US20090007573A1 - Cryostat assembly - Google Patents

Cryostat assembly Download PDF

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Publication number
US20090007573A1
US20090007573A1 US11/667,307 US66730705A US2009007573A1 US 20090007573 A1 US20090007573 A1 US 20090007573A1 US 66730705 A US66730705 A US 66730705A US 2009007573 A1 US2009007573 A1 US 2009007573A1
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United States
Prior art keywords
assembly according
pumping chamber
adsorption pump
working fluid
adsorption
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
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US11/667,307
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English (en)
Inventor
Paul Geoffrey Noonan
Vladimir Mikheev
Robert Andrew Slade
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Oxford Instruments Superconductivity Ltd
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Oxford Instruments Superconductivity Ltd
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Filing date
Publication date
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Assigned to OXFORD INSTRUMENTS SUPERCONDUCTIVITY LIMITED reassignment OXFORD INSTRUMENTS SUPERCONDUCTIVITY LIMITED ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: MIKHEEV, VLADIMIR, NOONAN, PAUL GEOFFREY, SLADE, ROBERT ANDREW
Publication of US20090007573A1 publication Critical patent/US20090007573A1/en
Abandoned legal-status Critical Current

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Classifications

    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F25REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
    • F25BREFRIGERATION MACHINES, PLANTS OR SYSTEMS; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS
    • F25B17/00Sorption machines, plants or systems, operating intermittently, e.g. absorption or adsorption type
    • F25B17/08Sorption machines, plants or systems, operating intermittently, e.g. absorption or adsorption type the absorbent or adsorbent being a solid, e.g. salt
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F25REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
    • F25DREFRIGERATORS; COLD ROOMS; ICE-BOXES; COOLING OR FREEZING APPARATUS NOT OTHERWISE PROVIDED FOR
    • F25D19/00Arrangement or mounting of refrigeration units with respect to devices or objects to be refrigerated, e.g. infrared detectors
    • F25D19/006Thermal coupling structure or interface
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01RMEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R33/00Arrangements or instruments for measuring magnetic variables
    • G01R33/20Arrangements or instruments for measuring magnetic variables involving magnetic resonance
    • G01R33/28Details of apparatus provided for in groups G01R33/44 - G01R33/64
    • G01R33/282Means specially adapted for hyperpolarisation or for hyperpolarised contrast agents, e.g. for the generation of hyperpolarised gases using optical pumping cells, for storing hyperpolarised contrast agents or for the determination of the polarisation of a hyperpolarised contrast agent
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01RMEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R33/00Arrangements or instruments for measuring magnetic variables
    • G01R33/20Arrangements or instruments for measuring magnetic variables involving magnetic resonance
    • G01R33/28Details of apparatus provided for in groups G01R33/44 - G01R33/64
    • G01R33/30Sample handling arrangements, e.g. sample cells, spinning mechanisms
    • G01R33/31Temperature control thereof
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01RMEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R33/00Arrangements or instruments for measuring magnetic variables
    • G01R33/20Arrangements or instruments for measuring magnetic variables involving magnetic resonance
    • G01R33/28Details of apparatus provided for in groups G01R33/44 - G01R33/64
    • G01R33/38Systems for generation, homogenisation or stabilisation of the main or gradient magnetic field
    • G01R33/3804Additional hardware for cooling or heating of the magnet assembly, for housing a cooled or heated part of the magnet assembly or for temperature control of the magnet assembly
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01RMEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R33/00Arrangements or instruments for measuring magnetic variables
    • G01R33/20Arrangements or instruments for measuring magnetic variables involving magnetic resonance
    • G01R33/28Details of apparatus provided for in groups G01R33/44 - G01R33/64
    • G01R33/38Systems for generation, homogenisation or stabilisation of the main or gradient magnetic field
    • G01R33/381Systems for generation, homogenisation or stabilisation of the main or gradient magnetic field using electromagnets
    • G01R33/3815Systems for generation, homogenisation or stabilisation of the main or gradient magnetic field using electromagnets with superconducting coils, e.g. power supply therefor
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01RMEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R33/00Arrangements or instruments for measuring magnetic variables
    • G01R33/20Arrangements or instruments for measuring magnetic variables involving magnetic resonance
    • G01R33/60Arrangements or instruments for measuring magnetic variables involving magnetic resonance using electron paramagnetic resonance
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01RMEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R33/00Arrangements or instruments for measuring magnetic variables
    • G01R33/20Arrangements or instruments for measuring magnetic variables involving magnetic resonance
    • G01R33/62Arrangements or instruments for measuring magnetic variables involving magnetic resonance using double resonance
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01RMEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R33/00Arrangements or instruments for measuring magnetic variables
    • G01R33/20Arrangements or instruments for measuring magnetic variables involving magnetic resonance
    • G01R33/44Arrangements or instruments for measuring magnetic variables involving magnetic resonance using nuclear magnetic resonance [NMR]
    • G01R33/48NMR imaging systems
    • G01R33/4808Multimodal MR, e.g. MR combined with positron emission tomography [PET], MR combined with ultrasound or MR combined with computed tomography [CT]

Definitions

  • the invention relates to a cryostat assembly, for example for use in nuclear magnet resonance (NMR) or dynamic nuclear polarization (DNP) apparatus.
  • NMR nuclear magnet resonance
  • DNP dynamic nuclear polarization
  • An adsorption pump assembly comprises an adsorption pump formed by an adsorbing material such as charcoal which is in fluid communication with a pumping chamber, typically an elongate pipe defining a closed volume.
  • a working fluid such as helium.
  • the adsorption pump As the adsorption pump is cooled, it adsorbs gaseous helium thus reducing the pressure within the pumping chamber and causing any liquid phase working fluid at a lower end of the pumping chamber to evaporate. This evaporation then cools the lower end.
  • the adsorption pump is heated so as to cause the previously adsorbed gas to be desorbed thus allowing the cooling cycle to repeat.
  • a cryostat assembly comprises:
  • a cooling system including a cold member which is maintained in use at a temperature lower than that of the thermal shield;
  • a first adsorption pump assembly located at least partly within the thermal shield, the first adsorption pump assembly comprising a pumping chamber containing a working fluid, and an adsorption pump in fluid communication with the pumping chamber;
  • a first switch for selectively, thermally connecting the adsorption pump to the thermal shield so as to cause the working fluid to desorb from the adsorption pump
  • a second switch for selectively, thermally connecting the adsorption pump to the cold member so as to cause the working fluid to be adsorbed by the adsorption pump
  • the adsorption pump can be heated by connecting it to the thermal shield and can be cooled by connecting it to the cold member. This avoids the need for any additional electrical heater and overcomes the problems set out above.
  • the cooling system can be provided by any conventional system such as a mechanical or cryo cooler or a liquid cryogen containing vessel, for example containing liquid helium.
  • a mechanical cooler e.g. a PTR or Gifford-McMahon refrigerator
  • a liquid cryogen containing vessel could also be cooled by a mechanical cooler and boil off from that vessel could be used to cool the thermal shield.
  • the pumping chamber typically has an elongate form, for example comprises a pipe, and will normally extend downwardly from the adsorption pump.
  • the full operation of the adsorption pump assembly will be described in more detail below.
  • the second switch is closed in order to cool the adsorption pump which then adsorbs gaseous working fluid causing the liquid phase to evaporate. This evaporation cools the adjacent part of the pumping chamber.
  • the second switch is opened and the first switch closed thus connecting the adsorption pump to the thermal shield.
  • DNP dynamic nuclear polarisation
  • the assembly further comprises a second adsorption pump assembly located at least partly within the thermal shield, the second adsorption pump assembly comprising a pumping chamber containing a working fluid, and an adsorption pump in fluid communication with the pumping chamber;
  • a third switch for selectively, thermally connecting the adsorption pump of the second adsorption pump assembly to the thermal shield so as to cause the working fluid to desorb from the adsorption pump;
  • a fourth switch for selectively thermally connecting the adsorption pump of the second adsorption pump assembly to the cold member so as to cause the working fluid to be adsorbed by the adsorption pump;
  • thermal link between the adsorbing pump assemblies can be achieved by suitably connecting the respective pumping chambers, typically via heat exchangers, with the system to be cooled.
  • a mechanical linkage via a thermal switch could be provided, that switch being operable to close when the temperature of the pumping chamber is less than that of the system to be cooled but otherwise to open.
  • a “thermal diode” arrangement can be provided, typically using a cryogen fluid such as helium which is caused to condense on the pumping chamber and fall towards the system to be cooled and then evaporate. The flow of heat from the system to be cooled back to the pumping chamber is much less efficient than the cooling power in the opposite direction so that while an adsorbing pump assembly is regenerating, little heat passes to it.
  • the thermal shield will at least partly, preferably fully, surround the cold member.
  • no thermal shield is provided within the inner bore of a magnet cooled by the cryostat assembly, or no thermal shield is provided at the bottom of the assembly.
  • An outer annular thermal shield extending only about the first (and second) adsorption pump assemblies is also feasible.
  • the switches can have a conventional form and conveniently comprise gas-gap heat switches. These are activated by supplying helium gas to a gap between a pair of copper plates so as to close the switch, the gas supply being terminated to open the switch.
  • the first and second thermal links are preferably permanently connected between the pumping chambers and the thermal shield although they could be selectively connected via respective switches since the cooling power is only required during the regeneration stage.
  • FIG. 1 is a schematic section through a first example of an NMR system utilizing a cryostat assembly
  • FIG. 2 is a view similar to FIG. 1 but of a modified NMR system
  • FIG. 3 is a view similar to FIG. 1 but of a DNP system.
  • the assembly shown in FIG. 1 comprises an outer vacuum chamber 1 surrounding a thermal shield 2 .
  • a cylindrical helium containing chamber 3 which communicates via a conduit 4 with a source of liquid He4 (not shown).
  • the chamber 3 also communicates via a conduit 5 , which is wrapped around the outside of the thermal shield 2 , with a non-return valve 6 so that helium boiled off from the chamber 3 passes adjacent the thermal shield in order to cool it before being recovered.
  • a further helium chamber 10 is surrounded by the chamber 3 and contains a superconducting magnet 11 .
  • Liquid helium is provided in the chamber 10 as shown at 12 so as to cool the magnet 11 .
  • the helium will exist in gaseous form.
  • a (room temperature) bore will extend into the magnet 11 coincident with its axis, the bore being accessible from outside the vacuum chamber 1 . This has been omitted for clarity.
  • the upper wall of the chamber 10 is formed into a pair of tubular extensions 15 , 16 .
  • each tubular extension 15 , 16 Extending into each tubular extension 15 , 16 is a respective pumping chamber 17 , 18 in the form of an elongate pipe which is closed at its lower end by a heat exchanger 19 , 20 and is also closed at its upper end.
  • Each pumping chamber 17 , 18 contains He 4 as will be described in more detail below.
  • each pumping chamber 17 , 18 is defined by an inner bore of a respective adsorbing pump, or sorb 17 A, 18 A, each pumping chamber and associated sorb defining a respective adsorption refrigerator S 1 ,S 2 .
  • Permanent thermal links 30 , 31 are provided between the chamber 3 and each of the pumping chambers 17 , 18 at positions below the sorbs 17 A, 18 A and a further thermal link between the two pumping chambers as shown at 32 .
  • a further thermal link 33 is coupled via a switch HS 4 with a lower end of the sorb 17 A and a thermal link 34 is connected via a thermal switch HS 3 with the sorb 18 A.
  • each sorb 17 A, 18 A is connected via a respective thermal switch HS 2 ,HS 1 with the thermal shield 2 .
  • the thermal switches HS 1 -HS 4 have a conventional form and conveniently comprise gas-gap heat switches which broadly comprise a pair of metal plates, typically interleaved, defining a gas path therebetween. In order to close the switch, cryogen gas is supplied between the plates so as to form a thermal link between them, while to open the switch, the gas supply is terminated.
  • gas-gap heat switches which broadly comprise a pair of metal plates, typically interleaved, defining a gas path therebetween.
  • cryogen gas is supplied between the plates so as to form a thermal link between them, while to open the switch, the gas supply is terminated.
  • Operation of the switches is controlled by a microprocessor 40 as shown schematically in FIG. 1 .
  • FIG. 2 is substantially the same as that shown in FIG. 1 and so those components which are equivalent have been given the same reference numbers. Again, the room temperature bore has been omitted.
  • the chamber 3 is coupled to a second stage 50 of a pulse-tube refrigerator (PTR) 52 .
  • the first stage 54 of the PTR 52 is coupled to the thermal shield 2 .
  • the second difference is that the magnet 11 is provided in a dry chamber 60 located within the chamber 10 . Consequently, a layer of liquid helium 62 forms above the chamber 60 which is made of a material which provides a suitable thermal link to the magnet 11 .
  • each adsorption refrigerator S 1 ,S 2 The function of the sorb materials such as charcoal in each adsorption refrigerator S 1 ,S 2 is to adsorb gas when it is cooled and to regenerate or desorb gas when it is heated.
  • the sorb material 17 A when the switch HS 4 is closed as shown in FIG. 2 , the sorb material 17 A is cooled and this increases its adsorption capacity so that it will adsorb gas from the pumping chamber 17 .
  • the helium will exist in liquid form. As the gaseous helium is adsorbed, this will reduce the pressure above the heat exchanger causing the liquid to evaporate and in turn causing a reduction in temperature on the heat exchanger 19 .
  • the switch HS 4 is opened and the switch HS 2 closed so as to connect the sorb material 17 A to the warmer temperature of the thermal shield 2 . This will cause gas to desorb from the sorb material and pass down the pumping chamber 17 past the permanent, thermal link 30 to the chamber 3 . This will cause the gas to liquefy and drop further down onto the heat exchanger 19 after which the cycle is repeated.
  • the heat exchanger 19 is cooled below the temperature of 4.2K and this will be thermally communicated to gas within the tubular extension 15 .
  • the gas will therefore be cooled below its liquifying temperature so as to form a liquid which then drops down onto the chamber 60 as shown at 62 .
  • the heat exchanger 19 will be warmer and therefore will not cause gas to liquefy within the tubular extension 15 .
  • Cool S1 to increase its Closed Open Open Closed capacity and reduce the pressure above the liquid helium condensed in step 3. This causes it to evap- orate and initate magnet cooling towards base temp- erature (1.5 K ⁇ T base ⁇ 2.2 K) 5 a) When all of the liquid Open Closed Closed Open below S1 has been evap- orated link S1 to the thermal shield through the heat switch HS2 and use heat from the radiation shield to warm S1 and de- sorb the helium gas within it (this will cause desorp- tion cooling of the shield).
  • Desorpbed helium gas from S1 is in thermal contact with the second stage of the PTR at T PTR vis the non- switchable thermal link be- low S1 and condenses to re- generate the pool of liquid below S1 at T PTR .
  • step 5 In parallel with action a) in step 5 cool S2 to increase its adsorption capacity, re- prise the pressure above the liquid condensed below S2 causing it to evaporate and continue magnet cooling to- wards base temperature.
  • step 6 In parallel with action a) in step 6 cool S1 to in- crease its adsorption capa- city, reduce the pressure above the liquid condensed below S1 causing it to ev- aporate and continue mag- net cooling towards base temperature. 7 Repeat steps 5 and 6 until the magnet reaches T base . Continue this cycle for as long as it is desired to keep the magnet at T base .
  • gaseous helium in the upper section of the chamber 10 in each example and in the tubular sections 15 , 16 acts as a thermal diode so that there is minimal heat flow between the tubular extension 15 and tubular extension 16 and no or minimal heat flow from the heat exchanger 19 , 20 during the desorption phase to the magnet 11 .
  • a permanent link is provided at 30 , 31 between the chamber 3 and the pumping chambers 17 , 18 .
  • FIG. 3 illustrates an example suitable for other applications such as DNP.
  • an outer vacuum chamber 100 surrounds a thermal shield 102 which in turn surrounds a bore 104 into which a DNP insert (not shown) can be located.
  • the DNP insert contains hardware for applying microwaves to a sample to cause dynamic nuclear polarization and hardware for dissolving the sample.
  • Suitable apparatus is described in “Increase in signal-to-noise ratio of >10,000 times in liquid state NMR”, J H Ardenkjaer-Larsen et al, PNAS, Sep. 2, 2003, Vol. 100, no. 18, and in WO-A-02/37132.
  • the bore 104 contains liquid helium 106 into which the sample is immersed.
  • a magnet 108 located in a liquid helium chamber 110 surrounds the bore 104 and this is cooled by a second stage 112 of a two stage PTR 114 .
  • the first stage 116 of the PTR 114 is coupled to the thermal shield 102 .
  • a pumping chamber 120 is located within the thermal shield 102 and is coupled at one end 122 via a thermal switch 124 with the bore 104 .
  • the pumping chamber 120 is closed and contains a coolant He 4 (not shown).
  • the other end 126 of the pumping chamber 120 is defined by the inner bore of a sorb material 128 .
  • the sorb 128 is connected via a thermal switch 130 to the thermal shield 102 and via a thermal switch 132 to the chamber 110 .
  • a weak thermal link 140 is provided between the chamber 120 and the chamber 110 .
  • a particular advantage of this embodiment is that the helium in the bore 104 is entirely separate from that used to cool the magnet 108 . This is an advantage in applications in which the sample must be kept entirely free of contamination, for example if it is to be used as an MR contrast agent.

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  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Thermal Sciences (AREA)
  • General Engineering & Computer Science (AREA)
  • Electromagnetism (AREA)
  • Chemical & Material Sciences (AREA)
  • Combustion & Propulsion (AREA)
  • Containers, Films, And Cooling For Superconductive Devices (AREA)
US11/667,307 2004-11-09 2005-09-27 Cryostat assembly Abandoned US20090007573A1 (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
GB0424725A GB0424725D0 (en) 2004-11-09 2004-11-09 Cryostat assembly
GB0424725.0 2004-11-09
PCT/GB2005/003712 WO2006051251A1 (en) 2004-11-09 2005-09-27 Cryostat assembly

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WO (1) WO2006051251A1 (de)

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US20080246567A1 (en) * 2007-02-05 2008-10-09 Hisashi Isogami Magnetic field generator
US20090051361A1 (en) * 2007-08-24 2009-02-26 Robert Andrew Slade Dnp apparatus
US20100005814A1 (en) * 2008-07-03 2010-01-14 Bruker Biospin Gmbh Method for cooling a cryostat configuration during transport and cryostat configuration with transport cooler unit
CN102288065A (zh) * 2010-06-17 2011-12-21 中国科学院理化技术研究所 热开关及采用这种热开关的测量装置
JP2014068772A (ja) * 2012-09-28 2014-04-21 Hitachi Medical Corp 超電導磁石装置及び磁気共鳴撮像装置
JP2014134334A (ja) * 2013-01-09 2014-07-24 Sumitomo Heavy Ind Ltd 冷凍装置
US9074798B2 (en) 2009-12-28 2015-07-07 Koninklijke Philips N.V. Tubular thermal switch for the cryo-free magnet
US20170115193A1 (en) * 2015-10-21 2017-04-27 Flir Detection, Inc. Manually operated desorber for sensor detector device
US10490329B2 (en) * 2015-04-10 2019-11-26 Mitsubishi Electric Corporation Superconducting magnet
US11287171B1 (en) 2017-07-05 2022-03-29 Rigetti & Co, Llc Heat switches for controlling a flow of heat between thermal stages of a cryostat
US11425841B2 (en) 2019-09-05 2022-08-23 International Business Machines Corporation Using thermalizing material in an enclosure for cooling quantum computing devices
US11576372B2 (en) * 2016-12-19 2023-02-14 Asymptote Ltd. Shipping container

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US20080229928A1 (en) * 2007-03-20 2008-09-25 Urbahn John A Sorption pump with integrated thermal switch
US20080242974A1 (en) * 2007-04-02 2008-10-02 Urbahn John A Method and apparatus to hyperpolarize materials for enhanced mr techniques
US20140123681A1 (en) * 2007-04-02 2014-05-08 General Electric Company Method and apparatus to hyperpolarize materials for enhanced mr techniques
WO2009086430A2 (en) * 2007-12-28 2009-07-09 D-Wave Systems Inc. Systems, methods, and apparatus for cryogenic refrigeration
WO2010020776A2 (en) * 2008-08-19 2010-02-25 Oxford Instruments Molecular Biotools Limited Dynamic nuclear polarisation system
GB2459316B (en) * 2008-09-22 2010-04-07 Oxford Instr Superconductivity Cryogenic cooling apparatus and method using a sleeve with heat transfer member
US10184711B2 (en) 2014-05-19 2019-01-22 General Electric Company Cryogenic cooling system

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US4279127A (en) * 1979-03-02 1981-07-21 Air Products And Chemicals, Inc. Removable refrigerator for maintaining liquefied gas inventory
US4366680A (en) * 1981-01-28 1983-01-04 Lovelace Alan M Administrator Cycling Joule Thomson refrigerator
US4771823A (en) * 1987-08-20 1988-09-20 The United States Of America As Represented By The Administrator Of The National Aeronautics And Space Administration Self-actuating heat switches for redundant refrigeration systems
US4796433A (en) * 1988-01-06 1989-01-10 Helix Technology Corporation Remote recondenser with intermediate temperature heat sink
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US5176003A (en) * 1990-09-05 1993-01-05 Mitsubishi Denki Kabushiki Kaisha Cryostat
US5613367A (en) * 1995-12-28 1997-03-25 General Electric Company Cryogen recondensing superconducting magnet
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Cited By (16)

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Publication number Priority date Publication date Assignee Title
US7764153B2 (en) * 2007-02-05 2010-07-27 Hitachi, Ltd. Magnetic field generator
US20080246567A1 (en) * 2007-02-05 2008-10-09 Hisashi Isogami Magnetic field generator
US20090051361A1 (en) * 2007-08-24 2009-02-26 Robert Andrew Slade Dnp apparatus
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US20100005814A1 (en) * 2008-07-03 2010-01-14 Bruker Biospin Gmbh Method for cooling a cryostat configuration during transport and cryostat configuration with transport cooler unit
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WO2006051251A1 (en) 2006-05-18
GB0424725D0 (en) 2004-12-08

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