US20100111753A1 - Pb-FREE COPPER-BASED SINTERED SLIDING MATERIAL - Google Patents

Pb-FREE COPPER-BASED SINTERED SLIDING MATERIAL Download PDF

Info

Publication number
US20100111753A1
US20100111753A1 US12/527,003 US52700308A US2010111753A1 US 20100111753 A1 US20100111753 A1 US 20100111753A1 US 52700308 A US52700308 A US 52700308A US 2010111753 A1 US2010111753 A1 US 2010111753A1
Authority
US
United States
Prior art keywords
phase
alloy
mass
sliding material
matrix
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
US12/527,003
Other languages
English (en)
Inventor
Daisuke Yoshitome
Takashi Tomikawa
Hitoshi Wada
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Taiho Kogyo Co Ltd
Original Assignee
Taiho Kogyo Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Taiho Kogyo Co Ltd filed Critical Taiho Kogyo Co Ltd
Assigned to TAIHO KOGYO CO., LTD. reassignment TAIHO KOGYO CO., LTD. ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: TOMIKAWA, TAKASHI, WADA, HITOSHI, YOSHITOME, DAISUKE
Publication of US20100111753A1 publication Critical patent/US20100111753A1/en
Abandoned legal-status Critical Current

Links

Images

Classifications

    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C9/00—Alloys based on copper
    • C22C9/02—Alloys based on copper with tin as the next major constituent
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C9/00—Alloys based on copper
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B22—CASTING; POWDER METALLURGY
    • B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
    • B22F5/00—Manufacture of workpieces or articles from metallic powder characterised by the special shape of the product
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C1/00—Making non-ferrous alloys
    • C22C1/04—Making non-ferrous alloys by powder metallurgy
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C1/00—Making non-ferrous alloys
    • C22C1/04—Making non-ferrous alloys by powder metallurgy
    • C22C1/0425—Copper-based alloys
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C32/00—Non-ferrous alloys containing at least 5% by weight but less than 50% by weight of oxides, carbides, borides, nitrides, silicides or other metal compounds, e.g. oxynitrides, sulfides, whether added as such or formed in situ
    • C22C32/0089—Non-ferrous alloys containing at least 5% by weight but less than 50% by weight of oxides, carbides, borides, nitrides, silicides or other metal compounds, e.g. oxynitrides, sulfides, whether added as such or formed in situ with other, not previously mentioned inorganic compounds as the main non-metallic constituent, e.g. sulfides, glass
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C9/00—Alloys based on copper
    • C22C9/06—Alloys based on copper with nickel or cobalt as the next major constituent
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F16—ENGINEERING ELEMENTS AND UNITS; GENERAL MEASURES FOR PRODUCING AND MAINTAINING EFFECTIVE FUNCTIONING OF MACHINES OR INSTALLATIONS; THERMAL INSULATION IN GENERAL
    • F16C—SHAFTS; FLEXIBLE SHAFTS; ELEMENTS OR CRANKSHAFT MECHANISMS; ROTARY BODIES OTHER THAN GEARING ELEMENTS; BEARINGS
    • F16C33/00—Parts of bearings; Special methods for making bearings or parts thereof
    • F16C33/02—Parts of sliding-contact bearings
    • F16C33/04—Brasses; Bushes; Linings
    • F16C33/06—Sliding surface mainly made of metal
    • F16C33/10—Construction relative to lubrication
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F16—ENGINEERING ELEMENTS AND UNITS; GENERAL MEASURES FOR PRODUCING AND MAINTAINING EFFECTIVE FUNCTIONING OF MACHINES OR INSTALLATIONS; THERMAL INSULATION IN GENERAL
    • F16C—SHAFTS; FLEXIBLE SHAFTS; ELEMENTS OR CRANKSHAFT MECHANISMS; ROTARY BODIES OTHER THAN GEARING ELEMENTS; BEARINGS
    • F16C33/00—Parts of bearings; Special methods for making bearings or parts thereof
    • F16C33/02—Parts of sliding-contact bearings
    • F16C33/04—Brasses; Bushes; Linings
    • F16C33/06—Sliding surface mainly made of metal
    • F16C33/12—Structural composition; Use of special materials or surface treatments, e.g. for rust-proofing
    • F16C33/121—Use of special materials
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B22—CASTING; POWDER METALLURGY
    • B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
    • B22F2998/00—Supplementary information concerning processes or compositions relating to powder metallurgy
    • B22F2998/10—Processes characterised by the sequence of their steps
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F16—ENGINEERING ELEMENTS AND UNITS; GENERAL MEASURES FOR PRODUCING AND MAINTAINING EFFECTIVE FUNCTIONING OF MACHINES OR INSTALLATIONS; THERMAL INSULATION IN GENERAL
    • F16C—SHAFTS; FLEXIBLE SHAFTS; ELEMENTS OR CRANKSHAFT MECHANISMS; ROTARY BODIES OTHER THAN GEARING ELEMENTS; BEARINGS
    • F16C2204/00—Metallic materials; Alloys
    • F16C2204/10—Alloys based on copper
    • F16C2204/18—Alloys based on copper with bismuth as the next major constituent

Definitions

  • the present invention relates to a copper-based sliding material, more particularly, to a copper-based sliding material having improved sliding properties notwithstanding inclusion of Pb.
  • Sliding material is required to support a load.
  • this function is performed by Cu.
  • Pb is usually added to a copper alloy.
  • Such Pb is present on the sliding surface of copper alloy elongates due to rise in temperature during sliding.
  • Pb exhibits excellent self lubricating property and plays a role of solid lubricant to prevent seizure.
  • Pb forms a soft dispersion phase, it has conformability and allows solid matter to be embedded therein.
  • Pb is of great concern because of its harmful effect to the human body and environment.
  • Pb is liable to be corroded by acid except sulfuric acid. Coarse lead particles present in Cu alloy lower the load resistance of a bearing.
  • Patent Document 1 Japanese Examined Patent Publication (kokoku) Hei 8-19945 proposes a specific calculation equation, which determines distribution of fine particles. This equation is obtained by counting total Pb particles in a view field of 0.1 mm 2 (10 5 ⁇ m 2 ), and calculating their area in percentage. The obtained value is processed to % average area per particle, which should be 0.1% or less.
  • Patent Document 2 Japanese Examined Patent Publication (kokoku) No. 7-9046) that such carbide hard-particle additives as Cr 2 C 3 , Mo 2 C, WC, VC, and NbC in sintered copper alloy enhance its wear resistance.
  • a copper-alloy powder having an average particle diameter of 10 to 100 ⁇ m and a hard-particle powder having an average particle-diameter of 5 to 150 ⁇ m are mixed with a V-type blender, and then compacted and sintered.
  • Pb is present in the grain boundaries of copper particles (column 4, lines 21-22). This finding is in agreement with a knowledge derived from a phase diagram showing the fact that Pb is virtually not dissolved in solid Cu.
  • Patent Document 3 Japanese Unexamined Patent Publication (kokai) No. 10-3308678
  • a Bi (alloy) phase is present in the three-pronged junctions and their vicinities in the grain boundaries.
  • Patent Document 3 discloses 5 to 50 mass % of Bi phase consisting of Bi or Bi-based alloy.
  • the Bi phase contains at least element of Sn, Ag, or In, in particular, 20% by weight or less Sn, 10% by weight or less Ag, and 5% by weight or less In.
  • a pure Bi powder or Bi powder containing at least one of Sn, Ag, and Bi is mixed with any one of pure Cu powder, bronze powder, and phosphor bronze powder, and the resulting mixture is compressed and sintered.
  • Sintering conditions include 800 degrees C. for 1 hour.
  • In is included in the Bi phase as is described above.
  • In effectively enhances adherence of Cu phase with Bi phase, because In lowers the melting point of Cu.
  • Sn lowers the melting point of Cu.
  • a phase diagram shown in FIG. 1 teaches that a Cu—In liquidus falls steeply in a range of 0 to 20 mass % In. This teaching of phase is believed to be utilized to effectively enhance adherence.
  • Patent Document 4 Japanese Patent No. 34217264 proposes that: hard particles co-present in the Pb or Bi phase of a sintered copper-alloy prevent Pb and Bi from flowing; the hard particles are placed on a cushion formed of the Pb and Bi phase and they attack an opposite shaft in only reduced amounts; and, the once separated hard particles are recaptured by the Pb or Bi phase. Abrasive wear is therefore mitigated.
  • Patent Document 5 Japanese Unexamined Patent Publication No. 2001-220630 discloses that the following structure improves seizure resistance and fatigue resistance of a Cu—Bi (Pb) based sintered sliding material.
  • the wear-resistant intermetallic compound additives present in the peripheries of Bi or Pb phase form convex portions on the surface of copper alloy, while the Bi or Pb phase or Cu matrix form concave portions to form an oil reservoir during sliding.
  • An example of sintering conditions includes 800-920 degrees C. for approximately 15 minutes.
  • Patent Document 6 Japanese Patent No. 3108363 discloses addition of indium (In) to copper alloy for use as a plain bearing. In this method, corrosion resistance of a Cu—Sn—Pb alloy is improved by In diffusion from an In-based overlay to the Cu—Pb—Sn layer.
  • Patent Document 1 Japanese Examined Patent Publication No. Hei 8-11945
  • Patent Document 2 Japanese Examined Patent Publication No. Hei 7-9046
  • Patent Document 3 Japanese Unexamined Patent Publication No. Hei 10-330868
  • Patent Document 4 Japanese Patent No. 3421724
  • Patent Document 5 Japanese Unexamined Patent Publication 2001-220630
  • Patent Document 6 Japanese Patent No. 3108363
  • Non Patent Document No. 1 FRICTION AND MATERIALS, Second Edition (1995), ERNEST RABINOWICZ, John Wiley & Sons. Inc. pages 32, 38.
  • a Pb-free copper-based sintered sliding material provided by the present invention contains 0.5 to 15.0 mass % Bi and 0.3 to 15.0 mass % In, with the balance being Cu and inevitable impurities, and is characterized by the existence of Cu, Bi, and In in the material as follows, namely, a Cu matrix containing In, a Bi phase, and an In concentrated region in said Cu matrix at a boundary of said Bi phase.
  • In content When the In content is less than 0.3%, although In concentrated regions may be formed, they are only slightly effective. On the other hand, when the In content is more than 15%, concentration of In occurs with difficulty, and seizure occurs.
  • the In content is therefore 0.3 to 15.0%.
  • a preferable In content is 0.5 to 6.0%.
  • the following additive elements are added to the copper-based sliding material according to the present invention.
  • 0.5% or less of P can be added to lower melting temperature of Cu and hence improve sinterability.
  • the copper alloy embrittles.
  • a forming temperature of a Cu—P liquid phase is higher than a forming temperature of a Bi liquid phase. This means that when sintering is carried out under the presence of a Cu—P liquid phase, Bi remains in a molten state. Formation temperature of the Bi phase is believed to be lower than the liquid-phase sintering temperature.
  • Ni From 0.1 to 5.0% of Ni can be added to enhance strength and corrosion resistance. When the Ni content is less than 0.1%, Ni is only slightly effective for enhancing strength. On the other hand, when the Ni content exceeds 5.0%, an intermetallic compound is liable to form and the alloy embrittles. Ni is uniformly dissolved in a solid Cu alloy.
  • Hard particles as proposed in Patent Document No. 2, and such Fe-based compound hard-particles as Fe 2 P, Fe 3 P, FeB, Fe 2 B, and Fe 3 B having improved sinterability with Cu alloy, can be added in the present invention.
  • the content of hard particles described in the present paragraph is based on the entire copper-based sintered sliding material. Meanwhile, the content of Bi, In, or the like is based on the material excepting hard particles.
  • seizure resistance and wear resistance are poor.
  • the content of hard particles exceeds 10.0%, the hard particles impair the fatigue resistance and damage an opposite material and lower sinterability.
  • a preferable content of the hard particles is 1.0 to 5.0%.
  • Solid lubricant such as MoS 2 , graphite, and the like can be added in an amount of 5.0% or less to copper alloy as a composite component.
  • the conformability and low adhesion property of copper-based sintered sliding material according to the present invention are obtained from the Bi phase and In-concentrated regions in the copper matrix, respectively.
  • Conformability can be evaluated by hardness of bulk material. That is, the higher the hardness, the better is the conformability. Although hardness of Bi is not as low as Pb, Bi exhibits conformability. Bi and Pb do not form an intermetallic compound with Cu. Bi is not dissolved in solid Cu. Bi therefore forms a minority phase.
  • Structure of the Cu—Bi—In based sintered alloy according to the present invention is formed of Cu, Bi, and In as follows. Sn, In, and the like are contained in the Cu matrix as solutes. Intermetallic compounds such as Cu—Sn, Cu—In, and the like are precipitated in the Cu matrix. The Cu matrix is therefore distinguished from a Bi phase. Bi is present in the boundaries of Cu crystal grains.
  • Cu and Bi are separated from each other in the Cu—Bi binary system.
  • Bi has no solubility in Cu, while In shows solubility in Cu.
  • the solubility of In decreases at lower temperature but remains appreciable even at room temperature (25° C.).
  • the solute In in the Cu matrix diffuses to the Bi liquid phase, which is then converted to a Bi—In liquid phase.
  • the liquid phase and the Cu solid phase are present in mixture.
  • Sintering is carried out under the condition of mixed phases, i.e., a Cu solid phase, and a liquid phase, i.e., a Bi+In liquid phase.
  • P is added, sintering proceeds under the condition of mixed solid and liquid phases. That is, the solid phase is Cu—P solid phase, and the liquid phase is Bi+In liquid phase.
  • the post sintering structure is a mixed Bi and In structure.
  • the structure according to the present invention is as follows.
  • the In phase and Bi phase are separated from each other, In concentration is high around the Bi phase, and an element other than Bi is not detected in the Bi phase.
  • Solubility of In in Cu at low temperature is utilized for the following re-diffusion. That is, In in the liquid phase again diffuses from the Bi phase to the Cu matrix during cooling after sintering. Thus, In concentrated regions are formed.
  • In is uniformly dispersed in the Cu matrix and hence no concentrated region is formed.
  • the above structures can be distinguished from each other, with an EPMA, which detects X-ray intensities of the respective elements.
  • the detected X-ray intensities are converted to color mapping.
  • the granular Cu matrix structure and the Bi-phase boundary structure are distinguished from each other.
  • the In concentration is detected with an EPMA, and, regions corresponding to different In concentrations are obtained.
  • an EPMA product of Nihon Denshi Co. Ltd., type-JXA-8100
  • X-ray detection and color mapping were carried out at an accelerating voltage of 20 kV and a current value of 3 ⁇ 10 ⁇ 8 A.
  • the sintering process as described above is achieved under the following preferable sintering conditions: holding at 750 degrees C. to 950 degrees C. for 20s or longer; and cooling down to the melting point (270 degrees C.) at a cooling speed of essentially 5 degrees C./sec or more.
  • the holding time at sintering is excessively short, diffusion time of solute In from Cu matrix to the Bi liquid phase is not satisfactory long so that In concentrated regions are formed with difficulty.
  • the cooling speed is too high, the diffusion time of In from the Bi+In liquid phase to the Cu matrix is so short that the In concentrated regions are formed with difficulty, as well.
  • the cooling speed is too slow, re-diffusion is promoted to such a level that In is uniformly dispersed in the Cu matrix and hence the concentrated regions are failed to be formed, as well.
  • Sn and Ni are optional elements described hereinabove and are mainly dissolved in the Cu matrix.
  • P forms a Cu—P based minority phase when added in a large amount.
  • the present invention is hereinafter described in detail by way of examples.
  • Cu—Bi—In—Sn based, Cu—Bi—In based, or Cu—Bi based pre alloy powder (particle diameter-150 ⁇ m, atomized powder) is sprayed onto a steel sheet to provide an approximately 1 mm thick layer having a composition showing in Table 1.
  • Primary sintering was carried out at 750-950 degrees C. for 200 seconds of sintering time in a hydrogen-reducing atmosphere. Cooling speed was 20 degrees c/s. Subsequently, rolling was carried out, and then a secondary sintering was carried out under the identical conditions. The resultant sintered compacts were used as test samples. However, in Comparative Examples 1-7 the holding time at sintering was 15 seconds and the other conditions were the same as in the Examples.
  • a bush journal type tester was used for a seizure test. Test samples were worked in a bush form 22 mm in diameter and 10 mm in length. A test was carried out under the following conditions.
  • FIG. 2 shows an EPMA chart of test sample No. 14.
  • FIG. 3 illustrates information obtained from color mapping of In concentration shown in FIG. 2 . The following facts are clear from FIG. 3 .
  • Example product Nos. 18, 20, 22, and 24 exhibited improved property over the Comparative Examples of Table 1.
  • the Ni concentration was uniform in the matrix.
  • P was also dispersed uniformly in the matrix.
  • the sintered copper alloy according to the present invention can be used for various sliding members, such as an AT (automatic transmission) bush, bearings of a connecting rod, and a sliding material of a compressor. High-level seizure resistance attained by the present invention is effectively exhibited in these applications.
  • FIG. 1 a Cu—In binary phase diagram
  • FIG. 2 an EPMA chart showing an In concentrated region
  • FIG. 3 an illustrative drawing of FIG. 2

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • General Engineering & Computer Science (AREA)
  • Inorganic Chemistry (AREA)
  • Manufacturing & Machinery (AREA)
  • Powder Metallurgy (AREA)
  • Sliding-Contact Bearings (AREA)
US12/527,003 2007-02-14 2008-02-13 Pb-FREE COPPER-BASED SINTERED SLIDING MATERIAL Abandoned US20100111753A1 (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2007-032896 2007-02-14
JP2007032896 2007-02-14
PCT/JP2008/052320 WO2008099840A1 (ja) 2007-02-14 2008-02-13 Pbフリー銅基焼結摺動材料

Publications (1)

Publication Number Publication Date
US20100111753A1 true US20100111753A1 (en) 2010-05-06

Family

ID=39690068

Family Applications (1)

Application Number Title Priority Date Filing Date
US12/527,003 Abandoned US20100111753A1 (en) 2007-02-14 2008-02-13 Pb-FREE COPPER-BASED SINTERED SLIDING MATERIAL

Country Status (6)

Country Link
US (1) US20100111753A1 (zh)
EP (1) EP2116620B1 (zh)
JP (1) JP5289065B2 (zh)
KR (1) KR101140191B1 (zh)
CN (1) CN101668870B (zh)
WO (1) WO2008099840A1 (zh)

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20140141282A1 (en) * 2012-11-16 2014-05-22 Daido Metal Company Ltd. Multi-layer slide member
US20140147326A1 (en) * 2008-01-23 2014-05-29 Taiho Kogyo Co., Ltd. Process for production of sintered copper alloy sliding material and sintered copper alloy sliding material
US8845776B2 (en) 2009-04-28 2014-09-30 Taiho Kogyo Co., Ltd. Lead-free copper-based sintered sliding material and sliding parts
US10125818B2 (en) * 2014-12-19 2018-11-13 Cummins Ltd. Turbomachine shaft and journal bearing assembly
CN115612947A (zh) * 2022-10-28 2023-01-17 陕西省机械研究院有限公司 一种粉末冶金摩擦块及制备方法

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101806324A (zh) * 2010-04-15 2010-08-18 浙江长盛滑动轴承有限公司 无铅双金属滑动轴承
CN106763202A (zh) * 2016-12-27 2017-05-31 柳州市金岭汽车配件厂 汽车轴瓦
CN109047768B (zh) * 2018-08-30 2021-07-13 云南科威液态金属谷研发有限公司 一种用于3d打印的低熔点金属线材

Citations (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4551395A (en) * 1984-09-07 1985-11-05 D.A.B. Industries, Inc. Bearing materials
US5489487A (en) * 1993-12-22 1996-02-06 Daido Metal Company Ltd. Cu-Pb alloy bearing
US6025081A (en) * 1995-10-27 2000-02-15 Taiho Kogyo Co., Ltd. Copper-based bearing material and sliding bearing for internal combustion engines
US6254701B1 (en) * 1996-03-14 2001-07-03 Taiho Kogyo Co., Ltd. Copper alloy and sliding bearing having improved seizure resistance
US20010019779A1 (en) * 2000-02-08 2001-09-06 Kenji Sakai Copper alloy sliding material
US20030064239A1 (en) * 2001-12-27 2003-04-03 Daido Metal Company Ltd. Copper-based, sintered sliding material and method of producing same
US6926779B1 (en) * 1999-12-01 2005-08-09 Visteon Global Technologies, Inc. Lead-free copper-based coatings with bismuth for swashplate compressors
US20060000527A1 (en) * 2004-06-10 2006-01-05 Taiho Kogyo Co., Ltd. Pb-free bearing used for fuel-injection pump
US20070042218A1 (en) * 2003-10-08 2007-02-22 Miba Gleitlager Gmbh Alloy, in particular for a bearing coating
US20080095658A1 (en) * 2004-01-15 2008-04-24 Hiromi Yokota Pb-Free Copper-Alloy Sliding Material

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2904355B2 (ja) * 1990-05-25 1999-06-14 大豊工業株式会社 焼結摺動材料の製造方法
US5360591A (en) * 1993-05-17 1994-11-01 Kohler Co. Reduced lead bismuth yellow brass
JPH10330868A (ja) * 1997-06-04 1998-12-15 Toyota Motor Corp 銅基焼結合金
JP4454812B2 (ja) 2000-08-23 2010-04-21 大豊工業株式会社 銅系すべり軸受材料及び内燃機関用すべり軸受

Patent Citations (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4551395A (en) * 1984-09-07 1985-11-05 D.A.B. Industries, Inc. Bearing materials
US5489487A (en) * 1993-12-22 1996-02-06 Daido Metal Company Ltd. Cu-Pb alloy bearing
US6025081A (en) * 1995-10-27 2000-02-15 Taiho Kogyo Co., Ltd. Copper-based bearing material and sliding bearing for internal combustion engines
US6254701B1 (en) * 1996-03-14 2001-07-03 Taiho Kogyo Co., Ltd. Copper alloy and sliding bearing having improved seizure resistance
US6926779B1 (en) * 1999-12-01 2005-08-09 Visteon Global Technologies, Inc. Lead-free copper-based coatings with bismuth for swashplate compressors
US20010019779A1 (en) * 2000-02-08 2001-09-06 Kenji Sakai Copper alloy sliding material
US6652675B2 (en) * 2000-02-08 2003-11-25 Daido Metal Company Ltd. Copper alloy sliding material
US20030064239A1 (en) * 2001-12-27 2003-04-03 Daido Metal Company Ltd. Copper-based, sintered sliding material and method of producing same
US20070042218A1 (en) * 2003-10-08 2007-02-22 Miba Gleitlager Gmbh Alloy, in particular for a bearing coating
US20080095658A1 (en) * 2004-01-15 2008-04-24 Hiromi Yokota Pb-Free Copper-Alloy Sliding Material
US20060000527A1 (en) * 2004-06-10 2006-01-05 Taiho Kogyo Co., Ltd. Pb-free bearing used for fuel-injection pump

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20140147326A1 (en) * 2008-01-23 2014-05-29 Taiho Kogyo Co., Ltd. Process for production of sintered copper alloy sliding material and sintered copper alloy sliding material
US9669461B2 (en) * 2008-01-23 2017-06-06 Taiho Kogyo Co., Ltd. Process for production of sintered copper alloy sliding material and sintered copper alloy sliding material
US8845776B2 (en) 2009-04-28 2014-09-30 Taiho Kogyo Co., Ltd. Lead-free copper-based sintered sliding material and sliding parts
US20140141282A1 (en) * 2012-11-16 2014-05-22 Daido Metal Company Ltd. Multi-layer slide member
US9074629B2 (en) * 2012-11-16 2015-07-07 Daido Metal Company Ltd. Multi-layer slide member
US10125818B2 (en) * 2014-12-19 2018-11-13 Cummins Ltd. Turbomachine shaft and journal bearing assembly
CN115612947A (zh) * 2022-10-28 2023-01-17 陕西省机械研究院有限公司 一种粉末冶金摩擦块及制备方法

Also Published As

Publication number Publication date
KR20090102853A (ko) 2009-09-30
WO2008099840A1 (ja) 2008-08-21
EP2116620A1 (en) 2009-11-11
JP5289065B2 (ja) 2013-09-11
CN101668870A (zh) 2010-03-10
EP2116620A4 (en) 2012-01-04
KR101140191B1 (ko) 2012-05-02
EP2116620B1 (en) 2012-11-07
JPWO2008099840A1 (ja) 2010-05-27
CN101668870B (zh) 2011-10-05

Similar Documents

Publication Publication Date Title
US20100111753A1 (en) Pb-FREE COPPER-BASED SINTERED SLIDING MATERIAL
US7678173B2 (en) Pb-free copper-alloy sliding material
US6854183B2 (en) Lead-free bearing
US6602615B2 (en) Composite sliding material
US9434005B2 (en) Pb-free copper-alloy sliding material, and plain bearing
US8679641B2 (en) Wear resistant lead free alloy bushing and method of making
US7829201B2 (en) Plain bearing
US20030173000A1 (en) Sliding material
JPH09125176A (ja) 銅系すべり軸受材料および内燃機関用すべり軸受
JP2004277883A (ja) 熱間加工アルミニウム合金、その合金から作られた基層と軸受素子
US5665480A (en) Copper-lead alloy bearing
US4471033A (en) Al-Si-Sn Bearing alloy and bearing composite
JP6363931B2 (ja) すべり軸受用銅合金
CN112901661A (zh) 多层滑动轴承元件

Legal Events

Date Code Title Description
AS Assignment

Owner name: TAIHO KOGYO CO., LTD.,JAPAN

Free format text: ASSIGNMENT OF ASSIGNORS INTEREST;ASSIGNORS:YOSHITOME, DAISUKE;TOMIKAWA, TAKASHI;WADA, HITOSHI;SIGNING DATES FROM 20090821 TO 20090828;REEL/FRAME:023332/0414

STCB Information on status: application discontinuation

Free format text: ABANDONED -- FAILURE TO RESPOND TO AN OFFICE ACTION