US20100319881A1 - Heat spreader with vapor chamber and method for manufacturing the same - Google Patents

Heat spreader with vapor chamber and method for manufacturing the same Download PDF

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Publication number
US20100319881A1
US20100319881A1 US12/541,182 US54118209A US2010319881A1 US 20100319881 A1 US20100319881 A1 US 20100319881A1 US 54118209 A US54118209 A US 54118209A US 2010319881 A1 US2010319881 A1 US 2010319881A1
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US
United States
Prior art keywords
supporting wires
supporting
heat spreader
vapor chamber
wires
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
US12/541,182
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English (en)
Inventor
De-Yu Wang
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fuzhun Precision Industry Shenzhen Co Ltd
Foxconn Technology Co Ltd
Original Assignee
Fuzhun Precision Industry Shenzhen Co Ltd
Foxconn Technology Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fuzhun Precision Industry Shenzhen Co Ltd, Foxconn Technology Co Ltd filed Critical Fuzhun Precision Industry Shenzhen Co Ltd
Assigned to FOXCONN TECHNOLOGY CO., LTD., FU ZHUN PRECISION INDUSTRY (SHEN ZHEN) CO., LTD. reassignment FOXCONN TECHNOLOGY CO., LTD. ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: WANG, DE-YU
Publication of US20100319881A1 publication Critical patent/US20100319881A1/en
Abandoned legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
    • H01L23/427—Cooling by change of state, e.g. use of heat pipes
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F28D15/04—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with tubes having a capillary structure
    • F28D15/046—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with tubes having a capillary structure characterised by the material or the construction of the capillary structure
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/4935—Heat exchanger or boiler making
    • Y10T29/49353—Heat pipe device making

Definitions

  • the disclosure generally relates to heat spreaders and, more particularly, to a heat spreader with a vapor chamber having a supporting frame received in the vapor chamber and a method for manufacturing the heat spreader.
  • CPUs central processing units
  • Electronic components such as central processing units (CPUs) comprise numerous circuits operating at high speeds and generating substantial heat. Under most circumstances, it is necessary to cool the CPUs to maintain safe operating conditions and assure that the CPUs function properly and reliably. In the past, various approaches have been used to cool electronic components.
  • a heat spreader with a vapor chamber is usually used to help heat dissipation for electronic components.
  • the heat spreader generally includes a base, a cover mounted on the base and a sealed chamber defined between the base and the cover. Moderate working liquid is contained in the chamber.
  • the base has a wick structure spreading on the whole inner face thereof, and the cover has a wick structure spreading on the whole inner face thereof, too.
  • the base absorbs heat from an electronic component, and the working liquid is heated into vapor in the chamber.
  • the vapor flows towards the cover and dissipates the heat to the cover, then condenses into liquid and returns back to the base by force (i.e., capillary action) generated by the wick structures to continue a next phase-change cycle.
  • the heat spreader is a hollow plate-shaped structure, it is prone to be deformed when subjected to a large pressure. Such deformation of the heat spreader may result in the wick structures disengaged from the inner faces of the heat spreader, thus adversely affecting heat transfer efficiency of the heat spreader.
  • FIG. 1 is an assembled, isometric view of a heat spreader in accordance with a first embodiment of the disclosure, with a heat sink positioned thereon and an electronic component positioned therebelow.
  • FIG. 2 is a cross-sectional view of FIG. 1 , taken along a line II-II thereof.
  • FIG. 3 is a schematic, top view of a supporting frame of the heat spreader of FIG. 1 .
  • FIG. 4 is an isometric view of a supporting wire of the supporting frame of FIG. 3 .
  • FIG. 5A is a schematic, top view of a supporting frame of the heat spreader in accordance with a second embodiment of the disclosure.
  • FIG. 5B is a schematic, top view of a supporting frame of the heat spreader in accordance with a third embodiment of the disclosure.
  • FIG. 5C is a schematic, top view of a supporting frame of the heat spreader in accordance with a fourth embodiment of the disclosure.
  • FIG. 5D is a schematic, top view of a supporting frame of the heat spreader in accordance with a fifth embodiment of the disclosure.
  • a heat spreader 10 in accordance with a first embodiment of the disclosure absorbs heat generated by an electronic component 20 mounted below the heat spreader 10 .
  • a finned metal heat sink 30 is attached to a top face of the heat spreader 10 to remove the heat therefrom. The heat absorbed by the heat sink 30 is then dissipated to ambient air.
  • the heat spreader 10 comprises a hollow casing 11 which defines a vapor chamber 12 therein, a wick structure 13 formed on an inner face of the casing 11 , and a supporting frame 14 received in the vapor chamber 12 .
  • a predetermined quantity of working liquid such as water, alcohol, olefin and so on, is contained in the vapor chamber 12 for transferring heat by phase change.
  • the vapor chamber 12 is evacuated for facilitating evaporation of the working liquid.
  • the casing 11 is a hollow rectangular plate and integrally made of a metal with good heat conductivity, such as aluminum, copper, or an alloy thereof.
  • the casing 11 comprises a base 15 thermally attached to the electronic component 20 and a cover 16 located above and parallel to the base 15 .
  • the heat sink 30 is thermally disposed on the cover 16 .
  • the wick structure 13 spreads on the whole inner face of the casing 11 and surrounds the vapor chamber 12 .
  • the wick structure 13 can be selected from some suitable materials, such as sintered metal powder, metal mesh, carbon nanotube array, bundle of fibers and so on.
  • the supporting frame 14 is horizontally sandwiched between the base 15 and the cover 16 of the casing 11 , and comprises a plurality of supporting wires 142 interlaced with each other.
  • Each of the supporting wires 142 has a column-spiral configuration similar to a spring.
  • An axis of each supporting wire 142 is parallel to the base 15 and the cover 16 of the casing 11 .
  • Opposite bottom and top sides of each supporting wire 142 are attached to the wick structure 13 formed on the base 15 and the cover 16 , respectively.
  • the supporting wires 142 comprise a plurality of first supporting wires 1420 and a plurality of second supporting wires 1422 .
  • the first supporting wires 1420 are parallel to and spaced from each other.
  • the second supporting wires 1422 are parallel to and spaced from each other, and perpendicular to the first supporting wires 1420 .
  • the first supporting wires 1420 are coplanar and crisscross with the second supporting wires 1422 .
  • the supporting frame 14 is configured as a mesh having a plurality of openings between the supporting wires 142 .
  • the supporting wires 142 can be arranged in different manners; that is to say, a structure of the supporting frame 14 is variable.
  • the supporting frame 14 a comprises a plurality of supporting wires 142 a , wherein the supporting wires 142 a are all parallel to and spaced from each other.
  • the supporting frame 14 b comprises a plurality of supporting wires 142 b , wherein the supporting wires 142 b are located adjacent to each other, with wave troughs of an upper supporting wire 142 b engaging with respective wave crests of a lower supporting wire 142 b.
  • the supporting frame 14 c comprises a plurality of supporting wires 142 c connecting with each other end-to-end and in series to have a configuration of a zigzag. Every two adjacent supporting wires 142 c define an acute angle therebetween. The acute angles are alternately located at opposite sides of the supporting frame 14 c as viewed from FIG. 5C .
  • the supporting frame 14 d comprises a plurality of supporting wires 142 d connecting with each other end-to-end and in series to have a configuration of a rectangular vortex, wherein every two adjacent two supporting wires 142 d define a right angle therebetween.
  • the supporting frame 14 d integrally extends along the rectangular vortex from a periphery gradually toward a center of the vapor chamber 12 .
  • the supporting wires 142 , 142 a , 142 b , 142 c , 142 d have similar configurations, with different lengths.
  • a method for manufacturing the heat spreader 10 of the disclosure comprises steps described below. Firstly, a metallic elongated and flat tube is provided. The tube is then cut into a plurality of similar semifinished parts each having a predetermined length in order to form the casing 11 , wherein each semifinished part has two openings at two opposite sides thereof. An insert (not shown) is inserted into the semifinished part through one of the openings thereof, with a gap defined between the insert and top and bottom of the semifinished part. Metal powder is then filled into the gap between the insert and the semifinished part and then sintered onto the inner face of the semifinished part by heating the metal powder, to thereby form the wick structure 13 over the inner face of the semifinished part.
  • the insert according to the preferred embodiment is a solid metallic block which is withdrawn from the semifinished part after the powder is sintered onto the inner face of the semifinished part.
  • the insert can be a hollow block formed by woven meshes which is able to be sintered onto the inner face of the semifinished part as a part of the wick structure 13 when sintering the powder.
  • the supporting frame 14 is placed into the semifinished part.
  • the two opposite sides of the semifinished part are punched to be sealed for sealing the vapor chamber 12 , in which an injection hole is formed in one of the two sealed opposite sides so that work liquid can be injected into the vapor chamber 12 via the injection hole and the vapor chamber can be vacuumed via the injection hole.
  • the injection hole is sealed, whereby the housing 11 is formed by the semifinished part and the manufacturing of the heat spreader 10 is finished, which incorporates the supporting frame 14 therein.
  • the electronic component 20 is attached to the base 15 , and the base 15 absorbs the heat produced by the electronic component 20 .
  • the working liquid saturated in the wick structure 13 formed on the base 15 is heated into vapor.
  • the vapor is quickly diffused into the whole vapor chamber 12 of the heat spreader 10 .
  • the vapor contacts the wick structure 13 formed on the cover 16 and the cover 16 , it gives out heat and condenses into liquid.
  • the condensed working liquid then flows back to the base 15 through the wick structure 13 .
  • the supporting frame 14 which is received in the vapor chamber 12 prevents the casing 11 from being deformed when the casing 11 is subject to pressure acting thereon.

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Power Engineering (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Sustainable Development (AREA)
  • Thermal Sciences (AREA)
  • Mechanical Engineering (AREA)
  • General Engineering & Computer Science (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
US12/541,182 2009-06-19 2009-08-14 Heat spreader with vapor chamber and method for manufacturing the same Abandoned US20100319881A1 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
CN200910303468.7A CN101929818A (zh) 2009-06-19 2009-06-19 均温板及其制造方法
CN200910303468.7 2009-06-19

Publications (1)

Publication Number Publication Date
US20100319881A1 true US20100319881A1 (en) 2010-12-23

Family

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Family Applications (1)

Application Number Title Priority Date Filing Date
US12/541,182 Abandoned US20100319881A1 (en) 2009-06-19 2009-08-14 Heat spreader with vapor chamber and method for manufacturing the same

Country Status (3)

Country Link
US (1) US20100319881A1 (ja)
JP (1) JP2011002219A (ja)
CN (1) CN101929818A (ja)

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20110027738A1 (en) * 2009-07-30 2011-02-03 Meyer Iv George Anthony Supporting structure with height difference and vapor chamber having the supporting structure
CN103327786A (zh) * 2012-03-21 2013-09-25 联想(北京)有限公司 一种电子设备
CN103413794A (zh) * 2013-08-16 2013-11-27 中国科学院深圳先进技术研究院 一种半导体功率器件的散热封装结构
US20140060793A1 (en) * 2012-09-06 2014-03-06 Cooler Master Development Corporation Plate-type heat exchanger and support structure thereof
CN104822238A (zh) * 2014-01-31 2015-08-05 刘永健 一种散热方法
CN104847476A (zh) * 2014-06-04 2015-08-19 北汽福田汽车股份有限公司 散热单元、散热器及发动机冷却系统
WO2020061976A1 (en) * 2018-09-28 2020-04-02 Intel Corporation Moderated deformation of a vapor chamber to match a shape of a heat source

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102927842A (zh) * 2012-11-26 2013-02-13 殷逢宝 一种led均温板
CN103335550B (zh) * 2013-06-08 2014-12-31 华南理工大学 一种热柱阵列蒸汽干道复合吸液芯及其制造方法
TWI542277B (zh) * 2014-09-30 2016-07-11 旭德科技股份有限公司 散熱模組
CN106767060A (zh) * 2016-12-08 2017-05-31 东莞祥龙五金制品有限公司 具有一体式散热器的均温板装置及均温板装置的制造方法
CN107333442A (zh) * 2017-07-24 2017-11-07 苏州天脉导热科技有限公司 超薄均热板及其制备方法
CN111863746B (zh) * 2019-04-25 2023-10-13 华为技术有限公司 一种散热装置、电路板及电子设备
CN115406278A (zh) * 2022-09-02 2022-11-29 昆明理工大学 一种螺旋形支撑柱-吸液芯一体烧结均热板及其制备方法

Citations (22)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US1719679A (en) * 1924-08-04 1929-07-02 Muller-Thym Bernard Wick and process for making same
US3576210A (en) * 1969-12-15 1971-04-27 Donald S Trent Heat pipe
US3677329A (en) * 1970-11-16 1972-07-18 Trw Inc Annular heat pipe
US3681843A (en) * 1970-03-06 1972-08-08 Westinghouse Electric Corp Heat pipe wick fabrication
US3892273A (en) * 1973-07-09 1975-07-01 Perkin Elmer Corp Heat pipe lobar wicking arrangement
US3901311A (en) * 1973-01-12 1975-08-26 Grumman Aerospace Corp Self-filling hollow core arterial heat pipe
US3921710A (en) * 1972-08-23 1975-11-25 Tokico Ltd Heat pipe and manufacturing method thereof
US4003427A (en) * 1974-10-15 1977-01-18 Grumman Aerospace Corporation Heat pipe fabrication
US4109709A (en) * 1973-09-12 1978-08-29 Suzuki Metal Industrial Co, Ltd. Heat pipes, process and apparatus for manufacturing same
US5076352A (en) * 1991-02-08 1991-12-31 Thermacore, Inc. High permeability heat pipe wick structure
US6397935B1 (en) * 1995-12-21 2002-06-04 The Furukawa Electric Co. Ltd. Flat type heat pipe
US6427765B1 (en) * 1998-09-29 2002-08-06 Korea Electronics Telecomm Heat-pipe having woven-wired wick and method for manufacturing the same
US20020124995A1 (en) * 2001-03-09 2002-09-12 Seok-Hwan Moon Heat pipe having woven-wire wick and straight-wire wick
US20020185268A1 (en) * 2001-06-07 2002-12-12 Rauch Robert A. Thermal interface wafer and method of making and using the same
US7086454B1 (en) * 2005-03-28 2006-08-08 Jaffe Limited Wick structure of heat pipe
US20060180296A1 (en) * 2005-02-17 2006-08-17 Yuh-Cheng Chemical Ltd. Heat pipe
US20060207749A1 (en) * 2005-03-18 2006-09-21 Jaffe Limited Multi-layer wick structure of heat pipe
US20060213646A1 (en) * 2005-03-28 2006-09-28 Jaffe Limited Wick structure of heat pipe
US7168480B2 (en) * 2004-04-29 2007-01-30 Los Alamos National Security, Llc Off-axis cooling of rotating devices using a crank-shaped heat pipe
US20070034357A1 (en) * 2005-08-12 2007-02-15 Chuen-Shu Hou Heat pipe and method of producing the same
US7293601B2 (en) * 2005-06-15 2007-11-13 Top Way Thermal Management Co., Ltd. Thermoduct
US7647961B2 (en) * 2004-10-25 2010-01-19 Thermal Corp. Heat pipe with axial and lateral flexibility

Patent Citations (23)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US1719679A (en) * 1924-08-04 1929-07-02 Muller-Thym Bernard Wick and process for making same
US3576210A (en) * 1969-12-15 1971-04-27 Donald S Trent Heat pipe
US3681843A (en) * 1970-03-06 1972-08-08 Westinghouse Electric Corp Heat pipe wick fabrication
US3677329A (en) * 1970-11-16 1972-07-18 Trw Inc Annular heat pipe
US3921710A (en) * 1972-08-23 1975-11-25 Tokico Ltd Heat pipe and manufacturing method thereof
US3901311A (en) * 1973-01-12 1975-08-26 Grumman Aerospace Corp Self-filling hollow core arterial heat pipe
US3892273A (en) * 1973-07-09 1975-07-01 Perkin Elmer Corp Heat pipe lobar wicking arrangement
US4109709A (en) * 1973-09-12 1978-08-29 Suzuki Metal Industrial Co, Ltd. Heat pipes, process and apparatus for manufacturing same
US4003427A (en) * 1974-10-15 1977-01-18 Grumman Aerospace Corporation Heat pipe fabrication
US5076352A (en) * 1991-02-08 1991-12-31 Thermacore, Inc. High permeability heat pipe wick structure
US6397935B1 (en) * 1995-12-21 2002-06-04 The Furukawa Electric Co. Ltd. Flat type heat pipe
US6427765B1 (en) * 1998-09-29 2002-08-06 Korea Electronics Telecomm Heat-pipe having woven-wired wick and method for manufacturing the same
US20020124995A1 (en) * 2001-03-09 2002-09-12 Seok-Hwan Moon Heat pipe having woven-wire wick and straight-wire wick
US20020185268A1 (en) * 2001-06-07 2002-12-12 Rauch Robert A. Thermal interface wafer and method of making and using the same
US7168480B2 (en) * 2004-04-29 2007-01-30 Los Alamos National Security, Llc Off-axis cooling of rotating devices using a crank-shaped heat pipe
US7647961B2 (en) * 2004-10-25 2010-01-19 Thermal Corp. Heat pipe with axial and lateral flexibility
US8230907B2 (en) * 2004-10-25 2012-07-31 Thermal Corp. Heat pipe with axial and lateral flexibility
US20060180296A1 (en) * 2005-02-17 2006-08-17 Yuh-Cheng Chemical Ltd. Heat pipe
US20060207749A1 (en) * 2005-03-18 2006-09-21 Jaffe Limited Multi-layer wick structure of heat pipe
US7086454B1 (en) * 2005-03-28 2006-08-08 Jaffe Limited Wick structure of heat pipe
US20060213646A1 (en) * 2005-03-28 2006-09-28 Jaffe Limited Wick structure of heat pipe
US7293601B2 (en) * 2005-06-15 2007-11-13 Top Way Thermal Management Co., Ltd. Thermoduct
US20070034357A1 (en) * 2005-08-12 2007-02-15 Chuen-Shu Hou Heat pipe and method of producing the same

Cited By (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20110027738A1 (en) * 2009-07-30 2011-02-03 Meyer Iv George Anthony Supporting structure with height difference and vapor chamber having the supporting structure
CN103327786A (zh) * 2012-03-21 2013-09-25 联想(北京)有限公司 一种电子设备
US20140060793A1 (en) * 2012-09-06 2014-03-06 Cooler Master Development Corporation Plate-type heat exchanger and support structure thereof
CN103413794A (zh) * 2013-08-16 2013-11-27 中国科学院深圳先进技术研究院 一种半导体功率器件的散热封装结构
CN104822238A (zh) * 2014-01-31 2015-08-05 刘永健 一种散热方法
CN104847476A (zh) * 2014-06-04 2015-08-19 北汽福田汽车股份有限公司 散热单元、散热器及发动机冷却系统
WO2020061976A1 (en) * 2018-09-28 2020-04-02 Intel Corporation Moderated deformation of a vapor chamber to match a shape of a heat source
US11437297B2 (en) 2018-09-28 2022-09-06 Intel Corporation Moderated deformation of a vapor chamber to match a shape of a heat source

Also Published As

Publication number Publication date
CN101929818A (zh) 2010-12-29
JP2011002219A (ja) 2011-01-06

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AS Assignment

Owner name: FU ZHUN PRECISION INDUSTRY (SHEN ZHEN) CO., LTD.,

Free format text: ASSIGNMENT OF ASSIGNORS INTEREST;ASSIGNOR:WANG, DE-YU;REEL/FRAME:023099/0714

Effective date: 20090722

Owner name: FOXCONN TECHNOLOGY CO., LTD., TAIWAN

Free format text: ASSIGNMENT OF ASSIGNORS INTEREST;ASSIGNOR:WANG, DE-YU;REEL/FRAME:023099/0714

Effective date: 20090722

STCB Information on status: application discontinuation

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