US20110240720A1 - Repair apparatus and method for electronic component and heat-transfer cap - Google Patents

Repair apparatus and method for electronic component and heat-transfer cap Download PDF

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Publication number
US20110240720A1
US20110240720A1 US13/037,777 US201113037777A US2011240720A1 US 20110240720 A1 US20110240720 A1 US 20110240720A1 US 201113037777 A US201113037777 A US 201113037777A US 2011240720 A1 US2011240720 A1 US 2011240720A1
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United States
Prior art keywords
light
heat
electronic component
transfer
receiving section
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Abandoned
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US13/037,777
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English (en)
Inventor
Toru Okada
Hiroshi Kobayashi
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Fujitsu Ltd
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Fujitsu Ltd
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Assigned to FUJITSU LIMITED reassignment FUJITSU LIMITED ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: KOBAYASHI, HIROSHI, OKADA, TORU
Publication of US20110240720A1 publication Critical patent/US20110240720A1/en
Abandoned legal-status Critical Current

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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/04—Mounting of components, e.g. of leadless components
    • H05K13/0486—Replacement and removal of components
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K1/00—Soldering, e.g. brazing, or unsoldering
    • B23K1/018—Unsoldering; Removal of melted solder or other residues
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
    • H01L24/799—Apparatus for disconnecting
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/013—Alloys
    • H01L2924/0132—Binary Alloys
    • H01L2924/01322—Eutectic Alloys, i.e. obtained by a liquid transforming into two solid phases
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/12—Passive devices, e.g. 2 terminal devices
    • H01L2924/1204—Optical Diode
    • H01L2924/12042—LASER

Definitions

  • Embodiments discussed herein are related to a repair apparatus, method for an electronic component, and a heat-transfer cap.
  • Examples of semiconductor packages mounted on a printed wiring board include a ball grid array (BGA) package having a large number of ball-like connection terminals on the bottom of its package board and a chip size package (CSP) (hereinafter referred to as a “package”).
  • BGA ball grid array
  • CSP chip size package
  • the package can be replaced (repaired) in the event of a failure of the package or for the purpose of maintenance or recycling of the package. Therefore, a repair technique for removing the package from the printed wiring board and mounting it again to the printed wiring board is needed.
  • Japanese Laid-Open Patent Application No. 2006-041375 discusses an example of the repair technique for a repair apparatus that mounts or removes a package to/from a printed board by fusing a solder section of the package for reliably and stably mounting the package to prevent warping or inclination of the package during remounting.
  • This repair apparatus employs a method involving blowing hot air onto the package to fuse the solder section.
  • Japanese Laid-Open Patent Application No. 2007-335447 discusses another repair technique that removes electronic components, such as an active device and a passive device, from a printed wiring board by directly irradiating soft beams from a halogen lamp onto the printed wiring board to melt the solder sections of the electronic components mounted on the printed wiring board.
  • solder sections such as Sn—Ag—Cu solder containing tin, silver, and copper, for the solder sections.
  • the melting point of the Sn—Ag—Cu solder is about 40° C. higher than eutectic solder containing tin and lead.
  • the distance between a package mounted in a predetermined region of the printed wiring board and surrounding electronic components is as small as 5 mm to 0.5 mm. Therefore, the method of fusing the solder sections with hot air heats the surrounding electronic components with direct heat from the hot air nozzle and with the heat of hot air that is released to the surroundings after being blown to the package.
  • the surrounding electronic components are given thermal history that can cause failure.
  • the surrounding electronic components can also need to be replaced after completion of repair, which requires additional time for the work.
  • the repair using hot air is complicated involving advance measurement of the temperature history of solder sections using hot air and the temperature history of individual positions around the solder sections, and a determination of the temperature and supply time of the hot air.
  • FIG. 8 is a diagram illustrating an example of a method for fusing solder sections with hot air.
  • the hot air can be blown against a package 102 placed at a predetermined position of a printed wiring board 101 using a hot air nozzle 100 placed close thereto.
  • the position of the hot air nozzle 100 can be adjusted such that the rim of the opening thereof is, for example, spaced apart about 2 mm from the edge of the package 102 , and the opening is located at substantially the same height as that of the upper surface of the package 102 .
  • solder sections 104 at the back of the package 102 can be melted.
  • the hot air nozzle 100 can discharge the hot air HA to the surroundings of the package 102 , as indicated by the broken line arrow in FIG. 8 , to ensure the flow of the hot air.
  • An electronic component 103 located in the vicinity of the package 102 can also be heated to a high temperature due to the influence of the heat directly from the hot air nozzle 100 or the heat of the hot air flowing out of the hot air nozzle 100 . As a result, a thermal history that will cause a failure of the electronic component 103 can be experienced.
  • the solder sections of the package are not uniformly heated, preventing the solder sections from being reliably melted.
  • a repair apparatus configured to melt a solder section of an electronic component to remove the electronic component from a printed wiring board.
  • the repair apparatus includes a light source configured to irradiate light, and a heat-transfer cap including a light-receiving section and a heat-transfer section.
  • the heat-transfer section is configured to contact the electronic component, and transfer heat generated from the light in the light-receiving section to the electronic component.
  • FIG. 1 is a schematic diagram of a repair apparatus according to an embodiment of the invention
  • FIG. 2A is a perspective view of a heat-transfer cap, as viewed from the front, for use in the repair apparatus shown in FIG. 1 ;
  • FIG. 2B is a perspective view of the heat-transfer cap, as viewed from the back;
  • FIG. 3A is a diagram illustrating the flow of heat from the heat-transfer cap shown in FIGS. 2A and 2B according to an embodiment of the invention
  • FIG. 3B is a diagram illustrating an example of the temperature distribution of the heat-transfer cap shown in FIGS. 2A and 2B according to an embodiment of the invention
  • FIG. 4 is a diagram illustrating the relevant part of a first elevator of the repair apparatus shown in FIG. 1 according to an embodiment of the invention
  • FIG. 5 is a control block diagram illustrating control performed by the repair apparatus shown in FIG. 1 according to an embodiment of the invention
  • FIG. 6A is an example flowchart of a repair method according to an embodiment of the invention.
  • FIG. 6B is an example flowchart of a repair method according to an embodiment of the invention.
  • FIG. 7 is a diagram illustrating measuring points of temperature measurement according to an embodiment of the invention.
  • FIG. 8 is a diagram illustrating a repair method using hot air.
  • FIG. 1 is a schematic configuration diagram of a repair apparatus 10 according to an embodiment of the invention.
  • the repair apparatus 10 is an apparatus for melting solder sections of an electronic component disposed at a mount position of a printed wiring board.
  • the repair apparatus 10 is configured to bring a heat-transfer cap heated by irradiation with light beams into contact with the electronic component and transfer heat flowing from the heat-transfer cap to the electronic component through the contact portion.
  • the electronic component can include a package on which semiconductor devices including an active device and a passive device or semiconductor chips are mounted.
  • a package of a BGA system hereinafter referred to as a “BGA package”
  • a BGA having Sn—Ag—Cu solder (melting point: 220° C.) as the solder sections is used as another example of the electronic component.
  • the repair apparatus 10 can include an upper light-source unit 12 , lower light-source units 14 and 16 , a heat-transfer cap 18 , a temperature measuring unit 20 , a displacement measuring unit 22 , a first elevator 24 , a second elevator 26 , a control unit 30 , a cap retaining unit 32 , a hot-air generating unit 34 , a stage 36 , and a board holder 38 .
  • the upper light-source unit 12 includes a light source 12 a and a reflector 12 b .
  • the light source 12 a irradiates far-infrared rays (FIR) to the heat-transfer cap 18 .
  • FIR far-infrared rays
  • the reflector 12 b includes a shape that focuses light at a predetermined position. Since the upper light-source unit 12 can be fixed to an arm 26 a of the second elevator 26 , the upper light-source unit 12 can also be moved as the arm 26 a of the second elevator 26 moves.
  • a spot diameter of light focused by the reflector 12 b is, for example, about 3 mm. In FIG. 1 , the irradiated light flux can be wide.
  • Examples of the light source 12 a include a halogen lamp, a xenon lamp, and a laser light source.
  • the lower light-source units 14 and 16 irradiate far-infrared light onto the periphery of an opposing portion (hereinafter referred to as a “back side”) of the printed wiring board 19 from the BGA package 17 mount position to heat it by radiant energy transfer.
  • This heating is performed to prevent a part of the mount side from being heated by the upper light-source unit 12 to warp the printed wiring board 19 due to thermal expansion.
  • the lower light-source units 14 and 16 uniformly heat the entire wiring board 19 to, for example, about 70° C. lower than the melting temperature of solder sections 17 a (see FIG. 3A described later). This can reduce the heating time by light irradiation of the upper light-source unit 12 .
  • hot air is blown by the hot-air generating unit 34 onto a position of the back side of the printed wiring board 19 corresponding to the BGA package 17 mount position.
  • the printed wiring board 19 is heated by convective energy transfer.
  • the hot-air generating unit 34 blows hot air at, for example, 180 to 220° C. onto the printed wiring board 19 from the back side at a flow rate of, for example, 3 to 20 (ml/min).
  • the blowing of hot air is performed to prevent the back side of the mount region of the printed wiring board 19 from becoming hotter than the melting temperature of the solder sections 17 a due to the heating by light irradiation of the upper light-source unit 12 and the heating by light irradiation of the lower light-source units 14 and 16 . This prevents excessive heating of the back side of the mount position, thereby suppressing an increase in the temperature of the solder sections 17 a.
  • the heat-transfer cap 18 can contact part of the BGA package 17 when the BGA package 17 is placed on the printed wiring board 19 .
  • the heat-transfer cap 18 includes a light-receiving section 18 a (see FIG. 2A ) that is heated by receiving light irradiated from the light source 12 a and a heat-transfer section 18 b (see FIGS. 2A and 2B ).
  • the heat-transfer section 18 b transfers the heat of the light-receiving section 18 a to the BGA package 17 , in particular, to the solder sections 17 a through a surface in contact with the BGA package 17 .
  • the outer periphery of the heat-transfer cap 18 can be substantially the same as the outer periphery of the BGA package 17 .
  • the heat-transfer cap 18 is provided with the heat-transfer section 18 b so that it can contact the outer edge of the BGA package 17 .
  • FIGS. 2A and 2B are perspective views of the heat-transfer cap 18 according to an embodiment of the invention.
  • FIG. 2A is a perspective view of the heat-transfer cap 18 , as viewed from the front.
  • FIG. 2B is a perspective view of the heat-transfer cap 18 , as viewed from the back.
  • the heat-transfer cap 18 can be a plate-like member having, at the front, a rectangular plane corresponding to the shape of the BGA package 17 mounted on the printed wiring board 19 .
  • the heat-transfer cap 18 includes a recessed portion 18 c at the back side of the heat-transfer cap 18 .
  • a protruding portion surrounding the recessed portion 18 c can contact the BGA package 17 as the heat-transfer section 18 b .
  • the heat-transfer section 18 b includes a rectangular-ring-shaped contact surface 18 d.
  • the base material for the heat-transfer cap 18 is a copper material, such as oxygen-free copper and brass, or a high-thermal-conductivity material, such as aluminum, and has a mass as small as, for example, about 1 to 5 g.
  • the heat-transfer cap 18 can be configured such that at least the surface of the light-receiving section 18 a is covered with a black chromium oxide coating or a black anodized aluminum coating (anodic oxidation coating) to absorb light energy to become hot by efficiently receiving light and to stabilize temperature measurement, to be described below.
  • the contact surface 18 d of the heat-transfer cap 18 that can come into contact with the BGA package 17 is provided with an adhesive, heat-transfer grease, such as heat-transfer silicone, or a heat-transfer sheet for reducing thermal contact resistance due to the roughness of the surface of the BGA package 17 to achieve efficient heat transfer.
  • the shape of the heat-transfer cap 18 is determined based on the shape and thermal conductivity of the BGA package 17 .
  • the width of the contact surface 18 d of the heat-transfer cap 18 can be set at, for example, 2 to 3 mm.
  • the width of the contact surface 18 d of the heat-transfer cap 18 can be set at, for example, 3 to 4 mm.
  • FIG. 3A is a diagram illustrating the flow of heat from the heat-transfer cap 18 to the BGA package 17 according to an embodiment of the invention.
  • FIG. 3B is a diagram illustrating an example of the temperature distribution of the light-receiving section 18 a of the heat-transfer cap 18 according to an embodiment of the invention. This temperature distribution shows an example of a distribution of temperature of a portion extending along the long side of the rectangular light-receiving section 18 a through a central part 18 e.
  • the surface of the light-receiving section 18 a at the front of the heat-transfer cap 18 is a rectangular plane, the central part 18 e of which is irradiated with substantially converged light.
  • the central part 18 e is heated by irradiation with light.
  • the heat flows toward the heat-transfer section 18 b substantially uniformly, which makes the temperature of the solder sections 17 a substantially uniform.
  • the back side of the heat-transfer cap 18 is provided with the recessed portion 18 c , as shown in FIG. 2B , so that the temperature distribution at the light-receiving section 18 a becomes substantially uniform as compared with a case without the recessed portion 18 c .
  • the temperature distribution of the light-receiving section 18 a is uniform, as indicated by the solid line in FIG. 3B .
  • the temperature distribution is such that the temperature of the central part 18 e is the highest, as indicated by the dotted line, and thus, a uniform heat flow to the heat-transfer section 18 b cannot be achieved.
  • four slit-like small holes 18 f formed by cutting the plate-like member along the four sides of the rectangular light-receiving section 18 a are provided in the centers of the individual four sides 18 b .
  • the small holes 18 f are provided to make the temperature distribution of the heat-transfer section 18 b more uniform. These small holes 18 f pass through the front and back of the heat-transfer cap 18 .
  • the small holes 18 f include a longitudinal length of about one fourth of each side of the rectangle. Providing such small holes 18 f can suppress a decrease in the temperature of the corners of the rectangle. Specifically, when heat flows from the light-receiving section 18 a to the heat-transfer section 18 b , the corners of the rectangle tend to discharge the heat, thus being prone to a fall in temperature as compared with the surroundings.
  • the temperature measuring unit 20 measures the temperature of the central part 18 e of the light-receiving section 18 a of the heat-transfer cap 18 .
  • the temperature measuring unit 20 measures the temperature by, for example, detecting infrared radiant energy. The result of the temperature measurement is sent to the control unit 30 .
  • the control unit 30 controls the ON/OFF of light irradiation of the light source 12 a depending on the result of the temperature measurement sent from the temperature measuring unit 20 . Even if the heating temperature is controlled by the ON/OFF control of the light source 12 a , the heating temperature for the solder sections 17 a varies because the heat-transfer cap 18 is used. Thus, the temperature of the central part 18 e of the light-receiving section 18 a of the heat-transfer cap 18 can be controlled to a predetermined temperature.
  • the temperature of the central part 18 e of the light-receiving section 18 a when the solder sections 17 a reach a solder melting temperature, can be determined as a target temperature by finding the relationship between the temperature of the central part 18 e of the light-receiving section 18 a to be measured and the temperature of the solder sections 17 a of the BGA package 17 in advance.
  • the use of the heat-transfer cap 18 allows the solder sections 17 a to be melted while keeping the heating temperature for the central part of the BGA package 17 and the heating temperature for the surrounding electronic components at the upper limit of a heat-resistant temperature or lower. Accordingly, by controlling the temperature of the central part 18 e of the light-receiving section 18 a to a target temperature, efficient repair can be achieved without exerting thermal effects on the BGA package 17 and the surrounding electronic components.
  • the displacement measuring unit 22 measures the position of the light-receiving section 18 a along a direction perpendicular to the surface of the printed wiring board 19 .
  • An example of the displacement measuring unit 22 is a laser displacement meter.
  • the time when the melting of the solder sections 17 a is started can be determined. Accordingly, the measurement data of the displacement measuring unit 22 is sent to the control unit 30 , and the control unit 30 monitors the presence or absence of a small displacement of the heat-transfer cap 18 . The control unit 30 determines the presence or absence of a small displacement of the heat-transfer cap 18 depending on whether the measurement data has exceeded a threshold value. When the control unit 30 determines that a small displacement has occurred, the control unit 30 stops the light irradiation of the light source 12 a after a lapse of a predetermined time, for example, about 5 seconds, from the determination time.
  • a predetermined time for example, about 5 seconds
  • solder sections 17 a it can be determined by the displacement measuring unit 22 and the control unit 30 whether the solder sections 17 a has started to melt.
  • This embodiment eliminates, for example, the work of obtaining information on the heating time until the solder melts, the temperature profiles of the individual portions of the BGA package 17 , the temperature profiles of the individual portions of the printed wiring board 19 , as in conventional repair apparatuses.
  • the first elevator 24 is a mechanism for conveying the BGA package 17 and the heat-transfer cap 18 to remove the BGA package 17 from the printed wiring board 19 .
  • the first elevator 24 includes a holding unit 32 for holding the BGA package 17 and the heat-transfer cap 18 , and an arm 33 .
  • FIG. 4 is a diagram illustrating the holding unit 32 and the arm 33 in detail according to an embodiment of the invention.
  • the holding unit 32 includes a first hook 32 a and a second hook 32 b .
  • the first hook 32 a hooks and lifts the heat-transfer cap 18 .
  • the second hook 32 b hooks and lifts the BGA package 17 .
  • the displacement of the heat-transfer cap 18 can be measured to determine whether the solder sections 17 a has started to melt. Therefore, the first hook 32 a and the second hook 32 b are not holding the heat-transfer cap 18 and the BGA package 17 during heating.
  • the arm 33 moves the holding unit 32 in the vertical direction.
  • the operations of the first hook 32 a , the second hook 32 b , and the arm 33 are controlled in response to control signals from the control unit 30 .
  • the second elevator 26 is provided to fix the upper light-source unit 12 , the temperature measuring unit 20 , and the displacement measuring unit 22 to the arm 26 a .
  • the second elevator 26 retracts the upper light-source unit 12 , the temperature measuring unit 20 , and the displacement measuring unit 22 upward.
  • the second elevator 26 moves the upper light-source unit 12 , the temperature measuring unit 20 , and the displacement measuring unit 22 downward so that the light convergence position comes to the central part 18 e of the heat-transfer cap 18 .
  • control unit 30 controls the upper light-source unit 12 , the lower light-source units 14 and 16 , the hot-air generating unit 34 , the first elevator 24 , and the second elevator 26 based on the measurement data of the temperature measuring unit 20 and the displacement measuring unit 22 .
  • FIG. 5 is a control block diagram centered on the control unit 30 according to an embodiment of the invention.
  • an amplifier 20 a amplifies the temperature data measured by the temperature measuring unit 20 at a predetermined magnification, and if the magnified measurement data exceeds a predetermined threshold value, adjusts the level of the binary signal higher, and if the magnified measurement data does not exceed the threshold value, adjusts the level of the binary signal lower.
  • the amplifier 20 a sends the binary signal to the control unit 30 . Therefore, the control unit 30 controls the light source 12 a so that, when the level of the binary signal changes from 0 to 1, the light source unit 12 is turned off, and when the level of the binary signal changes from 1 to 0, the light source unit 12 is turned on.
  • control unit 30 controls the ON/OFF of the light source unit 12 through a power source 12 c based on the level of the binary signal generated by the amplifier 20 a .
  • the heating temperature for the heat-transfer cap 18 can be controlled to a predetermined temperature.
  • control unit 30 can detect whether the solder sections 17 a have started to melt based on the displacement data measured by the displacement measuring unit 22 and amplified by an amplifier 22 a .
  • the heat-transfer cap 18 can be displaced downward when the solder sections 17 a are slightly crushed when melting starts. After a lapse of a predetermined time after the start of melting is detected from the displacement of the heat-transfer cap 18 , the control unit 30 controls the power sources 12 c , 14 a , and 16 a , and stops the blowing of hot air from the hot-air generating unit 34 .
  • control unit 30 moves the first elevator 24 by operating a solenoid valve 24 a .
  • control unit 30 controls holding of the BGA package 17 and the heat-transfer cap 18 by the holding unit 32 and lifting of the arm 33 .
  • the control unit 30 moves the second elevator 26 by operating the arm 26 a .
  • the holding unit 32 of the first elevator 24 moves to stand by in an unholding state in the vicinity of the BGA package 17 .
  • the control unit 30 retracts the upper light-source unit 12 , the temperature measuring unit 20 , and the displacement measuring unit 22 through the second elevator 26 to not obstruct the movement of the holding unit 32 .
  • the control unit 30 moves the second elevator 26 to move the upper light-source unit 12 , the temperature measuring unit 20 , and the displacement measuring unit 22 to a predetermined position during heating.
  • the stage 36 positions the printed wiring board 19 so that the mounting position of the printed wiring board 19 is arranged at a predetermined position of the repair apparatus 10 .
  • the board holder 38 fixes the located wiring board 19 so that it does not move.
  • FIG. 6A is an example flowchart of a repair method for mounting the BGA package 17 onto the printed wiring board 19 using the repair apparatus 10 according to an embodiment of the invention.
  • the BGA package 17 and the heat-transfer cap 19 are placed on the mounting position of the printed wiring board 19 . Specifically, after the BGA package 17 is placed on the mounting position of the printed wiring board 19 , the heat-transfer cap 19 is positioned to fit the outer periphery of the BGA package 17 .
  • the power sources 14 a and 16 a are turned on in accordance with an instruction of the control unit 30 , and the lower light-source units 14 and 16 start irradiation of far-infrared light (FIR) (step S 10 ). Furthermore, the hot-air generating unit 34 starts to blow hot air at, for example, 180 to 220° C. onto the printed wiring board 19 through a HA control unit 34 a (see FIG. 5 ) (step S 20 ).
  • FIR far-infrared light
  • the second elevator 26 moves to move the upper light-source unit 12 , the temperature measuring unit 20 , and the displacement measuring unit 22 to a predetermined lower position (step S 30 ).
  • heating by light irradiation is prepared.
  • the light source 12 a is turned on through the power source 12 c in accordance with an instruction from the control unit 30 to start irradiation of far-infrared light (FIR), to start the heating of the heat-transfer cap 18 (step S 40 ).
  • Irradiation of far-infrared light (FIR) is feedback-controlled based on measurement data of the temperature measuring unit 20 .
  • control unit 30 resets measurement data of the displacement measuring unit 22 indicating the current position of the heat-transfer cap 18 to zero to use the measurement data as a reference (step S 50 ). This allows the control unit 30 to monitor the start of melting of the solder sections 17 a.
  • control unit 30 stands by until the displacement measuring unit 22 detects displacement of the heat-transfer cap 18 (step S 60 ). Thus, the control unit 30 stands by until the start of melting of the solder sections 17 a is detected.
  • the control unit 30 On detection of the start of melting of the solder sections 17 a , the control unit 30 , according to an embodiment of the invention, sets the timer of the control unit 30 to, for example, five seconds (step S 70 ), and stands by until the timer indicates a lapse of five seconds (step S 80 ). The control unit 30 controls the light irradiation of the light source 12 a to OFF after a lapse of the predetermined time (step S 90 ). Thereafter, the heat-transfer cap 18 is removed from the BGA package 17 .
  • the BGA package 17 is now mounted on the printed wiring board 19 .
  • FIG. 6B is an example flowchart of a repair method for removing the BGA package 17 from the printed wiring board 19 using the repair apparatus 10 according to an embodiment of the invention. Since steps S 110 to S 190 of this method are the same as steps S 10 to S 90 of the method shown in FIG. 6A , a description thereof will be omitted.
  • the first elevator 24 moves downward, and the holding unit 32 stands by directly before holding the BGA package 17 and the heat-transfer cap 18 (step S 100 ).
  • the holding unit 32 does not completely hold them in order to monitor the displacement of the heat-transfer cap 18 to determine whether the solder sections 17 a has started to melt.
  • control unit 30 controls the holding unit 32 so that the holding unit 32 rapidly holds the BGA package 17 and the heat-transfer cap 18 and that the arm 33 of the first elevator 24 is lifted (step S 200 ).
  • the first elevator 24 can rapidly remove the BGA package 17 from the printed wiring board 19 after the solder sections 17 a are melted.
  • the temperature data of the heat-transfer cap 18 heated by irradiation of halogen light is measured.
  • the temperature measurement is performed by providing thermocouples at measuring points P 1 to P 13 .
  • the measuring point P 1 is the center of the BGA package 17 to be mounted.
  • the measuring point P 2 is a solder section 17 a located at the center of the solder sections 17 a of the BGA package 17 .
  • the measuring point P 3 is a solder section 17 a located at the end of the solder sections 17 a of the BGA package 17 .
  • the measuring point P 4 is 0.4 mm spaced apart from the end of the BGA package 17 .
  • the measuring point P 5 is 1 mm spaced apart from the end of the BGA package 17 .
  • the measuring point P 6 is 3 mm spaced apart from the end of the BGA package 17 .
  • the measuring point P 7 is 6 mm spaced apart from the end of the BGA package 17 .
  • the measuring point P 8 is located at a solder section at the end of an adjacent BGA package that is 1.3 mm spaced apart from the BGA package 17 .
  • the measuring points P 9 to P 13 are located on the back side of the printed wiring board 19 that mounts the BGA package 17 .
  • the measuring point P 9 is located at a position corresponding to the center of the BGA package 17 .
  • the measuring point P 10 is located at a position corresponding to the end of the BGA package 17 .
  • the measuring point P 11 is located at a position corresponding to the measuring point P 5 .
  • the measuring point P 12 is located at a position corresponding to the measuring point P 6 .
  • the measuring point P 13 is located at a position corresponding to the measuring point P 7 .
  • temperatures when a BGA package is mounted using hot air are measured, as shown in FIG. 8 , with the measuring points P 1 to P 13 provided with thermocouples.
  • solder sections 17 a formed of Sn—Ag—Cu solder melt to allow mounting is 220° C.
  • all of the solder sections 17 a be at 220° C. or higher and adjacent solder sections and measuring points adjacent to the BGA packages be at 200° C. or lower.
  • the temperature of the adjacent measuring points is set to 200° C. or lower for preventing solder splash from the adjacent BGA packages and preventing disengagement of the mounted electronic components from the printed wiring board 19 .
  • the solder splash is splash of melted solder from solder sections in the vicinity of the inside of underfill of the BGA packages.
  • Table 1 shows temperature measurement data of an embodiment of the invention (hereinafter referred to as a “first embodiment”) and the comparative example 1.
  • the temperatures at the measuring point P 1 at the center of the BGA package 17 and the measuring points P 2 and P 3 at the solder sections 17 a exceed 220° C., while the temperatures at the other measuring points are less than 200° C.
  • the temperatures at the measuring points P 4 to P 6 in addition to the measuring points P 1 and P 3 , also exceed 220° C., which shows that the temperatures reach the solder melting temperature in the surrounding region other than the BGA package 17 to be mounted.
  • the temperature at the measuring point P 2 which is a solder section, has not reached 220° C. at that time.
  • the temperatures of the individual positions are measured using the heat-transfer cap 18 that is heated by irradiation with halogen light when a BGA package 17 different from the BGA package 17 used in the first embodiment is mounted on the printed wiring board 19 .
  • the temperature measurement is performed using thermocouples as in the first embodiment and the comparative example 1.
  • the measuring points are the measuring points P 1 to P 4 and P 9 , described above, and a measuring point P 14 .
  • the measuring point P 14 is a solder section of another BGA package mounted at the back of the printed wiring board 19 and is located at a position corresponding to the center of the BGA package 17 to be mounted.
  • Table 2 shows the temperature measurement data for the second embodiment and a comparative example 2.
  • the temperature at the measuring point P 1 exceeds 245° C., which is the heat-resistant temperature of the BGA package 17 , and the temperatures at the measuring points P 2 and P 3 , which are solder sections, do not reach the solder melting temperature.
  • the temperature at the measuring point P 1 is lower than the heat-resistant temperature, and the temperatures at the measuring points P 2 and P 3 reach the solder melting temperature, and the temperatures at the measuring points P 4 , P 9 , and P 14 other than the solder sections 17 a do not reach the solder melting temperature, and besides, they are lower than 200° C. This shows that the temperatures of the solder sections 17 a of the second embodiment can reach the solder melting temperature more efficiently than the comparative example 2.

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  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Mechanical Engineering (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
US13/037,777 2010-03-30 2011-03-01 Repair apparatus and method for electronic component and heat-transfer cap Abandoned US20110240720A1 (en)

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JP2010079175A JP2011211073A (ja) 2010-03-30 2010-03-30 電子部品のリペア装置、リペア方法、およびリペア用伝熱キャップ部材

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US20130284707A1 (en) * 2012-04-27 2013-10-31 Fujitsu Limited Apparatus of mounting and removing component, method of mounting component and method of removing component
US9180539B1 (en) * 2014-03-18 2015-11-10 Flextronics Ap, Llc Method of and system for dressing RF shield pads
US20180149957A1 (en) * 2016-11-29 2018-05-31 Panasonic Intellectual Property Management Co., Ltd. Light source system and projection display apparatus
US10362720B2 (en) 2014-08-06 2019-07-23 Greene Lyon Group, Inc. Rotational removal of electronic chips and other components from printed wire boards using liquid heat media
US20200251442A1 (en) * 2019-02-01 2020-08-06 Laserssel Co., Ltd. Multi-beam laser de-bonding apparatus and method thereof
US20200367366A1 (en) * 2019-05-16 2020-11-19 Denso Corporation Sleeve soldering device and method of producing electronic device
US11317517B2 (en) * 2020-06-12 2022-04-26 PulseForge Incorporated Method for connecting surface-mount electronic components to a circuit board
TWI828171B (zh) * 2022-06-01 2024-01-01 創新服務股份有限公司 電子元件的維修裝置及維修方法

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JP5949302B2 (ja) * 2012-08-08 2016-07-06 富士通株式会社 リペア装置及び伝熱キャップ部材
CN102896388A (zh) * 2012-09-12 2013-01-30 潘国荣 一种bga红外线拆焊机
WO2016103800A1 (ja) * 2014-12-24 2016-06-30 ソニー株式会社 部品除去装置、基板、部品除去方法、部品リペア装置および部品実装基板
JP6732194B2 (ja) * 2016-06-10 2020-07-29 日本新工芯技株式会社 再生シリコン部材の製造方法
CN107359134B (zh) * 2017-07-28 2020-09-11 湖北三江航天红峰控制有限公司 一种利用激光实现bga芯片返修的方法和装置
KR102459616B1 (ko) * 2020-09-07 2022-10-27 한국기계연구원 불량 소자 제거용 스탬프 및 이를 포함하는 불량 소자 제거용 장치
WO2023135624A1 (ja) * 2022-01-11 2023-07-20 デンオン機器株式会社 半導体部品分離装置並びにこれを用いた半導体部品分離及び取付方法
CN114951994B (zh) * 2022-05-25 2023-08-04 武汉凌云光电科技有限责任公司 一种激光恒温焊接控制系统和方法

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US9517520B2 (en) * 2012-04-27 2016-12-13 Fujitsu Limited Apparatus of mounting and removing component, method of mounting component and method of removing component
US9180539B1 (en) * 2014-03-18 2015-11-10 Flextronics Ap, Llc Method of and system for dressing RF shield pads
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US11699676B2 (en) * 2019-02-01 2023-07-11 Laserssel Co., Ltd. Multi-beam laser de-bonding apparatus and method thereof
US20200367366A1 (en) * 2019-05-16 2020-11-19 Denso Corporation Sleeve soldering device and method of producing electronic device
US11696411B2 (en) * 2019-05-16 2023-07-04 Denso Corporation Sleeve soldering device and method of producing electronic device
US11317517B2 (en) * 2020-06-12 2022-04-26 PulseForge Incorporated Method for connecting surface-mount electronic components to a circuit board
TWI828171B (zh) * 2022-06-01 2024-01-01 創新服務股份有限公司 電子元件的維修裝置及維修方法

Also Published As

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EP2373147A1 (de) 2011-10-05
KR20110110015A (ko) 2011-10-06
KR101187940B1 (ko) 2012-10-08
TWI419632B (zh) 2013-12-11
JP2011211073A (ja) 2011-10-20

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