US20110203775A1 - System in a Network Node for Regulating Temperature of Electronic Equipment - Google Patents

System in a Network Node for Regulating Temperature of Electronic Equipment Download PDF

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Publication number
US20110203775A1
US20110203775A1 US13/127,188 US200813127188A US2011203775A1 US 20110203775 A1 US20110203775 A1 US 20110203775A1 US 200813127188 A US200813127188 A US 200813127188A US 2011203775 A1 US2011203775 A1 US 2011203775A1
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US
United States
Prior art keywords
fluid
unit
pipe
flow
heat exchanger
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
US13/127,188
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English (en)
Inventor
Klas Hedlund
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Cluster LLC
HPS Investment Partners LLC
Original Assignee
Telefonaktiebolaget LM Ericsson AB
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Telefonaktiebolaget LM Ericsson AB filed Critical Telefonaktiebolaget LM Ericsson AB
Assigned to TELEFONAKTIEBOLAGET LM ERICSSON (PUBL) reassignment TELEFONAKTIEBOLAGET LM ERICSSON (PUBL) ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: HEDBERG, KLAS
Publication of US20110203775A1 publication Critical patent/US20110203775A1/en
Assigned to HIGHBRIDGE PRINCIPAL STRATEGIES, LLC (AS COLLATERAL AGENT) reassignment HIGHBRIDGE PRINCIPAL STRATEGIES, LLC (AS COLLATERAL AGENT) LIEN (SEE DOCUMENT FOR DETAILS). Assignors: OPTIS CELLULAR TECHNOLOGY, LLC
Assigned to WILMINGTON TRUST, NATIONAL ASSOCIATION (AS COLLATERAL AGENT) reassignment WILMINGTON TRUST, NATIONAL ASSOCIATION (AS COLLATERAL AGENT) SECURITY AGREEMENT Assignors: OPTIS CELLULAR TECHNOLOGY, LLC
Assigned to CLUSTER LLC reassignment CLUSTER LLC ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: TELEFONAKTIEBOLAGET L M ERICSSON (PUBL)
Assigned to OPTIS CELLULAR TECHNOLOGY, LLC reassignment OPTIS CELLULAR TECHNOLOGY, LLC ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: CLUSTER LLC
Assigned to HIGHBRIDGE PRINCIPAL STRATEGIES, LLC, AS COLLATERAL AGENT reassignment HIGHBRIDGE PRINCIPAL STRATEGIES, LLC, AS COLLATERAL AGENT ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: OPTIS CELLULAR TECHNOLOGY, LLC
Assigned to HIGHBRIDGE PRINCIPAL STRATEGIES, LLC, AS COLLATERAL AGENT reassignment HIGHBRIDGE PRINCIPAL STRATEGIES, LLC, AS COLLATERAL AGENT CORRECTIVE ASSIGNMENT TO CORRECT THE NATURE OF CONVEYANCE TO READ "SECURITY INTEREST" PREVIOUSLY RECORDED ON REEL 032786 FRAME 0546. ASSIGNOR(S) HEREBY CONFIRMS THE SECURITY INTEREST. Assignors: OPTIS CELLULAR TECHNOLOGY, LLC
Assigned to OPTIS CELLULAR TECHNOLOGY, LLC reassignment OPTIS CELLULAR TECHNOLOGY, LLC RELEASE BY SECURED PARTY (SEE DOCUMENT FOR DETAILS). Assignors: HPS INVESTMENT PARTNERS, LLC
Abandoned legal-status Critical Current

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Classifications

    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F28D15/0266—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with separate evaporating and condensing chambers connected by at least one conduit; Loop-type heat pipes; with multiple or common evaporating or condensing chambers
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F28D15/06—Control arrangements therefor
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/20536—Modifications to facilitate cooling, ventilating, or heating for racks or cabinets of standardised dimensions, e.g. electronic racks for aircraft or telecommunication equipment
    • H05K7/20609—Air circulating in closed loop within cabinets wherein heat is removed through air-to-liquid heat-exchanger
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/20536—Modifications to facilitate cooling, ventilating, or heating for racks or cabinets of standardised dimensions, e.g. electronic racks for aircraft or telecommunication equipment
    • H05K7/20663—Liquid coolant with phase change, e.g. heat pipes
    • H05K7/20681—Liquid coolant with phase change, e.g. heat pipes within cabinets for removing heat from sub-racks
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/20536—Modifications to facilitate cooling, ventilating, or heating for racks or cabinets of standardised dimensions, e.g. electronic racks for aircraft or telecommunication equipment
    • H05K7/207—Thermal management, e.g. cabinet temperature control

Definitions

  • the present invention relates to a system in a radio network node, more particularly, to a system in a radio network node for regulating temperature of electronic equipment within the radio network node. Moreover, the present invention relates to an arrangement for restricting flow in a heat exchanger unit.
  • a radio communication system of today comprises a radio access network and a number of communication devices.
  • the radio access network is built up of several nodes, in particular, radio base stations.
  • the primary task of a radio base station is to send and receive information to/from the communication devices within a cell served by the radio base station. In many cases, the base station is run 24 hours a day. Therefore, it is of particular interest and importance to ensure that the base station is operable predictably and reliably.
  • the radio base station further comprises a cabinet, which comprises an enclosure for housing circuitry, or electronic equipment, for performing different tasks of the radio base station.
  • the circuitry may comprise a power control unit, a radio unit, comprising a radio amplifier, and a filtering unit for performing corresponding tasks.
  • the system comprises fans, which are used to circulate air through or over the heat generating equipment and through or over one side of a heat exchanger, i.e. an internal side within the enclosure. Moreover, further fans are used to force ambient air through or over the other side of the heat exchanger, i.e. an external side within the cabinet.
  • the heat exchanger comprises a refrigerant that absorbs heat from air, heated by the electronic equipment, at the internal side within the enclosure. As a result, a transition from liquid phase to gas phase of the refrigerant occurs.
  • the portion of the heat exchanger that is located at the internal side within the enclosure is called evaporator.
  • thermosiphon This kind of heat exchanger is generally denoted a thermosiphon.
  • thermosiphon A disadvantage with this kind of system, which comprises a thermosiphon, is that the electronic equipment may become unnecessary cold during, for example, cold weather conditions. As a result, performance of the electronic equipment is impaired.
  • the object is achieved by a system in a radio network node for regulating temperature of electronic equipment within the radio network node.
  • the system comprises a closed space comprising a flow generating device and the electronic equipment, wherein the flow generating device is arranged to circulate a first fluid within the closed space such that heat is transferrable between the electronic equipment and the first fluid.
  • the system further comprises a heat exchanger unit, comprising an evaporator unit, a condenser unit, and a first and a second pipe.
  • the evaporator unit is at least partly located within the closed space and the condenser unit is at least partly located outside the closed space.
  • the first and second pipes are arranged to connect the evaporator unit and the condenser unit, whereby a loop is formed.
  • a second fluid is flowable from the condenser unit to the evaporator unit in the first pipe and from the evaporator unit to the condenser unit in the second pipe.
  • the system comprises a heater unit arranged at the first pipe and arranged to heat the second fluid in the first pipe such that flow in the first pipe is restricted, whereby temperature of the electronic equipment is regulated.
  • the object is achieved by an arrangement for restricting flow in a heat exchanger unit.
  • the heat exchanger unit comprises an evaporator unit, a condenser unit, and a first and a second pipe.
  • the first and second pipes are arranged to connect the evaporator unit and the condenser unit, whereby a loop is formed.
  • a second fluid is flowable from the condenser unit to the evaporator unit in the first pipe and from the evaporator unit to the condenser unit in the second pipe.
  • the system comprises a heater unit arranged at the first pipe and arranged to heat the second fluid in the first pipe such that flow in the first pipe is restricted.
  • An idea of the invention is to reduce flow in the heat exchanger unit, whereby heat transportation to and/or from the electronic equipment via the first and second fluid is reduced. This is achieved by the system according to appended independent claim 1 and by the arrangement according to appended independent claim 5 by means of arranging a heater unit at the first pipe. In this manner, the system and the arrangement provide regulation of temperature of the electronic equipment without addition of any movable mechanical parts, such as valves or the like. As a result, a reliable system and a reliable arrangement are provided.
  • the heater unit provides for flow regulation of the second fluid while maintaining the same level of risk for leakage as before introduction of the heater unit.
  • the heater unit maintains the same level of flow resistance in the heat exchanger as before introduction of the heater unit. In other words, the heater unit does not introduce any pressure drop between the condenser unit and the evaporator unit.
  • a further advantage with the proposed solution is that heater units are readily and commercially available at low costs.
  • the network node may be a radio base station or any other kind of node in a (radio) communication system, which node comprises heat generating electronic equipment.
  • nodes are transmission nodes, remote subscriber switches (RSS) and nodes with similar functionality.
  • FIG. 1 shows a schematic block diagram of a system according to embodiments of the present invention
  • FIG. 2 shows a schematic block diagram of an arrangement comprising the heat exchanger unit in the system of FIG. 1 .
  • FIG. 1 shows a cross sectional, side view of a system 100 according to embodiments of the present invention.
  • the system 100 in a radio network node 110 for regulating temperature of electronic equipment 120 within the radio network node 110 comprises a closed space 130 , comprising a flow generating device 140 and the electronic equipment 120 .
  • the flow generating device 140 is arranged to circulate, as indicated by arrows 141 , 142 , 143 , 144 , a first fluid within the closed space 130 such that heat is transferrable between the electronic equipment 120 and the first fluid.
  • the arrow 144 in the vicinity of the electronic equipment 120 , is dashed to indicate that the flow of the first fluid may pass through or over the electronic equipment 120 .
  • the arrow 142 at the flow generating device 140 , is dashed to indicate that the flow is passed through the flow generating device 140 .
  • the system 100 further comprises a heat exchanger unit 200 arranged to transfer heat from the first fluid within the closed space 130 to ambient air outside the closed space 130 .
  • a flow generating device 150 may be arranged to push or to direct ambient air through or over, as indicated by arrow 149 , a portion of the heat exchanger 200 that is located outside the closed space 130 .
  • excess heat from the electronic equipment 120 may be transported from the electronic equipment 120 to the first fluid within the closed space 130 , from the first fluid to a second fluid comprised in and circulated within, as indicated by arrows 146 , 147 , the heat exchanger 200 , and from the second fluid to, for example, ambient air.
  • the heat exchanger unit 200 comprises an evaporator unit 202 , a condenser unit 203 , and a first and a second pipe 204 , 205 .
  • the evaporator unit 202 is at least partly located within the closed space and the condenser unit 203 is at least partly located outside the closed space.
  • the first and second pipes 204 , 205 are arranged to connect the evaporator unit 202 and the condenser unit 203 , whereby a loop is formed.
  • a second fluid such as a refrigerant fluid or a coolant, is flowable from the condenser unit 203 to the evaporator unit 202 in the first pipe 204 and from the evaporator unit 202 to the condenser unit 203 in the second pipe 205 .
  • the arrangement 160 comprises a heater unit 201 arranged at the first pipe 204 and arranged to heat the second fluid in the first pipe 204 such that flow in the first pipe 204 is restricted.
  • performance of the heat exchanger unit 200 is decreased.
  • the temperature of the first fluid within the closed space 130 is increased.
  • temperature of the electronic equipment 120 is increased, i.e. temperature of the electronic equipment 120 is regulated.
  • the second fluid in the first pipe 204 has a temperature that is close to saturation point (boiling point) of the second fluid, only a small amount of heat is needed in order to evaporate the second fluid.
  • the evaporated second fluid, in gaseous phase causes a flow in the opposite direction to the flow of condensed second fluid, in liquid phase, in the first pipe 204 . Consequently, due to the counteracting flows in gaseous and liquid phase, respectively, speed of flow in the loop is decreased or even completely shut off.
  • the following steps are performed simultaneously or as a sequence, starting with any of the steps described below.
  • the evaporator unit 202 evaporates the second fluid.
  • a first flow as indicated by arrow 212
  • the condenser unit 203 condenses, as indicated by arrow 213 , the second fluid.
  • a second flow as indicated by arrow 214
  • the second flow is enhanced by gravitation.
  • the heater unit 201 heats the second fluid in the first pipe 204 . Since the temperature of the second fluid is close to saturation point of the second fluid, only a small amount of heat transferred to the second fluid causes the second fluid to evaporate. As a result, a third flow, as indicated by arrow 215 , of the second fluid is generated. In this manner, the third flow, which is directed in the opposite direction compared to the flow of the second fluid in liquid phase from the condenser unit 203 to the evaporator unit 202 , reduces the overall flow of the second fluid in the loop. Consequently, the reduced overall flow of the second fluid in the loop reduces the amount of heat transferred between the electronic equipment and the second fluid. Hence, for example, cooling of the electronic equipment is reduced.
  • the heater unit may, alternatively or additionally, be arranged to heat the first pipe, which in turn heats the second fluid therein.
  • the flow of the second fluid in the heat exchanger unit 200 indirectly affects the amount of heat transferred to and/or from the electronic equipment.
  • the heater may, optionally, be controlled by a controller (not shown), whereby temperature of electronic equipment comprised in the radio network node may be controlled.
  • the heat exchanger unit 200 comprises a thermosiphon. It is preferred that resistance of or air pressure difference over the thermosiphon is low.
  • the flow generating device 140 may be operated at low power, i.e. the system may be energy efficient.
  • undesired flows of ambient air through the heat exchanger may cause the heat exchanger to cool the electronic equipment 120 more than desired.
  • the undesired flows of ambient air are generated by and dependent on external weather conditions. For example, a windy day may cause undesired cooling of the electronic equipment 120 .
  • the provision of a heater unit 201 allows for a reduction of (or possibly complete shut off of) the amount of heat transferred from the electronic equipment 120 , thereby securing that operation of the electronic equipment 120 is not impaired.
  • the condenser unit 203 is located at least partly above the evaporator unit 202 .
  • the evaporator unit 202 and the condenser unit 203 are arranged in relation to each other such that the fluid thanks to gravity is passed from the condenser unit 203 to the evaporator unit 202 .
  • fluid evaporated in the evaporator unit 202 is allowed to pass upwards and fluid condensed in the condenser unit 203 is allowed to pass downwards, in accordance with commonly known principles of fluid dynamics.
  • the electronic equipment 120 and the flow generating device 140 are arranged such that heat is transferrable between the electronic equipment 120 and the first fluid, wherein the flow generating device 140 is arranged to circulate the first fluid within the closed space 130 .
  • the flow generating device 140 may be arranged next to and at the same level from ground as the heat exchanger unit 200 in an upper portion of the enclosed space 130 .
  • the flow generating device 140 may be arranged next to and at the same level from ground as the electronic equipment 120 in a lower portion of the enclosed space 130 , while the heat exchanger unit 200 still is located in an upper portion of the enclosed space 130 .
  • a man skilled in the art may find other alternatives for arranging the electronic equipment 120 and the flow generating device 140 such that heat is transferrable between the electronic equipment 120 and the first fluid.

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Aviation & Aerospace Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Sustainable Development (AREA)
  • Mechanical Engineering (AREA)
  • General Engineering & Computer Science (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
US13/127,188 2008-11-03 2008-11-03 System in a Network Node for Regulating Temperature of Electronic Equipment Abandoned US20110203775A1 (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
PCT/SE2008/051252 WO2010050866A1 (en) 2008-11-03 2008-11-03 A system in a network node for regulating temperature of electronic equipment
JP2008-288872 2008-11-11
JP2008-288875 2008-11-11

Publications (1)

Publication Number Publication Date
US20110203775A1 true US20110203775A1 (en) 2011-08-25

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Family Applications (1)

Application Number Title Priority Date Filing Date
US13/127,188 Abandoned US20110203775A1 (en) 2008-11-03 2008-11-03 System in a Network Node for Regulating Temperature of Electronic Equipment

Country Status (4)

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US (1) US20110203775A1 (de)
EP (1) EP2347642B1 (de)
JP (1) JP5340399B2 (de)
WO (1) WO2010050866A1 (de)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP3536135A1 (de) * 2016-11-03 2019-09-11 Telefonaktiebolaget LM Ericsson (PUBL) Ausrüstungskühlsystem und -verfahren

Citations (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS51150150A (en) * 1975-06-18 1976-12-23 Hitachi Ltd Heat-transfer equipment
JPS5228756A (en) * 1975-08-29 1977-03-03 Hitachi Ltd Heat transmission equipment
JPS52105361A (en) * 1976-03-01 1977-09-03 Hitachi Ltd Heat transmission device
JPS52114157A (en) * 1976-03-22 1977-09-24 Hitachi Ltd Heat transfer device
US4370547A (en) * 1979-11-28 1983-01-25 Varian Associates, Inc. Variable thermal impedance
US5058391A (en) * 1989-04-27 1991-10-22 Gec Alsthom Sa Method of cooling electrical components, device for implementing same and application to vehicle-borne components
US5606870A (en) * 1995-02-10 1997-03-04 Redstone Engineering Low-temperature refrigeration system with precise temperature control
US6382308B2 (en) * 2000-05-19 2002-05-07 Denso Corporation Boiling cooling system that exchanges heat between higher-temperature fluid and lower-temperature fluid
US20030205364A1 (en) * 2001-06-29 2003-11-06 Ioan Sauciuc Method and apparatus for dissipating heat from an electronic device

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE4108981C2 (de) * 1991-03-19 1995-03-16 Siemens Ag Anordnung und Verfahren zur Wärmeabfuhr von mindestens einer Wärmequelle
SE518336C2 (sv) * 1997-11-21 2002-09-24 Ericsson Telefon Ab L M Temperaturregleringsanordning och förfarande att reglera temperaturen i en dylik anordning
JP2002340489A (ja) * 2001-05-15 2002-11-27 Hitachi Ltd ループ型ヒートパイプ
JP2004163033A (ja) * 2002-11-14 2004-06-10 Niigata Tlo:Kk 放熱装置
JP4179136B2 (ja) * 2003-11-10 2008-11-12 株式会社デンソー 冷却装置

Patent Citations (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS51150150A (en) * 1975-06-18 1976-12-23 Hitachi Ltd Heat-transfer equipment
JPS5228756A (en) * 1975-08-29 1977-03-03 Hitachi Ltd Heat transmission equipment
JPS52105361A (en) * 1976-03-01 1977-09-03 Hitachi Ltd Heat transmission device
JPS52114157A (en) * 1976-03-22 1977-09-24 Hitachi Ltd Heat transfer device
US4370547A (en) * 1979-11-28 1983-01-25 Varian Associates, Inc. Variable thermal impedance
US5058391A (en) * 1989-04-27 1991-10-22 Gec Alsthom Sa Method of cooling electrical components, device for implementing same and application to vehicle-borne components
US5606870A (en) * 1995-02-10 1997-03-04 Redstone Engineering Low-temperature refrigeration system with precise temperature control
US6382308B2 (en) * 2000-05-19 2002-05-07 Denso Corporation Boiling cooling system that exchanges heat between higher-temperature fluid and lower-temperature fluid
US20030205364A1 (en) * 2001-06-29 2003-11-06 Ioan Sauciuc Method and apparatus for dissipating heat from an electronic device

Also Published As

Publication number Publication date
WO2010050866A1 (en) 2010-05-06
EP2347642A1 (de) 2011-07-27
EP2347642B1 (de) 2013-04-17
JP2012507854A (ja) 2012-03-29
JP5340399B2 (ja) 2013-11-13

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