US20080311703A1 - Lead frame and a method of manufacturing the same - Google Patents
Lead frame and a method of manufacturing the same Download PDFInfo
- Publication number
- US20080311703A1 US20080311703A1 US12/194,001 US19400108A US2008311703A1 US 20080311703 A1 US20080311703 A1 US 20080311703A1 US 19400108 A US19400108 A US 19400108A US 2008311703 A1 US2008311703 A1 US 2008311703A1
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- US
- United States
- Prior art keywords
- lead
- bar
- frame body
- inner lead
- adhesive layer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Abandoned
Links
- 238000004519 manufacturing process Methods 0.000 title claims description 15
- 239000012790 adhesive layer Substances 0.000 claims description 30
- 238000005520 cutting process Methods 0.000 claims description 22
- 238000004080 punching Methods 0.000 claims description 10
- 230000015572 biosynthetic process Effects 0.000 claims description 9
- 229910052751 metal Inorganic materials 0.000 claims description 7
- 239000002184 metal Substances 0.000 claims description 7
- 230000002787 reinforcement Effects 0.000 abstract description 6
- 230000004048 modification Effects 0.000 description 9
- 238000012986 modification Methods 0.000 description 9
- 239000004065 semiconductor Substances 0.000 description 9
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 8
- 229910052802 copper Inorganic materials 0.000 description 8
- 239000010949 copper Substances 0.000 description 8
- 238000000926 separation method Methods 0.000 description 8
- 238000007747 plating Methods 0.000 description 7
- 238000000059 patterning Methods 0.000 description 6
- 238000009413 insulation Methods 0.000 description 5
- KDLHZDBZIXYQEI-UHFFFAOYSA-N Palladium Chemical compound [Pd] KDLHZDBZIXYQEI-UHFFFAOYSA-N 0.000 description 4
- 238000005304 joining Methods 0.000 description 3
- 238000009966 trimming Methods 0.000 description 3
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 2
- 238000005299 abrasion Methods 0.000 description 2
- 238000005530 etching Methods 0.000 description 2
- 238000000605 extraction Methods 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 229910052763 palladium Inorganic materials 0.000 description 2
- 229910052709 silver Inorganic materials 0.000 description 2
- 239000004332 silver Substances 0.000 description 2
- NIXOWILDQLNWCW-UHFFFAOYSA-N acrylic acid group Chemical group C(C=C)(=O)O NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 230000002411 adverse Effects 0.000 description 1
- 238000004458 analytical method Methods 0.000 description 1
- 230000000712 assembly Effects 0.000 description 1
- 238000000429 assembly Methods 0.000 description 1
- 230000000295 complement effect Effects 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000002955 isolation Methods 0.000 description 1
- 230000005855 radiation Effects 0.000 description 1
- 230000006641 stabilisation Effects 0.000 description 1
- 238000011105 stabilization Methods 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
- H01L23/495—Lead-frames or other flat leads
- H01L23/49541—Geometry of the lead-frame
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
- H01L23/495—Lead-frames or other flat leads
- H01L23/49541—Geometry of the lead-frame
- H01L23/49558—Insulating layers on lead frames, e.g. bridging members
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/50—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor for integrated circuit devices, e.g. power bus, number of leads
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/48—Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the subgroups H01L21/06 - H01L21/326
- H01L21/4814—Conductive parts
- H01L21/4821—Flat leads, e.g. lead frames with or without insulating supports
- H01L21/4842—Mechanical treatment, e.g. punching, cutting, deforming, cold welding
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Definitions
- the present invention relates to a manufacturing method of a lead frame with a bar lead, and particularly relates to a manufacturing method of a lead frame with the bar lead of ring shape.
- a lead frame with the bar lead (it is also called a bus bar) which is a common lead used for stabilization of a power source/GND etc.
- the bar lead of ring shape when arranging the bar lead of ring shape, it is arranged in the region surrounded by the inner lead tip group of each side.
- each inner lead tip is stuck on the sheet member via the insulation member, further, a chip mounting region is formed in the about central part of the sheet member, and the bar lead of ring shape is arranged in the region between the chip mounting region and the tip group of inner leads.
- connection part must be increased, and as a result cutting parts will also increase in number and consideration is needed also about how at the time of cutting to put in a punch, or abrasion of a punch.
- Japanese Unexamined Patent Publication No. Hei 9-252072 has the description about the lead frame of the structure where the tips of a plurality of leads are connected, the analyses about the reinforcement of a lead at the time of increasing a bar lead or the punch at the time of cutting are not made.
- the purpose of the present invention is to offer a manufacturing method of a lead frame which increases rigidity.
- the other purpose of the present invention is to offer a manufacturing method of a lead frame which aims at elongation of lifetime of the punch for cutting.
- the present invention comprises the steps of: preparing a frame body in which tip parts of inner leads are mutually formed in one by a first connection part; preparing a tape member of a shape corresponding to a plurality of inner lead rows; sticking a tip part of each of the inner leads and the first connection part, and the tape member; and after the sticking, removing the first connection part from the frame body by punching and cutting the first connection part from a surface at a side of chip mounting using a punch along tip parts of the inner leads; wherein after the removing, coining of a joined part of the inner lead and the tape member is performed.
- FIG. 1 is a plan view showing an example of the structure of the frame body used for the assembly of the lead frame of Embodiment 1 of the present invention
- FIG. 2 is a plan view showing the structure of the frame body of a modification
- FIG. 3 is an assembly flow diagram showing an example of the assembly procedure of the lead frame of Embodiment 1 of the present invention
- FIG. 4 is a plan view showing an example of the structure after the plating formation in the assembly shown in FIG. 3 ,
- FIG. 5 is a plan view showing an example of the structure after the tape member attachment in the assembly shown in FIG. 3 ,
- FIG. 6 is a plan view showing an example of the structure after the punch in the assembly shown in FIG. 3 ,
- FIG. 7 is a sectional view showing an example of the structure cut along with the A-A line shown in FIG. 6 .
- FIG. 8-FIG . 11 are the plan views showing the structure of the frame body of the modification of Embodiment 1 of the present invention, respectively.
- FIG. 12 is an enlarged partial plan view showing the structure of the frame body of the modification of Embodiment 1 of the present invention.
- FIG. 13 is a sectional view showing an example of the structure of the cutting plane of the width direction of the inner lead in the lead frame of Embodiment 2 of the present invention.
- FIG. 14-FIG . 17 are the sectional views showing the structure of the cutting plane of the width direction of an inner lead of the lead frame of the modification of Embodiment 2 of the present invention.
- the number of elements is not limited to a specific number but can be greater than or less than the specific number unless otherwise specifically indicated or principally apparent that the number is limited to the specific number.
- a lead frame 1 of Embodiment 1 is used for assemblies of such as QFP (Quad Flat Package) which is a semiconductor device with comparatively many pins, and as shown in FIG. 6 and FIG. 7 , it has laminated frame body 1 a which are a plurality of conductor leads and which includes inner lead 1 b or outer lead 1 c , and tape member 2 which is an insulating sheet member.
- QFP Quad Flat Package
- lead frame 1 only one device region corresponding to one semiconductor device is shown in FIG. 6 , and a plurality of device regions shown in FIG. 6 are formed in many rows or one row continuing in a row in lead frame 1 .
- Tape member 2 is joined to frame body 1 a via insulating adhesive layer 2 a , as shown in FIG. 7 .
- tape member 2 has the shape corresponding to an inner lead 1 b row, and it has insulation while it is the quadrangle. It has joined to the tip part of each inner lead 1 b via adhesive layer 2 a formed in this tape member 2 .
- Adhesive layer 2 a is formed from the adhesives of the acrylic system etc., for example.
- Tape member 2 has a chip mounting function, and serves as a chip mounting part on which a semiconductor chip is mounted in the assembly of a semiconductor device.
- through holes 1 m formed by lead trimming are formed at the outside of each bar lead 1 d of square ring shape.
- This through hole 1 m adjoins the tip part of each inner lead 1 b , and is formed along the column direction of inner lead 1 b . Therefore, corresponding to each side of quadrangular tape member 2 , four through holes 1 m are formed.
- corner part lead 1 e is formed between inner leads 1 b of the end portion of adjoining inner lead 1 b groups (i.e., in the corner part between adjoining inner lead groups) as an object for reinforcement of frame body 1 a.
- corner part lead 1 e is formed as the reinforcement, and this is raising the rigidity of lead frame 1 .
- corner part connection part 1 i connects corner part lead 1 e with inner lead 1 b arranged at the end portion of each inner lead group, the rigidity of frame body 1 a is increased by this, and the rigidity of lead frame 1 is also increased.
- the tip part of each inner lead 1 b is not beforehand individually separated at the time of patterning of inner lead 1 b , patterning connected by first connection parts 1 f as that the tip part of each inner lead 1 b might not separate in each inner lead group is performed, and after sticking tape member 2 on frame body 1 a , cutting isolation of the first connection parts 1 f is performed to the whole tape member 2 , and the tip part of each inner lead 1 b is individually separated.
- FIG. 1 shows the shape of only frame body 1 a before the tape member attachment in manufacture of lead frame 1 , and the tip parts of each inner lead 1 b are connected by first connection parts 1 f in each inner lead group. Furthermore, inner lead 1 b of the end portion in each inner lead group and corner part lead 1 e are connected by corner part connection part 1 i.
- FIG. 2 shows the shape of frame body 1 a of a modification, and it has second connection parts 1 g that connect first connection parts 1 f , and bar lead 1 d in addition to the frame shape of FIG. 1 . That is, first connection parts 1 f of each inner lead group and bar lead 1 d corresponding to this are connected by second connection parts 1 g , and this can raise further the rigidity of frame body 1 a and lead frame 1 .
- first connection parts 1 f are made to separate from frame body 1 a , and lead individual separation is performed.
- frame body 1 a as shown in FIG. 1 is formed by patterning shown in FIG. 3 .
- This frame body 1 a is a laminated metal member, and has a plurality of inner leads 1 b arranged corresponding to the electrode row of the semiconductor chip mounted, a plurality of outer leads 1 c formed in one with this, first connection parts 1 f that connect the tip parts of a plurality of inner leads 1 b mutually at one, bar lead 1 d of the square ring shape arranged inside first connection parts 1 f , corner part lead 1 e connected with this bar lead 1 d at the corner part of a bar lead 1 d of the square ring shape, and corner part connection part 1 i which connects inner lead 1 b of the end portion of each inner lead group, and corner part lead 1 e.
- Frame body 1 a is formed with the copper plate etc., and is patterned by press working or etching processing, for example.
- tape member 2 which is an insulating sheet member of the quadrangle corresponding to a plurality of inner lead rows is prepared.
- Adhesive layers 2 a such as thermoplasticity, are formed in surface of at least one of the two at tape member 2 .
- wire connection surface surface at the side of chip mounting
- the region from each tip part to the part where connection with a wire is made is plated, and it plates further also to bar lead 1 d of ring shape, and corner part lead 1 e .
- the plating is silver plating 3 for wire connection, for example.
- palladium plating may be performed or palladium plating may be performed all over frame body 1 a.
- tape member 2 is stuck on frame body 1 a via, for example, adhesive layer 2 a which was beforehand formed in tape member 2 and which is shown in FIG. 7 .
- corner part lead 1 e is arranged also in the free area between the adjacent inner lead groups and the strength is raised by forming corner part lead 1 e which has been arranged between the inner leads of the end portion of each group in the inner lead group which adjoins among four inner lead groups corresponding to each side of bar lead 1 d of square ring shape, and was connected with bar lead 1 d , the rigidity of lead frame 1 with bar lead 1 d of square ring shape can be increased.
- Frame body 1 a shown in FIG. 8-FIG . 11 is a case where corner part lead 1 e connected with bar lead 1 d of square ring shape is exposed to the outside of a semiconductor device as a terminal united with outer lead 1 c.
- corner part lead 1 e is connected with each corner part of bar lead 1 d of square ring shape, this bar lead 1 d and corner part lead 1 e are the things of structure which became independent of each inner lead group, and only first connection parts 1 f that have connected the tip part of each inner lead 1 b are punched at the time of the lead individual separation after tape member attachment.
- Frame body 1 a shown in FIG. 9 is a thing of the structure where first connection parts 1 f are connected with bar lead 1 d by second connection parts 1 g to frame body 1 a shown in FIG. 8 .
- second connection parts 1 g are also cut simultaneously while punching first connection parts 1 f that have connected the tip part of each inner lead 1 b.
- Frame body 1 a shown in FIG. 10 is a thing of the structure which connected corner part lead 1 e with inner lead 1 b of the both sides by corner part connection part 1 i to frame body 1 a shown in FIG. 8 .
- corner part connection part 1 i are also cut simultaneously while punching first connection parts 1 f that have connected the tip part of each inner lead 1 b.
- Frame body 1 a shown in FIG. 11 is a thing of the structure which connected first connection parts 1 f with bar lead 1 d by second connection parts 1 g further to frame body 1 a shown in FIG. 10 .
- corner part connection part 1 i , and second connection parts 1 g are also cut simultaneously while punching first connection parts 1 f that have connected the tip part of each inner lead 1 b.
- the modification shown in FIG. 12 is a case where bar lead 1 d of ring shape is continued and formed in plural lines (for example, three rows), and is the structures where bar lead 1 d of the most inner circumference and middle bar lead 1 d , further middle bar lead 1 d and bar lead 1 d of the outermost periphery were connected by third connection parts 1 h , respectively.
- each frame body 1 a has width narrow parts 1 n by which lead width was narrowly formed near the corner part of bar lead 1 d of an outermost periphery, and middle bar lead 1 d , respectively.
- this width narrow part 1 n avoids the placing region of punch 5 , and forms lead width narrowly so that punch 5 for cutting may be driven into third connection parts 1 h at the time of lead trimming, without hitting against bar lead 1 d .
- edge part 5 a of punch 5 will pass the side part of the width narrow part 1 n of bar lead 1 d at the time of punching, without contacting bar lead 1 d.
- Embodiment 2 explains the method of patterning of frame body 1 a , and the direction of the back-and-front surface of frame body 1 a at the time of joining frame body 1 a and sheet member 4 in manufacture of a lead frame.
- FIG. 13 shows the jointing condition of inner lead 1 b patterned by press working and sheet member 4 .
- burr portion 1 p is formed toward the extracted direction by performing an extraction processing in the extraction direction 6 .
- Sheet member 4 includes insulating adhesive layer 4 a and copper plate (metal plate) 4 b for heat radiation, and, by making the surface at the side of burr portion 1 p formation of inner lead 1 b into wire connection surface 1 k , has joined the surface of the languishing side of the opposite side, and adhesive layer 4 a of sheet member 4 .
- FIG. 14 is the same jointing condition as FIG. 13 , it is the case of frame body 1 a with which flattening of the wire connection surface 1 k was performed by coining. With the structure shown in FIG. 14 , while being able to improve the flatness of wire connection surface 1 k of inner lead 1 b , wire connection surface 1 k can be enlarged and improvement in wire bonding property can be aimed at.
- An adhesive layer includes first adhesive layer 4 c of the insulation arranged at a surface side, and insulating second adhesive layer 4 d harder than this first adhesive layer 4 c in that case.
- burr portion 1 p contacts copper plate 4 b , and can prevent causing an electric short circuit.
- sheet member 4 and each inner lead 1 b can be joined surely, securing insulation with copper plate 4 b and each inner lead 1 b by forming second adhesive layer 4 d harder (a modulus of elasticity being high) than first adhesive layer 4 c between first adhesive layer 4 c and copper plate 4 b , as shown in FIG. 15 .
- a hard binding material or the thick film material of second adhesive layer 4 d is preferred.
- the surface of the opposite side to the surface at the side of burr portion 1 p formation may be joined to first adhesive layer 4 c of sheet member 4 , and performing coining of the surface at the side of burr portion 1 p formation, this surface by which coining was performed, and first adhesive layer 4 c of sheet member 4 may be joined.
- FIG. 16 shows the structure which joined the surface at the side of burr portion 1 p formation of inner lead 1 b to sheet member 4 which includes hard insulating film seat 4 e and insulating first adhesive layer 4 c , and breaking through of burr portion 1 p of inner lead 1 b can be stopped by film seat 4 e.
- Metal plates such as copper plate 4 b , are attached to the surface which is the opposite side to the first adhesive layer 4 c side of film seat 4 e via adhesive layer 4 a .
- the metal plate does not need to be attached and there may not be adhesive layer 4 a in that case, either.
- sheet member 4 should just include insulating adhesive layer 4 a , and metal plates, such as copper plate 4 b , the structure of sheet member 4 can be simplified, and insulation of the metal plate with each inner lead 1 b and bar lead 1 d can also be secured.
- bar lead 1 d of ring shape may be arranged at what row.
- the semiconductor devices assembled using the lead frame shown in Embodiment 1 and 2 may be another semiconductor devices other than QFP.
- the lead frame of the present invention and its manufacturing method are suitable for the lead frame which has a bar lead (common lead), and suitable for the lead frame whose outer lead extends and exists in the four directions especially, and its manufacturing method.
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- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Lead Frames For Integrated Circuits (AREA)
Abstract
A plurality of inner leads, a plurality of outer leads formed in one with each of the inner lead, a bar lead of the square ring shape arranged inside a plurality of inner leads, a corner part lead which has been arranged between the inner leads of the end portion of the inner lead groups which adjoin among four inner lead groups corresponding to each side of the bar lead, and was connected with the bar lead, and a tape member joined to the tip part of each inner lead, a bar lead, and a corner part lead are included. Since the corner part lead is formed as an object for reinforcement of a frame body between adjoining inner lead groups, the rigidity of the lead frame can be increased.
Description
- This application is a continuation of U.S. application Ser. No. 10/569,577, filed Feb. 28, 2006, and which is the National Stage of International Application No. PCT/JP03/011120, filed on Aug. 29, 2003, the contents of which are hereby incorporated by reference into this application.
- The present invention relates to a manufacturing method of a lead frame with a bar lead, and particularly relates to a manufacturing method of a lead frame with the bar lead of ring shape.
- In a lead frame with the bar lead (it is also called a bus bar) which is a common lead used for stabilization of a power source/GND etc., when arranging the bar lead of ring shape, it is arranged in the region surrounded by the inner lead tip group of each side. In that case, each inner lead tip is stuck on the sheet member via the insulation member, further, a chip mounting region is formed in the about central part of the sheet member, and the bar lead of ring shape is arranged in the region between the chip mounting region and the tip group of inner leads.
- If it is going to form a plurality of bar leads of ring shape for reinforcement of a power source/GND, the combination part of each bar lead will increase, therefore a cutting part will also increase. About the various lead frames in which a plurality of bar leads of ring shape were formed, PCT/JP03/06151 have the description.
- When a bar lead increases, since not only connection of a bar lead but a lead pattern becomes complicated, rigidity must be increased also as the whole lead frame and reinforcement of a lead frame is needed. In order to maintain the strength of a frame, a connection part must be increased, and as a result cutting parts will also increase in number and consideration is needed also about how at the time of cutting to put in a punch, or abrasion of a punch.
- Although Japanese Unexamined Patent Publication No. Hei 9-252072 has the description about the lead frame of the structure where the tips of a plurality of leads are connected, the analyses about the reinforcement of a lead at the time of increasing a bar lead or the punch at the time of cutting are not made.
- The purpose of the present invention is to offer a manufacturing method of a lead frame which increases rigidity.
- The other purpose of the present invention is to offer a manufacturing method of a lead frame which aims at elongation of lifetime of the punch for cutting.
- The above-described and the other purposes and novel features of the present invention will become apparent from the description herein and accompanying drawings.
- The present invention comprises the steps of: preparing a frame body in which tip parts of inner leads are mutually formed in one by a first connection part; preparing a tape member of a shape corresponding to a plurality of inner lead rows; sticking a tip part of each of the inner leads and the first connection part, and the tape member; and after the sticking, removing the first connection part from the frame body by punching and cutting the first connection part from a surface at a side of chip mounting using a punch along tip parts of the inner leads; wherein after the removing, coining of a joined part of the inner lead and the tape member is performed.
-
FIG. 1 is a plan view showing an example of the structure of the frame body used for the assembly of the lead frame ofEmbodiment 1 of the present invention, -
FIG. 2 is a plan view showing the structure of the frame body of a modification, -
FIG. 3 is an assembly flow diagram showing an example of the assembly procedure of the lead frame ofEmbodiment 1 of the present invention, -
FIG. 4 is a plan view showing an example of the structure after the plating formation in the assembly shown inFIG. 3 , -
FIG. 5 is a plan view showing an example of the structure after the tape member attachment in the assembly shown inFIG. 3 , -
FIG. 6 is a plan view showing an example of the structure after the punch in the assembly shown inFIG. 3 , -
FIG. 7 is a sectional view showing an example of the structure cut along with the A-A line shown inFIG. 6 , -
FIG. 8-FIG . 11 are the plan views showing the structure of the frame body of the modification ofEmbodiment 1 of the present invention, respectively, -
FIG. 12 is an enlarged partial plan view showing the structure of the frame body of the modification ofEmbodiment 1 of the present invention, -
FIG. 13 is a sectional view showing an example of the structure of the cutting plane of the width direction of the inner lead in the lead frame ofEmbodiment 2 of the present invention, and -
FIG. 14-FIG . 17 are the sectional views showing the structure of the cutting plane of the width direction of an inner lead of the lead frame of the modification ofEmbodiment 2 of the present invention. - Hereafter, embodiments of the invention are explained in detail based on drawings.
- In the below-described embodiments, a description will be made after divided in plural sections or in plural embodiments if necessary for convenience's sake. These plural sections or embodiments are not independent each other, but in a relation such that one is a modification example, details or complementary description of a part or whole of the other one unless otherwise specifically indicated.
- In the below-described embodiments, when a reference is made to the number of elements (including the number, value, amount and range), the number is not limited to a specific number but can be greater than or less than the specific number unless otherwise specifically indicated or principally apparent that the number is limited to the specific number.
- Moreover, in the below-described embodiments, it is needless to say that the constituting elements (including element steps) are not always essential unless otherwise specifically indicated or principally apparent that they are essential.
- Similarly, in the below-described embodiments, when a reference is made to the shape or positional relationship of the constituting elements, that substantially analogous or similar to it is also embraced unless otherwise specifically indicated or principally apparent that it is not. This also applies to the above-described value and range.
- In all the drawings for describing the embodiments, members of a like function will be identified by like reference numerals and overlapping descriptions will be omitted.
- A
lead frame 1 ofEmbodiment 1 is used for assemblies of such as QFP (Quad Flat Package) which is a semiconductor device with comparatively many pins, and as shown inFIG. 6 andFIG. 7 , it has laminatedframe body 1 a which are a plurality of conductor leads and which includesinner lead 1 b orouter lead 1 c, andtape member 2 which is an insulating sheet member. - In
lead frame 1, only one device region corresponding to one semiconductor device is shown inFIG. 6 , and a plurality of device regions shown inFIG. 6 are formed in many rows or one row continuing in a row inlead frame 1. - The fine structure of
lead frame 1 is explained. A plurality ofinner leads 1 b, a plurality ofouter leads 1 c formed in one with each of a plurality ofinner leads 1 b,bar lead 1 d of the square ring shape arranged inside a plurality ofinner leads 1 b,corner part lead 1 e which is arranged between adjoininginner leads 1 b of an end portion of each group in the inner lead groups which adjoin among four inner lead groups corresponding to each side ofbar lead 1 d of square ring shape, and was connected withbar lead 1 d, and tape member (insulating sheet member) 2 joined to the tip part of eachinner lead 1 b,bar lead 1 d, andcorner part lead 1 e are included. -
Tape member 2 is joined toframe body 1 a via insulatingadhesive layer 2 a, as shown inFIG. 7 . - That is,
tape member 2 has the shape corresponding to aninner lead 1 b row, and it has insulation while it is the quadrangle. It has joined to the tip part of eachinner lead 1 b viaadhesive layer 2 a formed in thistape member 2.Adhesive layer 2 a is formed from the adhesives of the acrylic system etc., for example. - Tape
member 2 has a chip mounting function, and serves as a chip mounting part on which a semiconductor chip is mounted in the assembly of a semiconductor device. - In
lead frame 1, throughholes 1 m formed by lead trimming are formed at the outside of eachbar lead 1 d of square ring shape. This throughhole 1 m adjoins the tip part of eachinner lead 1 b, and is formed along the column direction ofinner lead 1 b. Therefore, corresponding to each side ofquadrangular tape member 2, four throughholes 1 m are formed. - In
lead frame 1 ofEmbodiment 1,corner part lead 1 e is formed betweeninner leads 1 b of the end portion of adjoininginner lead 1 b groups (i.e., in the corner part between adjoining inner lead groups) as an object for reinforcement offrame body 1 a. - Namely, since strength is weak only by
tape member 2 in the region oftape member 2 betweencutting area 1 j which is a region where the tip of an inner lead group is punched and which is shown inFIG. 5 , and cuttingarea 1 j which adjoins this,corner part lead 1 e is formed as the reinforcement, and this is raising the rigidity oflead frame 1. - In that case, as shown in
FIG. 1 , as for the width (P) ofcorner part lead 1 e, it is preferred to form more widely than the width (Q) of the tip part ofinner lead 1 b (P>Q), and it can increase the rigidity oflead frame 1 further by this. - While having connected
corner part lead 1 e with the corner part ofbar lead 1 d of ring shape, cornerpart connection part 1 i connectscorner part lead 1 e withinner lead 1 b arranged at the end portion of each inner lead group, the rigidity offrame body 1 a is increased by this, and the rigidity oflead frame 1 is also increased. - As for
lead frame 1 ofEmbodiment 1, the tip part of eachinner lead 1 b is not beforehand individually separated at the time of patterning ofinner lead 1 b, patterning connected byfirst connection parts 1 f as that the tip part of eachinner lead 1 b might not separate in each inner lead group is performed, and after stickingtape member 2 onframe body 1 a, cutting isolation of thefirst connection parts 1 f is performed to thewhole tape member 2, and the tip part of eachinner lead 1 b is individually separated. -
FIG. 1 shows the shape ofonly frame body 1 a before the tape member attachment in manufacture oflead frame 1, and the tip parts of eachinner lead 1 b are connected byfirst connection parts 1 f in each inner lead group. Furthermore,inner lead 1 b of the end portion in each inner lead group andcorner part lead 1 e are connected by cornerpart connection part 1 i. - Therefore, at the time of the lead individual separation after tape member attachment, while punching
first connection parts 1 f using punch 5 (refer toFIG. 12 ) for cutting corresponding to the shape ofcutting area 1 j ofFIG. 1 , cornerpart connection part 1 i is cut, and lead individual separation is performed. -
FIG. 2 shows the shape offrame body 1 a of a modification, and it hassecond connection parts 1 g that connectfirst connection parts 1 f, andbar lead 1 d in addition to the frame shape ofFIG. 1 . That is,first connection parts 1 f of each inner lead group andbar lead 1 d corresponding to this are connected bysecond connection parts 1 g, and this can raise further the rigidity offrame body 1 a andlead frame 1. - At the time of the lead individual separation after tape member attachment of
frame body 1 a shown inFIG. 2 , by punchingfirst connection parts 1 f along the tip parts ofinner lead 1 b, and simultaneously cutting cornerpart connection part 1 i andsecond connection parts 1 g, usingpunch 5 for cutting corresponding to the shape of cuttingarea 1 j ofFIG. 2 ,first connection parts 1 f are made to separate fromframe body 1 a, and lead individual separation is performed. - Next, the manufacturing method of
lead frame 1 ofEmbodiment 1 shown inFIG. 6 andFIG. 7 is explained. - First,
frame body 1 a as shown inFIG. 1 is formed by patterning shown inFIG. 3 . - This
frame body 1 a is a laminated metal member, and has a plurality ofinner leads 1 b arranged corresponding to the electrode row of the semiconductor chip mounted, a plurality ofouter leads 1 c formed in one with this,first connection parts 1 f that connect the tip parts of a plurality ofinner leads 1 b mutually at one,bar lead 1 d of the square ring shape arranged insidefirst connection parts 1 f,corner part lead 1 e connected with thisbar lead 1 d at the corner part of abar lead 1 d of the square ring shape, and cornerpart connection part 1 i which connectsinner lead 1 b of the end portion of each inner lead group, andcorner part lead 1 e. -
Frame body 1 a is formed with the copper plate etc., and is patterned by press working or etching processing, for example. - On the other hand,
tape member 2 which is an insulating sheet member of the quadrangle corresponding to a plurality of inner lead rows is prepared.Adhesive layers 2 a, such as thermoplasticity, are formed in surface of at least one of the two attape member 2. - Then, plating shown in
FIG. 3 is performed. - Here, in wire connection surface (surface at the side of chip mounting) 1 k shown in
FIG. 7 of eachinner lead 1 b, as shown inFIG. 4 , the region from each tip part to the part where connection with a wire is made is plated, and it plates further also to barlead 1 d of ring shape, andcorner part lead 1 e. The plating issilver plating 3 for wire connection, for example. - As a substitute of
silver plating 3, palladium plating may be performed or palladium plating may be performed all overframe body 1 a. - Then, tape attachment shown in
FIG. 3 is performed. - Here, at the surface which is the opposite side to wire
connection surface 1 k of a plurality ofinner lead 1 b shown inFIG. 7 , as shown inFIG. 5 , the tip part of a plurality ofinner leads 1 b,first connection parts 1 f,bar lead 1 d of ring shape,corner part lead 1 e and cornerpart connection part 1 i, andtape member 2 are stuck. - In that case,
tape member 2 is stuck onframe body 1 a via, for example,adhesive layer 2 a which was beforehand formed intape member 2 and which is shown inFIG. 7 . - Then, punching shown in
FIG. 3 is performed. - Here, by cutting corner
part connection part 1 i while punchingfirst connection parts 1 f along the tip part of a plurality ofinner leads 1 b using punch 5 (refer toFIG. 12 ) for cutting corresponding to the shape of cuttingarea 1 j shown inFIG. 1 , and makingfirst connection parts 1 f separate fromframe body 1 a thewhole tape member 2 by this, as a result, as shown inFIG. 6 , throughholes 1 m are formed. - Thus, in manufacture of
lead frame 1 ofEmbodiment 1, by cutting the tip of eachinner lead 1 b, after stickingtape member 2 onframe body 1 a, the generation of the inconvenience that a lead tip bends, a lead pitch shifts in the manufacturing process oflead frame 1, an adverse effect is given on the wire bonding of the assembly of a semiconductor device, and as a result the yield in a lead frame manufacturing process falls can be prevented. - In
lead frame 1 ofEmbodiment 1, sincecorner part lead 1 e is arranged also in the free area between the adjacent inner lead groups and the strength is raised by formingcorner part lead 1 e which has been arranged between the inner leads of the end portion of each group in the inner lead group which adjoins among four inner lead groups corresponding to each side ofbar lead 1 d of square ring shape, and was connected withbar lead 1 d, the rigidity oflead frame 1 withbar lead 1 d of square ring shape can be increased. - As a result, the generation of the waviness of
tape member 2 in the time of lead trimming etc. can be prevented, and improvement in the yield in manufacture oflead frame 1 can be aimed at. - Next, the lead frame of the modification shown in
FIG. 8-FIG . 11 is explained. -
Frame body 1 a shown inFIG. 8-FIG . 11 is a case wherecorner part lead 1 e connected withbar lead 1 d of square ring shape is exposed to the outside of a semiconductor device as a terminal united withouter lead 1 c. - As for
frame body 1 a shown inFIG. 8 ,corner part lead 1 e is connected with each corner part ofbar lead 1 d of square ring shape, thisbar lead 1 d andcorner part lead 1 e are the things of structure which became independent of each inner lead group, and onlyfirst connection parts 1 f that have connected the tip part of eachinner lead 1 b are punched at the time of the lead individual separation after tape member attachment. -
Frame body 1 a shown inFIG. 9 is a thing of the structure wherefirst connection parts 1 f are connected withbar lead 1 d bysecond connection parts 1 g to framebody 1 a shown inFIG. 8 . At the time of the lead individual separation after tape member attachment,second connection parts 1 g are also cut simultaneously while punchingfirst connection parts 1 f that have connected the tip part of eachinner lead 1 b. -
Frame body 1 a shown inFIG. 10 is a thing of the structure which connectedcorner part lead 1 e withinner lead 1 b of the both sides by cornerpart connection part 1 i to framebody 1 a shown inFIG. 8 . At the time of the lead individual separation after tape member attachment, cornerpart connection part 1 i are also cut simultaneously while punchingfirst connection parts 1 f that have connected the tip part of eachinner lead 1 b. -
Frame body 1 a shown inFIG. 11 is a thing of the structure which connectedfirst connection parts 1 f withbar lead 1 d bysecond connection parts 1 g further to framebody 1 a shown inFIG. 10 . At the time of the lead individual separation after tape member attachment, cornerpart connection part 1 i, andsecond connection parts 1 g are also cut simultaneously while punchingfirst connection parts 1 f that have connected the tip part of eachinner lead 1 b. - Next, the modification shown in
FIG. 12 is a case where bar lead 1 d of ring shape is continued and formed in plural lines (for example, three rows), and is the structures where bar lead 1 d of the most inner circumference andmiddle bar lead 1 d, furthermiddle bar lead 1 d andbar lead 1 d of the outermost periphery were connected bythird connection parts 1 h, respectively. - In this
frame body 1 a, each has widthnarrow parts 1 n by which lead width was narrowly formed near the corner part ofbar lead 1 d of an outermost periphery, andmiddle bar lead 1 d, respectively. - As shown in
FIG. 12 , this widthnarrow part 1 n avoids the placing region ofpunch 5, and forms lead width narrowly so thatpunch 5 for cutting may be driven intothird connection parts 1 h at the time of lead trimming, without hitting againstbar lead 1 d. By this, edgepart 5 a ofpunch 5 will pass the side part of the widthnarrow part 1 n ofbar lead 1 d at the time of punching, without contactingbar lead 1 d. - As a result, abrasion of
edge part 5 a ofpunch 5 can be prevented, and elongation of lifetime ofpunch 5 can be aimed at. -
Embodiment 2 explains the method of patterning offrame body 1 a, and the direction of the back-and-front surface offrame body 1 a at the time of joiningframe body 1 a andsheet member 4 in manufacture of a lead frame. -
FIG. 13 shows the jointing condition ofinner lead 1 b patterned by press working andsheet member 4. In press working,burr portion 1 p is formed toward the extracted direction by performing an extraction processing in the extraction direction 6.Sheet member 4 includes insulatingadhesive layer 4 a and copper plate (metal plate) 4 b for heat radiation, and, by making the surface at the side ofburr portion 1 p formation ofinner lead 1 b intowire connection surface 1 k, has joined the surface of the languishing side of the opposite side, andadhesive layer 4 a ofsheet member 4. - Since the surface at the side of the
burr portion 1 p formation by press working has turned to the opposite side ofsheet member 4 in the case of the jointing condition shown inFIG. 13 , it can prevent thatburr portion 1 p breaks throughadhesive layer 4 a, hitscopper plate 4 b, and causes an electric short circuit. - Although
FIG. 14 is the same jointing condition asFIG. 13 , it is the case offrame body 1 a with which flattening of thewire connection surface 1 k was performed by coining. With the structure shown inFIG. 14 , while being able to improve the flatness ofwire connection surface 1 k ofinner lead 1 b,wire connection surface 1 k can be enlarged and improvement in wire bonding property can be aimed at. - In
FIG. 15 , when patterning by press working, it punches from the surface at the side of chip mounting, and the surface at the side ofburr portion 1 p formation ofinner lead 1 b formed of this andsheet member 4 are joined. An adhesive layer includes firstadhesive layer 4 c of the insulation arranged at a surface side, and insulating secondadhesive layer 4 d harder than this firstadhesive layer 4 c in that case. When the surface at the side ofburr portion 1 p formation andsheet member 4 are joined, even ifburr portion 1 p breaks through surface firstadhesive layer 4 c, since secondadhesive layer 4 d is hard, it does not break through secondadhesive layer 4 d. - Therefore, it can prevent that
burr portion 1 pcontacts copper plate 4 b, and can prevent causing an electric short circuit. - In joining of
frame body 1 a and sheet member 4 (tape member 2) which were explained byEmbodiment 1, since inner leads 1 b are a large number, theseinner leads 1 b, bar leads 1 d, andsheet members 4 must be joined surely, therefore the big press pressure at the time of joining must be applied. - That is,
sheet member 4 and eachinner lead 1 b can be joined surely, securing insulation withcopper plate 4 b and eachinner lead 1 b by forming secondadhesive layer 4 d harder (a modulus of elasticity being high) than firstadhesive layer 4 c between firstadhesive layer 4 c andcopper plate 4 b, as shown inFIG. 15 . - A hard binding material or the thick film material of second
adhesive layer 4 d is preferred. - With the structure shown in
FIG. 15 , the surface of the opposite side to the surface at the side ofburr portion 1 p formation may be joined to firstadhesive layer 4 c ofsheet member 4, and performing coining of the surface at the side ofburr portion 1 p formation, this surface by which coining was performed, and firstadhesive layer 4 c ofsheet member 4 may be joined. -
FIG. 16 shows the structure which joined the surface at the side ofburr portion 1 p formation ofinner lead 1 b tosheet member 4 which includes hard insulatingfilm seat 4 e and insulating firstadhesive layer 4 c, and breaking through ofburr portion 1 p ofinner lead 1 b can be stopped byfilm seat 4 e. - Metal plates, such as
copper plate 4 b, are attached to the surface which is the opposite side to the firstadhesive layer 4 c side offilm seat 4 e viaadhesive layer 4 a. However, the metal plate does not need to be attached and there may not beadhesive layer 4 a in that case, either. - In
FIG. 17 , since patterning offrame body 1 a is formed by etching processing, back-and-front both sides ofinner lead 1 b become a flat surface, without formingburr portion 1 p as shown inFIG. 15 . - In adopting the structure which joins this
frame body 1 a andsheet member 4,sheet member 4 should just include insulatingadhesive layer 4 a, and metal plates, such ascopper plate 4 b, the structure ofsheet member 4 can be simplified, and insulation of the metal plate with eachinner lead 1 b andbar lead 1 d can also be secured. - Moreover, it becomes easy to secure a wire bonding region.
- As things mentioned above, the present inventions accomplished by the present inventors were concretely explained based on above embodiments, but the present inventions are not limited by above embodiments, but variations and modifications may be made, of course, in various ways in the limit that does not deviate from the gist.
- In the
Embodiment 1, although the case where the number of the ring ofbar lead 1 d was three or one row was explained,bar lead 1 d of ring shape may be arranged at what row. - The semiconductor devices assembled using the lead frame shown in
Embodiment - As mentioned above, the lead frame of the present invention and its manufacturing method are suitable for the lead frame which has a bar lead (common lead), and suitable for the lead frame whose outer lead extends and exists in the four directions especially, and its manufacturing method.
Claims (1)
1. A manufacturing method of a lead frame having a plurality of inner leads, a plurality of outer leads formed in one with this, and a sheet member joined to a tip part of each inner lead, comprising the steps of:
(a) preparing a frame body in which tip parts of the inner leads are mutually formed in one by a first connection part, and flattening of a wire connection surface of each inner lead;
(b) preparing the sheet member which is formed in a shape corresponding to a plurality of inner lead rows, and includes a metal plate, an insulating first adhesive layer arranged at a surface side, and an insulating second adhesive layer harder than this first adhesive layer;
(c) sticking a tip part of each of the inner leads and the first connection part, and the sheet member; and
(d) after the step (c), removing the first connection part from the frame body by punching and cutting the first connection part using a punch along tip parts of the inner leads;
wherein in the step (c), the inner lead and the sheet member are stuck making a surface at a side of burr formation of the inner lead contact to at least the first adhesive layer of the sheet member.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
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US12/194,001 US20080311703A1 (en) | 2003-08-29 | 2008-08-19 | Lead frame and a method of manufacturing the same |
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
PCT/JP2003/011120 WO2005024944A1 (en) | 2003-08-29 | 2003-08-29 | Lead frame and method of manufacturing the lead frame |
US10/569,577 US7413930B2 (en) | 2003-08-29 | 2003-08-29 | Lead frame and method of manufacturing the lead frame |
US12/194,001 US20080311703A1 (en) | 2003-08-29 | 2008-08-19 | Lead frame and a method of manufacturing the same |
Related Parent Applications (2)
Application Number | Title | Priority Date | Filing Date |
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US10/569,577 Continuation US7413930B2 (en) | 2003-08-29 | 2003-08-29 | Lead frame and method of manufacturing the lead frame |
PCT/JP2003/011120 Continuation WO2005024944A1 (en) | 2003-08-29 | 2003-08-29 | Lead frame and method of manufacturing the lead frame |
Publications (1)
Publication Number | Publication Date |
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US20080311703A1 true US20080311703A1 (en) | 2008-12-18 |
Family
ID=34260099
Family Applications (2)
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US10/569,577 Expired - Fee Related US7413930B2 (en) | 2003-08-29 | 2003-08-29 | Lead frame and method of manufacturing the lead frame |
US12/194,001 Abandoned US20080311703A1 (en) | 2003-08-29 | 2008-08-19 | Lead frame and a method of manufacturing the same |
Family Applications Before (1)
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US10/569,577 Expired - Fee Related US7413930B2 (en) | 2003-08-29 | 2003-08-29 | Lead frame and method of manufacturing the lead frame |
Country Status (7)
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US (2) | US7413930B2 (en) |
JP (1) | JP4223512B2 (en) |
KR (1) | KR101010114B1 (en) |
CN (1) | CN100390984C (en) |
AU (1) | AU2003261856A1 (en) |
TW (1) | TWI230444B (en) |
WO (1) | WO2005024944A1 (en) |
Families Citing this family (9)
Publication number | Priority date | Publication date | Assignee | Title |
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WO2005024944A1 (en) * | 2003-08-29 | 2005-03-17 | Renesas Technology Corp. | Lead frame and method of manufacturing the lead frame |
JP4628996B2 (en) * | 2006-06-01 | 2011-02-09 | 新光電気工業株式会社 | Lead frame, manufacturing method thereof, and semiconductor device |
JP2009099905A (en) * | 2007-10-19 | 2009-05-07 | Rohm Co Ltd | Semiconductor device |
US8383962B2 (en) * | 2009-04-08 | 2013-02-26 | Marvell World Trade Ltd. | Exposed die pad package with power ring |
CN102044514A (en) * | 2010-04-29 | 2011-05-04 | 中颖电子股份有限公司 | Chip lead bonding region and semiconductor device using same |
JP6095997B2 (en) * | 2013-02-13 | 2017-03-15 | エスアイアイ・セミコンダクタ株式会社 | Manufacturing method of resin-encapsulated semiconductor device |
US9607933B2 (en) * | 2014-02-07 | 2017-03-28 | Dawning Leading Technology Inc. | Lead frame structure for quad flat no-lead package, quad flat no-lead package and method for forming the lead frame structure |
CN104183545B (en) * | 2014-07-14 | 2017-05-17 | 申宇慈 | Method for manufacturing wire frame body and wire frame body |
CN104103620B (en) * | 2014-07-29 | 2017-02-15 | 日月光封装测试(上海)有限公司 | Lead frame and semiconductor packaging body |
Citations (2)
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US5936303A (en) * | 1996-06-28 | 1999-08-10 | Kabushiki Kaisha Gotoh Seisakusho | Plastic molded semiconductor package |
US7413930B2 (en) * | 2003-08-29 | 2008-08-19 | Renesas Technology Corp. | Lead frame and method of manufacturing the lead frame |
Family Cites Families (13)
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JP2918342B2 (en) | 1990-12-25 | 1999-07-12 | 新光電気工業株式会社 | Lead frame and manufacturing method thereof |
JP2679913B2 (en) | 1992-04-06 | 1997-11-19 | 日電精密工業株式会社 | Lead frame manufacturing method |
JP3230889B2 (en) * | 1993-04-07 | 2001-11-19 | 新光電気工業株式会社 | Lead frame manufacturing method |
JP3362948B2 (en) | 1994-03-03 | 2003-01-07 | アピックヤマダ株式会社 | Lead frame manufacturing method |
JPH08204100A (en) | 1995-01-27 | 1996-08-09 | Matsushita Electric Ind Co Ltd | Method of manufacturing lead frame with heat-radiation plate |
KR0182509B1 (en) * | 1995-06-29 | 1999-03-20 | 김광호 | Lead frame having extended tia-bar and semiconductor chip package using it |
KR970013267A (en) * | 1995-08-30 | 1997-03-29 | 김광호 | Lead frame with die pad and internal leads connected by insulating tape |
KR970077418A (en) * | 1996-05-23 | 1997-12-12 | 김광호 | Manufacturing method of hardened dough using lead frame |
JPH1022432A (en) | 1996-06-28 | 1998-01-23 | Mitsui High Tec Inc | Manufacture of lead frame |
JPH10135259A (en) * | 1996-11-01 | 1998-05-22 | Makoo Kk | Method of forming leads of ic |
JP3090096B2 (en) | 1997-07-10 | 2000-09-18 | 日本電気株式会社 | Semiconductor device and manufacturing method thereof |
JPH11214603A (en) * | 1998-01-28 | 1999-08-06 | Hitachi Cable Ltd | Lead frame and its manufacture |
JP3892139B2 (en) * | 1998-03-27 | 2007-03-14 | 株式会社ルネサステクノロジ | Semiconductor device |
-
2003
- 2003-08-29 WO PCT/JP2003/011120 patent/WO2005024944A1/en active Application Filing
- 2003-08-29 KR KR1020067004015A patent/KR101010114B1/en not_active IP Right Cessation
- 2003-08-29 AU AU2003261856A patent/AU2003261856A1/en not_active Abandoned
- 2003-08-29 CN CNB038269945A patent/CN100390984C/en not_active Expired - Fee Related
- 2003-08-29 JP JP2005508757A patent/JP4223512B2/en not_active Expired - Fee Related
- 2003-08-29 US US10/569,577 patent/US7413930B2/en not_active Expired - Fee Related
- 2003-09-23 TW TW092126221A patent/TWI230444B/en not_active IP Right Cessation
-
2008
- 2008-08-19 US US12/194,001 patent/US20080311703A1/en not_active Abandoned
Patent Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5936303A (en) * | 1996-06-28 | 1999-08-10 | Kabushiki Kaisha Gotoh Seisakusho | Plastic molded semiconductor package |
US7413930B2 (en) * | 2003-08-29 | 2008-08-19 | Renesas Technology Corp. | Lead frame and method of manufacturing the lead frame |
Also Published As
Publication number | Publication date |
---|---|
JP4223512B2 (en) | 2009-02-12 |
CN1820368A (en) | 2006-08-16 |
KR101010114B1 (en) | 2011-01-24 |
US7413930B2 (en) | 2008-08-19 |
TW200512892A (en) | 2005-04-01 |
AU2003261856A1 (en) | 2005-03-29 |
US20070001271A1 (en) | 2007-01-04 |
WO2005024944A1 (en) | 2005-03-17 |
TWI230444B (en) | 2005-04-01 |
CN100390984C (en) | 2008-05-28 |
KR20060079845A (en) | 2006-07-06 |
JPWO2005024944A1 (en) | 2006-11-16 |
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