US20060237087A1 - Method of forming leads of a packaged semiconductor device - Google Patents
Method of forming leads of a packaged semiconductor device Download PDFInfo
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- US20060237087A1 US20060237087A1 US11/445,180 US44518006A US2006237087A1 US 20060237087 A1 US20060237087 A1 US 20060237087A1 US 44518006 A US44518006 A US 44518006A US 2006237087 A1 US2006237087 A1 US 2006237087A1
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- Prior art keywords
- dies
- leads
- semiconductor device
- die
- bottom dies
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
- H05K13/0092—Treatment of the terminal leads as a separate operation
Definitions
- the present invention relates to lead forming of a semiconductor device.
- a semiconductor device has leads extending through two sides of a package thereof.
- the leads are formed on a semiconductor device after it is covered with a resin.
- a resin for example, when gull-wing type leads are formed in a prior art process, a semiconductor device after covered with a resin is put between top and bottom dies for preliminary bending, so that lead parts extended from the two sides of the semiconductor device are bent with press working. Next, the semiconductor device is put between top and bottom dies for bending, so that distal portions of the lead parts are bent in the reverse direction by press working. Then, the semiconductor device having the gull-wing leads is put between top and bottom dies for adjustment, so as to have a final form.
- a die in an apparatus for bending disclosed in Japanese Patent laid open Publication 6-47445/1994, a die consists of a plurality of components, and one of them is movable. The shape of the die can be changed by moving the movable component. It is to be noted that the publication also does not describe lead forming of a semiconductor device.
- An apparatus for lead bending disclosed in Japanese Patent laid open Publication 10-163396/1998, has a holder for holding the leads at bases thereof and another holder for holding them at edges thereof. When the bending form of lead is changed, the positions at the base and/or at the edge have to be changed. Then, the positions of the holders are adjusted, and the edges of the leads are moved like an arc so as to form the leads.
- the position or the like of a die can be changed according to a work to be processed.
- they cannot realize high precision of the order of for example one micrometer.
- the die assembly for lead bending does not have a punch and a die.
- the lead portions are clamped at a base position and at a forming position, to enforce an arc trajectory so as to form the lead parts.
- forming has low precision consequently.
- these apparatuses only bent the lead portions, and they cannot deal with a complicated form of leads.
- An object of the invention is to form lead parts of a semiconductor device at high precision even when the shape or the like of dies is changed according to the size of the semiconductor device.
- a holder holds a semiconductor device to be formed, the semiconductor device having leads extending from a package thereof.
- Two die assemblies (for bending, for cutting or the like) are set in parallel, each comprising a pair of top and bottom dies matched with each other.
- a mover changes a relative distance between the two die assemblies.
- the top and bottom dies in the two die assemblies are positioned to interpose the leads of the semiconductor device held on said holder and form the leads between them.
- a size of a semiconductor device is measured before lead forming thereof, and the positions of components in the lead forming apparatus is adjusted according to a difference between the measured size and a normal value. Then, the semiconductor device is formed with the adjusted apparatus.
- a size thereof is measured, and the lead forming apparatus is adjusted for lead forming for a next semiconductor device.
- An advantage of the present invention is that a plurality of types of semiconductor devices can be formed by the above-mentioned lead forming apparatus.
- FIG. 1 is a front view of an apparatus for forming leads of a semiconductor device according to a first embodiment of the invention
- FIG. 2 is a diagram of a controller therefor
- FIG. 3 is a part of a side view of the apparatus shown in FIG. 1 ;
- FIG. 4 is a diagram of an example of device holder
- FIG. 5 is a part of a front view of the apparatus shown in FIG. 1 ;
- FIG. 6 is a front view of a process in the apparatus shown in FIG. 5 ;
- FIG. 7 is a diagram for explaining fabrication of semiconductor device of different sizes
- FIG. 8 is a front view of a process in the apparatus shown in FIG. 7 ;
- FIG. 9 is a front view of a die according to a second embodiment of the invention.
- FIG. 10 is a front view of a die according to a third embodiment of the invention.
- FIG. 11 is a front view of a die according to a fourth embodiment of the invention.
- FIG. 12 is a front view of an apparatus for lead forming with cutting according to a fifth embodiment of the invention.
- FIG. 13 is a side view of a part of the apparatus shown in FIG. 1 ;
- FIG. 14 is a front view of an apparatus for lead forming with bending according to a sixth embodiment of the invention.
- FIG. 15 is a flowchart of lead forming according to a seventh embodiment of the invention.
- FIG. 16 is a diagram for explaining a size of a semiconductor device
- FIG. 17 s a flowchart of lead forming according to an eighth embodiment of the invention.
- FIG. 18 is a diagram for explaining a size of a semiconductor device.
- a lead forming apparatus for semiconductor devices has two sets of die assembly including a punch and a die for forming leads at a side of the device in parallel to each other.
- die assemblies of a punch and a die are positioned for bending, cutting or the like at two sides of the device.
- the relative distance between the two sets of die assemblies can be changed by a mover or the like.
- leads of a plurality of types of semiconductor devices can be formed by using the same die assemblies provided for the lead forming apparatus.
- the type of the semiconductor device can be changed automatically, and the capital investment for the dies can be reduced.
- FIG. 1 shows a lead forming apparatus according to the first embodiment of the invention.
- the affixes, “L” and “R”, for the names of the components in the apparatus mean positions when viewed from a front side.
- a semiconductor device as a work to be processes by the lead forming apparatus has lead parts extended from two sides of a resin package thereof, and they are formed as a gull-wing type leads.
- the lead forming apparatus can bend the lead parts without changing the die assemblies, but by changing the relative distances of the two sets of die assemblies.
- a ball screw 12 provided above a base plate 10 and supported by bearings 14 L and 14 R is screwed in the reverse directions at the left and right sides when viewed from the front in FIG. 1 .
- the ball screw 12 is connected at an end thereof with a coupling 16 connected further to a motor 18 .
- the ball screw 12 is rotated by driving the motor 18 .
- Left and right screws provided for the ball screw 12 at the left and right sides thereof are engaged with nuts 10 L and 20 R, and tables 22 L and 22 R are fixed to the nuts 10 L and 20 R.
- a left bottom die 24 L is mounted on the table 22 L, while a right bottom die 24 R is mounted on the table 22 R.
- Top dies 28 L and 28 R supported by a top platen 26 oppose the bottom dies 24 L and 24 R.
- the top platen 26 is pressed down by a pressing machine 30 .
- the top and bottom dies 28 L and 24 L at the left side and those 28 R and 24 R at the right side have shapes in correspondence with a pair of punch and die engaging with each other, respectively.
- the lead forming apparatus includes two pairs of die assemblies each consisting of the top and bottom dies 28 L and 24 L, 28 R and 24 R.
- a sensor 32 is fixed on opposing sides of the tables 22 L and 22 R so as to measure the relative distance between the bottom dies.
- the sensor 32 shown in FIG. 1 is an optical sensor, and an arrow shows schematically an optical path.
- each of the left and right dies forms lead parts extending from a side of the semiconductor device 80 , or the lead parts at the two sides of the semiconductor device are formed at the same time.
- a central processing unit (CPU) 62 in the controller 60 controls the lead forming apparatus.
- the controller 62 acquires signals from the signals 32 and receives setting of a desired position from an input device 64 instructed by an operator. Then, it drives the motor 18 according to a difference of the current and desired positions to rotate the ball screw 12 . Therefore, the relative distance between the dies can be adjusted according to the setting of the desired position.
- a suitable measuring device may be provided at different positions of the dies. The dies can be moved automatically according to the difference of the measurement data with a desired position by using a driver for moving the dies.
- the motor 18 rotates the ball screw 12 to move the nuts 20 L and 20 R
- the nut 20 L and the table 22 L are moved towards or away from the nut 20 R and the table 22 R. That is, the relative distance between the two pairs of dies is changed by rotating the ball screw 12 . Therefore, the relative distance is set by controlling the ball screw 12 .
- the dies at the left and right sides can be moved independently.
- FIG. 3 shows a side view of the platen 26 and one of the top dies 28 R.
- a pair of guide rollers 38 R holding the top die 28 R is supported by a pair of plates 40 R fixed to two sides of the platen 26 .
- the top die 28 R is supported by the pair of guide rollers 38 R fixed to the platen 26 , while it is moved freely to the left and right directions in FIG. 1 .
- the other top die 28 L is supported similarly.
- a semiconductor device 80 with lead parts extended to the right and left directions from a resin package thereof are put by a carrier (not shown) on the device holders 34 L and 34 R provided at the right and left sides.
- the device holders 34 L and 34 R hold a shoulder of the resin package, so that the semiconductor device 80 is put at a predetermined position between the top and bottom dies.
- lead parts at one of sides of the resin package of the semiconductor device 80 are positioned between the left top and bottom dies 28 L and 24 L, while lead parts at the opposite side thereof are positioned between the right top and bottom dies 28 R and 24 R.
- the lead parts held on the device holders are formed by pressing the platen 26 downward by the pressing machine 30 .
- device holders 134 L and 134 R are provided instead of the device holders 34 L and 34 R shown in FIG. 1 .
- the device holders 134 L, 134 R are engaged with a drive axis (ball screw) 70 , and the distance between them is adjusted by a servo motor 74 connected via a coupling 72 to the drive axis 70 .
- a sensor (not shown) is provided to measure the relative distance between them.
- the drive shaft 70 is positioned for example at the depth side of the ball screw 12 shown in FIG. 1 .
- the controller 60 also controls the servo motor 74 . Therefore, the holding position can be adjusted according the package size of the semiconductor device independently of the relative distance between the left and right dies.
- the device holder is integrated with a different component.
- FIG. 5 shows the top dies 28 L, 28 R and the bottom dies 22 L, 22 R in detail.
- a top holder 44 L supports a punch 48 L at a fulcrum 46 L.
- the punch 48 L has a roller SOL at the bottom thereof.
- a cam plate 54 L and a die 56 L are fixed on a bottom holder 52 L.
- a top holder 44 R supports the punch 48 R at a fulcrum 46 R.
- the punch 48 R has a roller 50 R at the bottom thereof.
- a cam plate 54 R and a die 56 R are fixed on a bottom holder 52 R.
- the punch 48 L, 48 R pivots around the fulcrum 46 L, 46 R, and the roller 50 L, 50 R makes contact rotatably with a shoulder or taper formed obliquely to lead the roller 50 L, 50 R towards the inside on the top of the cam plate 54 L, 54 R.
- the shapes of the bottom of the punches 48 L, 48 R and of the top of the dies 56 L, 56 R are designed to form gull-wing leads of the semiconductor device 80 between them.
- the device holders 34 L, 34 R for holding the device 80 are fixed to the dies 56 L, 56 R.
- the left and right bottom and bottom dies 24 L, 28 L, 24 R, 28 R are moved by the ball screw 12 according to the desired size for the semiconductor device 80 .
- the semiconductor device 80 is set by a carrier (not shown) on the device holders 34 L, 34 R at the predetermined position.
- the platen 26 driven by the pressing machine 30 moves the top dies 28 L, 28 R downward (as shown with arrows in FIG. 5 ).
- the rollers 50 L, 5 OR make contact with the shoulders of the cam plates 56 L, 56 R, and the top holders 44 L, 44 R held by the guide roller 38 L, 38 R are moved to the inside.
- the top dies 28 L, 28 R in contact with the leads of the semiconductor device 80 are moved to a bottom dead center by the platen 26 driven by the pressing machine 30 .
- the punches 48 L, 48 R are moved around the fulcrum 46 L, 46 R to the predetermined position by the contact and rotation of the roller 50 L, 5 OR and the cam plate 54 L, 54 R.
- the semiconductor device 80 has the desired shape at the position of bottom dead center according to the engagement of the punch 48 L, 48 R with the die 56 L, 56 R (refer to FIG. 6 ).
- the semiconductor device at the bottom dead center is called as as-formed semiconductor device 81 .
- the ball screw 12 is driven by the motor 18 according to a size of the semiconductor device 82 to move the left and right top and bottom dies 28 L, 24 L, 28 R, 24 R while confirming the position of the dies 24 L, 24 R with the sensor 32 .
- the change of the positions of the dies 28 L, 24 L, 28 R and 24 R is performed just before the engagement thereof by the pressing machine 30 because they form an apparent single die at this position such that the left top die 28 L engages with the left bottom die 24 L and that the right top die 28 R engages with the right bottom die 24 R.
- the semiconductor device 82 is set by a carrier (not shown) at the desired position.
- the top dies 28 L, 28 R and the bottom dies 24 L, 24 R are moved downward by the platen 26 pressed by the pressing machine 30 .
- the top dies 28 L and 28 R in contact with the semiconductor device 82 are moved further to the bottom dead center by the platen 26 pressed by the pressing machine 30 .
- the left punch 48 L is moved around the fulcrum 46 L to the predetermined position according to the contact and rotation of the roller 50 L with the cam plate 54 L, so that the lead parts of the semiconductor device 82 are formed to have the desired sizes at the bottom dead center by the punch 48 L and the die 56 L.
- the right punch 48 R is moved around the fulcrum 46 R to the predetermined position according to the contact and rotation of the roller 5 OR with the cam plate 54 R, so that the lead parts of the semiconductor device 82 are formed to have the desired sizes at the bottom dead center by the punch 48 R and the die 56 RL.
- the semiconductor device at the bottom dead center is an as-formed semiconductor device 83 .
- the lead forming apparatus is similar to that of the first embodiment except the internal structure of the dies. It can adjust the height of the cam at the bottom die.
- FIG. 9 shows a pair of the dies 128 R, 124 R at the right side in the lead forming apparatus.
- the dies 128 L, 124 L at the left side have symmetrical structures with the counterparts 128 R, 124 R, so the dies 128 L, 124 L are not shown.
- the top die 128 R consists of a top holder 144 R, a fulcrum 146 R, a punch 148 R and a roller 150 R. This structure is similar to the counterpart in the first embodiment.
- the bottom die 124 R consists of a bottom holder 152 R, a die 156 R, a cam 154 R, a taper block 155 to be integrated with the cam 154 R, a bottom plate 158 R, an elastic member 162 R and a screw 160 R.
- the die 156 R is fixed on the bottom holder 152 R.
- the taper block 155 R is mounted on the bottom holder 152 R, so that it can be moved in the left direction in FIG. 9 by the screw 160 R engaged with the bottom plate 158 R fixed to an end of the bottom holder 152 R.
- the cam 154 R is mounted on the taper block 155 R so as to be integrated therewith.
- the shapes at the tops of the die 156 R and the cam 154 R are similar to the die 56 R and the cam plate 54 R in the first embodiment.
- the elastic member 162 R provided between the die 156 R and the taper block 155 R pushes the taper block 155 R to the right direction.
- the shapes at the top plane of the taper block 155 R and the bottom plane of the cam 154 R are not in parallel to the top plane of the bottom holder 152 R. Therefore, when the taper block 155 R is moved by the screw 160 R to the left or right, the position and height of the cam 154 R are changed.
- the device holders 34 L, 34 R are fixed to the tables 22 L, 22 R on which the bottom dies 124 L, 124 R are mounted.
- a semiconductor device 84 is set at a predetermined position.
- the platen 26 driven by the pressing machine 30 moves the top die 128 L, 128 R in contact with the semiconductor device 84 to the bottom dead center.
- the punch 148 R is set at the desired position by the die 156 R according to the relative operation of the fulcrum 146 R, the punch 148 R, the roller 15 OR and the cam 154 R.
- the punch 148 R is set at the desired position.
- the lead parts of the semiconductor device 84 are formed to have the desired forms.
- the lead parts do not have the desired forms, they can be adjusted without changing the components in the lead forming apparatus by changing the positions of the cam 156 R and the tape block 155 R with the screw 158 R.
- the screw 160 to move towards the plate 156 R at the top dead center, the taper block 155 R is pushed towards the plate 156 R so that the height of the cam 154 R is decreased.
- the relative distance of the roller 15 OR to the cam 154 R is changed, so as to bend the lead parts of the semiconductor device 64 at a shallower position.
- the screw 160 to the outside at the top dead center, the taper block 155 R is pushed back by the elastic member 162 R so that the height of the cam 154 R is increased.
- the relative distance of the roller 15 OR to the cam 154 R is changed, so as to bend the lead parts of the semiconductor device 64 at a deeper position.
- FIG. 10 is a front view of a die assembly at the right side of the lead forming apparatus.
- a die assembly at the left side is not shown because it has a symmetrical structure.
- the lead forming apparatus can adjust the die height of the bottom die.
- the top die 228 R consists of a top holder 244 R, a fulcrum 246 R, a punch 248 R and a roller 250 R.
- This structure is similar to the right top die 28 R in the first embodiment.
- the bottom die 224 R consists of a bottom holder 252 R, a cam 254 R, a die 256 R, a taper block 257 R to be integrated with the die 256 R, a plate 258 R, a screw 260 R and an elastic member 262 R.
- This die 224 R has a different structure from the bottom die 28 R in the first embodiment.
- the cam 254 R is fixed on the bottom holder 252 R.
- the taper block 257 R is mounted on the bottom holder 252 R, so that it can be moved on the holder 252 R in the left direction in FIG. 9 by the screw 260 R engaged with the plate 258 R fixed to an end of the bottom holder 252 R.
- the die 256 R is mounted on the taper block 257 R so as to be integrated therewith.
- the shapes at the tops of the die 256 R and the cam 254 R are similar to the die 56 R and the cam plate 54 R in the first embodiment.
- the elastic member 262 R is provided between the cam 254 R and the taper block 257 R. The elastic member 262 R acts to push the taper block 257 R in the backward direction.
- the shapes at the top plane of the taper block 257 R and the bottom plane of the die 256 R are not in parallel to the top plane of the bottom holder 252 R.
- the taper block 257 R is moved by the screw 260 R to the left or right, the position of the die 256 R is changed.
- the device holders 34 L, 34 R are mounted to the tables 22 L, 22 R.
- a semiconductor device 86 is set at a predetermined position.
- the platen 26 driven by the pressing machine 30 moves the top die 10 L, 14 R downward to the bottom dead center.
- the punch 248 R is set at the desired position by the die 256 R.
- the lead parts of the semiconductor device 86 are formed to have the desired shapes.
- the punch 248 R is set at the desired position.
- the lead parts of the semiconductor device 86 are formed to have the desired forms.
- the lead parts of the semiconductor device 86 do not have the desired forms, they can be adjusted without changing the components in the lead forming apparatus, by changing the position of the die 256 R and the tape block 257 R with the screw 260 R. For example, by adjusting the screw 260 relative to the plate 258 R at the top dead center, the taper block 257 R is pushed towards the plate 258 R so that the height of the die 256 R is decreased. Thus, the relative distance of the punch 248 R to the die 256 R is changed, so as to bend the lead parts of the semiconductor device 86 at a deeper position.
- the taper block 257 R is pushed back by the elastic member 262 R so that the height of the die 256 R is increased.
- the relative distance of the punch 248 R to the die 256 R is changed, so as to bend the lead parts of the semiconductor device 64 at a shallower position.
- FIG. 11 is a front view of a right die assembly of the lead forming apparatus.
- a die assembly at the left side is not shown because it has a symmetrical structure.
- the lead forming apparatus can adjust the height of the semiconductor device and the bending angle of the lead parts thereof.
- a top holder 344 R supports a punch 348 R at a fulcrum 346 R. Furthermore, the punch 348 R has a roller 350 R at the bottom thereof.
- the structure of the top die 328 R is similar to the top die 28 R in the first embodiment.
- a cam 354 R is fixed on a bottom holder 352 R. Furthermore, a holder 359 R is provided near the cam 354 R to hold a die 358 R for changing the angle.
- a die 356 R is fixed on the bottom holder 352 R, and a screw 357 R is provided to engaged with a screw hole provided in the die 356 R in the left and right direction.
- a taper block 37 is mounted on the bottom holder 352 R, so that it can be moved on the holder 352 R in the left and right direction in FIG. 11 by a screw 361 R engaged with a plate 360 R fixed to an end of the bottom holder 352 R.
- the shapes at the tops of the die 356 R and the die 358 R are formed according to the shape of the leads to be formed.
- a base 36 for holding a semiconductor device 88 is placed on the tape block 37 .
- the shapes at the top of the taper block 37 and the bottom of the base 36 are not in parallel to the top plane of the bottom holder 352 R.
- the device holders 34 L, 34 R are mounted to the tables 22 L, 22 R on which the bottom die 324 is supported.
- the device holders 34 L, 34 R hold shoulders of a resin package of the semiconductor device 88 .
- a semiconductor device 88 is set at a predetermined position on the base 36 , and the pressing machine 30 presses it to the bottom dead center. At this time, according to the relative movement of the fulcrum 346 R, the punch 348 R, the roller 350 R and the cam 354 R, the punch 348 R is set at the desired position by the die 356 R. Similarly in the left die assembly, the punch 348 R is set at the desired position. Thus, the lead parts of the semiconductor device 88 are formed to have the desired forms.
- the lead parts of the semiconductor device 88 do not have the desired forms, they can be adjusted without changing the components in the lead forming apparatus, by adjusting the screw 357 R at the top dead center to move the die 357 R for changing the relative angle of the lead parts to the resin package of the semiconductor device 88 .
- the screw 357 R For example, by moving the screw 357 R towards the inside of the die 356 R, the angle at the edge of lead parts is changed towards a flat position.
- the screw 357 R towards the outside of the die 356 R the angle at the edge of a lead part is changed to have a larger angle relative to the flat position.
- the relative position of the die 358 R is changed by the screw 357 R, so as to change the angle of the die 358 R.
- the taper block 35 is moved to the left so that the height of the base 34 is set higher.
- the screw 361 R in the right direction in FIG. 11 at the top dead center the taper block 35 is moved to the right so that the height of the base 34 is set lower.
- FIG. 12 shows a lead forming apparatus for cutting according to the fifth embodiment of the invention.
- the lead forming apparatus shown in FIG. 12 is similar to the counterpart in the first embodiment shown in FIG. 1 , except the dies 424 R, 428 R, 424 L and 428 L.
- a lead frame has comb-like lead parts connected partially to each other. The lead parts are separated with dies for cutting in the lead forming apparatus.
- the dies 424 R, 428 R, 424 L and 428 L having shapes similar to dents of a comb engage with each other, when viewed from a side thereof.
- FIG. 13 is a side view of the platen 26 and the right top die 428 R. This structure is similar to the platen 26 and the right top die 428 R of the first embodiment shown in FIG.
- device holders 34 L, 34 R are fixed to the tables 22 L, 22 R.
- the device holders shown in FIG. 3 are used.
- a pair of guide rollers 438 R holding the top die 428 R are supported by a pair of plates 440 fixed to both sides of the platen. Therefore, the die 428 R can be moved to the left or to the right while supported by the guide rollers 438 .
- the left top die 428 not shown is supported similarly.
- the controller shown in FIG. 2 is used.
- lead cutting can be performed, without changing the dies, for semiconductor devices having the same lead forms, but having a different size of a resin package thereof.
- the lead forming apparatus can perform lead forming for a semiconductor device having leads at all the four sides thereof.
- the lead forming apparatus has two units shown in FIG. 1 set on a common base plane 510 , and a carrier 560 is provided between them.
- the carrier 560 rotates by 90 degrees a semiconductor device 92 which have been formed by one of the units and carries the rotated device to the other unit.
- the leads of the semiconductor device at all the four sides thereof are formed.
- the died 28 L, 24 L, 28 R and 24 R are moved by the ball screw 12 driven by the motor 18 by an amount in correspondence to a semiconductor device 92 .
- the left nut 20 L and the left table 22 L are moved toward or away from the right nut 20 R and the right table 22 R, to match the size of the semiconductor device 92 .
- the semiconductor device 92 is set on a predetermined position by a carrier (not shown).
- the pressing machine 30 is operated to move the top dies 28 L, 28 R by the platen 26 downward.
- the top dies 28 L, 28 R are moved to the bottom dead center, and the semiconductor device 92 is formed to have the desired shape.
- the semiconductor device 92 has leads at the four sides thereof. After the leads at two sides are formed by the above-mentioned operation, the carrier 560 takes and carries the device 92 for the next step, while rotating it by 90 degrees in the horizontal plane.
- the left nut 20 L and the left table 22 L are moved toward or away from the right nut 20 R and the right table 22 R, to match the size of the semiconductor device 92 .
- the semiconductor device 92 is set on a predetermined position on the device holders by the carrier 560 .
- the pressing machine 30 is operated to move the top dies 28 L, 28 R by the platen 26 downward.
- the top dies 28 L, 28 R are moved to the bottom dead center, and the semiconductor device 92 is formed to have the desired shape of the leads at the other two sides.
- the leads at the four sides of the semiconductor device 92 are formed.
- the lead forming can be performed, without changing the components in the lead forming apparatus, for a semiconductor device having a different size of resin package.
- the shape of the as-formed semiconductor device is not checked at the time of lead forming.
- the devices are checked after production of a lot thereof is completed. Then, based on the quality control data, the dies are adjusted manually if necessary. In the embodiments explained below, each semiconductor device is measured to adjust the positions of the components in the lead forming apparatus, so that semiconductor devices of high quality can be produced.
- FIG. 15 is a flowchart of lead forming by the controller 60 in the lead forming apparatus according to one of the above-mentioned embodiments.
- the relative distance between the left and right dies can be controlled by the ball screw 12 driven by the motor 18 .
- the screw 160 R, 260 R, 357 R, 361 R can be operated by drivers not shown.
- lead forming the size of a semiconductor device before lead forming is measured by a measuring device 66 , and the dies and the device holders are adjusted according to the measured data. Then, the lead forming is performed.
- the measured sizes of the semiconductor device are, for example, size A on a resin package and size B of lead thickness as shown in FIG. 16 .
- the sizes A and B scatter among the semiconductor devices due to shrinkage of the resin or the like, so that optimization due to measured data is effective.
- the size A is measured, and the measured data is received (S 10 ).
- the positions of the device holders 34 L, 34 R are optimized by operating the motor 18 in the lead forming apparatus by an amount based on the measured data (S 12 ).
- the pressing machine 30 is operated for lead forming of the semiconductor device (S 14 ). These steps are repeated.
- the size A of the resin package thereof is measured, and the apparatus is optimized according to the measured size. Then, lead forming is performed. Then, a semiconductor device of high precision can be produced.
- size B of lead thickness in the flow shown in FIG. 15 , the size B of a semiconductor device is measured before lead forming (S 10 ). Then, based on the measured data, the position of the bottom dead center, explained with reference to FIGS. 5 and 6 , is optimized (S 12 ). Then, lead forming of the semiconductor device is performed (S 14 ). These steps are repeated. Thus, a semiconductor device of high precision can be produced.
- the sizes A and B shown in FIG. 16 are controlled.
- a size to be adjusted is not limited to the sizes A and B.
- sizes shown in FIG. 18 referred to later may be used.
- the lead forming apparatus is controlled for each semiconductor device. However, the control may be performed for one among a predetermined amount of semiconductor devices or once per lot.
- a lead forming method according to the eighth embodiment of the invention is explained with reference to a flowchart of the controller 60 shown in FIG. 17 .
- the lead forming method after leads of a semiconductor device are formed by a lead forming apparatus, sizes of the as-formed device are measured by a measurement device 66 . Then the lead forming apparatus is adjusted according to the measured data for following lead forming.
- sizes to be measured are size C of distance between two ends of the leads, size D of a distance between the bottom of a resin package and an end of the lead in the vertical direction, and angle E of the lead edge relative to the bottom plane of the resin package.
- the sizes of the as-formed semiconductor device are measured to receive the measured data (S 22 ).
- the measured data may be an average of the measured data of a plurality of semiconductor devices.
- a difference between the measured data and a normal value is calculated (S 24 ), and the apparatus is adjusted according to the difference, for example, on the position of the screw 160 R, 260 R, 357 R, 361 R (S 24 ), for the feedback for the lead forming of a next semiconductor device.
- size E of a semiconductor device is measured after the semiconductor device is formed by the lead forming apparatus, and a difference between the measured data and the normal value is calculated by the controller 60 , and the positions of the dies in the apparatus are adjusted according to the difference. Then, a next semiconductor device is formed by the adjusted apparatus. For example, if the measured size E is smaller than the normal value, the die 358 R for changing the angle in the lead forming apparatus shown in FIG. 11 is adjusted to have an optimum position. Similarly, as to sizes C and D, if they are different from the normal values, the punch 248 R in the lead forming apparatus shown in FIG. 11 or the die 256 R in the lead forming apparatus shown in FIG. 10 is adjusted.
- a next semiconductor device is formed with the adjusted apparatus.
- a semiconductor device of high quality can be produced.
- the sizes C, D and E shown in FIG. 18 are controlled, but needless to say, a size to be measured is not limited to the sizes C-E.
- the lead forming apparatus can be adjusted automatically according to the type of semiconductor device. Further, investment cost therefor can be reduced.
Abstract
In lead forming of a packaged semiconductor device having sides and leads extending outwardly from the sides of a package, separation between first and second bottom dies is adjusted to receive the package. The first and second bottom dies have top surfaces that include oblique portions. The package is placed between the first and second bottom dies with the leads proximate the top surfaces of the first and second bottom dies. At least one of (i) the first and second bottom dies and (ii) first and second top dies having respective bottom surfaces with oblique portions complementary to the top surfaces of the first and second bottom dies are moved toward each other. The leads are clamped between the top and bottom dies and are formed. Simultaneously, lateral forces, produced through contact of the complementary top and bottom surfaces and the leads, move the first and second top dies laterally, changing separation between the first and second top dies.
Description
- 1. Field of the Invention
- The present invention relates to lead forming of a semiconductor device.
- 2. Description of Prior Art
- A semiconductor device has leads extending through two sides of a package thereof. In a fabrication process of semiconductor device, the leads are formed on a semiconductor device after it is covered with a resin. For example, when gull-wing type leads are formed in a prior art process, a semiconductor device after covered with a resin is put between top and bottom dies for preliminary bending, so that lead parts extended from the two sides of the semiconductor device are bent with press working. Next, the semiconductor device is put between top and bottom dies for bending, so that distal portions of the lead parts are bent in the reverse direction by press working. Then, the semiconductor device having the gull-wing leads is put between top and bottom dies for adjustment, so as to have a final form.
- In the above-mentioned lead forming, when the type of semiconductor device is changed or even if the type is not changed, but the shape of the leads is changed, all of the three die assemblies have to be replaced. That is, the dies are needed for each lead shape of semiconductor device. Therefore, much capital investment, labor and time are needed.
- In the above-mentioned lead forming, exclusive die assemblies each consisting of top and bottom dies are necessary according to a size of a work to be formed. Therefore, it is proposed to use a general die. For example, in the die disclosed in Japanese Utility Model laid open Publication 60-99033/1985 for bending a work such as a wire or a plate with press work, the position of a top die in a die assembly can be changed vertically. Furthermore, one of die assemblies provided at right and left sides can be moved horizontally with a screw. It is to be noted that lead forming of a semiconductor device is not described. Further, in an apparatus for bending disclosed in Japanese Patent laid open Publication 6-47445/1994, a die consists of a plurality of components, and one of them is movable. The shape of the die can be changed by moving the movable component. It is to be noted that the publication also does not describe lead forming of a semiconductor device. An apparatus for lead bending, disclosed in Japanese Patent laid open Publication 10-163396/1998, has a holder for holding the leads at bases thereof and another holder for holding them at edges thereof. When the bending form of lead is changed, the positions at the base and/or at the edge have to be changed. Then, the positions of the holders are adjusted, and the edges of the leads are moved like an arc so as to form the leads.
- Furthermore, in the apparatuses disclosed in Japanese Utility Model laid open Publication 60-99033/1985 and Japanese Patent laid open Publications 6-99033/1994 and 10-163396/1998, the position or the like of a die can be changed according to a work to be processed. However, they cannot realize high precision of the order of for example one micrometer. For example, in the apparatuses shown in Japanese Utility Model laid open Publication 60-99033/1985 and Japanese Patent laid open Publications 6-99033/1994 do not form leads, and they do not take high precision into account, for example, by adjusting the die position with a screw. Furthermore, in the apparatus for lead bending shown in Japanese Patent laid open Publication 10-163396/1998, the die assembly for lead bending does not have a punch and a die. In the apparatus the lead portions are clamped at a base position and at a forming position, to enforce an arc trajectory so as to form the lead parts. However, such forming has low precision consequently. Further, these apparatuses only bent the lead portions, and they cannot deal with a complicated form of leads.
- An object of the invention is to form lead parts of a semiconductor device at high precision even when the shape or the like of dies is changed according to the size of the semiconductor device.
- In a lead forming apparatus for a semiconductor device according to the invention, a holder holds a semiconductor device to be formed, the semiconductor device having leads extending from a package thereof. Two die assemblies (for bending, for cutting or the like) are set in parallel, each comprising a pair of top and bottom dies matched with each other. A mover changes a relative distance between the two die assemblies. The top and bottom dies in the two die assemblies are positioned to interpose the leads of the semiconductor device held on said holder and form the leads between them. Preferably, a size of a semiconductor device is measured before lead forming thereof, and the positions of components in the lead forming apparatus is adjusted according to a difference between the measured size and a normal value. Then, the semiconductor device is formed with the adjusted apparatus. Alternatively, after lead forming of a semiconductor device, a size thereof is measured, and the lead forming apparatus is adjusted for lead forming for a next semiconductor device.
- An advantage of the present invention is that a plurality of types of semiconductor devices can be formed by the above-mentioned lead forming apparatus.
- These and other objects and features of the present invention will become clear from the following description taken in conjunction with the preferred embodiments thereof with reference to the accompanying drawings, and in which:
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FIG. 1 is a front view of an apparatus for forming leads of a semiconductor device according to a first embodiment of the invention; -
FIG. 2 is a diagram of a controller therefor; -
FIG. 3 is a part of a side view of the apparatus shown inFIG. 1 ; -
FIG. 4 is a diagram of an example of device holder; -
FIG. 5 is a part of a front view of the apparatus shown inFIG. 1 ; -
FIG. 6 is a front view of a process in the apparatus shown inFIG. 5 ; -
FIG. 7 is a diagram for explaining fabrication of semiconductor device of different sizes; -
FIG. 8 is a front view of a process in the apparatus shown inFIG. 7 ; -
FIG. 9 is a front view of a die according to a second embodiment of the invention; -
FIG. 10 is a front view of a die according to a third embodiment of the invention; -
FIG. 11 is a front view of a die according to a fourth embodiment of the invention; -
FIG. 12 is a front view of an apparatus for lead forming with cutting according to a fifth embodiment of the invention; -
FIG. 13 is a side view of a part of the apparatus shown inFIG. 1 ; -
FIG. 14 is a front view of an apparatus for lead forming with bending according to a sixth embodiment of the invention; -
FIG. 15 is a flowchart of lead forming according to a seventh embodiment of the invention; -
FIG. 16 is a diagram for explaining a size of a semiconductor device; -
FIG. 17 s a flowchart of lead forming according to an eighth embodiment of the invention; and -
FIG. 18 is a diagram for explaining a size of a semiconductor device. - Referring now to the drawings, wherein like reference characters designate like or corresponding parts throughout the several views, embodiments of the invention are explained below. A lead forming apparatus for semiconductor devices has two sets of die assembly including a punch and a die for forming leads at a side of the device in parallel to each other. In order to form the leads at two sides of a semiconductor device, die assemblies of a punch and a die are positioned for bending, cutting or the like at two sides of the device. In the lead forming apparatus, the relative distance between the two sets of die assemblies can be changed by a mover or the like. Then, leads of a plurality of types of semiconductor devices can be formed by using the same die assemblies provided for the lead forming apparatus. Furthermore, the type of the semiconductor device can be changed automatically, and the capital investment for the dies can be reduced.
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FIG. 1 shows a lead forming apparatus according to the first embodiment of the invention. The affixes, “L” and “R”, for the names of the components in the apparatus mean positions when viewed from a front side. A semiconductor device as a work to be processes by the lead forming apparatus has lead parts extended from two sides of a resin package thereof, and they are formed as a gull-wing type leads. When the lead shapes are the same and only the size of the resin package is different, the lead forming apparatus can bend the lead parts without changing the die assemblies, but by changing the relative distances of the two sets of die assemblies. - In the lead forming apparatus, a
ball screw 12 provided above abase plate 10 and supported bybearings 14L and 14R is screwed in the reverse directions at the left and right sides when viewed from the front inFIG. 1 . The ball screw 12 is connected at an end thereof with acoupling 16 connected further to amotor 18. Thus, theball screw 12 is rotated by driving themotor 18. Left and right screws provided for theball screw 12 at the left and right sides thereof are engaged with nuts 10L and 20R, and tables 22L and 22R are fixed to the nuts 10L and 20R. A left bottom die 24L is mounted on the table 22L, while a right bottom die 24R is mounted on the table 22R. Top dies 28L and 28R supported by atop platen 26 oppose the bottom dies 24L and 24R. Thetop platen 26 is pressed down by apressing machine 30. The top and bottom dies 28L and 24L at the left side and those 28R and 24R at the right side have shapes in correspondence with a pair of punch and die engaging with each other, respectively. Thus, the lead forming apparatus includes two pairs of die assemblies each consisting of the top and bottom dies 28L and 24L, 28R and 24R. Furthermore, asensor 32 is fixed on opposing sides of the tables 22L and 22R so as to measure the relative distance between the bottom dies. Thesensor 32 shown inFIG. 1 is an optical sensor, and an arrow shows schematically an optical path. Still further,device holders device holders semiconductor device 80 at a predetermined position. In the lead forming apparatus, each of the left and right dies forms lead parts extending from a side of thesemiconductor device 80, or the lead parts at the two sides of the semiconductor device are formed at the same time. - As shown in
FIG. 2 , a central processing unit (CPU) 62 in thecontroller 60 controls the lead forming apparatus. On operation, thecontroller 62 acquires signals from thesignals 32 and receives setting of a desired position from aninput device 64 instructed by an operator. Then, it drives themotor 18 according to a difference of the current and desired positions to rotate theball screw 12. Therefore, the relative distance between the dies can be adjusted according to the setting of the desired position. In other embodiments, a suitable measuring device may be provided at different positions of the dies. The dies can be moved automatically according to the difference of the measurement data with a desired position by using a driver for moving the dies. - In the lead forming apparatus, when the
motor 18 rotates theball screw 12 to move the nuts 20L and 20R, thenut 20L and the table 22L are moved towards or away from thenut 20R and the table 22R. That is, the relative distance between the two pairs of dies is changed by rotating theball screw 12. Therefore, the relative distance is set by controlling theball screw 12. Alternatively, by providing ball screws at the left and right sides, the dies at the left and right sides can be moved independently. - The top dies 28L and 28R make contact closely to the
platen 26, but they are not fixed thereto. This makes top dies 28L and 28R follow the shift of bottom dies 24L and 24R by theball screw 12.FIG. 3 shows a side view of theplaten 26 and one of the top dies 28R. In the example shown inFIG. 3 , a pair ofguide rollers 38R holding the top die 28R is supported by a pair ofplates 40R fixed to two sides of theplaten 26. Thus, the top die 28R is supported by the pair ofguide rollers 38R fixed to theplaten 26, while it is moved freely to the left and right directions inFIG. 1 . The other top die 28L is supported similarly. - A
semiconductor device 80 with lead parts extended to the right and left directions from a resin package thereof are put by a carrier (not shown) on thedevice holders device holders semiconductor device 80 is put at a predetermined position between the top and bottom dies. At the position, lead parts at one of sides of the resin package of thesemiconductor device 80 are positioned between the left top and bottom dies 28L and 24L, while lead parts at the opposite side thereof are positioned between the right top and bottom dies 28R and 24R. In the lead forming, the lead parts held on the device holders are formed by pressing theplaten 26 downward by the pressingmachine 30. - In another example shown in
FIG. 4 ,device holders 134L and 134R are provided instead of thedevice holders FIG. 1 . Thedevice holders 134L, 134R are engaged with a drive axis (ball screw) 70, and the distance between them is adjusted by aservo motor 74 connected via acoupling 72 to thedrive axis 70. Furthermore, similarly to the dies shown inFIG. 1 , a sensor (not shown) is provided to measure the relative distance between them. Thedrive shaft 70 is positioned for example at the depth side of theball screw 12 shown inFIG. 1 . In this example, thecontroller 60 also controls theservo motor 74. Therefore, the holding position can be adjusted according the package size of the semiconductor device independently of the relative distance between the left and right dies. Alternatively, the device holder is integrated with a different component. -
FIG. 5 shows the top dies 28L, 28R and the bottom dies 22L, 22R in detail. At the left top die 28L, atop holder 44L supports a punch 48L at a fulcrum 46L. Still further, the punch 48L has a roller SOL at the bottom thereof. At the right bottom die 24L, a cam plate 54L and a die 56L are fixed on abottom holder 52L. Similarly, at the right top die 28R, a top holder 44R supports thepunch 48R at a fulcrum 46R. Still further, thepunch 48R has aroller 50R at the bottom thereof. At the right bottom die 24R, a cam plate 54R and adie 56R are fixed on abottom holder 52R. Thepunch 48L, 48R pivots around the fulcrum 46L, 46R, and theroller roller punches 48L, 48R and of the top of the dies 56L, 56R are designed to form gull-wing leads of thesemiconductor device 80 between them. Though not shown, thedevice holders device 80 are fixed to the dies 56L, 56R. - The operation of the above-mentioned apparatus is explained. First, in order to set the relative distance between two pairs of die assemblies, the left and right bottom and bottom dies 24L, 28L, 24R, 28R are moved by the
ball screw 12 according to the desired size for thesemiconductor device 80. Next, thesemiconductor device 80 is set by a carrier (not shown) on thedevice holders platen 26 driven by the pressingmachine 30 moves the top dies 28L, 28R downward (as shown with arrows inFIG. 5 ). When theplaten 26 is moved further downward while therollers 50L, 5OR make contact with the shoulders of thecam plates 56L, 56R, and thetop holders 44L, 44R held by theguide roller 38L, 38R are moved to the inside. - The top dies 28L, 28R in contact with the leads of the
semiconductor device 80 are moved to a bottom dead center by theplaten 26 driven by the pressingmachine 30. At this time, thepunches 48L, 48R are moved around the fulcrum 46L, 46R to the predetermined position by the contact and rotation of theroller 50L, 5OR and the cam plate 54L, 54R. Thus, thesemiconductor device 80 has the desired shape at the position of bottom dead center according to the engagement of thepunch 48L, 48R with thedie 56L, 56R (refer toFIG. 6 ). The semiconductor device at the bottom dead center is called as as-formedsemiconductor device 81. - As shown in
FIG. 7 , when a semiconductor device having the same shape of the lead parts as the above-mentioned one 80, but having a different size thereof (for example asemiconductor device 82 shown inFIG. 7 ) is formed in the lead forming apparatus, theball screw 12 is driven by themotor 18 according to a size of thesemiconductor device 82 to move the left and right top and bottom dies 28L, 24L, 28R, 24R while confirming the position of the dies 24L, 24R with thesensor 32. The change of the positions of the dies 28L, 24L, 28R and 24R is performed just before the engagement thereof by the pressingmachine 30 because they form an apparent single die at this position such that the left top die 28L engages with the left bottom die 24L and that the right top die 28R engages with the right bottom die 24R. Then, thesemiconductor device 82 is set by a carrier (not shown) at the desired position. Next, the top dies 28L, 28R and the bottom dies 24L, 24R are moved downward by theplaten 26 pressed by the pressingmachine 30. As shown inFIG. 7 , the top dies 28L and 28R in contact with thesemiconductor device 82 are moved further to the bottom dead center by theplaten 26 pressed by the pressingmachine 30. At this time, the left punch 48L is moved around the fulcrum 46L to the predetermined position according to the contact and rotation of theroller 50L with the cam plate 54L, so that the lead parts of thesemiconductor device 82 are formed to have the desired sizes at the bottom dead center by the punch 48L and the die 56L. At the same time, theright punch 48R is moved around the fulcrum 46R to the predetermined position according to the contact and rotation of the roller 5OR with the cam plate 54R, so that the lead parts of thesemiconductor device 82 are formed to have the desired sizes at the bottom dead center by thepunch 48R and the die 56RL. The semiconductor device at the bottom dead center is an as-formedsemiconductor device 83. - Next, a lead forming apparatus according to the second embodiment of the invention is explained. The lead forming apparatus is similar to that of the first embodiment except the internal structure of the dies. It can adjust the height of the cam at the bottom die.
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FIG. 9 shows a pair of the dies 128R, 124R at the right side in the lead forming apparatus. The dies 128L, 124L at the left side have symmetrical structures with the counterparts 128R, 124R, so the dies 128L, 124L are not shown. The top die 128R consists of a top holder 144R, afulcrum 146R, a punch 148R and aroller 150R. This structure is similar to the counterpart in the first embodiment. On the other hand, the bottom die 124R consists of a bottom holder 152R, a die 156R, a cam 154R, a taper block 155 to be integrated with the cam 154R, a bottom plate 158R, an elastic member 162R and ascrew 160R. The die 156R is fixed on the bottom holder 152R. Thetaper block 155R is mounted on the bottom holder 152R, so that it can be moved in the left direction inFIG. 9 by thescrew 160R engaged with the bottom plate 158R fixed to an end of the bottom holder 152R. The cam 154R is mounted on thetaper block 155R so as to be integrated therewith. The shapes at the tops of the die 156R and the cam 154R are similar to thedie 56R and the cam plate 54R in the first embodiment. The elastic member 162R provided between the die 156R and thetaper block 155R pushes the taper block 155R to the right direction. The shapes at the top plane of thetaper block 155R and the bottom plane of the cam 154R are not in parallel to the top plane of the bottom holder 152R. Therefore, when thetaper block 155R is moved by thescrew 160R to the left or right, the position and height of the cam 154R are changed. Though not shown, thedevice holders - The operation of the above-mentioned apparatus is explained. A semiconductor device 84 is set at a predetermined position. Next, the
platen 26 driven by the pressingmachine 30 moves the top die 128L, 128R in contact with the semiconductor device 84 to the bottom dead center. At this time, in the right die assembly, the punch 148R is set at the desired position by the die 156R according to the relative operation of thefulcrum 146R, the punch 148R, the roller 15OR and the cam 154R. Similarly in the left die assembly, the punch 148R is set at the desired position. Thus, the lead parts of the semiconductor device 84 are formed to have the desired forms. - If the lead parts do not have the desired forms, they can be adjusted without changing the components in the lead forming apparatus by changing the positions of the cam 156R and the
tape block 155R with the screw 158R. For example, by adjusting the screw 160 to move towards the plate 156R at the top dead center, thetaper block 155R is pushed towards the plate 156R so that the height of the cam 154R is decreased. Thus, the relative distance of the roller 15OR to the cam 154R is changed, so as to bend the lead parts of thesemiconductor device 64 at a shallower position. On the other hand, by adjusting the screw 160 to the outside at the top dead center, thetaper block 155R is pushed back by the elastic member 162R so that the height of the cam 154R is increased. Thus, the relative distance of the roller 15OR to the cam 154R is changed, so as to bend the lead parts of thesemiconductor device 64 at a deeper position. - Next, a lead forming apparatus according to the third embodiment of the invention is explained.
FIG. 10 is a front view of a die assembly at the right side of the lead forming apparatus. A die assembly at the left side is not shown because it has a symmetrical structure. The lead forming apparatus can adjust the die height of the bottom die. - As shown in
FIG. 10 , the top die 228R consists of a top holder 244R, a fulcrum 246R, a punch 248R and aroller 250R. This structure is similar to the right top die 28R in the first embodiment. On the other hand, the bottom die 224R consists of abottom holder 252R, a cam 254R, a die 256R, ataper block 257R to be integrated with the die 256R, a plate 258R, ascrew 260R and an elastic member 262R. This die 224R has a different structure from the bottom die 28R in the first embodiment. The cam 254R is fixed on thebottom holder 252R. Thetaper block 257R is mounted on thebottom holder 252R, so that it can be moved on theholder 252R in the left direction inFIG. 9 by thescrew 260R engaged with the plate 258R fixed to an end of thebottom holder 252R. The die 256R is mounted on thetaper block 257R so as to be integrated therewith. The shapes at the tops of the die 256R and the cam 254R are similar to thedie 56R and the cam plate 54R in the first embodiment. The elastic member 262R is provided between the cam 254R and thetaper block 257R. The elastic member 262R acts to push the taper block 257R in the backward direction. The shapes at the top plane of thetaper block 257R and the bottom plane of the die 256R are not in parallel to the top plane of thebottom holder 252R. When thetaper block 257R is moved by thescrew 260R to the left or right, the position of the die 256R is changed. Though not shown, thedevice holders - The operation of the above-mentioned apparatus is explained. A semiconductor device 86 is set at a predetermined position. Next, the
platen 26 driven by the pressingmachine 30 moves the top die 10L, 14R downward to the bottom dead center. At this time, in the right die assembly, according to the relative movement of the fulcrum 246R, the punch 248R, theroller 250R and the cam 254R, the punch 248R is set at the desired position by the die 256R. Thus, the lead parts of the semiconductor device 86 are formed to have the desired shapes. Similarly in the left die assembly, the punch 248R is set at the desired position. Thus, the lead parts of the semiconductor device 86 are formed to have the desired forms. - If the lead parts of the semiconductor device 86 do not have the desired forms, they can be adjusted without changing the components in the lead forming apparatus, by changing the position of the die 256R and the
tape block 257R with thescrew 260R. For example, by adjusting the screw 260 relative to the plate 258R at the top dead center, thetaper block 257R is pushed towards the plate 258R so that the height of the die 256R is decreased. Thus, the relative distance of the punch 248R to the die 256R is changed, so as to bend the lead parts of the semiconductor device 86 at a deeper position. On the other hand, by adjusting the screw 260 toward the outside at the top dead center, thetaper block 257R is pushed back by the elastic member 262R so that the height of the die 256R is increased. Thus, the relative distance of the punch 248R to the die 256R is changed, so as to bend the lead parts of thesemiconductor device 64 at a shallower position. - Next, a lead forming apparatus according to the fourth embodiment of the invention is explained.
FIG. 11 is a front view of a right die assembly of the lead forming apparatus. A die assembly at the left side is not shown because it has a symmetrical structure. The lead forming apparatus can adjust the height of the semiconductor device and the bending angle of the lead parts thereof. - As shown in
FIG. 11 , in atop die 328R, a top holder 344R supports apunch 348R at afulcrum 346R. Furthermore, thepunch 348R has aroller 350R at the bottom thereof. The structure of the top die 328R is similar to the top die 28R in the first embodiment. In the bottom die 324R, a cam 354R is fixed on abottom holder 352R. Furthermore, aholder 359R is provided near the cam 354R to hold adie 358R for changing the angle. A die 356R is fixed on thebottom holder 352R, and a screw 357R is provided to engaged with a screw hole provided in the die 356R in the left and right direction. On the other hand, ataper block 37 is mounted on thebottom holder 352R, so that it can be moved on theholder 352R in the left and right direction inFIG. 11 by a screw 361R engaged with aplate 360R fixed to an end of thebottom holder 352R. The shapes at the tops of the die 356R and thedie 358R are formed according to the shape of the leads to be formed. Furthermore, abase 36 for holding asemiconductor device 88 is placed on thetape block 37. The shapes at the top of thetaper block 37 and the bottom of the base 36 are not in parallel to the top plane of thebottom holder 352R. When thetaper block 37 is moved by the screw 357R to the left or right, the position (or height) of thebase 36 is changed. Though not shown, thedevice holders device holders semiconductor device 88. - The operation of the above-mentioned apparatus is explained. A
semiconductor device 88 is set at a predetermined position on thebase 36, and thepressing machine 30 presses it to the bottom dead center. At this time, according to the relative movement of thefulcrum 346R, thepunch 348R, theroller 350R and the cam 354R, thepunch 348R is set at the desired position by the die 356R. Similarly in the left die assembly, thepunch 348R is set at the desired position. Thus, the lead parts of thesemiconductor device 88 are formed to have the desired forms. - If the lead parts of the
semiconductor device 88 do not have the desired forms, they can be adjusted without changing the components in the lead forming apparatus, by adjusting the screw 357R at the top dead center to move the die 357R for changing the relative angle of the lead parts to the resin package of thesemiconductor device 88. For example, by moving the screw 357R towards the inside of the die 356R, the angle at the edge of lead parts is changed towards a flat position. Similarly, by moving the screw 357R towards the outside of the die 356R, the angle at the edge of a lead part is changed to have a larger angle relative to the flat position. Thus, the relative position of thedie 358R is changed by the screw 357R, so as to change the angle of thedie 358R. - Furthermore, by adjusting the screw 361R at the top dead center to move the taper block 35 in the left direction in
FIG. 11 , the taper block 35 is moved to the left so that the height of thebase 34 is set higher. Similarly, by moving the screw 361R in the right direction inFIG. 11 at the top dead center, the taper block 35 is moved to the right so that the height of thebase 34 is set lower. Thus, if the tolerance of the lead position of thesemiconductor device 88 is small, the above-mentioned operation can control the lead shapes within the tolerance. Therefore, the height of thesemiconductor device 88 can be adjusted by changing the height of the base 34 with the screw 361R, without changing the components in the lead forming apparatus. -
FIG. 12 shows a lead forming apparatus for cutting according to the fifth embodiment of the invention. The lead forming apparatus shown inFIG. 12 is similar to the counterpart in the first embodiment shown inFIG. 1 , except the dies 424R, 428R, 424L and 428L. A lead frame has comb-like lead parts connected partially to each other. The lead parts are separated with dies for cutting in the lead forming apparatus. The dies 424R, 428R, 424L and 428L having shapes similar to dents of a comb engage with each other, when viewed from a side thereof.FIG. 13 is a side view of theplaten 26 and the right top die 428R. This structure is similar to theplaten 26 and the right top die 428R of the first embodiment shown inFIG. 3 . Though not shown,device holders FIG. 3 are used. In the example shown inFIG. 13 , a pair ofguide rollers 438R holding the top die 428R are supported by a pair of plates 440 fixed to both sides of the platen. Therefore, thedie 428R can be moved to the left or to the right while supported by the guide rollers 438. The left top die 428 not shown is supported similarly. The controller shown inFIG. 2 is used. In the above-mentioned lead forming apparatus having dies 424R, 428R, 424L and 428L for cutting, lead cutting can be performed, without changing the dies, for semiconductor devices having the same lead forms, but having a different size of a resin package thereof. - Next, a lead forming apparatus according to the sixth embodiment of the invention is explained. It can perform lead forming for a semiconductor device having leads at all the four sides thereof. As shown in
FIG. 14 , the lead forming apparatus has two units shown inFIG. 1 set on acommon base plane 510, and acarrier 560 is provided between them. Thecarrier 560 rotates by 90 degrees asemiconductor device 92 which have been formed by one of the units and carries the rotated device to the other unit. Thus, the leads of the semiconductor device at all the four sides thereof are formed. - In the lead forming, first, in the unit shown at the left in
FIG. 14 , the died 28L, 24L, 28R and 24R are moved by theball screw 12 driven by themotor 18 by an amount in correspondence to asemiconductor device 92. By operating the motor, theleft nut 20L and the left table 22L are moved toward or away from theright nut 20R and the right table 22R, to match the size of thesemiconductor device 92. Then, thesemiconductor device 92 is set on a predetermined position by a carrier (not shown). Next, the pressingmachine 30 is operated to move the top dies 28L, 28R by theplaten 26 downward. The top dies 28L, 28R are moved to the bottom dead center, and thesemiconductor device 92 is formed to have the desired shape. - As mentioned above, the
semiconductor device 92 has leads at the four sides thereof. After the leads at two sides are formed by the above-mentioned operation, thecarrier 560 takes and carries thedevice 92 for the next step, while rotating it by 90 degrees in the horizontal plane. - In the unit shown at the right in
FIG. 14 , by operating themotor 18, theleft nut 20L and the left table 22L are moved toward or away from theright nut 20R and the right table 22R, to match the size of thesemiconductor device 92. Then, thesemiconductor device 92 is set on a predetermined position on the device holders by thecarrier 560. Next, the pressingmachine 30 is operated to move the top dies 28L, 28R by theplaten 26 downward. The top dies 28L, 28R are moved to the bottom dead center, and thesemiconductor device 92 is formed to have the desired shape of the leads at the other two sides. - Thus, the leads at the four sides of the
semiconductor device 92 are formed. The lead forming can be performed, without changing the components in the lead forming apparatus, for a semiconductor device having a different size of resin package. - As will be understood by a person skilled in the art, the components provided in the lead forming apparatuses of the above-mentioned embodiments can be incorporated in various way.
- In a prior art lead forming apparatus, the shape of the as-formed semiconductor device is not checked at the time of lead forming. The devices are checked after production of a lot thereof is completed. Then, based on the quality control data, the dies are adjusted manually if necessary. In the embodiments explained below, each semiconductor device is measured to adjust the positions of the components in the lead forming apparatus, so that semiconductor devices of high quality can be produced.
- Next, a lead forming method according to the seventh embodiment of the invention is explained.
FIG. 15 is a flowchart of lead forming by thecontroller 60 in the lead forming apparatus according to one of the above-mentioned embodiments. In the lead forming apparatus, the relative distance between the left and right dies can be controlled by theball screw 12 driven by themotor 18. Furthermore, thescrew device 66, and the dies and the device holders are adjusted according to the measured data. Then, the lead forming is performed. - The measured sizes of the semiconductor device are, for example, size A on a resin package and size B of lead thickness as shown in
FIG. 16 . The sizes A and B scatter among the semiconductor devices due to shrinkage of the resin or the like, so that optimization due to measured data is effective. Among the various sizes of the semiconductor device before lead forming, as to the size A on the resin package, as shown in the flow ofFIG. 15 , the size A is measured, and the measured data is received (S10). Next, the positions of thedevice holders motor 18 in the lead forming apparatus by an amount based on the measured data (S12). After confirming with thesensor 32 that thedevice holders machine 30 is operated for lead forming of the semiconductor device (S14). These steps are repeated. Thus, before carrying a semiconductor device, the size A of the resin package thereof is measured, and the apparatus is optimized according to the measured size. Then, lead forming is performed. Then, a semiconductor device of high precision can be produced. - Similarly, as to size B of lead thickness, in the flow shown in
FIG. 15 , the size B of a semiconductor device is measured before lead forming (S10). Then, based on the measured data, the position of the bottom dead center, explained with reference toFIGS. 5 and 6 , is optimized (S12). Then, lead forming of the semiconductor device is performed (S14). These steps are repeated. Thus, a semiconductor device of high precision can be produced. - In the above-mentioned example, the sizes A and B shown in
FIG. 16 are controlled. However, needless to say, a size to be adjusted is not limited to the sizes A and B. For example, sizes shown inFIG. 18 referred to later may be used. - In the flow shown in
FIG. 15 , the lead forming apparatus is controlled for each semiconductor device. However, the control may be performed for one among a predetermined amount of semiconductor devices or once per lot. - Next, a lead forming method according to the eighth embodiment of the invention is explained with reference to a flowchart of the
controller 60 shown inFIG. 17 . In the lead forming method, after leads of a semiconductor device are formed by a lead forming apparatus, sizes of the as-formed device are measured by ameasurement device 66. Then the lead forming apparatus is adjusted according to the measured data for following lead forming. In an example, as shown inFIG. 18 , sizes to be measured are size C of distance between two ends of the leads, size D of a distance between the bottom of a resin package and an end of the lead in the vertical direction, and angle E of the lead edge relative to the bottom plane of the resin package. - In the flow shown in
FIG. 17 , after thepressing machine 30 is operated to form leads of a semiconductor device (S20), the sizes of the as-formed semiconductor device are measured to receive the measured data (S22). The measured data may be an average of the measured data of a plurality of semiconductor devices. Then, a difference between the measured data and a normal value is calculated (S24), and the apparatus is adjusted according to the difference, for example, on the position of thescrew - For example, size E of a semiconductor device is measured after the semiconductor device is formed by the lead forming apparatus, and a difference between the measured data and the normal value is calculated by the
controller 60, and the positions of the dies in the apparatus are adjusted according to the difference. Then, a next semiconductor device is formed by the adjusted apparatus. For example, if the measured size E is smaller than the normal value, thedie 358R for changing the angle in the lead forming apparatus shown inFIG. 11 is adjusted to have an optimum position. Similarly, as to sizes C and D, if they are different from the normal values, the punch 248R in the lead forming apparatus shown inFIG. 11 or the die 256R in the lead forming apparatus shown inFIG. 10 is adjusted. Then, a next semiconductor device is formed with the adjusted apparatus. Thus, a semiconductor device of high quality can be produced. In the above-mentioned example, the sizes C, D and E shown inFIG. 18 are controlled, but needless to say, a size to be measured is not limited to the sizes C-E. - As explained above, a plurality of types of semiconductor devices can be formed by the above-mentioned lead forming apparatus. Thus, the lead forming apparatus can be adjusted automatically according to the type of semiconductor device. Further, investment cost therefor can be reduced.
- Although the present invention has been fully described in connection with the preferred embodiments thereof with reference to the accompanying drawings, it is to be noted that various changes and modifications are apparent to those skilled in the art. Such changes and modifications are to be understood as included within the scope of the present invention as defined by the appended claims unless they depart therefrom.
Claims (9)
1-13. (canceled)
14. A method of forming leads of a packaged semiconductor device, the method comprising:
providing a packaged semiconductor device having opposed first and second sides and first and second leads extending outwardly from the first and second sides of the package, respectively;
adjusting separation between first and second bottom dies so the first and second bottom dies receive the package of the packaged semiconductor device between the first and second bottom dies, the first and second bottom dies having respective top surfaces that include oblique portions;
placing the package of the packaged semiconductor device between the first and second bottom dies with the first and second leads proximate the top surfaces of the first and second bottom dies, respectively:
moving at least one of (i) the first and second bottom dies and (ii) first and second top dies having respective bottom surfaces with oblique portions complementary to the top surfaces of the first and second bottom dies, respectively, toward each other;
clamping the first and second leads between the top and bottom surfaces of the first top and bottom dies and between the second top and bottom dies, respectively, and
urging the first top and bottom dies and the second top and bottom dies together, thereby forming the first and second leads, and, simultaneously, producing lateral forces through contact of the complementary top and bottom surfaces and the first and second leads, and, in response to the lateral forces, moving the first and second top dies laterally, relative to the first and second bottom dies, thereby changing separation between the first and second top dies.
15. The method according to claim 14 , wherein the top surfaces of the first and second bottom dies apply cam forces to the first and second top dies, and the first and second top dies roll laterally in response to the cam forces.
16. The method according to claim 15 , including, before clamping the first and second leads, adjusting separations between the top surfaces of the first and second bottom dies and the bottom surfaces of the first and second top dies.
17. The method according to claim 14 , including, before clamping the first and second leads, adjusting separations between the top surfaces of the first and second bottom dies and the bottom surfaces of the first and second top dies.
18. The method according to claim 14 , wherein the top surfaces of the first and second bottom dies include respective separate first and second portions for contacting proximal and distal portions of the first and second leads, respectively, the method including, before clamping the first and second leads, adjusting the second portions of the top surfaces of the first and second bottom dies to adjust an angle at which the first and second leads are formed.
19. The method according to claim 14 , including supporting the package of the packaged semiconductor device between the first and second bottom dies before clamping the first and second leads, without directly placing the first and second leads on the top surfaces of the first and second bottom dies.
20. The method according to claim 14 , including, before clamping the first and second leads, detecting the separation between the first and second bottom dies and adjusting the separation between the first and second bottom dies in response to the separation detected.
21. The method according to claim 14 , wherein the package of the packaged semiconductor device includes opposed third and fourth sides, transverse to the first and second sides, and third and fourth leads extending outwardly from the third and fourth sides, respectively, the method comprising:
after forming the first and second leads, releasing the first and second leads from the first and second top and bottom dies and removing the first and second leads from the first and second top and bottom dies;
rotating the packaged semiconductor device 90°, placing the third and fourth leads opposite the top surfaces of the first and second bottom dies, respectively; and
repeating the moving, clamping, and urging with the third and fourth leads, thereby forming the third and fourth leads.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US11/445,180 US20060237087A1 (en) | 2003-01-07 | 2006-06-02 | Method of forming leads of a packaged semiconductor device |
Applications Claiming Priority (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2003001242A JP2004214497A (en) | 2003-01-07 | 2003-01-07 | Apparatus and method for forming lead of semiconductor device |
JP2003-1242 | 2003-01-07 | ||
US10/613,989 US7077170B2 (en) | 2003-01-07 | 2003-07-08 | Method of forming leads of a semiconductor device |
US11/445,180 US20060237087A1 (en) | 2003-01-07 | 2006-06-02 | Method of forming leads of a packaged semiconductor device |
Related Parent Applications (1)
Application Number | Title | Priority Date | Filing Date |
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US10/613,989 Continuation US7077170B2 (en) | 2003-01-07 | 2003-07-08 | Method of forming leads of a semiconductor device |
Publications (1)
Publication Number | Publication Date |
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US20060237087A1 true US20060237087A1 (en) | 2006-10-26 |
Family
ID=32819318
Family Applications (2)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
US10/613,989 Expired - Fee Related US7077170B2 (en) | 2003-01-07 | 2003-07-08 | Method of forming leads of a semiconductor device |
US11/445,180 Abandoned US20060237087A1 (en) | 2003-01-07 | 2006-06-02 | Method of forming leads of a packaged semiconductor device |
Family Applications Before (1)
Application Number | Title | Priority Date | Filing Date |
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US10/613,989 Expired - Fee Related US7077170B2 (en) | 2003-01-07 | 2003-07-08 | Method of forming leads of a semiconductor device |
Country Status (3)
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US (2) | US7077170B2 (en) |
JP (1) | JP2004214497A (en) |
CN (1) | CN1307703C (en) |
Cited By (1)
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CN108011277A (en) * | 2017-11-24 | 2018-05-08 | 上海航嘉电子科技股份有限公司 | The lead of electronic component extends gauge |
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US20040237112A1 (en) * | 2003-02-21 | 2004-11-25 | Wasilewski Anthony J. | Systems and methods for transfering television-related settings and preferences |
JP2009176789A (en) * | 2008-01-22 | 2009-08-06 | Hitachi Ltd | Lead forming jig for discrete component |
KR101414718B1 (en) | 2008-06-18 | 2014-07-07 | 한미반도체 주식회사 | Punch Press Device for Manufacturing Semiconductor Packages |
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JP6783128B2 (en) * | 2016-12-06 | 2020-11-11 | 三菱電機株式会社 | Lead processing equipment |
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KR101811201B1 (en) * | 2017-02-23 | 2017-12-21 | 주식회사 폴 | Apparatus for forming edge of lead for secondary battery |
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CN114378216B (en) * | 2021-12-11 | 2023-03-14 | 中国科学院长春光学精密机械与物理研究所 | Forming device for axial lead device |
CN116871437B (en) * | 2023-09-06 | 2023-11-10 | 山东中科际联光电集成技术研究院有限公司 | TEC lead molding device and use method thereof |
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- 2003-01-07 JP JP2003001242A patent/JP2004214497A/en active Pending
- 2003-07-08 US US10/613,989 patent/US7077170B2/en not_active Expired - Fee Related
- 2003-09-08 CN CNB031567401A patent/CN1307703C/en not_active Expired - Fee Related
-
2006
- 2006-06-02 US US11/445,180 patent/US20060237087A1/en not_active Abandoned
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CN108011277A (en) * | 2017-11-24 | 2018-05-08 | 上海航嘉电子科技股份有限公司 | The lead of electronic component extends gauge |
Also Published As
Publication number | Publication date |
---|---|
US7077170B2 (en) | 2006-07-18 |
JP2004214497A (en) | 2004-07-29 |
CN1518081A (en) | 2004-08-04 |
US20050076967A1 (en) | 2005-04-14 |
CN1307703C (en) | 2007-03-28 |
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