CN1188985A - Lead bending machine for electronic components - Google Patents
Lead bending machine for electronic components Download PDFInfo
- Publication number
- CN1188985A CN1188985A CN 97123024 CN97123024A CN1188985A CN 1188985 A CN1188985 A CN 1188985A CN 97123024 CN97123024 CN 97123024 CN 97123024 A CN97123024 A CN 97123024A CN 1188985 A CN1188985 A CN 1188985A
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- lead
- wire
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- electronic component
- driving mechanism
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Abstract
A general-purpose lead bending machine for electronic components that is capable of bending leads of various types of electronic components without a need of a great variety of benders. The machine includes a lead holding device for holding the distal end of a lead of an electronic component. A first driving mechanism causes the lead holding device to move along a first axis of travel. A second driving mechanism causes the lead holding device to move along a second axis of travel perpendicularly intersecting the first axis of travel. A control device controls the first driving mechanism and the second driving mechanism such that the lead holding device holding the lead of the electronic component moves along an approximately circular arc-shaped locus, thereby bending the lead of the electronic component.
Description
The present invention relates to make the lead-in wire of electronic component to do circular-arc motion and just can make lead-in wire crooked and can on electronic component, not produce the leads of electronic component bending apparatus of undue power, particularly relate to the leads of electronic component bending apparatus of the electronic component that can process corresponding multiple shape.
The lead-in wire bending machining of the electronic component of LSI etc. is carried out with processing method for stamping usually, sometimes can add excessive power with spun gold to LSI encapsulation or bonding, makes these wounds that is partially damaged.So the inventor has proposed a kind of scheme: use the sort of bending mould that constitutes by movable drift and movable punch die of special fair 7-95576 communique, make the lead-in wire of electronic component do circular-arc motion and process.
Use the sort of bending mould of the fair 7-95576 communique of existing spy, because shape, length and the crooked size of electronic component have many types, so must use special-purpose bending mould to every kind of electronic component.For this reason, just need multiple bending mould.The result becomes the increase that increases the processing charges that brings because of the cost of bending mould for making.In addition, because the manufacturing bending mould of will taking time, so have the shortcoming of the leads of electronic component bending machining of dealing with new varieties of will taking time.Also have, when the processing operation of reality, also will take time and the time corresponding to the kind exchange bending mould of electronic component, so the reason that has become to make working (machining) efficiency to reduce.
So, the purpose of this invention is to provide a kind of lead bending machine that does not need the electronic component of the leads of electronic component bending machining that multiple bending mould just can carry out various kinds generally.
To achieve these goals, the lead bending machine of the electronic component among the present invention has the lead-in wire holding device that keeps the leads of electronic component top; First driving mechanism that above-mentioned lead-in wire holding device is moved along first shifting axle; Second driving mechanism that above-mentioned lead-in wire holding device is moved along second shifting axle vertical with above-mentioned first shifting axle; Control above-mentioned first driving mechanism and second driving mechanism, the above-mentioned lead-in wire holding device of the lead-in wire that maintains above-mentioned electronic component is moved along circular-arc substantially track, with the control device of the bending machining of carrying out above-mentioned leads of electronic component.
In addition, in above-mentioned leads of electronic component bender, above-mentioned lead-in wire holding device it is desirable to by can the first lead-in wire retaining member and the second lead-in wire retaining member approaching, that can leave constituting.
In addition, in above-mentioned leads of electronic component bender, above-mentioned first driving mechanism is a mechanism of containing ball bolt and ball nut, above-mentioned second driving mechanism is to contain the ball bolt of the above-mentioned first lead-in wire retaining member of driving and the mechanism of ball nut, and, it is desirable to the cylinder device that the above-mentioned second lead-in wire retaining member is advanced towards the above-mentioned first lead-in wire retaining member.
In above-mentioned leads of electronic component bender, it is desirable to have the lead-in wire supportive device, be used for supporting the root of leads of electronic component with stationary state.
In above-mentioned leads of electronic component bender, it is desirable to above-mentioned lead-in wire supportive device and support fixed component and relative above-mentioned lead-in wire to support fixed component to support that movable link constitutes near the lead-in wire that can leave by the lead-in wire of fixed-site.
In above-mentioned leads of electronic component bender, it is desirable to have the 3rd driving mechanism, be used to make above-mentioned lead-in wire to support movable link to support that along above-mentioned second shifting axle towards above-mentioned lead-in wire fixed component moves.
In above-mentioned leads of electronic component bender, it is desirable to above-mentioned the 3rd driving mechanism is the mechanism of containing ball bolt and ball nut.The ball bolt of above-mentioned second driving mechanism and the ball bolt of above-mentioned the 3rd driving mechanism are an integral body, constitute the identical opposite bolt of pitch.
In above-mentioned leads of electronic component bender, it is desirable to have the input electronic element lead-in wire curved shape each size input unit and with the arithmetic unit of each sized data computing of having imported into from above-mentioned input unit and the holding position that determines above-mentioned lead-in wire holding device and circular-arc motion track.
Because the present invention constitutes as described above, so have following effect.
Can deal with the lead-in wire curved shape size of polytype electronic component with versatility, owing to also do not need to exchange bending mould, so can good efficiency carry out bending machining, also have, the electronic component that adapts to new varieties also is simple.
Owing to can take the way of the lead-in wire curved shape size of input electronic element, each parameter of the motion track of the lead-in wire of computing automatically bending machining is carried out bending machining then, so the operation of device is simple, anybody can operate.
Moving and support in the propelling device driven of lead-in wire supportive device of lead-in wire root at the y-axis shift of the lead-in wire holding device that drive to keep the guide-wire tip part with ball bolt with an opposite bolt, can reduce the number of Control Shaft, can simplify the formation of control device thereby can reduce cost.
Fig. 1 is the whole oblique view of electric leads bending apparatus of the present invention.
Fig. 2 is the profile of cutting open from the side of the lead bending machine of electronic component.
Fig. 3 is the Y direction driving mechanism of lead-in wire retaining member and the driving mechanism enlarged drawing of lead-in wire support member.
Fig. 4 is the amplification front elevation of lead-in wire support member.
Fig. 5 is the profile that the A-A direction of the lead-in wire support member of Fig. 4 is seen.
Shown in Fig. 6 is the situation map of the lead-in wire bending of electronic component.
Shown in Fig. 7 is the dimensional drawing of various piece of the lead-in wire curved shape of electronic component.
Shown in Fig. 8 is the pie graph of control device of the lead bending machine of electronic component.
Shown in Fig. 9 is the action sequence diagram of the lead bending machine of electronic component.
Embodiment
Followingly embodiments of the invention are described with reference to accompanying drawing.Fig. 1 is the whole oblique view of leads of electronic component bending apparatus of the present invention.Ground base 10 tops being located at factory and so on are fixed with substrate 1.Be provided with transportable movable plate 2 on a direction on the horizontal plane in substrate 1 top.Suppose that with this moving direction be X-direction.In substrate 1 top, also be fixed with lead-in wire and support base station 53, support base station 53 tops at this lead-in wire, be provided with by lead-in wire and support fixed component 51 and lead-in wire to support the lead-in wire supportive device that movable link 52 constitutes.X-direction is set at 2 pairs of lead-in wires of movable plate supportive device and carries out near the direction of leaving.The lead-in wire of electronic component, the location and fixedly mounting in the mounting table top of here not drawing and.The lead-in wire of electronic component is supported fixed component 51 and lead-in wire to support movable link 52 from two sides up and down the root that goes between to be seized on both sides by the arms with lead-in wire to support.
Fig. 2 is the profile of cutting open from the side of leads of electronic component bending apparatus.In substrate 1 top, on X-direction, be provided with X-axis guide rail 11, in axis rail 11 tops, on X-direction, can guide X-axis slider 12 movably.X-axis slider 12 is fixed on the lower surface of movable plate 2, and therefore, movable plate 2 can move on directions X smoothly.The driving of the directions X of movable plate 2 is carried out with the power of X-axis servomotor 21.The output shaft of X-axis servomotor 21 is connected to transmission rotation on the X-axis ball bolt 23 by means of X-axis coupling 22.X-axis ball nut 24 on being threaded on the X-axis ball bolt 23, X-axis ball nut 24 non-rotatably is fixed on the movable plate 2 via bindiny mechanism 25.Therefore, by means of the rotation of X-axis servomotor 21, movable plate 2 just can drive at the enterprising line linearity of directions X.
The lead-in wire of electronic component keeps its head portion with bottom lead-in wire retaining member 41 and top lead-in wire retaining member 42, implements the bending machining that is bent into the regulation shape.At this moment, support the root of lead-in wire fixed component 51 and lead-in wire to support movable link 52 to support with lead-in wire, make it inactive.Bottom lead-in wire retaining member 41 and lead-in wire are supported movable link 52, drive on this Y direction as vertical direction with Y-axis servomotor 31.The output shaft of Y-axis servomotor 31 is connected on the Y-axis ball bolt 33 with Y-axis coupling 32.In addition, lead-in wire retaining member 42 in top drives on the Y direction via cylinder rotating shaft 44 by means of cylinder device 43.
Fig. 3 is the enlarged drawing of the Y direction driving mechanism of bottom lead-in wire retaining member 41 and top lead-in wire retaining member 42 and lead-in wire support movable link 52.On movable plate 2, be fixed with the Y-axis guide rail 35 of 4 vertical direction.Y-axis guide rail 35 is columniform, and bottom movable plate 411, top movable plate 421 and roller holding plate 561 are directed to Y direction.Y-axis ball bolt 33 by Y-axis servomotor 31 drives about middle body, has lower spheres bolt 331 and upper spheres bolt 332.Lower spheres bolt 331 and upper spheres bolt 332 are reciprocal bolts, and pitch is identical.
Screw thread is fixed with lower spheres nut 341 on lower spheres bolt 331, and lower spheres nut 341 is not fixed on the bottom movable plate 411 revolvably.On the head portion of bottom movable plate 411, be fixed with bottom lead-in wire retaining member 41.Therefore, adopt the way that drives Y-axis ball bolt 33 with 31 rotations of Y-axis servomotor, bottom lead-in wire retaining member 41 is moved on Y direction.In addition, upper spheres nut 342 on being threaded on the upper spheres bolt 332, upper spheres nut 342 can not be fixed on the roller holding plate 561 rotationally.Axle (supporting with axle) driving roller 56 freely to rotate on the head portion of roller holding plate 561.Therefore, adopt the way that drives Y-axis ball bolt 33 with 31 rotations of Y-axis servomotor, driving roller 56 is moved on Y direction.
Because lower spheres bolt 331 and upper spheres bolt 332 are reciprocal bolts, so the result drives roller 56 and bottom lead-in wire retaining member 41 mobile just distance that equates on opposite up and down direction with regard to becoming to the rotation by means of Y-axis ball bolt 33 makes.Driving roller 56 has been engaged on the engagement ditch 541 of mesh component 54, employing makes and drive the way that roller 56 moves on Y direction, just can make lead-in wire support movable link 52 to support movable link 51 pushings to advance the engaging mechanism that drives rollers 56 and engagement ditch 541, be used for lead-in wire support movable link 52 being advanced irrelevantly with mobile on X-direction of movable plate 2 via spring 55 towards lead-in wire.The X-direction that absorbs movable plate 2 with the engagement ditch moves.
The top movable plate 421 that top lead-in wire retaining member 42 is fixed on the head portion is pushed driving via cylinder swivel bearing 44 by cylinder device 43 on direction of principal axis.So, lead-in wire retaining member 42 in top just advances for bottom lead-in wire retaining member 41 pushings.Top lead-in wire retaining member 42 is advanced under the state on the lead-in wire retaining member 41 of bottom resembling in this wise, if mobile bottom lead-in wire retaining member 41, then the result will become to following it and move, and top lead-in wire retaining member 42 also keeps advanced state to move together unchangeably.
Fig. 4 is when carrying out the lead-in wire bending machining of electronic component, the amplification front elevation of the lead-in wire supportive device of the root of fixing support lead-in wire, and its part is represented with section.In addition, Fig. 5 is the A-A directional profile figure of the lead-in wire supportive device of Fig. 4.The lead-in wire supportive device is located at lead-in wire and is supported base station 53 tops.Lead-in wire supports that base station 53 is fixedly set on the substrate 1.The lead-in wire supportive device supports the lead-in wire of fixed component 51 and upside to support that movable link 52 constitutes by the lead-in wire of the fixed-site of downside.Lead-in wire is supported movable link 52 as mentioned above, supports that towards lead-in wire fixed component 51 pushes propelling with Y-axis servomotor 31 and Y-axis ball bolt 33.
On mesh component 54, on the Y direction, be fixed with guide bar 57.Lead-in wire support member mounting portion 521, top and lead-in wire support member mounting portion 511, bottom are embedded as mutually and can relatively move for guide bar 57.By means of this guide bar 57, mesh component 54 and lead-in wire are supported movable link 52, support that for lead-in wire fixed component 51 is directed on the Y direction movably.Employing makes the way of roller 56 declines that are engaged in the engagement ditch 4 that mesh component 54 is descended, and adopts by spring 55 to make lead-in wire support the way that movable link 52 descends, the fixedly support of the root that goes between again.Lead-in wire supports movable link 52 after touching the lead-in wire root, mesh component 54 is descended, till the holding power that spring 55 is produced becomes the size of regulation.
The inside of lead-in wire support member mounting portion 521, top and lead-in wire support member mounting portion, bottom 511 is constituted as and has formed space 512 and space 522, and the inner upper lead-in wire retaining member 42 of these spaces 512 and 522 and bottom lead-in wire retaining member 41 can freely be moved on X-axis, Y direction.
Shown in Fig. 6 is the situation map of the lead-in wire bending of electronic component.Electronic component P location and fixing propping up are held in mounting table T top.Mounting table T is a device of supporting electronic component P with absorption such as vacuum suction methods, has the lead-in wire L that should process of electronic component P is inserted to calibration rotating function on the Working position.Supporting fixed component 51 and lead-in wire to support movable link 52 pushings to support to go between under the state of root of L with lead-in wire, the head portion clamping of the L that go between is being got up with bottom lead-in wire retaining member 41 and top lead-in wire retaining member 42.Then, control X-axis servomotor and Y-axis servomotor make bottom lead-in wire retaining member 41 and top lead-in wire retaining member 42 draw circular-arc track as shown in the figure, the bending machining of the L that goes between.
Shown in Fig. 7 is the size of various piece of curved shape of the lead-in wire L of electronic component P.The center of electronic component P is positioned mounting for consistent with the center line M of mounting table.The size 1 of size a till the root of expression from the center of electronic component P to lead-in wire L and the length of lead-in wire L is the size according to the kind decision of electronic component.The curved shape of lead-in wire L, though by size b, c, d, e decision, because size a and size 1 will determine according to electronic component, thus when having specified b, c, d, during 3 values among the e, a remaining size has just automatically determined.Such as, specifying size b, d under the situation of e, will become
R={ (b-a-d)
2+ e
2}
1/2 Formula 1
F=1-d-r ... formula 2
c＝b+f
Size c has just determined.
Therefore, if intended size b, d, the value of e then just can be calculated the root supporting location 0 of lead-in wire supportive device and holding position, the top S of lead-in wire holding device with formula 1, formula 2 from the input unit input.Can also calculate the radius r of the circular-arc track of maintenance and mobile head portion.That is, the 0 fixing lead-in wire root of supporting in the position, the guide-wire tip part keeps top one side from position S, from track starting position S to track end position G till, be 0 in the center, radius is that mobile guide-wire tip part is just on the circular arc of r.Even change other 3 values within specified size b, c, d, the e into, also computing arc track similarly.In addition, also can be 3 values within specified size b, c, d, the e not, and replace the designation method of specified size d, r, e etc.
The leads of electronic component bending apparatus, the such control device 6 of available Fig. 8 is controlled.As control device, can use numerical control device and Programmable Logic Controller etc.Control device 6 has CPU60, and carries out all data processing with CPU60.Via bus 61, be connected with R0M62, RAM63, fixed magnetic-disk drives 64 on the CPU60.CPU60 is according to the system program and the data that are stored among the ROM62, and the program and the data that have been encased among the RAM63 are moved.
In RAM63, store from by the data of size b, the d of operating personnel input, e etc. with according to the track operation program 631 of each parameter of computing arc tracks such as formula 1, formula 2.In fixed magnetic-disk drives 64, have among the RAM63 that packs into, should in addition, also there be size figure of having noted with the corresponding lead-in wire curved shape of the kind of electronic component or the like by all application programs or the track operation program 631 of CPU60 execution.Input/output unit 65 is diskette unit, paper tape read-out device etc., can from exterior storage mediums such as outside floppy disk, read in size figure that is recorded as of the lead-in wire curved shape that performs in advance or the like, perhaps conversely, the size figure of the lead-in wire curved shape in the control device 6 is saved in the exterior storage medium goes.
On the bus 61 of control device 6, be connected with display unit 66 and input unit 67 via interface circuit, making can be with the input and output of carrying out information between conversational mode and the operating personnel.As display unit 66, can use CRT or LCD panel or the like, as input unit 67, can use keyboard or the like.Operating personnel specify the various sizes of lead-in wire curved shapes with input unit 67 input, perhaps select the size figure that records in advance, to specify the lead-in wire curved shape.Control device 6 sends instruction according to each parameter of the arc track that is generated by the lead-in wire curved shape and the step of regulation to driving and positioner 7, carries out the driving and the location of X-axis servomotor 21, Y-axis servomotor 31, cylinder device 43.
Shown in Fig. 9 is the action sequence diagram of the lead bending machine of electronic component.In action 600, the various piece of device is in initial position, and X-axis servomotor 21, Y-axis servomotor 31, cylinder device 43 be not action as yet all.Then, the action 601 in, electronic component P located and mounting to mounting table T.Then, in action 602, drive X-axis servomotor 21, Y-axis servomotor 31, under the state of decontroling, mobile bottom lead-in wire retaining member 41 and top lead-in wire retaining member 42 till the holding position on the top that moves to lead-in wire L, position.Then, in action 603, drive Y-axis servomotor 31, support fixed component 51 pushings to advance lead-in wire to support movable link 52 towards lead-in wire, the fixing root position of supporting lead-in wire L.At this moment, carry out set positions, bottom lead-in wire retaining member 41 is positioned on the starting point of arc track.
Then, in action 604, drive cylinder device 43, advance top lead-in wire retaining member 42, keep the head portion of lead-in wire L towards bottom lead-in wire retaining member 41 pushings.Then, in action 605, drive X-axis servomotor 21, Y-axis servomotor 31, under the state that has kept lead-in wire L top, move bottom lead-in wire retaining member 41 and top lead-in wire retaining member 42 along the arc track that has calculated, the shape of lead-in wire L bending machining for regulation.At this moment, also move, absorb, so the fixedly support of the root position of lead-in wire L can not depart from owing to it moves by spring 55 because of interlock though drive roller 56.Then, in action 606, decontrol cylinder device 43, decontrol the maintenance on the top of lead-in wire L.At last, in action 607, drive the support of Y-axis servomotor 31, and return initial position by means of X-axis servomotor 21, Y-axis servomotor 31 with the root of relieving lead-in wire.Adopt the way that repeats above the sort of action to carry out the lead-in wire bending machining of electronic component.
In addition, in the present embodiment, having up and down opposite bolt ball bolt with one and drive the mechanism that bottom lead-in wire retaining member 41 and top lead-in wire are supported movable link 52 in linkage though become, also might not be this driving mechanism.In other words, also can be the sort of driving mechanism that drives independently respectively.
Claims (8)
1, a kind of lead bending machine of electronic component, this device has:
Lead-in wire holding device (41,42) is used to keep the top of the lead-in wire of electronic component;
First driving mechanism (21,23,24) is used for moving above-mentioned lead-in wire holding device (41,42) along first shifting axle;
Second driving mechanism (31,33,341) is used to make the lead-in wire retaining member to move along second shifting axle vertical with above-mentioned first shifting axle; And
Control device 6, be used to control above-mentioned first driving mechanism (21,23,24) and above-mentioned second driving mechanism (31,33,341), the above-mentioned lead-in wire holding device that has kept above-mentioned electronic component is moved along the circular-arc track of cardinal principle, carry out the lead-in wire bending machining of above-mentioned electronic component.
2, the lead bending machine of electronic component according to claim 1 is characterized in that: above-mentioned lead-in wire holding device is by constituting near the first lead-in wire retaining member (41) that can leave and the second lead-in wire retaining member (42) mutually.
3, the lead bending machine of electronic component according to claim 2 is characterized in that:
Above-mentioned first driving mechanism contains ball bolt (23) and ball nut (24);
Above-mentioned second driving mechanism contains ball bolt (331) and the ball nut (341) that drives the above-mentioned first lead-in wire retaining member (41); And
This lead bending machine also has the cylinder device (43) that advances the above-mentioned second lead-in wire retaining member (42) towards the above-mentioned first lead-in wire retaining member (41).
4, according to the lead bending machine of any described electronic component of claim among the claim 1-3, it is characterized in that: have the lead-in wire supportive device (51,52) of supporting the lead-in wire root of electronic component with stationary state.
5, the lead bending machine of electronic component according to claim 4 is characterized in that: above-mentioned lead-in wire supportive device is supported fixed component (51) and is supported fixed component to support movable link (52) to constitute near the lead-in wire that can leave for above-mentioned lead-in wire by the lead-in wire of fixed-site.
6, the lead bending machine of electronic component according to claim 5, it is characterized in that: have and make above-mentioned lead-in wire support movable link (52), support the driving mechanism (31,332,342) that fixed component (51) direction moves to above-mentioned lead-in wire along above-mentioned second shifting axle.
7, the lead bending machine of electronic component according to claim 6 is characterized in that:
Above-mentioned the 3rd driving mechanism contains ball bolt (332) and ball nut (342); The ball bolt (331) of above-mentioned second driving mechanism and the ball bolt (342) of above-mentioned the 3rd driving mechanism are an integral body, and form the identical opposite bolt of pitch.
8, according to the lead bending machine of the electronic component in any claim of claim 1～7, it is characterized in that: have
The input unit (67) of each size of the curved shape of input electronic element lead-in wire; And
With each sized data of coming in from above-mentioned input unit (67) input, computing determines the lead-in wire holding position of above-mentioned lead-in wire holding device and the arithmetic unit (60,631) of circular-arc motion track.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 97123024 CN1188985A (en) | 1996-11-29 | 1997-11-27 | Lead bending machine for electronic components |
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP334503/96 | 1996-11-29 | ||
| CN 97123024 CN1188985A (en) | 1996-11-29 | 1997-11-27 | Lead bending machine for electronic components |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN1188985A true CN1188985A (en) | 1998-07-29 |
Family
ID=5176941
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 97123024 Pending CN1188985A (en) | 1996-11-29 | 1997-11-27 | Lead bending machine for electronic components |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN1188985A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1307703C (en) * | 2003-01-07 | 2007-03-28 | 株式会社瑞萨科技 | Lead forming device and method of semiconductor element |
| CN109429477A (en) * | 2017-08-28 | 2019-03-05 | 松下知识产权经营株式会社 | The manufacturing method of apparatus for mounting component and the component-mounted substrate using the device |
-
1997
- 1997-11-27 CN CN 97123024 patent/CN1188985A/en active Pending
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1307703C (en) * | 2003-01-07 | 2007-03-28 | 株式会社瑞萨科技 | Lead forming device and method of semiconductor element |
| CN109429477A (en) * | 2017-08-28 | 2019-03-05 | 松下知识产权经营株式会社 | The manufacturing method of apparatus for mounting component and the component-mounted substrate using the device |
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