US20070228936A1 - Organic light emitting display - Google Patents
Organic light emitting display Download PDFInfo
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- US20070228936A1 US20070228936A1 US11/730,103 US73010307A US2007228936A1 US 20070228936 A1 US20070228936 A1 US 20070228936A1 US 73010307 A US73010307 A US 73010307A US 2007228936 A1 US2007228936 A1 US 2007228936A1
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- emission region
- barrier rib
- light emitting
- organic light
- emitting display
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- 230000004888 barrier function Effects 0.000 claims abstract description 74
- 239000000758 substrate Substances 0.000 claims abstract description 30
- 238000000059 patterning Methods 0.000 claims abstract description 3
- 239000000565 sealant Substances 0.000 claims description 19
- 230000007423 decrease Effects 0.000 claims description 4
- 238000007789 sealing Methods 0.000 claims 2
- 239000011368 organic material Substances 0.000 claims 1
- 238000005538 encapsulation Methods 0.000 description 4
- 230000008901 benefit Effects 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 238000005488 sandblasting Methods 0.000 description 2
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 1
- 238000010276 construction Methods 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- AMGQUBHHOARCQH-UHFFFAOYSA-N indium;oxotin Chemical compound [In].[Sn]=O AMGQUBHHOARCQH-UHFFFAOYSA-N 0.000 description 1
- 238000001459 lithography Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 229910052760 oxygen Inorganic materials 0.000 description 1
- 239000001301 oxygen Substances 0.000 description 1
- 238000000206 photolithography Methods 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K50/00—Organic light-emitting devices
- H10K50/80—Constructional details
- H10K50/84—Passivation; Containers; Encapsulations
- H10K50/842—Containers
- H10K50/8426—Peripheral sealing arrangements, e.g. adhesives, sealants
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/10—OLED displays
- H10K59/17—Passive-matrix OLED displays
- H10K59/173—Passive-matrix OLED displays comprising banks or shadow masks
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
- H05B33/00—Electroluminescent light sources
- H05B33/12—Light sources with substantially two-dimensional radiating surfaces
- H05B33/22—Light sources with substantially two-dimensional radiating surfaces characterised by the chemical or physical composition or the arrangement of auxiliary dielectric or reflective layers
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/80—Constructional details
- H10K59/87—Passivation; Containers; Encapsulations
- H10K59/871—Self-supporting sealing arrangements
- H10K59/8722—Peripheral sealing arrangements, e.g. adhesives, sealants
Definitions
- the present invention relates to an organic light emitting display.
- a flat panel display In recent years, a flat panel display (FPD) increasingly becomes important with the development of multimedia. Hence, various flat panel displays such as a plasma display panel (PDP), a field emission display (FED), and an organic light emitting display (OLED) have been put to practical use.
- PDP plasma display panel
- FED field emission display
- OLED organic light emitting display
- an organic light emitting display has an advantage in that it has a high response speed lower than 1 ms and low consumption power, as well as emits light by itself.
- the organic light emitting display is advantageous as a motion image display medium because it does not have a trouble in the view angle without respect to its size.
- the organic light emitting display has come into the spotlight as a next generation flat panel display because it can be simply manufactured with existing semiconductor manufacturing processes at a low temperature.
- FIG. 1 is a plan view illustrating a structure of an organic light emitting display according to the prior art
- FIG. 2 is a portionially enlarged view of the organic light emitting display in FIG. 1
- FIG. 3 is a cross sectional view of the organic light emitting display taken along line I-I′ of FIG. 2 .
- an organic light emitting display comprises a substrate 100 comprising a non-emission region N and an emission region E, on which there are arranged sub-pixels, each comprising a first electrode 110 , an emission layer 120 , and a second electrode 130 .
- a first region where sub-pixels are arranged is defined as an emission region E
- a second region other than the first region is defined as a non-emission region N.
- sealant 160 and wires (not shown) to apply electrical signals to the first electrode 110 and the second electrode 130 .
- the first electrode 110 is patterned on the substrate 100 in a stripe form. And, wires (not shown), which are spaced from the first electrode 110 and have the same material as the first electrode 110 , are provided. On a portion of the first electrode 110 and wires (not shown) there is provided an insulating film 115 comprising an opening 116 for exposing a portion of the first electrode 110 and a contact portion 117 for exposing a portion of the wires (not shown). On the insulating film 115 there are provided barrier ribs 118 formed to be spaced from each other in the direction of intersecting the first electrode 110 , and in the opening 116 there is provided the emission layer 120 .
- the second electrode 130 is located on the substrate comprising the emission layer 120 and contact portion 117 , and the second electrode 130 is patterned by the barrier ribs 118 .
- the sealant 160 is provided on the non-emission region N of the substrate 100 to surround the emission region E.
- the substrate 100 provided with the sub-pixels is attached to an encapsulation substrate (not-shown) by the sealant 160 to protect the emission portion from external moisture or oxygen.
- the sealant 160 can be flowed into the emission region E as shown in FIGS. 2 and 3(C) . That is, a capillary phenomenon created by a pressure applied when the substrate 110 and the encapsulation substrate 170 are attached to each other causes the sealant 160 to flow into the emission region E along the lower space of barrier ribs having overhang structures.
- the flowed sealant 160 may cause damage to an outer circumference of the emission layer 120 , thereby to reduce reliability and emission efficiency of elements.
- the present invention is provided to substantially obviate one or more problems due to limitations and disadvantages of the related art.
- an organic light emitting device comprising: a first substrate comprising an emission region and a non-emission region; a sub-pixel located on the first substrate, the sub-pixel comprising a first electrode, an emission layer, and a second electrode; and a barrier rib located on the substrate comprising the first electrode, the barrier rib patterning the second electrode, wherein a volume per unit area of a portion of the barrier rib located on the non-emission region is different from that of the other portion of the barrier rib located on the emission region.
- FIG. 1 is a plan view illustrating an organic light emitting display according to the prior art.
- FIG. 2 is a portionially enlarged view of the organic light emitting display in FIG. 1 .
- FIG. 3 is a cross sectional view of the organic light emitting display taken along line I-I′ of FIG. 2 .
- FIG. 4 is a plan view of an organic light emitting display according to a first embodiment of the present invention.
- FIG. 5 is a portionially enlarged view of the organic light emitting display in FIG. 4 .
- FIG. 6 is a cross sectional view of the organic light emitting display taken along line II-II′ of FIG. 4 .
- FIG. 4 is a plan view illustrating a portion of a barrier rib of an organic light emitting display according to a first embodiment of the present invention.
- FIG. 7B is a cross sectional view of the barrier rib taken along line A-A′ of FIG. 7A .
- FIG. 7C is a cross sectional view of the barrier rib taken along line B-B′ of FIG. 7A .
- FIG. 8 is a plan view illustrating an organic light emitting display according to a second embodiment of the present invention.
- FIG. 9 is a cross sectional view of a barrier rib of the organic light emitting display according to the second embodiment of the present invention.
- an organic light emitting display comprises a substrate 200 comprising a non-emission region N and an emission region E, on which there are arranged sub-pixels, each comprising a first electrode 210 , an emission layer 220 , and a second electrode 230 .
- a substrate 200 comprising a non-emission region N and an emission region E, on which there are arranged sub-pixels, each comprising a first electrode 210 , an emission layer 220 , and a second electrode 230 .
- sealant 260 and wires not shown to apply electrical signals to the first electrode 210 and the second electrode 230 .
- the first electrode 210 is patterned on the substrate 200 in a stripe form. And, wires (not shown), which are spaced from the first electrode 210 and have the same material as the first electrode 210 , are provided.
- the first electrode 210 may be an anode and may comprise a transparent conductive layer having a high work function such as ITO(Indium Tin Oxide). And, the wires(not shown) may further comprise a metallic layer disposed on a transparent conductive film other than the transparent conductive layer.
- An insulating film 215 is disposed on a portion of the first electrodes 210 and wires (not shown).
- the insulating film 215 may comprise an opening 216 for exposing a portion of the first electrode 210 and a contact portion 217 for exposing a portion of the wires (not shown).
- barrier ribs 218 formed in the direction of intersecting the first electrode 210 .
- the barrier ribs 218 are formed to be spaced from each other. And, the width of a portion of a barrier rib 218 located on the non-emission region N may be narrower than that of a portion of a barrier rib 218 located on the emission region E.
- the width of a portion of a barrier rib 218 located on the non-emission region N i.e. the width of an end portion, may become narrower as it goes to the outer circumference of the substrate as shown in FIGS. 7A to 7C .
- the end portion of the barrier rib 218 located on the non-emission region N is formed to have a length of more than 0 ⁇ m and less than 100 ⁇ m.
- a cross section of the end portion of the barrier rib 218 located on the emission region E, taken along the line A-A′, may have a reverse taper shape so that the second electrode 230 may be patterned. That is, each ( ⁇ 1) of two base angles at the cross section taken along the line A-A′ may be greater than 90 degrees. And, a cross section of the end portion of the barrier rib 218 located on the non-emission region N, taken along the line B-B′ may have a taper shape, and each ⁇ 2 of two base angles at the cross section taken along the line B-B′ may be more than 10 degrees and less than 90 degrees.
- the barrier rib 218 having the above-mentioned structure can be formed by selectively etching the end portion of the barrier rib located on the non-emission region N through a well known process such as lithography or sandblasting.
- the sealant 260 is applied on a portion of the non-emission region, and the substrate 200 having the above-mentioned structure is attached to the encapsulation substrate 270 by the sealant 260 .
- the organic light emitting device can reduce the phenomenon where the sealant 260 flows into the emission region as shown in FIGS. 5 and 6 , since the width of the end portion of the barrier rib 218 located on the non-emission region N is formed to be narrower than that of the end portion of the barrier rib 218 located on the emission region E. That is, the organic light emitting device according to the embodiment of the present invention can reduce the phenomenon caused by a capillary phenomenon as in the prior art, where the sealant 260 flows into the emission region E, by making the width of the end portion of the barrier rib 218 located on the non-emission region N narrow to secure a space.
- FIG. 8 is a plan view illustrating an organic light emitting display according to a second embodiment of the present invention.
- the organic light emitting display according to the second embodiment of the present invention has the same construction as the first embodiment of the present invention except that a barrier 365 is further provided between the barrier rib 318 and sealant 360 .
- a first electrode 310 patterned in a stripe form and wires (not shown), and on a portion of the first electrode 310 and wires there is provided an insulating film 315 comprising an opening 316 for exposing a portion of the first electrode 310 and a contact portion 317 for exposing a portion of the wires (not shown).
- barrier ribs 318 formed to be spaced from each other in the direction of intersecting the first electrode 310 , where the width of a barrier rib 318 located on the non-emission region N may be narrower than that of a barrier rib 318 located on the emission region E.
- a barrier 365 may be disposed between the emission region E and sealant 360 .
- the barrier 365 of the organic light emitting display according to the second embodiment of the present invention can be formed in one or more layers, and prevent the sealant 360 from flowing into the emission region E.
- the location where the barrier 365 is to be formed may be selected depending on how much sealant 360 is flowed into the emission region E.
- the organic light emitting display according to the second embodiment of the present invention can prevent sealant 360 from flowing into the emission region when the substrate 300 and the encapsulation substrate 370 are attached to each other, primarily by the barrier and secondarily by the barrier rib 318 .
- the organic light emitting display according to the second embodiment of the present invention can prevent more efficiently sealant from flowing into the emission region compared to the organic light emitting display according to the first embodiment of the present invention.
- FIG. 9 is a plan view illustrating a structure of a barrier rib according to the second embodiment of the present invention.
- a portion of the barrier rib according to the second embodiment which is located on the non-emission region, has narrower width than the other portion thereof, which is located on the emission region, and the portion of the barrier rib which is located on the emission region becomes narrower in width as going to the outer circumference of the substrate and has a bent where the width decreases sharply.
- the organic light emitting display according to the second embodiment of the present invention can reduce dramatically a capillary phenomenon since the width of the end portion of the barrier rib located on the non-emission region decreases prominently compared to the barrier rib according to the first embodiment of the present invention.
- the barrier rib according to the second embodiment can prevent the inflow of sealant effectively.
- the structure of the barrier rib is not limited thereto, and therefore the height of a portion of the barrier rib located on the non-emission region may be lower than that of the other portion of the barrier rib located on the emission region. And, both of height and width of the portion of the barrier rib located on the non-emission region may be adjusted at the same time.
- barrier ribs according to the embodiments of the present invention have been described to be formed by photolithography or sandblasting, but not limited thereto, various processes can be applicable to form the barrier ribs.
- barrier ribs according to the embodiments of the present invention have been described to be formed in a singe layer, they can also be formed in a double layer.
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- Optics & Photonics (AREA)
- Electroluminescent Light Sources (AREA)
Abstract
Description
- This application claims priority to and the benefit of Korea Patent Application No. 10-2006-0029600, filed on Mar. 31, 2006, the entire content of which is incorporated herein by reference.
- 1. Field
- The present invention relates to an organic light emitting display.
- 2. Related Art
- In recent years, a flat panel display (FPD) increasingly becomes important with the development of multimedia. Hence, various flat panel displays such as a plasma display panel (PDP), a field emission display (FED), and an organic light emitting display (OLED) have been put to practical use.
- In portionicular, an organic light emitting display has an advantage in that it has a high response speed lower than 1 ms and low consumption power, as well as emits light by itself. In addition, the organic light emitting display is advantageous as a motion image display medium because it does not have a trouble in the view angle without respect to its size. Furthermore, the organic light emitting display has come into the spotlight as a next generation flat panel display because it can be simply manufactured with existing semiconductor manufacturing processes at a low temperature.
-
FIG. 1 is a plan view illustrating a structure of an organic light emitting display according to the prior art,FIG. 2 is a portionially enlarged view of the organic light emitting display inFIG. 1 , andFIG. 3 is a cross sectional view of the organic light emitting display taken along line I-I′ ofFIG. 2 . - Referring to
FIGS. 1 to 3 , an organic light emitting display according to the prior art comprises asubstrate 100 comprising a non-emission region N and an emission region E, on which there are arranged sub-pixels, each comprising afirst electrode 110, anemission layer 120, and asecond electrode 130. Here, a first region where sub-pixels are arranged is defined as an emission region E, and a second region other than the first region is defined as a non-emission region N. - On the non-emission region N of the
substrate 100 there are providedsealant 160 and wires (not shown) to apply electrical signals to thefirst electrode 110 and thesecond electrode 130. - More specifically, the
first electrode 110 is patterned on thesubstrate 100 in a stripe form. And, wires (not shown), which are spaced from thefirst electrode 110 and have the same material as thefirst electrode 110, are provided. On a portion of thefirst electrode 110 and wires (not shown) there is provided aninsulating film 115 comprising anopening 116 for exposing a portion of thefirst electrode 110 and acontact portion 117 for exposing a portion of the wires (not shown). On theinsulating film 115 there are providedbarrier ribs 118 formed to be spaced from each other in the direction of intersecting thefirst electrode 110, and in theopening 116 there is provided theemission layer 120. Thesecond electrode 130 is located on the substrate comprising theemission layer 120 andcontact portion 117, and thesecond electrode 130 is patterned by thebarrier ribs 118. And, thesealant 160 is provided on the non-emission region N of thesubstrate 100 to surround the emission region E. And, thesubstrate 100 provided with the sub-pixels is attached to an encapsulation substrate (not-shown) by thesealant 160 to protect the emission portion from external moisture or oxygen. - At this time, however, the
sealant 160 can be flowed into the emission region E as shown inFIGS. 2 and 3(C) . That is, a capillary phenomenon created by a pressure applied when thesubstrate 110 and theencapsulation substrate 170 are attached to each other causes thesealant 160 to flow into the emission region E along the lower space of barrier ribs having overhang structures. - The flowed
sealant 160 may cause damage to an outer circumference of theemission layer 120, thereby to reduce reliability and emission efficiency of elements. - Accordingly, the present invention is provided to substantially obviate one or more problems due to limitations and disadvantages of the related art.
- To achieve the above objects, there is provided an organic light emitting device according to the present invention comprising: a first substrate comprising an emission region and a non-emission region; a sub-pixel located on the first substrate, the sub-pixel comprising a first electrode, an emission layer, and a second electrode; and a barrier rib located on the substrate comprising the first electrode, the barrier rib patterning the second electrode, wherein a volume per unit area of a portion of the barrier rib located on the non-emission region is different from that of the other portion of the barrier rib located on the emission region.
-
FIG. 1 is a plan view illustrating an organic light emitting display according to the prior art. -
FIG. 2 is a portionially enlarged view of the organic light emitting display inFIG. 1 . -
FIG. 3 is a cross sectional view of the organic light emitting display taken along line I-I′ ofFIG. 2 . -
FIG. 4 is a plan view of an organic light emitting display according to a first embodiment of the present invention. -
FIG. 5 is a portionially enlarged view of the organic light emitting display inFIG. 4 . -
FIG. 6 is a cross sectional view of the organic light emitting display taken along line II-II′ ofFIG. 4 . -
FIG. 4 is a plan view illustrating a portion of a barrier rib of an organic light emitting display according to a first embodiment of the present invention. -
FIG. 7B is a cross sectional view of the barrier rib taken along line A-A′ ofFIG. 7A . -
FIG. 7C is a cross sectional view of the barrier rib taken along line B-B′ ofFIG. 7A . -
FIG. 8 is a plan view illustrating an organic light emitting display according to a second embodiment of the present invention. -
FIG. 9 is a cross sectional view of a barrier rib of the organic light emitting display according to the second embodiment of the present invention. - Referring to
FIGS. 4 to 6 , an organic light emitting display comprises asubstrate 200 comprising a non-emission region N and an emission region E, on which there are arranged sub-pixels, each comprising afirst electrode 210, anemission layer 220, and asecond electrode 230. On the non-emission region N of thesubstrate 200 there are providedsealant 260 and wires (not shown) to apply electrical signals to thefirst electrode 210 and thesecond electrode 230. - More specifically, the
first electrode 210 is patterned on thesubstrate 200 in a stripe form. And, wires (not shown), which are spaced from thefirst electrode 210 and have the same material as thefirst electrode 210, are provided. - The
first electrode 210 may be an anode and may comprise a transparent conductive layer having a high work function such as ITO(Indium Tin Oxide). And, the wires(not shown) may further comprise a metallic layer disposed on a transparent conductive film other than the transparent conductive layer. - An
insulating film 215 is disposed on a portion of thefirst electrodes 210 and wires (not shown). Theinsulating film 215 may comprise anopening 216 for exposing a portion of thefirst electrode 210 and acontact portion 217 for exposing a portion of the wires (not shown). And, on theinsulating film 215 there are disposedbarrier ribs 218 formed in the direction of intersecting thefirst electrode 210. Thebarrier ribs 218 are formed to be spaced from each other. And, the width of a portion of abarrier rib 218 located on the non-emission region N may be narrower than that of a portion of abarrier rib 218 located on the emission region E. - More specifically, the width of a portion of a
barrier rib 218 located on the non-emission region N, i.e. the width of an end portion, may become narrower as it goes to the outer circumference of the substrate as shown inFIGS. 7A to 7C . At this time, it is desirable that the end portion of thebarrier rib 218 located on the non-emission region N is formed to have a length of more than 0 μm and less than 100 μm. - A cross section of the end portion of the
barrier rib 218 located on the emission region E, taken along the line A-A′, may have a reverse taper shape so that thesecond electrode 230 may be patterned. That is, each (θ1) of two base angles at the cross section taken along the line A-A′ may be greater than 90 degrees. And, a cross section of the end portion of thebarrier rib 218 located on the non-emission region N, taken along the line B-B′ may have a taper shape, and each θ2 of two base angles at the cross section taken along the line B-B′ may be more than 10 degrees and less than 90 degrees. - The
barrier rib 218 having the above-mentioned structure can be formed by selectively etching the end portion of the barrier rib located on the non-emission region N through a well known process such as lithography or sandblasting. - Returning to
FIGS. 4 to 6 , thesealant 260 is applied on a portion of the non-emission region, and thesubstrate 200 having the above-mentioned structure is attached to theencapsulation substrate 270 by thesealant 260. - At this time, the organic light emitting device according to a first embodiment of the present invention can reduce the phenomenon where the
sealant 260 flows into the emission region as shown inFIGS. 5 and 6 , since the width of the end portion of thebarrier rib 218 located on the non-emission region N is formed to be narrower than that of the end portion of thebarrier rib 218 located on the emission region E. That is, the organic light emitting device according to the embodiment of the present invention can reduce the phenomenon caused by a capillary phenomenon as in the prior art, where thesealant 260 flows into the emission region E, by making the width of the end portion of thebarrier rib 218 located on the non-emission region N narrow to secure a space. -
FIG. 8 is a plan view illustrating an organic light emitting display according to a second embodiment of the present invention. - Referring to
FIG. 8 , the organic light emitting display according to the second embodiment of the present invention, has the same construction as the first embodiment of the present invention except that abarrier 365 is further provided between thebarrier rib 318 andsealant 360. - That is, on a
substrate 300 according to the second embodiment of the present invention there are located afirst electrode 310 patterned in a stripe form and wires (not shown), and on a portion of thefirst electrode 310 and wires there is provided an insulating film 315 comprising anopening 316 for exposing a portion of thefirst electrode 310 and acontact portion 317 for exposing a portion of the wires (not shown). And, on the insulating film 315 there aredisposed barrier ribs 318 formed to be spaced from each other in the direction of intersecting thefirst electrode 310, where the width of abarrier rib 318 located on the non-emission region N may be narrower than that of abarrier rib 318 located on the emission region E. - And, a
barrier 365 may be disposed between the emission region E andsealant 360. Thebarrier 365 of the organic light emitting display according to the second embodiment of the present invention can be formed in one or more layers, and prevent thesealant 360 from flowing into the emission region E. The location where thebarrier 365 is to be formed may be selected depending on howmuch sealant 360 is flowed into the emission region E. - That is, the organic light emitting display according to the second embodiment of the present invention can prevent
sealant 360 from flowing into the emission region when thesubstrate 300 and the encapsulation substrate 370 are attached to each other, primarily by the barrier and secondarily by thebarrier rib 318. - Therefore, the organic light emitting display according to the second embodiment of the present invention can prevent more efficiently sealant from flowing into the emission region compared to the organic light emitting display according to the first embodiment of the present invention.
-
FIG. 9 is a plan view illustrating a structure of a barrier rib according to the second embodiment of the present invention. - Referring to
FIG. 9 , a portion of the barrier rib according to the second embodiment, which is located on the non-emission region, has narrower width than the other portion thereof, which is located on the emission region, and the portion of the barrier rib which is located on the emission region becomes narrower in width as going to the outer circumference of the substrate and has a bent where the width decreases sharply. - Accordingly, the organic light emitting display according to the second embodiment of the present invention can reduce dramatically a capillary phenomenon since the width of the end portion of the barrier rib located on the non-emission region decreases prominently compared to the barrier rib according to the first embodiment of the present invention. As a consequence, the barrier rib according to the second embodiment can prevent the inflow of sealant effectively.
- While the above-mentioned embodiments illustrate a case where the width of a portion of the barrier rib located on the non-emission region is narrower than that of the other portion of the barrier rib located on the emission region, the structure of the barrier rib is not limited thereto, and therefore the height of a portion of the barrier rib located on the non-emission region may be lower than that of the other portion of the barrier rib located on the emission region. And, both of height and width of the portion of the barrier rib located on the non-emission region may be adjusted at the same time.
- In addition, while the barrier ribs according to the embodiments of the present invention have been described to be formed by photolithography or sandblasting, but not limited thereto, various processes can be applicable to form the barrier ribs.
- And, while the barrier ribs according to the embodiments of the present invention have been described to be formed in a singe layer, they can also be formed in a double layer.
Claims (15)
Applications Claiming Priority (2)
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KR10-2006-0029600 | 2006-03-31 | ||
KR1020060029600A KR100738224B1 (en) | 2006-03-31 | 2006-03-31 | Light emitting diodes |
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US20070228936A1 true US20070228936A1 (en) | 2007-10-04 |
US7808172B2 US7808172B2 (en) | 2010-10-05 |
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Cited By (4)
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EP2731138A1 (en) * | 2012-11-09 | 2014-05-14 | EM Microelectronic-Marin SA | Method for manufacturing an OLED display, resulting OLED display and timepiece including such a display |
US20140363915A1 (en) * | 2013-06-11 | 2014-12-11 | Chi Mei Corporation | Negative photosensitive resin composition and application thereof |
CN104345557A (en) * | 2013-08-08 | 2015-02-11 | 奇美实业股份有限公司 | Negative photosensitive resin composition, pattern, crystal grain and device manufacturing method |
US20210202629A1 (en) * | 2019-12-31 | 2021-07-01 | Lg Display Co., Ltd. | Display device |
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JP4114895B2 (en) * | 1998-07-08 | 2008-07-09 | Tdk株式会社 | Organic EL display device |
JP4478274B2 (en) * | 2000-02-17 | 2010-06-09 | 東北パイオニア株式会社 | Organic electroluminescence display panel and manufacturing method thereof |
KR100508002B1 (en) * | 2002-09-03 | 2005-08-17 | 엘지.필립스 엘시디 주식회사 | fabrication method of an organic electro-luminescence device using nozzle coating |
KR100608403B1 (en) * | 2004-03-24 | 2006-08-03 | 엘지.필립스 엘시디 주식회사 | Organic Electro luminescence Device and fabrication method thereof |
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KR20050116278A (en) * | 2004-06-07 | 2005-12-12 | 엘지전자 주식회사 | Organic electro luminescence display device |
-
2006
- 2006-03-31 KR KR1020060029600A patent/KR100738224B1/en active IP Right Grant
-
2007
- 2007-03-29 US US11/730,103 patent/US7808172B2/en active Active
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EP2731138A1 (en) * | 2012-11-09 | 2014-05-14 | EM Microelectronic-Marin SA | Method for manufacturing an OLED display, resulting OLED display and timepiece including such a display |
US9105871B2 (en) | 2012-11-09 | 2015-08-11 | Em Microelectronic-Marin S.A. | Method of manufacturing an OLED display device, the resulting OLED display device and a timepiece comprising the same |
US20140363915A1 (en) * | 2013-06-11 | 2014-12-11 | Chi Mei Corporation | Negative photosensitive resin composition and application thereof |
CN104238270A (en) * | 2013-06-11 | 2014-12-24 | 奇美实业股份有限公司 | Composition, method for forming pattern, crystal grain and method for manufacturing display device |
CN104345557A (en) * | 2013-08-08 | 2015-02-11 | 奇美实业股份有限公司 | Negative photosensitive resin composition, pattern, crystal grain and device manufacturing method |
US20150044790A1 (en) * | 2013-08-08 | 2015-02-12 | Chi Mei Corporation | Negative photosensitive resin composition and application thereof |
US9366959B2 (en) * | 2013-08-08 | 2016-06-14 | Chi Mei Corporation | Negative photosensitive resin composition and application thereof |
US20210202629A1 (en) * | 2019-12-31 | 2021-07-01 | Lg Display Co., Ltd. | Display device |
US11716879B2 (en) * | 2019-12-31 | 2023-08-01 | Lg Display Co., Ltd. | Display device with dummy portions on non-display area |
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KR100738224B1 (en) | 2007-07-12 |
US7808172B2 (en) | 2010-10-05 |
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