US20100108205A1 - Method and device for tempering electronic components - Google Patents

Method and device for tempering electronic components Download PDF

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Publication number
US20100108205A1
US20100108205A1 US11/988,927 US98892707A US2010108205A1 US 20100108205 A1 US20100108205 A1 US 20100108205A1 US 98892707 A US98892707 A US 98892707A US 2010108205 A1 US2010108205 A1 US 2010108205A1
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US
United States
Prior art keywords
chamber
components
temperature
test
temperature chamber
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
US11/988,927
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English (en)
Inventor
Maximilian Schaule
Aexander Bauer
Stefan Kurz
Franz Aschl
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Individual
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Individual
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Publication date
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Publication of US20100108205A1 publication Critical patent/US20100108205A1/en
Abandoned legal-status Critical Current

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    • G—PHYSICS
    • G05—CONTROLLING; REGULATING
    • G05D—SYSTEMS FOR CONTROLLING OR REGULATING NON-ELECTRIC VARIABLES
    • G05D23/00—Control of temperature
    • G05D23/19—Control of temperature characterised by the use of electric means
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851—Testing of integrated circuits [IC]
    • G01R31/2855—Environmental, reliability or burn-in testing
    • G01R31/286—External aspects, e.g. related to chambers, contacting devices or handlers
    • G01R31/2862—Chambers or ovens; Tanks
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851—Testing of integrated circuits [IC]
    • G01R31/2855—Environmental, reliability or burn-in testing
    • G01R31/2872—Environmental, reliability or burn-in testing related to electrical or environmental aspects, e.g. temperature, humidity, vibration, nuclear radiation
    • G01R31/2874—Environmental, reliability or burn-in testing related to electrical or environmental aspects, e.g. temperature, humidity, vibration, nuclear radiation related to temperature

Definitions

  • the invention relates to a method and a device for tempering electronic components within a handler for a functional test in accordance with the preamble of claim 1 or 4 .
  • Electronic components in the form of semiconductor components are usually submitted to a special functional test under certain temperatures during or after their production.
  • the temperature range, in which the components are tested can be ⁇ 60° C. to +170° C. for example. It is thus necessary to cool down or heat up the components accordingly.
  • the components can be present in the form of single pieces or a group (strips, lead frames) during the test procedure.
  • Tempering of components is usually performed in a so-called handler, that is to say an automatic handling device for electronic components, which for this purpose has a temperature chamber, wherein the components are pre-tempered to the desired temperature, as well as a test chamber, provided with a chuck, which holds the components while a contact device, introduced from the outside, is placed on the latter in the desired contact position.
  • the components in this case are transported from the temperature chamber to the chuck by means of a special transport device (pick and place unit).
  • conductive tempering in particular has the disadvantage that heat transfer from the plates to the components is inhomogeneous and varied, therefore the temperature distribution over the components is sometimes very inhomogeneous and inexact. Furthermore conductive tempering of several strips in parallel is very costly. In the case of tempering with a liquid medium, wherein special oils are usually used, there is a risk of leakage and the problem that suitable oils are usually only available down to ⁇ 40° C. In addition the components are subject to a sharp change in temperature, which can lead to unusually high thermal loading of the components in a very short time.
  • German Patent DE 10 2004 002 707 A1 a method and a device for tempering electronic semiconductor components for a functional test are disclosed by German Patent DE 10 2004 002 707 A1, wherein the components to be tested are pre-tempered by means of a gas and brought to test temperature by heated gas flowing in a controlled way in the opposite direction.
  • the object of the invention is to create a method and a device of the kind initially specified with which it is possible to carry out tempering of electronic components in a simple, economic, fast and exact way as possible and ingress of ambient air into the temperature and test chamber can be prevented particularly reliably even with fast operating automatic handling devices.
  • the gas pressure inside the test chamber is maintained greater than the gas pressure in the temperature chamber. Furthermore the inlet and the outlet of the temperature chamber are alternately opened and closed so that the gas flows uni-directionally from the test chamber into the temperature chamber and from this into the atmosphere.
  • the gas pressure inside the test chamber is maintained at a greater level than the gas pressure in the temperature chamber and the gas pressure inside the temperature chamber at a greater level than the ambient pressure, it is ensured that the gas flows uni-directionally from the test chamber into the temperature chamber and from this into the atmosphere in a particularly reliable way even when fast operating automatic handling devices with high throughput are used.
  • Uni-directionally means that the gas flows exclusively from the test chamber into the temperature chamber and from there into the atmosphere, and not in the reverse direction.
  • the continuous flow of dry gas prevents freezing up of the contact areas as well as preventing condensation from forming on the chamber walls in low-temperature tests.
  • the inlet and outlet of the temperature chamber are alternately opened and closed, that is to say the inlet and outlet, via which the components are introduced into the temperature chamber or removed from this, are not opened at the same time. Thereby it is guaranteed that dry gas always flows from the temperature chamber to the outside and humid air can never ingress into the temperature chamber and from there into the test chamber.
  • the method according to the invention in particular offers the advantage that the insulation cost is substantially reduced, since only the temperature chamber, but not the test chamber must be extensively insulated. The space required for the test chamber is therefore substantially less. Furthermore a modular concept is easier to implement than a purely convective method since when using a purely convective method the machines must be newly designed over and over again depending on each application. The possibility of the modular concept leads to advantages in planning, extending and re-jigging the system.
  • the method according to the invention offers the advantage that the components are already really well pre-tempered when they arrive at the test chamber. No extremely sharp or rapid changes in temperature occur, so that thermal loading on the components is substantially less. The temperature transition and temperature distribution over several components of a strip is substantially more homogeneous and uniform. Distortions of the strips containing the components can therefore be avoided. Furthermore the method according to the invention renders the possibility of very fast and exact tempering of the components.
  • additional dry gas which expediently consists of dried ambient air, is fed into the test chamber.
  • dry gas which expediently consists of dried ambient air
  • the dry gas fed into the test chamber is at ambient temperature, in addition the drive mechanism for the chuck and the transport device for the components are not exposed to any thermal loads.
  • the device according to the invention offers the same advantages, as described with respect to the method.
  • FIG. 1 is a schematic plan view onto the device according to the invention.
  • FIG. 2 is a schematic illustration for clarification of the chuck.
  • FIG. 1 shows a handler 1 with a temperature chamber 2 and a test chamber 3 .
  • the temperature chamber 2 has an inlet 4 via which a strip 6 with several components 5 arranged next to one another can be introduced into the temperature chamber 2 .
  • the strips 6 are transferred to the handler 1 by a loader 7 .
  • FIG. 1 and FIG. 2 The device shown in FIG. 1 and FIG. 2 is described below on the basis of an example, wherein the components are maintained at low temperature.
  • the inventive concept however can be applied analogously if components are to be heated up.
  • the temperature chamber 2 has a tempering (soak area) area 8 and a transfer area 9 . Tempering the components 5 in the temperature chamber 2 is performed in a convective manner by means of a cold gas 10 , which is produced by a tempering device 11 and fed into the tempering area 8 of the temperature chamber 2 .
  • the tempering device 11 may be a separate unit arranged externally to the handler 1 , as illustrated. Alternatively it is also possible for the tempering device 11 to be integrated with the handler 1 .
  • Liquid nitrogen 12 evaporates in the tempering device 11 , brought to the desired temperature by means of a heater 13 and fed in gaseous form to the tempering area 8 of the temperature chamber 2 .
  • the cold gas 10 is returned in the re-circulation process through the temperature chamber 2 to the transfer area 9 and from there again from the temperature chamber 2 into the tempering device 11 , as illustrated by the arrow 15 .
  • the tempering device 11 as illustrated by the arrow 16 , the cold gas 10 , after mixing with the liquid nitrogen 12 , is again returned to the heater 13 and from there fed into the tempering area 8 .
  • the strip 6 with the components 5 After the strip 6 with the components 5 has been brought to the desired temperature in the tempering area 8 , it is transported to the transfer area 9 . Afterwards the strip 6 can be transported from there by means of transport device 17 (pick and place unit) to a chuck 18 , which is provided in the test chamber 3 .
  • transport device 17 pick and place unit
  • a chuck 18 which is provided in the test chamber 3 .
  • the chuck 18 as shown in detail in FIG. 2 is usually located on a lifting plate 19 , in order to raise the chuck 18 and thus the strips 6 with the components 5 resting on the chuck 18 to a height, at which a contact device 20 can be placed on the electrical contacts of the components 5 .
  • Evenly heated gas at a temperature corresponding to the test temperature is fed into the chuck 18 via a pipe 21 .
  • a plurality of outlet pipes 22 branches off from pipe 21 , in order to subject all components 5 of the strip 6 with evenly heated gas from below.
  • the components 5 are thus brought to the desired temperature in the chuck 18 in a conductive manner by means of the chuck 18 and/or by direct contact with a gas heated accordingly.
  • the lifting plate 19 may have a heating device 23 , for example a heating foil, with which the temperature of the lifting plate 19 and thus that of the chuck 18 can be adjusted as desired.
  • a heating device 23 for example a heating foil
  • the direct contact of the components 5 in the chuck 18 with heated gas is indicated in FIG. 1 with the arrow 24 .
  • Additional or alternative conductive tempering of the chuck 18 which can be carried out in particular by the lifting plate 19 , is indicated with the arrow 25 .
  • a dry gas can be fed into the test chamber 3 , in particular in the form of dried ambient air.
  • This dry gas in particular serves to prevent condensation forming on the wall of the test chamber 3 .
  • the components 5 After testing the strip 6 with the components 5 is returned by means of the transport device 17 from the chuck 18 back into the transfer area 9 of the temperature chamber 2 and can then be removed from the temperature chamber 2 by means of a suitable transport device via an outlet 29 .
  • the components 5 are first transported into a temperature adapting area (de-soak area) 30 , which is located inside the handler 1 and enables the components to be heated up or cooled down to ambient temperature. From there the components 5 can be removed from the handler 1 .
  • the dry gas indicated by the arrow 26 is fed to the test chamber 3 in such a way that the pressure P 1 inside the test chamber 3 is greater than the pressure P 2 in the temperature chamber 2 .
  • the pressure P 2 inside the temperature chamber 2 is again greater than the ambient pressure P a , which prevails in the loader 7 and in the temperature adapting area 30 .
  • the dry gas fed into the test chamber 3 (arrow 26 ) flows uni-directionally from the test chamber 3 into the temperature chamber 2 and from there either into the loader 7 or into the temperature adapting area 30 , as indicated by the arrows 31 , 32 .
  • inlet 4 and outlet 29 of the temperature chamber 2 are alternately opened and/or closed, but not at the same time.
  • the temperature chamber 2 and the test chamber 3 are of modular construction and arranged directly next to one another. Since just in the temperature chamber 2 tempering of the components 5 is performed in a convective manner, it is only necessary to insulate the temperature chamber 2 extensively while the test chamber 3 only has to be insulated to a minimum or not at all.

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  • Engineering & Computer Science (AREA)
  • Environmental & Geological Engineering (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • General Engineering & Computer Science (AREA)
  • Health & Medical Sciences (AREA)
  • Toxicology (AREA)
  • Automation & Control Theory (AREA)
  • Testing Of Individual Semiconductor Devices (AREA)
US11/988,927 2006-04-03 2007-03-29 Method and device for tempering electronic components Abandoned US20100108205A1 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE102006015365A DE102006015365B4 (de) 2006-04-03 2006-04-03 Verfahren und Vorrichtung zum Temperieren von elektronischen Bauelementen
PCT/EP2007/002824 WO2007115699A2 (de) 2006-04-03 2007-03-29 Verfahren und vorrichtung zum temperieren von elektronischen bauelementen

Publications (1)

Publication Number Publication Date
US20100108205A1 true US20100108205A1 (en) 2010-05-06

Family

ID=38513228

Family Applications (1)

Application Number Title Priority Date Filing Date
US11/988,927 Abandoned US20100108205A1 (en) 2006-04-03 2007-03-29 Method and device for tempering electronic components

Country Status (6)

Country Link
US (1) US20100108205A1 (de)
EP (1) EP1889133B1 (de)
AT (1) ATE422256T1 (de)
DE (1) DE102006015365B4 (de)
MY (1) MY163673A (de)
WO (1) WO2007115699A2 (de)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9110097B2 (en) 2012-05-18 2015-08-18 Micronas Gmbh Test system
WO2017056607A1 (ja) * 2015-09-29 2017-04-06 株式会社村田製作所 電子部品の検査装置及び検査方法

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102008003903A1 (de) * 2008-01-10 2009-09-10 Multitest Elektronische Systeme Gmbh Verfahren und Handhabungsvorrichtung zum Handhaben von elektronischen Bauelementen, insbesondere ICs, bei Niedrigtemperaturtests
US7999563B2 (en) 2008-06-24 2011-08-16 Cascade Microtech, Inc. Chuck for supporting and retaining a test substrate and a calibration substrate

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20040080311A1 (en) * 2002-10-28 2004-04-29 Samsung Electronics Co., Ltd. Integrated circuit test system and method

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4918928A (en) * 1987-12-17 1990-04-24 Kabushiki Kaisha Kobe Seikosho Apparatus for testing IC devices at low temperature and cooling bag for use in testing IC devices at low temperature
US20020070745A1 (en) * 2000-04-27 2002-06-13 Johnson James E. Cooling system for burn-in unit
WO2002035169A2 (en) * 2000-10-24 2002-05-02 L'air Liquide, Society Anonyme A Directoire Et Conseil De Surveillance Pour L'etude Et L'exploitation Des Procedes Georges Claude Methods and apparatus for recycling cryogenic liquid or gas from test chamber
US6668570B2 (en) * 2001-05-31 2003-12-30 Kryotech, Inc. Apparatus and method for controlling the temperature of an electronic device under test
KR100542126B1 (ko) * 2003-04-29 2006-01-11 미래산업 주식회사 반도체 소자 테스트 핸들러

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20040080311A1 (en) * 2002-10-28 2004-04-29 Samsung Electronics Co., Ltd. Integrated circuit test system and method

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9110097B2 (en) 2012-05-18 2015-08-18 Micronas Gmbh Test system
WO2017056607A1 (ja) * 2015-09-29 2017-04-06 株式会社村田製作所 電子部品の検査装置及び検査方法
JPWO2017056607A1 (ja) * 2015-09-29 2018-04-05 株式会社村田製作所 電子部品の検査装置及び検査方法

Also Published As

Publication number Publication date
ATE422256T1 (de) 2009-02-15
EP1889133B1 (de) 2009-02-04
DE102006015365A1 (de) 2007-10-11
WO2007115699A3 (de) 2008-01-10
DE102006015365B4 (de) 2009-11-19
EP1889133A2 (de) 2008-02-20
MY163673A (en) 2017-10-13
WO2007115699A2 (de) 2007-10-18

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