006-07-06 Cpumate Inc. Heat-dissipating device with isothermal plate assembly of predetermined shape and method for manufacturing the same

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20090266514A1 (en) * 2008-04-24 2009-10-29 Abb Research Ltd Heat exchange device
US9500416B2 (en) 2008-05-31 2016-11-22 The Boeing Company Thermal management device and method for making the same
EP3194875B1 (en) * 2014-09-15 2021-03-24 Aavid Thermalloy, LLC Arrangement comprising a thermosiphon device with bent tube section
US20180007810A1 (en) * 2016-06-30 2018-01-04 Fanuc Corporation Cooling structure for electronic device
CN107564870A (en) * 2016-06-30 2018-01-09 发那科株式会社 Electronic equipment cooling construction
US10231355B2 (en) * 2016-06-30 2019-03-12 Fanuc Corporation Cooling structure for electronic device

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Publication number Publication date
TWM317745U (en) 2007-08-21
DE202007008908U1 (en) 2007-09-13
JP3136735U (en) 2007-11-08

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