US20050234316A1 - Housing for a circuit that is to be implanted in-vivo and process of making the same - Google Patents

Housing for a circuit that is to be implanted in-vivo and process of making the same Download PDF

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Publication number
US20050234316A1
US20050234316A1 US10/825,648 US82564804A US2005234316A1 US 20050234316 A1 US20050234316 A1 US 20050234316A1 US 82564804 A US82564804 A US 82564804A US 2005234316 A1 US2005234316 A1 US 2005234316A1
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US
United States
Prior art keywords
housing
circuit
glass
epoxy
polymer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
US10/825,648
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English (en)
Inventor
Arthur Colvin
Carrie Lorenz
Casey O'Connor
Steven Walters
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sensors for Medicine and Science Inc
Sensors for Medecine and Science Inc
Original Assignee
Sensors for Medicine and Science Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sensors for Medicine and Science Inc filed Critical Sensors for Medicine and Science Inc
Priority to US10/825,648 priority Critical patent/US20050234316A1/en
Assigned to SENSORS FOR MEDICINE AND SCIENCE, INC. reassignment SENSORS FOR MEDICINE AND SCIENCE, INC. ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: COLVIN, ARTHUR E., LORENZ, CARRIE R., O'CONNOR, CASEY J., WALTERS, STEVEN J.
Priority to PCT/US2005/011653 priority patent/WO2005107351A1/en
Priority to CA002563606A priority patent/CA2563606A1/en
Priority to CN2011100787916A priority patent/CN102149258B/zh
Priority to EP10182071A priority patent/EP2259670A3/en
Priority to AU2005239569A priority patent/AU2005239569B2/en
Priority to DK05731370.2T priority patent/DK1736041T3/da
Priority to EP05731370.2A priority patent/EP1736041B1/en
Priority to KR1020067023933A priority patent/KR101166892B1/ko
Priority to BRPI0509917-0A priority patent/BRPI0509917A/pt
Priority to CN200580011394XA priority patent/CN1943288B/zh
Priority to MXPA06011875A priority patent/MXPA06011875A/es
Priority to JP2007508385A priority patent/JP5021458B2/ja
Priority to TW094111928A priority patent/TW200603764A/zh
Publication of US20050234316A1 publication Critical patent/US20050234316A1/en
Priority to HK07100457.9A priority patent/HK1094400A1/xx
Assigned to NEW ENTERPRISE ASSOCIATES 10, LIMITED PARTNERSHIP reassignment NEW ENTERPRISE ASSOCIATES 10, LIMITED PARTNERSHIP SECURITY AGREEMENT Assignors: SENSORS FOR MEDICINE AND SCIENCE, INC.
Priority to US13/171,711 priority patent/US9717413B2/en
Assigned to SENSORS FOR MEDICINE AND SCIENCE, INC. reassignment SENSORS FOR MEDICINE AND SCIENCE, INC. RELEASE BY SECURED PARTY (SEE DOCUMENT FOR DETAILS). Assignors: NEW ENTERPRISE ASSOCIATES 10, LIMITED PARTNERSHIP
Priority to JP2012052982A priority patent/JP5255136B2/ja
Priority to US15/657,769 priority patent/US20180132721A1/en
Abandoned legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K5/00—Casings, cabinets or drawers for electric apparatus
    • A—HUMAN NECESSITIES
    • A61—MEDICAL OR VETERINARY SCIENCE; HYGIENE
    • A61B—DIAGNOSIS; SURGERY; IDENTIFICATION
    • A61B5/00—Measuring for diagnostic purposes; Identification of persons
    • A61B5/0002—Remote monitoring of patients using telemetry, e.g. transmission of vital signals via a communication network
    • A61B5/0031—Implanted circuitry
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K5/00—Casings, cabinets or drawers for electric apparatus
    • H05K5/06—Hermetically-sealed casings
    • H05K5/065—Hermetically-sealed casings sealed by encapsulation, e.g. waterproof resin forming an integral casing, injection moulding

Definitions

  • the present invention relates to a circuit housing, and, more specifically, to a housing for a circuit designed to be implanted in-vivo (i.e., an implantable circuit).
  • a human implantable glucose sensor circuit must be housed within a suitable housing to both protect the sensor from the human body and to protect the human body from the sensor.
  • U.S. Pat. No. 6,330,464 the disclosure of which is incorporated herein by this reference, discloses such a sensor.
  • a housing encasing an implantable circuit should have at least some of the following characteristics: (1) the ability to protect the electronic circuitry of the sensor from the ambient in-vivo chemical and physical environment, (2) the ability to protect tissue adjacent to the sensor from any adverse reaction which could result as a consequence of contact (or leachables) from within the circuitry—in addition, beyond the adjacent tissue, the encasement must not permit leachables of any detectable significance into the general body environment; (3) the ability to permit wireless electronic communication between the circuitry and an external reader for power and signal; (4) the ability to permit free passage of wavelengths of light necessary for optical functioning of the sensor; (5) the ability to support the surface chemistry required to form a chemical recognition “front-end”; (6) the housing should be high volume manufacture-able; (7) the housing must be non-toxic and “biocompatible”; and (8) provide a sufficiently high reliability to meet the specifications of a medical product.
  • the present invention provides a housing that meets many of the criteria outlined above.
  • the present invention provides a circuit encased within a completely enclosed polymer housing.
  • the housing is made of an organic polymer, such as PMMA.
  • the circuit is first enclosed within a glass housing which itself is then enclosed within a second housing, such as a housing made from an organic polymer.
  • the circuit is first encased within a brick of epoxy and then the epoxy brick containing the circuit is enclosed within a housing.
  • the present invention provides a method for enclosing a circuit in a polymer housing.
  • the method may include the following steps: (a) placing the circuit in a mold; (b) pouring a formulation into the mold so that the formulation completely surrounds the circuit, wherein the formulation comprises monomers; and (c) polymerizing the monomers.
  • step (b) all of the formulation need not be poured at once.
  • the formulation is poured into the mold until the mold is half full and then after a delay additional formulation is poured into the mold.
  • the monomers may be MMA monomers.
  • the formulation may further comprise pre-polymerized PMMA.
  • the method may include the following steps: inserting the circuit into a polymer housing; injecting an optical epoxy into the polymer housing to fill the spaces between the circuit and the inside walls of the housing (in some embodiments the injection is from the bottom up to force out trapped air); capping an open end of the housing; placing the housing containing the optical epoxy and the circuit into a pressure vessel and increasing the pressure and temperature within the vessel; allowing the optical epoxy to cure; and removing the housing from the pressure vessel.
  • the method may include the following steps: inserting the circuit into a glass housing; injecting an optical epoxy into the glass housing to fill the spaces between the circuit and the inside walls of the housing; injecting an optical epoxy into a polymer housing; inserting into the polymer housing the glass housing containing the circuit; capping an open end of the glass housing; and capping an open end of the polymer housing.
  • FIG. 1 illustrates one embodiment of a circuit assembly according to the present invention.
  • FIG. 2 is a flow chart illustrating a process, according to one embodiment, for encasing a circuit within a polymer housing.
  • FIG. 3 is a cross sectional view of a circuit assembly according to an embodiment of the invention.
  • FIG. 4 is a flow chart illustrating a process, according to another embodiment, for encasing a circuit within a polymer housing.
  • FIG. 5 is an exploded view of a circuit assembly according to an embodiment of the invention.
  • FIG. 6 is a cross sectional view of a circuit assembly according to another embodiment of the invention.
  • FIG. 7 illustrates a circuit assembly according to another embodiment of the present invention.
  • FIG. 8 is an exploded view of a circuit assembly according to another embodiment of the invention.
  • FIG. 9 is a flow chart illustrating a process, according to another embodiment, for encasing a circuit within a polymer housing.
  • FIGS. 10A and 10B illustrate a circuit covered with different amount of epoxy.
  • FIG. 1 illustrates one embodiment of a circuit assembly 100 according to the present invention.
  • the present invention provides an assemblage including a circuit 101 housed within a fully enclosed housing 102 .
  • housing 102 is capsule shaped, but other shapes may be used.
  • Circuit 101 may be an electronic circuit having a printed circuit board 110 and one or more electrical and optical components 112 attached to the circuit board 110 .
  • Circuit 101 may include a conventional sensor, such as the sensor described in U.S. Pat. No. 6,304,766.
  • the housing 102 may be a housing made from PMMA, which is a polymer of methyl methacrylate (MMA) monomers, or from other organic polymers.
  • MMA methyl methacrylate
  • FIG. 2 is a flow chart illustrating a process 200 , according to one embodiment, for creating circuit assembly 100 .
  • Process 200 may begin in step 202 , where a polymerization initiator is added to a mold.
  • an encasement formulation containing monomers is poured into the mold (e.g., filling the mold halfway).
  • circuit 101 is placed in the mold.
  • more of the encasement formulation is poured into the mold so that the circuit is completely immersed in the encasement formulation.
  • the encasement formulation includes monomers.
  • the encasement formulation consists of or essentially consists of MMA monomers. In this manner, one can encase circuit 101 in a polymer housing.
  • circuit 101 can become severely damaged during the polymerization process (i.e., during step 206 ).
  • the cause of this damage is usually attributed to the shrinkage that occurs naturally during polymerization of MMA.
  • the intermolecular spacing is reduced within a polymer as the reaction progresses. This is a well-known phenomena and typical of most, if not all, polymer reactions.
  • the net volumetric shrinkage that occurs during the polymerization of PMMA from neat monomer solution is approximately 14%.
  • This shrinkage can, in some circumstances, create a particular problem when using PMMA as a circuit housing because, as the encasement reaction progresses, and the viscosity increases as the shrinkage occurs simultaneously, the electrical components 112 , which are mounted on the circuit board 110 typically with conductive epoxy, are pulled from the circuit board 110 during the polymerization process.
  • the relative strength of the conductive epoxy used to hold the components 112 in place which conductive epoxy is formulated primarily and maximally for its electrical conductance and cure properties, does not have sufficient mechanical strength to withstand the pull and stress from PMMA shrinkage as the encasement reaction progresses. Consequently, some attempts to encase a circuit from an MMA monomer encasement formulation result in a non-functional circuit because of un-repairable mechanical damage.
  • one aspect of the present invention is a method by which the polymerization reaction can be conducted without damage to the encased circuit 101 .
  • pre-polymerized PMMA of large molecular weights (approximately up through 1 million+mw) can be dissolved in MMA monomer, and because the shrinkage is a direct result of bonds forming from discrete monomers, one possible solution is to formulate the encasement formulation to include a portion of MMA monomer and a portion of pre-polymerized PMMA dissolved within the MMA monomer.
  • the result of altering percent solids provides an improvement in system stress during encasement by reducing shrinkage from, for example, 14% to 4% by reformulating MMA/PMMA specifically for the encasement process.
  • Formulation ratios of 60-80% PMMA in MMA are preferred, although not required, because of a present practical limitation. Although to a point, higher ratio values would be expected to reduce shrinkage proportionately, and further reduction in shrinkage may be possible. As a practical matter, the solution viscosity becomes extremely high at these higer ratio levels making the high solids solution extremely difficult to handle, transfer, etc.
  • circuits 101 can not withstand the 4% shrinkage of the encasement.
  • the surviving circuits tend to have greater amounts of conductive epoxy to increase mechanical strength slightly of the surface mounted parts.
  • conductive epoxy is not sufficiently strong, and to increase the amount used per connection beyond good manufacturing standards would then create other problems.
  • Another important consideration is for wire-bonded circuits. These “frog hair” gold wires are typically 25 microns in diameter which is about 1 ⁇ 3 to 1 ⁇ 4 the diameter of a typical human hair. Small amounts of movement relative to the fixed board components can rip these wires from the attachments.
  • One way to mechanically strengthen circuit 101 to allow it to withstand the remaining 4% shrinkage from the PMMA (70/30) encasement cure reaction, is to reinforce the circuit with a pre-applied epoxy layer.
  • an epoxy is applied over the circuit, which epoxy both under-fills and overfills the components attached to the circuit board.
  • this solution works best when the applied epoxy covers the components in such a way as to result in a relatively “smooth” surface topology, but this is not a requirement.
  • This “smooth” surface topology is illustrated in FIG. 10A .
  • FIG. 10B shows a “non-smooth” epoxy coating.
  • the surface 1002 of the epoxy coating is smooth or substantially smooth.
  • the epoxy adequately strengthens circuit 101 against damage from the shrinking polymer, the resultant stress caused by the remaining 4% shrinkage then becomes manifest as de-lamination between the adjoining surfaces of epoxy and PMMA within the final encasement.
  • the surface was smoothed by the volume and application of the epoxy pre-coat, not allowing the PMMA to get a “grip” within the surface topology, then de-lamination was less likely to occur.
  • the stress from the 4% remaining shrinkage is then absorbed as internal stress within the PMMA encasement body itself. This stress may be removed in a conventional way by annealing in a final operation.
  • Some or all of the epoxy used to reinforce the circuit 110 may, in some embodiments, include a light blocking pigment (such as black or wavelength specific) which prevents unwanted light propagation and scatter about the circuit, thereby increasing the optical signal to noise ratio of the system.
  • a light blocking pigment such as black or wavelength specific
  • the circuitry 101 may be desirable to prevent molecular water vapor that has seeped through the housing 102 from condensing to become liquid water. If liquid water cannot form from the water vapor, then potential ion contaminants present cannot become solvated, which can lead to circuit failure.
  • MMA monomer is extremely volatile.
  • the polymerization reaction of MMA to PMMA is also exothermic.
  • the exothermic heat yield from a typical reaction begun at room temperature will commonly increase the temperature as the reaction progresses to a point where the remaining un-reacted monomer will boil and create bubbles of all sizes trapped within the cured polymer.
  • substantial overpressure may be used during the polymerization reaction.
  • a mold containing PMMA/MMA is placed within a pressure reactor that is then pressurized to a pressure that exceeds the vapor pressure of MMA monomer at the polymerization temperature.
  • This pressurization process both prevents bubbles and provides a very close mechanical surface bond with the underlying epoxy coat which does not delaminate once formed.
  • the housing is clear and without bubble or void defects to prevent water from condensing, and as an important byproduct, provides excellent optical clarity without bubble defect.
  • FIG. 3 is a cross sectional view of circuit assembly 100 , according to one embodiment, along line A.
  • the circuit 101 may be fully encased within a brick of epoxy 302 (or “epoxy brick 302 ”), which is encased within housing 102 .
  • FIG. 4 is a flow chart illustrating a process 400 , according to another embodiment, for creating circuit assembly 100 .
  • Process 400 may begin in step 402 , where a housing 500 (e.g., a sleeve 500 or tube or other housing having an open end) (see FIG. 5 ) is created along with a plug 504 for plugging the opening in the housing.
  • a cylindrical sleeve 500 and plug 504 may be machined from a polymer rod, such as a rod of PMMA or other organic polymer.
  • sleeve 500 may have a notch 592 adjacent to the open end 594 of sleeve 500 .
  • the PMMA sleeve and plug may be annealed at approximately 80° C. for about four hours (step 403 ).
  • step 404 epoxy is applied over the circuit 101 so that the circuit is partially or fully encased within an epoxy brick 502 , thereby forming an assembly 503 .
  • step 406 assembly 503 , sleeve 500 and plug 504 are cleaned.
  • assembly 503 , sleeve 500 and plug 504 may be cleaned by rubbing a Q-tip with IPA on the surfaces thereof.
  • step 408 an optical epoxy is prepared. EPO-TEK 301-2 Epoxy from Epoxy Technology of Billerica, MA and other epoxies may be used as the optical epoxy.
  • step 410 the circuit encased within the epoxy brick (i.e., assembly 503 ) is placed into the sleeve 500 .
  • step 412 the prepared optical epoxy is injected (i.e., introduced) into sleeve 500 .
  • no bubbles in the optical epoxy are formed during step 412 .
  • step 414 the plug 504 is placed into the open end of sleeve 500 , thereby sealing the open end of the sleeve.
  • FIG. 6 is a cross sectional view, according to one embodiment, of the circuit assembly 100 along line A after step 414 is performed.
  • the circuit 101 is fully encased within an epoxy brick 502 .
  • the epoxy brick 502 which houses circuit 101 is placed within sleeve 500 , which may be a cylindrical sleeve.
  • sleeve 500 is a cylindrical sleeve and when circuit 101 is fully encased within the epoxy brick, it is preferable that the distance between the upper right hand corner and lower left corner of epoxy brick 502 be equal to or slightly less than the inner diameter of sleeve 502 .
  • w sqrt((d*d) ⁇ (h*h)), where w is the width of assembly 503 , h is the height of assembly 503 , and d is the inner diameter of sleeve 500 .
  • the maximum width of the assembly may be equal to or slightly less than the inner diameter.
  • the optical epoxy e.g., a refractive index (RI) matching epoxy fills spaces between assembly 503 and sleeve 500 .
  • the new assembly i.e., the sealed sleeve containing the epoxy and assembly 503
  • the pressure within the vessel is increased to about 125 psi using Nitrogen or other inert gas.
  • the optical epoxy is cured for an amount of time (e.g., 20 hours) at a predetermined temperature (e.g., 40° C.). After the predetermined amount of time has elapsed, the assembly is removed from the pressure vessel and then final machined (step 422 ).
  • the method described above allows the possibility of annealing a PMMA housing before encasement without putting any additional stress on the circuit 101 .
  • FIG. 7 illustrates an alternative circuit assembly 700 of the present invention.
  • Circuit assembly 700 is similar to circuit assembly 100 in that assembly 700 includes a circuit 101 housed within a housing 102 .
  • the circuit 101 is also housed within a glass housing 702 (e.g., a tube or other shaped housing), which itself is housed within the housing 102 .
  • the glass housing 702 in some embodiments, is closed at one end and open at the opposite end. The open end may be plugged by a glass ball 704 or other suitable plug.
  • FIG. 8 is an exploded view showing the components of assembly 700 , according to one embodiment.
  • Glass housing 702 in some embodiments, may be constructed from an infra-red (IR) blocking glass.
  • IR infra-red
  • FIG. 9 is a flow chart illustrating a process 900 , according to one embodiment, for making assembly 700 .
  • Process 900 may begin in step 902 , where a sleeve and a plug, such as sleeve 500 and plug 504 , are created.
  • step 904 the sleeve and plug are annealed.
  • the sleeve and plug may be annealed at 80° C. for about four hours.
  • step 906 the components (e.g., sleeve 500 , plug 504 , glass housing 702 , glass ball 704 , epoxy brick 502 , etc.) are cleaned.
  • sleeve 500 and plug 504 may be cleaned in an ultrasonic bath with IPA followed by a rinse step, and glass housing 702 and glass ball 704 may also be cleaned ultrasonically with KOH/alcohol solutions and then rinsed with water.
  • a bonding agent is applied to the glass housing 702 and glass ball 704 .
  • the bonding agent used may be trimethoxy[2-(7-oxabicyclo[4.1.0]hept-3-yl)ethyl]silane, which may be purchased from Sigma-Aldrich Corporation (catalog no. 413321)
  • step 910 a batch of optical epoxy is prepared.
  • step 912 the epoxy coated circuit board is inserted into the glass housing.
  • step 914 some of the prepared epoxy is injected into the glass housing 702 .
  • step 916 some of the prepared epoxy is injected into the sleeve 500 .
  • glass housing 702 which houses the circuit, is inserted into an open end of the sleeve.
  • step 920 the glass ball 704 is inserted into the open end of glass housing 702 , thereby sealing the open end of the glass housing.
  • step 922 the plug 504 is used to seal the open end of the sleeve.
  • step 924 the sealed sleeve, which houses glass housing 702 , which houses the circuit 101 , is placed into a pressure vessel where the pressure is increased to about 125 psi using an inert gas and the temperature is increased to about 40° C. After about 20 hours, the pressure is gradually reduced and the assembly is removed-from the pressure vessel and then final machined (step 926 ).

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  • Engineering & Computer Science (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Heart & Thoracic Surgery (AREA)
  • Surgery (AREA)
  • Pathology (AREA)
  • Biomedical Technology (AREA)
  • Physics & Mathematics (AREA)
  • Medical Informatics (AREA)
  • Molecular Biology (AREA)
  • Biophysics (AREA)
  • Animal Behavior & Ethology (AREA)
  • General Health & Medical Sciences (AREA)
  • Public Health (AREA)
  • Veterinary Medicine (AREA)
  • Computer Networks & Wireless Communication (AREA)
  • Casting Or Compression Moulding Of Plastics Or The Like (AREA)
  • Measurement Of The Respiration, Hearing Ability, Form, And Blood Characteristics Of Living Organisms (AREA)
US10/825,648 2004-04-16 2004-04-16 Housing for a circuit that is to be implanted in-vivo and process of making the same Abandoned US20050234316A1 (en)

Priority Applications (18)

Application Number Priority Date Filing Date Title
US10/825,648 US20050234316A1 (en) 2004-04-16 2004-04-16 Housing for a circuit that is to be implanted in-vivo and process of making the same
CA002563606A CA2563606A1 (en) 2004-04-16 2005-04-07 A housing for a circuit that is to be implanted in-vivo and process of making the same
CN200580011394XA CN1943288B (zh) 2004-04-16 2005-04-07 将植入体内的电路的壳体及其制造方法
JP2007508385A JP5021458B2 (ja) 2004-04-16 2005-04-07 生体内に移植される回路のためのハウジング及び当該ハウジングを製造する方法
CN2011100787916A CN102149258B (zh) 2004-04-16 2005-04-07 将植入体内的电路的壳体及其制造方法
EP10182071A EP2259670A3 (en) 2004-04-16 2005-04-07 A housing for a circuit that is to be implanted in-vivo and process of making the same
AU2005239569A AU2005239569B2 (en) 2004-04-16 2005-04-07 A housing for a circuit that is to be implanted in-vivo and process of making the same
DK05731370.2T DK1736041T3 (da) 2004-04-16 2005-04-07 Hus til et kredsløb der skal implementeres in-vivo og fremgangsmåde til fremstilling deraf
EP05731370.2A EP1736041B1 (en) 2004-04-16 2005-04-07 A housing for a circuit that is to be implanted in-vivo and process of making the same
KR1020067023933A KR101166892B1 (ko) 2004-04-16 2005-04-07 생체내에 이식되는 회로용 하우징 및 이의 제조 공정
BRPI0509917-0A BRPI0509917A (pt) 2004-04-16 2005-04-07 alojamento para um circuito a ser implantado in-vivo e processo de produção do mesmo
PCT/US2005/011653 WO2005107351A1 (en) 2004-04-16 2005-04-07 A housing for a circuit that is to be implanted in-vivo and process of making the same
MXPA06011875A MXPA06011875A (es) 2004-04-16 2005-04-07 Alojamiento para un circuito que sera implantado in vivo y procedimiento para elaborar el mismo.
TW094111928A TW200603764A (en) 2004-04-16 2005-04-15 A housing for a circuit that is to be implanted in-vivo and process of making the same
HK07100457.9A HK1094400A1 (en) 2004-04-16 2007-01-12 A housing for a circuit that is to be implanted in-vivo and process of making the same
US13/171,711 US9717413B2 (en) 2004-04-16 2011-06-29 Biocompatible, human implantable apparatus and method for fully encasing a circuit within a polymer housing
JP2012052982A JP5255136B2 (ja) 2004-04-16 2012-03-09 生体内に移植される回路のためのハウジング及び当該ハウジングを製造する方法
US15/657,769 US20180132721A1 (en) 2004-04-16 2017-07-24 Housing for a circuit that is to be implanted in-vivo and process of making the same

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US10/825,648 US20050234316A1 (en) 2004-04-16 2004-04-16 Housing for a circuit that is to be implanted in-vivo and process of making the same

Related Child Applications (1)

Application Number Title Priority Date Filing Date
US13/171,711 Continuation US9717413B2 (en) 2004-04-16 2011-06-29 Biocompatible, human implantable apparatus and method for fully encasing a circuit within a polymer housing

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US20050234316A1 true US20050234316A1 (en) 2005-10-20

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US10/825,648 Abandoned US20050234316A1 (en) 2004-04-16 2004-04-16 Housing for a circuit that is to be implanted in-vivo and process of making the same
US13/171,711 Expired - Lifetime US9717413B2 (en) 2004-04-16 2011-06-29 Biocompatible, human implantable apparatus and method for fully encasing a circuit within a polymer housing
US15/657,769 Abandoned US20180132721A1 (en) 2004-04-16 2017-07-24 Housing for a circuit that is to be implanted in-vivo and process of making the same

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Application Number Title Priority Date Filing Date
US13/171,711 Expired - Lifetime US9717413B2 (en) 2004-04-16 2011-06-29 Biocompatible, human implantable apparatus and method for fully encasing a circuit within a polymer housing
US15/657,769 Abandoned US20180132721A1 (en) 2004-04-16 2017-07-24 Housing for a circuit that is to be implanted in-vivo and process of making the same

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US (3) US20050234316A1 (ja)
EP (2) EP1736041B1 (ja)
JP (2) JP5021458B2 (ja)
KR (1) KR101166892B1 (ja)
CN (2) CN1943288B (ja)
AU (1) AU2005239569B2 (ja)
BR (1) BRPI0509917A (ja)
CA (1) CA2563606A1 (ja)
DK (1) DK1736041T3 (ja)
HK (1) HK1094400A1 (ja)
MX (1) MXPA06011875A (ja)
TW (1) TW200603764A (ja)
WO (1) WO2005107351A1 (ja)

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US20090247984A1 (en) * 2007-10-24 2009-10-01 Masimo Laboratories, Inc. Use of microneedles for small molecule metabolite reporter delivery
US20100189159A1 (en) * 2009-01-28 2010-07-29 Frank Tylinski Sensor for determining the temperature in the cabin of a motor vehicle, climate control member for an air conditioning system of a motor vehicle, and device for determining the temperature in the cabin of a motor vehicle
US9538958B2 (en) 2012-03-16 2017-01-10 Endotronix, Inc. Permittivity shielding
US9681824B2 (en) 2011-03-15 2017-06-20 Senseonics, Incorporated Integrated catalytic protection of oxidation sensitive materials
US20180327614A1 (en) * 2017-05-09 2018-11-15 Imam Abdulrahman Bin Faisal University Method of repairing an acrylic denture base and zirconia autopolymerizable resins therof

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WO2011026265A1 (zh) * 2009-09-01 2011-03-10 Shan Guangwei 植入动物体内的电子或电动装置与体外进行电信号连接的方法及一种可植入动物体内的电气插座
DE102010027875A1 (de) 2010-04-16 2011-10-20 Osram Opto Semiconductors Gmbh Optoelektronisches Bauelement und Verfahren zum Herstellen eines optoelektronischen Bauelements
US9963556B2 (en) 2013-09-18 2018-05-08 Senseonics, Incorporated Critical point drying of hydrogels in analyte sensors
CN115176155A (zh) 2019-10-25 2022-10-11 塞卡科实验室有限公司 指示剂化合物、包括指示剂化合物的装置及其制备和使用方法

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