CN104190821A - Diode pin bending mechanism - Google Patents
Diode pin bending mechanism Download PDFInfo
- Publication number
- CN104190821A CN104190821A CN201410448962.3A CN201410448962A CN104190821A CN 104190821 A CN104190821 A CN 104190821A CN 201410448962 A CN201410448962 A CN 201410448962A CN 104190821 A CN104190821 A CN 104190821A
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- CN
- China
- Prior art keywords
- board
- locating shaft
- chute
- diode
- plate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000005452 bending Methods 0.000 title abstract description 13
- 210000001847 Jaw Anatomy 0.000 claims description 12
- 230000003292 diminished Effects 0.000 claims description 2
- 238000000034 method Methods 0.000 abstract 1
- 230000000694 effects Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
Abstract
The invention provides a diode pin bending mechanism which comprises a vertical board, an upper board and a lower board, wherein the upper board and the lower board are located at the top and the bottom of the vertical board. An upper chute and a lower chute are formed in the bottom of the upper board and the top of the lower board respectively. A sliding block is arranged in the upper chute and the lower chute. An air cylinder is arranged on the vertical board. One end of the air cylinder is connected with the sliding block and the air cylinder drives the sliding block to slide between the upper chute and the lower chute. The sliding block is provided with an upper locating groove and a lower locating groove. An upper locating shaft and a lower locating shaft are arranged in the upper locating groove and the lower locating groove respectively and connected with an upper connecting block and a lower connecting block respectively. The upper connecting block and the lower connecting block are provided with an upper clamping board and a lower clamping board respectively. An upper clamping opening and a lower clamping opening which are opposite in position are formed in the bottom of the upper clamping board and the top of the lower clamping board respectively. The diode pin bending mechanism has the advantages that the problems generated in the manual pin bending process are solved, bending accuracy is high, the rejection rate is low, and production efficiency is high.
Description
Technical field
The present invention relates to diode field, particularly relate to a kind of diode and roll over pin mechanism.
Background technology
Diode claims again crystal diode, is called for short diode, and it is a kind of electronic device that can unidirectional conductive electric current.Diode is in industrial application and extensive, diode in actual production due to actual needs, just need to carry out bending to its pin, traditional folding pin operates by manually completing, bothersome effort, and the angle of pin bending is not controlled, deviation can be produced, therefore, the scrap of some can be produced, increase production cost, greatly reduced production efficiency simultaneously.
Summary of the invention
The diode folding pin mechanism that the object of this invention is to provide a kind of bending automatically.
The present invention is achieved through the following technical solutions above-mentioned purpose: a kind of diode is rolled over pin mechanism, the upper plate and the lower plate that comprise riser and be positioned at described riser top and bottom, the bottom of described upper plate and the top of described lower plate are respectively equipped with upper hopper chute and gliding groove, in described upper hopper chute and gliding groove, be jointly provided with slide block, described riser is provided with cylinder, one end of described cylinder is connected with described slide block, band movable slider slides between upper hopper chute and gliding groove, described slide block is provided with locating slot and lower locating slot, in described upper locating slot and described lower locating slot, be respectively equipped with locating shaft and lower locating shaft, described upper locating shaft and lower locating shaft are connected with respectively contiguous block and lower connecting block, on described upper contiguous block and described lower connecting block, be respectively equipped with train wheel bridge and lower plate, the bottom of described train wheel bridge is respectively equipped with the relative upper jaws in position and lower jaws with the top of described lower plate.
Compared with prior art, the beneficial effect of diode of the present invention folding pin mechanism is: diode folding of the present invention pin mechanism, solved the problem that artificial bending pin occurs, and have that bending precision is high, scrappage is low, production efficiency advantages of higher.
Accompanying drawing explanation
Fig. 1 is the structural representation of a kind of diode folding of the present invention pin mechanism one better embodiment.
In accompanying drawing, the mark of each parts is as follows: 1, riser 2, upper plate, 3, lower plate, 4, cylinder, 5, upper hopper chute, 6, gliding groove, 7, slide block, 8, upper locating slot, 9, lower locating slot, 10, upper contiguous block, 11, lower connecting block, 12, upper locating shaft, 13, lower locating shaft, 14, train wheel bridge, 15, lower plate, 16, upper jaws, 17, lower jaws.
The specific embodiment
Refer to accompanying drawing 1, a kind of diode is rolled over pin mechanism, the upper plate 2 and the lower plate 3 that comprise riser 1 and be positioned at described riser 1 top and bottom, described upper plate 2 is parallel to each other with described lower plate 3, the top of the bottom of described upper plate 2 and described lower plate 3 is respectively equipped with upper hopper chute 5 and gliding groove 6, described upper cunning, 5 are parallel to each other with described gliding groove 6, the interior slide block 7 that is jointly provided with of described upper hopper chute 5 and gliding groove 6, described riser 1 is provided with cylinder 4, one end of described cylinder 4 is connected with described slide block 7, band movable slider 7 slides between upper hopper chute 5 and gliding groove 6, described slide block 7 is provided with locating slot 8 and lower locating slot 9, in described upper locating slot 8 and described lower locating slot 9, be respectively equipped with locating shaft 12 and lower locating shaft 13, distance between described upper locating shaft 12 and described lower locating shaft 13 is slided and is diminished with slide block 7, described upper locating shaft 12 and lower locating shaft 13 are connected with respectively contiguous block 10 and lower connecting block 11, on described upper contiguous block 10 and described lower connecting block 11, be respectively equipped with train wheel bridge 14 and lower plate 15, the top of the bottom of described train wheel bridge 14 and described lower plate 15 is respectively equipped with the relative upper jaws 16 in position and lower jaws 17, the pin of diode is between upper jaws 16 and lower jaws 17, cylinder 4 band movable sliders 7 slide between upper hopper chute 5 and gliding groove 6, upper locating slot 8 and lower locating slot are symmetrical Shang Xia 9, spacing between upper locating slot 8 and lower locating slot 9 reduces gradually along slide block movement direction, therefore, cause the spacing between locating shaft 12 and lower locating shaft 13 to reduce gradually, thereby drive train wheel bridge 14 and the pressing of lower plate 15 to move, upper jaws 16 and lower jaws 17 are by therebetween diode pin bending, after completing, cylinder 4 back moves, band movable slider 7 slides between upper hopper chute 5 and gliding groove 6, spacing between upper locating slot 8 and lower locating slot 9 increases gradually along slide block movement direction, therefore, cause the spacing between locating shaft 12 and lower locating shaft 13 to increase gradually, thereby drive the action of unclamping of train wheel bridge 14 and lower plate 15, move in circles.
Diode of the present invention folding pin mechanism, has solved the problem that artificial bending pin occurs, has that bending precision is high, scrappage is low, production efficiency advantages of higher.
Above-described is only some embodiments of the present invention.For the person of ordinary skill of the art, without departing from the concept of the premise of the invention, can also make some distortion and improvement, these all belong to protection scope of the present invention.
Claims (4)
1. a diode is rolled over pin mechanism, it is characterized in that: the upper plate and the lower plate that comprise riser and be positioned at described riser top and bottom, the bottom of described upper plate and the top of described lower plate are respectively equipped with upper hopper chute and gliding groove, in described upper hopper chute and gliding groove, be jointly provided with slide block, described riser is provided with cylinder, one end of described cylinder is connected with described slide block, band movable slider slides between upper hopper chute and gliding groove, described slide block is provided with locating slot and lower locating slot, in described upper locating slot and described lower locating slot, be respectively equipped with locating shaft and lower locating shaft, described upper locating shaft and lower locating shaft are connected with respectively contiguous block and lower connecting block, on described upper contiguous block and described lower connecting block, be respectively equipped with train wheel bridge and lower plate, the bottom of described train wheel bridge is respectively equipped with the relative upper jaws in position and lower jaws with the top of described lower plate.
2. diode according to claim 1 is rolled over pin mechanism, it is characterized in that: described upper plate and described lower plate are parallel to each other.
3. diode according to claim 1 is rolled over pin mechanism, it is characterized in that: described upper hopper chute and described gliding groove are parallel to each other.
4. diode according to claim 1 is rolled over pin mechanism, it is characterized in that: the distance between described upper locating shaft and described lower locating shaft is slided and diminished with slide block.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410448962.3A CN104190821A (en) | 2014-09-04 | 2014-09-04 | Diode pin bending mechanism |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410448962.3A CN104190821A (en) | 2014-09-04 | 2014-09-04 | Diode pin bending mechanism |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN104190821A true CN104190821A (en) | 2014-12-10 |
Family
ID=52076268
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201410448962.3A Pending CN104190821A (en) | 2014-09-04 | 2014-09-04 | Diode pin bending mechanism |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN104190821A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106391925A (en) * | 2016-11-09 | 2017-02-15 | 扬州扬杰电子科技股份有限公司 | Bending mechanism for chip diode and work method of bending mechanism |
Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7077170B2 (en) * | 2003-01-07 | 2006-07-18 | Renesas Technology Corp. | Method of forming leads of a semiconductor device |
| CN201711459U (en) * | 2010-05-11 | 2011-01-19 | 成都新易盛通信技术有限公司 | Integrated device of optical device pin cutting and bending shaping clamp |
| CN203343727U (en) * | 2013-06-27 | 2013-12-18 | 苏州菱欧自动化设备有限公司 | Cam absorbing and clamping positioning mechanism |
| CN203380300U (en) * | 2013-05-29 | 2014-01-08 | 蚌埠市正园电子科技有限公司 | Efficient resistance pin beveling device |
| CN104014694A (en) * | 2014-06-12 | 2014-09-03 | 苏州乔岳软件有限公司 | Bending mechanism |
| CN204035411U (en) * | 2014-09-04 | 2014-12-24 | 苏州承乐电子科技有限公司 | A kind of diode folding pin mechanism |
-
2014
- 2014-09-04 CN CN201410448962.3A patent/CN104190821A/en active Pending
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7077170B2 (en) * | 2003-01-07 | 2006-07-18 | Renesas Technology Corp. | Method of forming leads of a semiconductor device |
| CN201711459U (en) * | 2010-05-11 | 2011-01-19 | 成都新易盛通信技术有限公司 | Integrated device of optical device pin cutting and bending shaping clamp |
| CN203380300U (en) * | 2013-05-29 | 2014-01-08 | 蚌埠市正园电子科技有限公司 | Efficient resistance pin beveling device |
| CN203343727U (en) * | 2013-06-27 | 2013-12-18 | 苏州菱欧自动化设备有限公司 | Cam absorbing and clamping positioning mechanism |
| CN104014694A (en) * | 2014-06-12 | 2014-09-03 | 苏州乔岳软件有限公司 | Bending mechanism |
| CN204035411U (en) * | 2014-09-04 | 2014-12-24 | 苏州承乐电子科技有限公司 | A kind of diode folding pin mechanism |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106391925A (en) * | 2016-11-09 | 2017-02-15 | 扬州扬杰电子科技股份有限公司 | Bending mechanism for chip diode and work method of bending mechanism |
| CN106391925B (en) * | 2016-11-09 | 2018-06-08 | 扬州扬杰电子科技股份有限公司 | The bending mechanism and its method of work of a kind of stamp-mounting-paper diode |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| C02 | Deemed withdrawal of patent application after publication (patent law 2001) | ||
| WD01 | Invention patent application deemed withdrawn after publication |
Application publication date: 20141210 |