CN114496966A - Strip structure, connecting sheet structure and packaging structure - Google Patents

Strip structure, connecting sheet structure and packaging structure Download PDF

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Publication number
CN114496966A
CN114496966A CN202111679704.2A CN202111679704A CN114496966A CN 114496966 A CN114496966 A CN 114496966A CN 202111679704 A CN202111679704 A CN 202111679704A CN 114496966 A CN114496966 A CN 114496966A
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connection
units
cutting
force
unit
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CN202111679704.2A
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Chinese (zh)
Inventor
叶永生
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Semiconductor Manufacturing Electronics Shaoxing Corp SMEC
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Semiconductor Manufacturing Electronics Shaoxing Corp SMEC
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Priority to CN202111679704.2A priority Critical patent/CN114496966A/en
Publication of CN114496966A publication Critical patent/CN114496966A/en
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/34—Strap connectors, e.g. copper straps for grounding power devices; Manufacturing methods related thereto
    • H01L24/39—Structure, shape, material or disposition of the strap connectors after the connecting process
    • H01L24/40—Structure, shape, material or disposition of the strap connectors after the connecting process of an individual strap connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/495—Lead-frames or other flat leads
    • H01L23/49517—Additional leads
    • H01L23/49524—Additional leads the additional leads being a tape carrier or flat leads
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    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/495—Lead-frames or other flat leads
    • H01L23/49541—Geometry of the lead-frame
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    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/02—Bonding areas; Manufacturing methods related thereto
    • H01L2224/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
    • H01L2224/06—Structure, shape, material or disposition of the bonding areas prior to the connecting process of a plurality of bonding areas
    • H01L2224/0601—Structure
    • H01L2224/0603—Bonding areas having different sizes, e.g. different heights or widths
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
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    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
    • H01L2224/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
    • H01L2224/321—Disposition
    • H01L2224/32151—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/32221—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/32245—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
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    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/34—Strap connectors, e.g. copper straps for grounding power devices; Manufacturing methods related thereto
    • H01L2224/39—Structure, shape, material or disposition of the strap connectors after the connecting process
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    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/34—Strap connectors, e.g. copper straps for grounding power devices; Manufacturing methods related thereto
    • H01L2224/39—Structure, shape, material or disposition of the strap connectors after the connecting process
    • H01L2224/40—Structure, shape, material or disposition of the strap connectors after the connecting process of an individual strap connector
    • H01L2224/401—Disposition
    • H01L2224/40151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/40153—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being arranged next to each other, e.g. on a common substrate
    • H01L2224/40175—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being arranged next to each other, e.g. on a common substrate the item being metallic
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
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    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/34—Strap connectors, e.g. copper straps for grounding power devices; Manufacturing methods related thereto
    • H01L2224/39—Structure, shape, material or disposition of the strap connectors after the connecting process
    • H01L2224/40—Structure, shape, material or disposition of the strap connectors after the connecting process of an individual strap connector
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    • H01L2224/40151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/40221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/40245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
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    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
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    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73201—Location after the connecting process on the same surface
    • H01L2224/73221—Strap and wire connectors
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    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73251—Location after the connecting process on different surfaces
    • H01L2224/73265—Layer and wire connectors
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    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/181—Encapsulation

Abstract

The application relates to a strip structure, a connecting sheet structure and a packaging structure. Wherein, the strip structure includes: a plurality of connection units for electrical connection arranged in a first direction, the connection units for connecting the chip and the lead frame; and the cutting unit is positioned between at least one group of adjacent connecting units and is connected with the connecting units on both sides of the cutting unit. The embodiment of the application can effectively reduce the production cost.

Description

Strip structure, connecting sheet structure and packaging structure
Technical Field
The application relates to the technical field of semiconductor manufacturing, in particular to a strip structure, a connecting sheet structure and a packaging structure.
Background
In the package structure, a chip is usually connected to a lead frame, and then packaged by a plastic package. The chip is connected to the lead frame through a clip copper sheet. clip copper sheets are typically die cut from clip copper tape.
The clip copper strip at present usually comprises a plurality of clip copper sheets with the same structure size, a connecting sheet interconnection structure between the clip copper sheets and the like. When the clip copper strip punching die is used, the clip copper strips on the clip copper strip are punched by a cutting die matched with the size of the clip copper strips, the required clip copper strips are reserved, and connecting sheet interconnection structures and the like among the clip copper strips are discarded as waste materials, so that the problem of serious material waste is caused, and further, the production cost is wasted.
Disclosure of Invention
Based on this, the embodiment of the application provides a strip structure, a connection structure and a packaging structure which can effectively reduce production cost.
A strap structure comprising:
a plurality of connection units for electrical connection arranged in a first direction, the connection units for connecting the chip and the lead frame;
and the cutting unit is positioned between at least one group of adjacent connecting units and is connected with the connecting units on both sides of the cutting unit.
In one embodiment, the number of the cutting units is multiple, and the cutting units are arranged between every two adjacent connecting units.
In one of the embodiments, the first and second electrodes are,
the connecting unit comprises a first connecting structure and a second connecting structure which are connected along a second direction; the second direction is perpendicular to the first direction;
the first connecting structure comprises a first connecting part for connecting a chip;
the second connecting structure comprises a second connecting part for connecting a lead frame;
the first connection portion and/or the second connection portion are connected to the cutting units on both sides thereof.
In one embodiment, the first connecting structure further includes a first bending portion connected to the first connecting portion;
and/or the second connecting structure further comprises a second bending part connected with the second connecting part.
In one embodiment, the cutting unit comprises a force unloading structure, and the force unloading structures are arranged between every two adjacent connecting units.
In one of the embodiments, the first and second electrodes are,
the connection unit includes a plurality of first connection portions arranged in a second direction perpendicular to the first direction;
the force unloading structure comprises a first force unloading part, wherein the first force unloading part extends along the second direction and is opposite to each first connecting structure of the connecting units positioned on two sides of the first force unloading part.
In one embodiment, the force unloading structure comprises a second force unloading part, the second force unloading part extends along the second direction and is opposite to the second connecting structures of the connecting units positioned on two sides of the second force unloading part, and the second force unloading part and the first force unloading part are arranged at intervals.
In one embodiment, the first force-releasing part and/or the second force-releasing part comprise force-releasing through holes or force-releasing grooves.
A connecting web structure formed by cutting of the strip structure of any one of the above; the connecting web structure includes at least one connecting unit.
A package structure, comprising: the chip comprises a chip, a lead frame and the connecting piece structure, wherein the first connecting structure of the connecting unit of the connecting piece structure is connected with the chip, and the second connecting structure of the connecting unit of the connecting piece structure is connected with the lead frame.
Above-mentioned strip structure, connection piece structure and packaging structure, the design cuts off the unit and all is connected rather than the linkage unit of both sides, and every linkage unit all is used for electric connection. Therefore, the structure of both sides after the strip structure is cut along the cutting unit can be directly used as a connecting sheet structure. Therefore, the process of forming the connecting piece structure by adopting the strip structure in the embodiment of the application has no waste, so that the production cost can be effectively reduced.
Meanwhile, the strip structure comprising a plurality of cutting units can generate connecting sheet structures meeting chips of different sizes, has strong universality and can effectively shorten the raw material development period of a new project. And when the chips with different sizes are assembled, the copper sheets with corresponding sizes are not required to be designed separately aiming at the chips with different sizes, so that the production efficiency is effectively improved.
Drawings
In order to more clearly illustrate the technical solutions in the embodiments or the conventional technologies of the present application, the drawings used in the descriptions of the embodiments or the conventional technologies will be briefly introduced below, it is obvious that the drawings in the following descriptions are only some embodiments of the present application, and for those skilled in the art, other drawings can be obtained according to the drawings without creative efforts.
Fig. 1 is a schematic plan view illustrating a package structure provided in an embodiment;
fig. 2 is a schematic cross-sectional view of a package structure provided in an embodiment;
FIG. 3 is a schematic plan view of a ribbon configuration provided in one embodiment;
FIG. 4 is a schematic cross-sectional view of the ribbon configuration of FIG. 3 taken along the direction C-C;
FIG. 5 is a schematic illustration of one cutting pattern of the strip structure provided in one embodiment;
FIG. 6 is a schematic view of a tab construction formed according to the cutting pattern shown in FIG. 5;
FIG. 7 is a schematic view of another cutting pattern of the tape structure provided in one embodiment;
FIG. 8 is a schematic view of a tab construction formed according to the cutting pattern shown in FIG. 7;
FIG. 9 is a schematic view of a package structure assembled by the connecting tab structure shown in FIG. 8;
FIG. 10 is a schematic view of another cutting pattern of the strip structure provided in one embodiment;
FIG. 11 is a schematic view of a tab construction formed according to the cutting pattern shown in FIG. 10;
fig. 12 is a schematic view of a package structure assembled by the connecting sheet structure shown in fig. 11.
Detailed Description
To facilitate an understanding of the present application, the present application will now be described more fully with reference to the accompanying drawings. Embodiments of the present application are set forth in the accompanying drawings. This application may, however, be embodied in many different forms and should not be construed as limited to the embodiments set forth herein. Rather, these embodiments are provided so that this disclosure will be thorough and complete.
The terminology used herein in the description of the present application is for the purpose of describing particular embodiments only and is not intended to be limiting of the application.
It will be understood that when an element or layer is referred to as being "on," "adjacent to," "connected to," or "coupled to" other elements or layers, it can be directly on, adjacent to, connected or coupled to the other elements or layers or intervening elements or layers may be present. In contrast, when an element is referred to as being "directly on," "directly adjacent to," "directly connected to" or "directly coupled to" other elements or layers, there are no intervening elements or layers present.
It will be understood that, although the terms first, second, third, etc. may be used to describe various elements, components, regions, layers, doping types and/or sections, these elements, components, regions, layers, doping types and/or sections should not be limited by these terms. These terms are only used to distinguish one element, component, region, layer, doping type or section from another element, component, region, layer, doping type or section. Thus, a first element, component, region, layer, doping type or section discussed below could be termed a second element, component, region, layer or section without departing from the teachings of the present application.
Spatial relational terms, such as "under," "below," "under," "over," and the like may be used herein to describe one element or feature's relationship to another element or feature as illustrated in the figures. It will be understood that the spatially relative terms are intended to encompass different orientations of the device in use or operation in addition to the orientation depicted in the figures. For example, if the device in the figures is turned over, elements or features described as "below" or "beneath" other elements or features would then be oriented "above" the other elements or features. Thus, the exemplary terms "under" and "under" can encompass both an orientation of above and below. In addition, the device may also include additional orientations (e.g., rotated 90 degrees or other orientations) and the spatial descriptors used herein interpreted accordingly.
As used herein, the singular forms "a", "an" and "the" may include the plural forms as well, unless the context clearly indicates otherwise. It will be further understood that the terms "comprises/comprising," "includes" or "including," etc., specify the presence of stated features, integers, steps, operations, components, parts, or combinations thereof, but do not preclude the presence or addition of one or more other features, integers, steps, operations, components, parts, or combinations thereof. Also, in this specification, the term "and/or" includes any and all combinations of the associated listed items.
In one embodiment, referring to fig. 1 and fig. 2, a package structure is provided, which includes a connection pad structure 100, a chip 200, and a lead frame 300. The connecting sheet structure 100 is used to connect the chip 200 and the lead frame 300.
In addition, the package structure may further include a plastic package structure 400, and the plastic package structure 400 seals a side of the lead frame 300 where the chip 200 and the connection pad structure 100 are disposed.
As an example, the chip 200 may include a chip source 210 and a chip gate 220.
Leadframe 300 may include drain electrical output pads 310, leadframe carrier 320, leadframe carrier tie bars 330, leadframe source 340, leadframe source contact 350, leadframe gate contact 360, and leadframe gate line connection pads 370. Where leadframe source 340 is connected to leadframe source contact 350. Leadframe gate contact 360 is connected to leadframe gate line connection point 370.
The die gate 220 of the die 200 and the leadframe gate line connection point 370 of the leadframe 300 may be connected by a gate connection line 500. Meanwhile, the chip source 210 of the chip 200 and the leadframe source 340 of the leadframe 300 may be connected by the connecting tab structure 100.
The connecting piece structure 100 is cut out by a strip structure.
In one embodiment, a strap structure is provided. The strip structure may be, but is not limited to, a tape structure, and the material thereof may be, but is not limited to, copper.
Referring to fig. 3 and 4, the strip structure includes a plurality of connection units 100a arranged along a first direction for electrical connection.
In one embodiment, the connection unit 100a is used to connect the chip 200 and the lead frame 300. The specific form of each connecting unit 100a may be the same or different, and is not limited herein.
Meanwhile, the tape structure further includes a cutting unit 100 b. The cutting unit 100b is a structure that can guide cutting, and may include a through hole or a slot, etc.
The cutting unit 100b is located between at least one adjacent group of the connection units 100a, and is connected to both of the connection units 100a on both sides thereof.
After the strip structure is cut along the cutting unit 100b, at least two connecting sheet structures 100 may be formed. Each connecting tab structure 100 may include at least one connecting unit 100 a. When the material of the strip structure is copper, the connecting sheet structure 100 may be specifically a copper sheet.
In the present embodiment, the cutting unit 100b is designed to be connected to the connection units 100a on both sides thereof, and each connection unit 100a is used for electrical connection. Therefore, the structure of both sides after the strip structure is cut along the cutting unit 100b may be directly used as the connecting sheet structure 100. Therefore, no waste material is generated in the process of forming the connecting sheet structure 100 by using the strip structure of the present embodiment, so that the production cost can be effectively reduced.
Meanwhile, when the cutting units are provided between the plurality of sets of adjacent connection units, the strip structure has a plurality of cutting units 100b disposed at intervals. At this time, cutting may be selected along one or more or all of the cutting units 100 b. The cutting pattern is different, and the size of the connecting sheet structure 100 produced after cutting is the same, so that chips 200 with different sizes can be adaptively connected.
For example, a plurality of cutting units may be provided, and each cutting unit is provided between adjacent connecting units, and at this time, the cutting method shown in fig. 5 is adopted to perform cutting, so that the connecting sheet structure 100 shown in fig. 6 is generated, and the connecting sheet structure can be used for assembling with the chip 200 with the size shown in fig. 1 to form a packaging structure. Dicing using the dicing method shown in fig. 7 results in the connecting pad structure 100 shown in fig. 8, which can be used to assemble with the chip 200 of the size shown in fig. 9 to form a package structure. Dicing using the dicing method shown in fig. 10 results in the connection pad structure 100 shown in fig. 11, which can be used to assemble with the chip 200 of the size shown in fig. 12 to form a package structure.
Therefore, the strip structure including the plurality of cutting units 100b can produce the connecting sheet structure 100 satisfying the chips 200 of different sizes at the same time, and further satisfies the requirement of assembling the chips of different sizes at the same time, and has strong versatility.
Moreover, the connecting sheet structure 100 satisfying the chips 200 with different sizes can be produced by selecting different cutting modes according to requirements on the same type of strip structure, and a new strip structure does not need to be developed again according to the size of the chip. Therefore, the raw material development cycle of the new project can be effectively shortened.
In addition, the connecting sheet structures 100 with different sizes can be punched by the same cutting die, so that when the connecting sheet structures 100 with different sizes are used for assembling chips 200 with different sizes, frequent cutting die replacement operation is not needed, and the production efficiency is effectively improved. Further, when the connecting piece structure 100 is formed by cutting, it is only necessary to cut along the cutting unit 100b, and thus the design requirement for the cutting die is also low.
In one embodiment, referring to fig. 3, the connection unit 100 includes a first connection structure 110 and a second connection structure 120 connected along a second direction. The second direction is perpendicular to the first direction.
The first connection structure 110 is used to connect the chip 200. The second connection structure 120 is used to connect the lead frame 300. The specific form of the first connection structure 110 and/or the second connection structure 120 of each connection unit 100a may be the same or different, and is not limited herein.
Specifically, the first connection structure 110 includes a first connection portion 111, and the second connection structure 120 includes a second connection portion 121.
In one embodiment, the first connection portion 111 is connected to both the cut-off units 100b on both sides thereof, so that the length of the first connection portion 111 in the first direction can be effectively increased, and the contact area between the first connection portion 111 and the chip can be effectively increased, thereby reducing the Rdson value of the package and improving the over-current capability of the product.
In one embodiment, the second connection portion 121 is connected to the cutting units 100b on both sides thereof, so that the length of the second connection portion 121 in the first direction can be effectively increased, and the contact area between the second connection portion 121 and the lead frame can be effectively increased, thereby reducing the Rdson value of the package and improving the over-current capability of the product.
As an example, referring to fig. 3 and fig. 4, the first connecting structure 110 may further include a first bending portion 112. The first connecting portion 111 is connected to the first bending portion 112 in the second direction, so that the first connecting portion 111 can be formed to sink, and thus can be effectively connected to the chip. The second direction is perpendicular to the first direction.
In one embodiment, the second connecting structure 120 may further include a second bending part 122. The second connection portion 121 is connected to the second bending portion 122 in the second direction, so that the second connection portion 121 may be formed to sink, and may be effectively connected to the lead frame.
In one embodiment, the first connecting structure 110 includes a first connecting portion 111 and a first bending portion 112, the second connecting structure 120 includes a second connecting portion 121 and a second bending portion 122, and the connecting unit 100a may further include a plurality of eave structures 130. The first bending portion 121 and the second bending portion 122 may be connected to different eave structures 130 in a second direction. Alternatively, the first bent portion 121 and the second bent portion 122 may also be connected to the same eave structure 130 in the second direction, which is not limited herein.
In packaging structure assembly, the strip structure may be first cut to form the desired tab structure 100. Then, the connection pad structure 100 is sucked up by a vacuum suction nozzle and assembled to the lead frame 300 to which the chip 200 has been attached.
The surface of the chip 200 may be coated with solder paste, and a position of the lead frame 300 corresponding to the second connection portion 121 (for example, a position related to the lead frame source 340) may also be coated with solder paste. Then, the first connection portion 111 and the second connection portion 121 on the connection pad structure 100 are adhered to the chip 200 and the lead frame 300, respectively, by the solder paste 600, thereby completing the assembly.
Specifically, referring to fig. 3 and 4, the connection unit 100a may include at least two eave structures 130 arranged along a second direction, where the second direction is perpendicular to the first direction.
The first connecting structure 110 is located between two adjacent eave structures 130. Specifically, the first connecting structure 110 may include two first bending portions 112. The two first bending portions 112 may be respectively connected to the first bending portions 112 of two adjacent eave structures 130. A first connecting portion 111 is disposed between the two first bending portions 112.
The second connecting structure 120 may further include an adjusting portion 123 and a third bending portion 124. The third bending portion 124 is connected to the eave structure 130. The adjusting portion 123 has one end connected to the third bending portion 124 and the other end connected to the second bending portion 122, so as to adjust the height of the second connecting portion 121 according to the height of the lead frame 300 corresponding to the position of the second connecting portion 121. Here, "height" may refer to a height relative to a surface of the lead frame 300.
By bending the third bent portion 124, the adjusting portion 123 protrudes from the eave structure 130, so that the adjusting portion 123 is raised from the eave structure 130. Meanwhile, the second connecting portion 121 is connected to the adjusting portion 123 through the second bending portion 122, so that the lifting of the adjusting portion 123 can drive the lifting of the position of the second connecting portion 121. The raised second connection portion 121 may be conveniently connected to the lead frame source 340 higher than the surface of the lead frame 300.
Meanwhile, the second bending part 122 is disposed such that the second connection part 121 is further sunk on the basis of the raised adjustment part 123 to be accurately connected to the lead frame source 340.
In this embodiment, other structures (e.g., the first bending portion 112) of the first connecting structure 110 may be provided, which have the same length as the first connecting portion 111 in the first direction and simultaneously connect the cutting units 100b on two sides of the first connecting portion 111. And/or, other structures (such as the second bent portion 122 and/or the adjusting portion 123 and/or the third bent portion 124) of the second connecting structure 120 may be provided to have the same length as the second connecting portion 121 in the first direction, and to connect the two side cutting units 100b with the second connecting portion 121 at the same time.
Further, each of the connection units 100a may also be provided with the same structure and size, so that the strip structure is easier to machine. Specifically, the strip structure may be press-formed by a press mold. When the 100a of each connection unit has the same structure and size, the press mold can be simplified, thereby reducing the press mold cost.
Of course, each of the connection units 100a may be provided with a different structure or different sizes. For example, different connection units 100a may have different numbers of first connection structures 110 and/or second connection structures 120, etc.
Alternatively, another structure (for example, the first bent portion 112) of the first connecting structure 110 may be connected to the cutting unit 100b, and the first connecting portion 111 may not be connected to at least one of the cutting units 100 b. Alternatively, another structure of the second connecting structure 120 (e.g., the second bent portion 122, the adjusting portion 123, and/or the third bent portion 124) may be connected to the cutting unit 100b, and the second connecting portion 121 may not be connected to at least one cutting unit.
In one embodiment, referring to fig. 3, the cutting unit 100b includes a force releasing structure, and the force releasing structure is disposed between the adjacent connecting units 100 a.
At this time, the force-releasing structure can play a role in releasing stress on the strip structure or the connecting piece structure 100 formed after cutting, so as to prevent the strip structure or the connecting piece structure from generating stress rebound, and further prevent the structure on the strip structure from deforming under the action of bending or compression and the like. On the other hand, the force-releasing structure can be used as the cutting unit 100b, so that the additional manufacture of cutting channels and grooves is not needed, and the manufacturing process of the strip structure is simplified.
Of course, the arrangement form of the cutting unit 100b is not limited thereto. For example, in other embodiments, the cutting path grooving and force unloading structure can be arranged at the same time. The cutting channel is grooved for cutting, and the force unloading structure is used for stress relief.
In one embodiment, referring to fig. 3, a plurality of first connection portions 111 are arranged on the same connection unit 100a in a second direction perpendicular to the first direction.
At this time, the chip 200 may be connected through the plurality of first connection portions 111, thereby reducing contact resistance with the chip 200.
Meanwhile, the force discharging structure includes a first force discharging part 140. As an example, the first force discharging part 140 may include a force discharging through hole or a force discharging groove, etc.
The first force-releasing portion 140 extends in the second direction and is opposite to each of the first connection structures 110 of the connection unit 100a located at both sides thereof. Therefore, the first force-releasing portions 140 can effectively protect the respective first connection structures 110 connected to the chip 200 during bending or pressing.
In one embodiment, referring to fig. 3, the force releasing structure includes a second force releasing portion 150. As an example, the second force discharging part 150 may include a force discharging through hole or a force discharging groove, etc.
The second force-releasing portion 150 extends in the second direction and is opposite to the second connecting structures 120 of the connecting units 100a located at both sides thereof. Therefore, the second force-releasing portion 150 may effectively protect the second connection structure 120 connected to the lead frame 300 during bending or pressing.
Meanwhile, the second force-releasing portion 150 and the first force-releasing portion 140 may be disposed at an interval, so that the first connecting structure 110 and the second connecting structure 120 on the strap structure or the connecting sheet structure 100 formed after cutting are effectively protected, and meanwhile, the structure of the strap structure or the connecting sheet structure 100 formed after cutting may be ensured to have sufficient continuity and strength, and is not easily broken and separated.
Of course, in other embodiments, the second force unloading part 150 may be disposed to communicate with the first force unloading part 140, which is not limited herein.
In one embodiment, referring to fig. 6, 8 or 11, a connecting web structure 100 is also provided, formed by cutting the strip structure of any of the above. Specifically, the connecting piece structure 100 includes at least one connecting unit 100 a.
Referring to fig. 1, a connecting sheet structure 100 is used to connect a chip 200 and a lead frame 300. Specifically, referring to fig. 2, the first connection structure 110 of the connection unit 100a of the connection sheet structure 100 is connected to the chip 200, and the second connection structure 120 of the connection unit 100a of the connection sheet structure 100 is connected to the lead frame 300.
In the description herein, references to the description of "one embodiment," "another embodiment," or the like, mean that a particular feature, structure, material, or characteristic described in connection with the embodiment or example is included in at least one embodiment or example of the application. In this specification, a schematic description of the above terminology may not necessarily refer to the same embodiment or example.
The technical features of the embodiments described above may be arbitrarily combined, and for the sake of brevity, all possible combinations of the technical features of the embodiments described above are not described, but should be considered as being within the scope of the present specification as long as there is no contradiction between the combinations of the technical features.
The above-mentioned embodiments only express several embodiments of the present application, and the description thereof is more specific and detailed, but not construed as limiting the claims. It should be noted that, for a person skilled in the art, several variations and modifications can be made without departing from the concept of the present application, which falls within the scope of protection of the present application. Therefore, the protection scope of the present patent shall be subject to the appended claims.

Claims (10)

1. A tape structure, comprising:
a plurality of connection units for electrical connection arranged in a first direction, the connection units for connecting the chip and the lead frame;
and the cutting unit is positioned between at least one group of adjacent connecting units and is connected with the connecting units on both sides of the cutting unit.
2. The tape structure according to claim 1, wherein the number of the cutting units is plural, and the cutting units are provided between adjacent ones of the connecting units.
3. The strap structure of claim 1 wherein the connection unit comprises a first connection structure and a second connection structure connected along a second direction; the second direction is perpendicular to the first direction;
the first connecting structure comprises a first connecting part for connecting a chip;
the second connecting structure comprises a second connecting part for connecting a lead frame;
the first connection portion and/or the second connection portion are connected to the cutting units on both sides thereof.
4. The strap structure of claim 3 wherein the first connecting structure further comprises a first bend connecting the first connection portion;
and/or the second connecting structure further comprises a second bending part connected with the second connecting part.
5. A strip structure according to claim 3 or 4, wherein said severing unit comprises a force relief structure, said force relief structure being provided between adjacent said connecting units.
6. The tape structure according to claim 5,
the connection unit includes a plurality of first connection portions arranged in a second direction perpendicular to the first direction;
the force unloading structure comprises a first force unloading part, wherein the first force unloading part extends along the second direction and is opposite to each first connecting structure of the connecting units positioned on two sides of the first force unloading part.
7. The strip structure according to claim 6, wherein said force relief structure comprises a second force relief portion extending in said second direction and opposite to said second connection structure of said connection unit on both sides thereof, said second force relief portion being spaced apart from said first force relief portion.
8. The strip structure according to claim 7, wherein the first and/or second force relief portion comprises a force relief through hole or a force relief groove.
9. A connecting sheet structure formed by cutting the strip structure according to any one of claims 1 to 8; the connecting web structure includes at least one connecting unit.
10. A package structure, comprising: chip, lead frame and connection piece structure of claim 8, the first connection structure of the connection unit of the connection piece structure connects the chip, the second connection structure of the connection unit of the connection piece structure connects the lead frame.
CN202111679704.2A 2021-12-31 2021-12-31 Strip structure, connecting sheet structure and packaging structure Pending CN114496966A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN202111679704.2A CN114496966A (en) 2021-12-31 2021-12-31 Strip structure, connecting sheet structure and packaging structure

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN202111679704.2A CN114496966A (en) 2021-12-31 2021-12-31 Strip structure, connecting sheet structure and packaging structure

Publications (1)

Publication Number Publication Date
CN114496966A true CN114496966A (en) 2022-05-13

Family

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Family Applications (1)

Application Number Title Priority Date Filing Date
CN202111679704.2A Pending CN114496966A (en) 2021-12-31 2021-12-31 Strip structure, connecting sheet structure and packaging structure

Country Status (1)

Country Link
CN (1) CN114496966A (en)

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