US20100006859A1 - Method of Manufacturing Substrates Having Improved Carrier Lifetimes - Google Patents

Method of Manufacturing Substrates Having Improved Carrier Lifetimes Download PDF

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Publication number
US20100006859A1
US20100006859A1 US12/373,145 US37314507A US2010006859A1 US 20100006859 A1 US20100006859 A1 US 20100006859A1 US 37314507 A US37314507 A US 37314507A US 2010006859 A1 US2010006859 A1 US 2010006859A1
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gas
substrate
canceled
silicon carbide
reaction chamber
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US12/373,145
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Gilyong Chung
Mark Loboda
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SK Siltron CSS LLC
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Dow Corning Corp
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Priority to US12/373,145 priority Critical patent/US20100006859A1/en
Assigned to DOW CORNING CORPORATION reassignment DOW CORNING CORPORATION ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: LOBODA, MARK, CHUNG, GILYONG
Publication of US20100006859A1 publication Critical patent/US20100006859A1/en
Priority to US13/745,066 priority patent/US9337027B2/en
Assigned to DDP SPECIALTY ELECTRONIC MATERIALS US 9, LLC reassignment DDP SPECIALTY ELECTRONIC MATERIALS US 9, LLC ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: DOW SILICONES CORPORATION
Assigned to SK SILTRON CSS, LLC reassignment SK SILTRON CSS, LLC ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: DDP SPECIALTY ELECTRONIC MATERIALS US 9, LLC
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02104—Forming layers
    • H01L21/02365—Forming inorganic semiconducting materials on a substrate
    • H01L21/02518—Deposited layers
    • H01L21/02521—Materials
    • H01L21/02524—Group 14 semiconducting materials
    • H01L21/02529—Silicon carbide
    • C—CHEMISTRY; METALLURGY
    • C30—CRYSTAL GROWTH
    • C30B—SINGLE-CRYSTAL GROWTH; UNIDIRECTIONAL SOLIDIFICATION OF EUTECTIC MATERIAL OR UNIDIRECTIONAL DEMIXING OF EUTECTOID MATERIAL; REFINING BY ZONE-MELTING OF MATERIAL; PRODUCTION OF A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; SINGLE CRYSTALS OR HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; AFTER-TREATMENT OF SINGLE CRYSTALS OR A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; APPARATUS THEREFOR
    • C30B29/00—Single crystals or homogeneous polycrystalline material with defined structure characterised by the material or by their shape
    • C30B29/10—Inorganic compounds or compositions
    • C30B29/36—Carbides
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
    • C23C16/22—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the deposition of inorganic material, other than metallic material
    • C23C16/30—Deposition of compounds, mixtures or solid solutions, e.g. borides, carbides, nitrides
    • C23C16/32—Carbides
    • C23C16/325—Silicon carbide
    • C—CHEMISTRY; METALLURGY
    • C30—CRYSTAL GROWTH
    • C30B—SINGLE-CRYSTAL GROWTH; UNIDIRECTIONAL SOLIDIFICATION OF EUTECTIC MATERIAL OR UNIDIRECTIONAL DEMIXING OF EUTECTOID MATERIAL; REFINING BY ZONE-MELTING OF MATERIAL; PRODUCTION OF A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; SINGLE CRYSTALS OR HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; AFTER-TREATMENT OF SINGLE CRYSTALS OR A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; APPARATUS THEREFOR
    • C30B25/00—Single-crystal growth by chemical reaction of reactive gases, e.g. chemical vapour-deposition growth
    • C30B25/02—Epitaxial-layer growth
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02104—Forming layers
    • H01L21/02365—Forming inorganic semiconducting materials on a substrate
    • H01L21/02367—Substrates
    • H01L21/0237—Materials
    • H01L21/02373—Group 14 semiconducting materials
    • H01L21/02378—Silicon carbide
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02104—Forming layers
    • H01L21/02365—Forming inorganic semiconducting materials on a substrate
    • H01L21/02367—Substrates
    • H01L21/02433—Crystal orientation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02104—Forming layers
    • H01L21/02365—Forming inorganic semiconducting materials on a substrate
    • H01L21/02518—Deposited layers
    • H01L21/0257—Doping during depositing
    • H01L21/02573—Conductivity type
    • H01L21/02576—N-type
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02104—Forming layers
    • H01L21/02365—Forming inorganic semiconducting materials on a substrate
    • H01L21/02518—Deposited layers
    • H01L21/0257—Doping during depositing
    • H01L21/02573—Conductivity type
    • H01L21/02579—P-type
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02104—Forming layers
    • H01L21/02365—Forming inorganic semiconducting materials on a substrate
    • H01L21/02612—Formation types
    • H01L21/02617—Deposition types
    • H01L21/0262—Reduction or decomposition of gaseous compounds, e.g. CVD

Definitions

  • the present invention relates to the growth of silicon carbide epitaxial layers.
  • silicon carbide is particularly superior for high power, high frequency, and high temperature electronic devices.
  • Silicon carbide has an extremely high thermal conductivity, and can withstand both high electric fields and high current densities before breakdown. Silicon carbide's wide band gap results in low leakage currents even at high temperatures.
  • silicon carbide is a quite desirable semiconductor material for power devices; i.e., those designed to operate at relatively high voltages.
  • Silicon carbide is, however, a difficult material to work with. Growth processes must be carried out at relatively high temperatures, above at least about 1400° C. for epitaxial growth and approximately 2000° C. for sublimation growth. Additionally, silicon carbide can form over 150 polytypes, many of which are separated by small thermodynamic differences. As a result, single crystal growth of silicon carbide, either by epitaxial layer or bulk crystal, is a challenging process. Finally, silicon carbide's extreme hardness (it is most often industrially used as an abrasive material) contributes to the difficulty in handling it and forming it into appropriate semiconductor devices.
  • CVD chemical vapor deposition
  • source gases such as silane SiH 4 and propane C 3 H 8 for silicon carbide
  • the source gases are typically introduced with a carrier gas, with the carrier gas forming the largest volume of the gas flow.
  • Chemical vapor deposition (CVD) growth processes for silicon carbide have been refined in terms of temperature profiles, gas velocities, gas concentrations, chemistry, and pressure.
  • the selection of conditions used to produce particular epilayers is often a compromise among factors such as desired growth rate, reaction temperature, cycle time, gas volume, equipment cost, doping uniformity, and layer thicknesses.
  • Silicon carbide is a wide band gap semiconductor material with theoretical properties that offer promise to build high performance diodes and transistors. Compared to materials like silicon, these semiconductor devices would be capable of operating at higher power and switching speeds.
  • bipolar devices are known as minority carrier or bipolar devices.
  • the operating characteristics of these types of devices depend on the generation rate and recombination rate of electron hole pairs. The inverse of the rate is called the lifetime.
  • Specific bipolar devices include PiN diodes, insulated gate bipolar transistors (IGBT), thyristors, and bipolar junction transistors.
  • a key material parameter which must be optimized to theoretical levels for semiconductor power device performance is the carrier recombination lifetime.
  • lifetimes are limited by impurities like iron.
  • silicon carbide less is known than silicon, but the best knowledge to date indicates that the lifetime of silicon carbide is degraded by the presence of vacancies and antisites in the crystal lattice. Vacancies are locations where a silicon or carbon atom is absent. An antisite is a location where the wrong atom is located.
  • Semiconductor silicon carbide is typically grown by physical vapor transport methods (also known as sublimation) from solid mixtures which could contain silicon, carbon, silicon carbide, or by chemical vapor deposition (CVD) from gas mixtures of silanes and hydrocarbons. Silicon carbide materials grown by these methods have lifetime's less than 500 ns, too small to realize theoretical device behavior in silicon carbide diodes and transistors. Epitaxial layers of semiconductor silicon carbide often exhibit lifetime values much less than 2 microseconds which is low compared to materials like silicon and low compared to the expected theoretical values for silicon carbide.
  • this invention relates to a method for depositing silicon carbide coating onto a substrate such that the resulting coating has a carrier lifetime of 0.5-1000 microseconds, the method comprising a. introducing a gas mixture comprising a chlorosilane gas, a carbon-containing gas, and hydrogen gas into a reaction chamber containing a substrate; and b. heating the substrate to a temperature of greater than 1000° C. but less than 2000° C.; with the proviso that the pressure within the reaction chamber is maintained in the range of 0.1 to 760 torr.
  • this invention relates to a method for depositing silicon carbide coating onto a substrate such that the resulting coating has a carrier lifetime of 0.5-1000 microseconds, the method comprising a. introducing a gas mixture comprising a non-chlorinated silicon-containing gas, hydrogen chloride, a carbon-containing gas, and hydrogen gas into a reaction chamber containing a substrate; and b. heating the substrate to a temperature of greater than 1000° C. but less than 2000° C.; with the proviso that the pressure within the reaction chamber is maintained in the range of 0.1 to 760 torr.
  • the gas mixture can further comprise a doping gas.
  • the doping gas is exemplified by nitrogen gas, phosphine gas, or trimethylaluminum gas.
  • the chlorosilane gas typically has the formula R w H x Si y Cl z , where y and z are greater than zero, w and x are greater than or equal to zero, and R denotes a hydrocarbon group.
  • the hydrocarbon group is exemplified by hydrocarbon groups containing from 1-3 carbon atoms illustrated by alkyl radicals such as the methyl, ethyl, or propyl, alkenyl radicals such as the vinyl or allyl, halohydrocarbon radicals such as 3-chloropropyl.
  • R group can be identical or different as desired.
  • R is illustrated by monovalent hydrocarbon radicals having from 1 to 3 carbon atoms such as methyl, ethyl, or propyl
  • the value of w is typically from 0 to 3
  • the value of x is typically from 0 to 3
  • the value of y is typically from 1 to 3
  • the value of z is typically from 1 to 3.
  • the chlorosilane gas is illustrated by dichlorosilane gas, trichlorosilane gas, trimethylchlorosilane gas, methylhydrogendichlorosilane gas, dimethylhydrogenchlorosilane gas, dimethyldichlorosilane gas, methyltrichlorosilane gas, or mixtures thereof.
  • the carbon-containing gas in the first embodiment of this invention typically has the formula H a C b Cl c , where a and b are greater than zero, and c is greater than or equal to zero.
  • the carbon-containing gas is exemplified by C 3 H 8 gas, C 2 H 6 gas, CH 3 Cl gas, or CH 3 CH 2 CH 2 Cl gas.
  • the substrate is typically heated to a temperature of from 1200° C. to 1800° C.
  • the substrate can be heated using any conventional means available or the reaction chamber itself can be heated to a temperature sufficient to raise the temperature of the substrate to the desired level.
  • the substrate typically comprises a single crystal silicon carbide substrate or a single crystal silicon wafer. Such substrates are commercially available.
  • the total pressure of the gases in the reaction chamber in the first embodiment can be varied over a wide range from 0.1 to 760 torr and is generally controlled to a level which provides a reasonable rate of epitaxial growth.
  • the pressure within the reaction chamber is typically from 10 to 250 torr, alternatively, pressures in the range of about 80 to 200 torr can be used.
  • the amount of chemical vapor introduced into the reaction chamber in the first embodiment of this invention should be that which allows for a desirable silicon carbide epitaxial layer growth rate, growth uniformity and, doping gas incorporation.
  • Total gas flow rates are typically in the 1-150 liters per minute range, depending on the size of the reaction chamber and the temperature profile.
  • the combined flow rates of the carbon and silicon containing gases are typically in the range of 0.1 to 30% of the total flow rate.
  • Flow rates of doping gases are typically much less than 1% of the total flow rate.
  • the ratio of the flow rates of the carbon containing gas to the silicon containing gas will typically range 0.3 to 3 and are adjusted based on the desired doping gas incorporation efficiency and surface morphology, the ratio is strongly influenced by the reaction chamber design (size, temperature profile, etc.).
  • the first embodiment of the invention can be conducted under static conditions, but it is usually preferred to continuously introduce a controlled amount of the gas mixture into one portion of a chamber while drawing a vacuum from another site in the chamber so as to cause flow of the vapor to be uniform over the area of the substrate.
  • the reaction chamber used in the process of the invention can be any chamber which facilitates the growth of films by a chemical vapor deposition process. Examples of such chambers are described by Nordell et al., Journal Electrochemical Soc., Vol. 143, No. 9, 1996 (page 2910) or Steckl and Li, IEEE Transactions on Electronic Devices, Vol. 39, No. 1, January 1992.
  • the resultant product of the first embodiment is a crystalline 3C, 4H, or 6H silicon carbide coated substrate.
  • the coating can be grown in a wide variety of thicknesses such as from about 1 nm up to 25 cm. The coating can be separated from the substrate and be used as a new substrate if desired.
  • the gas mixture can further comprise a doping gas.
  • the doping gas is as described above for the first embodiment of this invention.
  • the non-chlorinated silicon-containing gas in the second embodiment of this invention has the formula R w H x Si y , where y is greater than zero, w and x are greater than or equal to zero, and R denotes a hydrocarbon group.
  • the hydrocarbon group is as described above.
  • the non-chlorinated silicon-containing gas is illustrated by trimethylhydrogensilane gas, dimethyldihydrogensilane gas, methyltrihydrogensilane gas, or mixtures thereof.
  • the carbon-containing gas in the second embodiment has the formula H a C b Cl c , where a and b are greater than zero, and c is greater than or equal to zero.
  • the carbon-containing gas is illustrated by C 3 H 8 gas, C 2 H 6 gas, CH 3 Cl gas, or CH 3 CH 2 CH 2 Cl gas. It is typical that at least one gas in the gas mixture will contain a chlorine atom.
  • the substrate is typically heated to a temperature of from 1200° C. to 1800° C.
  • the substrate in the second embodiment of this invention is as described above for the first embodiment.
  • the total pressure of the gases in the reaction chamber in the second embodiment can be varied over a wide range from 0.1 to 760 torr and is generally controlled to a level which provides a reasonable rate of epitaxial growth.
  • the pressure within the reaction chamber is typically from 10 to 250 torr, alternatively, pressures in the range of about 80 to 200 torr can be used.
  • the amount of chemical vapor introduced into the reaction chamber in the second embodiment of this invention should be that which allows for a desirable silicon carbide epitaxial layer growth rate, growth uniformity and, doping gas incorporation.
  • Total gas flow rates are typically in the 1-150 liters per minute range, depending on the size of the reaction chamber and the temperature profile.
  • the combined flow rates of the carbon-containing and non-chlorinated silicon-containing gases are typically in the range of 0.1 to 30% of the total flow rate.
  • Flow rates of doping gases are typically much less than 1% of the total flow rate.
  • the ratio of the flow rates of the carbon-containing gas to the non-chlorinated silicon-containing gas will typically range 0.3 to 3 and are adjusted based on the desired doping gas incorporation efficiency and surface morphology, the ratio is strongly influenced by the reaction chamber design (size, temperature profile, etc.). Under these conditions, growth rates in the range of about 1-100 micrometers/hr may generally be achieved.
  • reaction chamber design size, temperature profile, etc.
  • growth rates in the range of about 1-100 micrometers/hr may generally be achieved.
  • the second embodiment of the invention can be conducted under static conditions, but it is usually preferred to continuously introduce a controlled amount of the gas mixture into one portion of a chamber while drawing a vacuum from another site in the chamber so as to cause flow of the vapor to be uniform over the area of the substrate.
  • reaction chamber used in the second embodiment of the invention is as described above for the first embodiment.
  • the resultant product from the second embodiment is a crystalline 3C, 4H, or 6H silicon carbide coated substrate.
  • the coating can be grown in a wide variety of thicknesses such as from about 1 nm up to 25 cm.
  • the coating can be separated from the substrate and be used as a new substrate if desired.
  • the products of the methods in the above embodiments of this invention are useful in semiconductor devices.
  • the product can serve as a single substrate containing a coating or the coating can be separated from the substrate and converted to several substrates.
  • the product can be processed into transistors or diodes or integrated semiconductor devices.
  • this invention also relates to a semiconductor device comprising (i) at least one semiconductor device component and (ii) a substrate comprising a silicon carbide region having a carrier lifetime of 0.5-1000 microseconds.
  • the semiconductor device component is illustrated by transistors and diodes such as PiN diodes, insulated gate bipolar transistors (IGBT), thyristors, and bipolar junction transistors.
  • the substrate is as described above in the two embodiments of this invention.
  • the lifetime value extracted from this technique is a combination of surface recombination rates and bulk recombination rates or lifetimes.
  • One of the silicon carbide wafers (4H n+SiC, 76 mm diameter, 8 degrees tilted to ⁇ 1120>) from Example 1 was individually tested using time resolved photoluminescence spectroscopy and the lifetime was determined from the decay of the photoluminescence signal. The lifetime was evaluated by scanning the material along both the x axis and y axis diameters. When measured by microwave photoconductive decay the sample had a lifetime value range of 5-12 microseconds, when measured by time resolved photoluminescence spectroscopy the lifetime value range was 24 microseconds.
  • This invention minimize lifetime limiting defects in single crystal silicon carbide materials.
  • This invention describes methods to grow silicon carbide with recombination lifetime values more closely approaching theoretical silicon carbide values than other methods currently known in the art of growing silicon carbide.

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  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Power Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Hardware Design (AREA)
  • Manufacturing & Machinery (AREA)
  • General Physics & Mathematics (AREA)
  • Physics & Mathematics (AREA)
  • Materials Engineering (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Organic Chemistry (AREA)
  • Metallurgy (AREA)
  • Inorganic Chemistry (AREA)
  • General Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Mechanical Engineering (AREA)
  • Chemical Vapour Deposition (AREA)
  • Crystals, And After-Treatments Of Crystals (AREA)
US12/373,145 2006-07-19 2007-07-17 Method of Manufacturing Substrates Having Improved Carrier Lifetimes Abandoned US20100006859A1 (en)

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Application Number Priority Date Filing Date Title
US12/373,145 US20100006859A1 (en) 2006-07-19 2007-07-17 Method of Manufacturing Substrates Having Improved Carrier Lifetimes
US13/745,066 US9337027B2 (en) 2006-07-19 2013-01-18 Method of manufacturing substrates having improved carrier lifetimes

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US83183906P 2006-07-19 2006-07-19
PCT/US2007/016192 WO2008011022A1 (en) 2006-07-19 2007-07-17 Method of manufacturing substrates having improved carrier lifetimes
US12/373,145 US20100006859A1 (en) 2006-07-19 2007-07-17 Method of Manufacturing Substrates Having Improved Carrier Lifetimes

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US (2) US20100006859A1 (ko)
EP (1) EP2044244B1 (ko)
JP (3) JP2009544171A (ko)
KR (1) KR101419279B1 (ko)
CN (2) CN101490315A (ko)
AU (1) AU2007275780B2 (ko)
CA (1) CA2657929C (ko)
WO (1) WO2008011022A1 (ko)

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US20110059003A1 (en) * 2009-09-04 2011-03-10 University Of South Carolina Methods of growing a silicon carbide epitaxial layer on a substrate to increase and control carrier lifetime
US20120244684A1 (en) * 2011-03-24 2012-09-27 Kunihiko Suzuki Film-forming apparatus and method
US20150152547A1 (en) * 2012-08-17 2015-06-04 Ihi Corporation Method and apparatus for manufacturing heat-resistant composite material
US10167549B2 (en) * 2014-02-17 2019-01-01 Ihi Corporation Heat-resistant composite material production method and production device
US11183385B2 (en) 2017-09-13 2021-11-23 The 13Th Research Institute Of China Electronics Method for passivating silicon carbide epitaxial layer

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CN101540343B (zh) * 2009-04-14 2011-08-24 西安电子科技大学 偏移场板结构的4H-SiC PiN/肖特基二极管及其制作方法
US20130320357A1 (en) * 2011-04-21 2013-12-05 Nippon Steel & Sumitomo Metal Corporation Epitaxial silicon carbide single crystal substrate and method for producing same
US8860040B2 (en) 2012-09-11 2014-10-14 Dow Corning Corporation High voltage power semiconductor devices on SiC
US9018639B2 (en) 2012-10-26 2015-04-28 Dow Corning Corporation Flat SiC semiconductor substrate
US9738991B2 (en) 2013-02-05 2017-08-22 Dow Corning Corporation Method for growing a SiC crystal by vapor deposition onto a seed crystal provided on a supporting shelf which permits thermal expansion
US9797064B2 (en) 2013-02-05 2017-10-24 Dow Corning Corporation Method for growing a SiC crystal by vapor deposition onto a seed crystal provided on a support shelf which permits thermal expansion
US9279192B2 (en) 2014-07-29 2016-03-08 Dow Corning Corporation Method for manufacturing SiC wafer fit for integration with power device manufacturing technology
KR20180042228A (ko) 2015-07-23 2018-04-25 더 유니버시티 오브 월위크 단결정 실리콘 상에 결정축을 따라서 3C-SiC을 성장시키는 방법
GB2540608A (en) * 2015-07-23 2017-01-25 Univ Warwick Growing epitaxial 3C-SiC on single-crystal silicon
US10968606B2 (en) 2018-12-07 2021-04-06 Caterpillar Trimble Control Technologies Llc Yaw estimation
CN111624460B (zh) * 2020-06-28 2022-10-21 西安奕斯伟材料科技有限公司 一种单晶硅缺陷分布区域的检测方法
IT202000021517A1 (it) 2020-09-11 2022-03-11 Lpe Spa Metodo per deposizione cvd di carburo di silicio con drogaggio di tipo n e reattore epitassiale
CN113913926A (zh) * 2021-10-22 2022-01-11 西安奕斯伟材料科技有限公司 外延反应腔室的恢复方法、外延生长装置及外延晶圆

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