JP7347267B2 - semiconductor manufacturing equipment - Google Patents

semiconductor manufacturing equipment Download PDF

Info

Publication number
JP7347267B2
JP7347267B2 JP2020035440A JP2020035440A JP7347267B2 JP 7347267 B2 JP7347267 B2 JP 7347267B2 JP 2020035440 A JP2020035440 A JP 2020035440A JP 2020035440 A JP2020035440 A JP 2020035440A JP 7347267 B2 JP7347267 B2 JP 7347267B2
Authority
JP
Japan
Prior art keywords
wafer
semiconductor manufacturing
wafer support
transfer arm
plan
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
JP2020035440A
Other languages
Japanese (ja)
Other versions
JP2021141125A (en
Inventor
美香 奥村
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Electric Corp
Original Assignee
Mitsubishi Electric Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Electric Corp filed Critical Mitsubishi Electric Corp
Priority to JP2020035440A priority Critical patent/JP7347267B2/en
Publication of JP2021141125A publication Critical patent/JP2021141125A/en
Application granted granted Critical
Publication of JP7347267B2 publication Critical patent/JP7347267B2/en
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Images

Landscapes

  • Chemical Vapour Deposition (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)

Description

本開示は半導体製造装置に関する。 The present disclosure relates to semiconductor manufacturing equipment.

半導体装置の製造プロセスを用いて製造された表面加工型半導体加速度センサが用いられている。この加速度センサの可動構造体は、例えば縦型拡散炉を用いた厚い多結晶シリコン膜を積層させることで形成される。縦型拡散炉では、複数の半導体ウエハを縦方向に積載する縦型ウエハボートが用いられている。特許文献１には、縦型ウエハボートに挿入されたウエハが確実に均等な３点で支持されるようにしてウエハに加わる剪断応力を最小にするウエハボート技術が開示されている。 A surface-processed semiconductor acceleration sensor manufactured using a semiconductor device manufacturing process is used. The movable structure of this acceleration sensor is formed by laminating thick polycrystalline silicon films using, for example, a vertical diffusion furnace. A vertical diffusion furnace uses a vertical wafer boat on which a plurality of semiconductor wafers are vertically loaded. Patent Document 1 discloses a wafer boat technique that minimizes shear stress applied to the wafers by ensuring that wafers inserted into a vertical wafer boat are supported at three even points.

特開平０８－１０７０８０号公報Japanese Patent Application Publication No. 08-107080

ウエハの裏面を複数のウエハ支持部で支持した状態でウエハに成膜を施すと、ウエハとウエハ支持部の接触部近傍に、特に膜厚の厚い部分が形成される。この膜厚が厚い部分をデポ溜まりということがある。成膜後のウエハをウエハ移載機で搬出する際、このデポ溜まりがウエハ裏面に突起物として付着し、ウエハの平坦性を低下させる問題があった。ウエハ平坦性の低下は様々な弊害を引き起こす。例えば露光工程において、当該突起物周辺のウエハ表面側でデフォーカスによるパターン不具合が生じる。 When a film is formed on a wafer while the back surface of the wafer is supported by a plurality of wafer supports, a particularly thick portion of the film is formed near the contact area between the wafer and the wafer support. This thick part is sometimes called a deposit pool. When the wafer after film formation is carried out using a wafer transfer machine, there is a problem in that the deposits adhere to the back surface of the wafer as protrusions, reducing the flatness of the wafer. Deterioration of wafer flatness causes various adverse effects. For example, in an exposure process, pattern defects occur due to defocus on the wafer surface side around the protrusions.

本開示は、上述のような課題を解決するためになされたもので、ウエハ裏面への突起物の付着を抑制することができる半導体製造装置を提供することを目的とする。 The present disclosure has been made to solve the above-mentioned problems, and an object of the present disclosure is to provide a semiconductor manufacturing apparatus that can suppress attachment of protrusions to the back surface of a wafer.

本開示に係る半導体製造装置は、同じ高さに環状に設けられた複数のウエハ支持部を有する縦型ウエハボートと、先端部と、該先端部より幅が広く、該複数のウエハ支持部のうち最近接する２つのウエハ支持部の間の距離より大きい幅となる太幅部を有する搬送アームと、を備え、該先端部の幅は一定であり、平面視で該複数のウエハ支持部で囲まれた領域に該搬送アームがあるとき、該太幅部は該複数のウエハ支持部に囲まれ、該先端部は平面視で該最近接する２つのウエハ支持部の間に設けられることを特徴とする。
A semiconductor manufacturing apparatus according to the present disclosure includes a vertical wafer boat having a plurality of wafer support parts annularly provided at the same height; a transfer arm having a wide portion having a width larger than the distance between the two nearest wafer support portions, the width of the tip portion being constant and surrounded by the plurality of wafer support portions in plan view; When the transfer arm is located in the area where the transfer arm is located, the wide part is surrounded by the plurality of wafer support parts , and the tip part is provided between the two closest wafer support parts in plan view. shall be.

本開示のその他の特徴は以下に明らかにする。 Other features of the disclosure will be revealed below.

本開示によれば、搬送アームと、縦型ウエハボートのすべてのウエハ支持部とが近接する構成を採用したことで、ウエハ移載時にウエハ裏面への突起物の付着が抑制される。 According to the present disclosure, by adopting a configuration in which the transfer arm and all the wafer support parts of the vertical wafer boat are close to each other, adhesion of protrusions to the back surface of the wafers is suppressed during wafer transfer.

半導体製造装置の構成例を示す図である。1 is a diagram illustrating a configuration example of a semiconductor manufacturing apparatus. 搬送アームの構成例を示す平面図である。FIG. 3 is a plan view showing an example of the configuration of a transport arm. 縦型ウエハボートの構成例を示す図である。FIG. 2 is a diagram showing an example of the configuration of a vertical wafer boat. ウエハ支持部の構成例を示す図である。It is a figure showing an example of composition of a wafer support part. 半導体製造装置の使用方法を示す図である。FIG. 3 is a diagram showing how to use the semiconductor manufacturing equipment. 半導体製造装置の使用方法を示す図である。FIG. 3 is a diagram showing how to use the semiconductor manufacturing equipment. 搬送アームとウエハ支持部の位置関係を示す図である。FIG. 3 is a diagram showing the positional relationship between a transfer arm and a wafer support section. 搬送アームとウエハ支持部の位置関係を示す図である。FIG. 3 is a diagram showing the positional relationship between a transfer arm and a wafer support section. 比較例を示す図である。It is a figure showing a comparative example. デポ溜まりを示す図である。It is a figure showing a deposit accumulation. 比較例に係るウエハの断面図である。FIG. 3 is a cross-sectional view of a wafer according to a comparative example. 搬送アームの別の構成例を示す平面図である。FIG. 7 is a plan view showing another example of the configuration of the transfer arm. 搬送アームの別の構成例を示す平面図である。FIG. 7 is a plan view showing another example of the configuration of the transfer arm. 搬送アームの別の構成例を示す平面図である。FIG. 7 is a plan view showing another example of the configuration of the transfer arm.

実施の形態に係る半導体製造装置について図面を参照して説明する。同じ又は対応する構成要素には同じ符号を付し、説明の繰り返しを省略する場合がある。 A semiconductor manufacturing apparatus according to an embodiment will be described with reference to the drawings. Identical or corresponding components may be given the same reference numerals and repeated descriptions may be omitted.

実施の形態１．
図１は、半導体製造装置の構成例を示す図である。この半導体製造装置は、縦型拡散炉として提供される。この半導体製造装置はウエハ移載機４を備えている。一例によれば、ウエハ移載機４は、軸４Ｃと、軸４Ｃに固定された本体部４Ａと、本体部４Ａに固定された搬送アーム４Ｂを備えている。搬送アーム４Ｂの材料は例えばアルミナである。一例によれば、同一形状の搬送アーム４Ｂが縦方向に間隔を開けて複数設けられている。ウエハ移載機４は搬送ロボットによって任意の位置に移動可能となっている。 Embodiment 1.
FIG. 1 is a diagram showing an example of the configuration of a semiconductor manufacturing apparatus. This semiconductor manufacturing apparatus is provided as a vertical diffusion furnace. This semiconductor manufacturing apparatus is equipped with a wafer transfer machine 4. According to one example, the wafer transfer device 4 includes a shaft 4C, a main body 4A fixed to the shaft 4C, and a transfer arm 4B fixed to the main body 4A. The material of the transport arm 4B is, for example, alumina. According to one example, a plurality of transport arms 4B having the same shape are provided at intervals in the vertical direction. The wafer transfer device 4 can be moved to any position by a transfer robot.

図２は、搬送アーム４Ｂの平面図である。搬送アーム４Ｂは、先端部４ａ、太幅部４ｂ及び固定部４ｃを備えている。太幅部４ｂは平面視で円形状である。固定部４ｃは本体部４Ａに固定される部分である。この例では、太幅部４ｂは、先端部４ａと固定部４ｃよりも幅の大きい部分を有している。φ１２５ｍｍの５インチウエハを移載する場合、先端部４ａと固定部４ｃの幅は例えば７０ｍｍ程度とすることができる。この場合、太幅部４ｂの幅は７０ｍｍより大きい。 FIG. 2 is a plan view of the transport arm 4B. The transport arm 4B includes a tip portion 4a, a wide portion 4b, and a fixing portion 4c. The wide portion 4b has a circular shape in plan view. The fixed part 4c is a part fixed to the main body part 4A. In this example, the wide portion 4b has a portion wider than the tip portion 4a and the fixed portion 4c. When transferring a 5-inch wafer with a diameter of 125 mm, the width of the tip portion 4a and the fixing portion 4c can be, for example, about 70 mm. In this case, the width of the wide portion 4b is greater than 70 mm.

図１の説明に戻る。縦型ウエハボート５は、複数のウエハを縦方向に並べた状態に維持するものである。図１には、複数のウエハ１が縦型ウエハボート５に格納されたことが図示されている。 Returning to the explanation of FIG. The vertical wafer boat 5 maintains a plurality of wafers arranged vertically. FIG. 1 shows that a plurality of wafers 1 are stored in a vertical wafer boat 5. As shown in FIG.

図３は、縦型ウエハボート５の構成例を示す図である。複数の溝を有する柱状構造の１つ１つがウエハ支持部である。左側の柱状構造は、縦方向に複数のウエハ支持部３ａを有する。他の３つの柱状構造も、それぞれ縦方向に複数のウエハ支持部３ｂ、複数のウエハ支持部３ｃ、複数のウエハ支持部３ｄを有している。任意の高さに着目すれば、複数のウエハ支持部３ａ、３ｂ、３ｃ、３ｄが環状に設けられている。言いかえれば、同じ高さに複数のウエハ支持部が環状に設けられている。この例では同じ高さに４つのウエハ支持部が提供されるが、ウエハを支持できるのであれば、ウエハ支持部の数は特に限定されない。図３には、ウエハ支持部３ａ、３ｂ、３ｃ、３ｄに１枚のウエハ１が載せられたことが図示されている。このような縦型ウエハボート５の材料は例えば、石英又は炭化ケイ素である。 FIG. 3 is a diagram showing an example of the configuration of the vertical wafer boat 5. As shown in FIG. Each columnar structure having a plurality of grooves is a wafer support portion. The columnar structure on the left side has a plurality of wafer support parts 3a in the vertical direction. The other three columnar structures each have a plurality of wafer support parts 3b, a plurality of wafer support parts 3c, and a plurality of wafer support parts 3d in the vertical direction. Focusing on an arbitrary height, a plurality of wafer support parts 3a, 3b, 3c, and 3d are provided in an annular shape. In other words, a plurality of wafer supports are provided in a ring shape at the same height. In this example, four wafer supports are provided at the same height, but the number of wafer supports is not particularly limited as long as the wafer can be supported. FIG. 3 shows that one wafer 1 is placed on the wafer supports 3a, 3b, 3c, and 3d. The material of such a vertical wafer boat 5 is, for example, quartz or silicon carbide.

図４は、ウエハ支持部３ａの例を示す断面図である。一例によれば、ウエハ支持部３ａの先端部は面取りされることでＲがついた形状を有している。ウエハ支持部３ｂ、３ｃ、３ｄも同様の形状とすることができる。この場合、複数のウエハ支持部の先端上部は曲面である。 FIG. 4 is a cross-sectional view showing an example of the wafer support section 3a. According to one example, the tip end of the wafer support portion 3a is chamfered to have an rounded shape. The wafer support parts 3b, 3c, and 3d can also have a similar shape. In this case, the upper ends of the plurality of wafer support parts are curved surfaces.

図１の説明に戻る。拡散炉内のプロセスチューブは、例えば石英製の外管１０と内管１１の二重構造になっている。プロセスチューブの周りにはヒータ９が設置されている。プロセスチューブの下側には、ガス導入管７とポンプ８が接続されている。このプロセスチューブは縦型成膜炉となっている。図１に両方向矢印で示されるように、縦型ウエハボート５は、縦型成膜炉の中に格納されることができる。 Returning to the explanation of FIG. The process tube in the diffusion furnace has a double structure of an outer tube 10 and an inner tube 11 made of, for example, quartz. A heater 9 is installed around the process tube. A gas introduction pipe 7 and a pump 8 are connected to the lower side of the process tube. This process tube is a vertical film forming furnace. As indicated by the double-headed arrow in FIG. 1, the vertical wafer boat 5 can be stored in a vertical deposition furnace.

次に、このような半導体製造装置の利用例を説明する。まず、ウエハ移載機４に少なくとも１枚のウエハを搭載する。具体的には、搬送アーム４Ｂの上にウエハ１をのせる。図５には、ウエハ１が搬送アーム４Ｂによって保持された状態が示されている。そして、ウエハ移載機４を移動することで、ウエハを縦型ウエハボート５の上に並べる。例えば、図５に矢印で示す方向にウエハ移載機４を移動させ、図６に矢印で示す方向にウエハ移載機４を移動させることで、ウエハ支持部３ａ及び他のウエハ支持部によってウエハ１を支持する。 Next, an example of the use of such a semiconductor manufacturing apparatus will be explained. First, at least one wafer is loaded onto the wafer transfer device 4. Specifically, the wafer 1 is placed on the transfer arm 4B. FIG. 5 shows a state in which the wafer 1 is held by the transfer arm 4B. Then, by moving the wafer transfer device 4, the wafers are arranged on the vertical wafer boat 5. For example, by moving the wafer transfer device 4 in the direction shown by the arrow in FIG. 5 and moving the wafer transfer device 4 in the direction shown by the arrow in FIG. I support 1.

図７は、ウエハ移載機４によってウエハ１をウエハ支持部３ａ、３ｂ、３ｃ、３ｄに乗せたときの平面図である。搬送アーム４Ｂの太幅部４ｂは、ウエハ１の下にあるので破線で示している。太幅部４ｂが平面視で円形状になっているので、太幅部４ｂはウエハ１の形状に沿った形状となっている。そのため、搬送アーム全体が先端部４ａ又は固定部４ｃと同じ幅である場合と比べて、すべてのウエハ支持部３ａ、３ｂ、３ｃ、３ｄと、搬送アーム４Ｂが近接している。 FIG. 7 is a plan view when the wafer 1 is placed on the wafer supports 3a, 3b, 3c, and 3d by the wafer transfer device 4. The wide portion 4b of the transfer arm 4B is located below the wafer 1 and is therefore indicated by a broken line. Since the wide portion 4b has a circular shape in plan view, the wide portion 4b has a shape that follows the shape of the wafer 1. Therefore, all the wafer supports 3a, 3b, 3c, and 3d are closer to the transfer arm 4B than in the case where the entire transfer arm has the same width as the tip portion 4a or the fixing portion 4c.

図８は、図７の構成におけるウエハ支持部３ａ、３ｂを含む位置の断面図である。太幅部４ｂとウエハ支持部３ａ、３ｂは近接している。図９は、比較例に係る搬送アームを示す図である。図９の搬送アームは、図８に対応するものであるが、太幅部４ｂではなく、先端部４ａ及び固定部４ｃと同じ幅の非太幅部４ｂ´を有する。図８の例と比較して、非太幅部４ｂ´とウエハ支持部３ａ、３ｂは離れている。 FIG. 8 is a sectional view of a position including the wafer support parts 3a and 3b in the configuration of FIG. The wide portion 4b and the wafer support portions 3a and 3b are close to each other. FIG. 9 is a diagram showing a transfer arm according to a comparative example. The transport arm in FIG. 9 corresponds to FIG. 8, but has a non-wide part 4b' having the same width as the tip part 4a and the fixing part 4c instead of the wide part 4b. Compared to the example of FIG. 8, the non-wide portion 4b' and the wafer support portions 3a and 3b are spaced apart.

図５、６を参照しつつ説明した方法で、全てのウエハを縦型ウエハボート５へ移載すると、縦型ウエハボート５をプロセスチューブ内に導入する。次いで、ウエハに対して成膜処理を施す。一例によれば、減圧状態で多結晶ポリシリコンを気相反応させてデポジションを行うと、ウエハの表裏の他に、ウエハ支持部とウエハとの接触部及びその近辺にもデポジョションされる。別の例によれば、別の方法で成膜処理が行われる。１回の成膜処理で成膜される膜の厚さは例えば１μｍ以上である。このような厚膜のポジションは、例えば加速度センサの可動構造体を形成するために行われる。 After all the wafers are transferred to the vertical wafer boat 5 by the method described with reference to FIGS. 5 and 6, the vertical wafer boat 5 is introduced into the process tube. Next, a film formation process is performed on the wafer. According to one example, when polycrystalline polysilicon is deposited by vapor phase reaction in a reduced pressure state, it is deposited not only on the front and back sides of the wafer but also on the contact area between the wafer support and the wafer and the vicinity thereof. According to another example, the deposition process is performed using another method. The thickness of the film formed in one film forming process is, for example, 1 μm or more. Such thick film positioning is performed, for example, to form a movable structure of an acceleration sensor.

図１０は、成膜処理後のウエハ支持部３ａとウエハ１の接触部分及びその近傍を示す断面図である。成膜された多結晶シリコン膜２０、２２は、ウエハ支持部３ａとウエハ１の接触部近辺に、他の部分より厚いデポ溜り部２１を有している。デポ溜り部２１は、図４に示したとおりウエハ支持部３ａの先端が丸い場合に生じやすい。１回の成膜で成膜される膜の厚みが大きいほどデポ溜り部２１が厚くなる。成膜処理が終わると、ウエハ移載機４を用いて縦型ウエハボート５からウエハを取り出す。 FIG. 10 is a cross-sectional view showing the contact portion between the wafer support portion 3a and the wafer 1 after the film forming process and the vicinity thereof. The deposited polycrystalline silicon films 20 and 22 have a deposit reservoir portion 21 near the contact portion between the wafer support portion 3a and the wafer 1, which is thicker than other portions. The deposit accumulation portion 21 is likely to occur when the tip of the wafer support portion 3a is rounded as shown in FIG. The thicker the film formed in one film formation, the thicker the deposit reservoir 21 becomes. When the film forming process is completed, the wafer is taken out from the vertical wafer boat 5 using the wafer transfer device 4.

図１１は、図９に示す比較例の搬送アームを用いた場合に基板の裏面に突起物２３が生じることを示す図である。突起物２３はデポ溜り部２１に起因する。比較例の搬送アームは、図９を参照しつつ前述したとおりウエハ支持部３ａ、３ｂから離れている。そのため、搬送アームをウエハ１の下面に接触させてウエハを持ち上げる際に、特にウエハ支持部３ａ、３ｂの近辺においてウエハ１が撓る。そのため、比較例の場合、ウエハ移載機でウエハを搬出する際に、デポ溜り部２１の多結晶シリコン膜の一部がウエハ裏面側に突起物２３として付着することがある。突起物２３は例えば後続の工程における写真製版においてデフォーカスを生じさせる。 FIG. 11 is a diagram showing that protrusions 23 are formed on the back surface of the substrate when the transfer arm of the comparative example shown in FIG. 9 is used. The protrusion 23 is caused by the deposit reservoir 21 . The transfer arm of the comparative example is separated from the wafer supports 3a and 3b as described above with reference to FIG. Therefore, when the transfer arm is brought into contact with the lower surface of the wafer 1 and the wafer is lifted up, the wafer 1 is bent, especially in the vicinity of the wafer supports 3a and 3b. Therefore, in the case of the comparative example, when the wafer is transferred by the wafer transfer machine, a part of the polycrystalline silicon film in the deposit reservoir 21 may adhere to the back surface of the wafer as a protrusion 23 . The protrusions 23 cause defocusing, for example, in photolithography in a subsequent process.

これに対し、実施の形態１に係る半導体製造装置によれば、搬送アーム４Ｂが太幅部４ｂを有することで、比較例に比べて搬送アーム４Ｂはすべてのウエハ支持部に近接している。一例によれば、平面視で複数のウエハ支持部で囲まれた領域に搬送アームがあるとき、搬送アームと複数のウエハ支持部の距離は略均一となる。しかも、搬送アーム４Ｂとウエハ１の接触面積が大きい。そのため、ウエハ支持部に支持されたウエハを取り出す際に、ウエハの撓りが軽減される。ウエハ撓りの軽減は突起物２３の発生を抑制する。 On the other hand, according to the semiconductor manufacturing apparatus according to the first embodiment, since the transfer arm 4B has the wide portion 4b, the transfer arm 4B is closer to all the wafer support parts than in the comparative example. According to one example, when the transfer arm is located in an area surrounded by a plurality of wafer supports in plan view, the distances between the transfer arm and the plurality of wafer supports are substantially uniform. Moreover, the contact area between the transfer arm 4B and the wafer 1 is large. Therefore, when the wafer supported by the wafer support section is taken out, bending of the wafer is reduced. Reducing wafer bending suppresses the formation of protrusions 23.

このように、搬送アーム４Ｂに太幅部４ｂを設けることは、ウエハ裏面への突起物を抑制することに貢献する。太幅部４ｂの形状は、ウエハ支持部と近接させることができるものであれば、特に限定されない。つまり、太幅部４ｂの形状は平面視で円形状に限定されない。図７の例でいえば、太幅部４ｂの幅は、複数のウエハ支持部３ａ、３ｂ、３ｃ、３ｄのうち最近接する２つのウエハ支持部の間の距離より大きい。この特徴によって、太幅部４ｂとウエハ支持部３ａ、３ｂをある程度近接させることができる。他方、太幅部４ｂの大きさはウエハ支持部によって制限される。具体的には、図７のように平面視で複数のウエハ支持部３ａ、３ｂ、３ｃ、３ｄで囲まれた領域に搬送アーム４Ｂがあるとき、太幅部４ｂは複数のウエハ支持部３ａ、３ｂ、３ｃ、３ｄに囲まれる。 Providing the wide portion 4b on the transfer arm 4B in this manner contributes to suppressing protrusions on the back surface of the wafer. The shape of the wide portion 4b is not particularly limited as long as it can be brought close to the wafer support portion. That is, the shape of the wide portion 4b is not limited to a circular shape in plan view. In the example of FIG. 7, the width of the wide portion 4b is greater than the distance between the two closest wafer supports among the plurality of wafer supports 3a, 3b, 3c, and 3d. This feature allows the wide portion 4b and the wafer support portions 3a, 3b to be brought close to each other to some extent. On the other hand, the size of the wide portion 4b is limited by the wafer support portion. Specifically, when the transfer arm 4B is located in an area surrounded by a plurality of wafer support parts 3a, 3b, 3c, and 3d in a plan view as shown in FIG. Surrounded by 3b, 3c, and 3d.

以下の実施の形態に係る半導体製造装置は、実施の形態１との共通点が多いので、実施の形態１との相違点を中心に説明する。実施の形態１で説明した変形は、以下の実施の形態にも応用できる。 The semiconductor manufacturing apparatus according to the following embodiment has many features in common with Embodiment 1, so the description will focus on the differences from Embodiment 1. The modification described in Embodiment 1 can also be applied to the following embodiments.

実施の形態２．
図１２は、実施の形態２に係る搬送アームの構成例を示す図である。搬送アームの太幅部４ｄは平面視で四角形である。その結果、搬送アームは平面視で十字型になっている。図７の円形状の太幅部４ｂはウエハ１の外縁に沿う形状となっているのに対して、図１２の太幅部４ｄは、ウエハ支持部３ａ、３ｂの方向に突き出た形状となっている。搬送アームに太幅部４ｄを設けることによって、搬送アームとすべてのウエハ支持部３ａ、３ｂ、３ｃ、３ｄとの距離を小さくすることができるので、上述の効果を得ることができる。 Embodiment 2.
FIG. 12 is a diagram illustrating a configuration example of a transfer arm according to the second embodiment. The wide portion 4d of the transfer arm is square in plan view. As a result, the transfer arm has a cross shape in plan view. The circular wide portion 4b in FIG. 7 is shaped along the outer edge of the wafer 1, while the wide portion 4d in FIG. 12 is shaped to protrude in the direction of the wafer supports 3a and 3b. ing. By providing the wide portion 4d in the transfer arm, the distance between the transfer arm and all the wafer supports 3a, 3b, 3c, and 3d can be reduced, so that the above-mentioned effects can be obtained.

実施の形態３．
図１３は、実施の形態３に係る搬送アームの構成例を示す図である。搬送アームの太幅部４ｅは平面視で多角形である。この例では太幅部４ｅは平面視で八角形である。言いかえれば、太幅部４ｅはウエハ支持部３ａ、３ｂの方向に台形状の突出部を有している。その結果、太幅部４ｅは、ウエハ支持部３ｃの近傍とウエハ支持部３ａの近傍を結び、ウエハ支持部３ｄの近傍とウエハ支持部３ｂの近傍を結ぶ形状を有している。したがって、搬送アームとウエハ１の接触面積が大きく、ウエハ移載の安定性を確保できる。搬送アームに太幅部４ｅを設けることによって、搬送アームとすべてのウエハ支持部３ａ、３ｂ、３ｃ、３ｄとの距離を小さくすることができるので、上述の効果を得ることができる。 Embodiment 3.
FIG. 13 is a diagram illustrating a configuration example of a transfer arm according to the third embodiment. The wide portion 4e of the transport arm is polygonal in plan view. In this example, the wide portion 4e is octagonal in plan view. In other words, the wide portion 4e has a trapezoidal protrusion in the direction of the wafer support portions 3a, 3b. As a result, the wide portion 4e has a shape that connects the vicinity of the wafer support part 3c and the vicinity of the wafer support part 3a, and connects the vicinity of the wafer support part 3d and the vicinity of the wafer support part 3b. Therefore, the contact area between the transfer arm and the wafer 1 is large, and the stability of wafer transfer can be ensured. By providing the wide portion 4e on the transfer arm, the distance between the transfer arm and all the wafer supports 3a, 3b, 3c, and 3d can be reduced, so that the above-mentioned effects can be obtained.

実施の形態４．
図１４は、実施の形態４に係る搬送アームの構成例を示す図である。太幅部４ｆに貫通孔４ｈが形成されている。貫通孔４ｈを設けることで貫通孔４ｈがない場合と比べて搬送アームを軽量化できるので、搬送ロボットの負荷の軽減が期待できる。なお、上述した様々な形状の太幅部に貫通孔を形成してもよい。 Embodiment 4.
FIG. 14 is a diagram illustrating a configuration example of a transfer arm according to the fourth embodiment. A through hole 4h is formed in the wide portion 4f. By providing the through hole 4h, the weight of the transport arm can be reduced compared to the case where the through hole 4h is not provided, so that a reduction in the load on the transport robot can be expected. Note that through holes may be formed in the wide portions of various shapes described above.

３ａ，３ｂ，３ｃ，３ｄ ウエハ支持部、 ４ ウエハ移載機、 ４Ｂ 搬送アーム、 ４ｂ 太幅部、 ５ 縦型ウエハボート 3a, 3b, 3c, 3d wafer support part, 4 wafer transfer machine, 4B transfer arm, 4b wide part, 5 vertical wafer boat

Claims (8)

同じ高さに環状に設けられた複数のウエハ支持部を有する縦型ウエハボートと、
先端部と、前記先端部より幅が広く、前記複数のウエハ支持部のうち最近接する２つのウエハ支持部の間の距離より大きい幅となる太幅部を有する搬送アームと、を備え、
前記先端部の幅は一定であり、
平面視で前記複数のウエハ支持部で囲まれた領域に前記搬送アームがあるとき、前記太幅部は前記複数のウエハ支持部に囲まれ、前記先端部は平面視で前記最近接する２つのウエハ支持部の間に設けられることを特徴とする半導体製造装置。 a vertical wafer boat having a plurality of wafer supports arranged annularly at the same height;
a transfer arm having a tip portion and a wide portion that is wider than the tip portion and has a width greater than the distance between two nearest wafer support portions among the plurality of wafer support portions;
The width of the tip portion is constant;
When the transfer arm is located in a region surrounded by the plurality of wafer support parts in plan view, the wide part is surrounded by the plurality of wafer support parts , and the tip part is located between the two nearest wafers in plan view. A semiconductor manufacturing device characterized in that it is provided between supporting parts . 前記太幅部は平面視で円形状である請求項１に記載の半導体製造装置。 2. The semiconductor manufacturing apparatus according to claim 1, wherein the wide portion has a circular shape in plan view. 前記太幅部は平面視で四角形である請求項１に記載の半導体製造装置。 2. The semiconductor manufacturing apparatus according to claim 1, wherein the wide portion has a rectangular shape in plan view. 前記太幅部は平面視で多角形である請求項１に記載の半導体製造装置。 2. The semiconductor manufacturing apparatus according to claim 1, wherein the wide portion has a polygonal shape in plan view. 前記太幅部に貫通孔が形成された請求項１から４のいずれか１項に記載の半導体製造装置。 5. The semiconductor manufacturing apparatus according to claim 1, wherein a through hole is formed in the wide portion. 平面視で前記複数のウエハ支持部で囲まれた領域に前記搬送アームがあるとき、前記搬送アームと前記複数のウエハ支持部の距離は略均一となる請求項１から５のいずれか１項に記載の半導体製造装置。 6. The method according to claim 1, wherein when the transfer arm is located in a region surrounded by the plurality of wafer support sections in a plan view, the distance between the transfer arm and the plurality of wafer support sections is substantially uniform. The semiconductor manufacturing apparatus described. 前記複数のウエハ支持部の先端上部は曲面であることを特徴とする請求項１から６のいずれか１項に記載の半導体製造装置。 7. The semiconductor manufacturing apparatus according to claim 1, wherein upper ends of the plurality of wafer support parts have curved surfaces. 前記縦型ウエハボートを格納する縦型成膜炉を備えた請求項１から７のいずれか１項に記載の半導体製造装置。 The semiconductor manufacturing apparatus according to any one of claims 1 to 7, further comprising a vertical film forming furnace that stores the vertical wafer boat.
JP2020035440A 2020-03-03 2020-03-03 semiconductor manufacturing equipment Active JP7347267B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2020035440A JP7347267B2 (en) 2020-03-03 2020-03-03 semiconductor manufacturing equipment

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2020035440A JP7347267B2 (en) 2020-03-03 2020-03-03 semiconductor manufacturing equipment

Publications (2)

Publication Number Publication Date
JP2021141125A JP2021141125A (en) 2021-09-16
JP7347267B2 true JP7347267B2 (en) 2023-09-20

Family

ID=77668984

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2020035440A Active JP7347267B2 (en) 2020-03-03 2020-03-03 semiconductor manufacturing equipment

Country Status (1)

Country Link
JP (1) JP7347267B2 (en)

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006156615A (en) 2004-11-29 2006-06-15 Tokyo Ohka Kogyo Co Ltd Conveyance device
JP2006310848A (en) 2005-04-25 2006-11-09 Tera Semicon Corp Manufacturing device of semiconductor, manufacturing method of substrate loading holder thereof, its substrate loading batch processing boat, and loading and/or unloading method of semiconductor substrate
JP6127621B2 (en) 2012-09-13 2017-05-17 日本精工株式会社 Bearing device
JP7183222B2 (en) 2020-08-20 2022-12-05 キヤノン株式会社 Liquid storage container and recording device

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH06127621A (en) * 1992-03-29 1994-05-10 Tokyo Electron Tohoku Ltd Substrate transfer equipment
JP3603189B2 (en) * 1993-12-24 2004-12-22 東京エレクトロン株式会社 Heat treatment equipment
JP3125968B2 (en) * 1994-09-30 2001-01-22 東芝セラミックス株式会社 Vertical wafer boat
JPH0950967A (en) * 1995-05-26 1997-02-18 Tokyo Electron Ltd Wafer boat
JPH1140508A (en) * 1997-07-23 1999-02-12 Sumitomo Metal Ind Ltd Wafer supporter and longitudinal boat
JP3244492B2 (en) * 1999-05-26 2002-01-07 株式会社日立国際電気 Vertical CVD equipment
JP2014072459A (en) * 2012-09-28 2014-04-21 Tokyo Ohka Kogyo Co Ltd Transfer method, bonding method, and bonding device
KR101990533B1 (en) * 2012-11-06 2019-09-30 주식회사 원익아이피에스 Batch type semiconductor manufacturing device

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006156615A (en) 2004-11-29 2006-06-15 Tokyo Ohka Kogyo Co Ltd Conveyance device
JP2006310848A (en) 2005-04-25 2006-11-09 Tera Semicon Corp Manufacturing device of semiconductor, manufacturing method of substrate loading holder thereof, its substrate loading batch processing boat, and loading and/or unloading method of semiconductor substrate
JP6127621B2 (en) 2012-09-13 2017-05-17 日本精工株式会社 Bearing device
JP7183222B2 (en) 2020-08-20 2022-12-05 キヤノン株式会社 Liquid storage container and recording device

Also Published As

Publication number Publication date
JP2021141125A (en) 2021-09-16

Similar Documents

Publication Publication Date Title
US11742224B2 (en) Substrate chuck and substrate bonding system including the same
JP7025589B2 (en) Methods for Improving Wafer Flatness and Joined Wafer Assembly Created By That Method
KR100815574B1 (en) Edge gripping device and method for handling a set of semiconductor wafers in an immersion processing system
JP5289577B2 (en) Equipment with vacuum chuck for imprint lithography equipment
US8118940B2 (en) Clamping mechanism for semiconductor device
US20030013315A1 (en) Process chamber used in manufacture of semiconductor device, capable of reducing contamination by particulates
US20080138504A1 (en) Coatings for components of semiconductor wafer fabrication equipment
JP7481937B2 (en) Planarization method, planarization device, and article manufacturing method
US20180350652A1 (en) Conveyance hand, conveyance apparatus, lithography apparatus, manufacturing method of article, and holding mechanism
CN113795907A (en) Substrate holder, substrate bonding apparatus, and substrate bonding method
JP7347267B2 (en) semiconductor manufacturing equipment
CN111276428B (en) Wafer bearing device
US6767170B2 (en) Wafer handling system and wafer handling method
US20200066571A1 (en) Substrate carrier
CN109830457B (en) Semiconductor device and method of forming the same
JP6098491B2 (en) Semiconductor manufacturing equipment
JP2018067582A (en) Semiconductor manufacturing apparatus and semiconductor device manufacturing method
TWI786778B (en) Mask structure for deposition device, deposition device, and operation method thereof
JP7330134B2 (en) Semiconductor device manufacturing method and semiconductor manufacturing equipment
US12123087B2 (en) Mask structure for deposition device, deposition device, and operation method thereof
JP5000597B2 (en) Semiconductor wafer support
US12051576B2 (en) Multicathode deposition system and methods
JP2023098814A (en) Planarization process, apparatus, and method for manufacturing article
JP2010050130A (en) Device for supporting semiconductor wafer
US7896563B2 (en) Photo spinner apparatus and wafer carrier loading/unloading method using the same

Legal Events

Date Code Title Description
A621 Written request for application examination

Free format text: JAPANESE INTERMEDIATE CODE: A621

Effective date: 20220506

A977 Report on retrieval

Free format text: JAPANESE INTERMEDIATE CODE: A971007

Effective date: 20230324

A131 Notification of reasons for refusal

Free format text: JAPANESE INTERMEDIATE CODE: A131

Effective date: 20230404

A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20230508

TRDD Decision of grant or rejection written
A01 Written decision to grant a patent or to grant a registration (utility model)

Free format text: JAPANESE INTERMEDIATE CODE: A01

Effective date: 20230808

A61 First payment of annual fees (during grant procedure)

Free format text: JAPANESE INTERMEDIATE CODE: A61

Effective date: 20230821

R150 Certificate of patent or registration of utility model

Ref document number: 7347267

Country of ref document: JP

Free format text: JAPANESE INTERMEDIATE CODE: R150