US20110217461A1 - Manufacturing method of a holder of a boat for loading a substrate - Google Patents
Manufacturing method of a holder of a boat for loading a substrate Download PDFInfo
- Publication number
- US20110217461A1 US20110217461A1 US13/107,691 US201113107691A US2011217461A1 US 20110217461 A1 US20110217461 A1 US 20110217461A1 US 201113107691 A US201113107691 A US 201113107691A US 2011217461 A1 US2011217461 A1 US 2011217461A1
- Authority
- US
- United States
- Prior art keywords
- holder
- boat
- semiconductor substrate
- supporting
- substrate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Abandoned
Links
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
- H01L21/67778—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading involving loading and unloading of wafers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
- H01L21/67303—Vertical boat type carrier whereby the substrates are horizontally supported, e.g. comprising rod-shaped elements
- H01L21/67306—Vertical boat type carrier whereby the substrates are horizontally supported, e.g. comprising rod-shaped elements characterized by a material, a roughness, a coating or the like
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S414/00—Material or article handling
- Y10S414/135—Associated with semiconductor wafer handling
- Y10S414/137—Associated with semiconductor wafer handling including means for charging or discharging wafer cassette
- Y10S414/138—Wafers positioned vertically within cassette
Definitions
- the present invention relates to a holder manufacturing method for loading a substrate of a semiconductor manufacturing device, a batch type boat having the holder, a loading/unloading method of a semiconductor substrate using the same, and a semiconductor manufacturing device having the same.
- a semiconductor manufacturing device for treating the semiconductor substrate divides into a batch type including a boat for loading substrates in bulk therein in order to improve the processing capacity and a single wafer type for treating the process one by one in order to extremely decrease the processing time.
- a semiconductor manufacturing device of the batch type is generally used in the manufacturing process thereof, especially a process of high temperature.
- FIG. 1A is an explanatory view illustrating an external appearance of a semiconductor manufacturing device including a batch type boat for loading a plurality of semiconductor substrates.
- the conventional semiconductor manufacturing device of the batch type includes a reaction chamber of a tubular type for treating the semiconductor manufacturing process having a receiving space therein and an opening portion at lower portion thereof, and a boat 1 for loading the substrate and stacking the plurality of semiconductor substrates vertically.
- the semiconductor substrates 100 located at a cassette 3 mounted on a stage are transferred to the boat 1 through an end-effector 2 .
- the boat 1 includes the plural boat frames 4 of a pole type, a plurality of supporting grooves (slits) formed along the boat frames 4 at a predetermined interval, and a plurality of holders 7 for loading the semiconductor substrates inserted in the supporting grooves.
- the boat 1 further includes a front opening portion 5 in regard to the working path (drawing in and out) of the end-effector 2 through the boat frame (note FIG. 1B ).
- the boat frame 4 occupies a half circle on the circumference thereof and the front opening portion 5 occupies the remaining portion in order to allow the loading/unloading of the semiconductor substrate 100 .
- the boat 1 further includes a boat cap capable of supporting the lower portion thereof and opening and closing the opening portion of the reaction chamber.
- the boat 1 in which the loading operation is completed, is putted into the reaction chamber through a lifting up and down device.
- the holder 7 for supporting the semiconductor substrate 100 is mounted on the boat 1 .
- the semiconductor process in the reaction chamber includes the heat treatment process.
- the heat treatment process for example, there are a deposition process, a heat treatment process for removing a COP (crystal originated particle), a diffusion process (well drive-in) for diffusing the dopant added to the semiconductor for doping into the semiconductor substrate, a oxide forming process of the semiconductor substrate and a SOI heat treatment process and so on.
- the environment of high temperature is required.
- the large diameter (about 12 inch) of the semiconductor substrate is positively performed in order to improve the productivity of the semiconductor. Also, the supporting method of the semiconductor substrate is changed in the heat treatment process according to the process of the high temperature and the large aperture.
- a slip which is a crystallization defect of a silicon lattice of the semiconductor substrate, can be more easily occurred on account of the large aperture of the wafer.
- the holder is used.
- the holder supports the lower portion located at 0.7 R (Radius) of the semiconductor substrate thereon so as to prevent its fall.
- the material of the holder 7 is made of a ceramic type for example, a silicon carbide (SiC) so as to cope with the environment of high temperature and the chemical environment of the reaction process. Also, a supporting ring 9 for a target-support of the 0.7 R is formed at the supporting panel 8 of a circular plate type similar to the shape of the semiconductor substrate
- the conventional holder 7 brings about the manufacturing inconvenience on account of the manufacturing difficulty of the holder itself.
- a peripheral device is used.
- FIG. 2 is a conceptual view illustrating a manufacturing method of the conventional holder.
- the silicon carbide is mixed with a binder and it is precisely molded in the form of a holder.
- the binder since the binder includes impurities, the silicon carbide is coated on the mold surface of the holder type to complete the holder operation.
- the silicon carbide is thickly coated on a molding panel of a circular plate type and its circumference is cut and then, the molding panel (graphite) is incinerated. Thereafter, in order to form the supporting ring 9 on the silicon carbide panel, it is precisely treated again to complete the holder.
- the height of the supporting ring 9 is restricted on account of the occupying space of the supporting panel 8 and the supporting ring 9 of the holder.
- the holder 7 and semiconductor substrate 100 have one occupying space and it is necessary to consider the pitch of one unit and the working space of the end-effector 2 together.
- the compact arrangement capable of minimizing the pitch is linked with the productivity (amount of the substrate treatment) of the semiconductor substrate 100 .
- the pitch is increased, thereby decreasing the amount of the substrate treatment.
- the total pitch “P” is the sum of the total thickness of the end-effector 2 , the working space “a”, the thickness of the semiconductor substrate 100 , the thickness of the supporting ring 9 and the thickness of the supporting panel 8 (note FIG. 3A ).
- the supporting ring 9 should be formed at a height providing the allowing space “a” equal to the total height of the end-effector 2 . Accordingly, the pitch “P” is the sum of the lifting height and the thickness of the supporting panel (note FIG. 3B ).
- the working speed of the bottom-lift type since the insertion process to the lower portion of the semiconductor substrate, the lifting process and the drawing-out process are performed in turns, the working speed is quickly and the gain of the pitch can be obtained in comparison with the top-edge-grip type.
- the silicon carbide so as to cope with the process of high-temperature, there is a problem in that the molding process for ensuring the height of the supporting ring is difficulty.
- the holder itself is complicated and the holder 7 having the supporting ring for performing the support of 0.7 R is required in the process of high-temperature for a large-diameter semiconductor, there are problems in that the manufacturing cost is high, the manufacturing process thereof is inconvenient and the productivity thereof is lowered.
- an object of the present invention is to provide a holder manufacturing method for loading a substrate of a semiconductor manufacturing device capable of simply manufacturing the holder.
- Another object of the present invention is to provide a batch type boat having the holder, in that the manufacture thereof is simple by means of a holder ring and the holder ring is supported on supporting rods and an end-effector escapes the supporting rods, so that the pitch interval can be minimized, whereby it can load the compact semiconductor substrate to the boat, the amount of the substrate treatment can be improved and thus the productivity thereof can be improved.
- Another object of the present invention is to provide a loading/unloading method of the semiconductor substrate using the batch type boat and a semiconductor manufacturing device having the batch type boat.
- the present invention provides a manufacturing method of a holder of a boat for loading a semiconductor substrate comprising the steps of: molding a holder substrate of a pipe shape having inner and outer circumference of a predetermined size in such a manner that a lower portion of the semiconductor substrate is seated thereon; and forming a plurality of holder rings by cutting the holder rings from the holder substrate in such a manner that each holder ring is matched to a disposal interval of the semiconductor substrates in the boat.
- the present invention provides a loading/unloading method of a semiconductor substrate comprising the steps of protruding supporting rods from a boat frame of a batch type boat for treating the semiconductor substrate in bulk; supporting holder rings on the supporting rods; supporting a lower portion of the semiconductor substrate on a circular girth of each holder ring; preparing the end-effector for allowing a occupying space of the supporting rod; and loading/unloading the plurality of semiconductor substrates toward the batch type boat having a pitch interval except for a thickness of the supporting rod through the end-effector.
- the present invention provides a batch type boat for loading a semiconductor substrate of a semiconductor manufacturing device comprising: a plurality of supporting rods supporting a lower portion of the semiconductor substrate and formed at a boat frame of the boat for loading/unloading the semiconductor substrate; and a plurality of holder rings mounted on the supporting rods.
- the present invention provides semiconductor manufacturing device having a batch type boat for mounting and treating a semiconductor substrate in bulk and an end-effector of a robot arm for loading/unloading the semiconductor substrate to the batch type boat comprising: a plurality of holder rings for supporting a lower portion of the semiconductor substrate on a circular girth thereof; a plurality of supporting rods supporting the semiconductor substrate by means of each holder ring and protruded from the boat frame in order to provide the working space of the end-effector, the end-effector for escaping an interference with the supporting rods located at a space between the holder rings vertically adjacent to each other; and the batch type boat having any pitch interval except for a thickness of the supporting rod 16 in order to support the holder ring by means of the supporting rod and the end-effector.
- FIG. 1A and FIG. 1B are explanatory views illustrating external appearances of conventional semiconductor manufacturing device including a batch type boat for loading a plurality of semiconductor substrates;
- FIG. 2A and FIG. 2B are conceptual views illustrating manufacturing methods of the conventional holder
- FIG. 3A and FIG. 3B are explanatory views illustrating working statuses of a conventional end-effector
- FIG. 4A and FIG. 4B are conceptual views illustrating manufacturing methods of a holder ring according to the present invention.
- FIG. 5 is an explanatory view illustrating an external appearance of a semiconductor manufacturing device including a batch type boat having holder rings and an end-effector of a top-edge-grip type according to one embodiment of the present invention
- FIG. 6 is plan and side views of FIG. 5 ;
- FIG. 7 is an explanatory view illustrating the external appearance of a semiconductor manufacturing device including a batch type boat having the holder rings and an end-effector of a bottom-lift type according to another embodiment of the present invention.
- FIG. 8 is plan and side views of FIG. 7 .
- FIG. 4 is a conceptual view illustrating a manufacturing method of a holder ring according to the present invention.
- FIG. 5 is an explanatory view illustrating the external appearance of a semiconductor manufacturing device including a batch type boat having the holder rings and an end-effector of a top-edge-grip type according to one embodiment of the present invention.
- FIG. 6 is plan and side views of FIG. 5 .
- FIG. 7 is an explanatory view illustrating the external appearance of a semiconductor manufacturing device including a batch type boat having the holder rings and an end-effector of a bottom-lift type according to another embodiment of the present invention.
- FIG. 8 is plan and side views of FIG. 7 .
- a holder according to the present invention includes a supporting panel of a circular plate type and a plurality of holder rings for safely seating each lower portion of semiconductor substrates disposing thereon and integrally formed on the supporting panel.
- a manufacturing method of the holder of the boat for loading the semiconductor substrate 100 includes the steps of forming a holder substrate 10 of a pipe shape having inner and outer circumference of a predetermined size in such a manner that the lower portion of the semiconductor substrate 100 is seated thereon, and forming a plurality of holder rings 12 by cutting the holder rings 12 from the holder substrate 12 in such a manner that each holder ring is matched to a disposal interval of the semiconductor substrates 100 in the boat 20 .
- the holder substrate 10 of the pipe shape is powder-molded through a silicon carbide powder and the silicon carbide is also, coated on the cut holder rings 12 .
- the holder substrate 10 of the pipe shape is molded by coating the silicon carbide on a graphite molding rod 14 and the graphite molding rod 14 is removed from the holder substrate 10 and then, the holder substrate 10 is cut.
- the lower portion of the semiconductor substrate 100 is supported on the circular girth thereof as described above.
- the manufacturing of the holder is simple and the gain of the pitch thereof is obtained.
- a loading/unloading method of the semiconductor substrate 100 using the holder ring 12 includes the steps of protruding supporting rods 16 from a boat frame of the batch type boat 20 for treating the semiconductor substrate 100 in bulk, supporting the holder rings 12 on the supporting rods 16 , supporting the 0.7 R lower portion of the semiconductor substrate 100 on the circular girth of each holder ring 12 , preparing the end-effector 18 for allowing (escaping) a occupying space of the supporting rod 16 in its planar view and a vertical occupying space (thickness) of the supporting rod 16 having any thickness secured by the supporting of the holder ring 12 , and loading/unloading the plurality of semiconductor substrates 100 toward the batch type boat 12 having a pitch interval except for the thickness of the supporting rod 16 through the end-effector 18 .
- the supporting rods 16 are internally protruded from the boat frame 22 located at the outside of the holder ring 12 in such a manner that the holder ring 12 is divided equally at an angle of 120 degrees to support the holder ring 12 by three spots, the lower space of the semiconductor substrate 100 is closed by the supporting rods 16 for interfering in the holder ring 12 and the outside space of the holder ring 12 , and the upper space of the semiconductor substrate 100 except for the occupying space of the supporting rod 16 is exposed to outside, in order to perform the loading/unloading of the semiconductor substrate 100 by means of the end-effector 18 of the top-edge-grip type.
- the end-effector 18 has a width for inserting between two supporting rods 16 protruded on both sides in regard to the working path in its planar view and an escape groove for escaping the interference of the remaining one supporting rod 16 protruded in the inner direction in regard to the working path in its planar view.
- a boat for loading a semiconductor substrate of a batch type semiconductor manufacturing device includes a plurality of supporting rods 16 for supporting the lower portion of the semiconductor substrate 100 formed at the boat frame 22 of the boat 20 for loading/unloading the semiconductor substrate 100 , and a plurality of holder rings 12 mounted on the supporting rods 16 and cut from the holder substrate 10 of a pipe shape having inner and outer circumference of a predetermined size for seating the lower portion of the semiconductor substrate 100 in such a manner that each holder ring 12 is matched to a disposal interval of the semiconductor substrates 100 in the boat 20 .
- a semiconductor manufacturing device having the batch type boat 20 for mounting and treating the semiconductor substrate 100 in bulk and the end-effector 18 of a robot arm for loading/unloading the semiconductor substrate 20 to the batch type boat 20 comprises the holder rings 12 for supporting the lower portion of the semiconductor substrate 100 on the circular girth thereof, the supporting rods 16 supporting the semiconductor substrate 100 by means of each holder ring 12 and protruded from the boat frame 22 in order to provide the working space of the end-effector 18 , the end-effector 18 for escaping the interference with the supporting rods 16 located at a space between the holder ring 12 vertically adjacent to each other, and the batch type boat 20 having any pitch interval except for the thickness of the supporting rod 16 in order to support the holder ring by means of the supporting rod 16 and the end-effector 18 .
- the supporting rods 16 are internally and radially protruded from the boat frame 22 having a front opening portion, thus the end-effector 18 of the top-edge-grip type has a width for inserting between two supporting rods 16 protruded on both sides in regard to the working path in its planar view and the escape groove 24 for receiving the remaining one supporting rod 16 protruded in the inner direction in regard to the working path and gripping the semiconductor substrate 100 in such a manner that the working is performed in the internal space of the holder ring 12 capable of escaping the planar occupying space of the supporting rod 16 in a case that the outer space of the holder ring 12 is occupied by the supporting rod 16 .
- the holder ring 12 is divided equally at an angle of 120 degrees to support the holder ring 12 on the supporting rods 16 by three spots.
- the supporting rods 16 are protruded from the boat frame 22 toward the three spots of the lower portion of the circumference of each holder ring 12 divided equally at an angle of 120 degrees. Accordingly, where the semiconductor substrate 100 is drawn out and in, an opening portion 28 is formed in such a manner that the interval between two spots protruded from both side of the boat frame 22 having the front opening portion 5 is larger than the width of the end-effector in regard to the working path thereof, so that the working can be easily performed.
- the end-effector 18 includes the holder ring receiving groove 26 having any size for receiving the holder ring 12 in such a manner that the working is performed between the exposed holder rings 12 in a case that the inner space of the holder ring 12 is occupied by the supporting rod 16 .
- a pair of the boat frames 22 is formed at the extension line of the working path of the end-effector 18 and a pair of the supporting rods 16 is penetrated through the inner circumference of the holder ring 12 at the boat frames 22 .
- the holder ring 12 , the boat frame 22 and the supporting rod 16 are made of the silicon carbide or its equivalents.
- the holder ring 12 , the boat frame 22 and the supporting rod 16 can be made of quartz.
- the present invention may be applied to the semiconductor manufacturing device except for a process of a high temperature on account of the manufacturing convenience and the gain of the pitch thereof.
- the present invention is provided to a simple semiconductor manufacturing method and a device thereof in that the capacity of the substrate treatment is improved and the manufacturing method is simple by means of the batch type boat having a compact pitch interval and a simple holder.
- the holder according to the present invention having supporting rings integrally molded therein and supporting 0.7 R of the semiconductor substrate 100 includes the holder rings 12 having only supporting ring to the exclusion of the supporting panel, the boat 20 for supporting the holder rings 12 therein, and the supporting rods 16 having no effect on the pitch interval, whereby ensuring the compact pitch interval.
- the present invention is divided into two embodiments according to the supporting manner of the holder ring 12 through the supporting rod 16 and the structure of the end-effector 18 corresponding to the holder ring 12 .
- the holder ring 12 according to one embodiment of the present invention is manufactured by the manufacturing method of FIG. 4 .
- FIG. 4A illustrates the manufacturing method of the holder ring according to one embodiment of the present invention in that the holder substrate 10 of the pipe shape is powder-molded through the silicon carbide powder, the holder substrate 10 is cut to any thickness of the holder ring, and then the silicon carbide is coated on the cut holder rings 12 .
- FIG. 4B illustrates the manufacturing method of the holder ring according to second embodiment of the present invention, in that the holder substrate 10 of the pipe shape is molded by coating the silicon carbide on a graphite molding rod 14 and the graphite molding rod 14 is removed from the holder substrate 10 and then, the holder substrate 10 is cut.
- the separate molding instrument for individually manufacturing the conventional holder is unnecessary. Also, because the conventional process such as the cutting molding and so on is deleted, the productivity of the holder can be maximized.
- the plurality of supporting rods 16 for supporting the lower portion of the semiconductor substrate 100 is formed at the boat frame 22 of the boat 20 for loading/unloading the semiconductor substrate 100 and the boat 20 for loading the semiconductor substrate 10 of the batch type semiconductor manufacturing device and having the holder rings 12 is provided.
- the function of the supporting panel of the conventional holder is performed by the boat 20 of the present invention.
- the holder rings 12 are arranged at the boat through the supporting rods 16 .
- the supporting rods 16 are mounted on the boat frame 22 of the boat 20 and protruded toward the inside of the boat 20 owing to the inside disposal of the holder ring 12 in the boat 20 .
- a seating groove 30 for seating the holder ring 12 is formed at the upper end of the supporting rod 16 . That is, the holder ring 12 is inserted into the seating groove 30 to ensure the supporting location (note FIG. 6 and FIG. 8 ).
- the supporting rod 16 of the present invention is divided into two embodiments according to the supporting manner.
- the end-effector 18 of the top-edge-grip type is adopted to the semiconductor substrate 200 through the supporting rod 16 occupying the outer area of the holder ring 12 . That is, the loading/unloading operation is performed in the inside of the space occupied by the supporting rod 16 located at the upper portion of the semiconductor substrate 100 .
- the supporting rods 16 are protruded from the boat frame 22 and the lower portion of the circumference of each holder ring 12 is divided equally and supported thereon.
- the boat frame 22 is formed at the semi-circumference in order to form the front opening portion 5 as described above.
- the support of the holder ring 12 can be unstable.
- both supporting rods 16 protruded from the boat frame 22 located at the front opening portion are slanted radially and divided equally at an angle of 120 degrees from the other supporting rod 16 located at the center line of the working path, in order to stably support the holder ring 12 .
- the holder ring 12 can be stably supported on the three supporting rods.
- the lower space of the semiconductor substrate 100 is closed and the upper space of the semiconductor substrate 100 except for the supporting rods 16 is opened to outside.
- the outer space of the holder ring 12 is occupied by the two supporting rods 16 and is interfered by one protruded supporting rod 16 at the center line in regard to the drawing out and in path in its planar view.
- the end-effector 18 of the top-edge-grip type has the width for inserting between two supporting rods 16 protruded on both sides in regard to the working path and the escape groove 24 for receiving the remaining one supporting rod 16 protruded in the inner direction in regard to the working path and gripping the semiconductor substrate 100 .
- the supporting rods 16 and the end-effector 18 of the top-edge-grip type it is unnecessary to consider the thickness of the supporting rod 16 as well as ensure the height (thickness) of the holder ring for gripping the semiconductor substrate 100 on the supporting rods 16 .
- the pitch “P” is the interval between holder rings 12 .
- the end-effector 18 escapes the supporting rod 16 , the working space “a” of the end-effector 18 is settled by the holder ring 12 and the semiconductor substrate 100 .
- the pitch interval is determined by the minimized thickness (about 1 mm: including insertion thickness of the seating groove 30 ), the thickness (about 1 mm) of the semiconductor substrate 100 and the working space (about 3.5 mm) of the end-effector 18 .
- the end-effector 18 does not escape the supporting rod 16 , it is approximately doubled in pitch.
- the predetermined thickness about 4-5 mm
- the added height of the holder ring 12 for working space of the grip are necessary.
- the supporting panel and the holder having the supporting ring are applied in the same manner as described above.
- FIG. 7 and FIG. 8 illustrate the end-effector of the bottom-lift type according to another embodiment of the present invention. That is, since the lower portion (outer space) of the semiconductor substrate 100 is exposed to outside through the holder ring 12 and the supporting rods 16 occupying the inside of the holder ring 12 , the end-effector of the bottom-lift type is adopted.
- the pair of the supporting rods 16 is penetrated through the inner circumference of the holder ring 12 at the lower portion thereof in the direction of the working path of the end-effector 18 , so that the holder ring 12 is supported on the supporting rods 16 by four spots.
- the holder ring 12 inscribes a regular square in the central circumference of the holder ring 12 , so that the outside of the holder ring 12 is open to the working space of the end-effector 18 .
- the holder ring 12 is stably supported on the supporting rods 16 and it can obtain more rapid loading/unloading of the semiconductor substrate 100 and the gain of pitch by means of the end-effector of the bottom-lift type.
- the end-effector 18 of the bottom-lift type has the holder ring receiving groove 26 of a U-shape for receiving the holder ring 12 , so that it is unnecessary to consider the thickness of the supporting rod 16 as the pitch thereof.
- the pitch “P” is the interval between holder rings 12 .
- the end-effector 18 escapes the supporting rod 16 in its planar view, the working space “a” of the end-effector 18 is settled by the holder ring 12 and the semiconductor substrate 100 .
- the gain of the pitch is larger than that of one embodiment of the present invention. Furthermore, because the working time of the grip is unnecessary in the course of the loading/unloading, the working speed can be quickly.
- the processing details of the supporting rod 16 is required.
- the thickness of the holder ring 12 the thickness of the semiconductor substrate 100 and the working space of the end-effector between the holder rings 12 as the pitch and the thickness of the holder ring 12 for supporting the semiconductor substrate 100 can be minimized, thereby obtaining a plenty of holder rings from one holder substrate and a compact arrangement.
- the holder manufacturing method for loading the substrate of the semiconductor manufacturing device the batch type boat having the holder, a loading/unloading method of a semiconductor substrate using the same, and a semiconductor manufacturing device having the same
- the manufacture of the holder and the batch type boat are simple by means of the holder ring
- the holder ring is supported on supporting rods and the end-effector escapes the supporting rods, so that the pitch interval can be minimized, whereby it can load the compact semiconductor substrate to the boat, the amount of the substrate treatment can be improved and thus the productivity thereof can be improved.
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Chemical Vapour Deposition (AREA)
Abstract
A manufacturing method of a holder of the boat for loading a semiconductor substrate includes molding a holder substrate of a pipe shape having inner and outer circumference of a predetermined size in such a manner that a lower portion of the semiconductor substrate is seated thereon, and forming a plurality of holder rings by cutting the holder rings from the holder substrate in such a manner that each holder ring is matched to a disposal interval of the semiconductor substrates in the boat. The manufacture of the holder and the batch type boat are simple by means of the holder ring supported on the supporting rods and the end-effector escapes the supporting rods, so that the pitch interval can be minimized, whereby it can load the compact semiconductor substrate to the boat, the amount of the substrate treatment can be improved and thus the productivity thereof can be improved.
Description
- 1. Field of the Invention
- The present invention relates to a holder manufacturing method for loading a substrate of a semiconductor manufacturing device, a batch type boat having the holder, a loading/unloading method of a semiconductor substrate using the same, and a semiconductor manufacturing device having the same.
- 2. Description of the Prior Art
- Generally, a semiconductor manufacturing device for treating the semiconductor substrate divides into a batch type including a boat for loading substrates in bulk therein in order to improve the processing capacity and a single wafer type for treating the process one by one in order to extremely decrease the processing time.
- In these processes, since the process time is consumed in order to increase or decrease the processing temperature, a semiconductor manufacturing device of the batch type is generally used in the manufacturing process thereof, especially a process of high temperature.
-
FIG. 1A is an explanatory view illustrating an external appearance of a semiconductor manufacturing device including a batch type boat for loading a plurality of semiconductor substrates. - Referring to
FIG. 1A , the conventional semiconductor manufacturing device of the batch type includes a reaction chamber of a tubular type for treating the semiconductor manufacturing process having a receiving space therein and an opening portion at lower portion thereof, and a boat 1 for loading the substrate and stacking the plurality of semiconductor substrates vertically. - Here, the
semiconductor substrates 100 located at acassette 3 mounted on a stage are transferred to the boat 1 through an end-effector 2. - The boat 1 includes the
plural boat frames 4 of a pole type, a plurality of supporting grooves (slits) formed along theboat frames 4 at a predetermined interval, and a plurality of holders 7 for loading the semiconductor substrates inserted in the supporting grooves. - At this time, the boat 1 further includes a front opening
portion 5 in regard to the working path (drawing in and out) of the end-effector 2 through the boat frame (noteFIG. 1B ). - That is, the
boat frame 4 occupies a half circle on the circumference thereof and thefront opening portion 5 occupies the remaining portion in order to allow the loading/unloading of thesemiconductor substrate 100. - Also, the boat 1 further includes a boat cap capable of supporting the lower portion thereof and opening and closing the opening portion of the reaction chamber. The boat 1, in which the loading operation is completed, is putted into the reaction chamber through a lifting up and down device.
- Generally, the holder 7 for supporting the
semiconductor substrate 100 is mounted on the boat 1. - That is, it is necessary to mount the holder 7 on account of the characteristic of the heat treatment and the large diameter of the semiconductor substrate. Since the transformation of the semiconductor substrate starts at about 750° c. and the temperature of the reaction chamber is beyond the temperature, it is necessary to locally support 0.7 R (Radius) of the semiconductor substrate so as to prevent its fall.
- More concretely, the semiconductor process in the reaction chamber includes the heat treatment process. For example, there are a deposition process, a heat treatment process for removing a COP (crystal originated particle), a diffusion process (well drive-in) for diffusing the dopant added to the semiconductor for doping into the semiconductor substrate, a oxide forming process of the semiconductor substrate and a SOI heat treatment process and so on. At this time, the environment of high temperature is required.
- The large diameter (about 12 inch) of the semiconductor substrate is positively performed in order to improve the productivity of the semiconductor. Also, the supporting method of the semiconductor substrate is changed in the heat treatment process according to the process of the high temperature and the large aperture.
- That is, since the transformation of the semiconductor substrate starts at about 750° c., the local support on the circumference of the wafer in the
boat 2 brings about the fall of the semiconductor substrate. - Especially, in the course of the heat treatment process, a slip, which is a crystallization defect of a silicon lattice of the semiconductor substrate, can be more easily occurred on account of the large aperture of the wafer. In order to prevent this problem, the holder is used. The holder supports the lower portion located at 0.7 R (Radius) of the semiconductor substrate thereon so as to prevent its fall.
- The material of the holder 7 is made of a ceramic type for example, a silicon carbide (SiC) so as to cope with the environment of high temperature and the chemical environment of the reaction process. Also, a supporting
ring 9 for a target-support of the 0.7 R is formed at the supportingpanel 8 of a circular plate type similar to the shape of the semiconductor substrate - However, the conventional holder 7 brings about the manufacturing inconvenience on account of the manufacturing difficulty of the holder itself. Also, in order to supplement it, a peripheral device is used. However, there are various problems owing to the complexity of the peripheral device and so on.
-
FIG. 2 is a conceptual view illustrating a manufacturing method of the conventional holder. As shown inFIG. 2 a as one example, the silicon carbide is mixed with a binder and it is precisely molded in the form of a holder. Here, since the binder includes impurities, the silicon carbide is coated on the mold surface of the holder type to complete the holder operation. - As shown in
FIG. 2 b as another example, the silicon carbide is thickly coated on a molding panel of a circular plate type and its circumference is cut and then, the molding panel (graphite) is incinerated. Thereafter, in order to form the supportingring 9 on the silicon carbide panel, it is precisely treated again to complete the holder. - However, since the manufacturing methods of the conventional holder uses the silicon carbide of a high-price, there is a problem in that the productivity of semiconductor manufacturing device is deteriorated.
- Also, the height of the supporting
ring 9 is restricted on account of the occupying space of the supportingpanel 8 and the supportingring 9 of the holder. - Especially, where the
semiconductor substrate 100 is seated on the holder 7, the holder 7 andsemiconductor substrate 100 have one occupying space and it is necessary to consider the pitch of one unit and the working space of the end-effector 2 together. - In the batch type boat, the compact arrangement capable of minimizing the pitch is linked with the productivity (amount of the substrate treatment) of the
semiconductor substrate 100. - As shown in
FIG. 3 , since the thickness of the holder 7 itself, that is, the thickness of the supportingpanel 8 and the thickness of the supportingring 9 and the working space “a” of the end-effector 2 of a robot arm between the holders 7 are ensured together, the pitch is increased, thereby decreasing the amount of the substrate treatment. - This problem is occurred in the top-edge-grip manner (
FIG. 3 a) and the bottom-lift manner (FIG. 3 b) together. In order to load/unload thesemiconductor substrate 100, it is necessary to ensure any thickness for ensuring the strength. At this time, it is also, necessary to ensure the working space “a” for inserting the end-effector 2 between the holders 7. - In case of the top-edge-grip type, the working space “a” for drawing in and out the end-
effector 2 and the height of the supportingring 9 for the working space of the grip should be ensured. - Accordingly, the total pitch “P” is the sum of the total thickness of the end-
effector 2, the working space “a”, the thickness of thesemiconductor substrate 100, the thickness of the supportingring 9 and the thickness of the supporting panel 8 (noteFIG. 3A ). - In the meantime, in case of the bottom-lift type using the end-
effector 2 of an U-shape, because the end-effector 2 is inserted between the supportingrings 9, the supportingring 9 should be formed at a height providing the allowing space “a” equal to the total height of the end-effector 2. Accordingly, the pitch “P” is the sum of the lifting height and the thickness of the supporting panel (noteFIG. 3B ). - In the aspect of the working speed of the bottom-lift type, since the insertion process to the lower portion of the semiconductor substrate, the lifting process and the drawing-out process are performed in turns, the working speed is quickly and the gain of the pitch can be obtained in comparison with the top-edge-grip type. However, in case of using the silicon carbide so as to cope with the process of high-temperature, there is a problem in that the molding process for ensuring the height of the supporting ring is difficulty.
- After all, the holder itself is complicated and the holder 7 having the supporting ring for performing the support of 0.7 R is required in the process of high-temperature for a large-diameter semiconductor, there are problems in that the manufacturing cost is high, the manufacturing process thereof is inconvenient and the productivity thereof is lowered.
- Accordingly, the present invention has been made to solve the above-mentioned problems occurring in the prior art, and an object of the present invention is to provide a holder manufacturing method for loading a substrate of a semiconductor manufacturing device capable of simply manufacturing the holder.
- Another object of the present invention is to provide a batch type boat having the holder, in that the manufacture thereof is simple by means of a holder ring and the holder ring is supported on supporting rods and an end-effector escapes the supporting rods, so that the pitch interval can be minimized, whereby it can load the compact semiconductor substrate to the boat, the amount of the substrate treatment can be improved and thus the productivity thereof can be improved.
- Further another object of the present invention is to provide a loading/unloading method of the semiconductor substrate using the batch type boat and a semiconductor manufacturing device having the batch type boat.
- To accomplish the objects, the present invention provides a manufacturing method of a holder of a boat for loading a semiconductor substrate comprising the steps of: molding a holder substrate of a pipe shape having inner and outer circumference of a predetermined size in such a manner that a lower portion of the semiconductor substrate is seated thereon; and forming a plurality of holder rings by cutting the holder rings from the holder substrate in such a manner that each holder ring is matched to a disposal interval of the semiconductor substrates in the boat.
- To accomplish the objects, the present invention provides a loading/unloading method of a semiconductor substrate comprising the steps of protruding supporting rods from a boat frame of a batch type boat for treating the semiconductor substrate in bulk; supporting holder rings on the supporting rods; supporting a lower portion of the semiconductor substrate on a circular girth of each holder ring; preparing the end-effector for allowing a occupying space of the supporting rod; and loading/unloading the plurality of semiconductor substrates toward the batch type boat having a pitch interval except for a thickness of the supporting rod through the end-effector.
- To accomplish the objects, the present invention provides a batch type boat for loading a semiconductor substrate of a semiconductor manufacturing device comprising: a plurality of supporting rods supporting a lower portion of the semiconductor substrate and formed at a boat frame of the boat for loading/unloading the semiconductor substrate; and a plurality of holder rings mounted on the supporting rods.
- To accomplish the objects, the present invention provides semiconductor manufacturing device having a batch type boat for mounting and treating a semiconductor substrate in bulk and an end-effector of a robot arm for loading/unloading the semiconductor substrate to the batch type boat comprising: a plurality of holder rings for supporting a lower portion of the semiconductor substrate on a circular girth thereof; a plurality of supporting rods supporting the semiconductor substrate by means of each holder ring and protruded from the boat frame in order to provide the working space of the end-effector, the end-effector for escaping an interference with the supporting rods located at a space between the holder rings vertically adjacent to each other; and the batch type boat having any pitch interval except for a thickness of the supporting
rod 16 in order to support the holder ring by means of the supporting rod and the end-effector. - The above as well as the other objects, features and advantages of the present invention will be more apparent from the following detailed description taken in conjunction with the accompanying drawings, in which:
-
FIG. 1A andFIG. 1B are explanatory views illustrating external appearances of conventional semiconductor manufacturing device including a batch type boat for loading a plurality of semiconductor substrates; -
FIG. 2A andFIG. 2B are conceptual views illustrating manufacturing methods of the conventional holder; -
FIG. 3A andFIG. 3B are explanatory views illustrating working statuses of a conventional end-effector; -
FIG. 4A andFIG. 4B are conceptual views illustrating manufacturing methods of a holder ring according to the present invention; -
FIG. 5 is an explanatory view illustrating an external appearance of a semiconductor manufacturing device including a batch type boat having holder rings and an end-effector of a top-edge-grip type according to one embodiment of the present invention; -
FIG. 6 is plan and side views ofFIG. 5 ; -
FIG. 7 is an explanatory view illustrating the external appearance of a semiconductor manufacturing device including a batch type boat having the holder rings and an end-effector of a bottom-lift type according to another embodiment of the present invention; and -
FIG. 8 is plan and side views ofFIG. 7 . - A preferred embodiment of the invention will be described in detail below with reference to the accompanying drawings.
-
FIG. 4 is a conceptual view illustrating a manufacturing method of a holder ring according to the present invention.FIG. 5 is an explanatory view illustrating the external appearance of a semiconductor manufacturing device including a batch type boat having the holder rings and an end-effector of a top-edge-grip type according to one embodiment of the present invention.FIG. 6 is plan and side views ofFIG. 5 . - Also,
FIG. 7 is an explanatory view illustrating the external appearance of a semiconductor manufacturing device including a batch type boat having the holder rings and an end-effector of a bottom-lift type according to another embodiment of the present invention.FIG. 8 is plan and side views ofFIG. 7 . - Firstly, as shown in
FIG. 4 , a holder according to the present invention includes a supporting panel of a circular plate type and a plurality of holder rings for safely seating each lower portion of semiconductor substrates disposing thereon and integrally formed on the supporting panel. - A manufacturing method of the holder of the boat for loading the
semiconductor substrate 100 includes the steps of forming aholder substrate 10 of a pipe shape having inner and outer circumference of a predetermined size in such a manner that the lower portion of thesemiconductor substrate 100 is seated thereon, and forming a plurality of holder rings 12 by cutting the holder rings 12 from theholder substrate 12 in such a manner that each holder ring is matched to a disposal interval of thesemiconductor substrates 100 in theboat 20. - Here, as shown in
FIG. 4 a, in the manufacturing method of theholder ring 12 according to one embodiment of the present invention, theholder substrate 10 of the pipe shape is powder-molded through a silicon carbide powder and the silicon carbide is also, coated on the cut holder rings 12. - Also, as shown in
FIG. 4 b, in the manufacturing method of theholder ring 12 according to another embodiment of the present invention, theholder substrate 10 of the pipe shape is molded by coating the silicon carbide on agraphite molding rod 14 and thegraphite molding rod 14 is removed from theholder substrate 10 and then, theholder substrate 10 is cut. - In the
holder ring 12 manufactured by the above methods, the lower portion of thesemiconductor substrate 100 is supported on the circular girth thereof as described above. Here, with the mounting of theholder ring 12, the manufacturing of the holder is simple and the gain of the pitch thereof is obtained. - A loading/unloading method of the
semiconductor substrate 100 using theholder ring 12 according to the present invention includes the steps of protruding supportingrods 16 from a boat frame of thebatch type boat 20 for treating thesemiconductor substrate 100 in bulk, supporting the holder rings 12 on the supportingrods 16, supporting the 0.7 R lower portion of thesemiconductor substrate 100 on the circular girth of eachholder ring 12, preparing the end-effector 18 for allowing (escaping) a occupying space of the supportingrod 16 in its planar view and a vertical occupying space (thickness) of the supportingrod 16 having any thickness secured by the supporting of theholder ring 12, and loading/unloading the plurality ofsemiconductor substrates 100 toward thebatch type boat 12 having a pitch interval except for the thickness of the supportingrod 16 through the end-effector 18. - As shown in
FIG. 5 andFIG. 6 , in the loading/unloading method of thesemiconductor substrate 100 according to one embodiment of the present invention, in order to allow the occupying space of the supportingload 16 through the end-effector 18, the supportingrods 16 are internally protruded from theboat frame 22 located at the outside of theholder ring 12 in such a manner that theholder ring 12 is divided equally at an angle of 120 degrees to support theholder ring 12 by three spots, the lower space of thesemiconductor substrate 100 is closed by the supportingrods 16 for interfering in theholder ring 12 and the outside space of theholder ring 12, and the upper space of thesemiconductor substrate 100 except for the occupying space of the supportingrod 16 is exposed to outside, in order to perform the loading/unloading of thesemiconductor substrate 100 by means of the end-effector 18 of the top-edge-grip type. Here, the end-effector 18 has a width for inserting between two supportingrods 16 protruded on both sides in regard to the working path in its planar view and an escape groove for escaping the interference of the remaining one supportingrod 16 protruded in the inner direction in regard to the working path in its planar view. - As shown in
FIG. 7 andFIG. 8 , in the loading/unloading method of thesemiconductor substrate 100 according to another embodiment of the present invention, in order to allow the occupying space of the supportingload 16 through the end-effector 18, a pair of the supportingrods 16 is penetrated through the inner circumference of theholder ring 12 at the lower portion thereof in the direction of the working path of the end-effector 18 in such a manner that theholder ring 12 is supported on the supporting rods by four spots, thus a space between the lower portion of thesemiconductor substrate 100 and theadjacent semiconductor substrate 100 down is exposed, whereby the loading/unloading of the semiconductor substrate is performed by means of the end-effector 18 of the bottom-lift type having a holderring receiving groove 26 of a U-shape for receiving theholder ring 12. - Also, as shown in
FIG. 5 throughFIG. 8 , a boat for loading a semiconductor substrate of a batch type semiconductor manufacturing device includes a plurality of supportingrods 16 for supporting the lower portion of thesemiconductor substrate 100 formed at theboat frame 22 of theboat 20 for loading/unloading thesemiconductor substrate 100, and a plurality of holder rings 12 mounted on the supportingrods 16 and cut from theholder substrate 10 of a pipe shape having inner and outer circumference of a predetermined size for seating the lower portion of thesemiconductor substrate 100 in such a manner that eachholder ring 12 is matched to a disposal interval of thesemiconductor substrates 100 in theboat 20. - Moreover, a semiconductor manufacturing device having the
batch type boat 20 for mounting and treating thesemiconductor substrate 100 in bulk and the end-effector 18 of a robot arm for loading/unloading thesemiconductor substrate 20 to thebatch type boat 20 comprises the holder rings 12 for supporting the lower portion of thesemiconductor substrate 100 on the circular girth thereof, the supportingrods 16 supporting thesemiconductor substrate 100 by means of eachholder ring 12 and protruded from theboat frame 22 in order to provide the working space of the end-effector 18, the end-effector 18 for escaping the interference with the supportingrods 16 located at a space between theholder ring 12 vertically adjacent to each other, and thebatch type boat 20 having any pitch interval except for the thickness of the supportingrod 16 in order to support the holder ring by means of the supportingrod 16 and the end-effector 18. - As shown in
FIG. 5 andFIG. 6 , in order to secure the drawing out and in path toward theboat 20 for the loading/unloading of thesemiconductor substrate 100, the supportingrods 16 are internally and radially protruded from theboat frame 22 having a front opening portion, thus the end-effector 18 of the top-edge-grip type has a width for inserting between two supportingrods 16 protruded on both sides in regard to the working path in its planar view and theescape groove 24 for receiving the remaining one supportingrod 16 protruded in the inner direction in regard to the working path and gripping thesemiconductor substrate 100 in such a manner that the working is performed in the internal space of theholder ring 12 capable of escaping the planar occupying space of the supportingrod 16 in a case that the outer space of theholder ring 12 is occupied by the supportingrod 16. - Here, the
holder ring 12 is divided equally at an angle of 120 degrees to support theholder ring 12 on the supportingrods 16 by three spots. - That is, the supporting
rods 16 are protruded from theboat frame 22 toward the three spots of the lower portion of the circumference of eachholder ring 12 divided equally at an angle of 120 degrees. Accordingly, where thesemiconductor substrate 100 is drawn out and in, an openingportion 28 is formed in such a manner that the interval between two spots protruded from both side of theboat frame 22 having thefront opening portion 5 is larger than the width of the end-effector in regard to the working path thereof, so that the working can be easily performed. - As shown in
FIG. 7 andFIG. 8 , in the end-effector of the bottom-lift type according to another embodiment of the present invention, a pair of the supportingrods 16 is penetrated through the inner circumference of theholder ring 12 in such a manner that theholder ring 12 is supported on the supporting rods by four spots, thus the end-effector 18 includes the holderring receiving groove 26 having any size for receiving theholder ring 12 in such a manner that the working is performed between the exposed holder rings 12 in a case that the inner space of theholder ring 12 is occupied by the supportingrod 16. - Also, a pair of the boat frames 22 is formed at the extension line of the working path of the end-
effector 18 and a pair of the supportingrods 16 is penetrated through the inner circumference of theholder ring 12 at the boat frames 22. - Here, the
holder ring 12, theboat frame 22 and the supportingrod 16 are made of the silicon carbide or its equivalents. - In the meantime, the
holder ring 12, theboat frame 22 and the supportingrod 16 can be made of quartz. Also, the present invention may be applied to the semiconductor manufacturing device except for a process of a high temperature on account of the manufacturing convenience and the gain of the pitch thereof. - As described above, the present invention is provided to a simple semiconductor manufacturing method and a device thereof in that the capacity of the substrate treatment is improved and the manufacturing method is simple by means of the batch type boat having a compact pitch interval and a simple holder.
- Accordingly, the holder according to the present invention having supporting rings integrally molded therein and supporting 0.7 R of the
semiconductor substrate 100 includes the holder rings 12 having only supporting ring to the exclusion of the supporting panel, theboat 20 for supporting the holder rings 12 therein, and the supportingrods 16 having no effect on the pitch interval, whereby ensuring the compact pitch interval. - The present invention is divided into two embodiments according to the supporting manner of the
holder ring 12 through the supportingrod 16 and the structure of the end-effector 18 corresponding to theholder ring 12. Firstly, theholder ring 12 according to one embodiment of the present invention is manufactured by the manufacturing method ofFIG. 4 . -
FIG. 4A illustrates the manufacturing method of the holder ring according to one embodiment of the present invention in that theholder substrate 10 of the pipe shape is powder-molded through the silicon carbide powder, theholder substrate 10 is cut to any thickness of the holder ring, and then the silicon carbide is coated on the cut holder rings 12. - Also,
FIG. 4B illustrates the manufacturing method of the holder ring according to second embodiment of the present invention, in that theholder substrate 10 of the pipe shape is molded by coating the silicon carbide on agraphite molding rod 14 and thegraphite molding rod 14 is removed from theholder substrate 10 and then, theholder substrate 10 is cut. - Accordingly, since the holder rings 12 are cut from the
holder substrate 10 of the pipe shape, the separate molding instrument for individually manufacturing the conventional holder is unnecessary. Also, because the conventional process such as the cutting molding and so on is deleted, the productivity of the holder can be maximized. - According to the providing of the
holder ring 12, the plurality of supportingrods 16 for supporting the lower portion of thesemiconductor substrate 100 is formed at theboat frame 22 of theboat 20 for loading/unloading thesemiconductor substrate 100 and theboat 20 for loading thesemiconductor substrate 10 of the batch type semiconductor manufacturing device and having the holder rings 12 is provided. - Concretely, the function of the supporting panel of the conventional holder is performed by the
boat 20 of the present invention. On this account, the holder rings 12 are arranged at the boat through the supportingrods 16. - That is, the supporting
rods 16 are mounted on theboat frame 22 of theboat 20 and protruded toward the inside of theboat 20 owing to the inside disposal of theholder ring 12 in theboat 20. - Also, a
seating groove 30 for seating theholder ring 12 is formed at the upper end of the supportingrod 16. That is, theholder ring 12 is inserted into theseating groove 30 to ensure the supporting location (noteFIG. 6 andFIG. 8 ). - The supporting
rod 16 of the present invention is divided into two embodiments according to the supporting manner. - As shown in
FIG. 5 andFIG. 6 , the end-effector 18 of the top-edge-grip type according to one embodiment of the present invention is adopted to the semiconductor substrate 200 through the supportingrod 16 occupying the outer area of theholder ring 12. That is, the loading/unloading operation is performed in the inside of the space occupied by the supportingrod 16 located at the upper portion of thesemiconductor substrate 100. - Here, the supporting
rods 16 are protruded from theboat frame 22 and the lower portion of the circumference of eachholder ring 12 is divided equally and supported thereon. - The
boat frame 22 is formed at the semi-circumference in order to form thefront opening portion 5 as described above. Here, when three supportingrods 16 are protruded in the central direction, since theholder ring 12 is supported on the supporting rods by three spots in the semi-circumference thereof, the support of theholder ring 12 can be unstable. - Accordingly, both supporting
rods 16 protruded from theboat frame 22 located at the front opening portion are slanted radially and divided equally at an angle of 120 degrees from the other supportingrod 16 located at the center line of the working path, in order to stably support theholder ring 12. - Accordingly, the
holder ring 12 can be stably supported on the three supporting rods. - By means of the supporting
rods 16 and theholder ring 12, the lower space of thesemiconductor substrate 100 is closed and the upper space of thesemiconductor substrate 100 except for the supportingrods 16 is opened to outside. - Concretely, the outer space of the
holder ring 12 is occupied by the two supportingrods 16 and is interfered by oneprotruded supporting rod 16 at the center line in regard to the drawing out and in path in its planar view. - Therefore, it is necessary to adopt the end-
effector 18 of the top-edge-grip type. The end-effector 18 of the top-edge-grip type has the width for inserting between two supportingrods 16 protruded on both sides in regard to the working path and theescape groove 24 for receiving the remaining one supportingrod 16 protruded in the inner direction in regard to the working path and gripping thesemiconductor substrate 100. - By means of the supporting
rods 16 and the end-effector 18 of the top-edge-grip type, it is unnecessary to consider the thickness of the supportingrod 16 as well as ensure the height (thickness) of the holder ring for gripping thesemiconductor substrate 100 on the supportingrods 16. - That is, as shown in
FIG. 6 , the pitch “P” is the interval between holder rings 12. Here, since the end-effector 18 escapes the supportingrod 16, the working space “a” of the end-effector 18 is settled by theholder ring 12 and thesemiconductor substrate 100. - Also, when the grip of the end-
effector 18 goes down, it can escape the interference with the supportingrod 16 owing to theescape groove 24, thereby minimizing the thickness of theholder ring 12. Accordingly, the pitch interval is determined by the minimized thickness (about 1 mm: including insertion thickness of the seating groove 30), the thickness (about 1 mm) of thesemiconductor substrate 100 and the working space (about 3.5 mm) of the end-effector 18. - Here, in a case that the end-
effector 18 does not escape the supportingrod 16, it is approximately doubled in pitch. For example, in order to ensure its strength, since the supportingrod 16 is protruded from the supporting frame occupying the most external angle of theboat 20 to the lower portion of theholder ring 12 supporting 0.7 R thereof, the predetermined thickness (about 4-5 mm) for supporting and the added height of theholder ring 12 for working space of the grip are necessary. - Also, the supporting panel and the holder having the supporting ring are applied in the same manner as described above.
- Accordingly, it can be seen that the difference can be surely occurred in productivity in the reaction chambers having the same working space according to yes or no of the escape of the occupying space of the supporting
rod 16. - In the meantime,
FIG. 7 andFIG. 8 illustrate the end-effector of the bottom-lift type according to another embodiment of the present invention. That is, since the lower portion (outer space) of thesemiconductor substrate 100 is exposed to outside through theholder ring 12 and the supportingrods 16 occupying the inside of theholder ring 12, the end-effector of the bottom-lift type is adopted. - That is, the pair of the supporting
rods 16 is penetrated through the inner circumference of theholder ring 12 at the lower portion thereof in the direction of the working path of the end-effector 18, so that theholder ring 12 is supported on the supportingrods 16 by four spots. - Preferably, it inscribes a regular square in the central circumference of the
holder ring 12, so that the outside of theholder ring 12 is open to the working space of the end-effector 18. - Accordingly, the
holder ring 12 is stably supported on the supportingrods 16 and it can obtain more rapid loading/unloading of thesemiconductor substrate 100 and the gain of pitch by means of the end-effector of the bottom-lift type. - The end-
effector 18 of the bottom-lift type has the holderring receiving groove 26 of a U-shape for receiving theholder ring 12, so that it is unnecessary to consider the thickness of the supportingrod 16 as the pitch thereof. - That is, as shown in
FIG. 8 , the pitch “P” is the interval between holder rings 12. Here, since the end-effector 18 escapes the supportingrod 16 in its planar view, the working space “a” of the end-effector 18 is settled by theholder ring 12 and thesemiconductor substrate 100. - Moreover, since the grip protruded down as in the end-
effector 18 of the top-edge-grip type does not exist, the gain of the pitch is larger than that of one embodiment of the present invention. Furthermore, because the working time of the grip is unnecessary in the course of the loading/unloading, the working speed can be quickly. - Here, since the
holder ring 12 is supported on the supportingrods 16 by four spots, not three spots, the processing details of the supportingrod 16 is required. - Accordingly, it considers the thickness of the
holder ring 12, the thickness of thesemiconductor substrate 100 and the working space of the end-effector between the holder rings 12 as the pitch and the thickness of theholder ring 12 for supporting thesemiconductor substrate 100 can be minimized, thereby obtaining a plenty of holder rings from one holder substrate and a compact arrangement. - As can be seen from the foregoing, in the holder manufacturing method for loading the substrate of the semiconductor manufacturing device, the batch type boat having the holder, a loading/unloading method of a semiconductor substrate using the same, and a semiconductor manufacturing device having the same, there are effects in that the manufacture of the holder and the batch type boat are simple by means of the holder ring, the holder ring is supported on supporting rods and the end-effector escapes the supporting rods, so that the pitch interval can be minimized, whereby it can load the compact semiconductor substrate to the boat, the amount of the substrate treatment can be improved and thus the productivity thereof can be improved.
- While this invention has been described in connection with what are presently considered to be the most practical and preferred embodiments, it is to be understood that the invention is not limited to the disclosed embodiments and the drawings, but, on the contrary, it is intended to cover various modifications and variations within the spirit and scope of the appended claims.
Claims (4)
1-15. (canceled)
16. A manufacturing method of a holder of a boat for loading a semiconductor substrate comprising the steps of:
molding a holder substrate of a pipe shape having inner and outer circumference of a predetermined size in such a manner that a lower portion of the semiconductor substrate is seated thereon; and
forming a plurality of holder rings by cutting the holder rings from the holder substrate in such a manner that each holder ring is matched to a disposal interval of the semiconductor substrates in the boat.
17. A manufacturing method as claimed in claim 16 , wherein the holder substrate of the pipe shape is powder-molded through a silicon carbide powder and a silicon carbide is coated on the cut holder rings.
18. A manufacturing method as claimed in claim 16 , wherein the holder substrate of the pipe shape is molded by coating a silicon carbide on a graphite molding rod of a pipe shape and the graphite molding rod is removed from the holder substrate and then, the holder substrate is cut to manufacture the holder rings.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US13/107,691 US20110217461A1 (en) | 2005-04-25 | 2011-05-13 | Manufacturing method of a holder of a boat for loading a substrate |
Applications Claiming Priority (6)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR10-2005-0033906 | 2005-04-25 | ||
KR1020050033906A KR100657502B1 (en) | 2005-04-25 | 2005-04-25 | Wafer-Holder Manufaturing Method and Wafer-Holder-Boat for Semiconductor |
KR10-2005-0119392 | 2005-12-08 | ||
KR1020050119392A KR100772462B1 (en) | 2005-12-08 | 2005-12-08 | Wafer Manufaturing Method and Wafer Manufaturing Apparatus |
US11/410,583 US7963735B2 (en) | 2005-04-25 | 2006-04-25 | Holder manufacturing method for loading substrate of semiconductor manufacturing device, batch type boat having holder, loading/unloading method of semiconductor substrate using the same, and semiconductor manufacturing device having the same |
US13/107,691 US20110217461A1 (en) | 2005-04-25 | 2011-05-13 | Manufacturing method of a holder of a boat for loading a substrate |
Related Parent Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
US11/410,583 Division US7963735B2 (en) | 2005-04-25 | 2006-04-25 | Holder manufacturing method for loading substrate of semiconductor manufacturing device, batch type boat having holder, loading/unloading method of semiconductor substrate using the same, and semiconductor manufacturing device having the same |
Publications (1)
Publication Number | Publication Date |
---|---|
US20110217461A1 true US20110217461A1 (en) | 2011-09-08 |
Family
ID=37187094
Family Applications (2)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
US11/410,583 Active 2029-10-20 US7963735B2 (en) | 2005-04-25 | 2006-04-25 | Holder manufacturing method for loading substrate of semiconductor manufacturing device, batch type boat having holder, loading/unloading method of semiconductor substrate using the same, and semiconductor manufacturing device having the same |
US13/107,691 Abandoned US20110217461A1 (en) | 2005-04-25 | 2011-05-13 | Manufacturing method of a holder of a boat for loading a substrate |
Family Applications Before (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
US11/410,583 Active 2029-10-20 US7963735B2 (en) | 2005-04-25 | 2006-04-25 | Holder manufacturing method for loading substrate of semiconductor manufacturing device, batch type boat having holder, loading/unloading method of semiconductor substrate using the same, and semiconductor manufacturing device having the same |
Country Status (3)
Country | Link |
---|---|
US (2) | US7963735B2 (en) |
JP (2) | JP4619984B2 (en) |
TW (2) | TWI346989B (en) |
Families Citing this family (12)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR100942066B1 (en) * | 2008-04-30 | 2010-02-11 | 주식회사 테라세미콘 | Holder Stage |
JP5456287B2 (en) * | 2008-09-05 | 2014-03-26 | 東京エレクトロン株式会社 | Vertical heat treatment equipment |
JP2010272683A (en) * | 2009-05-21 | 2010-12-02 | Covalent Materials Corp | Vertical wafer boat |
WO2012167285A1 (en) | 2011-06-03 | 2012-12-06 | Tel Nexx, Inc. | Parallel single substrate processing system |
US8556566B1 (en) * | 2011-09-30 | 2013-10-15 | WD Media, LLC | Disk stacking method and apparatus |
KR101990533B1 (en) * | 2012-11-06 | 2019-09-30 | 주식회사 원익아이피에스 | Batch type semiconductor manufacturing device |
CN103693343B (en) * | 2014-01-02 | 2016-01-06 | 北京七星华创电子股份有限公司 | A kind of multilayered memory table apparatus |
US9427818B2 (en) | 2014-01-20 | 2016-08-30 | Taiwan Semiconductor Manufacturing Company, Ltd. | Semiconductor processing boat design with pressure sensor |
JP6832720B2 (en) * | 2017-01-25 | 2021-02-24 | 株式会社日本マイクロニクス | Chucking device and chucking method |
JP7347267B2 (en) * | 2020-03-03 | 2023-09-20 | 三菱電機株式会社 | semiconductor manufacturing equipment |
CN113930730A (en) * | 2021-08-31 | 2022-01-14 | 安庆帝伯格茨活塞环有限公司 | Piston ring side diamond-like carbon film processing technology and tool assembly thereof |
CN114433496A (en) * | 2022-04-02 | 2022-05-06 | 山东泓瑞光电科技有限公司 | Control method and device for LED and semiconductor laser chip silicon wafer conveying device |
Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4761134A (en) * | 1987-03-30 | 1988-08-02 | Norton Company | Silicon carbide diffusion furnace components with an impervious coating thereon |
US6799940B2 (en) * | 2002-12-05 | 2004-10-05 | Tokyo Electron Limited | Removable semiconductor wafer susceptor |
US20050123713A1 (en) * | 2003-12-05 | 2005-06-09 | Forrest David T. | Articles formed by chemical vapor deposition and methods for their manufacture |
Family Cites Families (18)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5275521A (en) * | 1991-07-03 | 1994-01-04 | Tokyo Electron Sagami Limited | Wafer transfer device |
US5409348A (en) * | 1992-05-15 | 1995-04-25 | Tokyo Electron Limited | Substrate transfer method |
JP3245246B2 (en) * | 1993-01-27 | 2002-01-07 | 東京エレクトロン株式会社 | Heat treatment equipment |
US5458688A (en) * | 1993-03-09 | 1995-10-17 | Tokyo Electron Kabushiki Kaisha | Heat treatment boat |
JP3328763B2 (en) * | 1995-10-30 | 2002-09-30 | エヌティティエレクトロニクス株式会社 | Wafer support structure for vertical wafer boat |
JPH09199438A (en) * | 1996-01-12 | 1997-07-31 | Tokyo Electron Ltd | Heat treating jig |
US6156121A (en) * | 1996-12-19 | 2000-12-05 | Tokyo Electron Limited | Wafer boat and film formation method |
US6190113B1 (en) * | 1997-04-30 | 2001-02-20 | Applied Materials, Inc. | Quartz pin lift for single wafer chemical vapor deposition/etch process chamber |
JPH11176822A (en) * | 1997-12-05 | 1999-07-02 | Hitachi Ltd | Semiconductor treating equipment |
US6174011B1 (en) * | 1999-04-14 | 2001-01-16 | Arthur Keigler | Method of and apparatus for handling thin and flat workpieces and the like |
JP2001313267A (en) * | 2000-04-28 | 2001-11-09 | Asahi Glass Co Ltd | Heat treating boat |
JP2003059851A (en) * | 2001-08-17 | 2003-02-28 | Asahi Glass Co Ltd | Wafer support body and boat for heat treatment using the same |
US6761085B1 (en) * | 2002-02-06 | 2004-07-13 | Novellus Systems Incorporated | Method and apparatus for damping vibrations in a semiconductor wafer handling arm |
JP2003338531A (en) * | 2002-05-20 | 2003-11-28 | Toshiba Ceramics Co Ltd | Carrier and thermal treatment device of semiconductor wafer |
KR100496134B1 (en) | 2002-09-12 | 2005-06-20 | 주식회사 테라세미콘 | Wafer holder for ultra-high temperature process, wafer loading boat and ultra-high temperature furnace having the wafer holder |
JP2005086132A (en) * | 2003-09-11 | 2005-03-31 | Hitachi Kokusai Electric Inc | Heat treating apparatus, manufacturing method of semiconductor device, manufacturing method of substrate, and treating method of substrate |
KR100657501B1 (en) | 2004-08-19 | 2006-12-13 | 주식회사 테라세미콘 | Wafer Supporting Method and Wafer Holder for High-Temperature Semiconductor-Manufacture-Line |
JP5456287B2 (en) * | 2008-09-05 | 2014-03-26 | 東京エレクトロン株式会社 | Vertical heat treatment equipment |
-
2006
- 2006-04-21 TW TW095114456A patent/TWI346989B/en not_active IP Right Cessation
- 2006-04-21 JP JP2006117886A patent/JP4619984B2/en not_active Expired - Fee Related
- 2006-04-21 TW TW099142247A patent/TW201115675A/en unknown
- 2006-04-25 US US11/410,583 patent/US7963735B2/en active Active
-
2010
- 2010-04-05 JP JP2010087286A patent/JP5059157B2/en not_active Expired - Fee Related
-
2011
- 2011-05-13 US US13/107,691 patent/US20110217461A1/en not_active Abandoned
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4761134A (en) * | 1987-03-30 | 1988-08-02 | Norton Company | Silicon carbide diffusion furnace components with an impervious coating thereon |
US4761134B1 (en) * | 1987-03-30 | 1993-11-16 | Silicon carbide diffusion furnace components with an impervious coating thereon | |
US6799940B2 (en) * | 2002-12-05 | 2004-10-05 | Tokyo Electron Limited | Removable semiconductor wafer susceptor |
US20050123713A1 (en) * | 2003-12-05 | 2005-06-09 | Forrest David T. | Articles formed by chemical vapor deposition and methods for their manufacture |
Also Published As
Publication number | Publication date |
---|---|
TW201115675A (en) | 2011-05-01 |
JP2006310848A (en) | 2006-11-09 |
US7963735B2 (en) | 2011-06-21 |
JP2010251747A (en) | 2010-11-04 |
JP4619984B2 (en) | 2011-01-26 |
US20060239799A1 (en) | 2006-10-26 |
TW200705595A (en) | 2007-02-01 |
TWI346989B (en) | 2011-08-11 |
JP5059157B2 (en) | 2012-10-24 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
US7963735B2 (en) | Holder manufacturing method for loading substrate of semiconductor manufacturing device, batch type boat having holder, loading/unloading method of semiconductor substrate using the same, and semiconductor manufacturing device having the same | |
US8216379B2 (en) | Non-circular substrate holders | |
US5709543A (en) | Vertical heat treatment apparatus | |
US20090165721A1 (en) | Susceptor with Support Bosses | |
US6592675B2 (en) | Rotating susceptor | |
US20030047132A1 (en) | Susceptorless reactor for growing epitaxial layers on wafers by chemical vapor deposition | |
EP2222901A1 (en) | Epitaxial barrel susceptor having improved thickness uniformity | |
US20170350038A1 (en) | Vacuum platform with process chambers for removing carbon contaminants and surface oxide from semiconductor substrates | |
US8216920B2 (en) | Silicon epitaxial wafer and manufacturing method thereof | |
US20080308036A1 (en) | Vapor-phase growth apparatus and vapor-phase growth method | |
KR100772462B1 (en) | Wafer Manufaturing Method and Wafer Manufaturing Apparatus | |
JP7147551B2 (en) | Vapor deposition apparatus and carrier used therefor | |
CN115595552B (en) | Silicon carbide ring for plasma etching equipment and forming process of silicon carbide ring | |
KR100741859B1 (en) | Wafer Manufacturing Apparatus for High-Temperatuer Process | |
JP2001110881A (en) | Silicon carbide sleeve for substrate support assembly | |
TWI612610B (en) | Batch type substrate processing device | |
JP3440769B2 (en) | Wafer adapter | |
JP2009135258A (en) | Suscepter support shaft, and epitaxial growth system | |
KR100657502B1 (en) | Wafer-Holder Manufaturing Method and Wafer-Holder-Boat for Semiconductor | |
JPH07183222A (en) | Device and method for heat treatment | |
JP2004172374A (en) | Holding jig, manufacturing method of semiconductor wafer, and method for mounting semiconductor substrate and holding jig | |
JP2005235906A (en) | Wafer holding jig and vapor phase growing apparatus | |
JP7264038B2 (en) | Vapor deposition apparatus and vapor deposition treatment method | |
JP2010129587A (en) | Apparatus for manufacturing compound semiconductor epitaxial wafer | |
JP2003100648A (en) | Heat treatment jig of semiconductor wafer |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
STCB | Information on status: application discontinuation |
Free format text: ABANDONED -- FAILURE TO RESPOND TO AN OFFICE ACTION |