US20050215715A1 - Blends of high temperature resins suitable for fabrication using powdered metal or compression molding techniques - Google Patents

Blends of high temperature resins suitable for fabrication using powdered metal or compression molding techniques Download PDF

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Publication number
US20050215715A1
US20050215715A1 US11/007,957 US795704A US2005215715A1 US 20050215715 A1 US20050215715 A1 US 20050215715A1 US 795704 A US795704 A US 795704A US 2005215715 A1 US2005215715 A1 US 2005215715A1
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Prior art keywords
resin
particulates
blend
melt processible
polyimide
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US11/007,957
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English (en)
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Mark Schmeckpeper
Timothy Krizan
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EIDP Inc
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Individual
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Priority to US11/007,957 priority Critical patent/US20050215715A1/en
Priority to CA002550237A priority patent/CA2550237A1/en
Priority to KR1020067011966A priority patent/KR101136616B1/ko
Priority to PCT/US2004/042304 priority patent/WO2005061200A1/en
Priority to EP04814483A priority patent/EP1699610B1/en
Priority to JP2006545442A priority patent/JP4980724B2/ja
Priority to HK07104942.4A priority patent/HK1098422B/xx
Assigned to E. I. DU PONT DE NEMOURS AND COMPANY reassignment E. I. DU PONT DE NEMOURS AND COMPANY ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: KRIZAN, TIMOTHY D., SCHMECKPEPER, MARK R.
Publication of US20050215715A1 publication Critical patent/US20050215715A1/en
Priority to US12/154,075 priority patent/US7758781B2/en
Abandoned legal-status Critical Current

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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C43/00—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C43/00—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor
    • B29C43/006—Pressing and sintering powders, granules or fibres
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C43/00—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor
    • B29C43/003—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor characterised by the choice of material
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L79/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen with or without oxygen or carbon only, not provided for in groups C08L61/00 - C08L77/00
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L79/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen with or without oxygen or carbon only, not provided for in groups C08L61/00 - C08L77/00
    • C08L79/04—Polycondensates having nitrogen-containing heterocyclic rings in the main chain; Polyhydrazides; Polyamide acids or similar polyimide precursors
    • C08L79/08—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29K—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES B29B, B29C OR B29D, RELATING TO MOULDING MATERIALS OR TO MATERIALS FOR MOULDS, REINFORCEMENTS, FILLERS OR PREFORMED PARTS, e.g. INSERTS
    • B29K2079/00—Use of polymers having nitrogen, with or without oxygen or carbon only, in the main chain, not provided for in groups B29K2061/00 - B29K2077/00, as moulding material
    • B29K2079/08—PI, i.e. polyimides or derivatives thereof

Definitions

  • This invention relates to a dry blended, particulate, high temperature polymer, which is moldable using powdered metal or compression molding technology.
  • High temperature resins are increasingly replacing metals in the fabrication of machinery parts and mechanical components. As a result, significant reductions in production and replacement costs for the machinery parts and mechanical components have been realized.
  • the high temperature resins should have high resistance to mechanical wear, surface stress, and extreme temperature conditions. Additionally, the performance characteristics of the high temperature resins should equal or exceed that of the metals being replaced.
  • Polyimides are particularly preferable high temperature resins because of their mechanical strength, dimensional stability, thermal stability, chemical stability, flame retardance, and dielectric properties.
  • Polyimides such as those described in U.S. Pat. No. 3,179,614 issued to Edwards on Apr. 20, 1965, can be used in a wide variety of commercial applications. The outstanding performance characteristics of these polymers under stress and at high temperatures have made them useful in the form of bushings, seals, electrical insulators, compressor vanes and impellers, pistons and piston rings, gears, thread guides, cams, brake linings, and clutch faces.
  • Blending of resin polymers to improve the physical characteristics of the blend over the individual resin polymers is well known in the art.
  • Known techniques used in processing resin polymers include dry blending, direct compression, wet granulation, melt blending, coprecipitation from solution, and spray freezing of frozen particles. Dry blending of resins is advantageous because of the absence of solvents and other liquids that may contribute to residual moisture. Dry blending is also advantageous because of its simplicity compared to other mixing methods.
  • a molded article have low moisture pickup because absorbed moisture can negatively affect: the dimensional stability of the molded article through, for example, hygroscopic expansion; mechanical properties such as tensile strength; electrical properties; and hydrolytic stability. Thus, it is desirable to lower the moisture pickup of a molded article without changing any of the properties of the article.
  • one aspect of this invention is to provide dry blended resin particulates wherein the moisture pickup of a molded article comprising the dry blended resin particulates is lower than the level expected based on the moisture pickups of the individual components of the blend. Another aspect of the invention is that these dry blended resin particulates are suitable for compression molding.
  • One aspect of this invention is to provide a resin blend comprising at least two dry blended, non-melt processible resin particulates, wherein the at least two dry blended resin particulates are molded by compression molding.
  • Another aspect of the invention is a compression molded article comprising the resin blend.
  • Another aspect of this invention is to provide a process for producing a compression molded article comprising mixing at least two non-melt processible resin particulates by dry blending and molding the mixture by compression molding.
  • Another aspect of the invention is a resin blend comprising at least two blended, non-melt processible polyimide resin particulates, wherein the at least two blended, non-melt processible polyimide resin particulates are molded by compression molding.
  • compression molding means a method for preparing parts from a polymer or polymeric mixture by the application of both heat and pressure whereby the polymer is not melted.
  • the application of heat and pressure can be simultaneous or sequential.
  • Methods of compression molding include direct forming and sintering, isostatic molding, and other methods known to one of ordinary skill in the art.
  • dry blending means the process by which two or more particulate resins are thoroughly mixed while maintaining the integrity of the individual particles and without benefit of an additional material such as a solvent to aid in the processing.
  • a “dry blend” is thus a resultant mixture of a dry blending process.
  • resin particulate means polymers, optionally comprising encapsulated filler, with an average particle size of from about 5 ⁇ m to about 500 ⁇ m.
  • the resin particulate has an average particle size of from about 20 ⁇ m to about 400 ⁇ m. More preferably, the resin particulate has an average particle size of from about 30 ⁇ m to about 300 ⁇ m. Average particle size can be determined by methods such as an aqueous slurry using a Coulter Multisizer.
  • moisture pickup means the weight percent of water absorbed by a tensile bar after immersion in water for two weeks at room temperature.
  • expected moisture pickup for a resin blend is the amount of weight gain predicted from calculating the weighted average of the moisture pickups of two or more tensile bars prepared from each of the individual base resins used to prepare the blend.
  • the present invention relates to a resin blend comprising at least two dry blended, non-melt processible resin particulates, wherein the at least two dry blended resin particulates are molded by compression molding.
  • Another aspect of the invention is a compression molded article comprising the resin blend.
  • a desirable group of polymers suitable for use in the present invention are those that retain excellent mechanical properties at high temperatures. Polymers in this group, however, often melt at very high temperatures or decompose without melting. In addition, their viscosities in the melt phase are extremely high. Therefore, these polymers are considered to be intractable, that is, non-melt processible. Thus, forming these polymers into shaped articles is expensive at best and impossible in many cases.
  • nylons of hexamethylene diamine and terephthalic acid exhibit excellent temperature resistance but cannot be melt-spun or molded because they decompose before their crystalline melting temperatures are reached.
  • many other wholly aromatic polymers such as polyimides of pyromellitic anyhydride and aromatic diamines cannot be melt processed. Powder processing and sintering techniques have been used to process such intractable polymers into useable articles.
  • non-melt processible refers to resin particulates that either have a melting transition temperature (“T m ”) of at least 400° C. in the case of resin particulates that have a discernable melting point or have no discernable melting point but are stable in temperatures up to at least 400° C.
  • T m melting transition temperature
  • the resin particulate is derived from a base polymer that is non-melt processible.
  • the base polymer is preferably an organic polymer and is more preferably a synthetic polymer that is prepared in a polymerization reaction.
  • the base polymer can be, for example, a polyimide, a polybenzoxazole, a polybenzimidazole, a polyaramide, a polyarylene, a polyether sulfone, a polyarylene sulfide, a polyimidothioether, a polyoxamide, a polyimine, a polysulfonamide, a polysulfonimide, a polyimidine, a polypyrazole, a polyisoxazole, a polythiazole, a polybenzothiazole, a polyoxadiazole, a polytriazole, a polytriazoline, a polytetrazole, a polyquinoline, a polyanthrazoline,
  • At least one of the dry blended resin particulates is a polyimide resin particulate. More preferably, at least two of the dry blended resin particulates are polyimide resin particulates. Even more preferably, all of the dry blended resin particulates are polyimide particulate resins.
  • the invention provides for a resin blend comprising at least two blended, non-melt processible polyimide particulates, wherein the at least two blended, non-melt processible polyimide particulates are molded by compression molding.
  • Resin blends of these polyimide embodiments can optionally contain water and/or additional solvents as known to one of ordinary skill in the art and are thus not necessarily a dry blend. In these polyimide embodiments, water and/or additional solvents can be added in amounts as is necessary to produce functional blends.
  • the polyimide contains the characteristic —CO—NR—CO— group as a linear or heterocyclic unit along the main chain of the polymer backbone.
  • the polyimide can be obtained, for example, from the reaction of monomers such as an organic tetracarboxylic acid, or the corresponding anhydride or ester derivative thereof, with an aliphatic or aromatic diamine.
  • a polyimide precursor as used to prepare a polyimide is an organic polymer that becomes the corresponding polyimide when the polyimide precursor is heated or chemically treated.
  • about 60 to 100 mole percent, preferably about 70 mole percent or more, more preferably about 80 mole percent or more, of the repeating units of the polymer chain thereof has a polyimide structure as represented, for example, by the following formula:
  • Preferred polyimide precursors are aromatic, and provide, when imidized, polyimides in which a benzene ring of an aromatic compound is directly bonded to the imide group.
  • An especially preferred polyimide precursor includes a polyamic acid having a repeating unit represented, for example, by the following general formula, wherein the polyamic acid can be either a homopolymer or copolymer of two or more of the repeating units: wherein R 3 is a tetravalent aromatic radical having 1 to 5 benzenoid-unsaturated rings of 6 carbon atoms, the four carbonyl groups being directly bonded to different carbon atoms in a benzene ring of the R 3 radical and each pair of carbonyl groups being bonded to adjacent carbon atoms in the benzene ring of the R 3 radical; and R 4 is a divalent aromatic radical having 1 to 5 benzenoid-unsaturated rings of carbon atoms, the two amino groups being directly bonded to different carbon atoms in the
  • Typical examples of a polyamic acid having a repeating unit represented by the general formula above are those obtained from pyromellitic dianhydride (“PMDA”) and diaminodiphenyl ether (“ODA”) and 3,3′,4,4′-biphenyltetracarboxylic dianhydride (“BPDA”) and ODA.
  • PMDA pyromellitic dianhydride
  • ODA diaminodiphenyl ether
  • BPDA 3,3′,4,4′-biphenyltetracarboxylic dianhydride
  • ODA pyromellitic dianhydride
  • BPDA 3,3′,4,4′-biphenyltetracarboxylic dianhydride
  • a typical example of a polyimide prepared by a solution imidization process is a rigid, aromatic polyimide composition having the recurring unit: wherein R 5 is greater than 60 to about 85 mole percent paraphenylene diamine (“PPD”) units and about 15 to less than 40 mole percent metaphenylene diamine (“MPD”) units.
  • PPD paraphenylene diamine
  • MPD metaphenylene diamine
  • tetracarboxylic acids preferably employed in the practice of the 5 invention, or those from which derivatives useful in the practice of this invention can be prepared are those having the general formula: wherein A is a tetravalent organic group and R 6 to R 9 , inclusive, comprise hydrogen or a lower alkyl, and preferably methyl, ethyl, or propyl.
  • the tetravalent organic group A preferably has one of the following structures: wherein X comprises at least one of —O—, —S—, —SO 2 —, —CH 2 —, —CH 2 CH 2 —,
  • aromatic tetracarboxylic acid component there can be mentioned aromatic tetracarboxylic acids, acid anhydrides thereof, salts thereof and esters thereof.
  • aromatic tetracarboxylic acids examples include 3,3′,4,4′-biphenyltetracarboxylic acid, 2,3,3′,4′-biphenyltetracarboxylic acid, pyromellitic acid, 3,3′,4,4′-benzophenonetetracarboxylic acid, 2,2-bis(3,4-dicarboxyphenyl)propane, bis(3,4-dicarboxyphenyl)methane, bis(3,4-dicarboxyphenyl)ether, bis(3,4-dicarboxyphenyl)thioether, bis(3,4-dicarboxyphenyl)phosphine, 2,2-bis(3′,4′-dicarboxyphenyl)hexafluoropropane, and bis(3,4-dicarboxyphenyl)sulfone.
  • aromatic tetracarboxylic acids can be employed singly or in combination.
  • Preferred is an aromatic tetracarboxylic dianhydride, and particularly preferred are 3,3′,4,4′-biphenyltetracarboxylic dianhydride, pyromellitic dianhydride, 3,3′,4,4′-benzophenonetetracarboxylic dianhydride, and mixtures thereof.
  • aromatic diamine use is preferably made of one or more aromatic and/or heterocyclic diamines, which are themselves known to the art.
  • aromatic diamines can be represented by the structure: H 2 N—R 10 —NH 2 , wherein R 10 is an aromatic group containing up to 16 carbon atoms and, optionally, containing up to one hetero atom in the ring, the hetero atom comprising —N—, —O—, or —S—.
  • R 10 groups wherein R 10 is a diphenylene group or a diphenylmethane group.
  • diamines are 2,6-diaminopyridine, 3,5-diaminopyridine, meta-phenylene diamine, para-phenylene diamine, p,p′-methylene dianiline, 2,6-diamino toluene, and 2,4-diamino toluene.
  • aromatic diamine components include benzene diamines such as 1,4-diaminobenzene, 1,3-diaminobenzene, and 1,2-diaminobenzene; diphenyl(thio)ether diamines such as 4,4′-diaminodiphenylether, 3,4′-diaminodiphenylether, 3,3′-diaminodiphenylether, and 4,4′-diaminodiphenylthioether; benzophenone diamines such as 3,3′-diaminobenzophenone and 4,4′-diaminobenzophenone; diphenylphosphine diamines such as 3,3′-diaminodiphenylphosphine and 4,4′-diaminodiphenylphosphine; diphenylalkylene diamines such as 3,3′-diaminodiphenylmethane, 1,4-diaminodiphenyl
  • Other useful diamines have at least one non-heteroatom containing aromatic rings or at least two aromatic rings bridged by a functional group.
  • aromatic diamines can be employed singly or in combination.
  • aromatic diamine component are 1,4-diaminobenzene, 1,3-diaminobenzene, 4,4′-diaminodiphenylether, and mixtures thereof.
  • a polyamic acid can be obtained by polymerizing an aromatic diamine component and an aromatic tetracarboxylic acid component preferably in substantially equimolar amounts in an organic polar solvent.
  • the amount of all monomers in the solvent can be in the range of about 5 to about 40 weight percent, more preferably in the range of about 6 to about 35 weight percent, and most preferably in the range of about 8 to about 30 weight percent.
  • the temperature for the reaction generally is not higher than about 100° C., preferably in the range of about 10° C. to 80° C.
  • the time for the polymerization reaction generally is in the range of about 0.2 to 60 hours.
  • a polyimide is prepared can also vary according to the identity of the monomers from which the polymer is made up.
  • the monomers form a complex salt at ambient temperature. Heating of such a reaction mixture at a moderate temperature of about 100 to about 150° C. yields low molecular weight oligomers (for example, a polyamic acid), and these oligomers can, in turn, be transformed into higher molecular weight polymer by further heating at an elevated temperature of about 240 to about 350° C.
  • a solvent such as dimethylacetamide or N-methylpyrrolidinone is typically added to the system.
  • An aliphatic diamine and dianhydride also form oligomers at ambient temperature, and subsequent heating at about 150 to about 200° C. drives off the solvent and yields the corresponding polyimide.
  • an aromatic diamine is typically polymerized with a dianhydride in preference to a tetracarboxylic acid, and in such a reaction a catalyst is frequently used in addition to a solvent.
  • a nitrogen-containing base, phenol, or amphoteric material can be used as such a catalyst. Longer periods of heating can be needed to polymerize an aromatic diamine.
  • the ring closure can also be effected by conventionally used methods such as a heat treatment or a process in which a cyclization agent such as pyridine and acetic anhydride, picoline and acetic anhydride, 2,6-lutidine and acetic anhydride, or the like is used.
  • a cyclization agent such as pyridine and acetic anhydride, picoline and acetic anhydride, 2,6-lutidine and acetic anhydride, or the like is used.
  • the bisphenoxide salt of the bisphenol is first obtained by treatment with caustic soda, followed by an azeotropic distillation to obtain the anhydrous bisphenoxide salt. Heating the bisphenoxide salt and the dinitrobisimide at a temperature of about 80 to about 130° C. in a solvent yields the polyetherimide.
  • organic polar solvent employable in the above-described polymerization reaction, there can be mentioned solvents capable of homogeneously dissolving each monomer of the aromatic diamine component or the aromatic tetracarboxylic acid component, an oligomer produced by the monomers or a low-molecular polyamic acid.
  • organic polar solvents examples include amide solvents such as N,N-dimethylformamide, N,N-dimethylacetamide, N-methyl-2-pyrrolidone, N-methylcaprolactam, pyrrolidone; and dimethylsulfoxide, hexamethylsulfonamide, dimethylsulfone, tetramethylenesulfone, dimethyltetramethylenesulfone, pyridine, tetrahydrofuran, and butyrolactone.
  • These organic polar solvents can be used in combination with other solvents such as benzene, toluene, benzonitrile, xylene, solvent naphtha, and dioxane.
  • a polyimide can also be prepared from the reaction of a polyisocyanate and a dianhydride.
  • the polyimide resin particulate can be used in the range of about 5 weight percent to about 95 weight percent and preferably the polyimide resin particulate can be used in the range of about 20 weight percent to about 80 weight percent, the percentages being based on the total weight of all of the resin particulates in the resin blend.
  • the polyimide resin particulates in addition to any other resin particulates present in the blend can be used in any amount as one of ordinary skill in the art would recognize as being advantageous for the intended use of the resin blend.
  • a particulate filler and/or a fibrous filler uniformly dispersed in an organic solvent can be added to the production system at an appropriate stage from before the time of the synthesis of the polymeric precursor and, in the embodiments containing polyimides, through to the time of the imidization of the polyimide precursor.
  • the organic solvent that can be used for uniformly dispersing a particulate filler and/or a fibrous filler is usually the same as used for the polymerization of the acid dianhydride and the diamino compound.
  • the particulate or fibrous filler can be added as such, it is preferred that the filler is sufficiently dispersed in a prescribed amount of such organic solvent. Addition of the filler in a dispersed state in an organic solvent can be preferred because the filler previously wetted with the organic solvent can be uniformly dispersed in the reaction system and be more easily incorporated into the particle of the base polymer.
  • the filler is typically not added directly to the reaction system but typically is uniformly dispersed in an organic solvent in advance and then added to the system.
  • the filler can uniformly be dispersed in the reaction system, and, in one embodiment, a polymeric particle is precipitated around the dispersed filler.
  • the addition of the organic solvent having uniformly dispersed therein the filler can be effected at any stage before commencement of imidization of the polyimide precursor, that is, before precipitation of a polymeric particle.
  • the uniform filler dispersion can be added before addition of the acid dianhydride, for example, aromatic tetracarboxylic acid dianhydride, or the diamino compound, for example, aromatic diamino compounds, or it can be added to the polyimide precursor solution prior to imidization.
  • Uniform dispersion of the filler in the organic solvent can be carried out by using a dispersing device, for example a ball mill, a sand mill, attritor, a three-roll mill, a bead mill, a jet mill, a vibration mill, a disper, an impeller mill, a flow jet mixer, a homogenizer, a colloid mill, etc., or a general stirrer, for example, agitator.
  • a dispersing device for example a ball mill, a sand mill, attritor, a three-roll mill, a bead mill, a jet mill, a vibration mill, a disper, an impeller mill, a flow jet mixer, a homogenizer, a colloid mill, etc., or a general stirrer, for example, agitator.
  • Suitable fillers include various kinds, such as those imparting high strength properties to polymeric molded products, for example, glass fibers, carbon fibers, ceramic fibers, boron fibers, glass beads, whiskers, or diamond powders; those imparting heat dissipation properties to polymeric molded products, for example, alumina or silica; those imparting corona resistance, for example, natural mica, synthetic mica, or alumina; those imparting electric conductivity, for example, carbon black, a silver powder, a copper powder, an aluminum powder, or a nickel powder; or those imparting heat resistance to polymeric molded products, for example, aramide fibers, metal fibers, ceramic fibers, whiskers, silicon carbide, silicon oxide, alumina, a magnesium powder, or a titanium powder.
  • a fluorine-containing fine powder for example, polytetrafluoroethylene, can be used in order to reduce a coefficient of friction.
  • These fillers can be used individually or in combination of two or more thereof.
  • the polymeric component can be present in a range of about 30 weight percent to about 99 weight percent, the percentages being based on the total weight of all of the resin particulates in the resin blend.
  • the amount of the encapsulated filler to be used can appropriately be determined depending on characteristics required for the polymeric products, and usually ranges from about 1 weight percent to about 70 weight percent, the percentages being based on the total weight of all of the resin particulates in the resin blend.
  • the fillers can be used in a range from about 1 to about 15 weight percent, the percentages being based on the total weight of all of the resin particulates in the resin blend.
  • polymeric particulates can be used in a range of from about 85 to about 99 weight percent, the percentages being based on the total weight of all of the resin particulates in the resin blend.
  • Resin blends resulting from mixtures of resin particulates comprising both encapsulated and unencapsulated fillers are also within the scope of the present invention.
  • Another aspect of the invention provides for a method of producing a resin blend comprising mixing at least two non-melt processible resin particulates.
  • a further aspect of the invention provides for a method of producing a compression molded article comprising mixing at least two non-melt processible resin particulates by dry blending and molding the mixture by compression molding.
  • Suitable blending hardware includes, but is not limited to, drum rollers, ribbon blenders, v-cone blenders, double cone blenders, tote bin tumblers, a fluid bed, a Littleford-type mixer, a Nauta-type blender, a Forberg, a rotating drum with internal baffles, and gravity fall through static mixer.
  • Other blending hardware known to one of ordinary skill in the art can also be used.
  • the resin blend can further include other additives that do not depreciate the overall characteristics of the blend, as would be evident to one of ordinary skill in the art.
  • additives that do not depreciate the overall characteristics of the blend, as would be evident to one of ordinary skill in the art.
  • a wide variety of polymer particles such as those made from any of the aforementioned base particles, can be blended with the non-melt processible resin particulates of the invention.
  • Additives like the resin particulates of the invention, should be non-melt processible.
  • Other additives such as antioxidants, heat stabilizers, ultraviolet absorbers, flame retardants, auxiliary flame retardants, antistatic agents, lubricants, and coloring agents can also be added as long as the essential properties of the blend are not affected.
  • Molded articles that demonstrate lower moisture gain offer benefits.
  • moisture pick-up of a part that is, a constituent member of a machine or other apparatus, can alter the dimensions of the part, impacting the ability to install easily the component part into an assembly and/or impacting the performance of the part.
  • aircraft bushings can be produced to certain toleranced dimensions, but after production the bushings can pick-up moisture in humid environments, causing the dimensions to change from the die.
  • the inspection of the bushings can be based on either the saturated state or the dry state. Or, if such states are not controlled, the resulting capability to maintain a specific tolerance will be reduced, potentially requiring the design tolerances of the mating components to be more tightly controlled for effective functioning of the assembly, impacting costs.
  • the bushings can dry in operation when exposed to high thermal conditions, causing dimensional change, impacting the clearance between the bushing and the mating components.
  • Non-optimal clearance can impact bushing wear life and/or increase actuation torque thereby requiring heavier actuation systems that can provide more torque to actuate the system.
  • the part can become saturated during the time between inspection and assembly, causing dimensional change, potentially causing installation difficulty if the product is not pre-dried before assembly or stored in a manner to prevent moisture uptake.
  • the pre-drying step adds cost as does delays in assembly.
  • Another example of a material's low-moisture uptake properties benefiting an article is the material's use in environments that require low-outgassing.
  • min means minute(s)
  • ml means milliliter(s)
  • g means gram(s)
  • PMDA means pyromellitic dianhydride
  • ODA means diaminodiphenyl ether
  • BPDA means 3,3′,4,4′-biphenyltetracarboxylic dianhydride
  • BTDA 3,3′,4,4′-benzophenone tetracarboxylic dianhydride
  • PPD means paraphenylene diamine
  • MPD means metaphenylene diamine
  • kpsi means thousand pounds per square inch
  • wt % means weight percent(age).
  • Resin blends were prepared by placing a total of 30 g of two of the base resins described in Table 1 in a 250 ml jar. The mixture was gently tumbled for 5 min. and dried overnight in a vacuum oven at 150° C.
  • Tensile bars were prepared by the method set forth in U.S. Pat. No. 4,360,626. Moisture pickup studies were conducted by immersing dried tensile bars in water at room temperature and measuring the change in weight after two weeks. Tensile bars comprising resin blends and tensile bars comprising the individual base resins used to prepare the resin blends were tested simultaneously.

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  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Manufacture Of Macromolecular Shaped Articles (AREA)
  • Processing And Handling Of Plastics And Other Materials For Molding In General (AREA)
  • Casting Or Compression Moulding Of Plastics Or The Like (AREA)
  • Processes Of Treating Macromolecular Substances (AREA)
  • Macromolecular Compounds Obtained By Forming Nitrogen-Containing Linkages In General (AREA)
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US11/007,957 US20050215715A1 (en) 2003-12-19 2004-12-09 Blends of high temperature resins suitable for fabrication using powdered metal or compression molding techniques
CA002550237A CA2550237A1 (en) 2003-12-19 2004-12-16 Blends of high temperature resins suitable for fabrication using powdered metal or compression molding techniques
KR1020067011966A KR101136616B1 (ko) 2003-12-19 2004-12-16 분말 금속 또는 압축 성형 기술을 사용한 제조에 적합한고온 수지의 블렌드
PCT/US2004/042304 WO2005061200A1 (en) 2003-12-19 2004-12-16 Blends of high temperature resins suitable for fabrication using powdered metal or compression molding techniques
EP04814483A EP1699610B1 (en) 2003-12-19 2004-12-16 Blends of high temperature resins molded by compression molding
JP2006545442A JP4980724B2 (ja) 2003-12-19 2004-12-16 粉末金属または圧縮成形技術を用いる二次加工に好適な耐熱樹脂のブレンド
HK07104942.4A HK1098422B (en) 2003-12-19 2004-12-16 Blends of high temperature resins suitable for fabrication using powdered metal or compression molding techniques
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US20070134411A1 (en) * 2005-12-14 2007-06-14 General Electric Company Method for making compositions containing microcapsules and compositions made thereof
US20090069507A1 (en) * 2006-03-07 2009-03-12 Solvay Advanced Polymers, L.L.C. Aromatic Polyimide Composition
US20100056695A1 (en) * 2008-08-29 2010-03-04 E. I. Du Pont De Nemours And Company Composite parts for airplane engines
US20100055455A1 (en) * 2008-08-29 2010-03-04 E. I. Du Pont De Nemours And Company Composite parts for airplane engines
US20140228513A1 (en) * 2011-09-20 2014-08-14 Rhodia Operations Thermoplastic polyimides

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US7858687B2 (en) * 2008-07-30 2010-12-28 E.I. Du Pont De Nemours And Company Polyimide resins for high temperature wear applications
CA2752047A1 (en) * 2009-03-17 2010-09-23 E. I. Du Pont De Nemours And Company Co-polymer based polyimide articles and their uses in an aircraft
CN102356115A (zh) * 2009-03-17 2012-02-15 纳幕尔杜邦公司 基于共聚物的聚酰亚胺制品以及它们在高温应用中的用途
WO2010107790A1 (en) * 2009-03-17 2010-09-23 E. I. Du Pont De Nemours And Company Articles made from co-polymer based polyimide and their uses in high temperature glass handling applications
US11203192B2 (en) 2009-08-03 2021-12-21 E I Du Pont De Nemours And Company Matte finish polyimide films and methods relating thereto
US8574720B2 (en) * 2009-08-03 2013-11-05 E.I. Du Pont De Nemours & Company Matte finish polyimide films and methods relating thereto
US9631054B2 (en) 2010-07-23 2017-04-25 E I Du Pont De Nemours And Company Matte finish polyimide films and methods relating thereto
US9926415B2 (en) 2010-08-05 2018-03-27 E I Du Pont De Nemours And Company Matte finish polyimide films and methods relating thereto
US8541107B2 (en) 2009-08-13 2013-09-24 E. I. Du Pont De Nemours And Company Pigmented polyimide films and methods relating thereto
WO2011035258A2 (en) * 2009-09-21 2011-03-24 Saint-Gobain Performance Plastics Corporation Method of forming an article from non-melt processible polymers and articles formed thereby
CN103168068A (zh) * 2010-07-23 2013-06-19 E.I.内穆尔杜邦公司 消光整理聚酰亚胺膜及其相关方法
US8772997B2 (en) 2010-09-13 2014-07-08 Baker Hughes Incorporated Electrical submersible pump system having high temperature slot, end bell and phase-to-phase insulation
US9863732B2 (en) 2013-08-28 2018-01-09 Proof Research, Inc. Lightweight composite mortar tube
EP2886583B1 (de) * 2013-12-17 2018-10-17 Evonik Fibres GmbH Polyimidpulver mit hoher thermooxidativer Beständigkeit
KR102515461B1 (ko) 2020-11-30 2023-03-31 피아이첨단소재 주식회사 실란제를 포함하는 폴리이미드 복합 분말 및 이의 제조방법

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US4820781A (en) * 1987-06-29 1989-04-11 General Electric Company Blends of silicone copolymer and polyetherimide
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Cited By (10)

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US20070134411A1 (en) * 2005-12-14 2007-06-14 General Electric Company Method for making compositions containing microcapsules and compositions made thereof
US20090069507A1 (en) * 2006-03-07 2009-03-12 Solvay Advanced Polymers, L.L.C. Aromatic Polyimide Composition
US7820767B2 (en) * 2006-03-07 2010-10-26 Solvay Advanced Polymers, L.L.C. Aromatic polyimide composition
US20100056695A1 (en) * 2008-08-29 2010-03-04 E. I. Du Pont De Nemours And Company Composite parts for airplane engines
US20100055455A1 (en) * 2008-08-29 2010-03-04 E. I. Du Pont De Nemours And Company Composite parts for airplane engines
CN102137888A (zh) * 2008-08-29 2011-07-27 纳幕尔杜邦公司 用于飞机发动机的复合材料部件
US8198356B2 (en) * 2008-08-29 2012-06-12 E I Du Pont De Nemours And Company Composite parts for airplane engines
CN102137888B (zh) * 2008-08-29 2013-07-17 纳幕尔杜邦公司 用于飞机发动机的复合材料部件
US20140228513A1 (en) * 2011-09-20 2014-08-14 Rhodia Operations Thermoplastic polyimides
US9902809B2 (en) * 2011-09-20 2018-02-27 Rhodia Operations Thermoplastic polyimides

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JP4980724B2 (ja) 2012-07-18
WO2005061200A1 (en) 2005-07-07
CA2550237A1 (en) 2005-07-07
US7758781B2 (en) 2010-07-20
EP1699610A1 (en) 2006-09-13
KR20060113949A (ko) 2006-11-03
JP2007514834A (ja) 2007-06-07
HK1098422A1 (zh) 2007-07-20
EP1699610B1 (en) 2013-01-23
US20080227907A1 (en) 2008-09-18
KR101136616B1 (ko) 2012-04-18

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