US20070240855A1 - Heat pipe with composite capillary wick structure - Google Patents
Heat pipe with composite capillary wick structure Download PDFInfo
- Publication number
- US20070240855A1 US20070240855A1 US11/309,255 US30925506A US2007240855A1 US 20070240855 A1 US20070240855 A1 US 20070240855A1 US 30925506 A US30925506 A US 30925506A US 2007240855 A1 US2007240855 A1 US 2007240855A1
- Authority
- US
- United States
- Prior art keywords
- wick
- heat pipe
- type
- section
- evaporating section
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Abandoned
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Classifications
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
- F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
- F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
- F28D15/04—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with tubes having a capillary structure
- F28D15/046—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with tubes having a capillary structure characterised by the material or the construction of the capillary structure
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
- F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
- F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
- F28D15/0233—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes the conduits having a particular shape, e.g. non-circular cross-section, annular
Definitions
- heat pipes can transfer heat rapidly and therefore are widely used in various fields for heat dissipation purposes.
- heat pipes are commonly applied to transfer heat from heat-generating electronic components, such as central processing units (CPUs), to heat dissipating devices, such as heat sinks, to thereby remove the heat away.
- a conventional heat pipe generally includes a sealed casing made of thermally conductive material and a working fluid contained in the casing. The working fluid is employed to carry heat from one end of the casing, typically called an “evaporating section”, to the other end of the casing, typically called a “condensing section”.
- a capillary wick is generally provided in an inner surface of the casing in order to achieve the return of the liquid.
- the liquid is drawn back to the evaporating section by a capillary force developed by the capillary wick.
- the capillary wick may be a plurality of fine grooves defined in its lengthwise direction of the casing, a fine-mesh wick, or a layer of sintered metal or ceramic powders.
- the capillary force derived from each type of these wicks is generally different, and meanwhile, the flow resistance provided by each type of wick may also be different.
- the general rule is that as average capillary pore size grows larger, capillary force grows smaller and provides a lower flow resistance.
- the heat pipe includes a metal casing having an evaporating section and a condensing section.
- a composite wick structure is provided in the evaporating section.
- the composite wick structure comprises at least two wick layers in a radial direction of the heat pipe, one of the at least two wick layers is a plurality of fine grooves defined in an inner surface of the evaporating section.
- a singular wick structure is provided in the condensing section.
- An average capillary pore size of the evaporating section is smaller than that of the condensing section.
- the singular wick provides a low flow resistance in the condensing section so that the liquid condensed in the condensing section can flow more easily through the condensing section to reach the evaporating section. Meanwhile, the composite wick structure develops a large capillary force to draw the liquid from the condensing section to the evaporating section. Thus, the condensed liquid is brought back from the condensing section to the evaporating section in an accelerated manner, thereby increasing the total heat transfer capacity of the heat pipe.
- FIG. 1 is a longitudinal sectional view of a heat pipe in accordance with first embodiment of the present invention
- FIG. 4 is a longitudinal sectional view of a related heat pipe.
- FIGS. 1 and 2 show a heat pipe in accordance with one embodiment of the present invention.
- the heat pipe includes a metal casing 100 made of highly thermally conductive materials such as copper or copper alloys, a working fluid (not shown) contained in the casing 100 and a composite capillary wick (not labeled) arranged in an inner surface of the casing 100 .
- the casing 100 includes an evaporating section 400 at one end, a condensing section 600 at the other end and an adiabatic section 500 arranged between the evaporating section 400 and the condensing section 600 .
- the working fluid functions as a heat carrier for transferring heat from the evaporating section 400 to the condensing section 600 .
- the working fluid contained in the evaporating section 400 absorbs heat from a heat source and evaporates, and then carries the heat to the condensing section 600 in the form of vapor. Then, the vapor releases its heat to ambient environment and is condensed back to a liquid state. The condensed liquid is then brought back to the evaporating section 400 via the composite capillary wick.
- the grooves 200 can also be defined not in the adiabatic and condensing sections but in another type of wick directly arranged at the adiabatic and condensing sections 500 , 600 .
- the average pore sizes of the evaporating, adiabatic and condensing sections 400 , 500 , 600 gradually increase.
- the grooves 200 are filled with the sintered powders 210 , and the mesh-type wick 220 is attached to the sintered-type wick 210 such that along a radial direction of the evaporating section 400 , from the groove-type wick 200 to the mesh-type wick 220 which means from the outer layer to the inner layer of the composite capillary wick, the pore sizes of the composite capillary wick are gradually increased.
- the pore size of the groove-type wick 200 at the evaporating section 400 is much smaller than that at the adiabatic and condensing sections 500 , 600 , since the grooves 200 at the evaporating section 400 are filled with the sintered powders 210 .
- the groove-type wick 200 at the adiabatic and condensing sections 500 , 600 has a relatively large average capillary pore size and therefore provides a relatively low flow resistance to the condensed liquid to flow therethrough to the evaporating section 400 .
- the sintered powders 210 filled in the grooves 200 of the evaporating section 400 have a relatively small average capillary pore size and accordingly develops a relatively large capillary force.
- the groove-type wick 200 reduces the flow resistance the condensed liquid encounters when flowing through the condensing and adiabatic sections 600 , 500 , and, as the sintered-type wick 210 has a large capillary force it can therefore rapidly drawn the condensed liquid back to the evaporating section 400 from the adiabatic and condensing sections 500 , 600 .
- the mesh-type wick 220 is attached on the sintered-type wick 210 , which accelerates evaporation of the vapor to separate the vapor into more micro-vapor.
- the cycling of the working fluid is accelerated and therefore the total heat transfer capacity of the heat pipe is enhanced.
- FIG. 3 illustrates an evaporating section of a heat pipe according to a second embodiment of the present invention.
- the composite capillary wick of the evaporating section in series comprises a groove-type wick 200 , a mesh-type wick 220 and a sintered-type wick 210 .
Landscapes
- Engineering & Computer Science (AREA)
- Life Sciences & Earth Sciences (AREA)
- Sustainable Development (AREA)
- Physics & Mathematics (AREA)
- Thermal Sciences (AREA)
- Mechanical Engineering (AREA)
- General Engineering & Computer Science (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN200610060288.7 | 2006-04-14 | ||
CNB2006100602887A CN100561108C (zh) | 2006-04-14 | 2006-04-14 | 热管 |
Publications (1)
Publication Number | Publication Date |
---|---|
US20070240855A1 true US20070240855A1 (en) | 2007-10-18 |
Family
ID=38603730
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
US11/309,255 Abandoned US20070240855A1 (en) | 2006-04-14 | 2006-07-20 | Heat pipe with composite capillary wick structure |
Country Status (2)
Country | Link |
---|---|
US (1) | US20070240855A1 (zh) |
CN (1) | CN100561108C (zh) |
Cited By (31)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20070240858A1 (en) * | 2006-04-14 | 2007-10-18 | Foxconn Technology Co., Ltd. | Heat pipe with composite capillary wick structure |
US20090025910A1 (en) * | 2007-07-27 | 2009-01-29 | Paul Hoffman | Vapor chamber structure with improved wick and method for manufacturing the same |
US20100263835A1 (en) * | 2009-04-17 | 2010-10-21 | Young Green Energy Co. | Heat pipe |
US20100294475A1 (en) * | 2009-05-22 | 2010-11-25 | General Electric Company | High performance heat transfer device, methods of manufacture thereof and articles comprising the same |
US20100294467A1 (en) * | 2009-05-22 | 2010-11-25 | General Electric Company | High performance heat transfer device, methods of manufacture thereof and articles comprising the same |
US20110174464A1 (en) * | 2010-01-15 | 2011-07-21 | Furui Precise Component (Kunshan) Co., Ltd. | Flat heat pipe and method for manufacturing the same |
US20110259555A1 (en) * | 2010-04-26 | 2011-10-27 | Asia Vital Components Co., Ltd. | Micro vapor chamber |
US20120000530A1 (en) * | 2010-07-02 | 2012-01-05 | Miles Mark W | Device for harnessing solar energy with integrated heat transfer core, regenerator, and condenser |
US20120227934A1 (en) * | 2011-03-11 | 2012-09-13 | Kunshan Jue-Chung Electronics Co. | Heat pipe having a composite wick structure and method for making the same |
EP2527776A1 (en) * | 2011-05-24 | 2012-11-28 | Thermal Corp. | Capillary device for use in heat pipe and method of manufacturing such capillary device |
US20120325440A1 (en) * | 2011-06-27 | 2012-12-27 | Toshiba Home Technology Corporation | Cooling device |
US20130014919A1 (en) * | 2011-07-15 | 2013-01-17 | Foxconn Technology Co., Ltd. | Heat pipe |
US20140174701A1 (en) * | 2012-12-21 | 2014-06-26 | Elwha Llc | Heat Pipe |
WO2014148137A1 (ja) * | 2013-03-18 | 2014-09-25 | 国立大学法人横浜国立大学 | 冷却器及びそれを用いた冷却装置、並びに、発熱体の冷却方法 |
RU2568105C2 (ru) * | 2014-02-28 | 2015-11-10 | Виктор Викторович Сысун | Мощная светодиодная лампа с охлаждением |
US20170328647A1 (en) * | 2016-05-12 | 2017-11-16 | The Boeing Company | Composite heat pipes and sandwich panels, radiator panels, and spacecraft with composite heat pipes |
WO2017189156A3 (en) * | 2016-04-29 | 2018-07-26 | Intel Corporation | Wickless capillary driven constrained vapor bubble heat pipes for application in heat sinks |
US20180292145A1 (en) * | 2017-04-11 | 2018-10-11 | Cooler Master Co., Ltd. | Communication-type thermal conduction device |
US20180372419A1 (en) * | 2017-04-11 | 2018-12-27 | Cooler Master Co., Ltd. | Heat transfer device |
US10358945B2 (en) | 2012-12-21 | 2019-07-23 | Elwha Llc | Heat engine system |
US10463077B2 (en) | 2016-06-24 | 2019-11-05 | Altria Client Services Llc | Cartridge for e-vaping device with open-microchannels |
GB2587213A (en) * | 2019-09-18 | 2021-03-24 | Bae Systems Plc | Cooling device for cooling electronic components |
US10996001B2 (en) * | 2019-04-17 | 2021-05-04 | Furukawa Electric Co., Ltd. | Heatsink |
US11131511B2 (en) | 2018-05-29 | 2021-09-28 | Cooler Master Co., Ltd. | Heat dissipation plate and method for manufacturing the same |
JP6980081B1 (ja) * | 2020-11-13 | 2021-12-15 | 古河電気工業株式会社 | ヒートパイプ |
US20220082333A1 (en) * | 2020-09-15 | 2022-03-17 | Vast Glory Electronics & Hardware & Plastic(Hui Zhou) Ltd. | Heat pipe |
US11454454B2 (en) | 2012-03-12 | 2022-09-27 | Cooler Master Co., Ltd. | Flat heat pipe structure |
US20220341680A1 (en) * | 2021-04-27 | 2022-10-27 | Asia Vital Components (China) Co., Ltd. | Heat pipe structure |
EP4092371A1 (fr) * | 2021-05-20 | 2022-11-23 | Euro Heat Pipes | Caloduc à performance améliorée sous diverses répartitions de charges thermiques |
WO2023089858A1 (ja) * | 2021-11-17 | 2023-05-25 | 株式会社フジクラ | ヒートパイプ、およびヒートパイプの製造方法 |
US11913725B2 (en) | 2018-12-21 | 2024-02-27 | Cooler Master Co., Ltd. | Heat dissipation device having irregular shape |
Families Citing this family (12)
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CN102231369B (zh) * | 2010-12-18 | 2013-11-27 | 中山伟强科技有限公司 | 一种大功率散热模组 |
KR101031650B1 (ko) * | 2010-11-15 | 2011-04-29 | 새빛테크 주식회사 | Led 조명기구용 냉각장치 및 이를 이용한 led 조명기구 |
CN103060592A (zh) * | 2013-01-11 | 2013-04-24 | 上海交通大学 | 渐变形貌特征的通孔金属泡沫及其制备方法和换热装置 |
CN103925819A (zh) * | 2013-02-17 | 2014-07-16 | 上海交通大学 | 具有渐变形貌特征的通孔金属泡沫热管换热装置 |
CN103900412B (zh) * | 2013-02-17 | 2016-01-20 | 上海交通大学 | 具有渐变形貌特征的通孔金属泡沫热管换热装置 |
CN103629960A (zh) * | 2013-11-28 | 2014-03-12 | 华南理工大学 | 一种具有粗化结构的脉动热管 |
CN109945708A (zh) * | 2019-05-06 | 2019-06-28 | 广东工业大学 | 一种气液分离的强化热管 |
CN113532170A (zh) * | 2020-04-15 | 2021-10-22 | 华为技术有限公司 | 一种两相相变散热器件及终端设备 |
CN114518792A (zh) * | 2020-11-19 | 2022-05-20 | 英业达科技有限公司 | 散热装置 |
CN112556468A (zh) * | 2020-11-20 | 2021-03-26 | 广州大学 | 一种单向传热管及其加工方法 |
CN113784584B (zh) * | 2021-08-19 | 2023-03-24 | 联想(北京)有限公司 | 一种散热件和电子设备 |
CN116625148B (zh) * | 2023-05-18 | 2023-11-28 | 广州麦伦电子科技有限公司 | 一种抗重力热管及其制造方法 |
Citations (15)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3576210A (en) * | 1969-12-15 | 1971-04-27 | Donald S Trent | Heat pipe |
US4116266A (en) * | 1974-08-02 | 1978-09-26 | Agency Of Industrial Science & Technology | Apparatus for heat transfer |
US4170262A (en) * | 1975-05-27 | 1979-10-09 | Trw Inc. | Graded pore size heat pipe wick |
US4489777A (en) * | 1982-01-21 | 1984-12-25 | Del Bagno Anthony C | Heat pipe having multiple integral wick structures |
US4674565A (en) * | 1985-07-03 | 1987-06-23 | The United States Of America As Represented By The Secretary Of The Air Force | Heat pipe wick |
US5076352A (en) * | 1991-02-08 | 1991-12-31 | Thermacore, Inc. | High permeability heat pipe wick structure |
US6227287B1 (en) * | 1998-05-25 | 2001-05-08 | Denso Corporation | Cooling apparatus by boiling and cooling refrigerant |
US6460612B1 (en) * | 2002-02-12 | 2002-10-08 | Motorola, Inc. | Heat transfer device with a self adjusting wick and method of manufacturing same |
US6868898B2 (en) * | 2003-03-26 | 2005-03-22 | Intel Corporation | Heat pipe having an inner retaining wall for wicking components |
US20050077030A1 (en) * | 2003-10-08 | 2005-04-14 | Shwin-Chung Wong | Transport line with grooved microchannels for two-phase heat dissipation on devices |
US6997243B2 (en) * | 2004-04-23 | 2006-02-14 | Hul-Chun Hsu | Wick structure of heat pipe |
US6997244B2 (en) * | 2004-07-16 | 2006-02-14 | Hsu Hul-Chun | Wick structure of heat pipe |
US20060169439A1 (en) * | 2005-01-28 | 2006-08-03 | Chu-Wan Hong | Heat pipe with wick structure of screen mesh |
US7134485B2 (en) * | 2004-07-16 | 2006-11-14 | Hsu Hul-Chun | Wick structure of heat pipe |
US20060283574A1 (en) * | 2005-06-15 | 2006-12-21 | Top Way Thermal Management Co., Ltd. | Thermoduct |
-
2006
- 2006-04-14 CN CNB2006100602887A patent/CN100561108C/zh not_active Expired - Fee Related
- 2006-07-20 US US11/309,255 patent/US20070240855A1/en not_active Abandoned
Patent Citations (16)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3576210A (en) * | 1969-12-15 | 1971-04-27 | Donald S Trent | Heat pipe |
US4116266A (en) * | 1974-08-02 | 1978-09-26 | Agency Of Industrial Science & Technology | Apparatus for heat transfer |
US4170262A (en) * | 1975-05-27 | 1979-10-09 | Trw Inc. | Graded pore size heat pipe wick |
US4489777A (en) * | 1982-01-21 | 1984-12-25 | Del Bagno Anthony C | Heat pipe having multiple integral wick structures |
US4674565A (en) * | 1985-07-03 | 1987-06-23 | The United States Of America As Represented By The Secretary Of The Air Force | Heat pipe wick |
US5076352A (en) * | 1991-02-08 | 1991-12-31 | Thermacore, Inc. | High permeability heat pipe wick structure |
US6227287B1 (en) * | 1998-05-25 | 2001-05-08 | Denso Corporation | Cooling apparatus by boiling and cooling refrigerant |
US6460612B1 (en) * | 2002-02-12 | 2002-10-08 | Motorola, Inc. | Heat transfer device with a self adjusting wick and method of manufacturing same |
US6868898B2 (en) * | 2003-03-26 | 2005-03-22 | Intel Corporation | Heat pipe having an inner retaining wall for wicking components |
US20050077030A1 (en) * | 2003-10-08 | 2005-04-14 | Shwin-Chung Wong | Transport line with grooved microchannels for two-phase heat dissipation on devices |
US6997243B2 (en) * | 2004-04-23 | 2006-02-14 | Hul-Chun Hsu | Wick structure of heat pipe |
US6997244B2 (en) * | 2004-07-16 | 2006-02-14 | Hsu Hul-Chun | Wick structure of heat pipe |
US7134485B2 (en) * | 2004-07-16 | 2006-11-14 | Hsu Hul-Chun | Wick structure of heat pipe |
US20060169439A1 (en) * | 2005-01-28 | 2006-08-03 | Chu-Wan Hong | Heat pipe with wick structure of screen mesh |
US20060283574A1 (en) * | 2005-06-15 | 2006-12-21 | Top Way Thermal Management Co., Ltd. | Thermoduct |
US7293601B2 (en) * | 2005-06-15 | 2007-11-13 | Top Way Thermal Management Co., Ltd. | Thermoduct |
Cited By (50)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20070240858A1 (en) * | 2006-04-14 | 2007-10-18 | Foxconn Technology Co., Ltd. | Heat pipe with composite capillary wick structure |
US20090025910A1 (en) * | 2007-07-27 | 2009-01-29 | Paul Hoffman | Vapor chamber structure with improved wick and method for manufacturing the same |
US20100263835A1 (en) * | 2009-04-17 | 2010-10-21 | Young Green Energy Co. | Heat pipe |
US20100294475A1 (en) * | 2009-05-22 | 2010-11-25 | General Electric Company | High performance heat transfer device, methods of manufacture thereof and articles comprising the same |
US20100294467A1 (en) * | 2009-05-22 | 2010-11-25 | General Electric Company | High performance heat transfer device, methods of manufacture thereof and articles comprising the same |
US20110174464A1 (en) * | 2010-01-15 | 2011-07-21 | Furui Precise Component (Kunshan) Co., Ltd. | Flat heat pipe and method for manufacturing the same |
US20110259555A1 (en) * | 2010-04-26 | 2011-10-27 | Asia Vital Components Co., Ltd. | Micro vapor chamber |
US10502496B2 (en) * | 2010-04-26 | 2019-12-10 | Asia Vital Components (China) Co., Ltd. | Micro vapor chamber |
US20120000530A1 (en) * | 2010-07-02 | 2012-01-05 | Miles Mark W | Device for harnessing solar energy with integrated heat transfer core, regenerator, and condenser |
US20120227934A1 (en) * | 2011-03-11 | 2012-09-13 | Kunshan Jue-Chung Electronics Co. | Heat pipe having a composite wick structure and method for making the same |
WO2012160128A1 (en) * | 2011-05-24 | 2012-11-29 | Thermal Corp. | Capillary device for use in heat pipe and method of manufacturing such capillary device |
US11168944B2 (en) | 2011-05-24 | 2021-11-09 | Aavid Thermal Corp. | Capillary device for use in heat pipe and method of manufacturing such capillary device |
EP2527776A1 (en) * | 2011-05-24 | 2012-11-28 | Thermal Corp. | Capillary device for use in heat pipe and method of manufacturing such capillary device |
US20120325440A1 (en) * | 2011-06-27 | 2012-12-27 | Toshiba Home Technology Corporation | Cooling device |
US20130014919A1 (en) * | 2011-07-15 | 2013-01-17 | Foxconn Technology Co., Ltd. | Heat pipe |
US11454454B2 (en) | 2012-03-12 | 2022-09-27 | Cooler Master Co., Ltd. | Flat heat pipe structure |
US20140174701A1 (en) * | 2012-12-21 | 2014-06-26 | Elwha Llc | Heat Pipe |
US9752832B2 (en) * | 2012-12-21 | 2017-09-05 | Elwha Llc | Heat pipe |
US10358945B2 (en) | 2012-12-21 | 2019-07-23 | Elwha Llc | Heat engine system |
WO2014148137A1 (ja) * | 2013-03-18 | 2014-09-25 | 国立大学法人横浜国立大学 | 冷却器及びそれを用いた冷却装置、並びに、発熱体の冷却方法 |
JP2014206365A (ja) * | 2013-03-18 | 2014-10-30 | 国立大学法人横浜国立大学 | 冷却器及びそれを用いた冷却装置、並びに、発熱体の冷却方法 |
RU2568105C2 (ru) * | 2014-02-28 | 2015-11-10 | Виктор Викторович Сысун | Мощная светодиодная лампа с охлаждением |
US10219409B2 (en) | 2016-04-29 | 2019-02-26 | Intel Corporation | Wickless capillary driven constrained vapor bubble heat pipes for application in display devices |
US10917994B2 (en) | 2016-04-29 | 2021-02-09 | Intel Corporation | Wickless capillary driven constrained vapor bubble heat pipes for application in rack servers |
US11324139B2 (en) | 2016-04-29 | 2022-05-03 | Intel Corporation | Wickless capillary driven constrained vapor bubble heat pipes |
WO2017189156A3 (en) * | 2016-04-29 | 2018-07-26 | Intel Corporation | Wickless capillary driven constrained vapor bubble heat pipes for application in heat sinks |
US10694641B2 (en) | 2016-04-29 | 2020-06-23 | Intel Corporation | Wickless capillary driven constrained vapor bubble heat pipes for application in electronic devices with various system platforms |
US20170328647A1 (en) * | 2016-05-12 | 2017-11-16 | The Boeing Company | Composite heat pipes and sandwich panels, radiator panels, and spacecraft with composite heat pipes |
US10018426B2 (en) * | 2016-05-12 | 2018-07-10 | The Boeing Company | Composite heat pipes and sandwich panels, radiator panels, and spacecraft with composite heat pipes |
US11471624B2 (en) | 2016-06-24 | 2022-10-18 | Altria Client Services Llc | Cartridge for e-vaping device with open-microchannels |
US10463077B2 (en) | 2016-06-24 | 2019-11-05 | Altria Client Services Llc | Cartridge for e-vaping device with open-microchannels |
US11951250B2 (en) | 2016-06-24 | 2024-04-09 | Altria Client Services Llc | Cartridge for e-vaping device with open-microchannels |
US20180292145A1 (en) * | 2017-04-11 | 2018-10-11 | Cooler Master Co., Ltd. | Communication-type thermal conduction device |
US11320211B2 (en) * | 2017-04-11 | 2022-05-03 | Cooler Master Co., Ltd. | Heat transfer device |
US10345049B2 (en) * | 2017-04-11 | 2019-07-09 | Cooler Master Co., Ltd. | Communication-type thermal conduction device |
US20180372419A1 (en) * | 2017-04-11 | 2018-12-27 | Cooler Master Co., Ltd. | Heat transfer device |
US11680752B2 (en) | 2018-05-29 | 2023-06-20 | Cooler Master Co., Ltd. | Heat dissipation plate and method for manufacturing the same |
US11131511B2 (en) | 2018-05-29 | 2021-09-28 | Cooler Master Co., Ltd. | Heat dissipation plate and method for manufacturing the same |
US11448470B2 (en) | 2018-05-29 | 2022-09-20 | Cooler Master Co., Ltd. | Heat dissipation plate and method for manufacturing the same |
US11913725B2 (en) | 2018-12-21 | 2024-02-27 | Cooler Master Co., Ltd. | Heat dissipation device having irregular shape |
US10996001B2 (en) * | 2019-04-17 | 2021-05-04 | Furukawa Electric Co., Ltd. | Heatsink |
GB2587213A (en) * | 2019-09-18 | 2021-03-24 | Bae Systems Plc | Cooling device for cooling electronic components |
US20220082333A1 (en) * | 2020-09-15 | 2022-03-17 | Vast Glory Electronics & Hardware & Plastic(Hui Zhou) Ltd. | Heat pipe |
JP2022078819A (ja) * | 2020-11-13 | 2022-05-25 | 古河電気工業株式会社 | ヒートパイプ |
JP6980081B1 (ja) * | 2020-11-13 | 2021-12-15 | 古河電気工業株式会社 | ヒートパイプ |
US20220341680A1 (en) * | 2021-04-27 | 2022-10-27 | Asia Vital Components (China) Co., Ltd. | Heat pipe structure |
EP4092371A1 (fr) * | 2021-05-20 | 2022-11-23 | Euro Heat Pipes | Caloduc à performance améliorée sous diverses répartitions de charges thermiques |
US20220373265A1 (en) * | 2021-05-20 | 2022-11-24 | Euro Heat Pipes | Heat pipe with improved performance under diverse thermal load distributions |
FR3123114A1 (fr) * | 2021-05-20 | 2022-11-25 | Euro Heat Pipes | Caloduc à performance améliorée sous diverses répartitions de charges thermiques |
WO2023089858A1 (ja) * | 2021-11-17 | 2023-05-25 | 株式会社フジクラ | ヒートパイプ、およびヒートパイプの製造方法 |
Also Published As
Publication number | Publication date |
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CN101055153A (zh) | 2007-10-17 |
CN100561108C (zh) | 2009-11-18 |
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