US20080190594A1 - Heat Exchanger Device for Rapid Heating or Cooling of Fluids - Google Patents
Heat Exchanger Device for Rapid Heating or Cooling of Fluids Download PDFInfo
- Publication number
- US20080190594A1 US20080190594A1 US11/909,764 US90976406A US2008190594A1 US 20080190594 A1 US20080190594 A1 US 20080190594A1 US 90976406 A US90976406 A US 90976406A US 2008190594 A1 US2008190594 A1 US 2008190594A1
- Authority
- US
- United States
- Prior art keywords
- channels
- heat exchanger
- plates
- throughholes
- films
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Abandoned
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Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
- B01D—SEPARATION
- B01D5/00—Condensation of vapours; Recovering volatile solvents by condensation
- B01D5/0003—Condensation of vapours; Recovering volatile solvents by condensation by using heat-exchange surfaces for indirect contact between gases or vapours and the cooling medium
- B01D5/0015—Plates
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
- B01D—SEPARATION
- B01D1/00—Evaporating
- B01D1/22—Evaporating by bringing a thin layer of the liquid into contact with a heated surface
- B01D1/221—Composite plate evaporators
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
- B01J—CHEMICAL OR PHYSICAL PROCESSES, e.g. CATALYSIS OR COLLOID CHEMISTRY; THEIR RELEVANT APPARATUS
- B01J19/00—Chemical, physical or physico-chemical processes in general; Their relevant apparatus
- B01J19/0093—Microreactors, e.g. miniaturised or microfabricated reactors
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
- B01J—CHEMICAL OR PHYSICAL PROCESSES, e.g. CATALYSIS OR COLLOID CHEMISTRY; THEIR RELEVANT APPARATUS
- B01J19/00—Chemical, physical or physico-chemical processes in general; Their relevant apparatus
- B01J19/24—Stationary reactors without moving elements inside
- B01J19/248—Reactors comprising multiple separated flow channels
- B01J19/249—Plate-type reactors
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
- F28D9/00—Heat-exchange apparatus having stationary plate-like or laminated conduit assemblies for both heat-exchange media, the media being in contact with different sides of a conduit wall
- F28D9/0081—Heat-exchange apparatus having stationary plate-like or laminated conduit assemblies for both heat-exchange media, the media being in contact with different sides of a conduit wall the conduits for one heat-exchange medium being formed by a single plate-like element ; the conduits for one heat-exchange medium being integrated in one single plate-like element
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
- B01J—CHEMICAL OR PHYSICAL PROCESSES, e.g. CATALYSIS OR COLLOID CHEMISTRY; THEIR RELEVANT APPARATUS
- B01J2219/00—Chemical, physical or physico-chemical processes in general; Their relevant apparatus
- B01J2219/00781—Aspects relating to microreactors
- B01J2219/00783—Laminate assemblies, i.e. the reactor comprising a stack of plates
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
- B01J—CHEMICAL OR PHYSICAL PROCESSES, e.g. CATALYSIS OR COLLOID CHEMISTRY; THEIR RELEVANT APPARATUS
- B01J2219/00—Chemical, physical or physico-chemical processes in general; Their relevant apparatus
- B01J2219/00781—Aspects relating to microreactors
- B01J2219/00819—Materials of construction
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
- B01J—CHEMICAL OR PHYSICAL PROCESSES, e.g. CATALYSIS OR COLLOID CHEMISTRY; THEIR RELEVANT APPARATUS
- B01J2219/00—Chemical, physical or physico-chemical processes in general; Their relevant apparatus
- B01J2219/00781—Aspects relating to microreactors
- B01J2219/00873—Heat exchange
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
- B01J—CHEMICAL OR PHYSICAL PROCESSES, e.g. CATALYSIS OR COLLOID CHEMISTRY; THEIR RELEVANT APPARATUS
- B01J2219/00—Chemical, physical or physico-chemical processes in general; Their relevant apparatus
- B01J2219/24—Stationary reactors without moving elements inside
- B01J2219/2401—Reactors comprising multiple separate flow channels
- B01J2219/245—Plate-type reactors
- B01J2219/2451—Geometry of the reactor
- B01J2219/2453—Plates arranged in parallel
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
- B01J—CHEMICAL OR PHYSICAL PROCESSES, e.g. CATALYSIS OR COLLOID CHEMISTRY; THEIR RELEVANT APPARATUS
- B01J2219/00—Chemical, physical or physico-chemical processes in general; Their relevant apparatus
- B01J2219/24—Stationary reactors without moving elements inside
- B01J2219/2401—Reactors comprising multiple separate flow channels
- B01J2219/245—Plate-type reactors
- B01J2219/2451—Geometry of the reactor
- B01J2219/2456—Geometry of the plates
- B01J2219/2458—Flat plates, i.e. plates which are not corrugated or otherwise structured, e.g. plates with cylindrical shape
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
- B01J—CHEMICAL OR PHYSICAL PROCESSES, e.g. CATALYSIS OR COLLOID CHEMISTRY; THEIR RELEVANT APPARATUS
- B01J2219/00—Chemical, physical or physico-chemical processes in general; Their relevant apparatus
- B01J2219/24—Stationary reactors without moving elements inside
- B01J2219/2401—Reactors comprising multiple separate flow channels
- B01J2219/245—Plate-type reactors
- B01J2219/2461—Heat exchange aspects
- B01J2219/2462—Heat exchange aspects the reactants being in indirect heat exchange with a non reacting heat exchange medium
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
- F28F2250/00—Arrangements for modifying the flow of the heat exchange media, e.g. flow guiding means; Particular flow patterns
- F28F2250/10—Particular pattern of flow of the heat exchange media
- F28F2250/104—Particular pattern of flow of the heat exchange media with parallel flow
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
- F28F2260/00—Heat exchangers or heat exchange elements having special size, e.g. microstructures
- F28F2260/02—Heat exchangers or heat exchange elements having special size, e.g. microstructures having microchannels
Definitions
- the invention relates to a heat exchanger with which fluids can be very rapidly and uniformly cooled or heated.
- Heat exchangers are required in numerous industrial applications. Here, the trend is increasing towards ever higher heat transfer performance in the smallest possible space. These requirements are met particularly well by micro heat exchangers. In process technology, it is moreover desirable for very uniform heat transfer to take place, that is, to avoid so-called hot spots arising which could result in product damage due to an uncontrolled temperature increase.
- a microstructure heat exchanger made up of small pipes or hollow fibres located in a graphite matrix is known from DE 100 22 972 A1.
- micro heat exchangers are constructed of multi-ply microstructured layers, wherein the individual layers each have a number of microchannels.
- the layers are arranged such that the microchannels of adjacent layers are aligned in simple cross-flow construction, parallel flow construction or counter flow construction.
- Such a micro heat exchanger is known from DE 196 08 824 A1.
- the wall temperatures remain in a middle range at all positions on the heating surface.
- the heat exchange performance is relatively poor.
- the heat exchange performance is between that of the parallel flow heat exchanger and the counter flow heat exchanger.
- the full heat exchange surface is not used efficiently here, as the temperature differences in a quadrant of the heat exchange surface become extremely small or cease to exist.
- micro heat exchangers have either insufficient or no heat insulation from the surrounding ambient, which has a particularly disadvantageous effect on modular micro reaction systems, as known for example from DE 202 01 753 U1, as it results in very intensive heat exchange with adjacent modules.
- the invention is based on the object of providing the highest possible heat transfer performance, that is, a large heat transfer surface, while achieving extremely small pressure loss both for the process fluid and for the heat transfer fluid.
- the heat exchanger is constructed from a stack of films or plates in which channels for the fluids are embodied each lying adjacent one another, wherein the channels of the films or plates lying over one another intersect.
- the heat transfer fluid flows into the channels of a film or plate lying adjacent one another in antiparallel branch flows, while in the film or plate lying thereabove and therebelow, the process fluid flows transverse to the heat transfer fluid and parallel in the channels lying adjacent one another. Due to the linear channelling in each case, the pressure loss in the heat exchanger is minimized.
- the device according to the invention leads to the inlet conditions of a counter flow heat exchanger having the known high temperature differences between heat transfer fluid and process fluid. Due to the numerous crossing points of heat transfer fluid and process fluid, an optimum temperature difference between heat transfer fluid and process fluid and thus an extremely high heat transfer performance per unit of volume and simultaneously absolutely uniform heat transfer over the whole volume of the heat exchanger, is hereby obtained over the whole volume of the heat exchanger.
- the present invention combines the advantages of a counter flow heat exchanger with the advantages of a cross flow heat exchanger.
- FIG. 1 shows a schematic cross section through a stack of films
- FIG. 2 shows a section along the line A-A in FIG. 1 ,
- FIG. 3 shows a section along the line C-C in FIG. 1 and FIG. 2 ,
- FIG. 4 shows a section along the line B-B in FIG. 1 .
- FIG. 5 schematically shows the flow pattern in two plies of flow channels lying over one another
- FIG. 6 shows a schematic perspective view of the arrangement of channels and pipes of the heat exchanger
- FIG. 7 shows an exploded view of distributor plates
- FIG. 8 shows a housing with a micro heat exchanger from a stack of films in a perspective cut-away representation
- FIGS. 1 to 4 schematically show the construction of a micro heat exchanger 1 , wherein FIG. 1 represents a stack of films or thin plates F as indicated by dashed lines in FIG. 1 .
- FIG. 1 represents a stack of films or thin plates F as indicated by dashed lines in FIG. 1 .
- the individual films or plates channels and throughholes are embodied, wherein the channels extending horizontally can be embodied in a film F for example by recesses which are covered by the surfaces of adjacent film F, so that a closed channel results.
- the lowest film of the stack of films is merely shown as a cover film for the bottom row of channels 3 .
- another shape of channel formation in the individual films or plates F is also possible, for example in that a division extends between two adjacent films F in each case along the middle of the horizontally extending channels 2 and 3 .
- FIG. 1 shows as an example a flow pattern in which a process fluid P flows through the channels 2 and a heat transfer fluid W flows through the channels 3 extending transversely thereto.
- the channels 3 lie adjacent one another in a film F and form a row 30 of channels in each second film F.
- the channels 2 for the process fluid P are each formed lying adjacent one another in a row 20 , as FIG. 2 shows, which represents a section along the line A-A in FIG. 1 .
- the process fluid P flows parallel through the adjacent channels 2 in each case, while the heat transfer fluid W flows antiparallel in two branch flows W 1 and W 2 through the adjacent channels 3 , as the flow pattern in FIG. 5 shows schematically.
- FIG. 4 represents a section along the line B-B in FIG. 1 , wherein FIG. 4 only represents a partial sectional view, and the upper and lower edge areas of the heat exchanger unit 1 are not represented.
- the supplying of the heat transfer fluid W takes place via throughholes 4 in the films F, which in FIG. 2 form a pipe 4 from bottom to top, extending transverse to the horizontally extending channels 2 and 3 at an angle of approximately 90°.
- the discharging of the heat transfer fluid W takes place on the opposite side through a pipe 4 a , which is embodied by corresponding throughholes in the films F lying over one another and likewise extends in the plane of the drawing of FIG. 2 from top to bottom or vice versa, transverse to each of the channels 2 and 3 .
- the adjacent channels 3 in FIG. 2 through which the branch flows W 2 flow from right to left, are fed by a pipe formed by throughholes 5 , which lies before and behind the pipe 4 a .
- the discharging of the branch flows W 2 takes place through pipes 5 a before and behind the pipe 4 in FIG. 2 , as can also be seen from FIG. 6 .
- FIG. 1 shows pipes 7 and 8 , embodied in the same way by throughholes, on the opposite sides of the intersecting channels 2 and 3 , wherein in the embodiment shown the process fluid P is supplied from above through pipe 7 and discharged through pipe 8 .
- FIGS. 1 to 4 the direction of flow away from the observer is represented by an X and the direction of flow towards the observer by a dot.
- FIG. 5 schematically shows the flow pattern in the core portion of the heat exchanger with intersecting channels 2 and 3 , wherein the heat transfer fluid W is represented in the first upper row 30 of channels 3 in FIG. 1 and the process fluid P in the row 20 of channels 2 therebelow in FIG. 1 , without the channels themselves being represented.
- FIG. 5 therefore only shows by means of arrows the flow in the core portion of the heat exchanger, wherein the process fluid P flows parallel through each of the channels 2 arranged in rows, and the heat transfer fluid W flows transverse thereto in antiparallel flow to the branch flows W 1 and W 2 in each case.
- FIG. 6 shows in a schematic perspective view a heat exchanger unit 1 .
- the core of the heat exchanger is formed by the intersecting channels 2 and 3 , which are each arranged in rows 20 and 30 , wherein the heat transfer fluid W is guided antiparallel or in counter flow in adjacent channels 3 , while the process fluid P flows in parallel flow through the adjacent channels 2 .
- the supply and discharge of fluid takes place in each case on the outsides of the block-shaped arrangement of the intersecting channels 2 , 3 through pipes embodied by the throughholes 4 , 5 and 7 , 8 in the films F.
- the heat exchange takes place in the inner block of intersecting channels 2 , 3 , while the supply and discharge pipes 4 , 5 and 7 , 8 are arranged on the outside of the block.
- FIG. 6 the pipes 6 on opposite outsides of the heat exchanger 1 represented in FIGS. 1 and 3 are not shown.
- the micro heat exchanger 1 is used for cooling a process fluid P
- the heat transfer fluid W at first flows through throughholes 6 , embodied in FIG. 1 on the outside of the supply and discharge pipes 7 and 8 for the process fluid P, so that efficient heat insulation of the warm process fluid P in channels 7 and 8 in relation to the surrounding ambient is achieved through these pipes 6 with cold heat transfer fluid W.
- the heat transfer fluid W is supplied via the throughholes 4 to the channels 3 extending out of the plane of the drawing in FIG. 2 , whereupon the heat transfer fluid emerges via the pipes embodied by the throughholes 8 .
- the block of intersecting channels 2 and 3 is insulated from the surrounding ambient on the four outsides in each case by a row of pipes 6 , wherein in FIG. 1 only two outsides are represented.
- the outsides of the heat exchanger core lying at the top and bottom in FIGS. 1 and 2 are also formed by rows 30 of channels 3 , through which heat transfer fluid W flows. In this way, the cooling process fluid P in the channels 2 , 7 and 8 is effectively protected from the surrounding ambient.
- the supply pipes of the heat transfer fluid W and of the process fluid P can be exchanged, so that in this case too, the cooler fluid flows into the outer pipes 6 , 7 and 8 , so that heat insulation from the surrounding ambient is provided.
- the design is selected such that cooler fluid likewise flows through the rows 30 of channels arranged on the outsides.
- the described construction allows a plurality of adaptations, by changing the number of films F and of channels 2 , 3 and adapting it to the flow rates desired in each case.
- By enlarging the stack of films or thin plates F the capacity of the micro heat exchanger 1 can be corresponding enlarged.
- both the process fluid P and the heat transfer fluid W flow antiparallel through the respective rows 20 , 30 of channels 2 , 3 .
- the channels 2 , 3 and the pipes 4 to 8 can be embodied such that they have the same cross section for their whole length. Hereby, a minimum pressure loss occurs during throughflow through the heat exchanger. However, it is also possible to embody the pipes 4 to 8 with a larger cross section than the channels 2 and 3 .
- FIG. 8 schematically shows a stack of films FS in a housing 100 in which pipes are embodied for the supply and discharge of process fluid P and heat transfer fluid W.
- the housing 100 is constructed as a module which can be combined with other modules for the treatment of a process fluid P.
- the heat exchanger 1 described by means of FIGS. 1 to 4 can also be used without a housing 100 , wherein in FIG. 1 on the upper and lower side in each case a conduit device is provided which has the connections for the pipes 4 , 5 , 6 , 7 and 8 .
- FIG. 7 shows in an embodiment distributor plates or films F 1 to F 3 in an exploded view, which represents the supplying of the heat transfer fluid W from the lower side of a stack of films and the distribution into branch flows W 1 and W 2 .
- a throughhole 10 is formed through which the heat transfer fluid W is supplied.
- a channel 10 a extends in the film plane, which branches into two channels 10 b , which in turn branch into two channels 10 c and so forth, until on the right-hand side in FIG. 7 the number of pipes 10 e is available which is required for the supplying of the channels 3 of a row 30 for the heat transfer fluid in the core portion of the heat exchanger.
- throughholes 5 are embodied in a row, which lie opposite the ends of the individual pipes 10 e , so that the heat transfer fluid W, as indicated by dashed lines, can flow upward through the throughholes 5 .
- a pipe 11 is formed branching off, which leads in the film plane to the opposite side of the core portion of the heat exchanger unit 1 .
- a row of throughholes 4 is embodied which lie opposite the ends of the pipes 11 , so that a branch flow W 1 of the heat transfer fluid can flow upwards through the throughholes 4 .
- the opposite row of throughholes 5 in the film F 3 lies opposite the holes 5 in the film F 2 , from which no pipes 11 branch off, so that a branch flow W 2 flows upwards through the throughholes 5 .
- a channel arrangement corresponding to FIG. 4 can be embodied in the next film plane, in which the two branch flows W 1 and W 2 flow in counter flow through the channels 3 .
- the return pipes 4 a and 5 a are not shown. They can be embodied by corresponding throughholes in the films, wherein corresponding to the films F 1 and F 2 , the returning heat transfer fluid W is collected and discharged through a common outlet corresponding to the throughhole 10 .
- the supplying of the process fluid P in the embodiment shown takes place from above by an arrangement of distributor plates corresponding to that in FIG. 7 , wherein the lowest plate F 1 in FIG. 7 forms the uppermost plate for the guiding of the process fluid.
- the process fluid P flows in parallel flow through the channels 2 , it is not necessary to provide a distributor plate corresponding to the distributor plate F 2 .
- a film with throughholes corresponding to film F 3 can be joined, in which rows of throughholes 7 and 8 are embodied, instead of the row of throughholes 4 and 5 shown in FIG. 7 .
- the films F 1 to F 3 are shown discoidally, while in FIGS. 1 to 4 and 6 , in each case only one block-shaped arrangement of channels 2 , 3 and pipes 4 to 8 is represented.
- the channels and pipes shown in these Figures can be embodied in discoidal films, so that a round stack FS of films F results, as shown in FIG. 8 .
- the heat transfer fluid W is supplied from below and discharged from above, so that any air contained in the heat exchanger is displaced out upwards.
- the process fluid can be supplied from above and discharged on the lower side.
- another flow direction of the fluids P and W is also possible.
- the heat transfer fluid W can be supplied from above and also discharged from above, while the process fluid P is supplied from below and discharged from below.
- FIG. 9 schematically shows an arrangement of individual heat exchanger units 1 , of which one is shown in FIG. 6 .
- a plurality of such heat exchanger units 1 can be arranged adjacent and over one another, as FIG. 9 shows, wherein above a lower ply of heat exchanger units la a further ply of heat exchanger units 1 b and 1 c is arranged.
- the heat transfer performance can be multiplied without substantially increasing the overall pressure loss, in that the individual heat exchanger units 1 are fed fluidically in a parallel manner.
- each individual heat exchanger unit 1 can be supplied with fluid by means of distributor plates corresponding to FIG. 7 , wherein the different distributor plates can be supplied with fluid centrally by an additional distributor plate.
- distributor plates can be provided in which throughholes are embodied for forming pipes leading vertically upwards between the heat exchanger units 1 a , through which pipes the heat exchanger units 1 b and 1 c are supplied with the fluids W or P.
- distributor plates can be provided on the upper side of the block of a plurality of heat exchanger units.
- a further distributor plate can be provided from which the individual throughholes 10 are supplied with fluid, wherein this additional distributor plate has a central fluid supply from which channels lead off to the individual throughholes 10 of the individual heat exchanger units 1 a , corresponding to the film F 1 shown in FIG. 7 .
- temperature sensors can be integrated directly adjacent the microstructured films or thin plates.
- fluid or process fluid is to be understood broadly according to the invention and comprises liquids and gases as well as emulsions, dispersions and aerosols.
- the device can be used both for cooling and for heating.
- Microstructured channels means structures which are smaller than 1 mm in at least one spatial dimension.
- the walls between the microstructured channels are preferably between 10 ⁇ m and 500 ⁇ m thick.
- the films or thin plates with which the micro heat exchangers are joined together are composed of sufficient inert material, preferably metals, semiconductors, alloys, high-quality steels, composite materials, glass, quartz glass, ceramic or polymer materials, or of combinations of these materials.
- Methods which can be considered as suitable for fluidically leak-proof joining of the films or thin plates are for example pressing, riveting, bonding, soldering, welding, diffusion soldering, diffusion welding, and anodic or eutectic bonding.
- the structuring of the films or thin plates can take place for example by milling, laser ablation, etching, the LIGA method, galvanic casting, sintering, die-cutting or deformation.
- the device can be used not only as a micro heat exchanger but that, for example, an application as an evaporator or condenser of a combination thereof (rectification) is also possible.
- a heat exchanger according to the invention is not only suitable for micro construction. It can also be used for larger-dimensioned heat exchangers. These can be constructed for example, from thicker plates in which channels are stamped, milled or imprinted and bores are embodied instead of throughholes. Such structures can also be formed on the plates by spark erosion.
- the material of the plates or films F preferably consists of inert material or material which is sufficiently inert in relation to the fluids used.
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- Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Organic Chemistry (AREA)
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Thermal Sciences (AREA)
- Mechanical Engineering (AREA)
- General Engineering & Computer Science (AREA)
- Heat-Exchange Devices With Radiators And Conduit Assemblies (AREA)
Applications Claiming Priority (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE202005013835U DE202005013835U1 (de) | 2005-09-01 | 2005-09-01 | Vorrichtung zum schnellen Aufheizen, Abkühlen, Verdampfen oder Kondensieren von Fluiden |
DE202005013835.5 | 2005-09-01 | ||
EPPCT/EP2006/008564 | 2006-09-01 | ||
PCT/EP2006/008564 WO2007025766A1 (de) | 2005-09-01 | 2006-09-01 | Wärmetauschervorrichtung zum schnellen aufheizen oder abkühlen von fluiden |
Publications (1)
Publication Number | Publication Date |
---|---|
US20080190594A1 true US20080190594A1 (en) | 2008-08-14 |
Family
ID=35404887
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
US11/909,764 Abandoned US20080190594A1 (en) | 2005-09-01 | 2006-09-01 | Heat Exchanger Device for Rapid Heating or Cooling of Fluids |
Country Status (8)
Country | Link |
---|---|
US (1) | US20080190594A1 (de) |
EP (1) | EP1920208A1 (de) |
JP (1) | JP2009507202A (de) |
AU (1) | AU2006286714A1 (de) |
CA (1) | CA2600057A1 (de) |
DE (1) | DE202005013835U1 (de) |
IL (1) | IL185605A0 (de) |
WO (1) | WO2007025766A1 (de) |
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20160123537A1 (en) * | 2013-07-26 | 2016-05-05 | Bruker Biospin Corporation | Flexible interface closed cycle cryocast with remotely located point of cooling |
US20170328644A1 (en) * | 2014-11-06 | 2017-11-16 | Sumitomo Precision Products Company, Ltd. | Heat Exchanger |
CN108027282A (zh) * | 2015-09-09 | 2018-05-11 | 富士通将军股份有限公司 | 微流路热交换器 |
WO2018219855A1 (en) * | 2017-05-30 | 2018-12-06 | Shell Internationale Research Maatschappij B.V. | Method of using an indirect heat exchanger and facility for processing liquefied natural gas comprising such heat exchanger |
Families Citing this family (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP2017249A1 (de) | 2007-07-19 | 2009-01-21 | Total Petrochemicals Research Feluy | Verfahren zur selektiven Oxidation von Methan |
DE102010018869A1 (de) * | 2010-04-30 | 2011-11-03 | Karlsruher Institut für Technologie | Wärmetauscher zum schnellen Erhitzen und Abkühlen von Fluiden |
CN108759513A (zh) * | 2011-12-09 | 2018-11-06 | 应用材料公司 | 用于冷却加热管的热交换器和所述冷却的方法 |
KR101624147B1 (ko) | 2014-12-22 | 2016-05-26 | 한국원자력연구원 | 3차원 열교환기 |
DE202019101687U1 (de) * | 2019-03-25 | 2020-06-26 | Reinz-Dichtungs-Gmbh | Temperierplatte mit einem mikrostrukturierten Flüssigkeitskanal, insbesondere für Kraftfahrzeuge |
Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5823252A (en) * | 1994-07-28 | 1998-10-20 | Daimler-Benz Aktiengesellschaft | Two-stage evaporator unit |
US20020106311A1 (en) * | 2000-02-03 | 2002-08-08 | Cellular Process Chemistry, Inc. | Enhancing fluid flow in a stacked plate microreactor |
US6581402B2 (en) * | 2000-09-27 | 2003-06-24 | Idalex Technologies, Inc. | Method and plate apparatus for dew point evaporative cooler |
US6994155B2 (en) * | 2000-04-12 | 2006-02-07 | Cheiros (Technology) Ltd. | Heat transfer |
Family Cites Families (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP0292245A1 (de) * | 1987-05-21 | 1988-11-23 | Heatric Pty. Limited | Wärmeaustauscher mit flachen Platten |
DE19608824A1 (de) * | 1996-03-07 | 1997-09-18 | Inst Mikrotechnik Mainz Gmbh | Verfahren zur Herstellung von Mikrowärmetauschern |
DE10031558A1 (de) * | 2000-06-28 | 2002-01-10 | Clariant Gmbh | Verfahren zur Konditionierung von organischen Pigmenten |
DE10304077A1 (de) * | 2003-01-31 | 2004-08-12 | Heinz Schilling Kg | Luft-/Wasser-Wärmetauscher mit Teilwasserwegen |
-
2005
- 2005-09-01 DE DE202005013835U patent/DE202005013835U1/de not_active Expired - Lifetime
-
2006
- 2006-09-01 EP EP06791789A patent/EP1920208A1/de not_active Withdrawn
- 2006-09-01 JP JP2008528426A patent/JP2009507202A/ja active Pending
- 2006-09-01 AU AU2006286714A patent/AU2006286714A1/en not_active Abandoned
- 2006-09-01 CA CA002600057A patent/CA2600057A1/en not_active Abandoned
- 2006-09-01 WO PCT/EP2006/008564 patent/WO2007025766A1/de active Application Filing
- 2006-09-01 US US11/909,764 patent/US20080190594A1/en not_active Abandoned
-
2007
- 2007-08-30 IL IL185605A patent/IL185605A0/en unknown
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US20020106311A1 (en) * | 2000-02-03 | 2002-08-08 | Cellular Process Chemistry, Inc. | Enhancing fluid flow in a stacked plate microreactor |
US6994155B2 (en) * | 2000-04-12 | 2006-02-07 | Cheiros (Technology) Ltd. | Heat transfer |
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Cited By (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20160123537A1 (en) * | 2013-07-26 | 2016-05-05 | Bruker Biospin Corporation | Flexible interface closed cycle cryocast with remotely located point of cooling |
US20170328644A1 (en) * | 2014-11-06 | 2017-11-16 | Sumitomo Precision Products Company, Ltd. | Heat Exchanger |
CN108027282A (zh) * | 2015-09-09 | 2018-05-11 | 富士通将军股份有限公司 | 微流路热交换器 |
US10365051B2 (en) * | 2015-09-09 | 2019-07-30 | Fujitsu General Limited | Microchannel heat exchanger |
WO2018219855A1 (en) * | 2017-05-30 | 2018-12-06 | Shell Internationale Research Maatschappij B.V. | Method of using an indirect heat exchanger and facility for processing liquefied natural gas comprising such heat exchanger |
US11988460B2 (en) | 2017-05-30 | 2024-05-21 | Shell Usa, Inc. | Method of using an indirect heat exchanger and facility for processing liquefied natural gas comprising such heat exchanger |
Also Published As
Publication number | Publication date |
---|---|
JP2009507202A (ja) | 2009-02-19 |
WO2007025766A1 (de) | 2007-03-08 |
CA2600057A1 (en) | 2007-03-08 |
AU2006286714A1 (en) | 2007-03-08 |
EP1920208A1 (de) | 2008-05-14 |
IL185605A0 (en) | 2008-01-06 |
DE202005013835U1 (de) | 2005-11-10 |
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