Classifications

• • C—CHEMISTRY; METALLURGY
  • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
  • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
  • C09D177/00—Coating compositions based on polyamides obtained by reactions forming a carboxylic amide link in the main chain; Coating compositions based on derivatives of such polymers
  • C09D177/12—Polyester-amides
• • C—CHEMISTRY; METALLURGY
  • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
  • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
  • C08G18/00—Polymeric products of isocyanates or isothiocyanates
  • C08G18/06—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen
  • C08G18/28—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen characterised by the compounds used containing active hydrogen
  • C08G18/40—High-molecular-weight compounds
  • C08G18/64—Macromolecular compounds not provided for by groups C08G18/42 - C08G18/63
  • C08G18/6415—Macromolecular compounds not provided for by groups C08G18/42 - C08G18/63 having nitrogen
  • C08G18/6438—Polyimides or polyesterimides
• • C—CHEMISTRY; METALLURGY
  • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
  • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
  • C09D179/00—Coating compositions based on macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen, with or without oxygen, or carbon only, not provided for in groups C09D161/00 - C09D177/00
  • C09D179/04—Polycondensates having nitrogen-containing heterocyclic rings in the main chain; Polyhydrazides; Polyamide acids or similar polyimide precursors
  • C09D179/08—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
• • H—ELECTRICITY
  • H01—ELECTRIC ELEMENTS
  • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
  • H01B3/00—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties
  • H01B3/18—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances
  • H01B3/30—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances plastics; resins; waxes
  • H01B3/303—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups H01B3/38 or H01B3/302
  • H01B3/305—Polyamides or polyesteramides
• • H—ELECTRICITY
  • H01—ELECTRIC ELEMENTS
  • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
  • H01B3/00—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties
  • H01B3/18—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances
  • H01B3/30—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances plastics; resins; waxes
  • H01B3/303—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups H01B3/38 or H01B3/302
  • H01B3/306—Polyimides or polyesterimides
• • H—ELECTRICITY
  • H01—ELECTRIC ELEMENTS
  • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
  • H01B3/00—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties
  • H01B3/18—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances
  • H01B3/30—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances plastics; resins; waxes
  • H01B3/42—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances plastics; resins; waxes polyesters; polyethers; polyacetals
  • H01B3/421—Polyesters
• • C—CHEMISTRY; METALLURGY
  • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
  • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
  • C08L67/00—Compositions of polyesters obtained by reactions forming a carboxylic ester link in the main chain; Compositions of derivatives of such polymers
• • C—CHEMISTRY; METALLURGY
  • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
  • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
  • C08L75/00—Compositions of polyureas or polyurethanes; Compositions of derivatives of such polymers
  • C08L75/04—Polyurethanes
• • C—CHEMISTRY; METALLURGY
  • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
  • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
  • C08L77/00—Compositions of polyamides obtained by reactions forming a carboxylic amide link in the main chain; Compositions of derivatives of such polymers
  • C08L77/12—Polyester-amides
• • C—CHEMISTRY; METALLURGY
  • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
  • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
  • C08L79/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen with or without oxygen or carbon only, not provided for in groups C08L61/00 - C08L77/00
  • C08L79/04—Polycondensates having nitrogen-containing heterocyclic rings in the main chain; Polyhydrazides; Polyamide acids or similar polyimide precursors
  • C08L79/08—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
• • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
  • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
  • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
  • Y10T428/00—Stock material or miscellaneous articles
  • Y10T428/29—Coated or structually defined flake, particle, cell, strand, strand portion, rod, filament, macroscopic fiber or mass thereof
  • Y10T428/2913—Rod, strand, filament or fiber
  • Y10T428/2933—Coated or with bond, impregnation or core

Definitions

• the present invention relates to a new wire-coating composition based on new polyester amide imides and polyester amides which provides excellent enamelled surfaces of electrically conductive wires at elevated enamelling speeds, and is useful for coating of electric conductors.
• the wire-coating agents conventionally used nowadays are solutions of enamelled wire binders, such as, THEIC [tris(hydroxyethyl)isocyanurate] polyesters, polyesters, polyamides, polyamide-imides, THEIC polyester imides, polyester imides or polyurethanes in suitable organic solvents such as, cresol, phenol, benzyl alcohol, propylene carbonate or N-methylpyrrolidone, as well as diluents, such as, xylene, other substituted aromatic substances, aliphatic substances and small additions of additives, catalysts and regulators.
• the solvents are evaporated during thermal curing of the wire coating agents. In order to obtain a high-quality coating, it is necessary to drive out the solvents as completely as possible. In addition to the solvents, by-products of the curing reactions pass from the enamelling phase into the gas phase as occurs during crosslinking by condensation reactions.
• the user of the wire coating endeavours to increase the output of enamelled electrically conductive wire as much as possible and to obtain the best possible process for the user.
• Even at elevated enamelling speeds not only the solvent but also cleavage products of the crosslinking reaction have to be removed as completely as possible from the enamel in order to achieve adequate crosslinking.
• the oven temperature or catalysis of the crosslinking reaction or both parameters therefore have to be increased to allow substantial crosslinking despite the relatively short residence time of the wire in the oven.
• the faster crosslinking leads to a rapid increase in viscosity, so the dissipation of solvent and condensation products also has to take place in a much shorter period of time.
• the process window therefore, becomes much smaller and the stability of the wire enamelling process is significantly restricted. The occurrence of specific enamel defects, such as, bubbles or craters is thus almost inevitable.
• EP-A 873198 discusses an enamel which represents a polyamido amine bound to low-molecular acrylates by a Michael reaction.
• DE-A 3133571 proposes a polyurethane wire enamelling system which contains tris(hydroxyethyl)isocyanurate in addition to a polyol and a (blocked) isocyanate component. This system allows a higher enamelling speed than a similar composition without tris(hydroxyethyl)isocyanurate. However, this method is restricted to polyurethane wire enamels.
• DE-A 19648830 proposes a polyester imide wire enamelling resin which allows high enamelling speeds.
• a polyimide is initially produced by reacting polyisocyanate or polyamine with acid or acid anhydride, is reacted with a polyol to form a polyester imide and is subsequently reacted with acid or anhydride.
• This polyester imide is characterised, in particular, in that it also carries a significant number of acid groups in addition to hydroxy groups.
• the enamelling speed is limited by the OH—COOH esterification reaction, which generally takes place more slowly than a transesterification reaction.
• the invention provides wire-coating composition containing resins with nucleophilic groups as well as possibly amide group-containing resins which are capable of crosslinking with one another, comprising
• the wire-coating composition according to the invention allows a significant increase in the enamelling speed without losing the positive properties of standard wire enamels.
• the wire-coating agents according to the invention are stable in storage and exhibit good adhesion to round and profiled electrically conductive wires and have adequate heat shock resistance. An extremely high surface quality is achieved with very good electrical, thermal and mechanical properties, in particular at high enamelling speeds.
• the enamels according to the invention surprisingly also have better adhesion and better mechanical properties than those of the prior art.
• a wire-coating composition which additionally contains phenolic resins and/or melamine resins, catalysts, nano-scale particles and/or element-organic compounds, as well as, optionally conventionally used additives and/or auxiliaries and pigments and/or fillers is preferred.
• Wire-coating compositions of this type comprise
• Resins which are known for the coating of wire may be used as component A). These may be polyesters, also, polyesters with heterocyclic nitrogen-containing rings, for example polyesters with imide and hydantoin and benzimidazole structures condensed into the molecule.
• the polyesters are, in particular, condensation products of polybasic aliphatic, aromatic and/or cycloaliphatic carboxylic acids and the anhydrides thereof, polyhydric alcohols and, in the case of the imide-containing polyesters, polyester amino group-containing compounds, optionally, with a proportion of monofunctional compounds, for example, monohydric alcohols.
• the saturated polyester imides are preferably based on terephthalic acid polyester which may also contain polyols and, as an additional dicarboxylic acid component, a reaction product of diaminodiphenylmethane and trimellitic acid anhydride in addition to diols.
• unsaturated polyester resins and/or polyester imides, as well as, polyacrylates may also be used.
• component A the following may also be used: polyamides, for example, thermoplastic polyamides, aromatic, aliphatic and aromatic-aliphatic, also polyamide imides of the type produced, for example, from trimelletic acid anhydride and diisocyanato-diphenylmethane.
• Unsaturated polyesters and/or polyester imides are preferably used.
• composition according to the invention can additionally contain one or more further binders of the type known and conventional in the wire coating industry.
• these may be, for example, polyesters, polyester imides, polyamides, polyamide imides, THEIC-polyester imides, polytitanic acid ester-THEIC-ester imides, phenolic resins, melamine resins, polymethacrylic imide, polyimides, polybismaleic imides, polyether imides, polybenzoxazine diones, polyhydantoins, polyvinylformals, polyacrylates and derivatives thereof, polyvinylacetals and/or masked isocyanates.
• Polyesters and THEIC-polyester imides are preferably used (Lit.: Behr, “Hochtemperatur maybeige Kunststoffe” Hanser Verlage, Kunststoff 1969; Cassidy, “Thermally Stable Polymers” New York: Marcel Dekker, 1980; Frazer, “High Temperature Resistant Polymers” New York: Interscience, 1968; Mair, Kunststoffe 77 (1987) 204).
• the amide-containing resins of component B) contain ⁇ -carboxy- ⁇ -oxocycloalkyl carboxylic acid amide groups as a component which is instrumental to the invention.
• the ⁇ -carboxy- ⁇ -oxocycloalkyl carboxylic acid amide groups are preferably incorporated in a terminal position.
• the aforementioned ⁇ -carboxy groups are preferably alkyl- or aryl-esterified.
• ⁇ -carboxy- ⁇ -oxocycloalkyl carboxylic acid amides of this type may be produced, on the one hand, from the corresponding carboxylic acid or the reactive derivatives thereof, such as, carboxylic acid halide groups, carboxylic acid anhydride groups or the like by reaction with amine groups.
• amidation auxiliaries such as, dicyclohexylcarbodiimide during synthesis from amine and carboxylic acid.
• the ⁇ -carboxy- ⁇ -oxocycloalkyl carboxylic acids may be obtained, for example, by reaction with haloformic acid esters under basic conditions and subsequent selective saponification.
• 1-carboxy-2-oxocycloalkanes may in turn be obtained synthetically, for example, from 1,n-carboxytic acid diesters by reaction with bases with alcohol cleavage.
• said ⁇ -carboxy- ⁇ -oxocycloalkyl carboxylic acid amides may also be produced by reaction of said 1-carboxy-2-oxocycloalkanes with isocyanates under basic condition.
• Said 1-carboxy-2-oxocycloalkanes may be obtained, for example, from glutaric acid dialkyl esters, glutaric acid diaryl esters, adipic acid dialkyl esters, adipic acid diaryl esters, pimelic acid dialkyl esters, pimelic acid diaryl esters, octanoic dyacid dialkyl esters, octanoic dyacid diaryl esters and the alkyl-, aryl-, alkoxy-, aryloxy-, alkylcarboxy-, arylcarboxy-, halogen- and otherwise substituted derivatives thereof, particularly preferably from adipic acid dimethyl and ethyl ester.
• the aforementioned isocyanates may be, for example, propylene diisocyanate, trimethylene diisocyanate, tetramethyle diisocyanate, pentamethylene diisocyanate, hexamethylene diisocyanate, ethylethylene diisocyanate, 3,3,4-trimethyl hexamethylene diisocyanate, 1,3-cyclopentyl diisocyanate, 1,4-cyclohexyl diisocyanate, 1,2-cyclohexyl diisocyanate, 1,3-phenylene diisocyanate, 1,4-phenylene diisocyanate, 2,5-toluylene diisocyanate, 2,6-toluylene diisocyanate, 4,4′-biphenylene diisocyanate, 1,5-naphthylene diisocyanate, 1,4-naphthylene diisocyanate, 4,4′-diphenylmethane diisocyanate, 2,4′
• Excess urethanes or ureas obtained from said isocyanates obtainable, for example, by reaction with ethylene glycol, propylene glycol, butane diol, 1,3-propane diol, hexane diol, neopentyl glycol, trimethylol propane, glycerine, pentaerythritol and other diols, triols, tetraols, polyols or else amino alcohols, diamines, triamines and polyamines may also be used.
• the aforementioned amines used for amidation may be aliphatic primary diamines, such as, ethylene diamine, propylene diamine, tetramethylene diamine, pentamethylene diamine, hexamethylene diamine, cycloaliphatic diamines such as, 4,4′-dicyclohexylmethane diamine or else triamines, and it is also possible to use secondary amines.
• the amines may also be aromatic amines, such as, diaminodiphenylmethane, phenylene diamine, polynuclear aromatic amines with a functionality of >2, toluylene diamines or corresponding derivatives.
• amines with a further functional group in the molecule for example, amino alcohols such as, monoethanol amine and/or monopropanol amines, or amino acids, such as, glycine, aminopropanoic acids, aminocaproic acids or aminobenzoic acids and the esters thereof.
• amino alcohols such as, monoethanol amine and/or monopropanol amines
• amino acids such as, glycine, aminopropanoic acids, aminocaproic acids or aminobenzoic acids and the esters thereof.
• ⁇ -carboxy- ⁇ -oxocycloalkyl carboxylic acid amide groups may also be incorporated directly into component A). This can be achieved, for example, by reaction of the resin of component A) with di- or polyisocyanates and at least one carboxy- ⁇ -oxocycloalkane.
• the compositions can contain one or more organic solvents, such as, aromatic hydrocarbons, N-methylpyrrolidone, cresols, phenols, xylenols, styrenes, vinyl toluene, methylacrylates.
• organic solvents such as, aromatic hydrocarbons, N-methylpyrrolidone, cresols, phenols, xylenols, styrenes, vinyl toluene, methylacrylates.
• Catalysts such as, tetrabutyl titanate, isopropyl titanate, cresol titanate, the polymeric forms thereof, dibutyl tin dilaurate, further tin catalysts, may be used, individually or in a mixture, as the component D).
• Phenolic resins and/or melamine resins which may be used as the component E) may be, for example, novolaks, obtainable by polycondensation of phenols and aldehydes or polyvinyl formals, obtainable from polyvinyl alcohols and aldehydes and/or ketones.
• Blocked isocyanates such as, NCO-adducts of polyols, amines, C—H-acidic compounds (for example, acetoacetic esters, malonic esters, etc.) and diisocyanates (for example, Lit. Methoden der org. Chemie, Houben-Weyl, Georg Thieme Verlag, Stuttgart, 4th edition, Vol. 14/2, Part 2 “Makromolekulare Stoffe”, 1963, page 61) may also be used as the component E, cresols and/or phenols conventionally being used as blocking agents.
• Conventional additives and auxiliaries of component F include, for example, conventional enamel additives, such as, extenders, plasticising components, accelerators (for example metal salts, substituted amines), initiators (for example photo initiators, heat-responsive initiators), stabilisers (for example, hydroquinones, quinones, alkylphenols, alkylphenol ethers), defoamers and flow control agents.
• conventional enamel additives such as, extenders, plasticising components, accelerators (for example metal salts, substituted amines), initiators (for example photo initiators, heat-responsive initiators), stabilisers (for example, hydroquinones, quinones, alkylphenols, alkylphenol ethers), defoamers and flow control agents.
• Nano-scale particles of component G include particles with an average particle size in the range of 1 to 300 nm, preferably in the range of 2 to 80 nm. These are, for example, inorganic nano-scale particles based on compounds, such as, Si0 2 , Al 2 O 3 , TiO 2 , boronitride, silicon carbide.
• the particles can be, for example, compounds based on an element-oxygen network comprising elements from the series consisting of silicon, zinc, aluminium, tin, boron, germanium, gallium, lead, the transition metals and the lanthanides and actinides, in particular, from the series consisting of silicon, titanium, zinc, yttrium, cerium, vanadium, hafnium, zirconium, nickel and/or tantalum.
• the surface of the element-oxygen network of these particles being modifiable with reactive organic groups, as described, for example, in EP-A 1166283.
• compositions may contain as the component H) pigments and/or fillers, for example based on SiO 2 , Al 2 O 3 , TiO 2 , Cr 2 O 3 , for example, colour-imparting inorganic and/or organic pigments, such as, titanium dioxide or carbon black and effect pigments, such as, metal flake pigments and/or pearlescent pigments.
• component H pigments and/or fillers, for example based on SiO 2 , Al 2 O 3 , TiO 2 , Cr 2 O 3 , for example, colour-imparting inorganic and/or organic pigments, such as, titanium dioxide or carbon black and effect pigments, such as, metal flake pigments and/or pearlescent pigments.
• the coating composition can additionally contain monomeric and/or polymeric element-organic compounds.
• polymeric organo-element compounds include inorganic-organic hybrid polymers of the type mentioned, for example, in DE-A 198 41 977.
• monomeric organo-element compounds include ortho-titanic acid esters and/or ortho-zirconic acid esters such as, nonyl, cetyl, stearyl, triethanolamine, diethanolamine, acetylacetone, acetoacetic ester, tetraisopropyl, cresyl, tetrabutyltitanate and zirconate as well as titanium tetralactate, hafnium and silicon compounds, for example hafnium tetrabutoxide and tetraethyl silicate and/or various silicone resins. Additional polymeric and/or monomeric organo-element compounds of this type may be contained, for example in a content of 0 to 70% by weight, in the composition according to the invention.
• Component A) and component B) can enter chemical reactions during the stoving (baking) process.
• suitable reactions known to the person skilled in the art include, for example, an ester interchange reaction, polymefisation reaction, polyaddition reaction, condensation reaction.
• a polyester amide imide wire coating or a polyester amide wire coating is formed by the chemical reactions during the stoving process.
• composition according to the invention may optionally also be mixed with conventional wire enamels and subsequently be applied by conventional methods.
• the composition according to the invention may be applied by conventional methods independently of the type and diameter of the electrically conductive wire used.
• the wire may be coated directly with the composition according to the invention and subsequently be stoved (baked) in an oven. Coating and stoving may optionally take place several times in succession.
• the ovens may be arranged horizontally or vertically, the coating conditions, such as, duration and number of coatings, stoving temperature, coating speed being adapted to the type of wire to be coated.
• the coating temperatures may lie in a range from room temperature to 400° C.
• ambient temperatures above 400° C. for example of up to 800° C. and higher, may be possible during the enamelling process without affecting the quality of the coating according to the invention.
• the stoving may be supported by irradiation with infrared (IR) and/or near infrared (NIR) radiation with techniques known for a person skilled in the art.
• composition according to the invention may be used independently of the type and diameter of the electrically conductive wire; for example, wires having a diameter of 5 ⁇ m to 6 mm may be coated.
• the conventional metallic conductors made, for example, of copper, aluminium, zinc, iron, gold, silver or alloys thereof may be used as the wires.
• the coating composition according to the invention may be contained as a component of a multilayer enamel.
• This multilayer enamel can contain, for example, at least one coating composition according to the invention.
• the electrically conductive wires may be coated with or without existing finishes.
• Existing finishes may be, for example, insulating coatings and flame-retardant coatings.
• the layer thickness of the coating according to the invention can differ greatly.
• compositions based on polyamides, polyamides imides and polyimides are particularly suitable as topcoats.
• composition according to the invention is also suitable as a single-layer application.
• the composition may be applied in conventional layer thicknesses.
• Thin layers of, for example, 5 to 10 ⁇ m may also be applied without influencing the resistance to partial discharge achieved according to the invention nor the adhesion, strength and extensibility of the finishes.
• the dry layer thickness can vary, according to the standardised values for thin and thick electrically conductive wires, for example, for thin wires in low thicknesses of 5 to 10 ⁇ m, and for thick wires in thicknesses of about 75 to 89 ⁇ m.
• the resultant polyester imide solution has a solids content of 60.3%.
• a viscosity of 1040 mPas (4:4 in cresol, 25° C.) is achieved after 3 hours.
• the mixture is then diluted with 577.2 g cresol and the resin filtered.
• the resultant amidourethane resin solution has a viscosity of 5500 mPas at 25° C. and a solids content of 44.6%.
• the resultant wire enamel has a solids content of 39.7% and a viscosity at 25° C. of 1250 mPas.
• the resultant wire enamel has a solids content of 39.7% and a viscosity at 25° C. of 1250 mPas (corresponding to enamel 6a).
• the resultant wire enamel has a solids content of 39.5% and a viscosity at 25° C. of 1200 mpas.
• the resultant wire enamel has a solids content of 39.9% and a viscosity at 25° C. of 1250 mpas.
• the resultant wire enamel has a solids content of 39.8% and a viscosity at 25° C. of 1310 mPas.
• the resultant wire enamel has a solids content of 39.2% and a viscosity at 25° C. of 1290 mPas.
• the resultant wire enamel has a solids content of 50.4% and a viscosity at 25° C. of 3920 mPas (corresponding to enamel 7a).
• the resultant wire enamel has a solids content of 50.6% and a viscosity at 25° C. of 4300 mpas.
• the resultant wire enamel has a solids content of 39.7% and a viscosity at 25° C. of 1259 mPas (corresponding to enamel 6a).
• the resultant wire enamel has a solids content of 39.5% and a viscosity at 25° C. of 1170 mPas.
• the resultant wire enamel has a solids content of 50.4% and a viscosity at 25° C. of 3920 mPas (corresponding to enamel 7a).
• polyester solution from Example 2 557.6 g of the amide resin solution from Example 5, 3.2 g cresol, 6.3 g benzyl alcohol, 10.3 g cyclohexanone, 13.4 g methyidiglycol, 3.2 g aromatic hydrocarbon mixture A, 9.2 g aromatic hydrocarbon mixture B and 68.0 g conventional commercial surface additives and phenolic resins are made up to an enamel while stirring.
• the resultant wire enamel has a solids content of 49.5% and a viscosity at 25° C. of 4100 mpas.
• 0.65 mm diameter copper wire was enamelled at an oven temperature of 580° C., at 38 and 46 m/min respectively.

Landscapes

• Chemical & Material Sciences (AREA)
• Chemical Kinetics & Catalysis (AREA)
• Spectroscopy & Molecular Physics (AREA)
• Physics & Mathematics (AREA)
• Organic Chemistry (AREA)
• Life Sciences & Earth Sciences (AREA)
• Engineering & Computer Science (AREA)
• Materials Engineering (AREA)
• Wood Science & Technology (AREA)
• Polymers & Plastics (AREA)
• Medicinal Chemistry (AREA)
• Health & Medical Sciences (AREA)
• Paints Or Removers (AREA)
• Organic Insulating Materials (AREA)
• Compositions Of Macromolecular Compounds (AREA)
• Macromolecular Compounds Obtained By Forming Nitrogen-Containing Linkages In General (AREA)
• Insulated Conductors (AREA)

Priority Applications (1)

Applications Claiming Priority (2)

Publications (1)

Family

ID=37492836

Family Applications (1)

Country Status (9)

Cited By (6)

Families Citing this family (12)

Citations (6)

Family Cites Families (9)

• 2006
  • 2006-08-04 US US11/499,060 patent/US20070031672A1/en not_active Abandoned
  • 2006-08-07 CN CN2006800296343A patent/CN101243148B/zh not_active Expired - Fee Related
  • 2006-08-07 KR KR1020087005655A patent/KR20080034990A/ko active IP Right Grant
  • 2006-08-07 EP EP06789511A patent/EP1913106A1/en not_active Withdrawn
  • 2006-08-07 AU AU2006278414A patent/AU2006278414A1/en not_active Abandoned
  • 2006-08-07 WO PCT/US2006/030709 patent/WO2007019434A1/en active Application Filing
  • 2006-08-07 MX MX2008001726A patent/MX2008001726A/es unknown
  • 2006-08-07 JP JP2008526105A patent/JP2009504845A/ja active Pending
  • 2006-08-07 BR BRPI0615965-6A patent/BRPI0615965A2/pt not_active IP Right Cessation

Patent Citations (6)

Also Published As

Similar Documents

Legal Events