CN1177367C - Surface adhered diode array and its manufacture - Google Patents
Surface adhered diode array and its manufacture Download PDFInfo
- Publication number
- CN1177367C CN1177367C CNB001214667A CN00121466A CN1177367C CN 1177367 C CN1177367 C CN 1177367C CN B001214667 A CNB001214667 A CN B001214667A CN 00121466 A CN00121466 A CN 00121466A CN 1177367 C CN1177367 C CN 1177367C
- Authority
- CN
- China
- Prior art keywords
- strip
- line
- diode
- insulation glue
- bond end
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/93—Batch processes
- H01L24/95—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips
- H01L24/97—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips the devices being connected to a common substrate, e.g. interposer, said common substrate being separable into individual assemblies after connecting
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
- H01L2224/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
- H01L2224/321—Disposition
- H01L2224/32151—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/32221—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/32245—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
Abstract
The present invention relates to a surface adhered array diode and a manufacturing method thereof. The present invention is provided for providing an electronic element and a manufacturing method thereof which have the advantages of high productive efficiency, low cost, high finished product quality, and convenient use and assembly. The array diode of the present invention comprises a left contact terminal, a right contact terminal, a left material band, a right material band, wafers and insulating glue layers, wherein both sides of the left contact terminal and the right contact terminal are respectively arranged at intervals; the left material band and the right material band are arranged on left overlapping terminals and right overlapping terminals; the wafers are fixedly arranged on every pair of left overlapping terminal and right overlapping terminal; the bottoms of the insulating glue layers which coat the outer parts of the left material band and the right material band are provided with grooves; the left and the right contact terminals are exposed to the insulating glue layers. The manufacturing method of the present invention comprises punching, wafer setting, formed insulating glue layer emission and groove stamping.
Description
Technical field
The invention belongs to electronic component and manufacture method thereof, particularly a kind of surface adhesion type is arranged diode and manufacture method thereof.
Background technology
Diode is indispensable electronic component on the electronic product of majority, utensil.By section ripple rectification function that diode had, to make electronic product that electric current is more stable in the use.And it is also different according to the diode part of various required by electronic product; Once a diode separately uses, also once two or several diodes use together, i.e. use to diode there is no specific number, therefore, once needing to use on the product of a plurality of diodes, several diodes must be installed combination one by one, and to adjust distance between several diodes, the collision mutually in order to avoid diode is too approaching, perhaps distance is excessive takies too much space, the also bad arrangement of circuit, i.e. use for diode also exists problem and trouble some technology and that make.
As Fig. 1, Fig. 2, shown in Figure 3, present its manufacture method of employed diode is generally: at first as shown in Figure 1, the guide card 1B that makes diode is made single with impact style, and between the guide card 1B of two moulding chip 1C is set; Then, as shown in Figure 2, in the two guide card 1B outside with insulation glue-line 1D mold moulding; At last, as shown in Figure 3, will break in insulation glue-line 1D bottom, to make diode 1A through utmost point pin 1E folding with two guide card 1B after the insulation glue-line 1D mold moulding.
Above-mentioned all is single individualities with the made diode of known diode fabricating method.When needing most diodes to use together on the electronic product, just each diode must be arranged one by one, alignd, wherein the time of being consumed, manpower are also considerable, and have increased the cost of product, quite are not inconsistent economic benefit.And in manufacture process, also there are many disappearances:
(1) adopt single diode fabrication in the manufacture process, make one by one, consuming time, take a lot of work, operating efficiency is not good.
(2) in the manufacture process, behind the diode forming, the end pin of guide card must bend in insulation glue-line below, in the process of bending,, can make being uneven of the left and right limit of diode of moulding if left and right bending is asymmetric, when diode is placed on the circuit board, be easy to generate left and right situation of rocking, and, also can make the electric current that passes through influenced if be connected imappropriate.
(3) diode is single manufacturing moulding, and volume is bigger, when a plurality of diode of a less important use, must arrange one by one and put a plurality of diodes, and the front and back position of arranging, distance, space etc. all need be considered, cause staff's operation inconvenience, consuming time taking a lot of work.
Whether after (4) most diodes are installed on the circuit board one by one, must inspect one by one between each diode and separate, problem such as whether utmost point pin is overlapping in order to avoid produce error, has increased staff's activity duration.
Must bend the utmost point pin when (5) diode is made, therefore, the utmost point pin that in manufacturing process, often fractures, or bend situations such as improper, the defective products rate is increased, quite waste resource.
Summary of the invention
The surface adhesion type that the purpose of this invention is to provide a kind of production efficiency height, cost is low, end product quality is high, use is easy to assembly is arranged diode and manufacture method thereof.
Arrangement diode of the present invention comprises left strip, right strip, a plurality of chip and insulation glue-line; Left side strip, right strip are two independent lamellar bodies that are oppositely arranged; Strip both sides, a left side form spaced left contact jaw and left bond end respectively; Right strip both sides form spaced right contact jaw and right bond end respectively; Left and right strip is relative with its left and right bond end, and a plurality of chips are fixedly arranged on each between the left and right bond end; The insulation glue-line is coated on outside the left and right strip, and makes the left and right contact jaw of left and right strip be exposed at outside the insulation glue-line, and insulation glue-line bottom is corresponding to being provided with chase between per two chips, spaced two left and right contact jaws and the left and right bond end.
Arrangement diode making process of the present invention comprises the steps:
Step 1: punching press
Elongated left strip, right strip inboard for the independent lamellar body that is oppositely arranged stamped out corresponding spaced left bond end, right bond end and the outside stamp out continuous left contact jaw, right contact jaw;
Step 2: chip is set
Left and right strip is relative with its left and right bond end, and between each is to left and right bond end, set firmly chip, so that each of left and right strip is engaged left and right bond end;
Step 3: ejection formation insulation glue-line
At left and right strip outer rim ejection formation insulation glue-line,, and make the left and right contact jaw of left and right strip be exposed at outside the insulation glue-line with formation strip body;
Step 4: punching out chase
In form behind the profiled insulation glue-line strip body corresponding to per two chips between the bottom punching out chase of outer rim insulation glue-line, make arrangement diode of the present invention, and be isolated into spaced left and right contact jaw by the continuous left and right contact jaw that chase will expose the outer left and right strip of insulation glue-line;
Step 5: cut off
According to the number of the once required diode of each electronic product, cut off in the chase place of arranging on the diode, form a plurality of diodes of single diode or a plurality of arrangements.
Because arranging diode, the present invention comprises left and right strip, a plurality of chip and insulation glue-line; Left and right strip is two independent lamellar bodies that are oppositely arranged; Left and right strip both sides form spaced left and right contact jaw and left and right bond end respectively; A plurality of chips are fixedly arranged on each between the left and right bond end; The insulation glue-line is coated on outside the left and right strip, and makes left and right contact jaw be exposed at outside the insulation glue-line, and insulation glue-line bottom is provided with chase; Manufacture method of the present invention comprise be stamped into two left and right strips that are oppositely arranged independent lamellar body, chip be set, ejection formation insulation glue-line and punching out chase.The present invention is to form a spaced left side, a right contact jaw and a left side, the left side of right bond end, right strip cooperates chip, make strip and arrange diode, and arrange the insulation glue-line bottom of diode corresponding to per two chips at strip, spaced two left sides, a right contact jaw and a left side, be provided with chase between the right bond end, when desire is used diode, quantity according to selected single diode, chase place by rectangular arrangement diode cuts off, to take off several single diodes that several connect with the insulation glue-line, both kept independently circuit between each adjacent single diode, keep certain spacing again, need not adjust during use, production efficiency height not only, cost is low, the end product quality height, and use easy to assembly, thereby reach purpose of the present invention.
Description of drawings
Fig. 1, diode fabricating method schematic diagram (punching press is stacked) for commonly using.
Fig. 2, diode fabricating method schematic diagram (mold moulding) for commonly using.
Fig. 3, diode fabricating method schematic diagram (the stubborn utmost point pin of folding) for commonly using.
Fig. 4, be manufacture method step 1 of the present invention and step 2 schematic diagram.
Fig. 5, be manufacture method step 3 schematic diagram of the present invention.
Fig. 6, be manufacture method step 4 schematic diagram of the present invention.
Fig. 7, be manufacture method step 4 schematic diagram of the present invention.
Fig. 8, be manufacture method step 4 schematic diagram of the present invention.
Fig. 9, be manufacture method step 5 schematic diagram of the present invention.
Embodiment
Manufacture method of the present invention comprises:
Step 1: punching press
As shown in Figure 4, elongated left strip 30, right strip 40 inboards for the independent lamellar body that is oppositely arranged are stamped out corresponding spaced left bond end 32, right bond end 42 and the outside and stamp out continuous left contact jaw 31, right contact jaw 41;
Step 2: chip is set
As shown in Figure 4, left and right strip 30,40 is relative with its left and right bond end 32,42, and between each is to left and right bond end 32,42, set firmly chip 50, each chip 50 can directly be welded in each between the left and right bond end 32,42; Also can be as shown in Figure 5, each chip 50 is adhesively fixed between each is to left and right bond end 32,42 by conductive adhesive layer 60; And the left and right bond end 32,42 that makes chip 50 and left and right strip 30,40 is with plane contact;
Step 3: ejection formation insulation glue-line
As shown in Figure 5, at left and right strip 30,40 outer rim ejection formations insulation glue-line 70,, and make the left and right contact jaw 31,41 of left and right strip 30,40 be exposed at outside the insulation glue-line 70 with formation strip body 20 ';
Step 4: punching out chase
As Fig. 6, shown in Figure 7, in profiled insulation glue-line 70 back form strip bodies 20 ' corresponding to per two chips 50 between the bottom punching out chase 21 of outer rim insulation glue-line 70, make and arrange diode 20, and be isolated into spaced left and right contact jaw 31 ', 41 ' by the continuous left and right contact jaw 31,41 that chase 21 will expose the outer left and right strip 30,40 of insulation glue-line 70;
Step 5: cut off
As Fig. 8, shown in Figure 9, during use,, cut off in chase 21 places of arranging on the diode 20 according to the number of the once required diode 10 of each electronic product, form a plurality of diodes 10 of single diode 10 or a plurality of arrangements.
As Fig. 4, Fig. 5, shown in Figure 6, arrangement diode 20 of the present invention comprises left strip 30, right strip 40, a plurality of chip 50 and insulation glue-line 70.
Left and right strip 30,40 is two independent lamellar bodies that are oppositely arranged.
Strip 30 both sides, a left side form spaced left contact jaw 31 ' and left bond end 32 respectively.
Left and right strip 30,40 is relative with its left and right bond end 32,42, and a plurality of chips 50 are fixedly arranged on each between the left and right bond end 32,42, and each chip 50 can directly be welded in each between the left and right bond end 32,42; Each chip 50 also can be adhesively fixed between each is to left and right bond end 32,42 by conductive adhesive layer 60, so that each of left and right strip 30,40 is engaged left and right bond end 32,42; Insulation glue-line 70 is coated on outside the left and right strip 30,40 that engages by a plurality of chips 50, and the left and right contact jaw 31,41 that makes left and right strip 30,40 is exposed at outside the insulation glue-line 70, insulation glue-line 70 bottoms corresponding to per two chips 50, spaced two left and right contact jaws 31 ', 41 ' and left and right bond end 32,42 between be provided with chase.The circuit that left contact jaw 31 ' between each diode 10 of arrangement diode 20, right contact jaw 41 ', left bond end 32, right bond end 42 and chip 50 constitute is independent part.The arrangement diode 20 that contains several single diodes 10 during use connects by insulation glue-line 70, but can the phase mutual interference between each single diode 10.
The present invention is to form a spaced left side, right contact jaw 31 ', 41 ' and left, right bond end 32, a left side of 42, right strip 30,40 cooperate chip 50, make strip body 20 ', and in insulation glue-line 70 bottoms of strip body 20 ' corresponding to per two chips 50, spaced two left sides, right contact jaw 31 ', 41 ' and left, right bond end 32, be provided with chase 21 between 42, when desire is used diode 10, quantity according to selected single diode 10, chase 21 places by rectangular arrangement diode 20 cut off, to take off several single diodes 10 that several connect with insulation glue-line 70, both kept independently circuit between each adjacent single diode 10, keep certain spacing again, need not adjust during use.
Claims (2)
1, a kind of surface adhesion type is arranged diode, and it comprises left strip, right strip, a plurality of chip and insulation glue-line; Strip both sides, a left side form spaced left contact jaw and left bond end respectively; Right strip both sides form spaced right contact jaw and right bond end respectively; Left and right strip is relative with its left and right bond end, and a plurality of chips are fixedly arranged on each between the left and right bond end; The insulation glue-line is coated on outside the left and right strip, and makes the left and right contact jaw of left and right strip be exposed at outside the insulation glue-line; It is characterized in that described left strip, right strip are two independent lamellar bodies that are oppositely arranged; Insulation glue-line bottom is corresponding to being provided with chase between per two chips, spaced two left and right contact jaws and the left and right bond end.
2, a kind of surface adhesion type is arranged diode making process, and it comprises the steps:
Step 1: punching press
Elongated left strip, right strip inboard are stamped out corresponding spaced left bond end, right bond end and the outside stamp out continuous left contact jaw, right contact jaw;
Step 2: chip is set
Left and right strip is relative with its left and right bond end, and between each is to left and right bond end, set firmly chip, so that each of left and right strip is engaged left and right bond end;
Step 3: ejection formation insulation glue-line
At left and right strip outer rim ejection formation insulation glue-line,, and make the left and right contact jaw of left and right strip be exposed at outside the insulation glue-line with formation strip body;
Step 5: cut off
Number according to the once required diode of each electronic product is cut off, to form a plurality of diodes of single diode or a plurality of arrangements;
It is characterized in that described at ejection formation insulation glue-line step 3 and the step 5 of cut-out between still comprise the step 4 of punching out chase:
In form behind the profiled insulation glue-line strip body corresponding to per two chips between the bottom punching out chase of outer rim insulation glue-line, make arrangement diode of the present invention, and be isolated into spaced left and right contact jaw by the continuous left and right contact jaw that chase will expose the outer left and right strip of insulation glue-line; Left strip, right strip are two independent lamellar bodies that are oppositely arranged in the step 1; Be to cut off in the step 5 in the chase place of arranging on the diode.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNB001214667A CN1177367C (en) | 2000-07-24 | 2000-07-24 | Surface adhered diode array and its manufacture |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNB001214667A CN1177367C (en) | 2000-07-24 | 2000-07-24 | Surface adhered diode array and its manufacture |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN1335646A CN1335646A (en) | 2002-02-13 |
| CN1177367C true CN1177367C (en) | 2004-11-24 |
Family
ID=4588814
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CNB001214667A Expired - Fee Related CN1177367C (en) | 2000-07-24 | 2000-07-24 | Surface adhered diode array and its manufacture |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN1177367C (en) |
-
2000
- 2000-07-24 CN CNB001214667A patent/CN1177367C/en not_active Expired - Fee Related
Also Published As
| Publication number | Publication date |
|---|---|
| CN1335646A (en) | 2002-02-13 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US5410180A (en) | Metal plane support for multi-layer lead frames and a process for manufacturing such frames | |
| CN1077729C (en) | Combined electronical assembly and making of same | |
| US6467142B1 (en) | Method for manufacturing chip capacitor | |
| CN1451180A (en) | Planar hybrid diode rectifier bridge | |
| US20050174719A1 (en) | Chip capacitor and method for the production thereof | |
| CN1073289C (en) | Method for manufacturing group-type cell | |
| CN216054689U (en) | High-power module structure | |
| CN1177367C (en) | Surface adhered diode array and its manufacture | |
| US7521271B2 (en) | Method of manufacturing a transponder | |
| CN111564543B (en) | Vertical high-voltage light-emitting diode chip and manufacturing method thereof | |
| EP0095223B1 (en) | A lead frame | |
| CN1174487C (en) | Electronic part | |
| JP2000260206A (en) | Manufacture of light-emitting element module | |
| CN217965485U (en) | Series welding machine and photovoltaic module | |
| JP2002015953A (en) | Solid electrolytic capacitor and its manufacturing method | |
| CN1820368A (en) | Lead frame and manufacture thereof | |
| CN103038878A (en) | Diode package having improved lead wire and manufacturing method thereof | |
| CN1444299A (en) | Method for making aluminium cover plate of lithium cell | |
| CN106571342B (en) | Combined rectifying element and preparation method thereof | |
| CN214898488U (en) | Packaging substrate and packaging substrate assembly | |
| CN209947855U (en) | LED support material belt | |
| CN104137204B (en) | Solid electrolytic capacitor | |
| CN211125621U (en) | Substrate plate and intelligent power module with same | |
| KR100775029B1 (en) | Stacking method of unit electrode for the stacked type of polymer-condenser | |
| JP3448941B2 (en) | Chip-shaped solid electrolytic capacitors |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| C06 | Publication | ||
| PB01 | Publication | ||
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20041124 Termination date: 20180724 |