US20080153981A1 - Hot melt pressure sensitive adhesive for paper labels - Google Patents

Hot melt pressure sensitive adhesive for paper labels Download PDF

Info

Publication number
US20080153981A1
US20080153981A1 US11/643,912 US64391206A US2008153981A1 US 20080153981 A1 US20080153981 A1 US 20080153981A1 US 64391206 A US64391206 A US 64391206A US 2008153981 A1 US2008153981 A1 US 2008153981A1
Authority
US
United States
Prior art keywords
hmpsa
composition according
tackifying resin
hmpsa composition
resin
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
US11/643,912
Other languages
English (en)
Inventor
David Goubard
Robert John Haeger
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Bostik SA
Original Assignee
Bostik SA
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Bostik SA filed Critical Bostik SA
Priority to US11/643,912 priority Critical patent/US20080153981A1/en
Assigned to BOSTIK S.A. reassignment BOSTIK S.A. ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: GOUBARD, DAVID, HAEGER, JOHN
Priority to MX2009005243A priority patent/MX2009005243A/es
Priority to AU2007338452A priority patent/AU2007338452B2/en
Priority to ES07856736T priority patent/ES2364203T3/es
Priority to EP20070856736 priority patent/EP2121865B1/de
Priority to DE200760013809 priority patent/DE602007013809D1/de
Priority to PL07856736T priority patent/PL2121865T3/pl
Priority to CN2007800429778A priority patent/CN101589126B/zh
Priority to PCT/EP2007/010998 priority patent/WO2008077509A1/en
Priority to RU2009114362A priority patent/RU2415171C2/ru
Priority to AT07856736T priority patent/ATE504637T1/de
Publication of US20080153981A1 publication Critical patent/US20080153981A1/en
Priority to US12/345,543 priority patent/US8263696B2/en
Priority to ZA200902672A priority patent/ZA200902672B/xx
Abandoned legal-status Critical Current

Links

Classifications

    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08LCOMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L53/00Compositions of block copolymers containing at least one sequence of a polymer obtained by reactions only involving carbon-to-carbon unsaturated bonds; Compositions of derivatives of such polymers
    • C08L53/02Compositions of block copolymers containing at least one sequence of a polymer obtained by reactions only involving carbon-to-carbon unsaturated bonds; Compositions of derivatives of such polymers of vinyl-aromatic monomers and conjugated dienes
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J153/00Adhesives based on block copolymers containing at least one sequence of a polymer obtained by reactions only involving carbon-to-carbon unsaturated bonds; Adhesives based on derivatives of such polymers
    • C09J153/02Vinyl aromatic monomers and conjugated dienes
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08LCOMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2205/00Polymer mixtures characterised by other features
    • C08L2205/02Polymer mixtures characterised by other features containing two or more polymers of the same C08L -group
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08LCOMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2666/00Composition of polymers characterized by a further compound in the blend, being organic macromolecular compounds, natural resins, waxes or and bituminous materials, non-macromolecular organic substances, inorganic substances or characterized by their function in the composition
    • C08L2666/02Organic macromolecular compounds, natural resins, waxes or and bituminous materials
    • C08L2666/24Graft or block copolymers according to groups C08L51/00, C08L53/00 or C08L55/02; Derivatives thereof
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10TTECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00Stock material or miscellaneous articles
    • Y10T428/31504Composite [nonstructural laminate]
    • Y10T428/31855Of addition polymer from unsaturated monomers
    • Y10T428/3188Next to cellulosic
    • Y10T428/31895Paper or wood
    • Y10T428/31899Addition polymer of hydrocarbon[s] only
    • Y10T428/31902Monoethylenically unsaturated

Definitions

  • the present invention is concerned with a Hot Melt Pressure Sensitive Adhesive (HMPSA) compositions and systems.
  • HMPSA systems include a laminate comprising an adhesive layer consisting of said HMPSA and a paper facestock.
  • the HMPSA systems also include a permanent Pressure Sensitive Adhesive label obtainable from the laminated system.
  • PSA Pressure Sensitive Adhesive
  • paper based labels which are fixed on articles for information presentation purposes (such as bar code, name, price) and/or for mere ornamental purposes.
  • PSAs are generally applied by continuous coating processes on a large surface of a support layer, made of a base material (also called facestock) which consists of paper or of a plastic film.
  • the adhesive layer which coats this support layer is protected by a release liner consisting of, for instance, siliconized paper.
  • the resulting laminated system is generally produced so as to be wound up on itself under the form of large rolls of up to 2 m in width and 1 m in diameter, which is an appropriate dimension for storage and transport.
  • This laminated system may be subsequently converted into commercially useful labels after further processing steps which include printing and cutting.
  • labels are generally designated as pressure-sensitive or self-adhesive labels or PSA labels.
  • PSA labels After removal of the release liner, these labels may be adhered to a substrate, such as an article to be labeled, generally by means of an automated labeling equipment, for instance on the packaging lines of the end-user's industrial site.
  • PSAs due to their high tack, enable the manufacturing of self-adhesive labels which adhere in a very short time to substrates, which increases manufacturing output.
  • HM Hot Melt Adhesive
  • HMPSA Hot Melt Pressure Sensitive Adhesive
  • HMPSAs are designed to provide labels (in particular paper based labels) with high adhesive performance, which can be permanently fixed on the articles to be labeled. Once removed from the release liner and adhered to a substrate, these labels tear on any attempt to remove them.
  • Such HMPSAs are also designated as permanent HMPSA, in contrast to removable HMPSAs which are designed to provide labels which once adhered to a substrate must be able to be removed from the substrate after a residence time, and adhered to it again.
  • HMPSAs generally comprise a thermoplastic polymer (in particular elastomeric block copolymers) in combination with tackifying resins and plasticizers.
  • HMPSA compositions characterized by less bleed and staining tendencies. These HMPSAs are based on elastomeric components such as styrenic block copolymers and tackifying resins with softening points ranging from about 35 to 60° C.
  • WO 99/20708 relates to a HMPSA based on a block copolymer having a high level of diblock which exhibits minimal staining of paper.
  • this HMPSA is a removable grade whose adhesive performance is insufficient for designing a permanent PSA label.
  • the HMPSAs according to the present invention exhibit one or more of the following properties: a reduced tendency to discolor or stain paper after being coated thereon, a reduced tendency to discolor or stain after storage of the corresponding laminated system at temperatures well above room temperature, and high tack and adhesive performance on a variety of substrates.
  • HMPSA hot melt pressure sensitive adhesive
  • tackifying resin(s) with a softening temperature comprised between 70 and 150° C.
  • a tackifying resin (i) obtainable by hydrogenating, polymerizing or copolymerizing mixtures of aliphatic unsaturated hydrocarbons having about 5, 9 or 10 carbon atoms;
  • the composition according to the invention advantageously gives to the laminated system a high tack at room temperature resulting from its coating on a support layer, which makes the laminated system particularly useful as a PSA label.
  • This high tack is further exhibited at low temperature at around 2° C., which makes possible the labeling of cold articles, such as refrigerated foodstuffs packaged in a plastic film—for instance: fruit, vegetable or meat.
  • the laminated system also possesses very good adhesive performance which enables permanent fixing of the resulting label on the various substrates of the articles to be labeled.
  • the composition according to the invention exhibits reduced staining or discoloration of the paper after storage of the laminate at a temperature of about 75° C. and under pressure.
  • the styrenic triblock and diblock copolymers comprised in the composition according to the invention have a weight average molecular weight M w comprised between 60 and 420 kDa and may be linear or radial. Unless indicated to the contrary, the average molecular weights M w used in the present application are given in dalton (Da) and are determined by Gel Permeation Chromatography, the column being calibrated by a polystyrene standard. These styrenic block copolymers are well known in the art and are commercially available.
  • Preferred mixtures of SX 1 S triblock and SX 2 diblock copolymers include 10 to 30% of triblocks and 70 to 90% of diblocks. Further preferred mixtures of SX 1 S triblock and SX 2 diblock are such that the elastomeric polymerized segments X 1 and X 2 consist of the same monomer.
  • the overall styrene monomer content is more preferably from 15 to 30%.
  • a preferred composition according to the invention comprises a mixture of styrenic SX 1 S triblock and SX 2 diblock copolymers wherein X 1 and X 2 represent a polymerized segment of isoprene or a polymerized segment of butadiene.
  • Such copolymers are also designated as SIS, SI, SBS or SB block copolymers. Examples may include:
  • SEBS styrene-ethylene-butylene-styrene
  • SEPS styrene-ethylene-propylene-styrene
  • the HMPSA compositions may also comprise block copolymers of the SIBS type which are for instance described in US 2005/0137312 published on Jun. 23, 2005.
  • the HMPSA composition according to the invention comprises one or more tackifying resin(s), each with a softening temperature comprised between 70 and 150° C.
  • the overall amount of these tackifying resins in the HMPSA composition is comprised between 40 to 55%.
  • tackifying resins comprise one or more tackifying resin (i) obtainable by hydrogenating, polymerizing or copolymerizing (with an aromatic hydrocarbon) mixtures of aliphatic unsaturated hydrocarbons having about 5, 9 or 10 carbon atoms, said mixtures being issued from the cracking of naphta.
  • the tackifying resin(s) (i) are in admixture with up to 50% (based on the total weight of said admixture) of one or more tackifying resin(s) selected in the group consisting of:
  • Each of the tackifying resins (ii), (iii) and (iv) optionally included in admixture with resin (i) in the present HMPSA composition also possesses—like resin (i)—a softening temperature comprised between 70 and 150° C.
  • said admixture comprises about 50% of resin (i) and about 50% of resin (ii), (iii) or (iv).
  • tackifying resin (ii) With respect to tackifying resin (ii), one may cite as examples of natural rosin: gum rosin harvested from a living tree, wood rosin harvested from the roots of the trees, tall oil rosin harvested from the by-product of the paper industry.
  • Chemically modified rosin include rosin modified by such processes as hydrogenation, dehydrogenation, dimerization, polymerization or esterification by alcohols including polyols such as penta-erythritol.
  • terpenic resins generally result from the polymerization of terpenic hydrocarbons such as for example mono-terpene (or pinene) in the presence of a Friedel-Crafts catalyst.
  • tackifying resin iv
  • styrene/terpene alpha-methyl styrene/terpene and vinyl toluene/terpene copolymers.
  • the tackifying resins (i), (ii), (iii) and (iv) have an average weigh molecular weight M w which is generally comprised between 300 and 5000 Da. They are commercially available and one may refer for example among the above families to the following products:
  • Wingtack® 86 from the company Cray Valley which is an aromatically modified C5 hydrocarbon resin with a softening temperature of 86° C. and a M w of about 1670 Da
  • Escorez® 5600 from the company Exxon Chemicals which is a hydrogenated dicyclopentadiene modified by an aromatic compound, having a softening temperature of 100° C. and a M w of about 980 Da
  • Escorez® 5690 from the same company which is a hydrogenated dicyclopentadiene modified by an aromatic compound, having a softening temperature of 90° C. and a M w of 800 Da;
  • Sylvarez® TP 95 from the same company which is a terpene phenolic resin with a softening temperature of 95° C. and a M w of about 1120 Da;
  • Sylvarezs® ZT 105LT from the same company which is a styrene/terpene copolymer with a softening temperature of 105° C.
  • the softening temperature of the resin is determined by the standardized ASTM E 28 test using the Ring-and-Ball apparatus, whose principle is the following.
  • a brass ring with a diameter of about 2 cm is filled with the resin to be tested, in the molten state. After cooling down at room temperature, the ring and the resin in the solid state are arranged according to a horizontal position within a glycerin bath whose temperature can be raised uniformly at a rate of 5° C. per minute.
  • a steel ball of about 9.5 mm in diameter is centered on the disk of solid resin. The softening point is the temperature at which the disk of resin is forced downward a distance of 25.4 mm under the weight of the ball.
  • the preferred tackifying resins have a softening temperature comprised between 80 and 140° C., and more preferably between 85 and 110° C.
  • the hydrocarbon oil which may be used as component c) in the composition according to the invention has an aromatic content which is less than 15%, preferably less than 7%.
  • the aromatic content of the oil is the percentage in weight of aromatic carbons divided by the sum of weights of paraffinic, aromatic and naphthenic carbons.
  • the quantity of aromatic, paraffinic and naphthenic carbons are determined by standard measurements known to one skilled in the art and based on Infra Red spectroscopy.
  • an oil with substantially equal naphthenic and paraffinic content is used.
  • Such hydrocarbon oils are commercially available.
  • Nyplast® 222B available from Nynas which has 5% aromatic carbon, 47% paraffinic carbon, 48% naphthenic carbon.
  • Calcium carbonate which may be used as the filler d) of the HMPSA composition according to the invention is preferably implemented as a powder of fine particles of an average size less than 10 ⁇ m, more preferably less than 5 ⁇ m, and even more preferably of about 2 ⁇ m.
  • the filler is a homopolymer or copolymer of polyethylene with an average number molecular weight comprised between 1 and 5 kDa.
  • Such products are available commercially, for instance AC8® from Honeywell is a homopolymer of polyethylene having an average number molecular weight of 2800 Da and a polydispersity index of 1.69, AC400 from the same company is a copolymer of polyethylene and vinyl acetate having an average number molecular weight between 1 and 3 kDa.
  • the HMPSA composition according to the invention comprises:
  • a quantity of 0.5 to 2% of one or more stabilizer or antioxidant is preferably included in the HMPSA composition of the invention.
  • These compounds are added to protect the adhesive from degradation caused by reaction with oxygen likely to be induced from heat, light or residual catalyst from the raw materials such as the tackifying resin.
  • These compounds may include primary antioxidants which act as radical scavengers and are generally hindered phenols such as Irganox® 1010 from CIBA.
  • the primary antioxidants may be used alone or in combination with other antioxidants such as phosphites such as Irgafos® 168 from CIBA or sulfites such as Irganox® PS800 from the same company.
  • HMPSA composition Other components like dyes, pigments or coloring agents may also be incorporated in the HMPSA composition.
  • the viscosity of the HMPSA composition according to the invention is preferably comprised between 4000 and 50 000 mPa.s at 163° C., and more preferably between 8000 and 30 000 mPa.s at 163° C.
  • the HMPSA composition of the present invention may be prepared by a simple mixture of its components in a batch or semi-batch mixer at a temperature comprised between 130 and 200° C.
  • the mixing techniques are well known from one skilled in the art.
  • a laminated system comprising:
  • the paper used as a facestock has generally a grammage comprised between 60 and 100 g/m 2 and is often a high gloss paper or vellum paper, preferably white.
  • the release liner protects the adhesive layer prior to application to a substrate and may be for instance a siliconized Kraft paper liner.
  • the HMPSA composition is coated on or otherwise applied to the paper facestock or, more preferably, coated on the release liner and then laminated to the paper facestock. Coating is achieved by techniques well known to one skilled in the art such as roll coating, slot die coating or curtain coating at temperatures from about 120 to 175° C.
  • the coating weight of the HMPSA may be comprised between 15 and 30 g/m 2 .
  • a self-adhesive label obtainable by conversion of the laminated system according to the invention.
  • Conversion techniques include slitting, die-cutting and matrix-stripping.
  • the adhesive performance of the HMPSA composition according to the invention is assessed by the Peel 180° test on stainless steel, such as described by the FINAT test method n° 1, published in the Manuel Technique FINAT 6 th edition, 2001.
  • FINAT is the international federation of manufacturers and converters of adhesives and hot-melts on paper and other supports. The principle of this test if as follows. The HMPSA is first of all coated on a 50 ⁇ m thickness PolyEthyleneTerephtalate (PET) film at a weight of 20 g/m 2 . The resulting laminate is cut into a rectangular strip (25 mm ⁇ 175 mm) which is adhered to a substrate consisting of a stainless steel panel. This assembly is allowed to stay 20 minutes at room temperature.
  • PET PolyEthyleneTerephtalate
  • the Peel 180° value on stainless steel for a HMPSA suitable for permanent PSA labels is usually greater than 4 N/cm, preferably greater than 7 N/cm.
  • the tack at room temperature obtained by the HMPSA according to the invention is assessed by the loop tack test described in the FINAT n° 9 method of test also published in the Manuel Technique FINAT 6 th edition, 2001.
  • the HMPSA is first of all coated in order to obtain a rectangular strip (25 mm ⁇ 175 mm) as described here above.
  • the two ends of this strip are joined in a loop (the adhesive layer being outward) and are fixed in the mobile jaw of a traction apparatus able to move up and down at a speed of 300 mm/minute along a vertical axis.
  • the lower part of the loop is first allowed to move down in order to contact a horizontal glass panel of 25 mm width and 30 mm length, the contact zone being a square of about 25 mm ⁇ 25 mm. As soon as the contact occurs, the direction of the displacement is reversed.
  • the loop tack is the value of the force required for the loop to separate completely from the glass panel.
  • the loop tack of a PSA is generally greater than 1.3 N/cm 2 .
  • the tack at +2° C. is assessed by the probe tack test.
  • a stainless steel cylindrical probe with a 5 mm diameter is linked to a load cell equipped with a force sensor. The end of this probe is brought into and out of contact with a layer of the HMPSA coated on a PET film of 50 ⁇ m thickness, while recording the applied displacement and the resulting force.
  • the load cell and the probe are part of a texture analyzer; the layer of HMPSA and the probe are enclosed in a thermal chamber maintained at a temperature of +2° C.
  • the probe tack is the maximum force recorded during debonding of the probe end and is expressed in N/cm 2 .
  • the tendency to paper staining of the HMPSA composition according to the invention is assessed by the following test.
  • the HMPSA is coated at a temperature of about 160° C. on a release liner and then laminated to a paper facestock. Coating is achieved by means of a slot die nozzle.
  • the paper facestock is a 70 g/m 2 white high gloss paper.
  • the coating weight of the adhesive is 20 g/m 2 .
  • the laminated system is cut into 21 ⁇ 29.7 cm sheets which are stored during 7 days at 75° C. under a pressure of 32 kg/m 2 .
  • the discoloration ⁇ E of the paper facestock is calculated by means of a measurement carried out by a colormeter before and after storage of the sheets.
  • this apparatus determines for a light source of reference (of D type, namely D 65 corresponding to a color temperature of 6 504 K) 3 parameters for a specific color: its lightness (L*), its position between magenta and green (a*) and its position between yellow and blue (b*).
  • ⁇ E [( L* 0 ⁇ L* storage ) 2 +( a* 0 ⁇ a* storage ) 2 +( b* 0 ⁇ b* storage ) 2 ] 1/2
  • HMPSA compositions were prepared by simple mixing of the ingredients between 160 and 180° C.
  • compositions contained 0.5% of Irganox® 1010 and 0.5% of Irganox® PS800. The content of the remaining components is detailed in % in the following Table 1.
  • the exemplified HMPSA compositions provide an acceptable discoloration ⁇ E of the paper facestock in severe storage conditions of the laminated system, while showing advantageous properties of tack and adhesion through the Peel 180° test. These properties make these compositions particularly suited for the manufacturing of PSA labels.
  • the labels obtained by coating (at a weight of 20 g/m 2 ) each of these compositions on a 80 g/m 2 paper were first bonded onto glass, then peeled with an angle of 180°. During this peeling step, all the labels exhibited some fiber tears.
  • the exemplified HMPSA are therefore particularly suited for the manufacturing of permanent PSA labels.

Landscapes

  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Organic Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Laminated Bodies (AREA)
  • Adhesive Tapes (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
US11/643,912 2006-12-22 2006-12-22 Hot melt pressure sensitive adhesive for paper labels Abandoned US20080153981A1 (en)

Priority Applications (13)

Application Number Priority Date Filing Date Title
US11/643,912 US20080153981A1 (en) 2006-12-22 2006-12-22 Hot melt pressure sensitive adhesive for paper labels
AT07856736T ATE504637T1 (de) 2006-12-22 2007-12-14 Schmelzhaftkleber für papieretiketten
PL07856736T PL2121865T3 (pl) 2006-12-22 2007-12-14 Wrażliwy na nacisk topliwy klej do papierowych etykiet
PCT/EP2007/010998 WO2008077509A1 (en) 2006-12-22 2007-12-14 Hot melt pressure sensitive adhesives for paper labels
ES07856736T ES2364203T3 (es) 2006-12-22 2007-12-14 Adhesivos termofusibles sensibles a la presión para etiquetas de papel.
EP20070856736 EP2121865B1 (de) 2006-12-22 2007-12-14 Schmelzhaftkleber für papieretiketten
DE200760013809 DE602007013809D1 (de) 2006-12-22 2007-12-14 Schmelzhaftkleber für papieretiketten
MX2009005243A MX2009005243A (es) 2006-12-22 2007-12-14 Adhesivos de fusion en caliente sensibles a la presion para etiquetas de papel.
CN2007800429778A CN101589126B (zh) 2006-12-22 2007-12-14 纸标签用的热熔压敏粘合剂
AU2007338452A AU2007338452B2 (en) 2006-12-22 2007-12-14 Hot melt pressure sensitive adhesives for paper labels
RU2009114362A RU2415171C2 (ru) 2006-12-22 2007-12-14 Термоплавкие чувствительные к давлению адгезивы для бумажных этикеток
US12/345,543 US8263696B2 (en) 2006-12-22 2008-12-29 Hot melt pressure sensitive adhesives for paper labels
ZA200902672A ZA200902672B (en) 2006-12-22 2009-04-17 Hot melt pressure sensitive adhesives for paper lables

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US11/643,912 US20080153981A1 (en) 2006-12-22 2006-12-22 Hot melt pressure sensitive adhesive for paper labels

Related Child Applications (1)

Application Number Title Priority Date Filing Date
US12/345,543 Continuation US8263696B2 (en) 2006-12-22 2008-12-29 Hot melt pressure sensitive adhesives for paper labels

Publications (1)

Publication Number Publication Date
US20080153981A1 true US20080153981A1 (en) 2008-06-26

Family

ID=39226745

Family Applications (2)

Application Number Title Priority Date Filing Date
US11/643,912 Abandoned US20080153981A1 (en) 2006-12-22 2006-12-22 Hot melt pressure sensitive adhesive for paper labels
US12/345,543 Active 2027-06-01 US8263696B2 (en) 2006-12-22 2008-12-29 Hot melt pressure sensitive adhesives for paper labels

Family Applications After (1)

Application Number Title Priority Date Filing Date
US12/345,543 Active 2027-06-01 US8263696B2 (en) 2006-12-22 2008-12-29 Hot melt pressure sensitive adhesives for paper labels

Country Status (12)

Country Link
US (2) US20080153981A1 (de)
EP (1) EP2121865B1 (de)
CN (1) CN101589126B (de)
AT (1) ATE504637T1 (de)
AU (1) AU2007338452B2 (de)
DE (1) DE602007013809D1 (de)
ES (1) ES2364203T3 (de)
MX (1) MX2009005243A (de)
PL (1) PL2121865T3 (de)
RU (1) RU2415171C2 (de)
WO (1) WO2008077509A1 (de)
ZA (1) ZA200902672B (de)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP3144361A1 (de) * 2015-09-18 2017-03-22 Nitto Europe N.V Klebstoffzusammensetzung und klebeband mit geringem kriechverhalten
US9902884B2 (en) 2014-12-17 2018-02-27 H.B. Fuller Company Hot melt adhesive composition for bonding packs of plastic containers
US10351298B2 (en) 2014-12-17 2019-07-16 H.B. Fuller Company Hot melt adhesive composition for bonding packs of metal containers

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6049464B2 (ja) * 2012-03-07 2016-12-21 日東電工株式会社 両面接着テープ
ES2712123T3 (es) * 2013-12-30 2019-05-09 Avery Dennison Corp Películas compostables y etiquetas compostables
CN103773295B (zh) * 2014-02-20 2016-08-31 广东能辉新材料科技有限公司 一种用于pe薄膜背涂压敏胶及其制备方法
RU2626638C2 (ru) * 2015-11-16 2017-07-31 Акционерное Общество "Красноармейский научно-исследовательский институт механизации" Способ приготовления связующего
CN105647446B (zh) * 2016-01-20 2017-09-15 如皋市嘉好热熔胶有限公司 快递单用标签胶及其制备方法
FR3093337B1 (fr) 2019-02-28 2021-01-29 Bostik Sa Hmpsa incorporant un plastifiant en matiere premiere renouvelable
FR3093301B1 (fr) 2019-02-28 2021-10-01 Bostik Sa Articles auto-adhesifs avec hmpsa incorporant un plastifiant en matiere premiere renouvelable
FR3098520B1 (fr) * 2019-07-10 2022-07-22 Bostik Sa HMPSA réticulable sous irradiation UV

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6060550A (en) * 1997-10-23 2000-05-09 Huels Aktiengesellschaft Polyethylene wax as processing aid for hot-melt adhesive compositions
US6214935B1 (en) * 1998-07-15 2001-04-10 Avery Dennison Corporation Intermediate softening point resin-based hot melt PSAs
US20040062923A1 (en) * 1999-01-19 2004-04-01 Upm-Kymmene Corporation Self-adhesive labelstock, a face paper for self -adhesive labelstock, a print carrier and a method for making the face paper and the print carrier for self-adhesive labelstock
US20050234195A1 (en) * 2004-04-14 2005-10-20 St Clair David J Pressure sensitive adhesives from high molecular weight block copolymers having high fraction of diblock copolymer

Family Cites Families (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4132690A (en) * 1976-09-27 1979-01-02 Allied Chemical Corporation Adhesive polyamide resin compositions containing high acid number copolymers
US5000802A (en) * 1989-08-21 1991-03-19 Nippon Kayaku Kabushiki Kaisha Water-in-oil type emulsion explosive
US5163976A (en) * 1991-05-13 1992-11-17 Norton Company Hot melt pressure sensitive adhesives
US5414039A (en) * 1993-02-16 1995-05-09 Petrolite Corporation Repulpable hot melt adhesive for packaging materials containing an ethylene vinyl acetate copolymer having 40-60 weight percent of vinyl acetate units, a tackifier and a high molecular weight oxygen-containing polymer
US5412032A (en) * 1994-02-22 1995-05-02 Shell Oil Company High molecular weight low coupled linear styrene-isoprene-styrene block copolymer composition and adhesives made therefrom
TW438854B (en) * 1996-02-09 2001-06-07 Shell Internattonale Res Mij B Vinyl aromatic blockcopolymers and compositions containing them
MX9704536A (es) * 1996-06-19 1998-04-30 N B Fuller Licensing And Finan Aplicaciones de encuaderancion utilizando poliuretanos fundidos en caliente.
DE69810342T2 (de) 1997-10-23 2003-10-30 H.B. Fuller Licensing & Financing, Inc. Schmelzhaftkleber mit einer minimalen verschmutzung
US6877420B2 (en) * 2003-05-28 2005-04-12 Illinois Tool Works, Inc. Strapping machine with retained program timers for safety interlocks and method
US6776923B2 (en) * 2002-06-07 2004-08-17 Saint-Gobain Performance Plastics Corporation Self-adhering thermal interface material
US6794441B2 (en) * 2002-12-17 2004-09-21 Kraton Polymers U.S. Llc Die cuttable label adhesive formulation
US7081498B2 (en) * 2003-04-10 2006-07-25 Morgan Adhesives Company Pressure-sensitive adhesive compositions and constructions
EP1466953A1 (de) * 2003-04-10 2004-10-13 Morgan Adhesive Company Druckempfindliche Klebstoffzusammensetzungen und Klebekonstruktionen
US20060229411A1 (en) * 2005-04-06 2006-10-12 Stephen Hatfield Hot melt pressure sensitive adhesives based on blends of styrene/butadiene copolymers
PL1899430T3 (pl) * 2005-04-20 2014-10-31 Avery Dennison Corp Odporna na pełzanie taśma klejąca

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6060550A (en) * 1997-10-23 2000-05-09 Huels Aktiengesellschaft Polyethylene wax as processing aid for hot-melt adhesive compositions
US6214935B1 (en) * 1998-07-15 2001-04-10 Avery Dennison Corporation Intermediate softening point resin-based hot melt PSAs
US20040062923A1 (en) * 1999-01-19 2004-04-01 Upm-Kymmene Corporation Self-adhesive labelstock, a face paper for self -adhesive labelstock, a print carrier and a method for making the face paper and the print carrier for self-adhesive labelstock
US20050234195A1 (en) * 2004-04-14 2005-10-20 St Clair David J Pressure sensitive adhesives from high molecular weight block copolymers having high fraction of diblock copolymer

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9902884B2 (en) 2014-12-17 2018-02-27 H.B. Fuller Company Hot melt adhesive composition for bonding packs of plastic containers
US10351298B2 (en) 2014-12-17 2019-07-16 H.B. Fuller Company Hot melt adhesive composition for bonding packs of metal containers
EP3144361A1 (de) * 2015-09-18 2017-03-22 Nitto Europe N.V Klebstoffzusammensetzung und klebeband mit geringem kriechverhalten
WO2017045765A1 (en) 2015-09-18 2017-03-23 Nitto Europe N.V. Adhesive composition and adhesive tape with low creep

Also Published As

Publication number Publication date
AU2007338452A1 (en) 2008-07-03
CN101589126B (zh) 2013-04-03
DE602007013809D1 (de) 2011-05-19
US8263696B2 (en) 2012-09-11
MX2009005243A (es) 2009-05-28
ZA200902672B (en) 2010-04-28
ATE504637T1 (de) 2011-04-15
PL2121865T3 (pl) 2011-09-30
EP2121865B1 (de) 2011-04-06
US20090220807A1 (en) 2009-09-03
CN101589126A (zh) 2009-11-25
AU2007338452B2 (en) 2011-01-27
RU2009114362A (ru) 2010-10-20
WO2008077509A1 (en) 2008-07-03
EP2121865A1 (de) 2009-11-25
RU2415171C2 (ru) 2011-03-27
ES2364203T3 (es) 2011-08-26

Similar Documents

Publication Publication Date Title
US8263696B2 (en) Hot melt pressure sensitive adhesives for paper labels
US8703263B2 (en) Adhesive composition for self-adhesive label and item including the same
KR101331701B1 (ko) 스티렌 부타디엔 블록 공중합체를 함유하는 핫 멜트 접착제
EP2764067B1 (de) Vaseline enthaltender heissschmelzkleber für flaschenetikette
US20100193127A1 (en) Hmpsa for removable self-adhesive label
US20110281045A1 (en) HMPSA for debondable self-adhesive label
US7442739B1 (en) Hot melt pressure sensitive adhesives
US20050176887A1 (en) Pressure sensitive adhesive and compositions prepared with same
WO2000056796A1 (en) Adhesive compositions containing multiblock polyisoprene-polystyrene copolymers and articles including same
US12077692B2 (en) HMPSA incorporating a plasticiser made from a renewable raw material
JP7460647B2 (ja) 再生可能な原材料から作製された可塑剤を組み込んだhmpsa
EP4293090A1 (de) Druckempfindlicher heissschmelzkleber
EP4368682A1 (de) Druckempfindliche schmelzhaftkleberzusammensetzung
US20240093071A1 (en) A hot melt pressure sensitive adhesive composition
AU2012318417B9 (en) Petrolatum containing hot melt bottle labeling adhesive
WO1997039076A1 (en) Styrene-isoprene-styrene tri block copolymers with adapted diblock copolymers

Legal Events

Date Code Title Description
AS Assignment

Owner name: BOSTIK S.A., FRANCE

Free format text: ASSIGNMENT OF ASSIGNORS INTEREST;ASSIGNORS:GOUBARD, DAVID;HAEGER, JOHN;REEL/FRAME:019256/0356

Effective date: 20070330

STCB Information on status: application discontinuation

Free format text: ABANDONED -- FAILURE TO RESPOND TO AN OFFICE ACTION