US20090050057A1 - Apparatus for continuous coating - Google Patents

Apparatus for continuous coating Download PDF

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Publication number
US20090050057A1
US20090050057A1 US12/197,638 US19763808A US2009050057A1 US 20090050057 A1 US20090050057 A1 US 20090050057A1 US 19763808 A US19763808 A US 19763808A US 2009050057 A1 US2009050057 A1 US 2009050057A1
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US
United States
Prior art keywords
cooling
continuous coating
accordance
fingers
processing area
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
US12/197,638
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English (en)
Inventor
Hubertus VON DER WAYDBRINK
Siegfried SCHEIBE
Jens Meyer
Andrej WOLF
Uwe TRAEBER
Michael Hentschel
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Von Ardenne Anlagentechnik GmbH
Original Assignee
Von Ardenne Anlagentechnik GmbH
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Von Ardenne Anlagentechnik GmbH filed Critical Von Ardenne Anlagentechnik GmbH
Assigned to VON ARDENNE ANLAGENTECHNIK GMBH reassignment VON ARDENNE ANLAGENTECHNIK GMBH ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: HENTSCHEL, MICHAEL, WOLF, ANDREJ, SCHEIBE, SIEGFRIED, MEYER, JENS, TRAEBER, UWE, VON DER WAYDBRINK, HUBERTUS
Publication of US20090050057A1 publication Critical patent/US20090050057A1/en
Priority to US13/293,266 priority Critical patent/US8470094B2/en
Abandoned legal-status Critical Current

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    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
    • C23C16/44—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
    • C23C16/54—Apparatus specially adapted for continuous coating
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
    • C23C16/44—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
    • C23C16/4401—Means for minimising impurities, e.g. dust, moisture or residual gas, in the reaction chamber

Definitions

  • the invention relates to an apparatus for continuous coating having a chamber wall, which forms a processing chamber, a thermal insulation which forms a processing area within the processing chamber, and a transportation device for substrates located in the processing area with a substrate transportation direction lying in the lengthwise extension of the apparatus for continuous coating.
  • the substrates overlie the side of the transportation device facing the substrate hereinafter referred to as the substrate side.
  • the apparatus for continuous coating includes heating equipment, which heats the substrates.
  • continuous coating apparatus which essentially differ from high-vacuum coating apparatus in that they are used at relatively high pressures, i.e. pressures in the range of 1 to 10 mbar and work at high temperatures in the region of over 600° C.
  • the relatively high pressure is preset using a special process gas.
  • thermal conduction and convection escape the heat transportation mechanisms and convection, through this thermal insulation can be conveniently accomplished by using radiation shields.
  • this function is dispensed with in the case of the continuous coating plants described above, which work with relatively high pressures. If, on account of a higher degree of gas pressure, the mechanisms of thermal conduction and convection additionally have an effect, insulation can take place both through radiation shields of a sufficiently high number, which have been set up accordingly and/or through thermal insulating materials.
  • thermal insulation is required to be installed on the inner side of the chamber wall, which prevents the escape of heat from the processing chamber or at least makes it more difficult for this to happen.
  • Thermal insulation is in particular necessary at high temperatures, in order to keep the heat loss at a minimum. This thermal insulation therefore encloses the processing area. The high temperature is achieved in the processing area by using special heating equipment.
  • cooling elements In high-vacuum coating apparatus, it is common practice to cool parts, which undergo heating through the coating process, for example, the electrodes or bezels, by means of cooling elements. Any other use of these cooling elements is not known in the case of such coating apparatus. In continuous coating apparatus, which work at relatively high pressures of the kind cited earlier, the use of cooling elements was not known previously.
  • the invention is designed to fulfill the task of minimizing unwanted coating, in particular of parts of the apparatus, in order therefore to minimize the expense of maintaining and servicing the apparatus for continuous coating of the type cited in the beginning.
  • this problem is solved in that a condensation element, which extends in the processing area and binds the arising vapor through condensation, is located in the processing area. With this, the condensation element located in the processing chamber reduces unwanted vapor to a considerable extent through condensation.
  • condensation element the coating vapor will reach the surface of the substrates and all excess vapors, which are formed as a consequence of the high pressure and the high temperature in the rest of the processing area, are captured by the condensation element.
  • these condensation elements can then be located in such a skillful manner in the processing area that easy removal becomes possible, such that the entire installation expense is consequently reduced.
  • the design of the condensation element is envisaged as a cooling element connected with a cooling device.
  • This cooling element thus has a clearly cooler temperature than the remaining elements of the processing area, as a result of which the parasitic processing vapor is precipitated primarily on this cooling element.
  • care is taken to ensure that a sufficient temperature difference is constantly maintained vis-à-vis the processing area.
  • the cooling element is located on the side of the transportation device facing away from the substrate side.
  • the cooling element Under the transportation device, i.e. on the side of the transportation device facing away from the substrate side there is mostly an empty chamber, in which, in this version of the invention, the cooling element can be located.
  • the cooling element itself can be so designed that it consists of several individual cooling elements, as a result of which the condensation effect can be distributed over a wider surface area.
  • Water is eminently suitable as a cooling medium as it represents a low-cost and easily available cooling medium. Also, if in principle care has to be taken in the case of vacuum usage so that no leakages take place.
  • the cooling device is advantageous for the cooling device to be similarly water-cooled and consist of a water-cooled cooling block commensurate with it.
  • the individual cooling elements are designed as cooling fingers, which are connected to the cooling block.
  • the condensation surface area is extended through the form of a cooling finger.
  • the cooling fingers can be more easily set up and also replaced.
  • the cooling fingers can also be at a distance from each other, so that a current of gas is allowed into the processing area.
  • the cooling fingers consist of a solid material and are connected to the cooling block with thermal conductivity.
  • the cooling block is connected to the cooling block with thermal conductivity.
  • one is to take care to use a solid material, which displays characteristics of thermal conductivity. As a result, heat will be sucked away from the cooling fingers by the cooling block, so that these are suitable for vapor condensation.
  • This solution is preferred as it fulfills the aim of preventing a cooling medium input in the vacuum chamber.
  • each of the cooling fingers has a hollow chamber, each of which is connected via an intake opening to chambers in the cooling block, which conduct cooling water.
  • each of the intake openings is provided with a screw thread, into each of which a cooling finger can be screwed in with a corresponding screwed pipe connection.
  • a useful type of installation for the cooling fingers consists in positioning the cooling block in the lower area of the processing chamber and arranging the cooling fingers from the lower side of the processing chamber in the direction of the transportation equipment.
  • cooling fingers can stretch from the upper side of the processing chamber in the direction of the transportation equipment.
  • both solutions can also be thought of under certain other circumstances, for example, for the realization of the maximum possible condensation, viz. that the cooling fingers are arranged above and below the transportation equipment.
  • the length of the cooling fingers can be such that they stretch to the transportation equipment without touching it. With this, the complete cross-sectional area so to speak of the processing chamber under the transportation equipment will be blocked to vapor, which tries to cross it. Then the entire parasitic vapor would not be able to enter the area under the substrate.
  • coating behavior can also be influenced by the condensation elements.
  • the changes are symmetrically arranged with respect to both sides. This way, it can occasionally be ensured that a particularly high or particularly low coating rate occurs in the middle, something which can take place following the special features of the coating apparatus. Such an occurrence can be compensated by such an arrangement. But also specifically differing coating rates, for example for the purposes of deliberately achieving different thicknesses of the layers, can be achieved through this.
  • a certain version here envisages that the distances from the middle of the transportation equipment to its outer sides display constant changes, whereby the distances become either larger or smaller.
  • the cross-sectional areas can become larger or smaller. It is useful to design the cooling fingers in such a manner that they have a circular cross-section, whereby the diameter is smaller by one size in proportion to the length of the cooling fingers. Through this, the cooling fingers themselves can be manufactured in a cost effective manner. Apart from this, this solution is to be preferred in cases when the finger is to be directly cooled with water.
  • material for the manufacture of the cooling fingers stainless steel, normal steel, aluminum or any other substance that approximates to the thermal coefficient as the substances named above, are suitable.
  • the most differing substances are particularly suitable, highly thermal conductive substances such as copper, aluminum and Al-coatings for lower finger temperatures, medium thermal conductive substances such as steel for higher finger temperatures, as long as they are sufficiently low for the condensation to take place.
  • each of the cooling fingers can be provided with a removable covering, which cover the surface of the cooling fingers at least partially.
  • a pre-condition for a complete covering is that it enables a degree of condensation worth the mentioning at all, looked at from the perspective of the temperature level, since the transfer of heat from the covering to the cooling finger is insufficient in any case.
  • the coverings with their surfaces would serve the purpose of exclusion, whereby the cooling fingers themselves serve to suck heat out of the coverings, without themselves coming into contact with the condensation. In this way, the expense of servicing and maintenance is lowered even further.
  • FIG. 1 shows a cross-section of an apparatus for continuous coating in accordance with the invention with a row of cooling fingers diagonal to the transportation direction
  • FIG. 2 shows excerpts of a cross-section of the apparatus for continuous coating in accordance with the invention in accordance with FIG. 1 , length-wise to the transportation direction,
  • FIG. 3 shows a design for cooling fingers with a cylindrical thickening at the top
  • FIG. 5 shows a design for the cooling fingers with a partial covering in the lower region of the cooling fingers
  • FIG. 6 shows a design for the cooling fingers with a partial covering in the lower region and at the top of the cooling fingers
  • FIG. 7 shows a design for the cooling fingers with a complete covering of the cooling fingers and shield of the opening in the insulation
  • FIG. 8 shows the temperature behavior at a cooling finger with a slender intake
  • FIG. 9 shows a diagram of the temperature behavior along the finger length of the design in accordance with FIG. 8 .
  • FIG. 10 shows the temperature behavior at a cooling finger with an increased intake
  • FIG. 11 shows a diagram of the temperature behavior at a cooling finger in the version in accordance with FIG. 10 .
  • FIG. 12 shows the temperature behavior at a cooling finger with an increased intake and covering in the lower region
  • FIG. 13 shows a diagram of the temperature behavior along the length of the cooling finger in a version of the finger in accordance with FIG. 12 .
  • the apparatus for continuous coating exhibits a chamber wall 2 forming a processing chamber 1 .
  • Thermal insulation 3 which forms a processing area 4 , is located in this processing chamber 1 .
  • a transportation device 5 is located in the processing area 4 .
  • This transportation device 5 has transportation rollers 6 for the transportation of the substrates 7 as well as drive shafts 8 for powering the transportation rollers 6 .
  • the substrates 7 are coated at a temperature in the range of 500° C. up to typically approx. 600° C. However, the temperature can also be higher than this.
  • the coating of the substrates 7 takes place under a pressure range of 1 to 10 mbar, as a result of which vapor of the material to be coated can spread well in the processing area 4 .
  • These cooling fingers 10 are arranged in a row diagonal to the transportation direction 11 , as can be seen in FIG. 2 .
  • the arrangement of the cooling fingers is however not limited only to the version represented here.
  • these can also be arranged in two rows, one to the left of the substrate and one to the right of it.
  • a cooling block 12 is positioned between the chamber wall 2 and the thermal insulation 3 .
  • This cooling block 12 is connected by a cooling water pipe 13 to a cooling water source, which is not represented here in more detail.
  • the cooling fingers 10 are screwed into intake bores 14 in this cooling block 12 .
  • the cooling fingers 10 are at a distance 15 from each other, so that they cover almost the entire cross-sectional surface of the processing area 4 .
  • the length of the cooling fingers 10 is so designed that they reach into the area of the transportation device 5 .
  • the cooling fingers 10 consist of tubes, so that they form a hollow space 16 inside them, which is connected to the cooling water of the cooling block 12 . Through this arrangement, it becomes possible to lower the temperature of the cooling fingers 10 to a level that is clearly lower than the temperature prevailing in the processing area 4 .
  • the cooling fingers 10 are manufactured out a substance with good thermal conductivity, it is also possible to manufacture these out of a solid substance, so that they are not connected inside with the cooling water, but only the conduction of heat takes place inside the cooling fingers. In this case as well, the cooling fingers 10 display a lower temperature than that prevailing in the processing area 4 .
  • cooling fingers 10 are also coated through this action. As they can be removed relatively easily from the processing area 4 and can be cleaned, it is possible to prevent the parasitic coating of the thermal insulation 3 or the transportation device 5 or other component parts, which are not supposed to be coated. In this, these cooling fingers 10 act as a “vapor trap” so to speak.
  • the cooling fingers 10 are led into the processing area 4 through an opening 17 in the form of a slit in the thermal insulation 3 .
  • a shield 18 which covers the slit-shaped opening 17 on its upper side in order to prevent a parasitic coating of the side walls of the slit-shaped opening 17 .
  • the cooling fingers 10 exhibit not only a simple cylindrical form, but also a cylindrical widening on their upper side. With this, it becomes possible to influence the direction of the temperature profile of the cooling fingers in a targeted manner, so that it is only relatively far in the direction of the cooling block 12 that they exhibit a clearly lower temperature. Through this it is possible to influence the coating of the cooling fingers 10 .
  • the cooling fingers in the lower region 19 can be provided with coverings 20 .
  • this covering 20 it is possible for example to set an almost homogenous temperature profile along the entire length of the cooling fingers.
  • the arrangement of the covering 20 in FIG. 6 shows a similar effect as well.
  • the covering 20 is not only arranged in the lower region 19 of the cooling fingers 10 , but also on the upper side 21 of the cooling fingers.
  • the covering 20 in FIGS. 5 , 6 and also 7 takes over the function of the shield 18 over the slit-shaped opening 17 at the same time.
  • a complete covering 20 of the cooling fingers 10 is represented.
  • the covering 20 is removed from the processing area 4 along with the cooling fingers 10 , only the covering 20 then needs to be removed from the cooling finger and a new covering to be slipped on so that the cooling finger or fingers 10 are ready to be inserted into the processing area 20 once again.
  • the represented shield can also be conversely understood to be locations with a higher degree of deposition.
  • the use of shields can be expedient when particular condensation sites are desired and the finger is not meant to be immediately changed in order to achieve this.
  • the finger e.g. is too high and the condensate grows so high that it touches the transportation system, one could cover the upper end of the finger with radiation shields to such an extent that negligible condensation takes place there.
  • FIG. 8 shows the temperature behavior of a cooling finger with a slim intake, i.e. a continuous cylindrical form with a constant diameter. While, in this example, at a processing temperature of 600° C., a temperature of 490° C. still prevails at the upper region 21 of the cooling fingers 10 , a temperature of only 250° C. can already be measured in the lower region 19 through the action of thermal conductivity in the case of solid substance version of the cooling fingers 10 , or in that heat is conducted by means of cooling water.
  • the temperature behavior along the length of the finger is shown by the graphic representation in FIG. 9 . Here, on the right-hand side, the entry of the cooling finger 10 in the region of the thermal insulation 3 in the slit-shaped opening 17 can be seen.
  • the version of the cooling finger with an increased intake 22 in the lower region 19 of the cooling fingers 10 displays a different temperature behavior.
  • an increased intake 22 means that cooling fingers with a larger diameter are being used in this case.
  • an even clearer lowering of the temperature in the lower region 19 is achieved by means of such an increased intake 22 .

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  • Chemical & Material Sciences (AREA)
  • General Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Physical Vapour Deposition (AREA)
US12/197,638 2007-08-23 2008-08-25 Apparatus for continuous coating Abandoned US20090050057A1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
US13/293,266 US8470094B2 (en) 2007-08-23 2011-11-10 Apparatus for continuous coating

Applications Claiming Priority (2)

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DE102007039950.4 2007-08-23
DE102007039950 2007-08-23

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US13/293,266 Expired - Fee Related US8470094B2 (en) 2007-08-23 2011-11-10 Apparatus for continuous coating

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DE (1) DE102008039430A1 (de)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20140076362A1 (en) * 2012-09-14 2014-03-20 Von Ardenne Anlagentechnik Gmbh Continuous substrate treatment plant and cleaning method
US20140144381A1 (en) * 2011-05-19 2014-05-29 Furukawa Co., Ltd. Method for washing semiconductor manufacturing apparatus component, apparatus for washing semiconductor manufacturing apparatus component, and vapor phase growth apparatus

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102009049954A1 (de) 2009-06-19 2011-02-17 Von Ardenne Anlagentechnik Gmbh Einrichtung zur Temperaturführung von Substraten

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6013134A (en) * 1998-02-18 2000-01-11 International Business Machines Corporation Advance integrated chemical vapor deposition (AICVD) for semiconductor devices
US20060118414A1 (en) * 2004-05-10 2006-06-08 Masahiro Goto Method and apparatus for forming combinatorial film
US20070237894A1 (en) * 2006-04-06 2007-10-11 First Solar U.S. Manufacturing, Llc System and method for transport
US7419566B2 (en) * 2002-07-04 2008-09-02 Siegfried Straemke Plasma reactor

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE19753684C1 (de) 1997-12-03 1999-06-17 Fraunhofer Ges Forschung Einrichtung zur Behandlung von Werkstücken in einem Niederdruck-Plasma
DE102005037822A1 (de) 2005-08-08 2007-02-15 Systec System- Und Anlagentechnik Gmbh & Co.Kg Vakuumbeschichtung mit Kondensatentfernung

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6013134A (en) * 1998-02-18 2000-01-11 International Business Machines Corporation Advance integrated chemical vapor deposition (AICVD) for semiconductor devices
US7419566B2 (en) * 2002-07-04 2008-09-02 Siegfried Straemke Plasma reactor
US20060118414A1 (en) * 2004-05-10 2006-06-08 Masahiro Goto Method and apparatus for forming combinatorial film
US20070237894A1 (en) * 2006-04-06 2007-10-11 First Solar U.S. Manufacturing, Llc System and method for transport

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20140144381A1 (en) * 2011-05-19 2014-05-29 Furukawa Co., Ltd. Method for washing semiconductor manufacturing apparatus component, apparatus for washing semiconductor manufacturing apparatus component, and vapor phase growth apparatus
US10741380B2 (en) 2011-05-19 2020-08-11 Furukawa Co., Ltd. Method for washing semiconductor manufacturing apparatus component, apparatus for washing semiconductor manufacturing apparatus component, and vapor phase growth apparatus
US20140076362A1 (en) * 2012-09-14 2014-03-20 Von Ardenne Anlagentechnik Gmbh Continuous substrate treatment plant and cleaning method
US9452456B2 (en) * 2012-09-14 2016-09-27 Von Ardenne Gmbh Continuous substrate treatment plant and cleaning method

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US8470094B2 (en) 2013-06-25
DE102008039430A1 (de) 2009-02-26
US20120055404A1 (en) 2012-03-08

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