KR970013267A - Lead frame with die pad and internal leads connected by insulating tape - Google Patents
Lead frame with die pad and internal leads connected by insulating tape Download PDFInfo
- Publication number
- KR970013267A KR970013267A KR1019950027672A KR19950027672A KR970013267A KR 970013267 A KR970013267 A KR 970013267A KR 1019950027672 A KR1019950027672 A KR 1019950027672A KR 19950027672 A KR19950027672 A KR 19950027672A KR 970013267 A KR970013267 A KR 970013267A
- Authority
- KR
- South Korea
- Prior art keywords
- die pad
- lead frame
- lead
- semiconductor chip
- insulating tape
- Prior art date
Links
Landscapes
- Lead Frames For Integrated Circuits (AREA)
Abstract
내부 리드의 뒤틀림을 방지하고 동일 평면성(co-plunaritv)를 유지하며 다이 패드의 기울어짐을 방지하여 와이어 본딩의 신뢰성을 향상시킴과 동시에 주입되는 에폭시 몰딩 컴파운드의 릎로우 속도를 일정하게 제어하여 불완전성 몰딩에 의한 불량을 억제하기 위하여 반도체 칩이 부착되는 다이 패드의 주변부와 내부 리드의 선단부에 전기절연성 테이프가 부착되어 있는 새로운 리드 프레임의 구조를 개시한다. 테이프가 부착되어 있는 내부 리드의 선단부의 뒤쪽 내부 리드는 단차가 형성되어 있고 와이어 본딩을 위한 도금부가 형성되어 있다.Incomplete molding by preventing warpage of internal leads, maintaining co-plunaritv and preventing die pad tilting to improve the reliability of wire bonding, while controlling the knee speed of the epoxy molding compound being injected. A new lead frame structure is disclosed in which an electrically insulating tape is attached to the periphery of a die pad to which a semiconductor chip is attached and to the tip of an internal lead in order to suppress defects caused by the semiconductor chip. The inner lead at the rear end of the inner lead to which the tape is attached has a stepped portion and a plated portion for wire bonding.
Description
본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음Since this is an open matter, no full text was included.
제1도는 본 발명에 따른 구조를 갖는 리드 프레임의 부분 평면도.1 is a partial plan view of a lead frame having a structure according to the present invention.
제2도는 제1도의 부분 사시도.2 is a partial perspective view of FIG.
Claims (6)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR1019950027672A KR970013267A (en) | 1995-08-30 | 1995-08-30 | Lead frame with die pad and internal leads connected by insulating tape |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR1019950027672A KR970013267A (en) | 1995-08-30 | 1995-08-30 | Lead frame with die pad and internal leads connected by insulating tape |
Publications (1)
Publication Number | Publication Date |
---|---|
KR970013267A true KR970013267A (en) | 1997-03-29 |
Family
ID=66596323
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
KR1019950027672A KR970013267A (en) | 1995-08-30 | 1995-08-30 | Lead frame with die pad and internal leads connected by insulating tape |
Country Status (1)
Country | Link |
---|---|
KR (1) | KR970013267A (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR101010114B1 (en) * | 2003-08-29 | 2011-01-24 | 르네사스 일렉트로닉스 가부시키가이샤 | Method of manufacturing a lead frame |
-
1995
- 1995-08-30 KR KR1019950027672A patent/KR970013267A/en not_active Application Discontinuation
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR101010114B1 (en) * | 2003-08-29 | 2011-01-24 | 르네사스 일렉트로닉스 가부시키가이샤 | Method of manufacturing a lead frame |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
WITN | Withdrawal due to no request for examination |