KR970013267A - Lead frame with die pad and internal leads connected by insulating tape - Google Patents

Lead frame with die pad and internal leads connected by insulating tape Download PDF

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Publication number
KR970013267A
KR970013267A KR1019950027672A KR19950027672A KR970013267A KR 970013267 A KR970013267 A KR 970013267A KR 1019950027672 A KR1019950027672 A KR 1019950027672A KR 19950027672 A KR19950027672 A KR 19950027672A KR 970013267 A KR970013267 A KR 970013267A
Authority
KR
South Korea
Prior art keywords
die pad
lead frame
lead
semiconductor chip
insulating tape
Prior art date
Application number
KR1019950027672A
Other languages
Korean (ko)
Inventor
김진호
이관재
Original Assignee
김광호
삼성전자 주식회사
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 김광호, 삼성전자 주식회사 filed Critical 김광호
Priority to KR1019950027672A priority Critical patent/KR970013267A/en
Publication of KR970013267A publication Critical patent/KR970013267A/en

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Abstract

내부 리드의 뒤틀림을 방지하고 동일 평면성(co-plunaritv)를 유지하며 다이 패드의 기울어짐을 방지하여 와이어 본딩의 신뢰성을 향상시킴과 동시에 주입되는 에폭시 몰딩 컴파운드의 릎로우 속도를 일정하게 제어하여 불완전성 몰딩에 의한 불량을 억제하기 위하여 반도체 칩이 부착되는 다이 패드의 주변부와 내부 리드의 선단부에 전기절연성 테이프가 부착되어 있는 새로운 리드 프레임의 구조를 개시한다. 테이프가 부착되어 있는 내부 리드의 선단부의 뒤쪽 내부 리드는 단차가 형성되어 있고 와이어 본딩을 위한 도금부가 형성되어 있다.Incomplete molding by preventing warpage of internal leads, maintaining co-plunaritv and preventing die pad tilting to improve the reliability of wire bonding, while controlling the knee speed of the epoxy molding compound being injected. A new lead frame structure is disclosed in which an electrically insulating tape is attached to the periphery of a die pad to which a semiconductor chip is attached and to the tip of an internal lead in order to suppress defects caused by the semiconductor chip. The inner lead at the rear end of the inner lead to which the tape is attached has a stepped portion and a plated portion for wire bonding.

Description

다이 패드와 내부 리드가 절연성 테이프로 연결되어 있는 리드 프레임Lead frame with die pad and internal leads connected by insulating tape

본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음Since this is an open matter, no full text was included.

제1도는 본 발명에 따른 구조를 갖는 리드 프레임의 부분 평면도.1 is a partial plan view of a lead frame having a structure according to the present invention.

제2도는 제1도의 부분 사시도.2 is a partial perspective view of FIG.

Claims (6)

반도체 칩이 실장되는 다이 패드와, 상기 반도체 칩과 전기적으로 연결이 되는 내부 리드를 구비하는 리드 프레임에 있어서, 상기 내부 리드의 선단부와 상기 다이 패드의 주변부는 전기 절연성 테이프에 의해 연결되어 있는 것을 특징으로 하는 리드 프레임.A lead frame comprising a die pad on which a semiconductor chip is mounted and an internal lead electrically connected to the semiconductor chip, wherein the front end portion of the internal lead and the periphery of the die pad are connected by an electrically insulating tape. Lead frame. 제1항에 있어서, 상기 내부 리드의 선단부에는 단차가 형성되어 있으며 상기 단차가 형성된 부분의 바깥쪽에는 도금부가 형성되어 있고, 상기 반도체 칩과 상기 내부 리드의 전기적인 연결은 상기 도금부에서 이루어지는 것을 특징으로 하는 리드 프레임.The method of claim 1, wherein a stepped portion is formed at the tip of the inner lead, and a plated portion is formed outside the portion where the stepped portion is formed, and electrical connection between the semiconductor chip and the inner lead is made at the plated portion. A lead frame characterized by the above. 제1항 또는 제2항에 있어서, 상기 반도체 칩과 상기 내부 리드의 전기적인 연결은 본딩 와이어에 의해 이루어지는 것을 특징으로 하는 리드 프레임.The lead frame according to claim 1 or 2, wherein the electrical connection between the semiconductor chip and the internal lead is made by a bonding wire. 제1항에 있어서, 상기 반도체 칩은 다이 패드에도 실장되며 상기 다이 패드와 전기 절연성 테이프에 의해 연결되어 있는 내부 리드의 선단부에도 실장되는 것을 특징으로 하는 리드 프레임.The lead frame according to claim 1, wherein the semiconductor chip is also mounted on a die pad and also mounted on a tip of an internal lead connected by the die pad and an electrically insulating tape. 제1항에 있어서, 상기 전기 절연성 테이프는 상기 반도체 칩이 실장되는 다이 패드면의 반대쪽 면에서 상기 다이 패드와 내부 리드를 연결하는 것을 특징으로 하는 리드 프레임.The lead frame according to claim 1, wherein the electrically insulating tape connects the die pad and the inner lead on a surface opposite to the die pad surface on which the semiconductor chip is mounted. 제1항에 있어서, 상기 전기 절연성 테이프는 상기 반도체 칩이 실장되는 다이 패드면에서 상기 다이 패드와 내부 리드를 연결하는 것을 특징으로 하는 리드 프레임.The lead frame according to claim 1, wherein the electrically insulating tape connects the die pad and the inner lead at a die pad surface on which the semiconductor chip is mounted.
KR1019950027672A 1995-08-30 1995-08-30 Lead frame with die pad and internal leads connected by insulating tape KR970013267A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
KR1019950027672A KR970013267A (en) 1995-08-30 1995-08-30 Lead frame with die pad and internal leads connected by insulating tape

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR1019950027672A KR970013267A (en) 1995-08-30 1995-08-30 Lead frame with die pad and internal leads connected by insulating tape

Publications (1)

Publication Number Publication Date
KR970013267A true KR970013267A (en) 1997-03-29

Family

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Family Applications (1)

Application Number Title Priority Date Filing Date
KR1019950027672A KR970013267A (en) 1995-08-30 1995-08-30 Lead frame with die pad and internal leads connected by insulating tape

Country Status (1)

Country Link
KR (1) KR970013267A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101010114B1 (en) * 2003-08-29 2011-01-24 르네사스 일렉트로닉스 가부시키가이샤 Method of manufacturing a lead frame

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101010114B1 (en) * 2003-08-29 2011-01-24 르네사스 일렉트로닉스 가부시키가이샤 Method of manufacturing a lead frame

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