US20070163755A1 - Flat plate heat transfer device and method for manufacturing the same - Google Patents

Flat plate heat transfer device and method for manufacturing the same Download PDF

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Publication number
US20070163755A1
US20070163755A1 US10/583,514 US58351404A US2007163755A1 US 20070163755 A1 US20070163755 A1 US 20070163755A1 US 58351404 A US58351404 A US 58351404A US 2007163755 A1 US2007163755 A1 US 2007163755A1
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mesh
heat transfer
flat plate
transfer device
plate heat
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English (en)
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Hyun-Tae Kim
Yong-Duck Lee
Min-Jung Oh
Sung-Wook Jang
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LS Mtron Ltd
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Assigned to LS CALBE LTD reassignment LS CALBE LTD ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: JANG, SUNG-WOOK, KIM, HYUN-TAE, LEE, YONG-DUCK, OH, MIN-JUNG
Publication of US20070163755A1 publication Critical patent/US20070163755A1/en
Assigned to LS CORP. reassignment LS CORP. CHANGE OF NAME (SEE DOCUMENT FOR DETAILS). Assignors: LG CABLE LTD., LS CABLE LTD.
Assigned to LS MTRON LTD. reassignment LS MTRON LTD. ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: LS CORP.
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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
    • H01L23/427—Cooling by change of state, e.g. use of heat pipes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Definitions

  • the present invention relates to a flat plate heat transfer device capable of emitting heat from a heat source by circulating a working fluid using evaporation and condensation and its manufacturing method, and more particularly to a flat plate heat transfer device capable of preventing crush of a flat case and giving vapor dispersion channels and liquid flow channels in a direction that ensures a maximum heat transfer efficiency and its manufacturing method.
  • a heat pipe is widely known in the art.
  • the heat pipe is configured so that an inside of a sealed container is decompressed in a vacuum so as to be isolated from an ambient air, and then the container is sealed after a working fluid is injected therein.
  • a working fluid is heated and evaporated near the heat source to which the heat pipe is installed, and then flowed to a cooling part.
  • the vapor is condensed into a liquid again with emitting heat outside, and then returns to its original position.
  • the heat generated in the heat source is emitted outside, so the temperature of the electronic component may be kept in a suitable level accordingly.
  • U.S. Pat. No. 5,642,775 issued to Akachi et al. discloses a plate heat pipe including a plate with minute channels called capillary tunnel and formed by an extrusion method, and a working fluid filled therein. If one end of the plate is heated, the working fluid is heated and evaporated into a vapor and then moved to the other end of each channel, and then cooled and condensed again and moved to a heating part.
  • the plate heat pipe of Akachi et al. may be adopted between a motherboard and a printed circuit card. However, forming a plurality of such small and fine capillary channels by means of extrusion is very difficult.
  • U.S. Pat. No. 6,148,906 issued to Li et al. discloses a flat plate heat pipe for delivering heat from a heat source positioned in an electronic equipment enclosure to an external heatsink.
  • the flat plate heat pipe includes a metallic bottom plate having a depression therein containing a set of rods and a top plate for covering the bottom plate.
  • the space restricted by the bottom plate, the top plate and the rods is decompressed and filled with a working fluid.
  • the working fluid absorbs heat from a heating part in the channel and then moves to a cooling part, and the working fluid condensed with emitting heat in the cooling part is circulated again to the heating part so that the equipment is cooled.
  • FIG. 1 shows a heat dispersion unit 10 installed between a heat source 20 and a heatsink 30 , which is another example of a conventional cooling device.
  • the heat dispersion unit 10 is configured so that a working fluid is filled in an inner space 40 of a thin metallic case 50 , and a wick structure 60 is formed on an inner surface of the metallic case 50 .
  • the heat generated in the heat source 20 is delivered to the wick structure 60 in the heat dispersion unit 10 contacted with the heat source 20 .
  • the working fluid contained in the wick structure 60 is evaporated and dispersed in all directions through the inner space 40 , and then condensed with emitting heat at the wick structure 60 in a cooling region to which the heatsink 30 is installed.
  • the heat emitted in this condensation process is delivered to the heatsink 30 , and then emitted outward by means of forced convection by a cooling fan 70 .
  • Such cooling devices should have a sufficient space for the vapor to flow since the working fluid in a liquid state should be evaporated with absorbing heat from the heat source and the evaporated vapor should be moved again to the cooling region.
  • the flat case since the flat case is kept in a vacuous state (or, a decompressed state), the upper and lower plates of the case are apt to be crushed or distorted during its manufacturing procedure, thereby deteriorating reliability of the product.
  • the present invention is designed to solve the problems of the prior art, and therefore it is an object of the present invention to provide an improved flat plate heat transfer device with a geometric structure that is capable of preventing distortion of the device to ensure reliability of product by firmly supporting a flat case of the flat plate heat transfer device that becomes thinner, and also giving a vapor dispersion channel and a liquid flow channel in an optimized direction for effective heat transfer.
  • the present invention provides a flat plate heat transfer device, one end of which is contacted with a heat source and the other end of which is contacted with a heat emitting unit, the device transferring heat generated at the heat source to the heat emitting unit in a horizontal direction, the device including a thermally-conductive flat case containing a working fluid that is evaporated with absorbing heat from the heat source and condensed with emitting heat to the heat emitting unit; and a mesh aggregate installed in the case and configured so that coarse mesh and fine mesh in which wires are woven to be alternately crossed up and down are vertically laminated with being contacted with each other, wherein the coarse mesh provides main-directional and sub-directional vapor dispersion channels with different sectional areas at each crossing point of mesh wires so that vapor evaporated from the working fluid is capable of flowing therethrough, the main-directional vapor dispersion channel with a relatively larger sectional area being parallel to a heat transfer direction, wherein the fine mesh provides liquid flow channels along a surface of the mesh wires
  • the coarse mesh also preferably has a mesh number from 10 to 60 on the basis of ASTM specification E-11-95.
  • the fine mesh also preferably has a mesh number from 80 to 400 on the basis of ASTM specification E-11-95.
  • the fine mesh is arranged adjacent to the heat source and the coarse mesh is arranged adjacent to the heat emitting unit.
  • the mesh aggregate is configured so that the coarse mesh is interposed between two layers of fine meshes.
  • at least one layer of additional fine mesh may be further provided in at least a part of the coarse mesh interposed between the fine meshes so as to give a liquid channel by interconnecting the fine meshes.
  • the wick structure may be formed by sintered copper, stainless steel, or nickel powder, or by etching polymer, silicon, silica, copper, stainless steel, nickel, or aluminum plate.
  • the case may be made of electrolytic copper foil so that an inner surface having prominence and depression is used as the wick structure.
  • the working fluid is water, ethanol, ammonia, methanol, nitrogen, or Freon.
  • An amount of filled working fluid is preferably 80 to 150% of wick porosity.
  • the case is made of metal, polymer, or plastic, and the metal preferably includes copper, aluminum, stainless steel, molybdenum, or their alloy.
  • a method for manufacturing a flat plate heat transfer device At first, upper and lower plates of the flat case are formed, respectively. And then, a mesh aggregate with a structure that coarse mesh, in which wires are woven to be alternately crossed up and down, and fine mesh, in which wires are woven to be alternately crossed up and down, are laminated vertically is inserted into the flat case.
  • the coarse mesh mainly gives vapor dispersion channels
  • the fine mesh layer mainly gives liquid flow channels.
  • the coarse mesh has main-directional and sub-directional vapor dispersion channels with different sectional areas at each crossing point of mesh wires so that vapor evaporated from the working fluid is capable of flowing therethrough, and when the mesh aggregate is inserted into the flat case, it is important to adjust a direction of the coarse mesh so that the main-directional vapor dispersion channels of the coarse mesh are parallel to a heat transfer direction.
  • a flat case is formed by uniting the upper and lower plates with leaving a working fluid injection hole. And then, an inside of the united case is decompressed into a vacuum through the working fluid injection hole and then a working fluid is injected through the working fluid injection hole. Finally, the flat case with the working fluid injected therein is sealed to complete the flat plate heat transfer device.
  • FIG. 1 is a sectional view showing a conventional flat plate heat transfer device
  • FIG. 2 is a sectional view showing a flat plate heat transfer device according to a preferred embodiment of the present invention
  • FIG. 3 is a sectional view showing a flat plate heat transfer device according to another embodiment of the present invention.
  • FIG. 4 is a plane view showing a structure of a coarse mesh adopted according to a preferred embodiment of the present invention.
  • FIG. 5 is a plane view showing a structure of a fine mesh adopted according to a preferred embodiment of the present invention.
  • FIG. 6 is an enlarged plane view showing a detailed structure of the mesh adopted according to a preferred embodiment of the present invention.
  • FIG. 7 is a sectional side view showing a vapor dispersion channel formed in the mesh according to a preferred embodiment of the present invention, seen in X direction;
  • FIG. 8 is a sectional side view showing a vapor dispersion channel formed in the mesh according to a preferred embodiment of the present invention, seen in Y-direction;
  • FIG. 9 is a sectional side view showing a liquid membrane formed in the mesh according to a preferred embodiment of the present invention.
  • FIG. 10 is a plane view showing a mesh having a liquid membrane similar to FIG. 9 ;
  • FIGS. 14 to 16 are sectional views showing various examples of a flat case used in the flat plate heat transfer device according to the present invention.
  • FIG. 17 is a sectional view showing a flat plate heat transfer device according to still another embodiment of the present invention.
  • FIG. 18 is a sectional view showing a flat plate heat transfer device according to still another embodiment of the present invention.
  • FIG. 19 is a sectional view showing a flat plate heat transfer device according to still another embodiment of the present invention.
  • FIG. 20 is a sectional view showing a flat plate heat transfer device according to still another embodiment of the present invention.
  • FIG. 22 is a sectional view taken along B-B′ line of FIG. 21 ;
  • FIG. 23 is a sectional view taken along C-C′ line of FIG. 22 ;
  • FIG. 2 is a sectional view showing a flat plate heat transfer device according to a preferred embodiment of the present invention.
  • the flat plate heat transfer device 100 of the present invention includes a flat case 130 installed between a heat source 110 and a heat emitting unit 120 such as a heatsink and composed of upper and lower plates 130 a and 130 b, a mesh aggregate G inserted into the flat case 130 , and a working fluid acting as a medium for delivering heat in the flat case 130 .
  • the mesh aggregate G is configured so that a fine mesh 140 in which wires are finely woven to be alternately crossed up and down and a coarse mesh 150 in which wires are coarsely woven to be alternately crossed up and down are laminated to be opposite to each other.
  • fine mesh 140 ’ and ‘coarse mesh 150 ’ are defined according to a relative mesh lattice density, and the fine mesh 140 has a larger mesh number than the coarse mesh 150 .
  • FIGS. 4 and 6 are a plane view showing the entire coarse mesh 150 and an enlarged plane view showing a part of the coarse mesh 150 among the meshes of the mesh aggregate G.
  • the coarse mesh 150 is woven so that widthwise wires 150 a and 150 b and lengthwise wires 150 c and 150 d are alternately crossed with each other.
  • Such a coarse mesh 150 may be made of metal, polymer or plastic wire.
  • the metal is copper, aluminum, stainless steel, molybdenum, or their alloy.
  • the coarse mesh 150 may be made in various shapes such as square, rectangle, or other shapes according to a shape of a desired flat case.
  • the mesh aggregate G of the present invention may be configured as shown in FIG. 3 to include a coarse mesh layer 150 L in which three layers of coarse meshes are laminated, and a fine mesh layer 140 L in which three layers of fine meshes are laminated.
  • the number of layers in the mesh is not limited specially, but may be suitably selected in consideration of cooling capacity of the device or thickness of an electronic equipment.
  • a width M of an opening of the mesh 140 and 150 is generally expressed like the following equation 1.
  • d is a diameter (inch) of the mesh wire
  • N is a mesh number (the number of lattices existing in a length of 1 inch.
  • the coarse mesh 150 acts as a means for giving a vapor dispersion channel through which an evaporated working fluid may flow. More specifically, referring to FIG. 7 that shows a sectional side view of a part of the coarse mesh 150 , taken along A-A′ line of FIG. 6 , the coarse mesh 150 is configured in a way that the widthwise wire 150 a is contacted with the lower surface of the lengthwise wire 150 c, and also contacted with the upper surface of the adjacent lengthwise wire 150 d. Though not shown in the figures, the adjacent widthwise wire 150 b shown in FIG. 6 is arranged in a contrary way.
  • each empty space acts as a vapor dispersion channel Pv.
  • the vapor dispersion channel Pv is formed from a crossing point J of the widthwise wire 150 a and the lengthwise wires 150 c and 150 d along a running direction of the lengthwise wires 150 c and 150 d, and its sectional area is gradually reduced from the crossing point J.
  • the vapor dispersion channel Pv is formed in all of up, down, right and left directions from all crossing points J of the widthwise wires 150 a and 150 b and the lengthwise wires 150 c and 150 d.
  • a vapor may be rapidly dispersed in all directions through such channels.
  • dispersion paths of the vapor through the vapor dispersion channels Pv are depicted by arrow ‘ ’.
  • a maximum sectional area A of the vapor dispersion channel Pv is calculated as follows.
  • the maximum sectional area A of the vapor dispersion channel is increased as the mesh number N is decreased and the diameter d of the mesh wire is increased.
  • the maximum sectional area A is different when it is seen in a running direction Y of the widthwise wires 150 a and 150 b and when it is seen in a running direction X of the lengthwise wires 150 c and 150 d. It is because tension is changed according to the direction of meshes since the woven screen mesh is woven by fixing the widthwise wires 150 a and 150 b or the lengthwise wires 150 c and 150 d firstly and then weaving the other wires thereto like weaving fabrics.
  • the coarse mesh 150 shown in FIG. 6 is a screen mesh that is woven with the lengthwise wires 150 c and 150 d being fixed, the maximum sectional area A of the vapor dispersion channel Pv is larger when seen in X direction than when seen in Y direction.
  • the main direction of the coarse mesh 150 is arranged to be parallel to a heat transfer direction, namely a direction from the heat source 110 to the heat emitting unit 120 in the present invention. Accordingly, a vapor may be rapidly flowed in the heat transfer direction, so the heat transfer performance of the flat plate heat transfer device 100 may be optimized.
  • a liquid membrane 170 is formed in the vapor dispersion channel Pv positioned at the crossing points J of the widthwise wires and the lengthwise wires of the coarse mesh 150 due to the surface tension of the working fluid. Accordingly, an actual sectional area of the vapor dispersion channel Pv through which the vapor may actually flow is reduced as much as an area occupied by the liquid membrane 170 .
  • a ratio of the area of the liquid membrane 170 to the maximum sectional area A of the vapor dispersion channel Pv is decreased as the mesh number N is decreased and the wire diameter d is increased.
  • the mesh number N of the coarse mesh 150 is very large and the wire diameter d is very small, the maximum sectional area A of the vapor dispersion channel Pv is significantly decreased to increase flow resistance, and the vapor dispersion channel Pv is blocked by liquid due to surface tension, thereby not allowing vapor to flow therethrough.
  • it may be adopted as a coarse mesh 150 if the mesh number N is in the range of 10 to 60. At this time, if a diameter d of the mesh wire is 0.17 mm or more, there is no difficulty for vapor to flow through the vapor dispersion channel Pv.
  • a wire diameter d of the coarse mesh 150 is 0.17 to 0.5 mm
  • an opening width M of the mesh is 0.19 to 2.0 mm
  • an opening area of the mesh is 0.036 to 4.0 mm 2 .
  • a liquid membrane 170 is also formed by means of surface tension of the working fluid on a plane at the crossing point J where the widthwise wires 150 a and 150 b and the lengthwise wires 150 c and 150 d of the coarse mesh 150 are crossed while the flat plate heat transfer device is operating.
  • This liquid membrane 170 is interconnected to a liquid membrane 170 that is formed at an adjacent crossing point J (see 180 of FIG. 10 ).
  • connection of the liquid membranes 170 is enabled by control of the width N of the mesh lattice and/or the diameter d of the mesh wire among parameters of the coarse mesh 150 , and it also causes horizontal flow of the working fluid by means of capillary force as mentioned below.
  • dispersion of the evaporated working fluid is chiefly induced in the coarse mesh 150 through the vapor dispersion channel Pv
  • horizontal flow of the liquid is also induced therein by means of the capillary force caused in the interconnected liquid membranes 170 .
  • a direction of the horizontal flow is on average opposite to a heat transfer direction.
  • an amount of the horizontal flow in the coarse mesh 150 is relatively smaller than an amount of horizontal flow of liquid caused through the fine mesh 140 .
  • the fine mesh 140 gives a liquid flow channel. Accordingly, the working fluid condensed at the heat emitting unit 120 is returned near the heat source 110 through the liquid flow channel. More specifically, in a region of the fine mesh 140 that is approximately right above the heat source 110 , evaporation of the working fluid is continuously induced during the heat transfer procedure. The evaporated working fluid is dispersed through the vapor dispersion channel Pv of the coarse mesh 150 to the heat emitting unit 120 that is kept at a lower temperature than the evaporation point of the working fluid. After that, the working fluid is condensed at a region approximately right below the heat emitting unit 120 , and then mainly contained in the liquid membrane of the fine mesh 140 .
  • the flat case may be configured with an electrolytic copper foil that has a rough wick structure with small prominences and depressions about 10 ⁇ m on one side but has a smooth surface on the other side.
  • the surface having a rough wick structure is used as the inner surface of the flat case.
  • the flat plate heat transfer device according to the present invention is manufactured to have a thickness of 0.5 to 2.0 mm, or more than 2.0 mm if necessary.
  • the flat plate heat transfer device may have various shapes such as square, rectangle, T-shape or the like as shown in FIGS. 11 to 13 .
  • the flat case 130 of the flat plate heat transfer device may be configured with an upper case 130 a and a lower case 130 b that are separately provided and then assembled as shown in FIGS. 14 and 15 , or as an integrated one case as shown in FIG. 16 .
  • one end of the lower plate 130 b of the flat plate heat transfer device 100 is adjacent to the heat source 110 , and one end of the upper plate 130 a is provided with the heat emitting unit 120 such as a heatsink or a cooling fan.
  • the heat emitting unit 120 such as a heatsink or a cooling fan.
  • the evaporated working fluid is on average dispersed toward the heat emitting unit 120 .
  • the main direction of the coarse mesh 150 is coincided with the heat transfer direction, or a direction from the heat source 110 to the heat emitting unit 120 , the dispersion of the evaporated working fluid may be optimized.
  • the dispersed vapor is condensed in the fine mesh 140 and the coarse mesh 150 substantially right below the heat emitting unit 120 .
  • the condensation heat generated in this condensation process is delivered to the upper plate 130 a of the flat case 130 , and then subsequently emitted outward by means of conduction, natural convection, or forced convection by, for example, a cooling fan.
  • the working fluid in a condensed liquid state is contained in the fine mesh 140 and the coarse mesh 150 , and then flowed near to the heat source 110 by means of the capillary force caused in the liquid membranes interconnected by continuous evaporation of the working fluid near the heat source 110 so as to be returned to its original position.
  • the liquid is mainly flowed through the fine mesh 140 .
  • the condensed working fluid contained in the coarse mesh 150 is mainly flowed vertically through the crossing points J of the coarse mesh 150 shown in FIG. 10 and then flowed into the fine mesh 140 , though it is also flowed horizontally. In an ideal case, such circulation of the working fluid is kept on until the temperature of the heat source becomes substantially equal to or lower than the evaporation point of the working fluid.
  • the flow of liquid is also optimized, thereby supplying the condensed working fluid to a position near the heat source 110 rapidly.
  • the fine mesh 140 plays a role of an evaporation part at a position right above the heat source 110 , a role of a condensation part at a position right below the heat emitting unit 120 , and a role of an optimized liquid flow channel by means of a capillary force caused in the interconnected liquid membranes as a whole.
  • the coarse mesh 150 plays not only a role of an optimized vapor dispersion channel, but also a role of a condensation part at a position right below the heat emitting unit 120 and a role of a returning path so that the liquid condensed at a position right below the heat emitting unit 120 may be flowed vertically to the fine mesh 140 below the coarse mesh 150 and then returned to its original position.
  • the coarse mesh 150 plays a role of a vapor dispersion channel, there is no need to form an empty space in the flat case 130 so as to provide a separate vapor dispersion channel.
  • the mesh aggregate G supports the upper and lower plates 130 a and 130 b with being interposed between them, so the upper and lower plates 130 a and 130 b are not crushed while a vacuum is formed for filling of the working fluid or while the device is handled.
  • the mesh aggregate G shown in FIG. 2 may have various modifications, which are shown in FIGS. 17 to 23 as examples.
  • the same component in the drawings is indicated with the same reference numeral.
  • FIG. 17 A flat plate heat transfer device according to another embodiment of the present invention is shown in FIG. 17 .
  • fine mesh layers 140 H and 140 L are formed on inner surfaces of the upper and lower plates 130 a and 130 b of the flat case 130 , and a coarse mesh layer 150 acting as a vapor dispersion channel is interposed between the fine mesh layers 140 H and 140 L.
  • the fine mesh layer 140 H or 140 L has at least one layer of fine mesh, as depicted by hatchings, and the coarse mesh layer has at least one layer of coarse mesh, as depicted by dots.
  • the vapor evaporated from the lower fine mesh layer 140 L contacted with the lower plate 130 b is dispersed in all directions through the vapor dispersion channels of the coarse mesh layer 150 and then preferably condensed into a liquid with emitting heat at the upper fine mesh layer 140 H contacted with the upper plate 130 a.
  • the fine mesh layer 140 H or 140 L has a relatively larger mesh number N than the coarse mesh layer 150 , the number of condensation points where the vapor may be condensed is accordingly increased, thereby improving the heat emitting efficiency.
  • the coarse mesh layer 150 gives a returning channel so that the working fluid condensed at the upper fine mesh layer 140 H may flow to the lower fine mesh layer 140 L.
  • the main directions of the coarse mesh layer 150 and the fine mesh layers 140 H and 140 L are arranged to be parallel with the heat transfer direction, thereby optimizing vapor dispersion and liquid flow.
  • FIG. 18 shows still another embodiment of the present invention, wherein at least one layer of fine mesh 140 M is provided in at least a part of the coarse mesh layer 150 interposed between the fine mesh layers 140 H and 140 L so as to interconnect the fine mesh layers 140 H and 140 L for giving a liquid flow channel between them. This makes the working fluid, condensed at the upper fine mesh layer 140 H with emitting heat, be more easily moved to the lower fine mesh layer 140 L.
  • the main directions of the coarse mesh layer 150 and the fine mesh layers 140 H, 140 M and 140 L are arranged to be parallel with the heat transfer direction, thereby optimizing vapor dispersion and liquid flow.
  • a fine mesh layer 140 having at least one layer of fine mesh is provided on the inner surface of the lower plate 130 b of the flat case 130 that is adjacent to the heat source 110 so as to deliver heat to the liquid to be evaporated
  • a coarse mesh layer 150 having at least one layer of coarse mesh is provided on the fine mesh layer 140 so as to give a dispersion channel for the evaporated working fluid.
  • an intermediate mesh layer 140 ′ having at least one layer of intermediate mesh whose mesh number is relatively larger than the coarse mesh and relatively smaller than the fine mesh is provided.
  • the intermediate mesh layer 140 ′ further improves delivery efficiency of the condensation heat of the vapor.
  • the main directions of the coarse mesh layer 150 , the fine mesh layer 140 and the intermediate mesh layer 140 ′ are arranged to be parallel with the heat transfer direction, thereby optimizing vapor dispersion and liquid flow.
  • At least one layer of additional intermediate mesh layer 140 ′′ for interconnecting the intermediate mesh layer 140 ′ and the fine mesh layer 140 may be further provided in at least a part of the coarse mesh layer 150 interposed between the intermediate mesh layer 140 ′ and the fine mesh layer 140 in order to give a liquid flow channel for the working fluid condensed at the intermediate mesh layer 140 ′ toward the fine mesh layer 140 .
  • the additional intermediate mesh layer 140 ′′ may be replaced with the fine mesh layer 140 .
  • FIGS. 21 to 23 show a flat plate heat transfer devices according to still another embodiment of the present invention.
  • FIG. 22 is a plane sectional view taken along B-B′ line of FIG. 21
  • FIG. 23 is a side sectional view taken along C-C′ line of FIG. 22 .
  • the flat plate heat transfer device of this embodiment is more suitably adopted as a flat plate heat pipe.
  • a fine mesh layer 140 is provided in the flat case 130 at a position adjacent to the heat source 110 , and an intermediate mesh layer 140 ′ is provided therein near the heat emitting unit 120 where a working fluid is condensed with emitting heat.
  • the fine mesh layer 140 and the intermediate mesh layer 140 ′ are interconnected by means of a coarse mesh layer 150 .
  • the fine mesh layer 140 acts as an evaporation part of the working fluid
  • the coarse mesh layer 150 acts as a flow channel of vapor
  • the intermediate mesh layer 140 ′ acts as a condensation part of the working fluid.
  • the working fluid is evaporated by means of the heat delivered from the heat source 110 to the fine mesh layer 140 , and the vapor is flowed to the intermediate mesh layer 140 ′ though the vapor dispersion channel of the coarse mesh layer 140 . Subsequently, the vapor is condensed at the intermediate mesh layer 140 ′ with emitting heat to the heat emitting unit 120 . The condensed working fluid in a liquid state is returned again to the evaporation part through the fine mesh layer 140 by means of capillary force.
  • the main directions of the coarse mesh layer 150 , the fine mesh layer 140 and the intermediate mesh layer 140 ′ are arranged to be parallel with the heat transfer direction, thereby optimizing vapor dispersion and liquid flow.
  • vapor flow spaces 200 are preferably formed in the intermediate mesh layer 140 so that the vapor introduced from the coarse mesh layer 150 may flow through them.
  • the vapor passing through the coarse mesh layer 150 is further dispersed everywhere into the intermediate mesh layer 140 ′, so condensation efficiency and heat emitting efficiency may be further improved.
  • the intermediate mesh layer 140 ′ may be replaced with the fine mesh layer 140 .
  • vapor flow spaces identical to the intermediate mesh layer 140 ′ may also be formed in the fine mesh layer 140 .
  • the vapor flow space is not limited to this embodiment, but it may be suitably designed in the flat case to communicate with the coarse mesh so that the vapor passing through the vapor dispersion channels of the coarse mesh may be guided to the vapor condensation part of the fine mesh layer 140 right below the heat emitting unit 120 .
  • the samples 1, 2 and 3 were respectively 120 mm, 50 mm and 1.3 mm in width, length and height, and the mesh used is a copper screen mesh in which a content of copper is at least 99%.
  • the coarse mesh had a wire diameter d of 0.225 mm, a mesh thickness of 0.41 mm and a mesh number of 15, while the fine mesh layer had a wire diameter d of 0.11 mm, a thickness of 0.22 mm and a mesh number of 100.
  • the upper and lower plates of the flat case were sealed by means of denatured acrylic binary bond (HARDLOC TH , made by DENKA in Japan) with leaving a working fluid injection hole.
  • HARDLOC TH denatured acrylic binary bond
  • the inside of the flat case was decompressed to 1.0 ⁇ 10 ⁇ 7 torr with the use of a rotary vacuum pump and a diffusion vacuum pump, and then the flat case was filled with distilled water as a working fluid, and then finally sealed.
  • the heat transfer device in which vapor dispersion and liquid flow are optimized may be a good choice for a heat transfer unit for cooling an electronic equipment owing to its excellent heat transfer performance.
  • the method of the present invention does not require MEMS process or etching process that need a lot of costs, and it is possible to provide a flat plate heat transfer device at low costs with the use of inexpensive mesh and case.
  • the mesh provided in the cooling device prevents the case from being distorted or crushed during the vacuum-forming process or after the device is manufactured, the device may have improved reliability.
  • the flat plate heat transfer device of the present invention shows high heat transfer performance.
  • the flat plate heat transfer device of the present invention may be efficiently used to cool various electronic equipments such as a mobile electronic terminal.

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  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Thermal Sciences (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Heat-Exchange Devices With Radiators And Conduit Assemblies (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
US10/583,514 2003-12-16 2004-12-14 Flat plate heat transfer device and method for manufacturing the same Abandoned US20070163755A1 (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
KR10-2003-0092088 2003-12-16
KR1020030092088A KR100581115B1 (ko) 2003-12-16 2003-12-16 판형 열전달 장치 및 그 제조 방법
PCT/KR2004/003284 WO2005060325A1 (en) 2003-12-16 2004-12-14 Flat plate heat transfer device and method for manufacturing the same

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US20070163755A1 true US20070163755A1 (en) 2007-07-19

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US20090288808A1 (en) * 2008-05-26 2009-11-26 Chi-Te Chin Quick temperature-equlizing heat-dissipating device
US20090321053A1 (en) * 2008-06-05 2009-12-31 Battelle Memorial Institute Enhanced Two Phase Flow in Heat Transfer Systems
US20100157534A1 (en) * 2008-12-24 2010-06-24 Sony Corporation Heat-transporting device and electronic apparatus
US20100157535A1 (en) * 2008-12-24 2010-06-24 Sony Corporation Heat-transporting device and electronic apparatus
US20100157533A1 (en) * 2008-12-24 2010-06-24 Sony Corporation Heat-transporting device, electronic apparatus, and method of producing a heat-transporting device
US20100254090A1 (en) * 2009-04-01 2010-10-07 Harris Corporation Multi-layer mesh wicks for heat pipes
US20110088875A1 (en) * 2009-10-16 2011-04-21 Foxconn Technology Co., Ltd. Loop heat pipe
US20120031587A1 (en) * 2010-08-05 2012-02-09 Kunshan Jue-Choung Electronics Co., Ltd. Capillary structure of heat plate
US20120111541A1 (en) * 2010-11-09 2012-05-10 Foxconn Technology Co., Ltd. Plate type heat pipe and heat sink using the same
US8453717B1 (en) 2009-07-20 2013-06-04 Hrl Laboratories, Llc Micro-architected materials for heat sink applications
US20130213609A1 (en) * 2012-02-22 2013-08-22 Chun-Ming Wu Heat pipe structure
US20130248152A1 (en) * 2012-03-22 2013-09-26 Foxconn Technology Co., Ltd. Heat pipe with one wick structure supporting another wick structure in position
US20130255921A1 (en) * 2012-04-03 2013-10-03 Foxconn Technology Co., Ltd. Heat pipe with grid wick structure having rhombuses
US8573289B1 (en) 2009-07-20 2013-11-05 Hrl Laboratories, Llc Micro-architected materials for heat exchanger applications
US8579018B1 (en) * 2009-03-23 2013-11-12 Hrl Laboratories, Llc Lightweight sandwich panel heat pipe
US8771330B1 (en) 2010-05-19 2014-07-08 Hrl Laboratories, Llc Personal artificial transpiration cooling system
US8857182B1 (en) 2010-05-19 2014-10-14 Hrl Laboratories, Llc Power generation through artificial transpiration
US8921702B1 (en) 2010-01-21 2014-12-30 Hrl Laboratories, Llc Microtruss based thermal plane structures and microelectronics and printed wiring board embodiments
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US20160064306A1 (en) * 2009-02-09 2016-03-03 International Business Machines Corporation Liquid cooled compliant heat sink and related method
US9405067B2 (en) 2013-03-13 2016-08-02 Hrl Laboratories, Llc Micro-truss materials having in-plane material property variations
US20160320143A1 (en) * 2011-12-26 2016-11-03 Foxconn Technology Co., Ltd. Plate type heat pipe with mesh wick structure having opening
US9546826B1 (en) 2010-01-21 2017-01-17 Hrl Laboratories, Llc Microtruss based thermal heat spreading structures
US20180058767A1 (en) * 2016-09-01 2018-03-01 Shinko Electric Industries Co., Ltd. Loop heat pipe
US20200166293A1 (en) * 2018-11-27 2020-05-28 Hamilton Sundstrand Corporation Weaved cross-flow heat exchanger and method of forming a heat exchanger
US11060799B1 (en) * 2020-03-24 2021-07-13 Taiwan Microloops Corp. Vapor chamber structure
US11231235B2 (en) 2017-09-29 2022-01-25 Murata Manufacturing Co., Ltd. Vapor chamber
CN114199057A (zh) * 2021-12-23 2022-03-18 特能(厦门)超导科技有限公司 一种均温板装置及其生产方法
US20220228812A1 (en) * 2021-01-20 2022-07-21 Yi Chang Co., Ltd. Heat Sink
US20220243994A1 (en) * 2021-02-04 2022-08-04 Northrop Grumman Systems Corporation Metal woodpile capillary wick
CN114894015A (zh) * 2022-03-24 2022-08-12 山东大学 一种热管均温板及其换热系统
US11511377B2 (en) * 2014-11-04 2022-11-29 Roccor, Llc Conformal thermal ground planes
US20220404101A1 (en) * 2021-06-18 2022-12-22 Ming-Cheng Chen Heat dissipation net
US20230067112A1 (en) * 2020-02-09 2023-03-02 Unimicron Technology Corp. Vapor chamber structure
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TW200912237A (en) * 2007-09-13 2009-03-16 Univ Tamkang Thermal spreader with enhancement of support strength and capillarity
JP2011085311A (ja) * 2009-10-15 2011-04-28 Sony Corp 熱輸送デバイス、熱輸送デバイスの製造方法及び電子機器
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Cited By (49)

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US20090288808A1 (en) * 2008-05-26 2009-11-26 Chi-Te Chin Quick temperature-equlizing heat-dissipating device
US8813834B2 (en) * 2008-05-26 2014-08-26 Chi-Te Chin Quick temperature-equlizing heat-dissipating device
US8596341B2 (en) * 2008-06-05 2013-12-03 Battelle Memorial Institute Enhanced two phase flow in heat transfer systems
US20090321053A1 (en) * 2008-06-05 2009-12-31 Battelle Memorial Institute Enhanced Two Phase Flow in Heat Transfer Systems
US20100157535A1 (en) * 2008-12-24 2010-06-24 Sony Corporation Heat-transporting device and electronic apparatus
US20100157534A1 (en) * 2008-12-24 2010-06-24 Sony Corporation Heat-transporting device and electronic apparatus
US20100157533A1 (en) * 2008-12-24 2010-06-24 Sony Corporation Heat-transporting device, electronic apparatus, and method of producing a heat-transporting device
US8243449B2 (en) * 2008-12-24 2012-08-14 Sony Corporation Heat-transporting device and electronic apparatus
US10177075B2 (en) 2009-02-09 2019-01-08 International Business Machines Corporation Liquid cooled compliant heat sink and related method
US20160064306A1 (en) * 2009-02-09 2016-03-03 International Business Machines Corporation Liquid cooled compliant heat sink and related method
US10242931B2 (en) * 2009-02-09 2019-03-26 International Business Machines Corporation Liquid cooled compliant heat sink and related method
US10527359B1 (en) 2009-03-23 2020-01-07 Hrl Laboratories, Llc Lightweight sandwich panel heat pipe
US9797661B1 (en) 2009-03-23 2017-10-24 Hrl Laboratories, Llc Method of forming a lightweight sandwich panel heat pipe
US8579018B1 (en) * 2009-03-23 2013-11-12 Hrl Laboratories, Llc Lightweight sandwich panel heat pipe
US8587944B2 (en) * 2009-04-01 2013-11-19 Harris Corporation Multi-layer mesh wicks for heat pipes
US20100254090A1 (en) * 2009-04-01 2010-10-07 Harris Corporation Multi-layer mesh wicks for heat pipes
US9175912B2 (en) 2009-04-01 2015-11-03 Harris Corporation Multi-layer mesh wicks for heat pipes
JP2015092131A (ja) * 2009-04-21 2015-05-14 ユナ ティーアンドイー カンパニーリミテッドＹｏｕｎａ Ｔ＆Ｅ Ｃｏ．，Ｌｔｄ． 太陽光モジュールの冷却装置
US8573289B1 (en) 2009-07-20 2013-11-05 Hrl Laboratories, Llc Micro-architected materials for heat exchanger applications
US8453717B1 (en) 2009-07-20 2013-06-04 Hrl Laboratories, Llc Micro-architected materials for heat sink applications
US20110088875A1 (en) * 2009-10-16 2011-04-21 Foxconn Technology Co., Ltd. Loop heat pipe
US8550150B2 (en) * 2009-10-16 2013-10-08 Foxconn Technology Co., Ltd. Loop heat pipe
US9546826B1 (en) 2010-01-21 2017-01-17 Hrl Laboratories, Llc Microtruss based thermal heat spreading structures
US8921702B1 (en) 2010-01-21 2014-12-30 Hrl Laboratories, Llc Microtruss based thermal plane structures and microelectronics and printed wiring board embodiments
US8857182B1 (en) 2010-05-19 2014-10-14 Hrl Laboratories, Llc Power generation through artificial transpiration
US8771330B1 (en) 2010-05-19 2014-07-08 Hrl Laboratories, Llc Personal artificial transpiration cooling system
US20120031587A1 (en) * 2010-08-05 2012-02-09 Kunshan Jue-Choung Electronics Co., Ltd. Capillary structure of heat plate
US20120111541A1 (en) * 2010-11-09 2012-05-10 Foxconn Technology Co., Ltd. Plate type heat pipe and heat sink using the same
US20160320143A1 (en) * 2011-12-26 2016-11-03 Foxconn Technology Co., Ltd. Plate type heat pipe with mesh wick structure having opening
US20130213609A1 (en) * 2012-02-22 2013-08-22 Chun-Ming Wu Heat pipe structure
US20130248152A1 (en) * 2012-03-22 2013-09-26 Foxconn Technology Co., Ltd. Heat pipe with one wick structure supporting another wick structure in position
US20130255921A1 (en) * 2012-04-03 2013-10-03 Foxconn Technology Co., Ltd. Heat pipe with grid wick structure having rhombuses
US10107561B2 (en) * 2012-04-16 2018-10-23 Furukawa Electric Co., Ltd. Heat pipe
US20150013943A1 (en) * 2012-04-16 2015-01-15 Furukawa Electric Co., Ltd. Heat pipe
US9405067B2 (en) 2013-03-13 2016-08-02 Hrl Laboratories, Llc Micro-truss materials having in-plane material property variations
US11511377B2 (en) * 2014-11-04 2022-11-29 Roccor, Llc Conformal thermal ground planes
US20180058767A1 (en) * 2016-09-01 2018-03-01 Shinko Electric Industries Co., Ltd. Loop heat pipe
US10704838B2 (en) * 2016-09-01 2020-07-07 Shinko Electric Industries Co., Ltd. Loop heat pipe
US11231235B2 (en) 2017-09-29 2022-01-25 Murata Manufacturing Co., Ltd. Vapor chamber
US20200166293A1 (en) * 2018-11-27 2020-05-28 Hamilton Sundstrand Corporation Weaved cross-flow heat exchanger and method of forming a heat exchanger
US20230067112A1 (en) * 2020-02-09 2023-03-02 Unimicron Technology Corp. Vapor chamber structure
US11060799B1 (en) * 2020-03-24 2021-07-13 Taiwan Microloops Corp. Vapor chamber structure
US20220228812A1 (en) * 2021-01-20 2022-07-21 Yi Chang Co., Ltd. Heat Sink
US12007172B2 (en) * 2021-01-20 2024-06-11 Yi Chang Co., Ltd. Heat sink
US20220243994A1 (en) * 2021-02-04 2022-08-04 Northrop Grumman Systems Corporation Metal woodpile capillary wick
US20220404101A1 (en) * 2021-06-18 2022-12-22 Ming-Cheng Chen Heat dissipation net
CN114199057A (zh) * 2021-12-23 2022-03-18 特能(厦门)超导科技有限公司 一种均温板装置及其生产方法
CN114894015A (zh) * 2022-03-24 2022-08-12 山东大学 一种热管均温板及其换热系统
EP4312257A1 (en) * 2022-07-28 2024-01-31 Lenovo (Singapore) Pte. Ltd. Heat radiation structure and electronic apparatus

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KR100581115B1 (ko) 2006-05-16
JP2007519877A (ja) 2007-07-19
TWI266851B (en) 2006-11-21
WO2005060325A1 (en) 2005-06-30
EP1695601A1 (en) 2006-08-30
CN1895011A (zh) 2007-01-10
EP1695601A4 (en) 2010-03-03
TW200523518A (en) 2005-07-16

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