JP2016149223A - Light-emitting device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To suppress the in-plane variation of luminance of an organic EL element and suppress the area increase of a non-light-emitting portion of a light-emitting device.SOLUTION: A first terminal 112 extends in a first direction and is electrically connected to a light-emitting portion 140. A sealing member seals the light-emitting portion. The first terminal 112 includes a connection portion 114 and a non-connection portion 116. The connection portion 114 is a region where a conductive member 200 is connected, and the non-connection portion 116 is a region where the conductive member 200 is not connected. The non-connection portion 116 is disposed on each side of the connection portion 114. A part of the portion of the sealing member that is located around the light-emitting portion (the part corresponding to a periphery) overlaps with at least a part of the non-connection portion 116. A part of the periphery of the sealing member that overlaps with the connection portion 114 in the first direction is located between the first terminal 112 and the light-emitting portion 140.SELECTED DRAWING: Figure 3

Description

  The present invention relates to a light emitting device.

  In recent years, development of a light emitting device using an organic EL element as a light emitting unit has been advanced. The organic EL element has a configuration in which an organic layer is sandwiched between a first electrode and a second electrode. The light emitting device has a first terminal connected to the first electrode and a second terminal connected to the second electrode, as described in Patent Document 1, for example. The first terminal and the second terminal are connected to a power supply circuit via a conductive member such as an FPC (Flexible Printed Circuit). In Patent Document 1, the substrate of the light emitting device is rectangular. The first terminal and the second terminal are formed near each of the two sides facing each other on the substrate.

  In addition, since the organic layer is vulnerable to moisture, the organic EL element needs to be sealed with a sealing member. In Patent Document 1, the sealing member is a sealing film formed in the form of glass, stainless steel, copper foil, aluminum foil, gold foil or film. The first terminal and the second terminal described above are drawn out of the sealing member.

JP 2010-198980 A

  When the light emitting part using the organic EL element of the light emitting device is a planar light emitting part, there is a possibility that a luminance distribution is generated in the surface of the planar light emitting part. In order to suppress this luminance distribution, it is preferable that the terminal connected to the first electrode or the second electrode of the organic EL element extends long along the edge of the planar light-emitting portion to widen the terminal. However, if the terminal extends long along the edge of the planar light emitting part, the area of the non-light emitting part of the light emitting device increases.

  An example of a problem to be solved by the present invention is to prevent the area of the non-light emitting portion of the light emitting device from increasing while suppressing the occurrence of in-plane distribution in the luminance of the light emitting device.

The invention according to claim 1 is a substrate;
A light emitting part formed on the substrate;
A terminal formed on the substrate, located between an edge of the substrate and the light emitting unit, and extending in a first direction;
A sealing member for sealing the light emitting part;
With
The terminal is
In the first direction, it extends at least over the entire region overlapping the light emitting unit,
A connecting portion to which the conductive member is connected;
A non-connecting portion that is located on both sides of the connecting portion and to which the conducting member is not connected;
Have
In the sealing member, a part of a peripheral edge located around the light emitting part is a light emitting device that overlaps at least a part of the non-connecting part.

It is a top view which shows the structure of the light-emitting device which concerns on embodiment. It is the figure which removed the conduction member from FIG. It is the figure which removed the sealing member from FIG. It is the figure which removed the 2nd electrode from FIG. It is the figure which removed the insulating layer and the organic layer from FIG. It is AA sectional drawing of FIG. It is BB sectional drawing of FIG. It is CC sectional drawing of FIG. It is DD sectional drawing of FIG. It is a figure which shows an example of the cross section of a light-emitting device. 6 is a plan view showing a configuration of a light emitting device according to Modification Example 1. FIG. It is the figure which removed the sealing member from FIG. 12 is a plan view showing a configuration of a light emitting device according to Modification 2. FIG.

  Hereinafter, embodiments of the present invention will be described with reference to the drawings. In all the drawings, the same reference numerals are given to the same components, and the description will be omitted as appropriate.

  FIG. 1 is a plan view showing a configuration of a light emitting device 10 according to the embodiment. FIG. 2 is a view in which the conductive member 200 is removed from FIG. 3 is a view in which the sealing member 160 is removed from FIG. 2, and FIG. 4 is a view in which the second electrode 130 is removed from FIG. FIG. 5 is a diagram in which the insulating layer 150 and the organic layer 120 are removed from FIG. 4.

  The light emitting device 10 according to the embodiment includes a substrate 100, a light emitting unit 140, a first terminal 112, and a sealing member 160. The light emitting unit 140 is formed on the substrate 100. The first terminal 112 is formed on the substrate 100 and is located between the edge of the substrate 100 and the light emitting unit 140. The first terminal 112 extends in the first direction (the x direction in FIGS. 1 to 5). In the embodiment, the first terminal 112 is electrically connected to the light emitting unit 140. The sealing member 160 seals the light emitting unit 140. The first terminal 112 extends in the first direction to at least the entire region overlapping the light emitting unit 140, for example, the outside of the light emitting unit 140. The first terminal 112 has a connection part 114 and a non-connection part 116. The connection part 114 is an area where the conduction member 200 is connected, and the non-connection part 116 is an area where the conduction member 200 is not connected. As shown in FIGS. 3 to 5, in this embodiment, the non-connecting portion 116 is located on both sides of the connecting portion 114. In addition, a part of the portion (peripheral part) located around the light emitting part 140 in the sealing member 160 overlaps at least a part of the non-connecting part 116. In addition, a portion of the peripheral portion of the sealing member 160 that overlaps with the connection portion 114 in the first direction (that is, the direction in which the first terminal 112 extends) is located between the first terminal 112 and the light emitting portion 140. Yes. Details will be described below.

When the light emitting device 10 is a bottom emission type light emitting device, the substrate 100 is a light-transmitting substrate such as a glass substrate or a resin substrate. On the other hand, in the case where the light emitting device 10 is a top emission type light emitting device, the substrate 100 may not have translucency. Further, the substrate 100 may have flexibility. In this case, the light emitting device 10 can be used with the substrate 100 being curved. In the case where the substrate 100 has flexibility, the thickness of the substrate 100 is, for example, not less than 10 μm and not more than 1000 μm. The substrate 100 is, for example, a polygon such as a rectangle. When the substrate 100 is a resin substrate, the substrate 100 is formed using, for example, PEN (polyethylene naphthalate), PES (polyethersulfone), PET (polyethylene terephthalate), or polyimide. When the substrate 100 is a resin substrate, an inorganic barrier film such as SiN _x or SiON is formed on at least one surface (preferably both surfaces) of the substrate 100 in order to prevent moisture from permeating the substrate 100. Yes. Note that a planarization layer (for example, an organic layer) may be provided between the inorganic barrier film and the substrate 100.

  A light emitting unit 140 is provided on the substrate 100. The light emitting unit 140 has a configuration in which the first electrode 110, the organic layer 120, and the second electrode 130 are stacked in this order.

  The first electrode 110 is a transparent electrode having optical transparency. The material of the transparent electrode is a material containing a metal, for example, a metal oxide such as ITO (Indium Tin Oxide), IZO (Indium Zinc Oxide), IWZO (Indium Tungsten Zinc Oxide), or ZnO (Zinc Oxide). The thickness of the first electrode 110 is, for example, not less than 10 nm and not more than 500 nm. The first electrode 110 is formed using, for example, a sputtering method or a vapor deposition method. The first electrode 110 may be a carbon nanotube or a conductive organic material such as PEDOT / PSS.

  The organic layer 120 has a light emitting layer. The organic layer 120 has a configuration in which, for example, a hole injection layer, a light emitting layer, and an electron injection layer are stacked in this order. A hole transport layer may be formed between the hole injection layer and the light emitting layer. In addition, an electron transport layer may be formed between the light emitting layer and the electron injection layer. The organic layer 120 may be formed by a vapor deposition method. In addition, at least one layer of the organic layer 120, for example, a layer in contact with the first electrode 110, may be formed by a coating method such as an inkjet method, a printing method, or a spray method. In this case, the remaining layers of the organic layer 120 are formed by vapor deposition. Moreover, all the layers of the organic layer 120 may be formed using the apply | coating method.

  The second electrode 130 is made of a material that does not transmit visible light, for example, a metal selected from the first group consisting of Al, Au, Ag, Pt, Mg, Sn, Zn, and In, or the first group. It includes a metal layer made of an alloy of selected metals. In this case, the second electrode 130 has a light shielding property. The thickness of the second electrode 130 is, for example, not less than 10 nm and not more than 500 nm. However, the second electrode 130 may be formed using the material exemplified as the material of the first electrode 110. The second electrode 130 is formed using, for example, a sputtering method or a vapor deposition method.

  Note that the materials of the first electrode 110 and the second electrode 130 described above are for the case where the light emitting device 10 is a bottom emission type. When the light emitting device 10 is a top emission type, the material of the first electrode 110 does not have to be light transmissive, but the material of the second electrode 130 needs to be light transmissive. Further, the material of the first electrode 110 and the material of the second electrode 130 may be reversed. In this case, the material of the first electrode 110 is used as the material of the first electrode 110, and the material of the first electrode 110 is used as the material of the second electrode 130.

  The edge of the first electrode 110 is covered with an insulating layer 150. The insulating layer 150 is made of, for example, a photosensitive resin material such as polyimide, and surrounds a portion of the first electrode 110 that becomes the light emitting portion 140.

  A first terminal 112 and a second terminal 132 are formed on the surface of the substrate 100 where the light emitting unit 140 is formed. Both the first terminal 112 and the second terminal 132 are located between the light emitting unit 140 and the edge of the substrate 100. The first terminal 112 is electrically connected to the first electrode 110, and the second terminal 132 is electrically connected to the second electrode 130.

  Specifically, each of the first terminal 112 and the second terminal 132 has a layer made of the same conductive material as the first electrode 110 (first layers 111 and 131 described later). The layer made of the same conductive material as the first electrode 110 in the first terminal 112 is integrated with the first electrode 110. Here, the first terminal 112 can be defined as, for example, a portion of the first electrode 110 located outside the insulating layer 150. On the other hand, the layer made of the same conductive material as the first electrode 110 in the second terminal 132 is separated from the first electrode 110. The insulating layer 150 described above is located between the first electrode 110 and the second terminal 132.

  In the example shown in this drawing, both the substrate 100 and the light emitting unit 140 are rectangular. The first terminal 112 extends along two opposite sides of the light emitting unit 140, and the second terminal 132 extends along the remaining two sides of the light emitting unit 140. Exist. The length of the first terminal 112 is the same as the length of the light emitting unit 140 along the first terminal 112 in the first direction (for example, the side of the light emitting unit 140 that faces the first terminal 112). Longer than. In addition, the length of the second terminal 132 is the portion of the light emitting unit 140 along the second terminal 132 in the direction in which the second terminal 132 extends (for example, the second terminal 132 faces the second terminal 132 of the light emitting unit 140). Side) or longer. In this way, it is possible to suppress the occurrence of in-plane variation in the luminance of the light emitting unit 140 due to the resistance of the first electrode 110 and the second electrode 130.

  The conducting member 200 is connected to the first terminal 112 and the second terminal 132. In the example shown in this figure, the conducting member 200 has a first conducting part 210 and a second conducting part 220. The first conduction unit 210 is connected to both of the two first terminals 112, and the second conduction unit 220 is connected to both of the two second terminals 132. The first conductive portion 210 and the second conductive portion 220 are both drawn out of the substrate 100 from the same side (the right side in the example shown in the figure) of the substrate 100. In order to do this, for example, the first conductive portion 210 may be substantially T-shaped and the second conductive portion 220 may be linear. However, the shapes of the first conduction part 210 and the second conduction part 220 may be reversed.

  In addition, the 1st conduction | electrical_connection part 210 is FPC, for example, and has the 1st wiring 212 inside. The first terminal 112 and an electronic component outside the light emitting device 10 (for example, a power supply circuit of the light emitting device 10) are connected to each other via the first wiring 212. Similarly, the 2nd conduction | electrical_connection part 220 is also FPC, for example, and has the 2nd wiring 222 inside. The second terminal 132 and an external electronic component (for example, a power supply circuit of the light emitting device 10) are connected to each other via the second wiring 222.

  Moreover, the 1st conduction | electrical_connection part 210 and the 2nd conduction | electrical_connection part 220 may be mutually fixed at the intersection of the 1st conduction | electrical_connection part 210 and the 2nd conduction | electrical_connection part 220, and do not need to be fixed.

  The first terminal 112 has a connection part 114 and a non-connection part 116. The connection part 114 is a part of the first terminal 112 to which the first conduction part 210 is connected, and the non-connection part 116 is a part of the first terminal 112 to which the first conduction part 210 is not connected. The non-connection portion 116 is located on each side of the connection portion 114. In other words, the connection part 114 is located at a place other than both ends of the first terminal 112. For this reason, even if the connection part 114 is only a part of the first terminal 112, each of the light emitting parts 140 from the connection part 114 is different from the case where the connection part 114 is located at both ends of the first terminal 112. Variations in the resistance value up to the region can be suppressed. Thereby, it can suppress that in-plane distribution arises in the brightness | luminance of the light emission part 140. FIG. Preferably, the lengths of the non-connection portions 116 on both sides of the connection portion 114 are equal to each other.

  Similarly, the second terminal 132 also has a connection part 134 and a non-connection part 136. The connection part 134 is a part of the second terminal 132 to which the second conduction part 220 is connected, and the non-connection part 136 is a part of the second terminal 132 to which the second conduction part 220 is not connected. The non-connecting portion 136 is located on each side of the connecting portion 134. In other words, the connecting portion 134 is located at a place other than both ends of the second terminal 132. For this reason, compared with the case where the connection part 134 is located in the both ends of the 2nd terminal 132, it can suppress that in-plane distribution arises in the brightness | luminance of the light emission part 140. FIG. Preferably, the lengths of the non-connecting parts 136 on both sides of the connecting part 134 are made equal to each other.

  When the number of connection portions 114 included in one first terminal 112 is n, each of the n division points that divide the first terminal 112 into (n + 1) equal parts in the direction along the edge of the light emitting portion 140. In addition, it is preferable that the connecting portion 114 is disposed. In this way, it is possible to further suppress the variation in resistance value between the connection portion 114 and each region of the light emitting portion 140. For example, in the example shown in FIG. 3, only one connection portion 114 is provided for each first terminal 112. In this case, it is preferable that the connection part 114 is located in the center of the 1st terminal 112 in the direction where the 1st terminal 112 is extended.

  Similarly, when the number of connection portions 134 included in one second terminal 132 is n, n division points that divide the second terminal 132 equally into (n + 1) in the direction along the edge of the light emitting portion 140. It is preferable that the connection part 134 is arrange | positioned at each. In this way, it is possible to further suppress the variation in the resistance value between the connection part 134 and each region of the light emitting part 140. For example, in the example shown in FIG. 3, only one connection portion 134 is provided for each second terminal 132. The connecting portion 134 is preferably located at the center of the second terminal 132 in the direction in which the second terminal 132 extends.

  Further, in the direction in which the first terminal 112 extends, the length of the first terminal 112 is preferably not less than 5 times the length of the connection portion 114, and preferably not more than 30 times. . Further, the length of the connection portion 114 is, for example, 30% or less of the length of the first terminal 112. Similarly, in the direction in which the second terminal 132 extends, the length of the second terminal 132 is preferably not less than 5 times the length of the connecting portion 134 and not more than 30 times. preferable. Further, the length of the connecting portion 134 is, for example, 30% or less of the length of the second terminal 132.

  The light emitting unit 140 is covered with a sealing member 160. The sealing member 160 is provided to seal the light emitting unit 140. The sealing member 160 is formed on the surface of the substrate 100 where the light emitting unit 140 is formed, and seals the light emitting unit 140 and the insulating layer 150. The sealing member 160 is fixed to the substrate 100 using an adhesive. The planar shape of the sealing member 160 is substantially the same as that of the substrate 100. The sealing member 160 can use a metal foil such as glass, stainless steel, and aluminum. However, the sealing member 160 has notches 162 and 164. The notch 162 overlaps with the connecting portion 114 and is provided to expose the connecting portion 114 from the sealing member 160. The notch 164 overlaps the connection part 134 and is provided to expose the connection part 134 from the sealing member 160. In other words, the connection portion 114 is a portion of the first terminal 112 exposed from the sealing member 160, and the connection portion 134 is a portion of the second terminal 132 exposed from the sealing member 160.

  In addition, the plurality of light emitting devices 10 may be collectively formed with the plurality of substrates 100 connected, and then the plurality of light emitting devices 10 may be divided into pieces. When the light emitting device 10 is formed in this manner, a part of the end surface of the sealing member 160 forms the same surface as the end surface of the substrate 100.

The sealing member 160 may be a sealing film. In this case, the sealing member 160 is formed of, for example, an insulating material, more specifically, an inorganic material. The thickness of the sealing member 160 is preferably 300 nm or less. The thickness of the sealing member 160 is, for example, 50 nm or more. The sealing member 160 is formed using an ALD (Atomic Layer Deposition) method. By using the ALD method, the step coverage of the sealing member 160 is enhanced. However, the sealing member 160 may be formed using other film forming methods such as a CVD method or a sputtering method. In this case, the sealing member 160 is formed of an insulating film such as SiO ₂ or SiN, and the film thickness is, for example, not less than 10 nm and not more than 1000 nm.

  The sealing member 160 may have a shape in which a concave portion is provided on an inorganic plate such as glass or stainless steel, or may have a shape in which a concave portion is formed by pressing an aluminum foil. In this case, the sealing member is fixed to the substrate 100 so that the light emitting unit 140 is located in the recess.

  6 is a cross-sectional view taken along the line AA in FIG. 2, FIG. 7 is a cross-sectional view taken along the line BB in FIG. 2, FIG. 8 is a cross-sectional view taken along the line CC in FIG. It is D sectional drawing. In other words, FIG. 6 is a cross-sectional view of the connection portion 114 of the first terminal 112, and FIG. 7 is a cross-sectional view of the non-connection portion 116 of the first terminal 112. 8 is a cross-sectional view of the connection portion 134 of the second terminal 132, and FIG. 9 is a cross-sectional view of the non-connection portion 136 of the second terminal 132.

  As shown in FIGS. 6, 7, 8, and 9, the first terminal 112 includes a first layer 111 and a second layer 113, and the second terminal 132 includes the first layer 131 and the second layer 113. The layer 133 is included. The first layers 111 and 131 are layers formed of the same material as the first electrode 110. As described above, the first layer 111 is integrated with the first electrode 110, and the first layer 131 is separated from the first electrode 110. The second layers 113 and 133 are formed of a material having a lower resistance than the first layer 111, such as Al, Al alloy, Ag, or Ag alloy. Note that the second layers 113 and 133 may have a multilayer structure. By forming the second layers 113 and 133, the resistance of the first terminal 112 and the second terminal 132 is lowered. For this reason, it can suppress that in-plane distribution arises in the brightness | luminance of the light emission part 140. FIG. In addition, the connection resistance between the first terminal 112 and the conductive member 200 is low, and the connection resistance between the second terminal 132 and the conductive member 200 is low. For this reason, the emitted-heat amount of the light-emitting device 10 decreases.

  As shown in FIGS. 2 and 6, the connection portion 114 of the first terminal 112 is not covered by the sealing member 160, but as shown in FIGS. 2 and 7, the non-connection portion of the first terminal 112. 116 is covered with a sealing member 160. For this reason, as shown in FIGS. 3 and 4, the second electrode 130, the insulating layer 150, and the organic layer 120, the portion facing the non-connecting portion 116, the second electrode 130, the insulating layer 150, and the organic layer 120 can be closer to the edge of the substrate 100 than a portion facing the connecting portion 114. As a result, the area of the light emitting unit 140 can be increased.

  Similarly, as shown in FIGS. 2 and 8, the connecting portion 134 of the second terminal 132 is not covered with the sealing member 160, but as shown in FIGS. 2 and 9, the second terminal 132 is not connected. The part 136 is covered with a sealing member 160. Therefore, as shown in FIGS. 3 and 4, the second electrode 130, the insulating layers 150 and 120, the portion facing the non-connection portion 136 is connected to the second electrode 130, the insulating layers 150 and 120. It can be brought closer to the edge of the substrate 100 than the portion facing the portion 134. As a result, the area of the light emitting unit 140 can be increased.

  Note that, as shown in FIG. 7, that is, the BB cross section of FIG. 2, a portion of the edge of the sealing member 160 that overlaps the non-connecting portion 116 in the direction in which the first terminal 112 extends (the x direction in FIG. 2). Forms the same surface as the substrate 100. Further, as shown in FIG. 9, that is, the DD cross section of FIG. 2, a portion of the edge of the sealing member 160 that overlaps the non-connecting portion 136 in the direction in which the second terminal 132 extends (the y direction in FIG. 2). Forms the same surface as the substrate 100.

  FIG. 10 shows an example of a cross section of the light emitting device 10 when the substrate 100 has flexibility. For the sake of explanation, the sealing member 160 is omitted. When the substrate 100 has flexibility, the light emitting device 10 also has flexibility. For example, when the light emitting device 10 is bent in a direction in which the first terminal 112 is bent, it is difficult to bend the light emitting device 10 if the first conduction unit 210 is connected to the entire surface of the first terminal 112. Similarly, when the light emitting device 10 is bent in the direction in which the second terminal 132 is bent, it is difficult to bend the light emitting device 10 if the second conductive portion 220 is connected to the entire surface of the second terminal 132. On the other hand, in the present embodiment, the first conduction part 210 is connected only to a part of the first terminal 112, and the second conduction part 220 is connected only to a part of the second terminal 132. . Therefore, the light emitting device 10 can be easily bent.

  Next, a method for manufacturing the light emitting device 10 will be described. First, the first electrode 110, the first layer 111 of the first terminal 112, and the first layer 131 of the second terminal 132 are formed on the substrate 100. Next, the second layer 113 is formed on the first layer 111, and the second layer 133 is formed on the first layer 131.

  Next, an insulating material to be the insulating layer 150 is applied over the first electrode 110. The insulating material is then partially removed. For example, when the insulating material is a photosensitive material, the insulating material is partially removed by exposing and developing the insulating material. Thereby, the insulating layer 150 is formed.

  Next, the organic layer 120 is formed, and further the second electrode 130 is formed. The second electrode 130 is formed by, for example, a vapor deposition method using a mask. Thereafter, the light emitting unit 140 is sealed using the sealing member 160. Thereafter, the substrate 100 is divided as necessary. Thereby, a part of the edge of the sealing member 160 forms the same surface as the edge of the substrate 100.

  As described above, according to the present embodiment, the first terminal 112 extends along the edge of the light emitting unit 140. For this reason, it is possible to suppress the occurrence of in-plane distribution in the luminance of the light emitting unit 140. Further, a part of the first terminal 112 is a region (non-connecting portion 116) where the conducting member 200 is not connected. The non-connecting portion 116 is covered with a sealing member 160. Therefore, a portion of the second electrode 130, the insulating layer 150, and the organic layer 120 that faces the non-connection portion 116 is a portion of the second electrode 130, the insulating layer 150, and the organic layer 120 that faces the connection portion 114. Rather than the edge of the substrate 100. As a result, the area of the light emitting unit 140 can be increased.

  The second terminal 132 also extends along the edge of the light emitting unit 140. For this reason, it can suppress that in-plane distribution arises in the brightness | luminance of the light emission part 140. FIG. And since the non-connecting part 136 is formed also in the 2nd terminal 132, the area of the light emission part 140 can be enlarged for the same reason.

  Further, the first conduction part 210 is connected only to a part of the first terminal 112, and the second conduction part 220 is connected only to a part of the second terminal 132. Therefore, the 1st conduction | electrical_connection part 210 and the 2nd conduction | electrical_connection part 220 can be made small, As a result, the cost of the conduction | electrical_connection member 200 can be reduced. In addition, work efficiency when connecting the first conduction part 210 to the first terminal 112 is improved, and work efficiency when connecting the second conduction part 220 to the second terminal 132 is also improved. Further, when the substrate 100 is flexible, the light emitting device 10 can be bent even if the first conductive portion 210 is connected to the first terminal 112 and the second conductive portion 220 is connected to the second terminal 132. Ease can be maintained.

  Further, the connecting portion 114 is located at a place other than both ends of the first terminal 112, and the connecting portion 134 is located at a place other than both ends of the second terminal 132. For this reason, it can suppress that dispersion | variation arises in the resistance value from the connection parts 114 and 134 to each area | region of the light emission part 140. FIG. Thereby, it can suppress that in-plane distribution arises in the brightness | luminance of the light emission part 140. FIG.

(Modification 1)
FIG. 11 is a plan view showing a configuration of the light emitting device 10 according to the first modification, and corresponds to FIG. 1 in the embodiment. FIG. 12 is a view in which the sealing member 160 is removed from FIG. 11, and corresponds to FIG. 3 in the embodiment. The light emitting device 10 according to this modification has the same configuration as the light emitting device 10 according to the embodiment except for the following points.

  First, the substrate 100 has a convex portion 102 and a convex portion 104. The convex portion 102 is provided on each of two sides facing the first terminal 112 among the four sides of the substrate 100, and the convex portion 104 is provided on the remaining two sides of the four sides of the substrate 100. In the example shown in FIGS. 11 and 12, the convex portions 102 and 104 are both provided at positions that overlap the center of each side of the substrate 100. When the substrate 100 is formed using a resin, the convex portions 102 and 104 are easily formed on the substrate 100.

  A part of the first terminal 112 is located on the convex part 102 and a part of the second terminal 132 is located on the convex part 104. The sealing member 160 covers the area of the substrate 100 excluding the convex portions 102 and 104. In other words, the sealing member 160 is a polygon having the same number of sides as the substrate 100.

  In such a configuration, a portion of the first terminal 112 located on the convex portion 102 is a connection portion 114, and the other portion of the first terminal 112 is a non-connection portion 116. In addition, a portion of the second terminal 132 positioned on the convex portion 104 is a connection portion 134, and the other portion of the second terminal 132 is a non-connection portion 136.

  According to this modification, the first terminal 112 and the second terminal 132 extend along the edge of the light emitting unit 140 as in the embodiment. Therefore, it is possible to suppress the occurrence of in-plane distribution in the luminance of the light emitting unit 140. Further, the substrate 100 is formed with convex portions 102 and 104. The connection portion 114 of the first terminal 112 is located on the convex portion 102, and the connection portion 134 of the second terminal 132 is located on the convex portion 104. Therefore, almost the entire surface of the substrate 100 other than the convex portions 102 and the convex portions 104 can be the light emitting portion 140. As a result, the area of the light emitting unit 140 can be increased.

(Modification 2)
FIG. 13 is a plan view illustrating a configuration of the light emitting device 10 according to the second modification, and corresponds to FIG. 2 in the embodiment. The light emitting device 10 according to this modification has the same configuration as that of the light emitting device 10 according to the embodiment, except for the positions of the connection portion 114 of the first terminal 112 and the connection portion 134 of the second terminal 132.

  In this modification, the connection portion 114 is provided at two corner portions of the substrate 100 that are opposed to each other, and the connection portion 134 is provided at the remaining two corner portions of the substrate 100. And the sealing member 160 has covered the part except the corner | angular part of the board | substrate 100. FIG.

  In the present modification, as shown by a dotted line in FIG. 13, the first terminal 112 is formed from the corner portion where the connection portion 114 is provided among the four corner portions of the substrate 100. Extending along each of the two sides. In addition, the second terminal 132 extends from each of the four corners of the substrate 100 where the connection portion 134 is provided along each of the two sides of the substrate 100 constituting the corner. However, the first terminal 112 and the second terminal 132 do not overlap. The planar shape of the first electrode 110 and the planar shape of the second electrode 130 are also shapes that match the shapes of the first terminal 112 and the second terminal 132.

  Also according to this modification, the first terminal 112 and the second terminal 132 extend along the edge of the light emitting unit 140. Therefore, it is possible to suppress the occurrence of in-plane distribution in the luminance of the light emitting unit 140. Further, the non-connection portion 116 is covered with a sealing member 160. Therefore, a portion of the second electrode 130, the insulating layer 150, and the organic layer 120 that faces the non-connection portion 116 is a portion of the second electrode 130, the insulating layer 150, and the organic layer 120 that faces the connection portion 114. Rather than the edge of the substrate 100. As a result, the area of the light emitting unit 140 can be increased.

  As mentioned above, although embodiment and the Example were described with reference to drawings, these are illustrations of this invention and can also employ | adopt various structures other than the above.

DESCRIPTION OF SYMBOLS 10 Light-emitting device 100 Board | substrate 110 1st electrode 112 1st terminal 114 Connection part 116 Non-connection part 120 Organic layer 130 2nd electrode 132 2nd terminal 134 Connection part 136 Non-connection part 140 Light-emitting part 150 Insulating layer 160 Sealing member 200 Conductivity Member 210 First conductive portion 220 Second conductive portion

Claims (6)

A substrate,
A light emitting part formed on the substrate;
A terminal formed on the substrate, located between an edge of the substrate and the light emitting unit, and extending in a first direction;
A sealing member for sealing the light emitting part;
With
The terminal is
In the first direction, it extends at least over the entire region overlapping the light emitting unit,
A connecting portion to which the conductive member is connected;
A non-connecting portion that is located on both sides of the connecting portion and to which the conducting member is not connected;
Have
A part of the peripheral part located in the circumference of the light emission part among the sealing members is a light emitting device with which at least a part of the non-connection part has overlapped. The light-emitting device according to claim 1.
Having the conducting member,
The part which overlaps with the said connection part among the said peripheral parts of the said sealing member is a light-emitting device located between the said light-emitting part and the said connection part. The light-emitting device according to claim 2.
A light-emitting device in which the non-connection portions having the same length are located on both sides of the connection portion. The light emitting device according to claim 1,
The light emitting unit includes a first electrode, a second electrode, and an organic layer positioned between the first electrode and the second electrode,
The connecting portion and the non-connecting portion of the terminal are both formed using a first layer formed using the same material as the first electrode and a material having a lower resistance than the first layer. A second layer located on the first layer;
A light emitting device comprising: In the light-emitting device as described in any one of Claims 1-4,
The light-emitting device in which at least a part of the end surface of the sealing member forms the same surface as the end surface of the substrate. In the light-emitting device as described in any one of Claims 1-5,
The substrate is a light emitting device having flexibility.

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